JP2010153624A - Led light-emitting device - Google Patents

Led light-emitting device Download PDF

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JP2010153624A
JP2010153624A JP2008330669A JP2008330669A JP2010153624A JP 2010153624 A JP2010153624 A JP 2010153624A JP 2008330669 A JP2008330669 A JP 2008330669A JP 2008330669 A JP2008330669 A JP 2008330669A JP 2010153624 A JP2010153624 A JP 2010153624A
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led chip
lead frame
light
led
emitting device
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JP5212089B2 (en
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Hideki Kokubu
英樹 國分
Toshimasa Hayashi
稔真 林
Koichi Kaga
浩一 加賀
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve light extraction efficiency of an LED light-emitting device, and to suppress deterioration of a package. <P>SOLUTION: A lead frame 13a is bent nearby an LED chip 10 to form a recessed portion 16 along long sides of the LED chip 10. A side surface 16b of the recessed portion 16 is gently inclined away from the LED chip 10 and toward a bottom surface of the recessed portion 11 of the package 12. The side surface 16b of the recessed portion 16 reflects emissive light from the LED chip 10 to improve the light extraction efficiency. Further, the recessed portion 16 is provided, so the quantity of light incident on a region, nearby the LED chip 10, on the side surface 11a of the recessed portion 11 of the package 12 decreases, thereby preventing the deterioration of the package 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、長方形のＬＥＤチップを搭載した発光装置に関するものであり、特に光取り出し効率を向上させたものである。   The present invention relates to a light emitting device on which a rectangular LED chip is mounted, and particularly improves light extraction efficiency.

従来のパッケージ型のＬＥＤ発光装置は、樹脂パッケージの凹部底面にＬＥＤチップを搭載し、凹部側面を外側上方に向かって傾斜させた構造であり、凹部側面をリフレクタとして機能させることで上方への光取り出し効率を向上させている。   A conventional package type LED light emitting device has a structure in which an LED chip is mounted on the bottom surface of a concave portion of a resin package, and the side surface of the concave portion is inclined outward and upward, and the concave side surface functions as a reflector. The extraction efficiency is improved.

また、特許文献１に示されたＬＥＤ発光装置では、ＬＥＤチップの周囲に楕円面や放物面状の凹部を形成し、その楕円面や放物面の焦点にＬＥＤチップを配置することで、光取り出し効率を向上させている。
特開２００７−３００１１０ Moreover, in the LED light emitting device shown in Patent Document 1, by forming an elliptical or parabolic recess around the LED chip, and placing the LED chip at the focal point of the elliptical or parabolic surface, The light extraction efficiency is improved.
JP2007-300110A

しかし、従来のパッケージ型のＬＥＤ発光装置では、ＬＥＤチップから水平方向、または下方（凹部底面側）に放射される光は、ほぼ垂直に凹部側面に入射するため、上方へ反射させることができず、パッケージ内部で光が滞留・減衰し、光取り出し効率が悪かった。また、凹部側面のＬＥＤチップに近い部分は、照射光の強度が強いためパッケージの劣化が激しく、変色してしまったり、封止樹脂との密着性が低下するなどの不具合の要因となっていた。凹部側面に金属膜を形成することで、光取り出し効率の向上とパッケージの劣化防止を図ることも考えられるが、製造工程が複雑となり、製造コストの増大に見合う光取り出し効率の向上効果を得ることはできなかった。   However, in the conventional package type LED light emitting device, light emitted from the LED chip in the horizontal direction or downward (on the bottom surface side of the concave portion) is incident on the side surface of the concave portion almost vertically, and thus cannot be reflected upward. The light stayed and attenuated inside the package, and the light extraction efficiency was poor. In addition, the portion near the LED chip on the side surface of the concave portion was a cause of problems such as severe deterioration of the package due to strong intensity of irradiated light, discoloration, and reduced adhesion to the sealing resin. . By forming a metal film on the side surface of the recess, it may be possible to improve the light extraction efficiency and prevent deterioration of the package, but the manufacturing process becomes complicated, and the effect of improving the light extraction efficiency commensurate with the increase in manufacturing cost can be obtained. I couldn't.

また、特許文献１に記載の発光装置では、その構造上小型化することが難しく、安価に製造することができないという問題がある。   Further, the light emitting device described in Patent Document 1 has a problem that it is difficult to downsize due to its structure, and it cannot be manufactured at low cost.

そこで本発明の目的は、光取り出し効率を向上させ、パッケージの劣化を抑制させたＬＥＤ発光装置を提供することである。   Accordingly, an object of the present invention is to provide an LED light emitting device that improves light extraction efficiency and suppresses deterioration of a package.

第１の発明は、側面が上方に向かって広がるように傾斜した凹部を有し、樹脂からなるパッケージと、パッケージの凹部底面に形成されたリードフレームと、リードフレーム上に配置され、リードフレームと電気的に接続された矩形のＬＥＤチップと、パッケージの凹部を埋める封止樹脂と、を備え、リードフレームのＬＥＤチップ近傍に、リードフレームが屈曲されてＬＥＤチップの対向する一対の辺に沿って平行な凹部または凸部の少なくとも一方が形成されていて、そのリードフレームの凹部のＬＥＤチップとは反対側の側面または凸部のＬＥＤチップ側の側面は、ＬＥＤチップから離れる方向であって上方へ向かう方向に傾斜している、ことを特徴とするＬＥＤ発光装置である。   1st invention has the recessed part which inclined so that a side surface might spread upwards, the package which consists of resin, the lead frame formed in the recessed part bottom face of a package, the lead frame arrange | positioned on a lead frame, An electrically connected rectangular LED chip and a sealing resin that fills the recess of the package, and the lead frame is bent in the vicinity of the LED chip of the lead frame along a pair of opposite sides of the LED chip At least one of a parallel concave portion or convex portion is formed, and the side surface of the concave portion of the lead frame opposite to the LED chip or the side surface of the convex portion on the LED chip side is away from the LED chip and upwards. The LED light-emitting device is characterized in that it is inclined in a direction toward it.

第２の発明は、第１の発明において、リードフレームのＬＥＤチップ近傍に、ＬＥＤチップの対向する一対の辺に沿って平行にリードフレームが屈曲されて凹部と凸部の双方が形成され、そのリードフレームの凹部と凸部は、ＬＥＤチップに近い側を凹部、遠い側を凸部として形成されている、ことを特徴とするＬＥＤ発光装置である。   According to a second invention, in the first invention, in the vicinity of the LED chip of the lead frame, the lead frame is bent in parallel along a pair of opposite sides of the LED chip to form both a concave portion and a convex portion. The lead frame has a concave portion and a convex portion formed as a concave portion on the side close to the LED chip and a convex portion on the far side.

第３の発明は、第１の発明または第２の発明において、ＬＥＤチップは長方形であり、リードフレームの凹部および凸部は、ＬＥＤチップの長辺に沿って形成されていることを特徴とするＬＥＤ発光装置である。   According to a third invention, in the first invention or the second invention, the LED chip is rectangular, and the concave portion and the convex portion of the lead frame are formed along the long side of the LED chip. LED light emitting device.

第４の発明は、第１の発明から第３の発明において、ＬＥＤチップは、フェイスアップ型であることを特徴とするＬＥＤ発光装置である。   A fourth invention is an LED light emitting device according to the first to third inventions, wherein the LED chip is a face-up type.

第４の発明は、第１の発明から第３の発明において、リードフレームには、Ａｇめっきが施されていることを特徴とするＬＥＤ発光装置である。   A fourth invention is an LED light emitting device according to any one of the first to third inventions, wherein the lead frame is subjected to Ag plating.

第１の発明では、リードフレームを屈曲させて、ＬＥＤチップの対向する一対の辺に沿って凹部または凸部を設けている。このようにリードフレームに凹部または凸部を設けると、ＬＥＤチップの対向する一対の辺からパッケージの凹部底面方向または水平方向に向かって放射される光は、リードフレームの凹部または凸部によって反射され、上方へ放射される。そのため、第１の発明によると、光取り出し効率を向上させることができる。また、第２の発明のようにしてリードフレームに凹部と凸部の双方を設けると、ＬＥＤチップの対向対向する一対の辺からパッケージの凹部底面方向および水平方向に向かって放射される光の双方を、リードフレームの凹部および凸部によって上方へ反射させることができるので、同様に光取り出し効率を向上させることができる。また、第１、２の発明によると、リードフレームに凹部、凸部を設けたことにより、パッケージの凹部側面のＬＥＤチップに近い領域に入射する光が減るため、パッケージの劣化が抑制されている。また、第１、２のＬＥＤ発光装置は、リードフレームを屈曲されて凹部、凸部を設けており、従来のＬＥＤ発光装置に比べてパッケージの形状を大きく変えているわけではないので、本発明によってＬＥＤ発光装置の大きさを増大させてしまうことはなく、小型化も容易である。   In the first invention, the lead frame is bent to provide a recess or a protrusion along a pair of opposing sides of the LED chip. If the lead frame is thus provided with recesses or protrusions, the light emitted from the pair of opposing sides of the LED chip toward the bottom surface or the horizontal direction of the recess of the package is reflected by the recesses or protrusions of the lead frame. Is emitted upward. Therefore, according to the first invention, the light extraction efficiency can be improved. Further, when both the concave portion and the convex portion are provided in the lead frame as in the second aspect of the invention, both of the light radiated from the pair of opposing sides of the LED chip toward the bottom surface of the concave portion of the package and in the horizontal direction. Can be reflected upward by the concave and convex portions of the lead frame, so that the light extraction efficiency can be similarly improved. In addition, according to the first and second inventions, since the lead frame is provided with the concave portion and the convex portion, the light incident on the region near the LED chip on the side surface of the concave portion of the package is reduced, so that the deterioration of the package is suppressed. . In addition, the first and second LED light emitting devices are provided with a concave portion and a convex portion by bending the lead frame, and the shape of the package is not greatly changed as compared with the conventional LED light emitting device. Therefore, the size of the LED light emitting device is not increased, and the size can be easily reduced.

また、第３の発明のように、ＬＥＤチップが長方形である場合には、ＬＥＤチップの短辺からよりも長辺から光が多く放射されるため、長辺に沿ってリードフレームの凹部、凸部を設けることで、効率的に光取り出し効率を向上させることができる。   Further, as in the third invention, when the LED chip is rectangular, more light is emitted from the long side than from the short side of the LED chip. By providing the portion, the light extraction efficiency can be improved efficiently.

また、第４の発明のように、本発明はフェイスアップ型のＬＥＤチップを用いる場合に特に有効である。フェイスアップ型のＬＥＤチップは、他の構造のＬＥＤチップに比べて水平方向に放射される光量が多いため、本発明によって光取り出し効率を大きく向上させることができ、パッケージの劣化を抑制する効果も高い。   As in the fourth invention, the present invention is particularly effective when a face-up type LED chip is used. Since the face-up type LED chip emits a larger amount of light in the horizontal direction than the LED chips of other structures, the present invention can greatly improve the light extraction efficiency and also has the effect of suppressing the deterioration of the package. high.

また、第５の発明のように、リードフレームに光の反射率が高い材料であるＡｇをめっきすることで、より光取り出し効率を向上させることができる。   Further, as in the fifth invention, the light extraction efficiency can be further improved by plating Ag, which is a material having a high light reflectance, on the lead frame.

以下、本発明の具体的な実施例について図を参照に説明するが、本発明は実施例に限定されるものではない。   Hereinafter, specific examples of the present invention will be described with reference to the drawings. However, the present invention is not limited to the examples.

実施例１は、トップビュータイプのＬＥＤ発光装置１である。図１は、ＬＥＤ発光装置１を上方（発光面側）からみた図であり、図２は、ＬＥＤ発光装置１のＡ−Ａにおける断面図、図３は、ＬＥＤ発光装置１のＢ−Ｂにおける断面図である。   Example 1 is a top view type LED light emitting device 1. 1 is a view of the LED light emitting device 1 as viewed from above (light emitting surface side), FIG. 2 is a cross-sectional view taken along the line AA of the LED light emitting device 1, and FIG. It is sectional drawing.

ＬＥＤ発光装置１は、図２、３に示すように、凹部１１を有したパッケージ１２と、凹部１１の底面に形成されたリードフレーム１３ａ、１３ｂと、リードフレーム１３ａ上に接着されたＬＥＤチップ１０と、ＬＥＤチップ１０とリードフレーム１３ａ、１３ｂとを電気的に接続するワイヤ１４ａ、１４ｂと、凹部１１を埋めてＬＥＤチップ１０、ワイヤ１４ａ、１４ｂを封止する蛍光体を含んだ封止樹脂１５と、により構成されている。   As shown in FIGS. 2 and 3, the LED light-emitting device 1 includes a package 12 having a recess 11, lead frames 13a and 13b formed on the bottom surface of the recess 11, and an LED chip 10 bonded on the lead frame 13a. Then, a sealing resin 15 containing wires 14a and 14b for electrically connecting the LED chip 10 and the lead frames 13a and 13b, and a phosphor for filling the recess 11 and sealing the LED chip 10 and the wires 14a and 14b. And is constituted by.

パッケージ１２は、図１に示すように、平面形状は長方形であり、凹部１１の底面にリードフレーム１３ａ、１３ｂが形成されている。このリードフレーム１３ａ、１３ｂは、凹部１１内部から、パッケージ１２の外側まで連続して延びている。パッケージ１２の外側に延びたリードフレーム１３ａ、１３ｂは、パッケージ１２の外側側面から外側下面（発光面側とは反対側の面）に沿って折り曲げられている。なお、図３の断面図において、リードフレーム１３ａ、１３ｂが凹部１１内部から、パッケージ１２の外側に連続していないように見えるが、これはリードフレーム１３ａ、１３ｂに、折り曲げ加工時の加重を低減するための孔が開けられているからで、他の断面では連続している。パッケージ１２は、たとえば、ナイロンなどの樹脂である。   As shown in FIG. 1, the package 12 has a rectangular planar shape, and lead frames 13 a and 13 b are formed on the bottom surface of the recess 11. The lead frames 13 a and 13 b continuously extend from the inside of the recess 11 to the outside of the package 12. Lead frames 13a and 13b extending to the outside of the package 12 are bent from the outer side surface of the package 12 along the outer lower surface (surface opposite to the light emitting surface side). In the cross-sectional view of FIG. 3, it seems that the lead frames 13a and 13b are not continuous from the inside of the recess 11 to the outside of the package 12, but this reduces the load on the lead frames 13a and 13b during bending. This is because a hole is made to do so, and is continuous in other cross sections. The package 12 is a resin such as nylon, for example.

凹部１１は、角を丸めた四角錐台状の形状であり、図１のように平面視では角を丸めた長方形である。凹部１１の側面１１ａは、外側上方に向かって傾斜している。このように凹部１１の側面１１ａを傾斜させることで、ＬＥＤチップ１０から放射される光を上方へ反射させるリフレクタとして機能させている。凹部１１内部には封止樹脂１５が充填されており、ＬＥＤチップ１０やワイヤ１４ａ、１４ｂを封止している。   The concave portion 11 has a quadrangular truncated pyramid shape with rounded corners, and is a rectangle with rounded corners in plan view as shown in FIG. The side surface 11a of the recess 11 is inclined upward and outward. Thus, by inclining the side surface 11a of the recess 11, the light emitted from the LED chip 10 is functioned as a reflector that reflects upward. The recess 11 is filled with a sealing resin 15 to seal the LED chip 10 and the wires 14a and 14b.

ＬＥＤチップ１０は、長方形状のフェイスアップ型チップであり、リードフレーム１３ａ上であって凹部１１の中央に、パッケージ１２の長辺方向とＬＥＤチップ１０の長辺方向が平行となるような配置で、ダイボンドペースト（図示しない）によって接着、固定されている。このＬＥＤチップ１０の図示しない２つの電極は、ワイヤ１４ａ、１４ｂによってリードフレーム１３ａ、１３ｂと電気的に接続されている。また、ＬＥＤチップ１０はIII 族窒化物半導体からなる青色発光のものである。   The LED chip 10 is a rectangular face-up chip, and is arranged on the lead frame 13a in the center of the recess 11 so that the long side direction of the package 12 and the long side direction of the LED chip 10 are parallel to each other. And bonded and fixed by a die bond paste (not shown). Two electrodes (not shown) of the LED chip 10 are electrically connected to the lead frames 13a and 13b by wires 14a and 14b. The LED chip 10 emits blue light made of a group III nitride semiconductor.

リードフレーム１３ａのＬＥＤチップ１０近傍は、リードフレーム１３ａが屈曲させられており、ＬＥＤチップ１０の長辺に沿って凹部１６が形成されている。凹部１６のＢ−Ｂにおける断面は、図３に示すように、側面１６ａと側面１６ｂとによる三角形状である。凹部１６のＬＥＤチップ１０側の側面１６ａは、パッケージ１２の凹部１１の底面に対してほぼ垂直に形成され、他方の凹部１６の側面１６ｂは、ＬＥＤチップ１０から離れる方向であってパッケージ１２の凹部１１の底面方向に向かって、ゆるやかに傾斜している。リードフレーム１３ａ、１３ｂは、Ｃｕなどの金属板にＡｇめっきを施したものである。また、パッケージ１２とリードフレーム１３ａ、１３ｂは、インサート成形によって一体化されて形成されている。   In the vicinity of the LED chip 10 of the lead frame 13 a, the lead frame 13 a is bent, and a recess 16 is formed along the long side of the LED chip 10. As shown in FIG. 3, the cross section of the recess 16 at BB has a triangular shape with side surfaces 16 a and 16 b. The side surface 16a of the recess 16 on the LED chip 10 side is formed substantially perpendicular to the bottom surface of the recess 11 of the package 12, and the side surface 16b of the other recess 16 is away from the LED chip 10 and is a recess of the package 12. 11 is gently inclined toward the bottom surface direction. The lead frames 13a and 13b are obtained by performing Ag plating on a metal plate such as Cu. Further, the package 12 and the lead frames 13a and 13b are integrally formed by insert molding.

封止樹脂１５は、シリコーン樹脂からなり、黄色蛍光体や分散材が混合されている。ＬＥＤチップ１０から放射される青色光の一部は黄色蛍光体により黄色光に変換される。そのため、実施例１のＬＥＤ発光装置１は、青色光と黄色光との混色により白色光を発光する。封止樹脂１５には、シリコーン樹脂以外にエポキシ樹脂などを用いることができる。また、黄色蛍光体は、たとえばＹＡＧ蛍光体やＢＯＳ蛍光体などである。また、酸化チタンなどの反射材を混合させてもよい。   The sealing resin 15 is made of a silicone resin, and a yellow phosphor and a dispersion material are mixed. Part of the blue light emitted from the LED chip 10 is converted into yellow light by the yellow phosphor. Therefore, the LED light-emitting device 1 of Example 1 emits white light by a mixed color of blue light and yellow light. As the sealing resin 15, an epoxy resin or the like can be used in addition to the silicone resin. The yellow phosphor is, for example, a YAG phosphor or a BOS phosphor. Further, a reflective material such as titanium oxide may be mixed.

実施例１のＬＥＤ発光装置１では、ＬＥＤチップ１０が長方形状であるため、光はＬＥＤチップ１０の長辺から主として放射される。従来のリードフレーム１３ａに凹部１６を設けていない場合には、ＬＥＤチップ１０の長辺からの放射光のうち、パッケージ１２の凹部１１底面側へ向かう光は、リードフレーム１３ａに反射された後、凹部１１の側面１１ａにほぼ垂直に入射していた。そのため、凹部１１内で光が滞留・減衰し、発光装置の外部に取り出されないことが多かった。これに対し、実施例１のＬＥＤ発光装置１では、リードフレーム１３ａに凹部１６を設けたことにより、ＬＥＤチップ１０の長辺からの放射光のうち、パッケージ１２の凹部１１底面側へ向かう光は、パッケージ１２のリードフレーム１３ａの凹部１６の側面１６ｂによって反射されて上方へと向かい、ＬＥＤ発光装置１の外部に取り出される。したがって、実施例１のＬＥＤ発光装置１は、従来のＬＥＤ発光装置に比べて光取り出し効率が向上している。また、リードフレーム１３ａはＡｇめっきが施されているため、凹部１６の側面１６ｂによって光を効率的に反射させることができる。   In the LED light-emitting device 1 of Example 1, since the LED chip 10 is rectangular, light is mainly emitted from the long side of the LED chip 10. In the case where the conventional lead frame 13a is not provided with the concave portion 16, the light emitted from the long side of the LED chip 10 toward the bottom surface side of the concave portion 11 of the package 12 is reflected by the lead frame 13a, The light was incident on the side surface 11 a of the recess 11 substantially perpendicularly. For this reason, the light stays and attenuates in the recess 11 and is often not taken out of the light emitting device. On the other hand, in the LED light emitting device 1 according to the first embodiment, by providing the lead frame 13a with the concave portion 16, the light emitted from the long side of the LED chip 10 toward the bottom surface side of the concave portion 11 of the package 12 is not emitted. Then, the light is reflected by the side surface 16b of the concave portion 16 of the lead frame 13a of the package 12 and directed upward, and is taken out of the LED light emitting device 1. Therefore, the LED light-emitting device 1 of Example 1 has improved light extraction efficiency compared to the conventional LED light-emitting device. In addition, since the lead frame 13a is Ag-plated, light can be efficiently reflected by the side surface 16b of the recess 16.

また、リードフレーム１３ａに凹部１６を設けた結果、パッケージ１２の凹部１１側面１１ａの、ＬＥＤチップ１０に近い領域に入射する光は減少する。そのため、パッケージ１２の劣化が抑制されており、パッケージ１２が変色して反射率が低下したり、封止樹脂１５とパッケージ１２との密着性が低下するなどの不具合が抑制される。   Further, as a result of providing the recess 16 in the lead frame 13a, the light incident on the region near the LED chip 10 on the side surface 11a of the recess 11 of the package 12 is reduced. Therefore, the deterioration of the package 12 is suppressed, and the package 12 is discolored and the reflectance is reduced, and problems such as a decrease in adhesion between the sealing resin 15 and the package 12 are suppressed.

また、実施例１のＬＥＤ発光装置１は、リードフレーム１３ａを屈曲されて凹部１６を設けており、パッケージ１２の形状を大きく変えているわけではないので、容易に小型化を図ることができる。   In addition, the LED light emitting device 1 of Example 1 is provided with the concave portion 16 by bending the lead frame 13a, and the shape of the package 12 is not greatly changed, so that the size can be easily reduced.

実施例２のＬＥＤ発光装置２は、リードフレーム１３ａの凹部１６に替えて、凸部２７を形成したものである。図４は、図１と同様の方向におけるＬＥＤ発光装置２の断面図である。凸部２７は、凹部１６と同様に、リードフレーム１３ａのＬＥＤチップ１０近傍を屈曲させて形成しており、ＬＥＤチップ１０の長辺に沿って形成されている。また、図４のように、凸部２７の断面は、側面２７ａと側面２７ｂとによる三角形状である。凸部２７のＬＥＤチップ１０側の側面２７ａは、ＬＥＤチップ１０から離れる方向であって上方に向かって、ゆるやかに傾斜していて、他方の凸部２７の側面２７ｂは、パッケージ１２の凹部１１の底面に対してほぼ垂直に形成されている。   In the LED light emitting device 2 of Example 2, a convex portion 27 is formed instead of the concave portion 16 of the lead frame 13a. FIG. 4 is a cross-sectional view of the LED light-emitting device 2 in the same direction as FIG. Similar to the concave portion 16, the convex portion 27 is formed by bending the vicinity of the LED chip 10 of the lead frame 13 a and is formed along the long side of the LED chip 10. Further, as shown in FIG. 4, the cross section of the convex portion 27 is triangular with a side surface 27 a and a side surface 27 b. A side surface 27 a of the convex portion 27 on the LED chip 10 side is a direction that is away from the LED chip 10 and is gently inclined upward, and a side surface 27 b of the other convex portion 27 is formed on the concave portion 11 of the package 12. It is formed substantially perpendicular to the bottom surface.

凸部２７の高さは、ＬＥＤチップ１０の高さと同程度とすることが望ましい。発光の面内均一性をより良好とすることができるからである。   As for the height of the convex part 27, it is desirable to make it the same grade as the height of the LED chip 10. FIG. This is because the in-plane uniformity of light emission can be made better.

このようにリードフレーム１３ａに凸部２７を形成すると、ＬＥＤチップ１０の長辺からの放射光のうち、パッケージ１２の凹部１１底面に平行に放射される光は、パッケージ１２のリードフレーム１３ａの凸部２７の側面２７ａによって反射されて上方へと向かい、ＬＥＤ発光装置２の外部に取り出される。したがって、実施例２のＬＥＤ発光装置２は、実施例１のＬＥＤ発光装置１と同様に光取り出し効率が向上している。   Thus, when the convex part 27 is formed in the lead frame 13a, light emitted from the long side of the LED chip 10 in parallel to the bottom surface of the concave part 11 of the package 12 is projected to the convex of the lead frame 13a of the package 12. The light is reflected by the side surface 27 a of the portion 27 and directed upward, and is taken out of the LED light emitting device 2. Therefore, the LED light-emitting device 2 of Example 2 has improved light extraction efficiency like the LED light-emitting device 1 of Example 1.

実施例３のＬＥＤ発光装置３は、リードフレーム１３ａの凹部１６に替えて、凹部３６と凸部３７を形成したものである。図５は、図１と同様の方向におけるＬＥＤ発光装置３の断面図である。凹部３６および凸部３７は、凹部１６と同様に、リードフレーム１３ａのＬＥＤチップ１０近傍を屈曲させて形成しており、ＬＥＤチップ１０の長辺に沿って形成されている。また、図５のように、ＬＥＤに近い側を凹部３６、遠い側を凸部３７として、凹部３６と凸部３７とは連続して形成されており、凹部３６の断面は、側面３６ａと側面３６ｂとによる三角形状であり、凸部３７の断面は、側面３７ａと側面３７ｂとによる三角形状であり、側面３６ｂと側面３７ａは一続きに形成されている。凹部３６のＬＥＤチップ１０側の側面３６ａは、パッケージ１２の凹部１１の底面に対してほぼ垂直に形成され、他方の凹部３６の側面３６ｂおよび凸部３７のＬＥＤチップ１０側の側面３７ａは、ＬＥＤチップ１０から離れる方向であって上方に向かって、ゆるやかに傾斜していて、凸部３７の他の側面３７ｂは、パッケージ１２の凹部１１の底面に対してほぼ垂直に形成されている。   The LED light-emitting device 3 of Example 3 has a concave portion 36 and a convex portion 37 formed in place of the concave portion 16 of the lead frame 13a. FIG. 5 is a cross-sectional view of the LED light emitting device 3 in the same direction as FIG. The recess 36 and the protrusion 37 are formed by bending the vicinity of the LED chip 10 of the lead frame 13 a in the same manner as the recess 16, and are formed along the long side of the LED chip 10. Further, as shown in FIG. 5, the concave portion 36 and the convex portion 37 are formed continuously with the concave portion 36 on the side close to the LED and the convex portion 37 on the far side, and the cross section of the concave portion 36 has a side surface 36a and a side surface. 36b, and the cross section of the convex portion 37 is a triangular shape including a side surface 37a and a side surface 37b, and the side surface 36b and the side surface 37a are formed in a row. The side surface 36a of the recess 36 on the LED chip 10 side is formed substantially perpendicular to the bottom surface of the recess 11 of the package 12, and the side surface 36b of the other recess 36 and the side surface 37a of the protrusion 37 on the LED chip 10 side are LED The other side surface 37 b of the convex portion 37 is formed so as to be substantially perpendicular to the bottom surface of the concave portion 11 of the package 12.

なお、凹部３６と凸部３７は必ずしも連続して形成されている必要はなく、ＬＥＤに近い側を凹部３６、遠い側を凸部３７として形成されているならば、凹部３６と凸部３７は離間していてもよい。   The concave portion 36 and the convex portion 37 are not necessarily formed continuously. If the side closer to the LED is formed as the concave portion 36 and the far side is formed as the convex portion 37, the concave portion 36 and the convex portion 37 are It may be separated.

このようにリードフレーム１３ａに凹部３６と凸部３７を形成すると、ＬＥＤチップ１０の長辺からの放射光のうち、パッケージ１２の凹部１１底面に平行に放射される光は、パッケージ１２のリードフレーム１３ａの凸部３７の側面３７ａによって反射されて上方へと向かい、ＬＥＤ発光装置３の外部に取り出される。また、ＬＥＤチップ１０の長辺からの放射光のうち、パッケージ１２の凹部１１底面側へ向かう光は、パッケージ１２のリードフレーム１３ａの凹部３６の側面３６ｂによって反射されて上方へと向かい、ＬＥＤ発光装置３の外部に取り出される。したがって、実施例３のＬＥＤ発光装置３もまた、ＬＥＤ発光装置１やＬＥＤ発光装置２と同様に、光取り出し効率が向上している。   When the concave portion 36 and the convex portion 37 are formed in the lead frame 13a in this way, the light emitted from the long side of the LED chip 10 in parallel to the bottom surface of the concave portion 11 of the package 12 is emitted from the lead frame of the package 12. Reflected by the side surface 37 a of the convex portion 37 of 13 a and directed upward, it is taken out of the LED light emitting device 3. Of the radiated light from the long side of the LED chip 10, the light directed toward the bottom surface of the concave portion 11 of the package 12 is reflected by the side surface 36 b of the concave portion 36 of the lead frame 13 a of the package 12 and travels upward. It is taken out of the apparatus 3. Therefore, the LED light-emitting device 3 of Example 3 also has improved light extraction efficiency, like the LED light-emitting device 1 and the LED light-emitting device 2.

なお、各実施例に示した発光装置はいずれもトップビュータイプのものであるが、本発明はこれに限るものではなく、サイドビュータイプの発光装置などにも適用することができる。サイドビュータイプでは、ＬＥＤとパッケージとの距離が近いため、本発明を適用すると、パッケージの劣化抑制の効果が高い。   Note that each of the light-emitting devices shown in the embodiments is a top-view type, but the present invention is not limited to this, and can be applied to a side-view type light-emitting device. In the side view type, since the distance between the LED and the package is short, the effect of suppressing the deterioration of the package is high when the present invention is applied.

また、各実施例では、ＬＥＤとしてフェイスアップ型のものを用いたが、フリップチップ型や、上下電極構造のものなど、任意の構造のＬＥＤを用いてよい。ただし、フェイスアップ型のものは、水平方向に放射される光の割合が高いので、本発明によって光取り出し効率を大きく向上させることができる。また、ＬＥＤの発光色についても、実施例のようにIII 族窒化物半導体からなる青色発光のＬＥＤに限るものではなく、緑色、赤色など任意の発光色のものを用いてよく、紫外発光や、赤外発光など可視光以外の波長を発光するものであってもよい。たとえば、紫外発光のＬＥＤを用い、封止樹脂に紫外光によって励起されて青、緑、赤に発光する蛍光体を混合することで、白色発光の発光装置を実現することも可能である。また、ＬＥＤの半導体材料も任意であり、III 族窒化物半導体、ＡｌＧａＩｎＰ系材料、ＧａＡｓＰ系材料などのIII −Ｖ族半導体や、ＺｎＯなどのII−ＶI 族半導体を材料とするＬＥＤであってもよい。   In each of the embodiments, the face-up type LED is used, but an LED having an arbitrary structure such as a flip chip type or an upper and lower electrode structure may be used. However, since the ratio of light emitted in the horizontal direction is high in the face-up type, the light extraction efficiency can be greatly improved by the present invention. In addition, the LED emission color is not limited to a blue light emitting LED made of a group III nitride semiconductor as in the embodiment, and may be any light emission color such as green or red, such as ultraviolet light emission, It may emit light having a wavelength other than visible light, such as infrared light emission. For example, a white light emitting device can be realized by using an ultraviolet light emitting LED and mixing a phosphor that emits blue, green, and red light when excited by ultraviolet light into a sealing resin. The semiconductor material of the LED is also arbitrary, and even an LED made of a III-V group semiconductor such as a group III nitride semiconductor, an AlGaInP-based material, a GaAsP-based material, or a II-VI group semiconductor such as ZnO may be used. Good.

また、各実施例では、リードフレームの凹部、凸部の断面形状を三角形状としたが、これに限るものではなく、ＬＥＤから遠い側の側面が、ＬＥＤから離れる方向であって上方に向かう傾斜を有する形状であればよい。たとえば台形状などである。また、各実施例ではＬＥＤチップを長方形としたが、正方形であってもよい。   In each embodiment, the cross-sectional shape of the concave portion and the convex portion of the lead frame is triangular. However, the present invention is not limited to this, and the side surface far from the LED is inclined away from the LED and upward. Any shape may be used. For example, a trapezoidal shape. Moreover, although LED chip was made into the rectangle in each Example, a square may be sufficient.

本発明の発光装置は、ディスプレイのバックライト光源などに用いることができる。   The light emitting device of the present invention can be used as a backlight light source of a display.

実施例１のＬＥＤ発光装置１を上方からみた図。The figure which looked at the LED light-emitting device 1 of Example 1 from upper direction. 図１のＡ−ＡにおけるＬＥＤ発光装置１の断面図。Sectional drawing of the LED light-emitting device 1 in AA of FIG. 図１のＢ−ＢにおけるＬＥＤ発光装置１の断面図。Sectional drawing of the LED light-emitting device 1 in BB of FIG. 実施例２のＬＥＤ発光装置２の断面図。Sectional drawing of the LED light-emitting device 2 of Example 2. FIG. 実施例３のＬＥＤ発光装置３の断面図。Sectional drawing of the LED light-emitting device 3 of Example 3. FIG.

符号の説明Explanation of symbols

１０：ＬＥＤチップ
１１、１６、３６：凹部
１２：パッケージ
１３ａ、１３ｂ：リードフレーム
１４ａ、１４ｂ：ワイヤ
１５：封止樹脂
２７、３７：凸部 10: LED chip 11, 16, 36: recessed part 12: package 13a, 13b: lead frame 14a, 14b: wire 15: sealing resin 27, 37: convex part

Claims (5)

側面が上方に向かって広がるように傾斜した凹部を有し、樹脂からなるパッケージと、
前記パッケージの前記凹部底面に形成されたリードフレームと、
前記リードフレーム上に配置され、前記リードフレームと電気的に接続された矩形のＬＥＤチップと、
前記パッケージの前記凹部を埋める封止樹脂と、
を備え、
前記リードフレームの前記ＬＥＤチップ近傍に、前記リードフレームが屈曲されて前記ＬＥＤチップの対向する一対の辺に沿って平行な凹部または凸部の少なくとも一方が形成されていて、
そのリードフレームの凹部の前記ＬＥＤチップとは反対側の側面または凸部の前記ＬＥＤチップ側の側面は、前記ＬＥＤチップから離れる方向であって上方へ向かう方向に傾斜している、
ことを特徴とするＬＥＤ発光装置。 A package made of resin, having a concave portion inclined so that the side surface expands upward;
A lead frame formed on the bottom surface of the recess of the package;
A rectangular LED chip disposed on the lead frame and electrically connected to the lead frame;
A sealing resin filling the recess of the package;
With
Near the LED chip of the lead frame, the lead frame is bent to form at least one of a concave portion or a convex portion parallel to a pair of opposing sides of the LED chip,
The side surface opposite to the LED chip of the concave portion of the lead frame or the side surface of the convex portion on the LED chip side is inclined in a direction away from the LED chip and upward.
An LED light emitting device characterized by that. 前記リードフレームの前記ＬＥＤチップ近傍に、前記ＬＥＤチップの対向する一対の辺に沿って平行に前記リードフレームが屈曲されて凹部と凸部の双方が形成され、
そのリードフレームの凹部と凸部は、前記ＬＥＤチップに近い側を凹部、遠い側を凸部として形成されている、
ことを特徴とする請求項１に記載のＬＥＤ発光装置。 In the vicinity of the LED chip of the lead frame, the lead frame is bent in parallel along a pair of opposite sides of the LED chip to form both a concave portion and a convex portion,
The concave portion and the convex portion of the lead frame are formed as a concave portion on the side close to the LED chip and a convex portion on the far side,
The LED light-emitting device according to claim 1. 前記ＬＥＤチップは長方形であり、
前記リードフレームの凹部および凸部は、前記ＬＥＤチップの長辺に沿って形成されていることを特徴とする請求項１または請求項２に記載のＬＥＤ発光装置。 The LED chip is rectangular,
The LED light-emitting device according to claim 1, wherein the concave portion and the convex portion of the lead frame are formed along a long side of the LED chip. 前記ＬＥＤチップは、フェイスアップ型であることを特徴とする請求項１ないし請求項３のいずれか１項に記載のＬＥＤ発光装置。   The LED light-emitting device according to claim 1, wherein the LED chip is a face-up type. 前記リードフレームには、Ａｇめっきが施されていることを特徴とする請求項１ないし請求項４のいずれか１項に記載のＬＥＤ発光装置。   The LED light-emitting device according to claim 1, wherein the lead frame is subjected to Ag plating.
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