JP2003158302A - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
JP2003158302A
JP2003158302A JP2001355826A JP2001355826A JP2003158302A JP 2003158302 A JP2003158302 A JP 2003158302A JP 2001355826 A JP2001355826 A JP 2001355826A JP 2001355826 A JP2001355826 A JP 2001355826A JP 2003158302 A JP2003158302 A JP 2003158302A
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
led
emitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001355826A
Other languages
Japanese (ja)
Inventor
Yoshinobu Suehiro
好伸 末広
Akihiro Misawa
明弘 三沢
Toshinori Takahashi
利典 高橋
Hisatoshi Ota
久敏 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2001355826A priority Critical patent/JP2003158302A/en
Priority to CNB028226461A priority patent/CN100369274C/en
Priority to TW091133621A priority patent/TW569476B/en
Priority to US10/495,644 priority patent/US7781787B2/en
Priority to AU2002365761A priority patent/AU2002365761A1/en
Priority to EP02804348A priority patent/EP1453107A4/en
Priority to PCT/JP2002/011968 priority patent/WO2003049207A1/en
Publication of JP2003158302A publication Critical patent/JP2003158302A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To achieve a high external emission efficiency in an LED wherein its thin structure creates a good appearance and enables a single LED to irradi ate a large area. SOLUTION: A portion of the light emitted by a light emitting element 6 is directed to the upper surface 9 serving as reflector for an LED 2 and, because it lands there at a great angle of incidence, is totally reflected to travel to a side surface 10. Since the upper surface 9 assumes a shape formed when a part of a parabola with its focal point at the element 6 is rotated on the Z-axis, the whole light reflected by the upper surface 9 proceeds in parallel to the X-Y plane. Since the side surface 10 is a part of a spherical surface with its center at the element 6, the light as is proceeds in parallel, to be emitted in 360 deg. directions at the Z-axis. Furthermore, the light from the element 6 directly arriving on the side surface 10, which is a part of the spherical surface as stated above, is emitted without being refracted. All the light is emitted upward thanks to the ladder-shaped peripheral reflector surrounding the LED 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、車載用ライト等の
照明装置、表示装置等に応用するLEDライトに光源と
して用いる発光ダイオード(以下、「LED」とも略す
る。)に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (hereinafter, also abbreviated as "LED") used as a light source for an LED light applied to a lighting device such as a vehicle light, a display device and the like.

【0002】なお、本明細書中においては、LEDチッ
プそのものは「発光素子」と呼び、LEDチップを搭載
したパッケージ樹脂またはレンズ系等の光学装置を含む
発光装置全体を「発光ダイオード」または「LED」と
呼ぶこととする。さらに、LEDを光源とする車載用ラ
イト等の照明装置、表示装置等を「LEDライト」と呼
ぶこととする。
In the present specification, the LED chip itself is called a "light emitting element", and the entire light emitting device including an optical device such as a package resin or a lens system on which the LED chip is mounted is referred to as a "light emitting diode" or "LED". ". Further, an illuminating device such as a vehicle-mounted light using an LED as a light source, a display device and the like will be referred to as an "LED light".

【0003】[0003]

【従来の技術】発光素子の高輝度化に伴って、自動車の
バックライト等にLEDを光源としたLEDライトが用
いられることが多くなってきた。LEDは、スペクトル
がシャープで視認性が良い。また、応答速度が速いた
め、後続車への信号伝達速度が速く、高速走行中、静止
距離の短縮に顕著な効果が認められている。さらに、L
EDはそれ自体単色光源であるので、白熱電球のように
必要色以外の光をフィルターカットする必要もなく、単
色光源として高効率であり、省エネルギー化にもつなが
る。
2. Description of the Related Art With the increase in brightness of light-emitting elements, LED lights having LEDs as light sources have been increasingly used in automobile backlights and the like. LEDs have a sharp spectrum and good visibility. Further, since the response speed is fast, the signal transmission speed to the following vehicle is fast, and it is recognized that the stationary distance is shortened during high speed running. Furthermore, L
Since the ED itself is a monochromatic light source, it is not necessary to filter out light other than the necessary colors like an incandescent light bulb, and it is highly efficient as a monochromatic light source, leading to energy saving.

【0004】かかるLEDライトの一例を図8に示す。
図8は、従来のLEDライトの一例の全体構成を示す断
面図である。
An example of such an LED light is shown in FIG.
FIG. 8: is sectional drawing which shows the whole structure of an example of the conventional LED light.

【0005】図8に示されるように、このLEDライト
100は、発光素子102を透明エポキシ樹脂105で
凸レンズ形に封止したレンズ型LED101を光源とし
て用いている。レンズ型LED101は、1対のリード
103a,103bのうちリード103aに発光素子1
02をマウントして、発光素子102とリード103b
とをワイヤ104でボンディングして、全体を透明エポ
キシ樹脂105で凸レンズ形に封止したものである。そ
して、凸レンズ型LED101の周囲を回転放物面形の
反射鏡106で覆い、上方中央部にはフレネルレンズ1
07が形成されていて、結局レンズ型LED101から
発せられた光は反射鏡106で反射され、またはフレネ
ルレンズ107で集光されて、すべて上方へ略平行に出
射される。そして、樹脂レンズ109の下面に設けられ
た凹凸の界面によって拡げられて樹脂レンズ109を透
過した光は、車載用バックライトの規格である略20度
の拡がりをもった放射光として外部放射される。
As shown in FIG. 8, the LED light 100 uses a lens type LED 101 in which a light emitting element 102 is sealed in a convex lens shape with a transparent epoxy resin 105 as a light source. In the lens type LED 101, the light emitting element 1 is attached to the lead 103a of the pair of leads 103a and 103b.
02 is mounted, and the light emitting element 102 and the lead 103b are mounted.
Are bonded with a wire 104, and the whole is sealed with a transparent epoxy resin 105 in a convex lens shape. Then, the convex lens type LED 101 is covered with a rotating parabolic reflector 106, and the Fresnel lens 1 is provided at the upper center.
07 is formed, and eventually the light emitted from the lens type LED 101 is reflected by the reflecting mirror 106 or condensed by the Fresnel lens 107, and is all emitted substantially parallel upward. Then, the light that has been spread by the interface of the unevenness provided on the lower surface of the resin lens 109 and transmitted through the resin lens 109 is externally radiated as radiated light having a spread of about 20 degrees which is the standard of the vehicle-mounted backlight. .

【0006】[0006]

【発明が解決しようとする課題】しかしながら、発光素
子の出力がさらに向上してきた今日、少ない発光素子で
所定面積の発光エリアを発光させる必要が生じてきてい
る。これは、部品数を減らし、部品実装の手間を削減す
るためである。しかし、上述した凸レンズ形のLED1
01を用いたLEDライト100において、1個の発光
素子でより大面積を発光させようとすると、相似形に大
きくなり、面積方向に大型になるとともに厚さ方向にも
厚くなる。また、無理に薄くしようとすると見栄えが低
下する。このため、LEDの特長である薄型の光源とす
ることができないという問題点があった。さらに、発光
素子102から反射鏡106にもフレネルレンズ107
にも至らない光は光学制御されず外部放射できないの
で、外部放射効率の点からもまだ課題のあるものであっ
た。
However, as the output of the light emitting element is further improved, it is necessary to emit light from a light emitting area having a predetermined area with a small number of light emitting elements. This is to reduce the number of components and the labor of component mounting. However, the above-mentioned convex lens type LED 1
In the LED light 100 using 01, if one light emitting element is intended to emit light over a larger area, the light emitting element becomes similar in shape, becomes larger in the area direction, and becomes thicker in the thickness direction. Also, if the film is forcibly thinned, the appearance will be degraded. Therefore, there is a problem that the thin light source, which is a feature of the LED, cannot be used. Further, the Fresnel lens 107 is provided from the light emitting element 102 to the reflecting mirror 106.
Light that does not reach this level cannot be optically controlled and cannot be externally radiated, so there was still a problem in terms of external radiation efficiency.

【0007】そこで、本発明は、LEDの特長である薄
型という点を生かしつつ見栄え良く1個の発光素子で大
面積を照射することができ、高い外部放射効率が得られ
るLEDライト用光源としてのLEDの提供を課題とす
るものである。
Therefore, the present invention is a light source for an LED light, which can illuminate a large area with one light emitting element with good appearance while making the most of the characteristic of LED, that is, a thin light emitting element. It is an object to provide LEDs.

【0008】[0008]

【課題を解決するための手段】請求項1の発明にかかる
発光ダイオードは、発光素子と、該発光素子の上方に設
けられた前記発光素子からの光を側面方向へ上下方向に
拡げることなく反射する第1の反射鏡とを具備するもの
である。
A light emitting diode according to the invention of claim 1 reflects a light emitting element and light from the light emitting element provided above the light emitting element without laterally spreading the light in the vertical direction. And a first reflecting mirror that does this.

【0009】これによって、発光素子の直上に側面方向
へ上下方向に拡げることなく反射する第1の反射鏡を設
置して、この反射光を上方へ反射する周辺反射鏡をLE
Dの周囲に設けることによって、周辺反射鏡を第1の反
射鏡から離すほど大面積の外部放射光を得ることができ
る。また、側面方向へ反射された光は上下方向に拡がる
ことなく反射されるので、この反射光を上方へ反射する
周辺反射鏡の厚さを薄くすることができる。さらに、側
面に反射された光は全て光学制御されて上方へ反射され
て外部放射されるので、高い外部放射効率が得られる。
Thus, the first reflecting mirror for reflecting the light without spreading in the vertical direction in the side surface direction is installed directly above the light emitting element, and the peripheral reflecting mirror for reflecting the reflected light upward is LE.
By arranging it around D, it is possible to obtain external emission light having a large area as the peripheral reflecting mirror is separated from the first reflecting mirror. Further, since the light reflected in the side surface direction is reflected without spreading in the vertical direction, it is possible to reduce the thickness of the peripheral reflecting mirror that reflects this reflected light upward. Further, all the light reflected on the side surface is optically controlled, reflected upward, and radiated to the outside, so that high external radiation efficiency can be obtained.

【0010】このようにして、LEDの特長である薄型
という点を生かして、薄型で1個の発光素子で大面積を
照射することができ、高い外部放射効率を得ることがで
きるLEDライト用の発光ダイオードとなる。
In this way, taking advantage of the thinness which is a feature of the LED, it is possible to illuminate a large area with one thin light emitting element and to obtain high external emission efficiency for the LED light. It becomes a light emitting diode.

【0011】請求項2の発明にかかる発光ダイオード
は、発光素子と、該発光素子に電力を供給する電気系
と、前記発光素子及び前記電気系を封止する光透過性材
料とを具備し、前記光透過性材料により前記発光素子か
ら発せられた光を上下方向に拡げることなく、側面方向
へ反射する反射面と、前記側面方向へ反射された光を上
下方向へ拡げることなく外部放射する側面放射面とがモ
ールドされているものである。
A light emitting diode according to a second aspect of the present invention comprises a light emitting element, an electric system for supplying electric power to the light emitting element, and a light transmissive material for sealing the light emitting element and the electric system. A reflective surface that reflects the light emitted from the light emitting element in the vertical direction by the light transmissive material and reflects the light in the side direction, and a side surface that radiates the light reflected in the lateral direction to the outside without expanding the light in the vertical direction. The radiating surface is molded.

【0012】即ち、発光素子から発せられた光が発光素
子を封止している光透過性材料の上面である反射面にお
いて、臨界角よりも大きな角度で入射するように作製さ
れている。これによって、LEDの反射鏡を作製するの
にメッキ、蒸着等の表面処理の必要がなくなり、封止金
型の形状を調節すれば良いだけなので、発光ダイオード
の作製工程が極めて短縮され、また低コスト化される。
また、光透過性材料の側面は側面方向へ反射された光を
上下方向へ拡げることなく外部放射する側面放射面とす
ることによってそのまま側面へ透過して、LED外部の
周辺反射鏡によって上方へ反射される。これによって、
発光素子から光透過性材料の上面・側面へ放射された光
はいずれも周辺反射鏡によって上方へ反射されるので、
LEDの薄型の特徴を生かしつつ外部放射効率の高いL
EDライトに適した発光ダイオードとなる。
That is, the light emitted from the light emitting element is manufactured so that it is incident on the reflection surface, which is the upper surface of the light transmissive material encapsulating the light emitting element, at an angle larger than the critical angle. This eliminates the need for surface treatment such as plating and vapor deposition for manufacturing the LED reflecting mirror, and only needs to adjust the shape of the sealing mold, which significantly shortens the manufacturing process of the light emitting diode and reduces the manufacturing cost. Cost is reduced.
In addition, the side surface of the light-transmissive material allows the light reflected in the side direction to be emitted to the outside without spreading in the vertical direction, so that the side surface is directly transmitted to the side surface and is reflected upward by the peripheral reflector outside the LED. To be done. by this,
Since the light emitted from the light emitting element to the upper and side surfaces of the light transmissive material is reflected upward by the peripheral reflecting mirror,
L, which has high external radiation efficiency while taking advantage of the thin LED characteristics
It becomes a light emitting diode suitable for ED light.

【0013】請求項3の発明にかかる発光ダイオード
は、請求項2の構成において、前記反射面は前記発光素
子を焦点とし前記発光素子の中心軸に直交する対称軸で
ある放物線の一部を前記発光素子の中心軸周りに回転さ
せた形状であるものである。
According to a third aspect of the present invention, in the light emitting diode according to the second aspect, the reflecting surface has a part of a parabola which is a symmetry axis having the light emitting element as a focal point and being orthogonal to a central axis of the light emitting element. It has a shape rotated around the central axis of the light emitting element.

【0014】これによって、請求項2に記載の効果に加
えて、発光素子から発せられて前記反射面のいずれかの
箇所に当った光は、全て前記発光素子の中心軸に略垂直
な側面方向に全反射される。この結果、前記反射面で反
射された光は全て側面方向に上下方向に拡がることなく
反射されるので、LED外部の周辺反射鏡の厚さを薄く
することができる。
As a result, in addition to the effect described in claim 2, all the light emitted from the light emitting element and impinging on any part of the reflecting surface is directed in a lateral direction substantially perpendicular to the central axis of the light emitting element. Is totally reflected. As a result, all the light reflected by the reflecting surface is reflected in the lateral direction without spreading in the vertical direction, so that the thickness of the peripheral reflecting mirror outside the LED can be reduced.

【0015】このようにして、LEDの特長である薄型
という点を生かして、薄型で1個の発光素子で大面積を
照射することができ、高い外部放射効率を得ることがで
きるLEDライト用の発光ダイオードとなる。
In this way, by taking advantage of the thinness which is a feature of the LED, it is possible to illuminate a large area with one thin light emitting element and to obtain a high external emission efficiency for an LED light. It becomes a light emitting diode.

【0016】請求項4の発明にかかる発光ダイオード
は、請求項1乃至請求項3のいずれか1つの構成におい
て、前記発光素子を金属板の上の回路基板上にマウント
したものである。
A light emitting diode according to a fourth aspect of the present invention is the light emitting diode according to any one of the first to third aspects, wherein the light emitting element is mounted on a circuit board on a metal plate.

【0017】請求項1乃至請求項3のいずれか1つに記
載の効果に加えて、このように熱伝導性に優れた金属板
の上に発光素子をマウントしているので、放熱性が大幅
に向上し、発光素子に大電流を投入しても熱飽和が起き
ないため、大きな光出力が得られるという利点がある。
このようにして、本発明の発光ダイオードによれば、薄
型で大きな放熱性を有し、熱飽和の制限を受けることな
く大きな光出力が得られ、明るい放射光が得られるLE
Dライトとなる。
In addition to the effect according to any one of claims 1 to 3, since the light emitting element is mounted on the metal plate having excellent thermal conductivity as described above, the heat dissipation is significantly improved. Since there is no thermal saturation even when a large current is applied to the light emitting element, a large light output can be obtained.
In this way, according to the light emitting diode of the present invention, the LE is thin and has a large heat dissipation property, a large light output can be obtained without being limited by thermal saturation, and a bright radiant light can be obtained.
It becomes D light.

【0018】請求項5の発明にかかる発光ダイオード
は、請求項1乃至請求項4のいずれか1つの構成におい
て、前記発光素子の近傍に前記発光素子の側方へ出射し
た光を上方へ反射する第2の反射鏡を設けたものであ
る。
A light emitting diode according to a fifth aspect of the present invention is the light emitting diode according to any one of the first to fourth aspects, in which light emitted to the side of the light emitting element in the vicinity of the light emitting element is reflected upward. A second reflecting mirror is provided.

【0019】これによって、請求項1乃至請求項4のい
ずれか1つに記載の効果に加えて、請求項1の発明にか
かるLEDにおいては発光素子の真上のみ上方に光が放
射されるのに対して、発光素子の周辺からも上方に光が
放射されるようになり、より全体が発光しているように
見えて、見栄えが向上するという効果が得られる。
As a result, in addition to the effect according to any one of claims 1 to 4, in the LED according to the invention of claim 1, light is emitted only right above the light emitting element. On the other hand, light is emitted upward from the periphery of the light emitting element, and it seems that the entire device emits light, and the appearance is improved.

【0020】請求項6の発明にかかる発光ダイオード
は、請求項1乃至請求項5のいずれか1つの構成におい
て、前記第1の反射鏡または前記封止面の上面が中心軸
に対して60度以上の範囲の光を反射するものである。
According to a sixth aspect of the present invention, in the light emitting diode according to any one of the first to fifth aspects, the upper surface of the first reflecting mirror or the sealing surface is 60 degrees with respect to the central axis. It reflects light in the above range.

【0021】これによって、請求項1乃至請求項5のい
ずれか1つに記載の効果に加えて、発光素子の上面の中
心軸から60度の範囲内に放射される光は全て第1の反
射鏡または前記封止面の上面で側面方向へ反射され、中
心軸から60度より大きい範囲内に放射される光は直接
側面方向へ向かい、いずれも周辺反射鏡によって上方へ
反射される。したがって、発光素子から放射される大部
分の光がLEDライトから外部放射されるため、極めて
外部放射効率の高いLEDライト用のLEDとなる。
Thereby, in addition to the effect according to any one of claims 1 to 5, all light emitted within a range of 60 degrees from the central axis of the upper surface of the light emitting element is subjected to the first reflection. Light reflected laterally on the upper surface of the mirror or the sealing surface and emitted within a range of more than 60 degrees from the central axis is directed directly to the lateral direction, and both are reflected upward by the peripheral reflecting mirror. Therefore, most of the light emitted from the light emitting element is externally emitted from the LED light, so that the LED for LED light has extremely high external emission efficiency.

【0022】[0022]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

【0023】実施の形態1 まず、本発明の実施の形態1について、図1乃び図2を
参照して説明する。
First Embodiment First, a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

【0024】図1は本発明の実施の形態1にかかるLE
Dの全体構成を示す縦断面図である。図2(a)は本発
明の実施の形態1にかかるLEDを用いたLEDライト
の全体構成を示す平面図、(b)は(a)のA−A断面
図、(c)は(b)のP部分の拡大図である。
FIG. 1 is an LE according to the first embodiment of the present invention.
It is a longitudinal cross-sectional view showing the overall configuration of D. FIG. 2A is a plan view showing an overall configuration of an LED light using the LED according to the first embodiment of the present invention, FIG. 2B is a sectional view taken along line AA of FIG. 2A, and FIG. It is an enlarged view of P part of FIG.

【0025】まず、本実施の形態1のLED2の構成に
ついて、図1を参照して説明する。ここで、発光素子の
中心軸をZ軸とし発光素子上面をその原点とし、この原
点においてX軸とY軸とが直角に交わるように定めてあ
る。以下の各実施の形態においても同様である。
First, the structure of the LED 2 of the first embodiment will be described with reference to FIG. Here, the central axis of the light emitting element is the Z axis, and the top surface of the light emitting element is the origin thereof, and the X axis and the Y axis intersect at a right angle at this origin. The same applies to each of the following embodiments.

【0026】図1に示されるように、X−Y平面上に設
けられた1対のリード板5a,5bのうち面積の広いリ
ード板5aの先端に発光素子6をマウントしている。発
光素子6の上面の電極とリード板5bの先端とは、ワイ
ヤ7でボンディングされて電気的接続がなされている。
これらの電気系としてのリード板5a,5bの先端、発
光素子6、ワイヤ7が樹脂封止用金型にセットされて、
光透過性材料としての透明エポキシ樹脂8によって図に
示すような断面形状に樹脂封止されている。ここで、L
ED2の上面9の中心部分には平坦面があって、この平
坦面に続いて第1の反射鏡として発光素子6の発光面の
中心を焦点とし、X軸方向を対称軸とする放物線の一部
(Z軸に対して60度の範囲)をZ軸の周りに回転させ
た傘のような形状をしている。また、LED2の側面1
0は、発光素子6を中心とする球面の一部をなしてい
る。
As shown in FIG. 1, the light emitting element 6 is mounted on the tip of the lead plate 5a having a large area among the pair of lead plates 5a and 5b provided on the XY plane. The electrode on the upper surface of the light emitting element 6 and the tip of the lead plate 5b are bonded by a wire 7 to be electrically connected.
The tips of the lead plates 5a and 5b as the electric system, the light emitting element 6, and the wire 7 are set in a resin sealing mold,
A transparent epoxy resin 8 as a light transmissive material is resin-sealed in a cross-sectional shape as shown in the figure. Where L
There is a flat surface in the central portion of the upper surface 9 of the ED 2 and, following this flat surface, one of the parabola having the center of the light emitting surface of the light emitting element 6 as the first reflecting mirror and the symmetry axis in the X axis direction. It has an umbrella-like shape in which the part (range of 60 degrees with respect to the Z axis) is rotated around the Z axis. Also, the side surface 1 of the LED 2
0 forms a part of a spherical surface centered on the light emitting element 6.

【0027】即ち、本実施の形態1のLED2において
は、光透過性材料としての透明エポキシ樹脂8によっ
て、発光素子6から発せられた光を上下方向に拡げるこ
となく、側面方向へ反射する反射面9と、側面方向へ反
射された光を上下方向へ拡げることなく外部放射する側
面放射面10とがモールドされている。
That is, in the LED 2 of the first embodiment, the transparent epoxy resin 8 as the light transmissive material reflects the light emitted from the light emitting element 6 in the lateral direction without spreading the light in the vertical direction. 9 and a side emission surface 10 that emits the light reflected in the side direction to the outside without spreading the light in the vertical direction are molded.

【0028】次に、図2に示されるように、本実施の形
態1のLED2を用いたLEDライト1は円形の本体の
中心に光源となるLED2を搭載して、その周囲を周辺
反射鏡としての同心円の階段状の反射鏡3で囲んだ構造
をしている。図2(c)に示されるように、この反射鏡
3の反射面3aは、図のX−Y平面に対して約45度に
傾斜している。反射鏡3は、透明アクリル樹脂で成形し
た後、アルミ蒸着して反射面を形成している。
Next, as shown in FIG. 2, an LED light 1 using the LED 2 of the first embodiment has a circular main body on which the LED 2 serving as a light source is mounted, and the periphery thereof is used as a peripheral reflecting mirror. It has a structure surrounded by a concentric stepped reflecting mirror 3. As shown in FIG. 2C, the reflecting surface 3a of the reflecting mirror 3 is inclined at about 45 degrees with respect to the XY plane in the figure. The reflecting mirror 3 is formed of a transparent acrylic resin and then vapor-deposited with aluminum to form a reflecting surface.

【0029】かかる構成を有するLEDライト1の光り
方について、図1,図2を参照して説明する。LED2
のリード板5a,5bに電圧をかけて発光素子6を光ら
せると、発光素子6から発せられた光のうち、Z方向、
即ち、真上に向かった光は透明エポキシ樹脂8をそのま
ま通り抜けて直進し、LEDライト1の上に被せられて
いる図示しない透明な前板を通り抜けて外部放射され
る。また、発光素子6から発せられた光のうち、Z軸に
対して60度以上の範囲内の光が第1の反射鏡としての
上面9に至り、これらの光は入射角が大きいため全て全
反射されて側面10に向かう。ここで、上面9は発光素
子6を焦点としX軸を対称軸とする放物線の一部をZ軸
の周りに回転させた形状をしているため、上面9で反射
された光は全てX−Y平面に平行に進み、側面10は発
光素子6を中心とする球面の一部をなしているため、光
はほぼそのまま平行に進んでZ軸周り360度の方向に
略平面状に放射される。さらに、発光素子6から側面1
0に直接向かった光は、側面10は発光素子6を中心と
する球面の一部をなしているため、屈折することなくそ
のままの向きで放射される。
The way in which the LED light 1 having such a structure shines will be described with reference to FIGS. LED2
When a voltage is applied to the lead plates 5a and 5b to illuminate the light emitting element 6, the light emitted from the light emitting element 6 in the Z direction,
That is, the light heading directly above passes through the transparent epoxy resin 8 as it is, goes straight, passes through a transparent front plate (not shown) which is covered on the LED light 1, and is emitted to the outside. Further, among the light emitted from the light emitting element 6, light within a range of 60 degrees or more with respect to the Z axis reaches the upper surface 9 as the first reflecting mirror, and all of these lights have a large incident angle, so that all of them are totally incident. It is reflected and goes to the side surface 10. Here, since the upper surface 9 has a shape in which a part of a parabola having the light emitting element 6 as the focal point and the X axis as the axis of symmetry is rotated around the Z axis, all the light reflected by the upper surface 9 is X−. Since the light travels in parallel to the Y plane and the side surface 10 forms a part of a spherical surface centered on the light emitting element 6, light travels substantially in parallel and is emitted in a substantially planar shape in the direction of 360 degrees around the Z axis. . Further, from the light emitting element 6 to the side surface 1
Since the side surface 10 forms a part of a spherical surface centering on the light emitting element 6, the light directly directed to 0 is emitted in the same direction without refraction.

【0030】その先には周辺反射鏡としての階段状の反
射鏡3があり、略45度の傾斜を有する反射面3aがあ
るが、上面9で反射されてX−Y平面に略平行に進んで
きた光を始めとして、側面10から直接放射された光も
X−Y平面に平行に近いため、反射面3aで反射された
光はそれぞれがほぼ垂直に近く上方へ進み、少なくとも
Z軸から20度の範囲内で、図示しない透明な前板を通
り抜けて外部放射される。なお、上記で「平行」と表現
している光も、発光素子6の大きさがあるために完全な
平行にはならないが、いずれの光もほぼ平行になり、少
なくともZ軸から20度の範囲内には確実に入るものと
なる。
A staircase-shaped reflecting mirror 3 as a peripheral reflecting mirror is located ahead of it, and a reflecting surface 3a having an inclination of about 45 degrees is reflected, but is reflected by the upper surface 9 and proceeds substantially parallel to the XY plane. Since the light directly emitted from the side surface 10 including the generated light is also close to parallel to the XY plane, the light reflected by the reflecting surface 3a travels almost vertically and goes upward, and at least 20 from the Z axis. Within a range of degrees, it is radiated to the outside through a transparent front plate (not shown). Note that the light described as “parallel” in the above is not perfectly parallel because of the size of the light-emitting element 6, but all the light is substantially parallel and at least within a range of 20 degrees from the Z axis. It will surely come in.

【0031】このようにして、本実施の形態1のLED
2は、LEDの特長である薄型という利点を生かして、
薄型で1個の発光素子で大面積を照射することができ、
高い外部放射効率を得ることができるLEDライト1に
適した光源となる。
In this way, the LED of the first embodiment is
2 takes advantage of the thinness which is the feature of LED,
It is thin and can illuminate a large area with one light emitting element.
The light source is suitable for the LED light 1 that can obtain high external radiation efficiency.

【0032】実施の形態2 次に、本発明の実施の形態2のLEDについて、図3を
参照して説明する。図3は本発明の実施の形態2にかか
るLEDの全体構成を示す縦断面図である。
Second Embodiment Next, an LED according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a vertical cross-sectional view showing the overall configuration of the LED according to the second embodiment of the present invention.

【0033】図3に示されるように、本実施の形態2の
LED11は、一対のリード板12a,12bを発光素
子6の周辺のみ凹ませて第2の反射鏡としている。これ
によって、図1の基本形においては発光素子6の真上の
み直接上方に光が放射されるのに対して、LED11内
の発光素子6の周辺からも上方に光が放射されるように
なり、より全体が発光しているように見えて、見栄えが
向上するという効果が得られる。
As shown in FIG. 3, in the LED 11 of the second embodiment, the pair of lead plates 12a and 12b are recessed only around the light emitting element 6 to form a second reflecting mirror. As a result, in the basic form of FIG. 1, light is directly emitted only directly above the light emitting element 6, whereas light is emitted upward from the periphery of the light emitting element 6 in the LED 11. It is possible to obtain the effect that the whole looks like emitting light and the appearance is improved.

【0034】実施の形態3 次に、本発明の実施の形態3のLEDについて、図4を
参照して説明する。図4は本発明の実施の形態3にかか
るLEDの全体構成を示す縦断面図である。
Third Embodiment Next, an LED according to the third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a vertical cross-sectional view showing the overall structure of the LED according to the third embodiment of the present invention.

【0035】本実施の形態3のLED16においては、
一対のリード板13a,13bにハーフエッチングやス
タンピングパターンにより、図4に示されるような第2
の反射鏡としてのパターンを設けることによって、発光
素子6から斜め下方に放射される光を反射して上方に光
を放射するようにしている。こうして複数の同心円反射
鏡を形成することにより、実施の形態2と同様により全
体が発光しているように見せることができ、見栄えの向
上を図ることができる。なお、この場合には、透明エポ
キシ樹脂8とリード板13a,13bとの接着面積が増
し、接着形状を平面形状でなくすることによる剥離不良
低減の効果も同時に得られる。特に、発熱の大きい大電
流タイプの場合に有効である。
In the LED 16 of the third embodiment,
The pair of lead plates 13a and 13b are subjected to the second etching as shown in FIG. 4 by half etching or stamping pattern.
By providing a pattern as a reflecting mirror of the above, the light emitted obliquely downward from the light emitting element 6 is reflected and the light is emitted upward. By forming a plurality of concentric reflecting mirrors in this manner, it is possible to make the whole look like emitting light as in the second embodiment, and to improve the appearance. In this case, the adhesive area between the transparent epoxy resin 8 and the lead plates 13a and 13b is increased, and the effect of reducing the peeling defect can be obtained at the same time by eliminating the adhesive shape from the planar shape. Particularly, it is effective in the case of a large current type that generates a large amount of heat.

【0036】実施の形態4 次に、本発明の実施の形態4のLEDについて、図5を
参照して説明する。図5は本発明の実施の形態4にかか
るLEDの側面形状を示す説明図である。
Fourth Embodiment Next, an LED according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is an explanatory diagram showing a side surface shape of an LED according to the fourth embodiment of the present invention.

【0037】本実施の形態4のLED17においては、
図5に示されるように、LED17の透明エポキシ樹脂
8による封止部分の側面形状を変更している。実施の形
態1のLED2の側面10は発光素子6を中心とする球
面形状の一部であり、発光素子6から出た光は側面10
に略垂直に入射してそのまま直進するようになっていた
が、この変形例3においては、側面14は発光素子6を
一方の焦点とする楕円体表面の一部をなしており、発光
素子6から出た光は側面14において直進方向に対して
やや下方に屈折する。したがって、LED2の周囲の階
段状反射鏡3をより低い位置にもってきても高い外部放
射効率が得られるLEDライトとなる。これによって、
LEDライトをより薄型にすることができるLEDとな
る。
In the LED 17 of the fourth embodiment,
As shown in FIG. 5, the side shape of the sealed portion of the LED 17 made of the transparent epoxy resin 8 is changed. The side surface 10 of the LED 2 of the first embodiment is a part of a spherical shape centered on the light emitting element 6, and the light emitted from the light emitting element 6 is the side surface 10.
Although the light is incident substantially vertically on the light source and goes straight as it is, in the third modification, the side surface 14 forms a part of an ellipsoidal surface having the light emitting element 6 as one focal point, and the light emitting element 6 is Light emitted from the side surface 14 is slightly refracted downward in the straight direction. Therefore, even when the staircase-shaped reflecting mirror 3 around the LED 2 is moved to a lower position, the LED light has high external radiation efficiency. by this,
The LED becomes an LED that can be made thinner.

【0038】実施の形態5 次に、本発明の実施の形態5のLEDについて、図6を
参照して説明する。図6は本発明の実施の形態5にかか
るLEDの上面を示す部分拡大図である。
Fifth Embodiment Next, an LED according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a partially enlarged view showing the upper surface of the LED according to the fifth embodiment of the present invention.

【0039】本実施の形態5のLED18においては、
図6に示されるように、上面9の中心部分まで全て発光
素子6を焦点とする放物線の一部をZ軸周りに回転させ
た形状としてある。そして、LEDの反射鏡としての上
面9における側方への反射を、透明エポキシ樹脂8と空
気の境界面における全反射によらず、上面9にメッキ、
蒸着等を施して金属反射膜15を付着させている。これ
によって、発光素子6から真上に放射される光を含め、
発光素子6が発する略全光束を側面へ放射するLEDと
なる。
In the LED 18 of the fifth embodiment,
As shown in FIG. 6, a part of a parabola whose focal point is the light emitting element 6 up to the central portion of the upper surface 9 is rotated around the Z axis. Then, the upper surface 9 as the reflecting mirror of the LED is laterally reflected by plating on the upper surface 9 regardless of the total reflection at the boundary surface between the transparent epoxy resin 8 and the air.
The metal reflection film 15 is attached by vapor deposition or the like. As a result, including the light emitted directly from the light emitting element 6,
It becomes an LED that emits almost all the luminous flux emitted from the light emitting element 6 to the side surface.

【0040】[比較例]ここで、本発明の各実施の形態
との比較例について、図7を参照して説明する。図7は
本発明の各実施の形態との比較例にかかるLEDの全体
構成を示す縦断面図である。
Comparative Example Here, a comparative example with each of the embodiments of the present invention will be described with reference to FIG. FIG. 7 is a vertical cross-sectional view showing the overall configuration of an LED according to a comparative example with each embodiment of the present invention.

【0041】図7に示されるように、本比較例のLED
31は、1対のリード板33a,33bのうちリード板
33aの先端に発光素子34がマウントされ、発光素子
34の上面の電極とリード板33bの先端とがワイヤ3
5でボンディングされて電気的接続がなされている。こ
れらの電気系としてのリード板33a,33bの先端、
発光素子34、ワイヤ35が光透過性材料としての透明
エポキシ樹脂36によって封止されている。この透明エ
ポキシ樹脂36の外形は、発光素子34を中心とする球
形の半分(凸レンズ形)の上部を円錐形に抉り取った形
状をしている。この場合には、発光素子34から出た光
は上面32でほぼ全反射されるが、反射光は上面32に
対する発光素子34の鏡映点からの放射光に相当するの
で、集光された光ではなく、拡がり角をもって側面37
から放射される。したがって、これらの光を上方へ反射
する周辺反射鏡としての円形階段状反射鏡も実施の形態
1で用いたLED2と比較するとZ方向に長いものが必
要とされる。
As shown in FIG. 7, the LED of this comparative example
In the reference numeral 31, the light emitting element 34 is mounted on the tip of the lead plate 33a of the pair of lead plates 33a and 33b, and the electrode on the upper surface of the light emitting element 34 and the tip of the lead plate 33b are connected to the wire 3.
Bonding is performed at 5 to make an electrical connection. The tip ends of the lead plates 33a and 33b as the electric system,
The light emitting element 34 and the wire 35 are sealed with a transparent epoxy resin 36 as a light transmissive material. The outer shape of the transparent epoxy resin 36 is a spherical half (convex lens shape) with the light emitting element 34 as the center, and the upper part of the spherical shape is cut into a conical shape. In this case, the light emitted from the light emitting element 34 is almost totally reflected by the upper surface 32, but the reflected light corresponds to the emitted light from the mirror point of the light emitting element 34 with respect to the upper surface 32. Rather, it has a flank 37
Emitted from. Therefore, a circular step-shaped reflecting mirror as a peripheral reflecting mirror that reflects these lights upward is also required to be longer in the Z direction than the LED 2 used in the first embodiment.

【0042】このように、本比較例にかかるLED31
においては、LEDライトとして薄型にすることができ
ず、また外部放射効率も高くすることができず、本発明
の目的が達成されない。
Thus, the LED 31 according to this comparative example
In the above, since the LED light cannot be made thin and the external radiation efficiency cannot be increased, the object of the present invention cannot be achieved.

【0043】上記各実施の形態においては、発光素子等
を封止する光透過性材料として透明エポキシ樹脂を主に
用いているが、その他の光透過性材料でも構わない。
In each of the above-mentioned embodiments, the transparent epoxy resin is mainly used as the light-transmitting material for sealing the light emitting element and the like, but other light-transmitting materials may be used.

【0044】また、上記各実施の形態においては、発光
素子を1対のリード板の一方にマウントしているが、金
属板の上の回路基板上にマウントしても良い。このよう
に熱伝導性に優れた金属板の上に発光素子をマウントす
ることによって、放熱性が大幅に向上し、発光素子に大
電流を投入しても熱飽和が起きないため、大きな光出力
が得られるという利点がある。
In each of the above embodiments, the light emitting element is mounted on one of the pair of lead plates, but it may be mounted on the circuit board on the metal plate. By mounting the light emitting element on a metal plate with excellent thermal conductivity in this way, heat dissipation is greatly improved, and thermal saturation does not occur even when a large current is applied to the light emitting element, resulting in a large light output. Has the advantage that

【0045】発光ダイオードのその他の部分の構成、形
状、数量、材質、大きさ、接続関係等についても、上記
各実施の形態に限定されるものではない。
The configuration, shape, quantity, material, size, connection relationship, etc. of the other parts of the light emitting diode are not limited to those in the above-mentioned respective embodiments.

【0046】[0046]

【発明の効果】以上説明したように、請求項1の発明に
かかる発光ダイオードは、発光素子と、該発光素子の上
方に設けられた前記発光素子からの光を側面方向へ上下
方向に拡げることなく反射する第1の反射鏡とを具備す
るものである。
As described above, in the light emitting diode according to the invention of claim 1, the light emitting element and the light from the light emitting element provided above the light emitting element are spread in the vertical direction in the lateral direction. And a first reflecting mirror that reflects without reflection.

【0047】これによって、発光素子の直上に側面方向
へ上下方向に拡げることなく反射する第1の反射鏡を設
置して、この反射光を上方へ反射する周辺反射鏡をLE
Dの周囲に設けることによって、周辺反射鏡を第1の反
射鏡から離すほど大面積の外部放射光を得ることができ
る。また、側面方向へ反射された光は上下方向に拡がる
ことなく反射されるので、この反射光を上方へ反射する
周辺反射鏡の厚さを薄くすることができる。さらに、側
面に反射された光は全て光学制御されて上方へ反射され
て外部放射されるので、高い外部放射効率が得られる。
Thus, the first reflecting mirror that reflects the light without expanding in the vertical direction in the side direction is installed directly above the light emitting element, and the peripheral reflecting mirror that reflects the reflected light upward is LE.
By arranging it around D, it is possible to obtain external emission light having a large area as the peripheral reflecting mirror is separated from the first reflecting mirror. Further, since the light reflected in the side surface direction is reflected without spreading in the vertical direction, it is possible to reduce the thickness of the peripheral reflecting mirror that reflects this reflected light upward. Further, all the light reflected on the side surface is optically controlled, reflected upward, and radiated to the outside, so that high external radiation efficiency can be obtained.

【0048】このようにして、LEDの特長である薄型
という点を生かして、薄型で1個の発光素子で大面積を
照射することができ、高い外部放射効率を得ることがで
きるLEDライト用の発光ダイオードとなる。
In this way, by taking advantage of the thinness which is a feature of the LED, it is possible to illuminate a large area with one thin light emitting element and to obtain high external radiation efficiency for an LED light. It becomes a light emitting diode.

【0049】請求項2の発明にかかる発光ダイオード
は、発光素子と、該発光素子に電力を供給する電気系
と、前記発光素子及び前記電気系を封止する光透過性材
料とを具備し、前記光透過性材料により前記発光素子か
ら発せられた光を上下方向に拡げることなく、側面方向
へ反射する反射面と、前記側面方向へ反射された光を上
下方向へ拡げることなく外部放射する側面放射面とがモ
ールドされているものである。
A light emitting diode according to the invention of claim 2 comprises a light emitting element, an electric system for supplying electric power to the light emitting element, and a light transmissive material for sealing the light emitting element and the electric system. A reflective surface that reflects the light emitted from the light emitting element in the vertical direction by the light transmissive material and reflects the light in the side direction, and a side surface that radiates the light reflected in the lateral direction to the outside without expanding the light in the vertical direction. The radiating surface is molded.

【0050】即ち、発光素子から発せられた光が発光素
子を封止している光透過性材料の上面である反射面にお
いて、臨界角よりも大きな角度で入射するように作製さ
れている。これによって、LEDの反射鏡を作製するの
にメッキ、蒸着等の表面処理の必要がなくなり、封止金
型の形状を調節すれば良いだけなので、発光ダイオード
の作製工程が極めて短縮され、また低コスト化される。
また、光透過性材料の側面は側面方向へ反射された光を
上下方向へ拡げることなく外部放射する側面放射面とす
ることによってそのまま側面へ透過して、LED外部の
周辺反射鏡によって上方へ反射される。これによって、
発光素子から光透過性材料の上面・側面へ放射された光
はいずれも周辺反射鏡によって上方へ反射されるので、
LEDの薄型の特徴を生かしつつ外部放射効率の高いL
EDライトに適した発光ダイオードとなる。
That is, it is manufactured so that the light emitted from the light emitting element is incident on the reflection surface, which is the upper surface of the light transmissive material sealing the light emitting element, at an angle larger than the critical angle. This eliminates the need for surface treatment such as plating and vapor deposition for manufacturing the LED reflecting mirror, and only needs to adjust the shape of the sealing mold, which significantly shortens the manufacturing process of the light emitting diode and reduces the manufacturing cost. Cost is reduced.
In addition, the side surface of the light-transmissive material allows the light reflected in the side direction to be emitted to the outside without spreading in the vertical direction, so that the side surface is directly transmitted to the side surface and is reflected upward by the peripheral reflector outside the LED. To be done. by this,
Since the light emitted from the light emitting element to the upper and side surfaces of the light transmissive material is reflected upward by the peripheral reflecting mirror,
L, which has high external radiation efficiency while taking advantage of the thin LED characteristics
It becomes a light emitting diode suitable for ED light.

【0051】請求項3の発明にかかる発光ダイオード
は、請求項2の構成において、前記反射面は前記発光素
子を焦点とし前記発光素子の中心軸に直交する対称軸で
ある放物線の一部を前記発光素子の中心軸周りに回転さ
せた形状であるものである。
According to a third aspect of the present invention, in the light emitting diode according to the second aspect, the reflecting surface has a part of a parabola which is an axis of symmetry with the light emitting element as a focal point and being orthogonal to a central axis of the light emitting element. It has a shape rotated around the central axis of the light emitting element.

【0052】これによって、発光素子から発せられて前
記反射面のいずれかの箇所に当った光は、全て前記発光
素子の中心軸に略垂直な側面方向に全反射される。この
結果、前記反射面で反射された光は全て側面方向に上下
方向に拡がることなく反射されるので、LED外部の周
辺反射鏡の厚さを薄くすることができる。
As a result, all the light emitted from the light emitting element and hitting any part of the reflecting surface is totally reflected in the side surface direction substantially perpendicular to the central axis of the light emitting element. As a result, all the light reflected by the reflecting surface is reflected in the lateral direction without spreading in the vertical direction, so that the thickness of the peripheral reflecting mirror outside the LED can be reduced.

【0053】このようにして、LEDの特長である薄型
という点を生かして、薄型で1個の発光素子で大面積を
照射することができ、高い外部放射効率を得ることがで
きるLEDライト用の発光ダイオードとなる。
In this way, by taking advantage of the thinness which is a feature of the LED, it is possible to illuminate a large area with one thin light emitting element and to obtain high external radiation efficiency for an LED light. It becomes a light emitting diode.

【0054】請求項4の発明にかかる発光ダイオード
は、請求項1乃至請求項3のいずれか1つの構成におい
て、前記発光素子を金属板の上の回路基板上にマウント
したものである。
A light emitting diode according to a fourth aspect of the present invention is the light emitting diode according to any one of the first to third aspects, wherein the light emitting element is mounted on a circuit board on a metal plate.

【0055】このように熱伝導性に優れた金属板の上に
発光素子をマウントしているので、放熱性が大幅に向上
し、発光素子に大電流を投入しても熱飽和が起きないた
め、大きな光出力が得られるという利点がある。このよ
うにして、本発明の発光ダイオードによれば、薄型で大
きな放熱性を有し、熱飽和の制限を受けることなく大き
な光出力が得られ、明るい放射光が得られるLEDライ
トとなる。
Since the light emitting element is mounted on the metal plate having excellent thermal conductivity as described above, the heat dissipation is greatly improved, and thermal saturation does not occur even when a large current is applied to the light emitting element. However, there is an advantage that a large light output can be obtained. In this way, according to the light emitting diode of the present invention, the LED light is thin and has a large heat dissipation property, a large light output can be obtained without being restricted by thermal saturation, and a bright radiant light can be obtained.

【0056】請求項5の発明にかかる発光ダイオード
は、請求項1乃至請求項4のいずれか1つの構成におい
て、前記発光素子の近傍に前記発光素子の側方へ出射し
た光を上方へ反射する第2の反射鏡を設けたものであ
る。
A light emitting diode according to a fifth aspect of the present invention is the light emitting diode according to any one of the first to fourth aspects, in which light emitted to the side of the light emitting element in the vicinity of the light emitting element is reflected upward. A second reflecting mirror is provided.

【0057】これによって、請求項1の発明にかかるL
EDにおいては発光素子の真上のみ上方に光が放射され
るのに対して、発光素子の周辺からも上方に光が放射さ
れるようになり、より全体が発光しているように見え
て、見栄えが向上するという効果が得られる。
As a result, L according to the invention of claim 1
In the ED, light is radiated upward only just above the light emitting element, whereas light is also radiated upward from the periphery of the light emitting element, and it seems that the whole is emitting light. The effect of improving the appearance is obtained.

【0058】請求項6の発明にかかる発光ダイオード
は、請求項1乃至請求項5のいずれか1つの構成におい
て、前記第1の反射鏡または前記封止面の上面が中心軸
に対して60度以上の範囲の光を反射するものである。
According to a sixth aspect of the present invention, in the light emitting diode according to any one of the first to fifth aspects, the upper surface of the first reflecting mirror or the sealing surface is 60 degrees with respect to the central axis. It reflects light in the above range.

【0059】これによって、発光素子の上面の中心軸か
ら60度の範囲内に放射される光は全て第1の反射鏡ま
たは前記封止面の上面で側面方向へ反射され、中心軸か
ら60度より大きい範囲内に放射される光は直接側面方
向へ向かい、いずれも周辺反射鏡によって上方へ反射さ
れる。したがって、発光素子から放射される大部分の光
がLEDライトから外部放射されるため、極めて外部放
射効率の高いLEDライト用のLEDとなる。
As a result, all the light emitted within a range of 60 degrees from the central axis of the upper surface of the light emitting element is reflected in the side direction by the first reflecting mirror or the upper surface of the sealing surface, and 60 degrees from the central axis. Light emitted in the larger range is directed laterally and is reflected upward by the peripheral reflectors. Therefore, most of the light emitted from the light emitting element is externally emitted from the LED light, so that the LED for LED light has extremely high external emission efficiency.

【図面の簡単な説明】[Brief description of drawings]

【図1】 図1は本発明の実施の形態1にかかるLED
の全体構成を示す縦断面図である。
FIG. 1 is an LED according to a first embodiment of the present invention.
FIG. 3 is a vertical sectional view showing the overall configuration of

【図2】 図2(a)は本発明の実施の形態1にかかる
LEDを用いたLEDライトの全体構成を示す平面図、
(b)は(a)のA−A断面図、(c)は(b)のP部
分の拡大図である。
FIG. 2 (a) is a plan view showing the overall configuration of an LED light using the LED according to the first embodiment of the present invention,
(B) is an AA sectional view of (a), and (c) is an enlarged view of a portion P of (b).

【図3】 図3は本発明の実施の形態2にかかるLED
の全体構成を示す縦断面図である。
FIG. 3 is an LED according to a second embodiment of the present invention.
FIG. 3 is a vertical sectional view showing the overall configuration of

【図4】 図4は本発明の実施の形態3にかかるLED
の全体構成を示す縦断面図である。
FIG. 4 is an LED according to a third embodiment of the present invention.
FIG. 3 is a vertical sectional view showing the overall configuration of

【図5】 図5は本発明の実施の形態4にかかるLED
の側面形状を示す説明図である。
FIG. 5 is an LED according to a fourth embodiment of the present invention.
It is explanatory drawing which shows the side surface shape.

【図6】 図6は本発明の実施の形態5にかかるLED
の上面を示す部分拡大図である。
FIG. 6 is an LED according to a fifth embodiment of the present invention.
3 is a partially enlarged view showing the upper surface of FIG.

【図7】 図7は本発明の各実施の形態との比較例にか
かるLEDの全体構成を示す縦断面図である。
FIG. 7 is a vertical cross-sectional view showing an overall configuration of an LED according to a comparative example with each embodiment of the present invention.

【図8】 図8は、従来のLEDライトの一例の全体構
成を示す断面図である。
FIG. 8 is a cross-sectional view showing an overall configuration of an example of a conventional LED light.

【符号の説明】[Explanation of symbols]

2,11,16,17,18 発光ダイオード(LE
D) 5a,5b,7,12a,12b,13a,13b 電
気系 6 発光素子 8 光透過性材料 9 第1の反射鏡 15 金属面
2,11,16,17,18 Light emitting diode (LE
D) 5a, 5b, 7, 12a, 12b, 13a, 13b Electric system 6 Light emitting element 8 Light transmitting material 9 First reflecting mirror 15 Metal surface

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) F21Q 1/00 N (72)発明者 高橋 利典 愛知県西春日井郡春日町大字落合字長畑1 番地 豊田合成株式会社内 (72)発明者 太田 久敏 愛知県西春日井郡春日町大字落合字長畑1 番地 豊田合成株式会社内 Fターム(参考) 3K080 AA01 AB01 BA07 BB02 BC02 BC09 BD01 BE07 5F041 AA42 AA47 DA17 DA26 DA33 DA34 DA44 DA57 FF01 FF11 FF16 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) F21Q 1/00 N (72) Inventor Toshinori Takahashi 1st Nagachihata, Ochiai, Nishikasugai-gun, Aichi Toyoda Gosei Co., Ltd. In-house (72) Inventor Hisatoshi Ohta 1 Ochiai, Nagachiba, Kasuga-cho, Nishikasugai-gun, Aichi Prefecture F-term (Toyoda Gosei Co., Ltd.) 3K080 AA01 AB01 BA07 BB02 BC02 BC09 BD01 BE07 5F041 AA42 AA47 DA17 DA26 DA33 DA34 DA44 DA57 FF01 FF11 FF16

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 発光素子と、 該発光素子の上方に設けられた前記発光素子からの光を
上下方向に拡げることなく、側面方向のみに反射する第
1の反射鏡とを具備する発光ダイオード。
1. A light emitting diode comprising: a light emitting element; and a first reflecting mirror provided above the light emitting element, which reflects the light from the light emitting element only in a side direction without spreading the light in a vertical direction.
【請求項2】 発光素子と、 該発光素子に電力を供給する電気系と、 前記発光素子及び前記電気系を封止する光透過性材料と
を具備し、 前記光透過性材料により前記発光素子から発せられた光
を上下方向に拡げることなく、側面方向へ反射する反射
面と、前記側面方向へ反射された光を上下方向へ拡げる
ことなく外部放射する側面放射面とがモールドされてい
る発光ダイオード。
2. A light emitting device, an electric system for supplying electric power to the light emitting device, and a light transmissive material for sealing the light emitting device and the electric system, wherein the light transmissive material is used for the light emitting device. Light emission in which a reflection surface that reflects the light emitted from the side surface without being spread in the vertical direction and a side surface emitting surface that emits the light reflected in the side surface to the outside without being spread in the vertical direction is molded. diode.
【請求項3】 前記反射面は前記発光素子を焦点とし前
記発光素子の中心軸に直交する対称軸である放物線の一
部を前記発光素子の中心軸周りに回転させた形状である
ことを特徴とする請求項2に記載の発光ダイオード。
3. The reflecting surface has a shape in which a part of a parabola, which is a symmetry axis orthogonal to the central axis of the light emitting element, is rotated about the central axis of the light emitting element with the light emitting element as a focal point. The light emitting diode according to claim 2.
【請求項4】 前記発光素子を金属板の上の回路基板上
にマウントしたことを特徴とする請求項1乃至請求項3
のいずれか1つに記載の発光ダイオード。
4. The light emitting device is mounted on a circuit board on a metal plate.
The light emitting diode according to any one of 1.
【請求項5】 前記発光素子の近傍に前記発光素子の側
方へ出射した光を上方へ反射する第2の反射鏡を設けた
ことを特徴とする請求項1乃至請求項4のいずれか1つ
に記載の発光ダイオード。
5. The second reflecting mirror for reflecting light emitted to the side of the light emitting element upward is provided in the vicinity of the light emitting element. The light emitting diode described in 1.
【請求項6】 前記第1の反射鏡または前記反射面が中
心軸に対して60度以上の範囲の光を反射することを特
徴とする請求項1乃至請求項5のいずれか1つに記載の
発光ダイオード。
6. The first reflecting mirror or the reflecting surface reflects light in a range of 60 degrees or more with respect to a central axis, according to any one of claims 1 to 5. Light emitting diode.
JP2001355826A 2001-11-16 2001-11-21 Light emitting diode Pending JP2003158302A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2001355826A JP2003158302A (en) 2001-11-21 2001-11-21 Light emitting diode
CNB028226461A CN100369274C (en) 2001-11-16 2002-11-15 Light-emitting diode, led light, and light apparatus
TW091133621A TW569476B (en) 2001-11-16 2002-11-15 Light emitting diode, LED lighting module, and lamp apparatus
US10/495,644 US7781787B2 (en) 2001-11-16 2002-11-15 Light-emitting diode, led light, and light apparatus
AU2002365761A AU2002365761A1 (en) 2001-11-16 2002-11-15 Light-emitting diode, led light, and light apparatus
EP02804348A EP1453107A4 (en) 2001-11-16 2002-11-15 Light-emitting diode, led light, and light apparatus
PCT/JP2002/011968 WO2003049207A1 (en) 2001-11-16 2002-11-15 Light-emitting diode, led light, and light apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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