JP2012094689A - Light-emitting device and manufacturing method thereof - Google Patents

Light-emitting device and manufacturing method thereof Download PDF

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JP2012094689A
JP2012094689A JP2010240835A JP2010240835A JP2012094689A JP 2012094689 A JP2012094689 A JP 2012094689A JP 2010240835 A JP2010240835 A JP 2010240835A JP 2010240835 A JP2010240835 A JP 2010240835A JP 2012094689 A JP2012094689 A JP 2012094689A
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containing resin
light
element mounting
phosphor
substrate
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Taiji Kotani
泰司 小谷
Takateru Sakai
隆照 酒井
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which includes a light scattering material-containing resin for forming a reflective structure and a phosphor-containing organic resin as a wavelength conversion material, and can avoid a reduction in luminous efficiency and variations in chromaticity owing to fluctuations in the filled amount of the light scattering material-containing resin, and a method for manufacturing the light-emitting device.SOLUTION: The light-emitting device comprises a substrate, an element placement salient part provided on the top face of the substrate and projecting in a direction crossing the top face of the substrate, a light-emitting element mounted on the top face of the element placement salient part, a phosphor-containing organic resin part covering the light-emitting element on the top face of the element placement salient part, and a light scattering material-containing resin part covering the top face of the substrate and the side faces of the element placement salient part. The element placement salient part has an overhang part whose upper part, including the top face, juts out to the lower part which is connected to the substrate, and the phosphor-containing organic resin part and the light scattering material-containing resin part are separated from each other via the overhang part.

Description

本発明は、発光ダイオード等の発光素子を有する発光装置に関する。   The present invention relates to a light emitting device having a light emitting element such as a light emitting diode.

近年、発光ダイオード（LED：Light Emitting Diode）等の発光素子を用いて白色光を出力する発光装置が、照明装置や液晶表示装置のバックライト等に利用されている。例えば青色光を出射する発光素子を、蛍光体を含有させた樹脂で封止することにより、発光素子から出射される青色光の一部を蛍光体によって黄色光に変換し、青色光と黄色光とを混色させることにより白色光として出力させるようにした発光装置が知られている。一方、近年におけるＬＥＤの照明用途への展開等に伴って、表面実装型の発光装置のニーズが高まりつつある。表面実装型の発光装置では、発光効率を高めるために光反射構造が設けられている。   2. Description of the Related Art In recent years, light emitting devices that output white light using light emitting elements such as light emitting diodes (LEDs) have been used as backlights for illumination devices and liquid crystal display devices. For example, by sealing a light emitting element that emits blue light with a resin containing a phosphor, a part of the blue light emitted from the light emitting element is converted into yellow light by the phosphor, and blue light and yellow light are converted. There is known a light-emitting device that outputs white light by mixing the two colors. On the other hand, with the recent development of LED lighting applications, the need for surface-mounted light-emitting devices is increasing. In the surface mount type light emitting device, a light reflecting structure is provided in order to increase the light emission efficiency.

特許文献１には、側壁を有するパッケージ成形体の底部にサブマウント基板に載置された発光素子を搭載し、パッケージ成形体の底部および側壁を光反射性を有するコーティング部材で被覆した半導体発光装置が記載されている。コーティング部材は、エポキシ樹脂等からなる基材に酸化チタン等の光散乱材を含有させたものであり、発光素子に非接触となるように形成される。   Patent Document 1 discloses a semiconductor light emitting device in which a light emitting element mounted on a submount substrate is mounted on the bottom of a package molded body having a side wall, and the bottom and side walls of the package molded body are covered with a coating member having light reflectivity. Is described. The coating member is a base material made of an epoxy resin or the like containing a light scattering material such as titanium oxide, and is formed so as not to contact the light emitting element.

特開２００５−１３６３７９号公報JP 2005-136379 A

特許文献１には、コーティング部材が発光素子に対して非接触であることが記載されている。しかしながら、単に発光素子をサブマウントを介してパッケージ成形体の底部に搭載する構造では、コーティング部材がサブマウントの側面および発光素子の側面に這い上がりやすい。発光素子の側面にコーティング部材が付着すると、発光素子から放射された光が再び発光素子内部に導入されて減衰し、発光効率の低下を招くため好ましくない。従って、コーティング部材の塗布量を厳重に管理する必要があり、高歩留りを確保するのが困難となる。また、特許文献１に記載の構造において、発光素子を埋設するようにパッケージ成形体の内側を蛍光体含有樹脂で封止する場合、コーティング部材の充填量のばらつきが蛍光体含有樹脂の充填量のばらつきを招来し、ひいては発光色の色度ばらつきを招来することとなる。   Patent Document 1 describes that the coating member is not in contact with the light emitting element. However, in the structure in which the light emitting element is simply mounted on the bottom of the package molded body via the submount, the coating member tends to creep up to the side surface of the submount and the side surface of the light emitting element. If the coating member adheres to the side surface of the light emitting element, the light emitted from the light emitting element is again introduced into the light emitting element and attenuated, resulting in a decrease in luminous efficiency. Therefore, it is necessary to strictly manage the coating amount of the coating member, and it becomes difficult to ensure a high yield. Further, in the structure described in Patent Document 1, when the inside of the package molded body is sealed with a phosphor-containing resin so as to embed the light emitting element, the variation in the filling amount of the coating member is the filling amount of the phosphor-containing resin. Variation will be caused, and as a result, chromaticity variation of the emission color will be caused.

本発明は、上記した点に鑑みてなされたものであり、反射構造を形成するための光散乱材含有樹脂部と波長変換部材としての蛍光体含有樹脂部とを有する発光装置において、光散乱材含有樹脂の充填量の変動に伴う発光効率の低下や色度ばらつきの発生を回避することができる発光装置およびその製造方法を提供することを目的とする。   The present invention has been made in view of the above points, and in a light emitting device having a light scattering material-containing resin portion for forming a reflective structure and a phosphor-containing resin portion as a wavelength conversion member, the light scattering material It is an object of the present invention to provide a light emitting device and a method for manufacturing the same that can avoid a decrease in light emission efficiency and a chromaticity variation caused by a change in the filling amount of the contained resin.

本発明の発光装置は、基板と、前記基板の上面に設けられて前記基板の上面と交差する方向に突出した素子搭載凸部と、前記素子搭載凸部の上面に搭載された発光素子と、前記素子搭載凸部の上面において前記発光素子を被覆する蛍光体含有樹脂部と、前記基板の上面および前記素子搭載凸部の側面を覆う光散乱材含有樹脂部と、を有し、前記素子搭載凸部は、上面を含む上部が前記基板に接続される下部に対して張り出しているオーバハング部を有し、前記蛍光体含有樹脂部と前記光散乱材含有樹脂部とは、前記オーバハング部を介して互いに隔てられていることを特徴としている。   The light emitting device of the present invention includes a substrate, an element mounting convex portion provided on the upper surface of the substrate and protruding in a direction intersecting the upper surface of the substrate, a light emitting element mounted on the upper surface of the element mounting convex portion, A phosphor-containing resin part that covers the light emitting element on the upper surface of the element mounting convex part, and a light scattering material-containing resin part that covers the upper surface of the substrate and the side surface of the element mounting convex part, The convex portion has an overhang portion in which an upper portion including an upper surface protrudes from a lower portion connected to the substrate, and the phosphor-containing resin portion and the light scattering material-containing resin portion are interposed via the overhang portion. It is characterized by being separated from each other.

また、本発明の発光装置の製造方法は、基板と、前記基板の上面に設けられて前記基板の上面と交差する方向に突出した素子搭載凸部と、を有する基体を用意する工程と、前記素子搭載凸部の上面に発光素子を搭載する工程と、前記素子搭載凸部の上面において前記発光素子を蛍光体含有樹脂で被覆する工程と、前記基板の上面および前記素子搭載凸部の側面を覆うように光散乱材含有樹脂を充填する工程と、を含み、前記素子搭載凸部は、上面を含む上部が前記基板に接続される下部に対して張り出しているオーバハング部を有し、前記素子搭載凸部の側面を覆う光散乱材含有樹脂は、前記オーバハング部を介して前記素子搭載凸部の上面から隔てられていることを特徴としている。   Further, the method for manufacturing a light emitting device of the present invention includes a step of preparing a substrate having a substrate and an element mounting convex portion provided on the upper surface of the substrate and protruding in a direction intersecting the upper surface of the substrate; A step of mounting a light emitting element on the upper surface of the element mounting convex portion, a step of covering the light emitting element with a phosphor-containing resin on the upper surface of the element mounting convex portion, and an upper surface of the substrate and a side surface of the element mounting convex portion. Filling the light-scattering material-containing resin so as to cover, the element mounting convex portion having an overhang portion in which an upper portion including an upper surface projects from a lower portion connected to the substrate, The light scattering material-containing resin that covers the side surface of the mounting convex portion is separated from the upper surface of the element mounting convex portion via the overhang portion.

本発明の発光装置およびその製造方法によれば、光散乱材含有樹脂の充填量にばらつきが生じた場合でも、素子搭載凸部に形成された軒構造（又は庇構造）により、蛍光体含有樹脂および発光素子を含む発光部が光散乱材含有樹脂から隔てられているので、光散乱材含有樹脂の這い上がり生じにくくなり、発光効率の低下が回避される。また、蛍光体含有樹脂は、素子搭載凸部の上面によって形成範囲が画定されるので、発光素子を覆う蛍光体含有樹脂の被覆厚は、光散乱材含有樹脂の充填量のばらつきの影響を受けず、従って色度ばらつきの発生も回避することができる。   According to the light emitting device and the method for manufacturing the same of the present invention, even when the filling amount of the light scattering material-containing resin varies, the phosphor-containing resin is formed by the eaves structure (or the ridge structure) formed on the element mounting convex portion. Since the light-emitting portion including the light-emitting element is separated from the light scattering material-containing resin, the light scattering material-containing resin does not easily creep up, and a decrease in light emission efficiency is avoided. In addition, since the formation range of the phosphor-containing resin is defined by the upper surface of the element mounting convex portion, the coating thickness of the phosphor-containing resin that covers the light emitting element is affected by variations in the filling amount of the light scattering material-containing resin. Therefore, the occurrence of chromaticity variation can be avoided.

図１（ａ）は本発明の実施例に係る発光装置の構成を示す平面図、図１（ｂ）は図１（ａ）における１ｂ−１ｂ線に沿った断面図、図１（ｃ）は本発明の実施例に係る素子搭載凸部の構成を示す斜視図である。1A is a plan view showing a configuration of a light emitting device according to an embodiment of the present invention, FIG. 1B is a cross-sectional view taken along line 1b-1b in FIG. 1A, and FIG. It is a perspective view which shows the structure of the element mounting convex part which concerns on the Example of this invention. 本発明の実施例に係る発光装置の構成を示す断面図である。It is sectional drawing which shows the structure of the light-emitting device based on the Example of this invention. 本発明の実施例に係る素子搭載凸部の構成を示す断面図である。It is sectional drawing which shows the structure of the element mounting convex part which concerns on the Example of this invention. 図４（ａ）〜（ｃ）は、本発明の実施例に係る発光装置の製造方法を示す断面図である。4A to 4C are cross-sectional views illustrating a method for manufacturing a light-emitting device according to an embodiment of the present invention. 図５（ａ）〜（ｃ）は、本発明の実施例に係る発光装置の製造方法を示す断面図である。5A to 5C are cross-sectional views illustrating a method for manufacturing a light emitting device according to an embodiment of the present invention. 本発明の実施例に係る素子搭載凸部の他の構成を示す断面図である。It is sectional drawing which shows the other structure of the element mounting convex part which concerns on the Example of this invention. 本発明の実施例に係る素子搭載凸部の他の構成を示す斜視図である。It is a perspective view which shows the other structure of the element mounting convex part which concerns on the Example of this invention. 図８（ａ）は本発明の実施例に係る面状光源装置の構成を示す平面図、図８（ｂ）は図８（ａ）における８ｂ−８ｂ線に沿った断面図である。FIG. 8A is a plan view showing the configuration of the planar light source device according to the embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along the line 8b-8b in FIG. 8A.

以下、本発明の実施例について図面を参照しつつ説明する。尚、以下に示す図において、実質的に同一又は等価な構成要素、部分には同一の参照符を付している。   Embodiments of the present invention will be described below with reference to the drawings. In the drawings shown below, substantially the same or equivalent components and parts are denoted by the same reference numerals.

図１（ａ）は本発明の実施例に係る発光装置１の平面図、図１（ｂ）および図２は図１（ａ）における１ｂ−１ｂ線に沿った断面図、図１（ｃ）は本発明の実施例に係る素子搭載凸部の構成を示す斜視図である。   1A is a plan view of a light emitting device 1 according to an embodiment of the present invention, FIGS. 1B and 2 are cross-sectional views taken along line 1b-1b in FIG. 1A, and FIG. These are perspective views which show the structure of the element mounting convex part based on the Example of this invention.

基体１０は、導電性および熱伝導性が良好な例えばＡｌ又はＣｕ等の金属からなり、発光装置１の外形形状を画定している。基体１０は、発光装置１の底面を形成する基板部１１と、基板部１１の上面中央から略垂直方向に突出した素子搭載凸部１２と、素子搭載凸部１２を囲む側壁を形成する枠部１３とにより構成されている。基体１０を構成するこれらの各構成部分は、プレス加工により成型されて一体的な形態を有している。尚、基体１０の表面には、はんだ濡れ性等を向上させるために全体的又は部分的に適宜Ｎｉめっき等のめっき処理が施されていてもよい。   The substrate 10 is made of a metal such as Al or Cu having good conductivity and thermal conductivity, and defines the outer shape of the light emitting device 1. The base 10 includes a substrate portion 11 that forms the bottom surface of the light emitting device 1, an element mounting convex portion 12 that protrudes from the center of the top surface of the substrate portion 11 in a substantially vertical direction, and a frame portion that forms a side wall surrounding the element mounting convex portion 12. 13. Each of these constituent parts constituting the base body 10 is molded by pressing and has an integral form. The surface of the substrate 10 may be appropriately subjected to a plating treatment such as Ni plating in whole or in part in order to improve solder wettability and the like.

基体１０は、スリット１４により互いに分離された第１の部分１０ａと第２の部分１０ｂとからなり、それぞれ発光素子２０のｐ電極およびｎ電極にボンディングワイヤ２２を介して接続されている。素子搭載凸部１２は、基体１０の第１の部分１０ａにおいてスリット１４に面する位置に設けられている。   The base body 10 includes a first portion 10 a and a second portion 10 b separated from each other by the slit 14, and is connected to the p electrode and the n electrode of the light emitting element 20 via bonding wires 22, respectively. The element mounting convex portion 12 is provided at a position facing the slit 14 in the first portion 10 a of the base body 10.

素子搭載凸部１２の上面は、平坦であり、発光素子２０を搭載するための素子搭載面を形成している。素子搭載凸部１２は、素子搭載面を含む上部が基板部１１に接続された下部（支柱部１２ｂ）に対して外側に張り出したオーバハング部１２ａとなっており、いわゆる軒構造（又は庇構造）を形成している。すなわち、素子搭載凸部１２は、支柱部１２ｂとオーバハング部１２ａとからなり、素子搭載面を含むオーバハング部１２ａが支柱部１２ｂに対してオーバハングしており、素子搭載凸部１２の全体形状は、図１（ｂ）に示す断面において略Ｔ字型となっている。本実施例では、オーバハング部１２ａの側面は、その上面および下面に対し略垂直となっている。素子搭載凸部１２の上面には、発光素子２０がダイアタッチ剤を介して接合されている。   The upper surface of the element mounting convex portion 12 is flat and forms an element mounting surface for mounting the light emitting element 20. The element mounting convex part 12 is an overhang part 12a in which an upper part including the element mounting surface protrudes outward from a lower part (post part 12b) connected to the substrate part 11, and is a so-called eaves structure (or eaves structure). Is forming. That is, the element mounting convex portion 12 is composed of a column portion 12b and an overhang portion 12a. The overhang portion 12a including the element mounting surface is overhanging with respect to the column portion 12b, and the overall shape of the element mounting convex portion 12 is The cross section shown in FIG. 1B is substantially T-shaped. In the present embodiment, the side surface of the overhang portion 12a is substantially perpendicular to the upper surface and the lower surface. The light emitting element 20 is joined to the upper surface of the element mounting convex portion 12 via a die attach agent.

素子搭載凸部１２の上面（素子搭載面）の面積は、発光素子２０の面積よりも大きい。例えば、発光素子２０は０．３ｍｍ×０．５ｍｍの矩形形状を有し、素子搭載凸部１２の上面（素子搭載面）は０．９ｍｍ×１．２ｍｍの矩形形状を有する。すなわち、発光素子２０を素子搭載凸部１２の上面の中央に配置したときに、発光素子２０の各辺から素子搭載面の外縁までの距離がそれぞれ略等しくなる。   The area of the upper surface (element mounting surface) of the element mounting convex portion 12 is larger than the area of the light emitting element 20. For example, the light emitting element 20 has a rectangular shape of 0.3 mm × 0.5 mm, and the upper surface (element mounting surface) of the element mounting convex portion 12 has a rectangular shape of 0.9 mm × 1.2 mm. That is, when the light emitting element 20 is disposed at the center of the upper surface of the element mounting convex portion 12, the distances from the sides of the light emitting element 20 to the outer edge of the element mounting surface are substantially equal.

支柱部１２ｂは、例えば四角柱状であり、幅Ｗ１が０．６ｍｍ、高さＴ１が０．４ｍｍである。オーバハング部１２ａの支柱部１２ｂに対する張り出し幅Ｗ２は、例えば０．１５ｍｍである。オーバハング部１２ａの厚さＴ２は例えば０．２ｍｍである。つまり、基板部１１の上面から突出した素子搭載凸部１２の全体の高さ（Ｔ１＋Ｔ２）は、例えば０．６ｍｍである。   The support column 12b is, for example, a quadrangular prism, and has a width W1 of 0.6 mm and a height T1 of 0.4 mm. The overhanging width W2 of the overhang portion 12a with respect to the column portion 12b is, for example, 0.15 mm. A thickness T2 of the overhang portion 12a is, for example, 0.2 mm. That is, the overall height (T1 + T2) of the element mounting convex portion 12 protruding from the upper surface of the substrate portion 11 is, for example, 0.6 mm.

発光素子２０は、例えばＧａＮ系窒化物半導体からなるｎ型半導体層、活性層、ｐ型半導体層とを有する青色ＬＥＤである。発光素子２０は、上面にｎ側電極およびｐ側電極が形成されたいわゆるフェイスアップ型の発光素子である。   The light emitting element 20 is a blue LED having, for example, an n-type semiconductor layer made of a GaN-based nitride semiconductor, an active layer, and a p-type semiconductor layer. The light emitting element 20 is a so-called face-up type light emitting element in which an n-side electrode and a p-side electrode are formed on an upper surface.

蛍光体含有樹脂部３０は、素子搭載凸部１２の上面に亘って延在し、発光素子２０を埋設しつつ素子搭載凸部１２の上面を覆っている。蛍光体含有樹脂部３０は、シリコーン樹脂等の光透過性樹脂を主成分とし、これにＹＡＧ（イットリウム・アルミニウム・ガーネット：Ｙ３Ａｌ５Ｏ１２）に付活剤としてＣｅ（セリウム）を導入したＹＡＧ：Ｃｅ蛍光体を分散した蛍光体含有樹脂を用いて形成される。ＹＡＧ：Ｃｅ蛍光体は、発光素子２０から放射されるピーク波長が例えば約４６０ｎｍの青色光を吸収してこれを例えば波長５６０ｎｍ前後に発光ピークを持つ黄色光に変換する。発光装置１の光放射面からは、蛍光体により波長変換された黄色光と、波長変換されずに蛍光体含有樹脂部３０を透過した青色光が混ざることにより白色光が得られるようになっている。 The phosphor-containing resin portion 30 extends over the upper surface of the element mounting convex portion 12 and covers the upper surface of the element mounting convex portion 12 while embedding the light emitting element 20. The phosphor-containing resin part 30 is mainly composed of a light-transmitting resin such as silicone resin, and Ce (cerium) is introduced into YAG (yttrium, aluminum, garnet: Y 3 Al 5 O 12 ) as an activator. It is formed using a phosphor-containing resin in which a YAG: Ce phosphor is dispersed. The YAG: Ce phosphor absorbs blue light having a peak wavelength of, for example, about 460 nm emitted from the light emitting element 20, and converts it into yellow light having an emission peak at, for example, about 560 nm. From the light emitting surface of the light emitting device 1, white light is obtained by mixing yellow light that has been wavelength-converted by the phosphor and blue light that has been transmitted through the phosphor-containing resin portion 30 without being wavelength-converted. Yes.

蛍光体含有樹脂部３０は、所定重量の液状の蛍光体含有樹脂を発光素子２０の上方から滴下した後、熱硬化することにより形成される。蛍光体含有樹脂部３０の形成範囲および形状は、蛍光体含有樹脂が熱硬化前の液体の状態にあるときに、表面張力によってセルフアライン的に定まる。すなわち、液状の蛍光体含有樹脂は、素子搭載凸部１２の上面の外縁まで濡れ拡がる。従って、蛍光体含有樹脂部３０の底面の形状は、素子搭載凸部１２の上面形状に応じた形状すなわち本実施例においては矩形形状となる。一方、蛍光体含有樹脂部３０の上面は、半球ドーム状の曲面となる。発光素子２０の各辺から素子搭載凸部１２の上面の外縁までの距離がそれぞれ等しくなるように発光素子２０を素子搭載凸部１２の上面中央に配置することにより、発光素子２０の側面を覆う蛍光体含有樹脂部３０の被覆厚は発光素子２０の各辺においてそれぞれ均一となる。発光素子２０の上面を覆う蛍光体含有樹脂部３０の被覆厚を、側面における被覆厚と一致させることにより、色むらのない発光色を得ることが可能となる。   The phosphor-containing resin portion 30 is formed by dripping a predetermined amount of a liquid phosphor-containing resin from above the light emitting element 20 and then thermosetting it. The formation range and shape of the phosphor-containing resin portion 30 are determined in a self-aligned manner by the surface tension when the phosphor-containing resin is in a liquid state before thermosetting. That is, the liquid phosphor-containing resin spreads to the outer edge of the upper surface of the element mounting convex portion 12. Therefore, the shape of the bottom surface of the phosphor-containing resin portion 30 is a shape corresponding to the shape of the top surface of the element mounting convex portion 12, that is, a rectangular shape in this embodiment. On the other hand, the upper surface of the phosphor-containing resin portion 30 is a hemispherical dome-shaped curved surface. The light emitting element 20 is arranged at the center of the upper surface of the element mounting convex portion 12 so that the distance from each side of the light emitting element 20 to the outer edge of the upper surface of the element mounting convex portion 12 is equal, thereby covering the side surface of the light emitting element 20. The coating thickness of the phosphor-containing resin portion 30 is uniform on each side of the light emitting element 20. By making the coating thickness of the phosphor-containing resin portion 30 covering the upper surface of the light emitting element 20 coincide with the coating thickness on the side surface, it is possible to obtain a light emission color without color unevenness.

枠部１３は、基板部１１の外縁に沿って設けられ、基板部１１の上面に対して略垂直方向に伸長する側壁を有し、素子搭載凸部１２を囲むように円形状に連なる壁面を形成する。すなわち、枠部１３は円形のキャビティを形成している。素子搭載凸部１２は枠部１３により形成される円形のキャビティ内の中央に配置される。枠部１３により形成される側壁は、発光素子２０およびボンディングワイヤ２２のループトップよりも高い位置まで伸長している。   The frame portion 13 is provided along the outer edge of the substrate portion 11, has a side wall extending in a substantially vertical direction with respect to the upper surface of the substrate portion 11, and has a circular wall surface that surrounds the element mounting convex portion 12. Form. That is, the frame portion 13 forms a circular cavity. The element mounting convex portion 12 is disposed at the center in a circular cavity formed by the frame portion 13. The side wall formed by the frame portion 13 extends to a position higher than the loop tops of the light emitting element 20 and the bonding wire 22.

光散乱材含有樹脂部４０は、シリコーン樹脂等の樹脂材に二酸化チタン（ＴｉＯ２）、酸化亜鉛（ＺｎＯ）、酸化アルミニウム（Ａｌ２Ｏ３）等の光散乱材を分散させた白色の光散乱含有樹脂を用いて形成される。光散乱材含有樹脂部４０は、枠部１３によって形成される側壁の内側を充填するように形成される。光散乱材含有樹脂部４０は、枠部１３の側壁、基板部１１の上面および素子搭載凸部１２の側面を覆う。素子搭載凸部１２が軒構造（又は庇構造）を有することにより、光散乱材含有樹脂の這い上がりはオーバハング部１２ａの下面で堰き止められる。すなわち、発光素子２０および蛍光体含有樹脂部３０を含む発光部と光散乱材含有樹脂部４０とは、オーバハング部１２ａを間に挟んで互いに離間しており、発光部と光散乱材含有樹脂部４０とは非接触となっている。素子搭載凸部１２が軒構造（又は庇構造）を有することにより、光散乱材含有樹脂の充填量が多少変動した場合でも、発光部と光散乱材含有樹脂部４０の非接触状態は維持される。また、蛍光体含有樹脂部３０は、光散乱材含有樹脂部４０から隔てられた素子搭載凸部１２の上面に形成されるので、光散乱材含有樹脂の充填量の変動によって発光素子２０を覆う蛍光体含有樹脂部３０の被覆厚が変動することはなく、発光色の色度ばらつきを防止することができる。 The light scattering material-containing resin portion 40 is a white light scattering in which a light scattering material such as titanium dioxide (TiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ) is dispersed in a resin material such as silicone resin. It is formed using the containing resin. The light scattering material-containing resin portion 40 is formed so as to fill the inside of the side wall formed by the frame portion 13. The light scattering material-containing resin portion 40 covers the side wall of the frame portion 13, the upper surface of the substrate portion 11, and the side surface of the element mounting convex portion 12. Since the element mounting convex portion 12 has an eaves structure (or eaves structure), the creeping of the light scattering material-containing resin is blocked by the lower surface of the overhang portion 12a. That is, the light emitting part including the light emitting element 20 and the phosphor-containing resin part 30 and the light scattering material-containing resin part 40 are separated from each other with the overhang part 12a interposed therebetween, and the light emitting part and the light scattering material-containing resin part 40 40 is not contacted. Since the element mounting convex portion 12 has an eaves structure (or a saddle structure), the non-contact state between the light emitting portion and the light scattering material-containing resin portion 40 is maintained even when the filling amount of the light scattering material-containing resin is slightly changed. The In addition, since the phosphor-containing resin portion 30 is formed on the upper surface of the element mounting convex portion 12 separated from the light scattering material-containing resin portion 40, the phosphor-containing resin portion 30 covers the light emitting element 20 due to variation in the filling amount of the light scattering material-containing resin. The coating thickness of the phosphor-containing resin part 30 does not vary, and the chromaticity variation of the emission color can be prevented.

光散乱材含有樹脂部４０は、枠部１３の上端から素子搭載凸部１２に至る表面が下方（基板部１１）に向けて凹んだ曲面を形成している。すなわち、光散乱材含有樹脂部４０は、すり鉢形状の光反射面を形成している。発光素子２０は、このすり鉢形状の光反射面の底部に配置される。かかる構成により、投光方向前方に向かう光の量を増大させることができ発光効率の向上を図ることができる。光散乱材含有樹脂は、基体１０を分割するスリット１４内にも充填され、分割された基体１０の第１の部分１０ａと第２の部分１０ｂとは、電気的絶縁状態を維持したまま結合される。   The light scattering material-containing resin part 40 forms a curved surface in which the surface from the upper end of the frame part 13 to the element mounting convex part 12 is recessed downward (substrate part 11). That is, the light scattering material-containing resin portion 40 forms a mortar-shaped light reflecting surface. The light emitting element 20 is disposed at the bottom of the mortar-shaped light reflecting surface. With this configuration, the amount of light traveling forward in the light projecting direction can be increased, and the light emission efficiency can be improved. The light-scattering material-containing resin is also filled in the slits 14 that divide the base 10, and the first portion 10 a and the second portion 10 b of the divided base 10 are combined while maintaining an electrically insulating state. The

封止樹脂部５０は、シリコーン樹脂等の光透過性樹脂からなり、枠部１３によって形成される側壁の内側を充填するように形成される。封止樹脂部５０は、蛍光体含有樹脂部３０で覆われた発光素子２０および光散乱材含有樹脂部４０の表面を覆い、発光素子２０およびボンディングワイヤ２２を封止する。封止樹脂部５０は、上面が平坦であり且つ枠部１３の上面と同一面内に延在するように形成される。封止樹脂部５０の上面と素子搭載凸部１２の上面（素子搭載面）との間の距離Ｔ３は例えば０．４ｍｍである。   The sealing resin portion 50 is made of a light transmissive resin such as a silicone resin, and is formed so as to fill the inside of the side wall formed by the frame portion 13. The sealing resin part 50 covers the surfaces of the light emitting element 20 and the light scattering material-containing resin part 40 covered with the phosphor-containing resin part 30 and seals the light emitting element 20 and the bonding wire 22. The sealing resin portion 50 is formed so that the upper surface is flat and extends in the same plane as the upper surface of the frame portion 13. A distance T3 between the upper surface of the sealing resin portion 50 and the upper surface (element mounting surface) of the element mounting convex portion 12 is, for example, 0.4 mm.

図３は、発光素子２０から発せられる熱の放熱性を考慮した素子搭載凸部１２の構成を示す断面図である。図３において、発光素子２０から発せられる熱の拡散範囲を破線で示す。発光素子２０から発せられた熱は、基体１０に向けて概ね斜め４５°の拡がりを持って拡散する。基体１０が光散乱材含有樹脂よりも熱伝導率の高い材料により構成されている場合には、図３に示すように、放熱経路上に光散乱材含有部４０が存在しなくなるように素子搭載凸部１２の支柱部１２ａの幅Ｗ１を設定する。これにより、パッケージの放熱性を向上させることが可能となる。この場合、素子搭載面の拡大に伴って光散乱材含有樹脂部４０の面積が減少することによる光束の低下を考慮する必要がある。   FIG. 3 is a cross-sectional view illustrating a configuration of the element mounting convex portion 12 in consideration of heat dissipation of heat generated from the light emitting element 20. In FIG. 3, the diffusion range of the heat generated from the light emitting element 20 is indicated by a broken line. The heat generated from the light emitting element 20 diffuses toward the base body 10 with an approximately 45 ° spread. When the substrate 10 is made of a material having a higher thermal conductivity than the light scattering material-containing resin, as shown in FIG. 3, the element mounting is performed so that the light scattering material-containing portion 40 does not exist on the heat dissipation path. The width W1 of the column portion 12a of the convex portion 12 is set. Thereby, the heat dissipation of the package can be improved. In this case, it is necessary to consider a decrease in luminous flux due to a decrease in the area of the light scattering material-containing resin portion 40 as the element mounting surface is enlarged.

尚、上記の実施例では、基体１０を構成する基板部１１、素子搭載凸部１２および枠部１３は、一体的な形態を有するものとしたが、これらの各構成部分が別体として形成され、これらを組み合わせることで基体１０を構成することとしてもよい。また、基体１０は、金属の他、アルミナセラミックス、ガラスエポキシ樹脂等の絶縁体により構成されていてもよく、また、各構成部分が互いに異なる材料により構成されていてもよい。基体１０が絶縁体により構成される場合には、基板部１１には、適宜導体配線が形成される。また、上記の実施例では、発光素子２０の上面にｐ電極およびｎ電極を有する発光素子を搭載する場合を例に説明したが、発光素子の下面に一方の電極が形成されるタイプの発光素子を搭載する場合にも適用可能である。   In the above embodiment, the substrate portion 11, the element mounting convex portion 12 and the frame portion 13 constituting the base body 10 have an integral form, but these respective constituent portions are formed as separate bodies. The base 10 may be configured by combining these. Moreover, the base | substrate 10 may be comprised with insulators, such as an alumina ceramics and a glass epoxy resin other than a metal, and each component may be comprised with a mutually different material. When the base 10 is made of an insulator, conductor wiring is appropriately formed on the substrate portion 11. In the above embodiment, the case where the light emitting element having the p electrode and the n electrode is mounted on the upper surface of the light emitting element 20 has been described as an example. However, the light emitting element in which one electrode is formed on the lower surface of the light emitting element. This is also applicable to the case of mounting.

上記した構成を有する発光装置１の製造方法について以下に説明する。図４（ａ）〜（ｃ）および図５（ａ）〜（ｃ）は、発光装置１の製造工程におけるプロセスステップ毎の断面図（上段）および上面図（下段）である。   A method for manufacturing the light-emitting device 1 having the above-described configuration will be described below. FIGS. 4A to 4C and FIGS. 5A to 5C are a cross-sectional view (upper stage) and a top view (lower stage) for each process step in the manufacturing process of the light emitting device 1.

（基体の作製）
発光装置１の外形形状を画定する基体１０を作製する。厚さ１．２〜２ｍｍ程度の純Ａｌ板材又はＣｕ板材を用意する。板材には、適宜Ｎｉめっき等のめっき処理が施される。次に、基板部１１、素子搭載凸部１２、枠部１３およびスリット１４をプレス加工により成型する。その後、エッチングにより素子搭載凸部１２においてオーバハング部１２ａおよび支柱部１２ｂを形成する。基体１０の第１の部分１０ａおよび第２の部分１０ｂは、分離しないようにタイバー６０により結合されている（図４（ａ））。 (Preparation of substrate)
A substrate 10 that defines the outer shape of the light emitting device 1 is produced. A pure Al plate or Cu plate having a thickness of about 1.2 to 2 mm is prepared. The plate material is appropriately subjected to a plating treatment such as Ni plating. Next, the board | substrate part 11, the element mounting convex part 12, the frame part 13, and the slit 14 are shape | molded by press work. Thereafter, the overhang portion 12a and the column portion 12b are formed in the element mounting convex portion 12 by etching. The first portion 10a and the second portion 10b of the base body 10 are coupled by a tie bar 60 so as not to be separated (FIG. 4A).

（発光素子の搭載）
ディスペンス法または印刷法などにより素子搭載凸部１２の上面（素子搭載面）に例えばシリコーン樹脂系のダイアタッチ材を適量塗布する。酸化チタン、アルミナ、ＺｎＯ等の光散乱材を含有した白色のダイアタッチ材又は銀フィラー等を含有した熱伝導性の高いダイアタッチ材が好適である。次に、発光素子２０を素子搭載凸部１２の上面にマウントし、ダイアタッチ材を熱硬化する。尚、発光素子２０の裏面に金めっきを施すことにより共晶接合することも可能である。次に、発光素子２０の上面のｐ電極およびｎ電極と基体１０の第１の部分１０ａと第２の部分１０ｂとをボンディングワイヤ２２で接続する（図４（ｂ））。 (Installation of light emitting element)
An appropriate amount of, for example, a silicone resin die attach material is applied to the upper surface (element mounting surface) of the element mounting convex portion 12 by a dispensing method or a printing method. A white die attach material containing a light scattering material such as titanium oxide, alumina or ZnO or a die attach material having a high thermal conductivity containing a silver filler or the like is suitable. Next, the light emitting element 20 is mounted on the upper surface of the element mounting convex portion 12, and the die attach material is thermally cured. Note that eutectic bonding can be performed by applying gold plating to the back surface of the light emitting element 20. Next, the p-electrode and n-electrode on the upper surface of the light-emitting element 20 are connected to the first portion 10a and the second portion 10b of the substrate 10 with bonding wires 22 (FIG. 4B).

（光散乱材含有樹脂部の形成）
枠部１３により形成される側壁の内側の空間、すなわち、枠部１３によって形成される円形キャビティ内に所定量の光散乱材含有樹脂を充填する。光散乱材含有樹脂は、例えば、シリコーン樹脂等の樹脂材に二酸化チタン（ＴｉＯ２）、酸化亜鉛（ＺｎＯ）、酸化アルミニウム（Ａｌ２Ｏ３）等の光散乱材を分散させた白色の樹脂である。光散乱材含有樹脂は、枠部１３の側壁、基板部１１の上面および素子搭載凸部１２の側面を被覆するように充填される。光散乱材含有樹脂は表面張力により素子搭載凸部１２の支柱部１２ｂの側面を這い上がるが、外側に張り出したオーバハング部１２ａによって這い上がりが堰き止められる。従って、光散乱材含有樹脂の充填量が多少変動した場合でも、光散乱材含有樹脂の這い上がりは、オーバハング部１２ａの下面で遮断され、素子搭載凸部１２の上面まで達しない。 (Formation of light scattering material-containing resin part)
A space inside the side wall formed by the frame portion 13, that is, a circular cavity formed by the frame portion 13 is filled with a predetermined amount of the light scattering material-containing resin. The light scattering material-containing resin is, for example, a white resin in which a light scattering material such as titanium dioxide (TiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ) is dispersed in a resin material such as a silicone resin. is there. The light scattering material-containing resin is filled so as to cover the side wall of the frame portion 13, the upper surface of the substrate portion 11, and the side surface of the element mounting convex portion 12. The light scattering material-containing resin crawls up the side surface of the column portion 12b of the element mounting convex portion 12 due to surface tension, but the crawl-up is blocked by the overhang portion 12a projecting outward. Therefore, even when the filling amount of the light scattering material-containing resin slightly varies, the creeping of the light scattering material-containing resin is blocked by the lower surface of the overhang portion 12a and does not reach the upper surface of the element mounting convex portion 12.

光散乱材含有樹脂は、基体１０を分割するスリット１４内にも充填される。スリット１４からの樹脂漏れ防止のために、基体１０の底面にスリット１４の開口面を塞ぐテフロン治具７０を当接した状態で光散乱材含有樹脂が充填される。その後、熱処理により光散乱材含有樹脂を硬化させ、光散乱材含有樹脂部４０を形成する。   The light scattering material-containing resin is also filled in the slits 14 dividing the base 10. In order to prevent resin leakage from the slit 14, the light scattering material-containing resin is filled in a state in which the bottom surface of the substrate 10 is in contact with the Teflon jig 70 that closes the opening surface of the slit 14. Thereafter, the light scattering material-containing resin is cured by heat treatment to form the light scattering material-containing resin portion 40.

光散乱材含有樹脂部４０は、枠部１３の上端から素子搭載部１２に至る上面が下方（基板部１１）に向けて凹んだすり鉢状の光反射面を形成する。発光素子２０は、すり鉢状の光反射面の底部に配置される。光散乱材含有樹脂部４０は、上端が発光素子２０およびボンディングワイヤ２２のループトップよりも上方に位置するように形成される（図４（ｃ））。   The light scattering material-containing resin portion 40 forms a mortar-shaped light reflecting surface in which the upper surface from the upper end of the frame portion 13 to the element mounting portion 12 is recessed downward (substrate portion 11). The light emitting element 20 is disposed at the bottom of the mortar-shaped light reflecting surface. The light scattering material-containing resin portion 40 is formed such that the upper end is positioned above the light emitting element 20 and the loop top of the bonding wire 22 (FIG. 4C).

（蛍光体含有樹脂部の形成）
液状のシリコーン樹脂にＹＡＧ：Ｃｅ蛍光体を分散させた蛍光体含有樹脂を例えばディスペンス法により発光素子２０の表面に滴下する。蛍光体含有樹脂は、発光素子２０の表面を覆い、素子搭載凸部１２の上面の外縁にまで濡れ拡がる。蛍光体含有樹脂が、素子搭載凸部１２上面の外縁の超えて濡れ拡がらないように作用する表面張力が生じる為、樹脂の滴下のみによって蛍光体含有樹脂部３０の形成範囲および形状が定まる。蛍光体含有樹脂は、素子搭載凸部１２上面によって画定される形成範囲を維持したまま表面張力によって半球ドーム形状を呈する。その後、蛍光体含有樹脂を熱硬化することにより蛍光体含有樹脂部３０を形成する。このように、素子搭載凸部１２を設けることにより発光素子２０の周囲に段差を設け、表面張力を利用することにより、蛍光体含有樹脂部３０の形成範囲および形状をセルフアライン的に定めることができる。従って、個々の装置間における色度ばらつき等を低減することが可能となる。 (Formation of phosphor-containing resin part)
A phosphor-containing resin in which a YAG: Ce phosphor is dispersed in a liquid silicone resin is dropped onto the surface of the light emitting element 20 by, for example, a dispensing method. The phosphor-containing resin covers the surface of the light emitting element 20 and spreads to the outer edge of the upper surface of the element mounting convex portion 12. Since surface tension is generated so that the phosphor-containing resin does not wet and spread beyond the outer edge of the upper surface of the element mounting convex portion 12, the formation range and the shape of the phosphor-containing resin portion 30 are determined only by the dripping of the resin. The phosphor-containing resin exhibits a hemispherical dome shape by surface tension while maintaining the formation range defined by the upper surface of the element mounting convex portion 12. Thereafter, the phosphor-containing resin portion 30 is formed by thermosetting the phosphor-containing resin. As described above, by providing the element mounting convex portion 12, a step is provided around the light emitting element 20, and by using the surface tension, the formation range and shape of the phosphor-containing resin portion 30 can be determined in a self-aligning manner. it can. Therefore, it is possible to reduce chromaticity variation and the like between individual devices.

尚、蛍光体含有樹脂部３０の形状を安定化させるためには、オーバハング部１２ａの上面と側面とが交差する角部が丸みを帯びていないことが望ましい。また、本実施例においては、光散乱材含有樹脂部４０を形成した後に蛍光体含有樹脂部３０を形成しているが、いずれを先に形成しても構わない。   In order to stabilize the shape of the phosphor-containing resin portion 30, it is desirable that the corner portion where the upper surface and the side surface of the overhang portion 12a intersect is not rounded. Further, in this embodiment, the phosphor-containing resin portion 30 is formed after the light scattering material-containing resin portion 40 is formed, but either may be formed first.

素子搭載面は、オーバハング部１２ａを介して一定のクリアランスを保持しつつ光散乱材含有樹脂部４０から隔てられているので、光散乱材含有樹脂部４０と非接触となるように蛍光体含有樹脂部３０を形成することが容易となる。尚、蛍光体含有樹脂部３０をスクリーン印刷法により形成することも可能である。この場合においても蛍光体含有樹脂部３０の形状および形成範囲を安定化させることができる。ただし、スクリーン印刷法においては印刷用マスクを使用する都合上、光散乱材含有樹脂部４０を形成する前に蛍光体含有樹脂の印刷を実施する必要がある（図５（ａ））。   Since the element mounting surface is separated from the light scattering material-containing resin portion 40 while maintaining a certain clearance via the overhang portion 12a, the phosphor-containing resin is not in contact with the light scattering material-containing resin portion 40. It becomes easy to form the portion 30. Note that the phosphor-containing resin portion 30 can be formed by a screen printing method. Even in this case, the shape and formation range of the phosphor-containing resin portion 30 can be stabilized. However, in the screen printing method, for the convenience of using a printing mask, it is necessary to print the phosphor-containing resin before forming the light scattering material-containing resin portion 40 (FIG. 5A).

（封止樹脂部の形成）
枠部１３によって形成される側壁の内側の空間、すなわち、枠部１３によって形成される円形キャビティ内に所定量のシリコーン樹脂等の光透過性樹脂をディスペンス法などにより充填し、これを熱硬化することにより封止樹脂部５０を形成する。封止樹脂部５０は、蛍光体含有樹脂部３０で覆われた発光素子２０および光散乱材含有樹脂部４０の表面を覆い、発光素子２０およびボンディングワイヤ２２を封止する。封止樹脂部５０は、上面が枠部１３の上面と同一面内に延在するように形成される（図５（ｂ））。封止樹脂部５０の上面から素子搭載面までの距離は、０．４ｍｍ以上であることが好ましい。発光素子２０の上部を覆う封止樹脂部５０の被覆厚が薄くなると、ボンディングワイヤ２２や蛍光体含有樹脂部３０が封止樹脂部５０の上面から露出してしまう場合がある。これを防止するために、蛍光体含有樹脂部３０の高さを制限すると、所望の色味を得るために蛍光体の含有率を増加させる必要性が生じる。しかしながら、蛍光体の含有率を増加させると、蛍光体含有樹脂部３０の厚さばらつきに対する色度ばらつきが顕著となり、また、蛍光体含有樹脂の粘度が高くなるため蛍光体含有樹脂部３０の成形が困難となる。従って、封止樹脂部５０の厚さは、発光素子２０の厚さ等を考慮して適宜設定することが好ましい。 (Formation of sealing resin part)
A space inside the side wall formed by the frame portion 13, that is, a circular cavity formed by the frame portion 13 is filled with a predetermined amount of light-transmitting resin such as silicone resin by a dispense method or the like, and is thermally cured. Thus, the sealing resin portion 50 is formed. The sealing resin part 50 covers the surfaces of the light emitting element 20 and the light scattering material-containing resin part 40 covered with the phosphor-containing resin part 30 and seals the light emitting element 20 and the bonding wire 22. The sealing resin part 50 is formed so that the upper surface extends in the same plane as the upper surface of the frame part 13 (FIG. 5B). The distance from the top surface of the sealing resin portion 50 to the element mounting surface is preferably 0.4 mm or more. When the coating thickness of the sealing resin portion 50 covering the upper part of the light emitting element 20 is reduced, the bonding wire 22 and the phosphor-containing resin portion 30 may be exposed from the upper surface of the sealing resin portion 50. In order to prevent this, if the height of the phosphor-containing resin portion 30 is limited, it is necessary to increase the phosphor content to obtain a desired color. However, when the phosphor content is increased, the chromaticity variation with respect to the thickness variation of the phosphor-containing resin portion 30 becomes significant, and the viscosity of the phosphor-containing resin increases, so that the phosphor-containing resin portion 30 is molded. It becomes difficult. Therefore, the thickness of the sealing resin portion 50 is preferably set as appropriate in consideration of the thickness of the light emitting element 20 and the like.

（パッケージ分離工程）
ダイシングによりタイバー６０を基本１０から切り離し、発光装置１を個片化する。基体１０にタイバー６０の分割ラインに沿って予めダイシング溝を形成しておくことが望ましい。これにより、作業時間を短縮することができるとともにダイシング時の飛沫による樹脂へのダメージを低減することができる。以上の各工程を経ることにより、発光装置１が完成する（図５（ｃ））。発光装置１は、裏面が実装面となっており、はんだ付け等によりプリント基板等に実装される。 (Package separation process)
The tie bar 60 is separated from the base 10 by dicing, and the light emitting device 1 is separated into pieces. It is desirable to form dicing grooves in the base 10 along the dividing lines of the tie bars 60 in advance. Thereby, work time can be shortened and damage to the resin due to splashes during dicing can be reduced. The light emitting device 1 is completed through the above steps (FIG. 5C). The light emitting device 1 has a back surface as a mounting surface, and is mounted on a printed circuit board or the like by soldering or the like.

上記した実施例においては、図１（ｂ）に示すように、オーバハング部１２ａおよび支柱部１２ｂからなる素子搭載凸部１２の断面形状を略Ｔ字型としたが、これに限定されるものではない。図６（ａ）〜（ｄ）に素子搭載凸部１２における軒構造（又は庇構造）のバリエーションを示す。図６（ａ）〜（ｄ）は、素子搭載凸部１２の他の構成を示したものであり、図１（ｂ）に示す断面と同一の断面を示している。図６（ａ）〜（ｄ）において、オーバハング部１２ａの上面と側面とのなす角をＡ、オーバハング部１２ａの側面と下面とのなす角をＢ、オーバハング部１２ａの下面と支柱部１２ｂの側面とのなす角をＣと表示している。   In the above-described embodiment, as shown in FIG. 1B, the cross-sectional shape of the element mounting convex portion 12 including the overhang portion 12a and the column portion 12b is substantially T-shaped. However, the present invention is not limited to this. Absent. 6A to 6D show variations of the eaves structure (or the ridge structure) in the element mounting convex portion 12. FIGS. 6A to 6D show other configurations of the element mounting convex portion 12 and show the same cross section as the cross section shown in FIG. 6A to 6D, the angle between the upper surface and the side surface of the overhang portion 12a is A, the angle between the side surface and the lower surface of the overhang portion 12a is B, the lower surface of the overhang portion 12a and the side surface of the support column 12b. The angle formed by C is indicated as C.

オーバハング部１２ａの上面と側面とのなす角Ａは、６０°以上１００°以下であることが好ましい。角Ａを９０°以上とすることは、プレス加工においてプレスが抜き易く製造が容易となる点で好ましい。一方、角Ａを１００°以上とすると蛍光体含有樹脂の表面張力が低下して、半球ドーム形状を維持することが困難となる。また、角Ａを９０°以下とすることは、蛍光体含有樹脂の形状維持に有効となる。一方、角Ａを６０°以下とするとオーバハング部１２ａを形成するたのエッチングに時間を要し、また、強度が低下する。   The angle A formed by the upper surface and the side surface of the overhang portion 12a is preferably 60 ° or more and 100 ° or less. Setting the angle A to 90 ° or more is preferable in that the press can be easily pulled in the press working and the manufacture is easy. On the other hand, if the angle A is 100 ° or more, the surface tension of the phosphor-containing resin is lowered, and it becomes difficult to maintain the hemispherical dome shape. Further, setting the angle A to 90 ° or less is effective for maintaining the shape of the phosphor-containing resin. On the other hand, if the angle A is 60 ° or less, it takes time to form the overhang portion 12a, and the strength decreases.

オーバハング１２ａの側面と下面とのなす角Ｂは、６０°以上１５０°以下であることが好ましい。角Ｂの大きさが小さい程、光散乱材含有樹脂の這い上がりを抑制する効果が高いものと考えられる。角Ｂを１５０°以下とすることで光散乱材含有樹脂の這い上がり抑制効果を十分に発揮させることが可能となる。一方、角Ｂを６０°以下とするとオーバハング部１２ａを形成するたのエッチングに時間を要し、また、強度が低下する。   The angle B formed between the side surface and the lower surface of the overhang 12a is preferably 60 ° or more and 150 ° or less. It is considered that the smaller the size of the corner B, the higher the effect of suppressing the creeping of the light scattering material-containing resin. By setting the angle B to 150 ° or less, it becomes possible to sufficiently exhibit the creeping-up suppressing effect of the light scattering material-containing resin. On the other hand, if the angle B is 60 ° or less, it takes time to form the overhang portion 12a, and the strength is reduced.

オーバハング部１２ａの下面と支柱部１２ｂの側面とのなす角Ｃの好ましい範囲は、上記した角Ａと角Ｂの好ましい範囲から導かれる。すなわち、角Ａが上記した好ましい範囲の最大値（１００°）をとり且つ角Ｂが上記した好ましい範囲の最大値（１５０°）をとる場合、角Ｃは１６０°となり、この角度が角Ｃの最大値となる。一方、角Ａが上記した好ましい範囲の最小値（６０°）をとり且つ角Ｂが上記した好ましい範囲の最小値（６０°）をとる場合、角Ｃは３０°となり、この角度が角Ｃの最小値となる。   A preferable range of the angle C formed by the lower surface of the overhang portion 12a and the side surface of the support column portion 12b is derived from the preferable ranges of the corner A and the angle B described above. That is, when the angle A takes the maximum value (100 °) of the above preferred range and the angle B takes the maximum value (150 °) of the above preferred range, the angle C is 160 °, and this angle is the angle C Maximum value. On the other hand, when the angle A takes the minimum value (60 °) of the above preferred range and the angle B takes the minimum value (60 °) of the above preferred range, the angle C is 30 °, and this angle is the angle C Minimum value.

図１および図６（ｃ）に示すように、角Ｂおよび角Ｃが共に９０°以下となる構造とすることにより、オーバハング部１２ａの下面と支柱部１２ｂの側面との間の空間に光散乱材含有樹脂が充填されやすくなるため、光散乱材含有樹脂の這い上がりを抑制する効果が高くなる。一方、図１、図６（ｂ）および図６（ｄ）に示すように、角Ａおよび角Ｃが９０°以上となる構造とすることにより、オーバハング部１２ａの加工が容易となる。   As shown in FIG. 1 and FIG. 6C, light is scattered in the space between the lower surface of the overhang portion 12a and the side surface of the column portion 12b by adopting a structure in which both the corner B and the corner C are 90 ° or less. Since the material-containing resin is easily filled, the effect of suppressing the creeping of the light scattering material-containing resin is enhanced. On the other hand, as shown in FIG. 1, FIG. 6B and FIG. 6D, the overhang portion 12a can be easily processed by adopting a structure in which the angle A and the angle C are 90 ° or more.

また、図７に示すように、オーバハング部１２ａおよび支柱部１２ｂの形状を円柱形状としてもよい。すなわち、素子搭載凸部１２の上面形状は円形となり、オーバハング部１２ａの側面は曲面となる。かかる構成とすることにより、光散乱材含有脂の這い上がり抑制効果をさらに向上させる効果が期待できる。   Moreover, as shown in FIG. 7, it is good also considering the shape of the overhang part 12a and the support | pillar part 12b as a column shape. That is, the upper surface shape of the element mounting convex portion 12 is circular, and the side surface of the overhang portion 12a is a curved surface. By setting it as this structure, the effect which further improves the creeping-up suppression effect of light-scattering material containing fat can be anticipated.

上記したいずれの構成もオーバハング部１２ａの下面が光散乱材含有樹脂の這い上がりを堰き止める軒構造（又は庇構造）を有し、製造工程において蛍光体含有樹脂部３０と光散乱材含有樹脂部４０との非接触状態を維持することが容易となる。   In any of the above-described configurations, the lower surface of the overhang portion 12a has an eaves structure (or a ridge structure) that dams up the light scattering material-containing resin, and the phosphor-containing resin portion 30 and the light scattering material-containing resin portion in the manufacturing process. It becomes easy to maintain a non-contact state with 40.

本発明の実施例に係る発光装置１を面状光源装置に応用した場合の構成例を図８（ａ）および（ｂ）に示す。図８（ａ）は、本発明の実施例に係る面状光源装置２の構成を示す平面図、図８（ｂ）は図８（ａ）における８ｂ−８ｂ線に沿った断面図である。   8A and 8B show a configuration example when the light emitting device 1 according to the embodiment of the present invention is applied to a planar light source device. FIG. 8A is a plan view showing the configuration of the planar light source device 2 according to the embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along the line 8b-8b in FIG. 8A.

面状光源装置２は、発光装置１を行方向および列方向に配列することにより構成される。複数の発光素子２０を搭載するために、基板部１１の表面に複数の素子搭載凸部１２が例えば等間隔で形成されている。枠部１３は、複数の円形キャビティを形成し、素子搭載凸部１２は、それぞれ円形キャビティの中央に配置される。基体１０を構成する基板部１１、複数の素子搭載凸部１２および複数の円形キャビティを形成する枠部１３は、一体的な形態を有するものであってもよく、またこれらの各構成部分が別体として形成され、これらを組み合わせることで基体を構成することとしてもよい。   The planar light source device 2 is configured by arranging the light emitting devices 1 in the row direction and the column direction. In order to mount a plurality of light emitting elements 20, a plurality of element mounting convex portions 12 are formed on the surface of the substrate portion 11 at regular intervals, for example. The frame portion 13 forms a plurality of circular cavities, and the element mounting convex portions 12 are respectively arranged at the centers of the circular cavities. The substrate part 11 constituting the base body 10, the plurality of element mounting convex parts 12 and the frame part 13 forming the plurality of circular cavities may have an integral form, and each of these constituent parts is different. It is good also as forming a base | substrate by forming as a body and combining these.

面状光源２は、素子搭載凸部２０の各々の上面に発光素子２０を搭載し、各キャビティ内に光散乱材含有樹脂を充填し、素子搭載凸部１２の上面において発光素子２０を埋設するように蛍光体含有樹脂を塗布し、これらの樹脂を硬化させることにより光散乱材含有樹脂部４０および蛍光体含有樹脂部３０を形成した後、封止樹脂部５０によって発光素子２０およびボンディングワイヤ２２を封止することにより製造される。尚、図８（ａ）において破線で示す領域を切り取って線状光源装置を製造することも可能である。   In the planar light source 2, the light emitting element 20 is mounted on each upper surface of the element mounting convex portion 20, a light scattering material-containing resin is filled in each cavity, and the light emitting element 20 is embedded on the upper surface of the element mounting convex portion 12. After the phosphor-containing resin is applied and the resin is cured to form the light scattering material-containing resin portion 40 and the phosphor-containing resin portion 30, the light-emitting element 20 and the bonding wire 22 are formed by the sealing resin portion 50. It is manufactured by sealing. In addition, it is also possible to manufacture a linear light source device by cutting a region indicated by a broken line in FIG.

以上の説明から明らかなように、本発明の実施例に係る発光装置およびその製造方法によれば、素子搭載凸部１２は、支柱部１２ｂに対してオーバハング部１２ａが外側に張り出した軒構造（又は庇構造）を有するので、蛍光体含有樹脂部３０を形成した後に光散乱材含有樹を充填する場合にあっては、光散乱材含有樹脂の充填量が多少変動した場合であっても、オーバハング部１２ａの下面において樹脂の這い上がりを堰き止めることができる。従って、発光素子２０および蛍光体含有樹脂部３０を含む発光部と光散乱材含有樹脂部４０との非接触状態が維持される。これにより、発光部への光散乱材含有樹脂の付着に伴う光束の低下を防止することができる。一方、光散乱材含有樹脂部４０を形成した後に蛍光体含有樹脂部３０を形成する場合にあっては、軒構造（又は庇構造）によって素子搭載面と光散乱材含有樹脂部４０とのクリアランスが確保されているので、表面張力を利用した蛍光体含有樹脂部３０の成形を安定的に行うことが可能となる。また、蛍光体含有樹脂部３０は、光散乱材含有樹脂部４０から隔てられた素子搭載凸部１２の上面に形成されるので、光散乱材含有樹脂の充填量の変動によって発光素子２０を覆う蛍光体含有樹脂部３０の被覆厚が変動することはなく、発光色の色度ばらつきを防止することができる。   As is apparent from the above description, according to the light emitting device and the manufacturing method thereof according to the embodiment of the present invention, the element mounting convex portion 12 has an eave structure in which the overhang portion 12a projects outward from the support portion 12b. Or a bag structure), when filling the light-scattering material-containing tree after forming the phosphor-containing resin portion 30, even if the filling amount of the light-scattering material-containing resin is slightly changed, Resin scooping can be blocked on the lower surface of the overhang portion 12a. Therefore, the non-contact state of the light emitting part including the light emitting element 20 and the phosphor-containing resin part 30 and the light scattering material-containing resin part 40 is maintained. Thereby, the fall of the light beam accompanying adhesion of the light-scattering material containing resin to a light emission part can be prevented. On the other hand, in the case where the phosphor-containing resin portion 30 is formed after the light scattering material-containing resin portion 40 is formed, the clearance between the element mounting surface and the light scattering material-containing resin portion 40 by the eaves structure (or the saddle structure). Therefore, the phosphor-containing resin portion 30 utilizing the surface tension can be stably molded. In addition, since the phosphor-containing resin portion 30 is formed on the upper surface of the element mounting convex portion 12 separated from the light scattering material-containing resin portion 40, the phosphor-containing resin portion 30 covers the light emitting element 20 due to variation in the filling amount of the light scattering material-containing resin. The coating thickness of the phosphor-containing resin part 30 does not vary, and the chromaticity variation of the emission color can be prevented.

素子搭載凸部が上記実施例の如き軒構造（又は庇構造）を有していない発光装置においては、以下のような問題が生じることが考えられる。すなわち、蛍光体含有樹脂部３０を形成した後に光散乱材含有樹材を充填する場合にあっては、充填量が僅かでも増加すると光散乱材含有樹脂が素子搭載凸部１２の上面の高さまで這い上がり、蛍光体含有樹脂部３０と光散乱材含有樹脂部４０とが接触し、その結果、光束が低下する。一方、光散乱材含有樹脂部４０を形成した後に蛍光体含有樹脂部３０を形成する場合にあっては、素子搭載面と光散乱材含有樹脂部４０とのクリアランスの制御が困難となり、素子搭載面と光散乱材含有樹脂部４０の表面とが連続面を形成しやすくなる。この場合、表面張力を利用した蛍光体含有樹脂部３０の成形が困難となる。すなわち、液状の蛍光体含有樹脂は素子搭凸部１２の上面の外縁を超えて光散乱材含有樹脂部４０の表面まで濡れ拡がりやすくなり、蛍光体含有樹脂部３０を所望の形状とすることができず、色むらの原因となる。上記の問題は、樹脂量の管理によって解決することは困難である。本発明の実施例に係る発光装置およびその製造方法によれば、蛍光体含有樹脂部３０および光散乱材含有樹脂部４０のいずれを先に形成する場合であっても、上記の問題を解消することができる。   In the light emitting device in which the element mounting convex portion does not have the eave structure (or the eaves structure) as in the above embodiment, the following problems may occur. That is, in the case where the light scattering material-containing tree material is filled after the phosphor-containing resin portion 30 is formed, the light scattering material-containing resin reaches the height of the upper surface of the element mounting convex portion 12 when the filling amount increases even slightly. Ascending, the phosphor-containing resin part 30 and the light scattering material-containing resin part 40 come into contact with each other, and as a result, the luminous flux decreases. On the other hand, in the case where the phosphor-containing resin portion 30 is formed after the light scattering material-containing resin portion 40 is formed, it becomes difficult to control the clearance between the element mounting surface and the light scattering material-containing resin portion 40, and the device mounting is performed. It becomes easy for the surface and the surface of the light scattering material-containing resin portion 40 to form a continuous surface. In this case, it becomes difficult to mold the phosphor-containing resin portion 30 using the surface tension. That is, the liquid phosphor-containing resin easily spreads over the outer edge of the upper surface of the element mounting convex portion 12 to the surface of the light scattering material-containing resin portion 40, so that the phosphor-containing resin portion 30 has a desired shape. This is not possible and causes color unevenness. The above problem is difficult to solve by managing the amount of resin. According to the light emitting device and the manufacturing method thereof according to the embodiment of the present invention, the above-described problem can be solved even when either the phosphor-containing resin portion 30 or the light scattering material-containing resin portion 40 is formed first. be able to.

Claims (6)

基板と、
前記基板の上面に設けられて前記基板の上面と交差する方向に突出した素子搭載凸部と、
前記素子搭載凸部の上面に搭載された発光素子と、
前記素子搭載凸部の上面において前記発光素子を被覆する蛍光体含有樹脂部と、
前記基板の上面および前記素子搭載凸部の側面を覆う光散乱材含有樹脂部と、を有し、
前記素子搭載凸部は、上面を含む上部が前記基板に接続される下部に対して張り出しているオーバハング部を有し、
前記蛍光体含有樹脂部と前記光散乱材含有樹脂部とは、前記オーバハング部を介して互いに隔てられていることを特徴とする発光装置。 A substrate,
An element mounting protrusion provided on the upper surface of the substrate and protruding in a direction intersecting the upper surface of the substrate;
A light emitting element mounted on the upper surface of the element mounting convex portion;
A phosphor-containing resin part that covers the light emitting element on the upper surface of the element mounting convex part;
A light scattering material-containing resin portion covering the upper surface of the substrate and the side surface of the element mounting convex portion,
The element mounting convex portion has an overhang portion in which an upper portion including an upper surface protrudes from a lower portion connected to the substrate,
The phosphor-containing resin portion and the light scattering material-containing resin portion are separated from each other via the overhang portion. 前記蛍光体含有樹脂部は、前記素子搭載凸部の上面の外縁まで延在していることを特徴とする請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the phosphor-containing resin portion extends to an outer edge of an upper surface of the element mounting convex portion. 前記素子搭載凸部を囲む側壁を形成する枠部を更に有し、
前記光散乱材含有樹脂部は、前記側壁と前記素子搭載凸部との間に充填されていることを特徴とする請求項１又は２に記載の発光装置。 It further has a frame part forming a side wall surrounding the element mounting convex part,
The light-emitting device according to claim 1, wherein the light scattering material-containing resin portion is filled between the side wall and the element mounting convex portion. 前記光散乱材含有樹脂部は、前記枠部の上端から前記素子搭載凸部に至る表面が前記基板側に向けて凹んだ曲面であることを特徴とする請求項１乃至３のいずれか１つに記載の発光装置。   4. The light scattering material-containing resin portion is a curved surface in which a surface from an upper end of the frame portion to the element mounting convex portion is recessed toward the substrate side. 5. The light emitting device according to 1. 基板と、前記基板の上面に設けられて前記基板の上面と交差する方向に突出した素子搭載凸部と、を有する基体を用意する工程と、
前記素子搭載凸部の上面に発光素子を搭載する工程と、
前記素子搭載凸部の上面において前記発光素子を蛍光体含有樹脂で被覆する工程と、
前記基板の上面および前記素子搭載凸部の側面を覆うように光散乱材含有樹脂を充填する工程と、を含み、
前記素子搭載凸部は、上面を含む上部が前記基板に接続される下部に対して張り出しているオーバハング部を有し、
前記素子搭載凸部の側面を覆う光散乱材含有樹脂は、前記オーバハング部を介して前記素子搭載凸部の上面から隔てられていることを特徴とする発光装置の製造方法。 Preparing a substrate having a substrate and an element mounting protrusion provided on the upper surface of the substrate and protruding in a direction intersecting the upper surface of the substrate;
Mounting a light emitting element on the upper surface of the element mounting convex portion;
Coating the light emitting element with a phosphor-containing resin on the upper surface of the element mounting convex portion;
Filling the light scattering material-containing resin so as to cover the upper surface of the substrate and the side surface of the element mounting convex portion,
The element mounting convex portion has an overhang portion in which an upper portion including an upper surface protrudes from a lower portion connected to the substrate,
The method for manufacturing a light-emitting device, wherein the light-scattering material-containing resin covering the side surface of the element mounting convex portion is separated from the upper surface of the element mounting convex portion via the overhang portion. 前記蛍光体含有樹脂で被覆する工程は、前記発光素子を埋設し且つ前記素子搭載凸部の外縁まで濡れ拡がるように液状の蛍光体含有樹脂を塗布する工程を含むことを特徴とする請求項５に記載の製造方法。   6. The step of coating with the phosphor-containing resin includes a step of applying a liquid phosphor-containing resin so as to embed the light-emitting element and to spread to the outer edge of the element mounting convex portion. The manufacturing method as described in.
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