JPH05299701A - Line illumination unit - Google Patents
Line illumination unitInfo
- Publication number
- JPH05299701A JPH05299701A JP9794492A JP9794492A JPH05299701A JP H05299701 A JPH05299701 A JP H05299701A JP 9794492 A JP9794492 A JP 9794492A JP 9794492 A JP9794492 A JP 9794492A JP H05299701 A JPH05299701 A JP H05299701A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- concave
- concave reflecting
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 title abstract description 11
- 239000002184 metal Substances 0.000 abstract description 2
- 238000009827 uniform distribution Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Light Sources And Details Of Projection-Printing Devices (AREA)
- Facsimile Scanning Arrangements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、線状の領域を任意の
照度で照明するライン照明ユニットに関するものであ
り、さらに詳しくは、ファクシミリ、イメージスキャ
ナ、バーコードリーダなどの光学式像読み取り装置にお
ける読み取り原稿照明用や、複写機、光プリンタなどの
電子式写真装置におけるドラム除電用などに使用される
ライン照明ユニットに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a line illumination unit that illuminates a linear area with an arbitrary illuminance, and more specifically, it relates to an optical image reading apparatus such as a facsimile, an image scanner or a bar code reader. The present invention relates to a line illumination unit used for illuminating a read document, and for removing static electricity from a drum in an electrophotographic apparatus such as a copying machine or an optical printer.
【０００２】[0002]
【従来の技術】従来、ファクシミリ、イメージスキャナ
などにおける読み取り原稿照明用に用いられるライン照
明ユニットとして、図１１〜図１３に示すようなものが
知られている。すなわち、そのライン照明ユニットにあ
っては、読み取り原稿サイズに合わせた長さの紙エポキ
シ製プリント配線基板１１上に、等間隔ピッチで長手方
向（Ｘ−Ｘ′方向）へ一直線状に、表面実装型発光ダイ
オード１２が多数並べられて配置されている。これらの
発光ダイオード１２は、基板１１に、ハンダ付けによっ
て電気的に接続されるとともに固定されている。2. Description of the Related Art Conventionally, as shown in FIGS. 11 to 13, there are known line illumination units used for illuminating read originals in facsimiles, image scanners and the like. That is, in the line illumination unit, the surface mounting is performed on the printed wiring board 11 made of paper epoxy having a length corresponding to the size of the original to be read, in a straight line in the longitudinal direction (XX 'direction) at equal pitches. Many type light emitting diodes 12 are arranged side by side. These light emitting diodes 12 are electrically connected and fixed to the substrate 11 by soldering.
【０００３】Ｂ４サイズ原稿用のライン光源の場合（長
さ２５３mm）、５０個前後の発光ダイオード１２が使用
されている。これらの発光ダイオード１２が実装された
基板１１の上方には、プラスチック製の集光用シリンド
リカルレンズ１３が設置されている。シリンドリカルレ
ンズ１３は、基板１１に対して所定距離をおいて位置す
るように、基板１１を保持するためのフレーム１４と一
体に形成されている。そして、図１１に示すように、各
発光ダイオード１２から発せられた光をライン光源の長
手方向に対して直角の方向（Ｚ−Ｚ′方向）に集光す
る。なお、図１１〜図１３において、１５は照明対象
面、１６は負荷抵抗素子である。また、１７は電気コネ
クタ、１８はリード線、１９は配線パターンである。In the case of a line light source for a B4 size document (length: 253 mm), about 50 light emitting diodes 12 are used. Above the substrate 11 on which the light emitting diodes 12 are mounted, a plastic condensing cylindrical lens 13 is installed. The cylindrical lens 13 is formed integrally with a frame 14 for holding the substrate 11 so as to be positioned at a predetermined distance from the substrate 11. Then, as shown in FIG. 11, the light emitted from each light emitting diode 12 is condensed in a direction (Z-Z 'direction) perpendicular to the longitudinal direction of the line light source. 11 to 13, reference numeral 15 is an illumination target surface, and 16 is a load resistance element. Further, 17 is an electrical connector, 18 is a lead wire, and 19 is a wiring pattern.
【０００４】[0004]
【発明が解決しようとする課題】上記のようなライン照
明ユニットにあっては、以下に説明するように、光の利
用効率が悪いという問題がある。すなわち、発光ダイオ
ード１２の正面方向へ発せられた光のうち、シリンドリ
カルレンズ１３へ到達しない光やシリンドリカルレンズ
１３へその開口角以上の角度で入射する光は、有効に利
用されていない。これらの場合、光の利用効率は、せい
ぜい１０数パーセント程度に過ぎない。The line lighting unit as described above has a problem that the light utilization efficiency is poor, as will be described below. That is, of the light emitted in the front direction of the light emitting diode 12, the light that does not reach the cylindrical lens 13 or the light that enters the cylindrical lens 13 at an angle equal to or larger than its opening angle is not effectively used. In these cases, the utilization efficiency of light is no more than about ten percent.
【０００５】また、発光ダイオード１２の光出射方向の
前方に設置されるシリンドリカルレンズ１３としては、
通常、発光ダイオード１２の実装されていない部分（隣
接する発光ダイオード１２どうしの間）の直下における
照度低下（以下、「光リップル」という）を少なくする
目的で、光の散乱効果を有する乳白色レンズが用いられ
ている。このことも、光源から発せられた光の利用効率
が低下する要因の１つとなっている。Further, as the cylindrical lens 13 installed in front of the light emitting direction of the light emitting diode 12,
In general, a milky white lens having a light scattering effect is used for the purpose of reducing a decrease in illuminance (hereinafter, referred to as “light ripple”) immediately below a portion where the light emitting diode 12 is not mounted (between adjacent light emitting diodes 12). It is used. This is also one of the factors that reduce the utilization efficiency of the light emitted from the light source.
【０００６】以上のように、従来のライン照明ユニット
は、光の利用効率が悪く、また、光リップルにより出射
光の強度が不均一になるという問題があった。As described above, the conventional line illumination unit has a problem that the utilization efficiency of light is poor and the intensity of emitted light becomes non-uniform due to light ripple.
【０００７】[0007]
【課題を解決するための手段】この発明は、発光素子
と、この発光素子から発せられた光を所定方向へ反射さ
せるための凹面反射鏡と、その発光素子およびその凹面
反射鏡を収納しかつその発光素子から発せられた光をそ
の凹面反射鏡により反射させて外部へ導くケースとを有
してなる光源体を複数個備え、これら複数個の光源体が
線状に配設されてなるライン照明ユニットである。SUMMARY OF THE INVENTION The present invention contains a light emitting element, a concave reflecting mirror for reflecting light emitted from the light emitting element in a predetermined direction, the light emitting element and the concave reflecting mirror. A line comprising a plurality of light source bodies having a case in which light emitted from the light emitting element is reflected by the concave reflecting mirror and guided to the outside, and the plurality of light source bodies are linearly arranged. It is a lighting unit.
【０００８】すなわち、この発明の要旨は、発光素子
（発光チップ）と、凹面反射鏡と、これらのケースとを
有してなる光源体を複数個、線状に配設し、発光素子か
ら発せられた光を凹面反射鏡により反射させてケース外
部へ取り出すことにより所定の線状領域を均一に照明す
るように、光学系を改善したことにある。That is, the gist of the present invention is to arrange a plurality of light source bodies each having a light emitting element (light emitting chip), a concave reflecting mirror, and these cases in a line, and emit the light from the light emitting element. It is an improvement of the optical system so that a predetermined linear region can be uniformly illuminated by reflecting the reflected light by a concave reflecting mirror to the outside of the case.
【０００９】ここで、複数個の光源体は、それらの凹面
反射鏡がいずれも上記所定方向を向いて縦に並んだ状態
に配設してもよく、それらの凹面反射鏡がいずれも上記
所定方向を向いて横に並んだ状態に配設してもよい。ま
た、１つの光源体には、発光素子および凹面反射鏡が、
１つずつ備えられていてもよく、数個ずつ備えられてい
てもよい。さらに、複数個の光源体は、直線状に配設し
てもよく、曲線状に配設してもよい。Here, the plurality of light source bodies may be arranged such that their concave reflecting mirrors are vertically aligned so as to face the above predetermined direction. You may arrange | position in the state which has faced the direction and was lined up side by side. In addition, one light source has a light emitting element and a concave reflecting mirror.
One may be provided, or several may be provided. Further, the plurality of light source bodies may be arranged linearly or in a curved shape.
【００１０】この発明において、好ましくは、複数個の
光源体を、それらの凹面反射鏡がいずれも上記所定方向
を向いて縦に並んだ状態に配設し、発光素子を、それら
の凹面反射鏡の裏側の面にそれぞれ設ける。そして、縦
に並んだ１の凹面反射鏡の裏側における発光素子から、
対象とする後ろの凹面反射鏡に光を照射する、という繰
り返し構造を採ることにより、前記問題点を改善する。In the present invention, preferably, a plurality of light source units are arranged such that their concave reflecting mirrors are all vertically aligned so as to face the above-mentioned predetermined direction, and the light emitting elements are arranged with their concave reflecting mirrors. It is provided on the back side of each. Then, from the light emitting elements on the back side of the one concave reflecting mirrors arranged vertically,
The above problem is solved by adopting a repeating structure in which the rear concave reflecting mirror of interest is irradiated with light.
【００１１】[0011]
【作用】発光素子と、凹面反射鏡と、これらのケースと
を有してなる光源体を複数個、線状に配設し、発光素子
から発せられた光を凹面反射鏡により反射させてケース
外部へ取り出すことにより、所定方向に進行する平行光
で線状（直線状または曲線状）領域を照明することがで
きる。A plurality of light source bodies each having a light emitting element, a concave reflecting mirror and these cases are linearly arranged, and light emitted from the light emitting element is reflected by the concave reflecting mirror to form a case. By taking out to the outside, it is possible to illuminate a linear (straight or curved) region with parallel light traveling in a predetermined direction.
【００１２】さらに、複数個の光源体を、それらの凹面
反射鏡がいずれも上記所定方向を向いて縦に並んだ状態
に配設し、発光素子を、それらの凹面反射鏡の裏側の面
にそれぞれ設けた場合は、それぞれの発光素子から対象
とする凹面反射鏡に光を照射して平行光を取り出すこと
ができる。したがって、取り出される平行光は、発光素
子の存在により進路を妨げられることがない。Further, a plurality of light source bodies are arranged such that their concave reflecting mirrors are all arranged vertically in the predetermined direction, and the light emitting elements are arranged on the back surface of the concave reflecting mirrors. When each is provided, parallel light can be extracted by irradiating the target concave reflecting mirror from each light emitting element. Therefore, the extracted parallel light is not obstructed by the presence of the light emitting element.
【００１３】以上のように、線状領域を平行光でかつ均
一な照度分布をもって照明することができ、光の利用効
率を高くすることができる。したがって、従来、約５０
個使用されていた発光素子（チップ）を２５個程度に大
幅節減することができ、省電力化も同時に達成できる。As described above, it is possible to illuminate the linear region with parallel light and with a uniform illuminance distribution, and it is possible to improve the light utilization efficiency. Therefore, conventionally, about 50
The number of light emitting elements (chips) used individually can be significantly reduced to about 25, and power saving can be achieved at the same time.
【００１４】[0014]
【実施例】以下、この発明の２つの実施例について図面
を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Two embodiments of the present invention will be described below with reference to the drawings.
【００１５】実施例１ 図１は実施例１のライン照明ユニットにおける光源体の
外観を示す斜視図であり、図２はその内部構造の概略を
示す斜視図である。また、図３は図１におけるＸ−Ｚ平
面内の概略を示す構成説明図である。Embodiment 1 FIG. 1 is a perspective view showing the appearance of a light source unit in a line illumination unit of Embodiment 1, and FIG. 2 is a perspective view showing the outline of its internal structure. Further, FIG. 3 is a structural explanatory view showing an outline in the XZ plane in FIG.
【００１６】図３においてａは、光源となる発光素子
（発光チップ）としての発光ダイオードを示す。この発
光ダイオードａは、図４および図５に示されるように、
金属メッキした凹面鏡（ａ−４）の上に、ＧａＰからな
る発光ダイオードチップ（発光波長５６５nm）（ａ−
５）を搭載し、光出射方向の面上に、外部からの電力を
供給するための２つの電極（ａ−１）（ａ−２）を有し
てなる。発光ダイオードチップ（ａ−５）と一方の電極
（ａ−２）とは、ワイヤ（ａ−３）により接続されてい
る。このような発光ダイオードａは、凹面反射鏡として
の凹面反射板４の裏面に１つずつ実装されている。In FIG. 3, a shows a light emitting diode as a light emitting element (light emitting chip) serving as a light source. This light emitting diode a is, as shown in FIGS. 4 and 5,
On the metal-plated concave mirror (a-4), a light emitting diode chip made of GaP (emission wavelength 565 nm) (a-
5) is mounted, and two electrodes (a-1) and (a-2) for supplying electric power from the outside are provided on the surface in the light emission direction. The light emitting diode chip (a-5) and one electrode (a-2) are connected by a wire (a-3). One such light emitting diode a is mounted on the back surface of the concave reflecting plate 4 as a concave reflecting mirror.
【００１７】図１〜図３に示すライン照明ユニットにお
ける光源体は、縦１列に同じ方向を向いて配設されかつ
凹面に金属メッキを施した５枚の凹面反射板４と、これ
らの凹面反射板４を収納して支持する細長い箱状のケー
スとしての１つのパッケージ３と、光出射面に位置する
透光性天板１とから主として構成されている。パッケー
ジ３の両側面には配線パターン２がそれぞれ設けられて
いる。これにより、パッケージ３内部の発光ダイオード
ａに電力を供給する。なお、図２および図３において、
５は、縦１列に並んだ発光ダイオードａのうち一番前の
ものを所定位置に支持するための支持板である。The light source unit in the line lighting unit shown in FIGS. 1 to 3 is provided with five concave reflecting plates 4 arranged in one column in the same direction and having the concave surfaces plated with metal, and these concave surfaces. It is mainly configured by one package 3 as an elongated box-shaped case that houses and supports the reflection plate 4, and the translucent top plate 1 located on the light emission surface. The wiring patterns 2 are provided on both side surfaces of the package 3, respectively. As a result, power is supplied to the light emitting diode a inside the package 3. In addition, in FIG. 2 and FIG.
Reference numeral 5 denotes a support plate for supporting the frontmost one of the light emitting diodes a arranged in a line in the vertical direction at a predetermined position.
【００１８】このような光源体を複数個、たとえば５
個、縦１列に配設することによりライン照明ユニットが
得られる。なお、天板１は、発光ダイオードａから発せ
られた光のうち、その発光ダイオードａに対向する凹面
反射板４へ向かわずに直接、上方の光出射（光出力）面
へ達しようとする光を反射させて凹面反射板４に導くた
めのものである（図３参照）。A plurality of such light source bodies, for example, 5
A line lighting unit is obtained by arranging the individual units in a vertical line. It should be noted that the top plate 1 is a part of the light emitted from the light emitting diode a, which does not go to the concave reflecting plate 4 facing the light emitting diode a and which is going to reach the upper light emitting (light output) surface directly. Is reflected and guided to the concave reflection plate 4 (see FIG. 3).
【００１９】この実施例では、凹面反射板４はＸ−Ｚ平
面内でのみ放物面形状であり、その凹面反射板４の焦点
位置に発光ダイオードａが設置されている。そのため、
Ｘ方向にはほぼ均一でＺ軸に平行な出射光が得られる
が、Ｙ方向には広がりをもった出射光が得られる。そこ
で、発光ダイオードａから発せられる光のうちＹ方向に
広がる光を金属メッキした凹面鏡（ａ−４）によってあ
らかじめ一方向に整え、出射光のＹ方向への広がりを抑
えている。In this embodiment, the concave reflection plate 4 has a parabolic shape only in the XZ plane, and the light emitting diode a is installed at the focal position of the concave reflection plate 4. for that reason,
Emitted light that is substantially uniform in the X direction and parallel to the Z axis can be obtained, but divergent emitted light can be obtained in the Y direction. Therefore, of the light emitted from the light emitting diode a, the light that spreads in the Y direction is adjusted in advance in one direction by the metal-plated concave mirror (a-4) to suppress the spread of the emitted light in the Y direction.
【００２０】実施例２ 次に、透光性光基板を用いた実施例２について図６〜図
１０を参照して説明する。図６は同実施例のライン照明
ユニットにおける光源体の概略を示す斜視図である。ま
た、図７は同ユニットにおける光源体を構成する１つの
透光性光基板の概略を示す斜視図であり、図８はそのＸ
−Ｚ平面内の概略を示す。Example 2 Next, Example 2 using a translucent optical substrate will be described with reference to FIGS. FIG. 6 is a perspective view showing an outline of a light source body in the line illumination unit of the embodiment. Further, FIG. 7 is a perspective view showing an outline of one translucent optical substrate constituting the light source body in the unit, and FIG.
-Shows an outline in the Z plane.
【００２１】光基板６は底面が凹面（放物面）となって
おり、凸面部８に金属メッキが施されることにより、底
面に凹面反射鏡が形成されている。発光ダイオードｂ
は、図９および図１０に示されるように、薄い基板（ｂ
−１）上にＧａＰからなる発光ダイオードチップ（ｂ−
４）を搭載し、光出射方向の面上に外部から電力を供給
するための２つの電極（ｂ−２）（ｂ−３）を有してな
る。発光ダイオードチップ（ｂ−４）と一方の電極（ｂ
−３）とは、ワイヤ（ｂ−５）により接続されている。The optical substrate 6 has a concave bottom surface (parabolic surface), and the convex surface portion 8 is metal-plated to form a concave reflecting mirror on the bottom surface. Light emitting diode b
Is a thin substrate (b) as shown in FIGS.
-1) A light emitting diode chip (b-
4) is mounted, and two electrodes (b-2) and (b-3) for supplying electric power from the outside are provided on the surface in the light emission direction. Light emitting diode chip (b-4) and one electrode (b
-3) is connected by a wire (b-5).
【００２２】このような発光ダイオードｂは、光基板６
の凹面反射鏡の裏側の面すなわち凸面部８に１つずつ実
装されており、次段（隣り）の光基板６の光入射部であ
る凹部７に位置するようになっている。この実施例の場
合、発光ダイオードｂは指向特性の強いものを用いるこ
とにより、出射光のＹ方向への広がりを抑えることがで
きる。Such a light emitting diode b is provided on the optical substrate 6
One is mounted on each of the rear surface of the concave reflecting mirror, that is, the convex surface portion 8, and is located in the concave portion 7 which is the light incident portion of the next (adjacent) optical substrate 6. In the case of this embodiment, the light emitting diode b having a strong directional characteristic can suppress the spread of the emitted light in the Y direction.
【００２３】なお、この発明は、上記の２実施例に限定
されるものではなく、また、発明の範囲内で上記各実施
例に多くの修正および変更を加えることができるのはも
ちろんである。The present invention is not limited to the above-mentioned two embodiments, and it goes without saying that many modifications and changes can be made to each of the above embodiments within the scope of the invention.
【００２４】[0024]
【発明の効果】この発明によれば、発光素子から発せら
れた光を所定方向へ取り出すための凹面反射鏡を有する
光源体を複数個、線状に配設し、発光素子から発せられ
た光をその凹面反射鏡により反射させて、ケース外部へ
取り出すことにより、所定方向に進行する平行光で線状
領域を照明することができる。また、発光素子から発せ
られる光の大部分を凹面反射鏡で受けるような設計が可
能なため、光の利用効率を大幅に高めることができる。According to the present invention, a plurality of light source bodies having a concave reflecting mirror for taking out the light emitted from the light emitting element in a predetermined direction are arranged in a line, and the light emitted from the light emitting element is arranged. Is reflected by the concave reflecting mirror and taken out of the case, it is possible to illuminate the linear region with parallel light traveling in a predetermined direction. Further, since it is possible to design such that most of the light emitted from the light emitting element is received by the concave reflecting mirror, it is possible to significantly improve the light utilization efficiency.
【００２５】さらに、複数個の光源体を、それらの凹面
反射鏡がいずれも上記所定方向を向いて縦に並んだ状態
に配設し、発光素子を、それらの凹面反射鏡の裏側の面
にそれぞれ設けた場合は、それぞれの発光素子から対象
とする凹面反射鏡に光を照射して平行光を取り出すこと
ができる。したがって、取り出される平行光は、発光素
子の存在により進路を妨げられることがない。また、取
り出される平行光が、光源体（ケース）と光源体（ケー
ス）の継ぎ目で途切れることもない。Further, a plurality of light source bodies are arranged such that their concave reflecting mirrors are all arranged vertically in the predetermined direction, and the light emitting elements are arranged on the back surface of the concave reflecting mirrors. When each is provided, parallel light can be extracted by irradiating the target concave reflecting mirror from each light emitting element. Therefore, the extracted parallel light is not obstructed by the presence of the light emitting element. Further, the extracted parallel light is not interrupted at the joint between the light source body (case) and the light source body (case).
【００２６】以上のように、線状領域を平行光でかつ均
一な照度分布をもって照明することができ、光の利用効
率も高めることができることから、場合によっては、従
来に比べて約半数の発光素子で必要な照度が得られるた
め、省電力化を達成できるという効果も奏する。As described above, since it is possible to illuminate a linear region with parallel light and a uniform illuminance distribution, and it is possible to improve the light utilization efficiency, and in some cases, about half the light emission compared with the conventional one is emitted. Since the illuminance required by the element is obtained, there is an effect that power saving can be achieved.
【図１】この発明における実施例１の外観斜視図。FIG. 1 is an external perspective view of a first embodiment of the present invention.
【図２】同実施例の内部構造を示す斜視図。FIG. 2 is a perspective view showing the internal structure of the embodiment.
【図３】図２のＸ−Ｚ平面における構成説明図。FIG. 3 is a structural explanatory view on an XZ plane of FIG.
【図４】同実施例に使用される光源部分の構成説明図。FIG. 4 is a structural explanatory view of a light source portion used in the embodiment.
【図５】図４のＶ−Ｖ線に沿う断面図。5 is a cross-sectional view taken along the line VV of FIG.
【図６】この発明における実施例２の分解斜視図。FIG. 6 is an exploded perspective view of a second embodiment of the present invention.
【図７】同実施例のユニットを構成する光基板の斜視
図。FIG. 7 is a perspective view of an optical substrate forming the unit of the embodiment.
【図８】図７のＸ−Ｚ平面における構成説明図。8 is an explanatory diagram of a configuration on an XZ plane of FIG. 7.
【図９】同実施例に使用される光源部分の構成説明図。FIG. 9 is a structural explanatory view of a light source portion used in the embodiment.
【図１０】図４のＸ−Ｘ線に沿う断面図。10 is a cross-sectional view taken along line XX of FIG.
【図１１】従来のライン照明ユニットの分解斜視図。FIG. 11 is an exploded perspective view of a conventional line lighting unit.
【図１２】同照明ユニットの要部拡大斜視図。FIG. 12 is an enlarged perspective view of a main part of the lighting unit.
【図１３】図１１のＹ−Ｚ平面における構成説明図。FIG. 13 is an explanatory diagram of a configuration on a YZ plane of FIG. 11.
１ 透光性天板 ２ 配線パターン ３ パッケージ（ケース） ４ 凹面反射板（凹面反射鏡） ５ 支持板 ６ 透光性光基板 ７ 光基板の凹部 ８ 光基板の凸面部 ９ パッケージ（ケース） １０ 配線パターン ａ 発光ダイオード （ａ−１） 電極 （ａ−２） 電極 （ａ−３） ワイヤ （ａ−４） 凹面鏡 （ａ−５） 発光ダイオードチップ （ａ−６） 基板 ｂ 発光ダイオード （ｂ−１） 基板 （ｂ−２） 電極 （ｂ−３） 電極 （ｂ−４） 発光ダイオードチップ （ｂ−５） ワイヤ 1 Translucent Top Plate 2 Wiring Pattern 3 Package (Case) 4 Concave Reflector (Concave Reflector) 5 Support Plate 6 Translucent Optical Substrate 7 Recess of Optical Substrate 8 Convex Surface of Optical Substrate 9 Package (Case) 10 Wiring Pattern a Light emitting diode (a-1) Electrode (a-2) Electrode (a-3) Wire (a-4) Concave mirror (a-5) Light emitting diode chip (a-6) Substrate b Light emitting diode (b-1) Substrate (b-2) Electrode (b-3) Electrode (b-4) Light Emitting Diode Chip (b-5) Wire
Claims (2)
た光を所定方向へ反射させるための凹面反射鏡と、その
発光素子およびその凹面反射鏡を収納しかつその発光素
子から発せられた光をその凹面反射鏡により反射させて
外部へ導くケースとを有してなる光源体を複数個備え、 これら複数個の光源体が線状に配設されてなるライン照
明ユニット。1. A light emitting element, a concave reflecting mirror for reflecting the light emitted from the light emitting element in a predetermined direction, a light emitting element and a light reflecting the concave reflecting mirror, and the light emitted from the light emitting element. A line lighting unit comprising a plurality of light source bodies each having a case that is reflected by the concave reflecting mirror and guided to the outside, and the plurality of light source bodies are linearly arranged.
がいずれも上記所定方向を向いて縦に並んだ状態に配設
され、 発光素子は、それらの凹面反射鏡の裏側の面にそれぞれ
設けられている請求項１記載のライン照明ユニット。2. A plurality of light source bodies are arranged in a state where their concave reflecting mirrors are all arranged vertically in the predetermined direction, and the light emitting element is provided on the back surface of the concave reflecting mirrors. The line lighting unit according to claim 1, which is provided respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9794492A JPH05299701A (en) | 1992-04-17 | 1992-04-17 | Line illumination unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9794492A JPH05299701A (en) | 1992-04-17 | 1992-04-17 | Line illumination unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05299701A true JPH05299701A (en) | 1993-11-12 |
Family
ID=14205785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9794492A Pending JPH05299701A (en) | 1992-04-17 | 1992-04-17 | Line illumination unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05299701A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263753A (en) * | 1994-03-23 | 1995-10-13 | Kimura Denki Kk | Led surface illuminator |
| JP2003158302A (en) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | Light emitting diode |
| WO2003049207A1 (en) * | 2001-11-16 | 2003-06-12 | Toyoda Gosei Co., Ltd. | Light-emitting diode, led light, and light apparatus |
| WO2006134839A1 (en) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| JP2008268273A (en) * | 2007-04-16 | 2008-11-06 | Fuji Xerox Co Ltd | Optical discharging device, image holder unit, image forming unit, and image forming apparatus |
| JP2009099497A (en) * | 2007-10-19 | 2009-05-07 | Maruwa Co Ltd | Light-emitting device, and light-emitting diode module for the same |
| JP2009279133A (en) * | 2008-05-21 | 2009-12-03 | Sanyo Electric Co Ltd | Showcase |
| US7997760B2 (en) | 2005-06-07 | 2011-08-16 | Fujikura Ltd. | Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal |
-
1992
- 1992-04-17 JP JP9794492A patent/JPH05299701A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263753A (en) * | 1994-03-23 | 1995-10-13 | Kimura Denki Kk | Led surface illuminator |
| WO2003049207A1 (en) * | 2001-11-16 | 2003-06-12 | Toyoda Gosei Co., Ltd. | Light-emitting diode, led light, and light apparatus |
| US7781787B2 (en) | 2001-11-16 | 2010-08-24 | Toyoda Gosei, Co., Ltd. | Light-emitting diode, led light, and light apparatus |
| JP2003158302A (en) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | Light emitting diode |
| US7997760B2 (en) | 2005-06-07 | 2011-08-16 | Fujikura Ltd. | Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal |
| WO2006134839A1 (en) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| US7982230B2 (en) | 2005-06-13 | 2011-07-19 | Fujikura Ltd. | Substrate for mounting light emitting element, light emitting module and lighting apparatus |
| JP2008268273A (en) * | 2007-04-16 | 2008-11-06 | Fuji Xerox Co Ltd | Optical discharging device, image holder unit, image forming unit, and image forming apparatus |
| JP2009099497A (en) * | 2007-10-19 | 2009-05-07 | Maruwa Co Ltd | Light-emitting device, and light-emitting diode module for the same |
| JP4724700B2 (en) * | 2007-10-19 | 2011-07-13 | 株式会社Ｍａｒｕｗａ | Light emitting device |
| JP2009279133A (en) * | 2008-05-21 | 2009-12-03 | Sanyo Electric Co Ltd | Showcase |
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