JPS60147177A - Led array - Google Patents
Led arrayInfo
- Publication number
- JPS60147177A JPS60147177A JP59001819A JP181984A JPS60147177A JP S60147177 A JPS60147177 A JP S60147177A JP 59001819 A JP59001819 A JP 59001819A JP 181984 A JP181984 A JP 181984A JP S60147177 A JPS60147177 A JP S60147177A
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving surface
- led
- reflecting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 230000004907 flux Effects 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Facsimile Scanning Arrangements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、ファクシミリ装置、複写機等の画像読取装置
の原稿面の照明に用いるＩＪＤアレイに係シ、特に受光
面の広範囲に渡シ高い照度を発生し得るＬＥＤアレイに
関する。[Detailed Description of the Invention] [Technical Field] The present invention relates to an IJD array used for illuminating the document surface of an image reading device such as a facsimile machine or a copying machine, and particularly to an IJD array that generates high illuminance over a wide area of the light receiving surface. The present invention relates to a possible LED array.
近年、ファクシミリ装置、複写機又はそれに類する画像
読取シ装置において、小型化の要求が高ｔｂ、それに伴
って原稿面の照明に、従来用いられていた螢光灯を廃し
、新たにＬＥＤチップを多数個並べたＬＥＤアレイが採
用されることが多い。しかるにＬＥＤアレイは螢光灯に
較べて小型でしかも耐久性に富む長所があるが、反面、
絶対光量が少なく、原稿の読取りに十分な光量を得る事
が難しい。In recent years, there has been a high demand for miniaturization of facsimile machines, copying machines, and similar image reading devices.As a result, the conventional fluorescent lamps used to illuminate the document surface have been abolished, and a large number of LED chips have been newly installed to illuminate the document surface. Individual LED arrays are often used. However, LED arrays have the advantage of being smaller and more durable than fluorescent lights, but on the other hand,
The absolute light intensity is small, making it difficult to obtain sufficient light intensity to read the original.
一第１図は従来のＬＥＤアレイの構成を示すもので、図
中１は基板、２はＬＥＤチッグ、３は円筒状の集光レン
ズ、４は集光レンズ３を支える支持体である。第２図は
第１図Ａ −Ａ’断面内の光線進路及び受光面上の照度
を示したものである。FIG. 1 shows the configuration of a conventional LED array. In the figure, 1 is a substrate, 2 is an LED chip, 3 is a cylindrical condensing lens, and 4 is a support for supporting the condensing lens 3. FIG. 2 shows the ray path and the illuminance on the light receiving surface in the section A-A' in FIG. 1.
第２図に示す如（ＬＥＤチッグ２から発した光束のうち
、集光レンズ３の中心付近を通過した光束は受光面１０
の中央部に集光し照度分布のピークを形成する。集光レ
ンズ３の周辺部を通過−だ光。As shown in FIG.
The light is focused at the center of the area, forming a peak in the illuminance distribution. Light passes through the periphery of the condenser lens 3.
束は、収差のための受光面１０の中央部に集光する事な
く、その周辺に拡散して照度分布の裾野を形成する。Ｌ
ＥＤチッグ２から側方に射出した光束は、直接集光レン
ズ３に入射する事なく、支持体４に入射する。通常この
支持体４は白色のグラスチックで作られている為、入射
した光束は散乱され、その一部が集光レンズ３を通過し
て受光面１０に到達する。しかしながらこの光は受光面
１０中夫に集光する事なく、受光面、１０上に広く拡散
するので受光面１０中央部の照度に対する寄与は少ない
。The beam does not converge at the center of the light-receiving surface 10 due to aberrations, but is diffused around the center to form the base of the illuminance distribution. L
The light beam emitted laterally from the ED chip 2 does not directly enter the condenser lens 3, but instead enters the support 4. Since this support 4 is usually made of white glass, the incident light beam is scattered and a part of it passes through the condenser lens 3 and reaches the light receiving surface 10. However, this light is not focused on the central part of the light receiving surface 10 but is widely diffused over the light receiving surface 10, so that its contribution to the illuminance at the center of the light receiving surface 10 is small.
このＬＥＤアレイを、画像読取装置の原稿の照明に用い
る場合、原稿面を受光面とし、原稿上の読み取ろうとす
る部分を、最も高い照度の得られる受光面中央に一致さ
せて用いるのが普通である＠しかし、従来のＬＥＤアレ
イにおいては、受光面中央の照度に寄与する光束はＬＥ
Ｄチッグから直接集光レンズの中心付近に入射する光束
のみであったため、
■ 受光面上における照度分布のピークが鋭く、高い照
度を得られる領域が受光面中央の狭い領域に限られるた
め、原稿上の読取ろうとする部分とこの領域を一致させ
る事が困難である。When using this LED array to illuminate a document in an image reading device, it is common to use the surface of the document as the light-receiving surface, and align the part of the document to be read with the center of the light-receiving surface where the highest illuminance can be obtained. Yes, however, in conventional LED arrays, the luminous flux that contributes to the illuminance at the center of the light receiving surface is
Since only the light flux directly entered near the center of the condenser lens from the D-chig, the peak of the illuminance distribution on the light-receiving surface was sharp, and the area where high illuminance could be obtained was limited to a narrow area at the center of the light-receiving surface. It is difficult to match this area with the part to be read above.
■ 受光面照度分布のピーク（受光面中央）においても
、得られる照度が小さい。■ Even at the peak of the light-receiving surface illuminance distribution (at the center of the light-receiving surface), the obtained illuminance is small.
という欠点があった。There was a drawback.
そこで本発明の目的は受光面上で高照度の得られる領域
が広く、しかも受光面照度分布のピークにお−て得られ
る照度が高いＬＥＤアレイを提供するにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an LED array that has a wide area on the light receiving surface where high illuminance can be obtained and also has high illuminance that can be obtained at the peak of the light receiving surface illuminance distribution.
前記目的を達成すべく本発明は、基板上にＬＥＤチッグ
を配列するとともに、前記基板に集光レンズを設けたＬ
ＥＤアレイにおいて；前記ＬＥＤチップの近傍に反射手
段を設けたことを特徴とする。In order to achieve the above-mentioned object, the present invention provides an L-shaped lamp in which LED chips are arranged on a substrate and a condensing lens is provided on the substrate.
The ED array is characterized in that a reflecting means is provided near the LED chips.
以下図面に基づいて本発明の実施例を具体的かつ詳細に
説明する。Embodiments of the present invention will be described in detail below based on the drawings.
第３図は本発明の第１実施例を示し、（ａ）はＬＥＤア
レイの平面図、（ｂ）は正面図、（ｃ）は側面図を示し
図に示す如く、板状の基板１の長手方向にＬＥＤチップ
２が等間隔に配置され、基板１の両側に、円筒状の集光
レンズ３を支持する支持体４が対岐し ′て設けられる
。基板１と支持体４とに互いに接するべく三角柱状のガ
ラスで形成された反射手段５が、ＬＥＤチッグ２０両側
に設けられる。該反射手段５の反射面６は反射板５を研
磨しさらにアルミニウムが真空蒸着されて形成される。FIG. 3 shows a first embodiment of the present invention, in which (a) is a plan view of the LED array, (b) is a front view, and (c) is a side view. LED chips 2 are arranged at equal intervals in the longitudinal direction, and supports 4 for supporting cylindrical condensing lenses 3 are provided on both sides of the substrate 1 in a bifurcated manner. Reflection means 5 formed of triangular prism-shaped glass are provided on both sides of the LED chip 20 so as to be in contact with the substrate 1 and the support 4. The reflecting surface 6 of the reflecting means 5 is formed by polishing the reflecting plate 5 and then vacuum-depositing aluminum.
第４図は第３図Ｂ −Ｂ’断面内の光線進路及び受光面
上の照度を示したものである。FIG. 4 shows the ray path and the illuminance on the light receiving surface in the section B-B' in FIG. 3.
仁の第１実施例において社、第４図に示す如くＬＥＤチ
ッグ２から側方に射出した光束が反射手段５０反射面６
−によって反射され、集光レンズ３の中心部付近を通過
して、受光面１ｏの中央から若干はずれた位置に集光す
る事である。このため受光面１０上の照度分布は、ＬＥ
Ｄチ、ノ２の上面より射出し、直接集光レンズ３の中心
部付近を通過して受光面１０中央部に集光する光束によ
る照度分布（第４図で破線ａで示す）七、ＬＥＤチ、プ
２の側方よシ射出し、一旦、ＬＥＤチ、プ２の側方に設
けられた反射手段５０反射面６で反射された後、集光レ
ンズ３の中心部付近を通過して受光面１゜中央部から若
干はずれた位置に集光する光束による照度分布（第４図
で、破線す、ｃで示す）とが重畳し１第４図の実線ｄで
示すような形状となる。In the first embodiment of the present invention, as shown in FIG.
-, passes near the center of the condensing lens 3, and is focused at a position slightly off the center of the light-receiving surface 1o. Therefore, the illuminance distribution on the light receiving surface 10 is LE
Illuminance distribution due to the light beam emitted from the top surface of D-chi, no-2, directly passing near the center of the condenser lens 3, and condensing at the center of the light-receiving surface 10 (indicated by the broken line a in FIG. 4)7. LED The light is emitted from the side of the LED chip 2, is reflected by the reflecting surface 6 of the reflecting means 50 provided on the side of the LED chip 2, and then passes near the center of the condenser lens 3. The illuminance distribution due to the light beam condensed at a position slightly deviated from the center of the light-receiving surface by 1° (indicated by broken lines s and c in Fig. 4) is superimposed, resulting in a shape as shown by the solid line d in Fig. 4. .
これは第２図において示した、従来のＬＥＤプレイによ
って得られた受光面照度分布よシ受光面上照度分布のピ
ークの幅が広く、かつピークそのものも高くなっている
。This means that the peak width of the illuminance distribution on the light receiving surface is wider and the peak itself is higher than the illuminance distribution on the light receiving surface obtained by the conventional LED play shown in FIG.
′＄５図祉本発明の第２実施例を示す。以下の実施例に
おいて第１実施例と同じ作用を果たす箇所には同一符号
が付しである。このｌａ２実施例の特徴とするところは
、反射手段５をＬＥＤチ、プ２の片側だけに設けた仁と
である。通常ＬＥＤアレイにおいては第６図に示す如く
、ＬＥＤチｙ ７’ ２の上面と基板１上にプリントさ
れた電極７との間をダンディングワイヤ８によって接続
する構成をとっている。このがンディングヮイヤ８が基
板ｌの長手方向に対して垂直な方向に設けられる場合、
ダンディングワイヤ８の設けられた側で社反射面６を有
する反射手段５を十分ＬＥＤチップ２に近接させること
ができないので、がンディングヮイヤ８が般社られてい
ない側、にのみ反射手段５を設けたものである。'$5 Figure We will show a second embodiment of the present invention. In the following embodiments, parts that perform the same functions as those in the first embodiment are given the same reference numerals. The feature of this la2 embodiment is that the reflecting means 5 is provided only on one side of the LED chip 2. A typical LED array has a configuration in which the upper surface of the LED chip y7' 2 and the electrode 7 printed on the substrate 1 are connected by a dangling wire 8, as shown in FIG. When this landing gear 8 is provided in a direction perpendicular to the longitudinal direction of the substrate l,
Since it is not possible to bring the reflecting means 5 having the reflecting surface 6 sufficiently close to the LED chip 2 on the side where the dangling wire 8 is provided, the reflecting means 5 is provided only on the side where the dangling wire 8 is not provided. It is something that
第７図は本発明の第３実施例を示し、この第３実施例の
特徴とするところは集光レンズ３に非円弧状断面を有す
る棒状レンズを用いたことにある。FIG. 7 shows a third embodiment of the present invention, and the feature of this third embodiment is that the condenser lens 3 is a rod-shaped lens having a non-arc cross section.
このように非円弧状断面の棒状レンズを用いることによ
シ受光面上のピーク照度を高めることができる。By using a rod-shaped lens having a non-arc cross section in this manner, the peak illuminance on the light-receiving surface can be increased.
第８図は本発明第４実施例を示し、この第４実施例の特
徴とするところはＬＥＤチップ２の四囲に反射手段５を
設けたことである。即ち１個のＬＥＤチップ２の四囲に
反射手段５を設けたことによシ反射効率が良好となる。FIG. 8 shows a fourth embodiment of the present invention, and the feature of this fourth embodiment is that reflective means 5 are provided around the LED chip 2. That is, by providing the reflecting means 5 around each LED chip 2, the reflection efficiency becomes good.
第９図は本発明第５実施例を示し、この第５実施例の特
徴とするところは集光し／ズ３に半円筒状レンズを用い
、この集光レンズ３とＬＥＤチップ２との間隙に樹脂９
を装填したことにある。この第５実施例によれば樹脂９
を装填する事によりＬＥＤチッゾからの放熱が良好とな
る。又集光レンズ３とＬＥＤチッゾ２間の距離が変動し
ない。FIG. 9 shows a fifth embodiment of the present invention, and the feature of this fifth embodiment is that a semi-cylindrical lens is used for the light condensing lens 3, and the gap between the condensing lens 3 and the LED chip 2 is Resin 9
This is due to the fact that it was loaded. According to this fifth embodiment, the resin 9
By loading the LED chip, heat radiation from the LED chip becomes better. Further, the distance between the condenser lens 3 and the LED chip 2 does not change.
以上詳細かつ具体的に説明した如く本発明によれＩｆ”
Ｌ、ＬＥＤアレイのＬＥＤチ、７ｐ近傍に鏡面から成る
反射面を設ける事によシ、従来用いられているＬＥＤア
レイよシ、受光面上のよシ広い範囲で、よυ高い照度を
得る事ができる。このため、本発明によるＬＥＤアレイ
をファクシミリ、複写機等の画像読取装置の原稿照明に
用いれば、
（１）組立てに際してＬＥＤアレイと原稿面、レンズ、
センサー等の部品の位置合わせの要求精度が緩和される
為、工数を削減しコストダウンをはかれる。As described above in detail and specifically, according to the present invention, if
By providing a reflective surface consisting of a mirror surface near the LED tip and 7p of the LED array, it is possible to obtain higher illuminance over a wider range on the light receiving surface than with conventionally used LED arrays. I can do it. Therefore, if the LED array according to the present invention is used for document illumination in an image reading device such as a facsimile or a copying machine, (1) during assembly, the LED array, document surface, lens, etc.
Since the accuracy required for positioning parts such as sensors is relaxed, man-hours can be reduced and costs can be reduced.
（２）少ない消費電力で必要な照度が得られる為１ＬＥ
Ｄの発熱量が少なく、放熱材を小さくする事が可能で装
置の小型化源はかれる。(2) 1LE because the necessary illuminance can be obtained with low power consumption
Since the amount of heat generated by D is small, the heat dissipation material can be made smaller, which allows for miniaturization of the device.
等の効果を奏する。It has the following effects.
第１図は従来のＬＥＤアレイの概略構成図、第２図は第
１図Ａ −Ａ’断面内の光線進路と受光面上の照度分布
を示す説明図、第３図は本発明第１実施例のＬＥＤアレ
イの概略構成図、第４図は第３図Ｂ２−ｎ／断面内の光
線進路と受光面上の照度分布を示す説明図、第５図は本
発明第２実施例０ＬＥＤアレイの概略構成図、第６図は
ＬＥＤ基板の拡大図、第７図・第８図・第９図は夫、々
本発明第３実施例・第４実施例・第５実施例の概略構成
図である。
図において
１・・・基板、２・・・ＬＥＤチッノ、３・・・集光レ
ンズ、５・・・反射手段
である。
ｉａ１図
Ｉ２ｒｚＪ
１１！３図
第４図
第５図
＠６図
１に７図
（Ｃ）
１に８図
１１９図Fig. 1 is a schematic configuration diagram of a conventional LED array, Fig. 2 is an explanatory diagram showing the light ray course in the cross section A-A' in Fig. 1 and the illuminance distribution on the light receiving surface, and Fig. 3 is the first embodiment of the present invention. A schematic configuration diagram of the LED array of the example, FIG. 4 is an explanatory diagram showing the ray path in the B2-n/cross section of FIG. 3 and the illuminance distribution on the light receiving surface, and FIG. 6 is an enlarged view of the LED board, and FIGS. 7, 8, and 9 are schematic configuration diagrams of the third, fourth, and fifth embodiments of the present invention, respectively. be. In the figure, 1...substrate, 2...LED chitno, 3...condensing lens, 5...reflecting means. ia1 figure I2rzJ 11!3 figure 4 figure 5 figure @6 figure 1 to 7 figure (C) 1 to 8 figure 119 figure
Claims (1)
基板に集光レンズを設けたＬＥＤアレイにおいて；前記
ＬＥＤテッグの近傍に反射手段を設けたことを特徴とす
るＩＪＤプレイ。(1) An IJD play, characterized in that in an LED array in which IJD chips are arranged on a substrate and a condensing lens is provided on the substrate; a reflecting means is provided near the LED tag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59001819A JPS60147177A (en) | 1984-01-11 | 1984-01-11 | Led array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59001819A JPS60147177A (en) | 1984-01-11 | 1984-01-11 | Led array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60147177A true JPS60147177A (en) | 1985-08-03 |
Family
ID=11512169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59001819A Pending JPS60147177A (en) | 1984-01-11 | 1984-01-11 | Led array |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60147177A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131157U (en) * | 1987-02-19 | 1988-08-26 | ||
| US4941072A (en) * | 1988-04-08 | 1990-07-10 | Sanyo Electric Co., Ltd. | Linear light source |
| US5196950A (en) * | 1988-08-04 | 1993-03-23 | Ricoh Company, Ltd. | Optical reader and light source used for the same |
-
1984
- 1984-01-11 JP JP59001819A patent/JPS60147177A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131157U (en) * | 1987-02-19 | 1988-08-26 | ||
| US4941072A (en) * | 1988-04-08 | 1990-07-10 | Sanyo Electric Co., Ltd. | Linear light source |
| US5196950A (en) * | 1988-08-04 | 1993-03-23 | Ricoh Company, Ltd. | Optical reader and light source used for the same |
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