JP2019068100A - Light-emitting apparatus - Google Patents

Abstract

To provide a light emitting apparatus capable of improving bonding strength to a mounting board while suppressing degradation of the strength of a base member.SOLUTION: A light emitting apparatus 1000 comprises: a substrate which has a base member having a front surface, a rear surface 112, a bottom surface 113 and an upper surface, a first wiring 12 disposed on the front surface, a second wiring 13 disposed on the rear surface, and a via hole electrically connecting the first wiring and the second wiring; at least one light-emitting element 20 placed on the first wiring; and a light reflecting cover member covering a side surface of the light emitting element and the front surface of the substrate. The base member further includes a plurality of depressed portions 16 which open on the rear surface and the bottom surface, and the substrate includes a third wiring 14 which covers an inner wall of each of the depressed portions and is electrically connected to the second wiring. The depth of each of the depressed portions from the rear surface in a front surface direction on a bottom surface side is deeper than the depth on an upper surface side. The covering member has lateral surfaces positioned on a bottom surface side and an upper surface side, respectively and inclined inward from the rear surface in the front surface direction.SELECTED DRAWING: Figure 2A

Description

  The present invention relates to a light emitting device.

There is known a light emitting device in which a mounting surface of a support (base) is provided with a recess, and the support (base) and the mounting substrate are fixed by filling the recess with a brazing material (for example, a patent) Reference 1).

JP, 2013-041865, A

An object of the present invention is to provide a light emitting device capable of improving the bonding strength with a mounting substrate while suppressing the strength reduction of a base material.

The light emitting device according to one aspect of the present invention is adjacent to a front surface extending in a first direction which is a longitudinal direction and a second direction which is a short direction, a back surface located on the opposite side of the front surface, and the front surface. A base material having a bottom surface orthogonal to the front surface, and a top surface located on the opposite side of the bottom surface, a first wiring disposed on the front surface, a second wiring disposed on the back surface, the first A substrate including a wiring and a via hole electrically connecting the second wiring, and at least one light emitting element electrically connected to the first wiring and mounted on the first wiring; A light-emitting device comprising: a light-reflecting covering member for covering the side surface of the element and the front surface of the substrate, wherein the base material is separated from the via hole in front view, and the back surface and the bottom surface A plurality of openings, and the substrate is A third wiring is provided which covers the inner wall of the recess and is electrically connected to the second wiring, and the depth of the plurality of recesses in the front direction from the back surface is the bottom surface more than the top surface side Deep on the side.

According to the light emitting device of the present invention, it is possible to provide a light emitting device capable of improving the bonding strength with the mounting substrate while suppressing the strength reduction of the base material.

FIG. 1A is a schematic perspective view 1 of the light emitting device according to the first embodiment. FIG. 1B is a schematic perspective view 2 of the light emitting device according to the first embodiment. FIG. 1C is a schematic front view of the light emitting device according to the first embodiment. FIG. 2A is a schematic end view taken along line 2A-2A of FIG. 1C. FIG. 2B is a schematic end view taken along line 2B-2B of FIG. 1C. FIG. 3A is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 3B is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 3C is a schematic front view of the base according to Embodiment 1. FIG. 4A is a schematic rear view of the light emitting device according to the first embodiment. FIG. 4B is a schematic rear view showing the modification of the light emitting device according to the first embodiment. FIG. 4C is a schematic rear view showing the modification of the light emitting device according to the first embodiment. FIG. 4D is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 4E is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 4F is a schematic bottom view of the deformability of the light emitting device according to the first embodiment. FIG. 5A is a schematic right side view of the light emitting device according to the first embodiment. FIG. 5B is a schematic left side view of the light emitting device according to the first embodiment. FIG. 6 is a schematic top view of the light emitting device according to the first embodiment. FIG. 7 is a schematic front view of the light emitting device according to the second embodiment. FIG. 8A is a schematic end view taken along line 8A-8A of FIG. FIG. 8B is a schematic end view taken along line 8B-8B of FIG. FIG. 9A is a schematic bottom view of the light emitting device according to the second embodiment. FIG. 9B is a schematic rear view of the light emitting device according to the second embodiment. FIG. 10 is a schematic front view of the light emitting device according to the third embodiment. FIG. 11 is a schematic end view taken along line 11A-11A of FIG. FIG. 12 is a schematic bottom view of the light emitting device according to the third embodiment. FIG. 13 is a schematic rear view of the light emitting device according to the third embodiment. FIG. 14 is a schematic right side view of the light emitting device according to the third embodiment. FIG. 15 is a schematic front view showing a modification of the light emitting device according to the third embodiment. 16 is a schematic end view taken along line 15A-15A of FIG. FIG. 17 is a schematic front view of the light emitting device according to the fourth embodiment. 18 is a schematic end view taken along line 18A-18A of FIG. FIG. 19 is a schematic bottom view of the light emitting device according to the fourth embodiment. FIG. 20 is a schematic rear view of the light emitting device according to the fourth embodiment. FIG. 21 is a schematic right side view of the light emitting device according to the fourth embodiment. FIG. 22 is a schematic rear view of the light emitting device according to the fifth embodiment. FIG. 23 is a schematic rear view of the light emitting device according to the sixth embodiment. FIG. 24 is a schematic rear view of the light emitting device according to the seventh embodiment. FIG. 25A is a schematic bottom view of a land pattern in which the light emitting device according to Embodiment 1 is described by a dotted line. FIG. 25B is a schematic bottom view showing the modified example of the land pattern in which the light emitting device according to the first embodiment is described by dotted lines. FIG. 25C is a schematic bottom view showing the modification of the land pattern in which the light emitting device according to Embodiment 1 is described by a dotted line. FIG. 26A is a schematic bottom view of a land pattern in which the light emitting device according to the fourth embodiment is described by a dotted line. FIG. 26B is a schematic bottom view showing the modification of the land pattern in which the light emitting device according to the fourth embodiment is described by a dotted line. FIG. 27 is a schematic front view of a light emitting device according to an eighth embodiment. 28A is a schematic end view taken along line 28A-28A of FIG. 28B is a schematic end view taken along line 28B-28B of FIG. FIG. 29 is a schematic bottom view of the light emitting device according to the eighth embodiment. FIG. 30 is a schematic rear view of the light emitting device according to the eighth embodiment. FIG. 31 is a schematic end view of a modification of the light emitting device according to the eighth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device described below is for embodying the technical concept of the present invention, and the present invention is not limited to the following unless there is a specific description. Further, the sizes and positional relationships of members shown in the drawings may be exaggerated in order to clarify the description.

First Embodiment
A light emitting device 1000 according to an embodiment of the present invention will be described based on FIGS. 1A to 6. The light emitting device 1000 includes a substrate 10, at least one light emitting element 20, and a covering member 40. The substrate 10 includes a base 11, a first wire 12, a second wire 13, a third wire 14, and a via hole 15. The base material 11 has a first direction which is a longitudinal direction and a second direction which is a lateral direction.
It has a front surface 111 extending in a direction, a back surface 112 located on the opposite side of the front surface, a bottom surface 113 adjacent to the front surface 111 and orthogonal to the front surface 111, and a top surface 114 located on the opposite side of the bottom surface 113. The substrate 11 further has a plurality of depressions 16. The first wiring 12 is a front surface 1 of the base 11.
11 is placed. The second wiring 13 is disposed on the back surface 112 of the base 11. Via hole 1
5 electrically connects the first wiring 12 and the second wiring 13. The light emitting element 20 includes the first wiring 12.
And is mounted on the first wiring 12. The covering member 40 has light reflectivity,
The side surface 202 of the light emitting element 20 and the front surface 111 of the substrate are covered. The plurality of recesses 16 are separated from the via holes 15 in a front view, and open to the back surface 112 and the bottom surface 113. The third wiring 14 covers the inner walls of the plurality of recesses 16 and is electrically connected to the second wiring 13. Back 1
The depth W1 of the recess on the bottom side is deeper than the depth W2 of the recess on the upper surface side in each of the depths of the plurality of recesses 16 in the direction from 12 to the front surface 111. In this specification, orthogonal means 90 ± 3.
Means °

The light emitting device 1000 can be fixed to the mounting substrate by a bonding member such as solder formed in the plurality of recesses 16. Since the bonding members can be located in the plurality of depressions, the bonding strength between the light emitting device 1000 and the mounting substrate can be improved more than in the case of one depression.
As shown in FIG. 2A, each of the depths of the plurality of depressions in the front direction (Z direction) from the back side is deeper on the bottom side than the top side, whereby the top side of the depressions in the front direction (Z direction) from the back side The thickness W5 of the base located on the bottom of the recess can be made thicker than the thickness W6 of the base located on the bottom side of the recess. Thereby, the strength reduction of the base material can be suppressed. In addition, since the depth W1 of the depression on the bottom side is deep, the volume of the bonding member formed in the depression is increased, so that the bonding strength between the light emitting device 1000 and the mounting substrate can be improved. Even in the top-emission type (top view type) in which the light emitting device 1000 mounts the back surface 112 of the substrate 11 so as to face the mounting substrate, the bottom surface 113 of the substrate 11 faces the mounting substrate and mounted Even in the side light emission type (side view type), the bonding strength with the mounting substrate can be improved by increasing the volume of the bonding member. In the present specification, the front direction from the back surface is also referred to as the Z direction.

The bonding strength between the light emitting device 1000 and the mounting substrate can be improved particularly in the case of the side light emission type. Since the depth of the depression in the Z direction is deeper on the bottom side than on the top side, the area of the opening of the depression on the bottom can be increased. By increasing the area of the opening of the depression on the bottom surface facing the mounting substrate, the area of the bonding member located on the bottom surface can also be increased. Thus, the area of the bonding member located on the surface facing the mounting substrate can be increased, so that the bonding strength between the light emitting device 1000 and the mounting substrate can be improved.

As shown in FIG. 2A, the depth W1 of the recess 16 in the Z direction is shallower than the thickness W3 of the substrate in the Z direction. That is, the recess 16 does not penetrate the substrate. Forming a hole through the substrate reduces the strength of the substrate. For this reason, the strength reduction of a substrate can be suppressed by providing a hollow which does not penetrate a substrate. The maximum of the depth of each of the plurality of depressions in the Z direction is preferably 0.4 to 0.8 times the thickness of the substrate. The depth of the depression is 0.
When the depth is more than four times, the volume of the bonding member formed in the recess is increased, so that the bonding strength between the light emitting device and the mounting substrate can be improved. When the depth of the depression is shallower than 0.8 times the thickness of the substrate, the decrease in strength of the substrate can be suppressed.

In a sectional view, the recess 16 preferably includes a parallel portion 161 extending from the back surface 112 in the direction parallel to the bottom surface 113 (Z direction). By providing the parallel portion 161, the volume of the depression can be increased even if the area of the opening of the depression on the back surface is the same. By increasing the volume of the recess, the amount of bonding members such as solder that can be formed in the recess can be increased, so that the bonding strength between the light emitting device 1000 and the mounting substrate can be improved. In the present specification, “parallel” means to allow an inclination of about ± 3 °. Moreover, hollow 1 in cross sectional view
6 includes an inclined portion 162 which is inclined from the bottom surface 113 in the direction in which the thickness of the substrate 11 is increased.
The inclined portion 162 may be straight or curved. The straight portion of the inclined portion 162 facilitates formation by a drill having a sharp tip. The straight line at the inclined portion 162 means that variations such as bending or deviation of about 3 μm are allowed.

As shown in FIG. 3A, in the bottom surface, a central depth W1 of each of the plurality of depressions 16 is
Preferably the maximum of the depth of the depression in the Z direction. By doing this, the thickness W8 of the base in the Z direction can be increased at the end of the recess in the X direction on the bottom surface, so the strength of the base can be improved. In the present specification, the middle means that a variation of about 5 μm is acceptable. As shown in FIG. 3B which is a modification of the first embodiment, the depth W7 of the depression 16 in the Z direction may be substantially constant at the bottom surface. In other words, the depression 16
The deepest part of may be a flat surface. The recess 16 can be formed by a known method such as a drill or a laser. In the bottom surface, the recess with the greatest central depth can be easily formed by a drill with a pointed tip. In addition, by using a drill, it is possible to form a recess having a substantially cylindrical shape in which the deepest portion has a substantially conical shape and the circular shape of the bottom surface of the substantially conical shape is continuous with a substantially cylindrical shape. By cutting a part of the recess by dicing or the like, it is possible to form a recess having a substantially semi-cylindrical shape in which the deepest portion is a substantially semi-cylindrical shape and a continuous substantially semi-circular shape.

As shown to FIG. 4A, it is preferable that the shape of each of the some hollow 16 is the same in a back surface. When the shapes of the plurality of depressions are the same, the formation of the depressions is easier than when the shapes of the depressions are different. For example, when forming a hollow by a drilling method, if the shape of each of a plurality of hollows is the same, hollow can be formed by one drill. In the present specification, the same means that a difference of about 5 μm is allowed.

Moreover, the area of the opening part of several hollow in back view may be the same, and may differ. For example, as shown in FIG. 4B, the area of the opening of the recess 16C located at the center of the substrate in the rear view is the recess 16L located on the X + side and the opening of each recess 16R located on the X− side. It may be larger than the area. In the rear view shown in FIG. 4B, FIG. 4C, etc., the right side on the X axis from the center of the light emitting device is the X + side, and the left side is the X− side. The bonding strength between the light emitting device and the mounting substrate can be improved by increasing the area of the opening of the recess 16C located at the center of the base material. Further, the area of the opening of the recess 16L located on the X + side and the opening of the recess 16R located on the X− side is small, so that the area of the second wiring 13 can be easily increased.
Since the area of the second wiring 13 is large, the inspection becomes easy when the probe needle is brought into contact with the second wiring in the characteristic inspection of the light emitting device or the like. In addition, as shown in FIG.
The area of the opening of each of the recess 16L located on the + side and the recess 16R located on the X − side may be larger than the area of the opening of the recess 16C located at the center of the substrate. The bonding strength between the light emitting device and the mounting substrate can be improved by increasing the areas of the openings of the recess 16L located on the X + side and the recess 16R located on the X- side. Moreover, it is preferable that the area of the opening part of the hollow 16L located in a X + side and the hollow 16R located in a X- side in a back view is substantially the same. By doing so, it becomes easy to suppress the deviation between the joining member formed in the recess 16L located on the X + side and the joining member formed in the recess 16R located on the X- side. This makes it easy to suppress the light emitting device from being inclined and mounted on the mounting substrate.

As shown in FIGS. 3A and 3B, the depths W1 and W7 of the plurality of depressions in the Z direction may be the same, or as shown in FIG. 4D, the depths of the plurality of depressions in the Z direction may be different. Good. For example, as shown in FIG. 4D, the depth W1C in the Z direction of the recess 16C located at the center of the base in the bottom view is located at the depth W1L in the Z direction and the X − side of the recess 16L located on the X + side It may be deeper than the depth W1R in the Z direction of the recess 16R. Note that FIG.
In the bottom view shown in D, 4E, and FIG. 4F, the left side on the X axis from the center of the light emitting device is X
It becomes + side and the right side becomes X-side. By the depth W1C of the depression 16C located at the center of the base material being deep, the bonding strength between the light emitting device and the mounting substrate can be improved. Bottom view X
Depth W1L in the Z direction of recess 16L located on the + side and recess 16R located on the X-side
The depth W1R in the Z direction of Z may be deeper than the recess W1C of the recess 16C located at the center of the substrate. The depth W1L in the Z direction of the recess 16L located on the X + side and the depth W1R in the Z direction of the recess 16R located on the X− side are preferably substantially the same. This makes it easy to suppress the deviation between the bonding member formed in the recess located on the X + side and the bonding member formed in the recess located on the X- side, so that the light emitting device is mounted on the mounting substrate. It becomes easy to control being inclined and mounted.

As shown in FIG. 4D, the width D1C in the X direction of the recess 16C located at the center of the base in a bottom view, and the width D1L in the X direction and the width D1L of the recess 16L located on the X + side Width D1R in the direction may be substantially the same, as shown in FIG. 4E and FIG. 4F, width D1C in the X direction of recess 16C located at the center of the substrate in a bottom view, X direction of recess 16L located on the X + side Recess R located on the width D1L and / or the X-side at
The width D1R in the X direction of may be different. Width D1C in the X direction of recess 16C located at the center of the base in a bottom view, width D in the X direction of recess 16L located on the X + side
Even when the widths D1R in the X direction of the recesses 16R located on the 1L and / or X-side are different, the depths of the plurality of recesses in the Z direction may be the same or different. The width D1L in the X direction of the recess 16L located on the X + side in a bottom view and the width D1R in the X direction of the recess 16R located on the X− side are preferably substantially the same. By doing so, it becomes easy to suppress the deviation between the joining member formed in the recess 16L located on the X + side and the joining member formed in the recess 16R located on the X- side. This makes it easy to suppress the light emitting device from being inclined and mounted on the mounting substrate.

In the back surface, it is preferable that the plurality of depressions 16 be positioned symmetrically with respect to the center line of the substrate parallel to the second direction (Y direction). In this way, when the light emitting device is mounted on the mounting substrate via the bonding member, the self alignment effectively works, and the light emitting device can be mounted within the mounting range with high accuracy.

In the rear surface, it is preferable that the opening shape of each of the plurality of depressions is substantially semicircular.
The hollow whose opening shape is circular can be formed by drilling, and by cutting a part of the circular hollow by dicing or the like, a substantially semicircular hollow can be easily formed on the back surface. . In addition, in the rear surface, since the opening shape of the recess is substantially semicircular having no corner, concentration of the stress related to the recess can be suppressed, so that it is possible to suppress the substrate from being broken.

As shown in FIGS. 1A, 2A, and 2B, the light emitting device 1000 may include the light transmitting member 30. It is preferable that the translucent member 30 be located on the light emitting element 20. The light emitting element 20 can be protected from external stress by the translucent member being positioned on the light emitting element. The covering member 40 preferably covers the side surface of the translucent member 30. By doing this, the light from the light emitting device can be brought close to the point light source. By bringing the light emitting device close to a point light source, for example, adjustment of light distribution by an optical system such as a lens becomes easy.

The light emitting element 20 includes a mounting surface facing the substrate 10 and a light extraction surface 201 located on the opposite side of the mounting surface. As shown in FIG. 2A, when the light emitting element is flip-chip mounted, the surface on which the positive and negative electrodes of the light emitting element are located and the surface on the opposite side are used as light extraction surfaces. The translucent member 30 may be bonded to the light emitting element 20 via the light guide member 50. The light guide member 50 may be positioned only between the light extraction surface 201 of the light emitting element and the light transmitting member 30 to bond the light emitting element 20 and the covering member 40, and light is emitted from the light extraction surface 201 of the light emitting element The light emitting element 20 and the covering member 40 may be bonded by covering the side surface 202 of the element. The light guide member 50 has a higher transmittance of light from the light emitting element 20 than the covering member 40. For this reason, the light guide member 50 is the side surface 202 of the light emitting element.
Since the light emitted from the side surface of the light emitting element 20 can be easily taken out to the outside of the light emitting device through the light guide member 50 by covering up to the side, the light extraction efficiency can be enhanced.

When there are a plurality of light emitting elements 20, peak wavelengths of one light emitting element and the other light emitting element may be the same or different. When the peak wavelengths of one light emitting element and the other light emitting element are different, the light emitting element having a peak wavelength of light emission in the range of 430 nm to less than 490 nm (wavelength range of blue region) and the peak wavelength of light emission of 490 nm to 570 nm or less Preferably, the light emitting element is in the range of (wavelength range of green region). This can improve the color rendering of the light emitting device.

As shown in FIGS. 2A and 2B, the light transmissive member 30 may contain a wavelength conversion substance 32. The wavelength conversion substance 32 is a member that absorbs at least a part of the primary light emitted by the light emitting element 20 and emits secondary light of a wavelength different from that of the primary light. By making the light transmitting member 30 contain the wavelength conversion substance 32, it is possible to output mixed color light in which the primary light emitted from the light emitting element 20 and the secondary light emitted from the wavelength conversion substance 32 are mixed. For example, the light emitting element 20 is a blue LED,
When a phosphor such as YAG is used as the wavelength conversion substance 32, a light emitting device is configured to output white light obtained by mixing blue light of a blue LED and yellow light excited by the blue light and emitted by the phosphor. can do.

The wavelength converting substance may be dispersed uniformly in the light transmitting member, or the wavelength converting substance may be unevenly distributed in the vicinity of the light emitting element than the upper surface of the light transmitting member 30. In this way, even if the wavelength conversion substance 32 which is weak to moisture is used, the base material 31 of the light transmitting member 30 also functions as a protective layer, so that deterioration of the wavelength conversion substance 32 can be suppressed. Also, as shown in FIGS. 2A and 2B, the light-transmissive member 30 includes a layer containing the wavelength conversion substance 32 and a layer 3 substantially containing no wavelength conversion substance.
3 and may be provided. The layer 33 substantially containing no wavelength conversion substance is positioned on the layer containing the wavelength conversion substance 32 on the light transmitting member 30 so that the layer 33 substantially containing no wavelength conversion substance is also used as a protective layer. Since the function is performed, the deterioration of the wavelength conversion substance 32 can be suppressed. As a wavelength conversion substance 32 which is weak to moisture, for example, a manganese activated fluoride phosphor is mentioned.
The manganese-activated fluoride phosphor is a preferable member from the viewpoint of color reproducibility because light emission with a relatively narrow spectral line width can be obtained.

As shown in FIG. 2B, the via holes 15 are provided in the holes passing through the front surface 111 and the back surface 112 of the substrate 11. The via hole 15 includes a fourth wire 151 covering the surface of the through hole of the base material and a filling member 152 filled in the fourth wire 151. The filling member 152 may be conductive or insulating. It is preferable to use a resin material for the filling member 152. In general, the resin material before curing is easier to fill in the fourth wiring 151 because the resin material has higher fluidity than the metal material before curing. For this reason, manufacture of a board | substrate becomes easy by using a resin material for a filling member. Examples of resin materials that can be easily filled include epoxy resins. In the case of using a resin material as the filling member, it is preferable to include an addition member in order to lower the linear expansion coefficient. By doing this, the difference in linear expansion coefficient with the fourth wiring is reduced, so it is possible to suppress the formation of a gap between the fourth wiring and the filling member by the heat from the light emitting element. As an additive member,
For example, silicon oxide can be mentioned. When a metal material is used for the filling member 152,
Heat dissipation can be improved.

As shown in FIG. 4A, the area of the via hole 15 on the back surface is smaller than the area of the opening of the recess 16 on the back surface. For this reason, although the via hole 15 penetrates the base material 11, it is smaller than the area of the opening of the recess 16 in the back surface, so that the strength of the base material 11 can be prevented from being reduced.

As shown to FIG. 4A, it is preferable that the hollow 16 is located between the via hole 15 and the adjacent via hole in a rear view. In other words, it is preferable that the recess 16 be located on a straight line connecting the via hole 15 and the adjacent via hole in the rear view. In this way, the heat from the light emitting element can be efficiently transmitted from the via hole 15 to the third wiring 14 located in the recess 16. The heat transferred to the third wiring 14 is transferred to the mounting substrate through the bonding member, so the heat dissipation of the light emitting device is improved.

Moreover, as shown to FIG. 4A, it is preferable that the via hole 15 is located between the hollow 16 and the hollow adjacent in the rear view. In other words, it is preferable that the via hole 15 be located on a straight line connecting the recesses adjacent to the recess 16 in the rear view. By doing this, the heat from the light emitting element can be efficiently transmitted from the via hole 15 to the third wiring 14 located in the recess. Thereby, the heat dissipation of the light emitting device is improved.

As shown in FIG. 2B, the light emitting element 20 includes at least a semiconductor laminate 23, and the semiconductor laminate 23 is provided with positive and negative electrodes 21 and 22. The positive and negative electrodes 21 and 22 are preferably formed on the same side of the light emitting element 20, and the light emitting element 20 is preferably flip-chip mounted on the substrate 10. As a result, a wire for supplying electricity to the positive and negative electrodes of the light emitting element is not necessary, and the light emitting device can be miniaturized. Although the light emitting element 20 includes the element substrate 24 in the present embodiment, the element substrate 24 may be removed. When the light emitting element 20 is flip-chip mounted on the substrate 10, the positive and negative electrodes 21 and 22 of the light emitting element are electrically conductive adhesive members 60.
Are connected to the first wiring 12 via

As shown to FIG. 2B, when the light-emitting device 1000 is equipped with two or more light emitting elements 20, it is preferable that a several light emitting element is provided along with a 1st direction (X direction). By doing this, the width of the light emitting device 1000 in the second direction (Y direction) can be shortened, so that the light emitting device can be thinned. The number of light emitting elements may be three or more or one.

As shown in FIGS. 3C and 4A, the substrate 10 includes a base 11, a first wire 12, and a second wire 1.
3 and. The base material 11 has a front surface 111 extending in a first direction as a longitudinal direction and a second direction as a lateral direction, a back surface 112 opposite to the front surface, and a bottom surface adjacent to the front surface 111 and orthogonal to the front surface 111 113 and an upper surface 114 opposite to the bottom surface 113.

As shown in FIG. 4A, the light emitting device 1000 has an insulating film 18 covering a part of the second wiring 13.
May be provided. By providing the insulating film 18, it is possible to secure insulation on the rear surface and prevent short circuit. Moreover, it can prevent that a 2nd wiring peels from a base material.

As shown to FIG. 5A, it is preferable that the side surface 403 of the longitudinal direction of the covering member 40 located in the bottom face 113 side inclines inside the light-emitting device 1000 in a Z direction. In this way, when the light emitting device 1000 is mounted on the mounting substrate, the contact between the side surface 403 of the covering member 40 and the mounting substrate is suppressed, and the mounting posture of the light emitting device 1000 is likely to be stable. In addition, when the covering member 40 thermally expands, the stress due to the contact with the mounting substrate can be suppressed. Top surface 114
The longitudinal side surface 404 of the covering member 40 located on the side is a light emitting device 1000 in the Z direction.
It is preferable that the inside of the By doing this, the contact between the side surface of the covering member 40 and the suction nozzle (collet) can be suppressed, and damage to the covering member 40 at the time of suction of the light emitting device 1000 can be suppressed. In addition, when the light emitting device 1000 is incorporated into a lighting unit or the like, the upper surface 114 of the base material 11 preferentially contacts the peripheral members rather than the side surface 404 of the covering member 40, thereby suppressing stress on the covering member 40. be able to. Thus, the bottom 113
The side 403 in the longitudinal direction of the covering member 40 located on the side and the side 404 in the longitudinal direction of the covering member 40 located on the upper surface 114 side are the light emitting device 1000 in the front direction (Z direction) from the back side.
It is preferable that the inside of the The inclination angle θ of the covering member 40 can be appropriately selected, but is preferably 0.3 ° or more and 3 ° or less from the viewpoint of the easiness of such effects and the strength of the covering member 40, 0.5 ° It is more preferably 2 ° or less and still more preferably 0.7 ° or more and 1.5 ° or less.

As shown to FIG. 5A and FIG. 5B, it is preferable that the right side and left side of the light-emitting device 1000 are carrying out the substantially identical shape. By doing this, the light emitting device 1000 can be miniaturized.

As shown in FIG. 6, it is preferable that the lateral side surface 405 of the covering member 40 and the lateral side surface 105 of the substrate 10 be substantially coplanar. By doing this, the width in the longitudinal direction (X direction) can be shortened, so that the light emitting device can be miniaturized.

Second Embodiment
As compared with the light emitting device 1000 according to Embodiment 1, the light emitting device 2000 according to Embodiment 2 of the present invention shown in FIGS. 7 to 9B includes the number of light emitting elements mounted on the substrate and the depression provided in the base material. And the number of via holes is different. The shape of the recess 16 is the same as that of the first embodiment.

As shown in FIG. 8A, in the light emitting device 2000, as in the first embodiment, the depth of the depression in the front direction from the back surface is deeper on the bottom side than on the top side. The thickness can be greater than the thickness of the base located on the bottom side of the recess. Thereby, the strength reduction of the base material can be suppressed. In addition, since the hollow on the bottom side is deep, the volume of the bonding member formed in the hollow is increased, so that the bonding strength between the light emitting device 2000 and the mounting substrate can be improved.

As shown in FIG. 8B, the number of light emitting elements may be one. When the number of light emitting elements is one, the width in the first direction (X direction) can be shorter than in the case where there are a plurality of light emitting elements, so that the light emitting device can be miniaturized. By reducing the width in the first direction (X direction) of the light emitting device, the number of depressions may be changed as appropriate. For example, as shown in FIG. 9A, the number of depressions 16 may be two. The number of depressions 16 may be one or three or more.

As shown in FIG. 9B, it is preferable that the plurality of via holes 15 be located between the recess 16 and the recess adjacent in the rear view. In other words, it is preferable that the plurality of via holes 15 be located on a straight line connecting the recesses adjacent to the recess 16 in the rear view. By doing this, the heat from the light emitting element can be efficiently transmitted from the via hole 15 to the third wiring 14 located in the recess. Thereby, the heat dissipation of the light emitting device is improved.

Embodiment 3
A light emitting device 3000 according to the third embodiment of the present invention shown in FIGS. 10 to 14 is different from the light emitting device 1000 according to the first embodiment in that a recess 16 having a different shape is provided.

Similar to the light emitting device 1000, the light emitting device 3000 includes the substrate 10, at least one light emitting element 20, and the covering member 40. The substrate 10 includes a base 11, a first wiring 12, and a second
A wire 13, a third wire 14, and a via hole 15 are provided. The base material 11 has a front surface 111 extending in a first direction as a longitudinal direction and a second direction as a lateral direction, a back surface 112 opposite to the front surface, and a bottom surface adjacent to the front surface 111 and orthogonal to the front surface 111 And 113, a top surface 114 opposite to the bottom surface 113, and a side surface 115 located between the front surface 111 and the back surface 112. The substrate 11 further has a plurality of depressions 16. The plurality of depressions 16 have a back surface 112 and a bottom surface 1
A central recess 161 opened at 13 and an end recess 162 opened at the back surface 112, the bottom surface 113 and the side surface 115. The third wiring 14 covers the inner wall of the recess 16 and is electrically connected to the second wiring 13.

As shown in FIG. 14, the light emitting device 3000 has a central recess 161 in the front direction from the back surface.
And / or the depth of the end recess 162 is deeper on the bottom side than on the upper surface side, the thickness of the substrate located on the upper surface side of the center recess 161 and / or the end recess 162 is set to the center recess 161 and / or the end It can be thicker than the thickness of the base located on the bottom side of the partial recess 162. Thereby, the strength reduction of the base material can be suppressed. In addition, since the central recess 161 and / or the end recess 162 on the bottom side is deep, the volume of the bonding member formed in the central recess 161 and / or the end recess 162 is increased, so that the light emitting device 3000 and the mounting substrate The bonding strength with this can be improved. The center recess 161 and / or the end recess 162 may be at least one.

The end recess 162 is also open to the side surface 115 of the base, as shown in FIGS. As a result, the bonding member is also located on the side surface 115 side of the base material.
It is possible to improve the bonding strength between the and the mounting substrate. In the case of the side light emission type in which the light emitting device 3000 is mounted with the bottom surface 113 of the base 11 and the mounting substrate facing each other, the end depressions 16 in particular
It is preferable to have two. By providing the end recess 162, the side surface 115 of the substrate
Accordingly, it is possible to suppress the occurrence of the Manhattan phenomenon in which the light emitting device 3000 is inclined on the mounting substrate and the back surface of the base material faces the mounting substrate and stands up. At least one end recess 162 may be provided, but a plurality of end recesses 162 is preferable. The presence of the plurality of end recesses 162 can further improve the bonding strength between the light emitting device 3000 and the mounting substrate. In the case where there are a plurality of end depressions 162, it is preferable that the end depressions be located at both ends of the substrate in rear view. By doing this, the occurrence of the Manhattan phenomenon can be further suppressed.

When the shape of the central recess 161 is substantially half of a circle and the shape of the end recess 162 is substantially a quarter of a circle in the rear view, the central recess 161 and the end are Partial depression 1
The diameters of the circular shapes 62 may be different or substantially the same. Central depression 161 and end depression 16
If the diameters of the two circular shapes are substantially the same, one hollow is used to form the central recess 161 and the end recess 1.
It is preferable because 62 can be formed. In the case where the central recess 161 and the end recess 162 have an inclined portion which inclines in the direction in which the thickness of the base 11 increases from the bottom surface 113 in the cross sectional view, the inclined portion and the end recess 162 of the central recess 161 The angle of the inclined portion of may be different or substantially the same. If the angle of the inclined portion of the central recess 161 and the inclined portion of the end recess 162 are substantially the same, it is preferable because the central recess 161 and the end recess 162 can be formed by one drill.

As shown to FIG. 15, FIG. 16, one translucent member 30 may be located on several light emitting elements. By doing this, the area of the light transmitting member in the front view can be increased, so the light extraction efficiency of the light emitting device is improved. In addition, since the light emitting surface of the light emitting device is one, luminance unevenness of the light emitting device can be reduced.

When one translucent member 30 is located on a plurality of light emitting elements, each light emitting element 20
The light guide member 50 joining the light transmitting member 30 and the light transmitting member 30 may be connected or separated from each other. As shown in FIG. 16, it is preferable that the light guide member be positioned so as to connect one light emitting element to the other light emitting element. In this way, the light of the light emitting element can be guided to the light transmitting member through the light guide member also between the one light emitting element and the other light emitting element, thereby reducing the uneven brightness of the light emitting device. can do. In addition, since the portion of the covering member located between one light emitting element and the other light emitting element is reduced, the covering member can suppress deterioration by light from the light emitting element. As the light guide member, it is preferable to use a material that is less likely to be deteriorated by the light from the light emitting element than the covering member.

Fourth Embodiment
The light emitting device 4000 according to the fourth embodiment of the present invention shown in FIGS. 17 to 21 is different from the light emitting device 2000 according to the second embodiment in that a recess 16 having a different shape is provided.

As shown in FIG. 21, the light emitting device 4000 includes an end recess 162. Since the depth of the end depression in the front direction from the back surface is deeper on the bottom side than on the top side, the thickness of the base located on the top side of the end depression is greater than the thickness of the base located on the bottom of the depression It can be thickened.
Thereby, the strength reduction of the base material can be suppressed. Further, since the end recess on the bottom surface side is deep, the volume of the bonding member formed in the end recess is increased, so that the bonding strength between the light emitting device 4000 and the mounting substrate can be improved.

The end recess 162 is also open to the side surface 115 of the substrate, as shown in FIGS. As a result, the bonding member is also located on the side surface 115 side of the base material.
It is possible to improve the bonding strength between the and the mounting substrate.

Fifth Embodiment
A light emitting device 5000 according to the fifth embodiment of the present invention shown in FIG. 22 is different from the light emitting device 4000 according to the fourth embodiment in that a center depression 161 is provided.

Since the light emitting device 5000 includes the central recess 161 and the end recess 162, the number of locations that can be fixed by the bonding member increases, so the bonding strength between the light emitting device and the mounting substrate can be improved. The depth of the central recess 161 and / or the end recess 162 in the front direction from the back surface is deeper on the bottom side than on the upper surface side. Thus, the bonding strength between the light emitting device 5000 and the mounting substrate can be improved.

Embodiment 6
Compared to the light emitting device 1000 according to Embodiment 1, the light emitting device 6000 according to Embodiment 6 of the present invention shown in FIG. 23 has a shape of the second wiring and the insulating film and a recess (center recess) in the center of the light emitting device. The difference is that they do not have

The second wiring 13 of the light emitting device 6000 includes an exposed portion 131 which is located between the two end depressions in the rear view and is exposed from the insulating film 18. The exposed portion 131 is surrounded by the insulating film 18 except for the bottom surface 113 side. By arranging the bonding member in the exposed portion 131, bonding strength between the light emitting device and the mounting substrate can be improved. The shape of the exposed portion 131 in the rear view may be any shape, square or hemispherical. The shape of the exposed portion 131 in the rear view can be easily changed by changing the shape of the insulating film. The shape of the exposed portion 131 in the rear view has a narrow portion 132 on the bottom side and a wide portion 133 at a position extended in the second direction (Y direction).
Preferably, By arranging a portion having a narrow width, it is possible to suppress flux or the like contained in the bonding member from entering the area below the light emitting element along the surface of the exposed portion 131 when the light emitting device is mounted. it can. Also, the second wire 1 exposed from the insulating film 18
It is preferable that the shape of 3 is located symmetrically with respect to the center line of the base material parallel to the second direction (Y direction). In this way, when the light emitting device is mounted on the mounting substrate via the bonding member, the self alignment effectively works, and the light emitting device can be mounted within the mounting range with high accuracy.

Seventh Embodiment
The light emitting device 7000 according to the seventh embodiment of the present invention shown in FIG. 24 is different from the light emitting device 4000 according to the fourth embodiment in the shapes of the second wiring and the insulating film.

Similar to the light emitting device 6000, the second wiring 13 of the light emitting device 7000 includes an exposed portion 131 which is located between two end depressions in a rear view and is exposed from the insulating film 18. Exposed section 13
1 is surrounded by the insulating film 18 except for the bottom surface 113 side. By arranging the bonding member in the exposed portion 131, bonding strength between the light emitting device 7000 and the mounting substrate can be improved.

The shape of the land pattern of the mounting substrate on which the light emitting device is mounted is not particularly limited, and may be substantially square or substantially circular. For example, as shown in FIG. 25A, the land pattern of the mounting substrate on which the light emitting device according to the first embodiment is mounted has a wide portion W10 with a wide width in the X direction.
And a narrow portion W9 having a narrow width. In the bottom view, the narrow portion W9 is positioned at a position overlapping the recess, whereby the self alignment property when mounting the light emitting device on the mounting substrate can be enhanced. Moreover, the land pattern includes the wide portion W10, whereby the area of the land pattern in a bottom view can be increased. Thereby, variation in the thickness of the bonding member can be suppressed. Further, as in the light emitting device according to the first embodiment, the land pattern of the mounting substrate on which the light emitting device is mounted, in which the depth of the center of the recess is the maximum of the depth of the recess in the Z direction, is shown in FIG. Preferably, the length W12 in the Z direction at the center of the land pattern is longer than the length W11 in the Z direction at the end of the land pattern. By doing this, it is possible to improve self-alignment when mounting the light emitting device on a mounting substrate. Also, as shown in FIG. 25C, the land pattern has a wide portion W10 and a narrow portion W9.
And a length W14 in the central Z direction at the narrow portion of the land pattern,
It may be longer than the length W13 in the Z direction of the end of the narrow portion of the land pattern. By doing this, it is possible to improve the self alignment property when mounting the light emitting device according to the first embodiment to the mounting substrate and to suppress the thickness variation of the bonding member.

Further, as shown in FIG. 26A, the land pattern of the mounting substrate on which the light emitting device is mounted, in which the depth of the depression in the Z direction becomes deeper as being farther from the center of the light emitting device Length W15 in the Z direction of the land pattern far from the center of
The length W 16 in the Z direction of the land pattern closer to the center of the light emitting device is preferably longer. By doing this, it is possible to improve self-alignment when mounting the light emitting device on a mounting substrate. Also, as shown in FIG. 26B, the land pattern includes a wide portion W10 having a large width in the X direction and a narrow portion W9 having a narrow width, and the narrow portion of the land pattern on the side far from the center of the light emitting device. It is preferable that the length W17 of the end portion in the Z direction be longer than the length W18 in the Z direction of the end portion of the narrow portion of the land pattern closer to the center of the light emitting device. In the bottom view, the narrow portion is positioned at a position overlapping the end recess, whereby the self alignment property when mounting the light emitting device on the mounting substrate can be enhanced. In addition, by providing the wide portion with the land pattern, the area of the land pattern in a bottom view can be increased. Thereby, variation in the thickness of the bonding member can be suppressed. In addition, the length W17 in the Z direction of the end of the narrow portion of the land pattern on the side far from the center of the light emitting device is the length in the Z direction of the end of the narrow portion of the land pattern on the side closer to the center of the light emitting device When the light emitting device is mounted on the mounting substrate, the self alignment can be enhanced by making the light emitting device longer than the width W18.

Eighth Embodiment
As compared with the light emitting device 1000 according to Embodiment 1, the light emitting device 8000 according to Embodiment 8 of the present invention shown in FIGS. 27 to 30 has the number of light emitting elements mounted on the substrate and the depression provided in the base material. The number of via holes and the shape of the light transmitting member are different. The shape of the recess 16 is the same as that of the first embodiment.

As shown in FIG. 28A, in the light emitting device 8000, as in the first embodiment, the depth of the depression in the front direction from the back is deeper on the bottom side than on the top side. The thickness can be greater than the thickness of the base located on the bottom side of the recess. Thereby, the strength reduction of the base material can be suppressed. In addition, since the hollow on the bottom side is deep, the volume of the bonding member formed in the hollow is increased, so that the bonding strength between the light emitting device 8000 and the mounting substrate can be improved.

As shown in FIG. 28B, the number of light emitting elements may be three. The peak wavelengths of the three light emitting elements may be the same, or the peak wavelengths of the three light emitting elements may be different, and the peak wavelengths of the two light emitting elements are the same, and the peak wavelength of one light emitting element is the two light emitting elements It may be different from the peak wavelength. In the present specification, the same peak wavelength of the light emitting element means that a fluctuation of about 5 nm is allowed. When the peak wavelengths of the light emitting elements are different, as shown in FIG. 28B.
As shown in the first light emitting element 20B whose peak wavelength of light emission is in the range of 430 nm to less than 490 nm (wavelength range of blue region), the peak wavelength of light emission is in the range of 490 nm to 570 nm (wavelength range of green region) And the second light emitting element 20G. In particular, as the second light emitting element 20G, it is preferable to use a light emitting element whose half width is 40 nm or less, and more preferable to use a light emitting element whose half width is 30 nm or less. Thereby, green light can have a sharp peak easily compared with the case where green light is obtained using green fluorescent substance. As a result, the liquid crystal display device including the light emitting device 8000 can achieve high color reproducibility.

The arrangement of the first light emitting element 20B and the second light emitting element 20G is not particularly limited, but as shown in FIG. 28B, the first light emitting element 20B which is a blue light emitting element and the second light emitting element which is a green light emitting element It is preferable that 20G and the first light emitting element 20B, which is a blue light emitting element, be arranged side by side. By alternately arranging the first light emitting elements 20B and the second light emitting elements 20G, the color mixing property of the light emitting device can be improved. The second light emitting element, the first light emitting element, and the second light emitting element may be arranged in order from the left. The number of first light emitting elements 20B may be greater than the number of second light emitting elements 20G according to the light emission characteristics to be obtained, and the number of second light emitting elements 20G is the first light emitting element. It may be more than the number of 20 B,
The number of first light emitting elements 20B and the number of second light emitting elements 20G may be the same. By adjusting the number of light emitting elements, a light emitting device having an arbitrary color tone and light quantity can be obtained.

As shown in FIG. 28B, one light transmitting member 30 includes the first light emitting element 20B and the second light emitting element 2.
When positioned on 0 G, it is preferable that the wavelength conversion substance 32 hardly absorbs the green light of the second light emitting element 20 G to emit red light. That is, it is preferable that the wavelength conversion substance 32 does not substantially convert green light into red light. And it is preferable that the reflectance with respect to the green light of the wavelength conversion substance 32 is 70% or more on the average in the range of the wavelength of green light.
Design of the light emitting device can be facilitated easily by using the wavelength conversion substance 32 as a phosphor having high reflectance to green light, that is, a phosphor that absorbs less green light, that is, a phosphor that converts less green light. can do.
If a red phosphor that absorbs large amounts of green light is used, the output balance of the light emitting device should be examined not only for the first light emitting element 20B but also for the second light emitting element 20G in consideration of wavelength conversion by the wavelength conversion substance 32. Absent. On the other hand, when the wavelength conversion substance 32 which hardly converts the wavelength of green light is used, the output balance of the light emitting device can be designed only by considering only the wavelength conversion of the blue light emitted by the first light emitting element 20B.

As such a preferable wavelength conversion substance 32, the following red fluorescent substance can be mentioned.
The wavelength conversion substance 32 is at least one or more of these.
The first type is a red phosphor whose composition is represented by the following general formula (I).

A ₂ MF ₆ : Mn ⁴⁺ (I)

However, in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs and NH ^{4 +} , and M is a group 4 element or group 14 element And at least one element selected from the group consisting of

The group 4 elements are titanium (Ti), zirconium (Zr) and hafnium (Hf).
Group 14 elements include silicon (Si), germanium (Ge), tin (Sn) and lead (Pb)
It is.
As a specific example of the first type of red phosphor, K ₂ SiF ₆ : Mn ⁴⁺ , K ₂ (Si, Ge
) F ₆ : Mn ⁴⁺ , K ₂ TiF ₆ : Mn ⁴⁺ can be mentioned.

The second type is a red phosphor whose composition is represented by 3.5MgO.0.5MgF ₂ .GeO ₂ : Mn ⁴⁺ or a red phosphor whose composition is represented by the following general formula (II) .

(X-a) MgO · a (Ma) O · b / 2 (Mb) 2 O 3 · yMgF 2 · c (Mc) X
₂ · (1-d−e) GeO ₂ · d (Md) O ₂ · e (Me) ₂ O ₃ : Mn ⁴⁺ (I
I)

However, in the above general formula (II), Ma is at least one selected from Ca, Sr, Ba, Zn, and Mb is at least one selected from Sc, La, Lu, M
c is at least one selected from Ca, Sr, Ba, Zn, X is at least one selected from F, Cl, and Md is at least one selected from Ti, Sn, Zr And Me is at least one selected from B, Al, Ga, In. In addition, for x, y, a, b, c, d and e, 2 ≦ x ≦ 4, 0 <y ≦ 2, 0 ≦ a ≦ 1.5,
0 ≦ b <1, 0 ≦ c ≦ 2, 0 ≦ d ≦ 0.5, 0 ≦ e <1.

In the light-emitting device 8000, the width in the first direction (X direction) is likely to be longer than in the case where one light-emitting element is provided because the number of light-emitting elements is three. Therefore, the number of recesses and via holes may be changed as appropriate. For example, as shown in FIG. 30, the number of recesses 16 and via holes may be four.

As shown in FIG. 31, one light-transmissive member 30 may be positioned on each of the first light-emitting element and the second light-emitting element, and as shown in FIG. 28B, one light-transmissive member 30 is provided. May be located on a plurality of light emitting elements. As shown in FIG. 31, when one light-transmissive member 30 is located on the first light-emitting element and the second light-emitting element, the light-transmissive member 30 located on the first light-emitting element 20B The material of the wavelength conversion substance 32 contained in the translucent member 30 located on the second light emitting element 20G may be the same or different. For example, in the case where the wavelength conversion substance 32 hardly absorbs the green light of the second light emitting element 20G and emits red light, the first
The light transmitting member 30 located on the light emitting element 20B contains the wavelength conversion substance 32 which is a red phosphor, and the light transmitting member 30 located on the second light emitting element 20G has a wavelength conversion which is a red phosphor. The substance 32 may not be contained. By doing this, it is possible to design the output balance of the light emitting device only by considering only the wavelength conversion of the blue light emitted by the first light emitting element 20B. When one translucent member 30 is positioned on each of the first light emitting element and the second light emitting element,
A covering member is formed between the light transmitting member 30 located on the first light emitting element 20B and the light transmitting member 30 located on the second light emitting element 20G. As shown to FIG. 28B, when one translucent member 30 is located on several light emitting elements, the translucent member 30 in a plain view
Thus, the light extraction efficiency of the light emitting device is improved. In addition, since the light emitting surface of the light emitting device is one, luminance unevenness of the light emitting device can be reduced.

When one translucent member 30 is located on a plurality of light emitting elements, each light emitting element 20
The light guide member 50 joining the light transmitting member 30 and the light transmitting member 30 may be connected or separated from each other. As shown to FIG. 28B, it is preferable that the light guide member 50 is located so that it may connect between one light emitting element and the other light emitting element. In this way, the light of the light emitting element can be guided to the light transmitting member through the light guide member also between the one light emitting element and the other light emitting element, thereby reducing the uneven brightness of the light emitting device. can do.

As shown in FIGS. 28B and 31, a layer in which the light transmitting member 30 contains the wavelength conversion substance 32,
And a layer 33 substantially containing no wavelength conversion substance. The layer 33 substantially containing no wavelength conversion substance is positioned on the layer containing the wavelength conversion substance 32 on the light transmitting member 30 so that the layer 33 substantially containing no wavelength conversion substance is also used as a protective layer. Since the function is performed, the deterioration of the wavelength conversion substance 32 can be suppressed. As shown in FIG. 31, when one light-transmissive member 30 is located on each of the first light-emitting element and the second light-emitting element, the light-transmissive member 30 located on the first light-emitting element 20B. The thickness of the layer 33 substantially free of the wavelength conversion substance of the present invention and the thickness of the layer 33 substantially free of the light transmitting member 30 wavelength conversion substance located on the second light emitting element 20G are the same or different. It is also good. In addition, in the case where one translucent member 30 is positioned on each of the first light emitting element and the second light emitting element, the wavelength conversion material of the translucent member 30 positioned on the first light emitting element 20B The thickness of the layer containing 32 and the thickness of the layer containing the light transmitting member 30 wavelength conversion substance 32 located on the second light emitting element 20G may be the same or different. In the present specification, the same thickness means that a difference of about 5 μm is allowed.

  Hereinafter, each component in the light emitting device according to the embodiment of the present invention will be described.

(Board 10)
The substrate 10 is a member on which the light emitting element is mounted. The substrate 10 is at least a substrate 11;
A first wiring 12, a second wiring 13, a third wiring 14, and a via hole 15 are formed.

(Base material 11)
The base material 11 can be comprised using insulating members, such as resin or fiber reinforced resin, ceramics, glass. As resin or fiber reinforced resin, epoxy, glass epoxy, bismaleimide triazine (BT), polyimide etc. are mentioned. Examples of the ceramic include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof. It is preferable to use the base material which has a physical property close | similar to the linear expansion coefficient of a light emitting element especially among these base materials. The lower limit of the thickness of the substrate can be appropriately selected, but is preferably 0.05 mm or more, and more preferably 0.2 mm or more from the viewpoint of the strength of the substrate. The upper limit of the thickness of the substrate is preferably 0.5 mm or less from the viewpoint of the thickness (depth) of the light emitting device, and 0
. More preferably, it is 4 mm or less.

(First Wiring 12, Second Wiring 13, Third Wiring 14)
The first wiring is disposed on the front of the substrate and is electrically connected to the light emitting element. The second wiring is disposed on the back surface of the substrate and is electrically connected to the first wiring through the via hole. The third wire is
It covers the inner wall of the recess and is electrically connected to the second wiring. The first wiring, the second wiring, and the third wiring can be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy of these. It may be a single layer or multiple layers of these metals or alloys. In particular, copper or a copper alloy is preferable in terms of heat dissipation. In addition, in the surface layer of the first wiring and / or the second wiring, a layer of silver, platinum, aluminum, rhodium, gold or an alloy thereof, from the viewpoint of wettability and / or light reflectivity of the conductive adhesive member, etc. May be provided.

(Via hole 15)
The via hole 15 is provided in a hole that penetrates the front surface and the back surface of the base material 11, and is a member that electrically connects the first wiring and the second wiring. The via hole 15 is constituted by the fourth wiring 151 covering the surface of the through hole of the base material, and the filling member 152 filled in the fourth wiring 151. For the fourth wiring 151, the same conductive member as the first wiring, the second wiring, and the third wiring can be used. For the filling member 152, a conductive member or an insulating member may be used.

(Insulating film 18)
The insulating film 18 is a member for securing insulation on the rear surface and preventing short circuit. The insulating film may be formed of any of those used in the relevant field. For example, a thermosetting resin or a thermoplastic resin can be mentioned.

(Light-emitting element 20)
The light emitting element 20 is a semiconductor element that emits light by applying a voltage, and a known semiconductor element formed of a nitride semiconductor or the like can be applied. As the light emitting element 20, for example, an LED
There is a chip. The light emitting device 20 comprises at least a semiconductor laminate 23 and in many cases further comprises a device substrate 24. The top view shape of the light emitting element is preferably a rectangular shape, particularly a square shape or a rectangular shape elongated in one direction, but may be another shape, for example, a hexagonal shape can also enhance the luminous efficiency. The side surface of the light emitting element may be perpendicular to the upper surface, or may be inclined inward or outward. In addition, the light emitting element has positive and negative electrodes. The positive and negative electrodes are gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten,
It can be composed of palladium, nickel or their alloys. The emission peak wavelength of the light emitting element can be selected from the ultraviolet region to the infrared region depending on the semiconductor material and the mixed crystal ratio thereof. As a semiconductor material, it is preferable to use a nitride semiconductor which is a material capable of emitting light of a short wavelength capable of efficiently exciting a wavelength conversion substance. The nitride semiconductor is mainly of the general formula In _{x
Al y Ga 1-x-y} N (0 ≦ x, 0 ≦ y, x + y ≦ 1) is represented by. The light emission peak wavelength of the light emitting element is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and more preferably 450 nm or more and 475 nm or less from the viewpoint of light emission efficiency and color mixing relationship with excitation of wavelength conversion substance and the light emission. More preferred. Besides, InAlG
An aAs-based semiconductor, an InAlGaP-based semiconductor, zinc sulfide, zinc selenide, silicon carbide or the like can also be used. The element substrate of the light emitting element is mainly a crystal growth substrate capable of growing a crystal of a semiconductor constituting the semiconductor laminate, but may be a bonding substrate joined to a semiconductor element structure separated from the crystal growth substrate. . Since the element substrate has a light transmitting property, it is easy to adopt flip chip mounting, and it is easy to enhance the light extraction efficiency. As a base material of the element substrate,
Sapphire, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphorus, indium phosphorus, zinc sulfide, zinc oxide, zinc selenide, diamond and the like can be mentioned. Among them, sapphire is preferred. The thickness of the element substrate can be appropriately selected, for example, 0
. The thickness is preferably 02 mm or more and 1 mm or less, and preferably 0.05 mm or more and 0.3 mm or less in terms of the strength of the element substrate and / or the thickness of the light emitting device.

(Transparent member 30)
The translucent member is provided on the light emitting element to protect the light emitting element. The translucent member is
It is composed of at least the following base materials. Moreover, the translucent member can be functioned as a wavelength conversion substance by containing the following wavelength conversion substances 32 in a base material.
Also in the case where the light transmitting member includes the layer containing the wavelength conversion substance and the layer substantially containing no wavelength conversion substance, the base material of each layer is configured as follows. The base material of each layer may be the same or different. However, it is not essential that the translucent member has a wavelength conversion material. Also,
The light-transmissive member may be a sintered body of a wavelength conversion substance and an inorganic substance such as alumina, or a plate crystal of the wavelength conversion substance.

(Base material 31 of translucent member)
The base material 31 of the light transmitting member may be a material having light transmitting property with respect to the light emitted from the light emitting element. Here, “translucent” means that the light transmittance at the light emission peak wavelength of the light emitting element is preferably 60% or more, more preferably 70% or more, still more preferably 80% or more Say that. As a base material of the translucent member, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin thereof can be used. It may be glass. Among them, silicone resins and modified silicone resins are preferable because they are excellent in heat resistance and light resistance. Specific silicone resins include dimethyl silicone resins, phenyl-methyl silicone resins and diphenyl silicone resins. The translucent member can be configured by forming one of these base materials in a single layer or by laminating two or more of these base materials. The "modified resin" in the present specification includes a hybrid resin.

The base material of the translucent member may contain various fillers in the resin or glass.
Examples of the filler include silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. A filler can be used individually by 1 type in these, or in combination of 2 or more types in these. In particular, silicon oxide having a small thermal expansion coefficient is preferable. In addition, by using nanoparticles as a filler, scattering of light emitted from the light emitting element is increased,
The amount of wavelength conversion substance used can also be reduced. The nanoparticles are particles having a particle size of 1 nm to 100 nm. Further, "particle size" herein, for example, it is defined by the D _50.

(Wavelength conversion substance 32)
The wavelength conversion material absorbs at least a portion of the primary light emitted by the light emitting element and emits secondary light of a wavelength different from that of the primary light. The wavelength converting substance may be one of the specific examples shown below alone.
Or it can use combining 2 or more types.

As a wavelength conversion material that emits green light, yttrium aluminum garnet phosphors (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce), lutetium aluminum garnet phosphors (for example, Lu ₃ (Al, Ga) ₅ O ₁₂ : Ce), Terbium aluminum garnet phosphor (eg Tb ₃ (Al, Ga) ₅ O ₁₂ : Ce) phosphor, silicate phosphor (eg (Ba, Sr) ₂ SiO ₄ : Eu) ), Chlorosilicate phosphors (
For example, Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu), β-sialon-based phosphor (eg, Si _6)
−z Al _z O _z N _8-z : Eu (0 <z <4.2), SGS-based phosphor (eg, SrGa)
₂ S ₄ : Eu) and the like. As a wavelength conversion substance for yellow light emission, an α-sialon-based phosphor (eg, M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0 <z ≦ 2, where M is L)
i, Mg, Ca, Y, and lanthanide elements other than La and Ce) and the like. In addition to the above-mentioned wavelength conversion substances that emit green light, there are wavelength conversion substances that emit yellow light. Further, for example, in the yttrium-aluminum-garnet-based phosphor, the emission peak wavelength can be shifted to the long wavelength side by substituting a part of Y with Gd, and yellow light emission is possible. Also,
Among these, there are also wavelength conversion substances capable of emitting orange light. As a wavelength conversion substance that emits red light, a nitrogen-containing calcium aluminosilicate (CASN or SCASN) -based phosphor (for example
Sr, Ca) AlSiN ₃ : Eu) and the like. Besides, it is a phosphor represented by a manganese-activated fluoride phosphor (general formula (I) A ₂ [M _{1 -a} Mn _a F ₆ ] (however, in the above general formula (I), A is At least one member selected from the group consisting of K, Li, Na, Rb, Cs and NH ₄ , and M is at least one member selected from the group consisting of Group 4 elements and Group 14 elements, a is 0 <a <0.2)). As a representative example of this manganese-activated fluoride phosphor, a phosphor of manganese-activated potassium fluorosilicate (
For example, K ₂ SiF ₆ : Mn).

(Covering member 40)
The light reflective covering member preferably has a light reflectance of 70% or more, more preferably 80% or more, at the light emission peak wavelength of the light emitting element from the viewpoint of the light extraction efficiency to the upper side. It is even more preferable that it is% or more. Furthermore, the covering member is preferably white. Therefore, the covering member preferably contains a white pigment in the base material. The covering member passes through a liquid state before curing. The covering member can be formed by transfer molding, injection molding, compression molding, potting or the like.

(Base material of covering member)
As a base material of the covering member, a resin can be used, and for example, a silicone resin, an epoxy resin,
A phenol resin, a polycarbonate resin, an acrylic resin, or modified resin of these is mentioned. Among them, silicone resins and modified silicone resins are excellent in heat resistance and light resistance,
preferable. Specific silicone resins include dimethyl silicone resins, phenyl-methyl silicone resins and diphenyl silicone resins. Also, the base material of the covering member is
You may contain the filler similar to the above-mentioned translucent member.

(White pigment)
White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate,
One of barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide and silicon oxide can be used alone, or two or more of these can be used in combination. The shape of the white pigment can be appropriately selected, and may be indeterminate or crushed, but is preferably spherical in terms of fluidity. Further, the particle diameter of the white pigment is, for example, about 0.1 μm or more and 0.5 μm or less, but in order to enhance the effects of light reflection and coating, the smaller the better. The content of the white pigment in the light-reflecting covering member can be selected as appropriate, but from the viewpoint of light-reflecting property and viscosity in liquid state, for example, 10 wt% to 80 wt% is preferable, 2
0 wt% or more and 70 wt% or less is more preferable, and 30 wt% or more and 60 wt% or less is even more preferable. "Wt%" is weight percent and represents the ratio of the weight of the material to the total weight of the light reflective covering member.

(Light guiding member 50)
The light guide member bonds the light emitting element and the light transmitting member, and guides the light from the light emitting element to the light transmitting member. As a base material of the light guide member, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin thereof can be mentioned. Among them, silicone resins and modified silicone resins are preferable because they are excellent in heat resistance and light resistance. Specific silicone resins include dimethyl silicone resin, phenyl-methyl silicone resin,
Diphenyl silicone resin is mentioned. Moreover, the base material of the light guide member may contain the same filler as the above-mentioned light transmitting member. Moreover, the light guide member can be omitted.

(Conductive adhesive member 60)
The conductive adhesive member is a member that electrically connects the electrode of the light emitting element and the first wiring. Conductive adhesive members include bumps of gold, silver, copper and the like, metal powders containing metal powders of silver, gold, copper, platinum, aluminum, palladium and the like and resin binders, tin-bismuth type, tin-
Any one of copper-based, tin-silver-based, gold-tin-based solder, and brazing materials such as low melting point metals can be used.

A light-emitting device according to an embodiment of the present invention includes a backlight device for a liquid crystal display, various illumination devices, a large display, various display devices such as advertisement and destination guidance, a projector device, and further, a digital video camera, a facsimile, a copier , Scanners, etc. can be used.

1000, 2000 Light Emitting Device 10 Substrate 11 Base Material 12 First Wiring 13 Second Wiring 14 Third Wiring 15 Via Hole
151 4th wiring
152 Filling member 16 hollow 18 insulating film 20 light emitting element 30 light transmitting member 40 covering member 50 light guiding member 60 conductive adhesive member

Claims (13)

A substrate having a front surface extending in a first direction and a second direction, a back surface located opposite to the front surface, a bottom surface connecting the front surface and the back surface, and a top surface located opposite the bottom surface A substrate comprising: a first wiring disposed on the front; a second wiring disposed on the back; and a via hole electrically connecting the first wiring and the second wiring;
At least one light emitting element electrically connected to the first wiring and mounted on the first wiring;
A light emitting device comprising: a light reflective covering member for covering the side surface of the light emitting element and the front surface of the substrate,
The substrate has a plurality of depressions opened in the back surface and the bottom surface,
The substrate is provided with a third wiring that covers the inner walls of the plurality of recesses and is electrically connected to the second wiring.
Each of the depths of the plurality of recesses in the front direction from the back surface is deeper on the bottom surface side than on the top surface side,
The covering member is positioned on the bottom side and the top side, and has two side surfaces along the first direction,
The light emitting device in which the side surface located on the bottom surface side and the side surface located on the upper surface side are inclined inward in the front direction from the back surface.
Light emitting device.   The light emitting device according to claim 1, wherein the recess has a maximum depth at the center of the bottom surface.   The light emitting device according to claim 1, wherein the recess has a semicircular shape on the back surface.   The light emitting device according to any one of claims 1 to 3, wherein the maximum depth of the recess is 0.4 times to 0.8 times the thickness of the substrate.   The light emitting device according to any one of claims 1 to 4, wherein the shape of each of the plurality of recesses is the same on the back surface.   The light emitting device according to any one of claims 1 to 5, wherein in the back surface, the plurality of depressions are positioned symmetrically with respect to a center line parallel to a second direction.   The light emitting device according to any one of claims 1 to 6, wherein a translucent member is located on the light emitting element.   The light emitting device according to claim 7, wherein the covering member covers a side surface of the light transmitting member.   The light emitting device according to any one of claims 1 to 8, comprising a plurality of the light emitting elements, wherein the plurality of light emitting elements are arranged side by side in a first direction.   The light emitting device according to any one of claims 1 to 9, wherein the via hole includes a fourth wiring and a filling member, and the filling member is a resin material.   The substrate according to any one of claims 1 to 10, wherein the substrate comprises a side surface located between the front surface and the back surface, and at least one of the plurality of recesses is an end recess open to the back surface, the bottom surface and the side surface. The light-emitting device according to any one of the items.   The light emitting device according to claim 11, comprising a plurality of the end depressions, wherein the end depressions are located at both ends of the base in a rear view.   The light emitting device according to any one of claims 1 to 12, wherein the plurality of depressions are separated from the via hole in a front view.

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