JP7121309B2 - light emitting device - Google Patents

Description

The present disclosure relates to light emitting devices.

Light-emitting devices using LEDs are used in various products. For example, Patent Literature 1 discloses a thin light-emitting device that can be used for a backlight device of a liquid crystal display, various lighting fixtures, and the like.

JP 2019-016766 A

An object of the present disclosure is to provide a thin light-emitting device.

A light-emitting device according to the present disclosure includes a plurality of light-emitting elements arranged side by side in a first direction, a plurality of translucent members respectively arranged on upper surfaces of the light-emitting elements, and between the plurality of translucent members. and a second covering portion arranged on both sides of the plurality of translucent members in the first direction; and a covering member positioned on the upper surface of the first covering portion , a first protrusion separated from the translucent member, and a second protrusion located on the upper surface of the second cover.

According to the light emitting device according to the present disclosure, a thin light emitting device can be obtained.

It is the schematic perspective view which looked at the light-emitting device of 1st Embodiment from the upper surface side. It is the schematic perspective view which looked at the light-emitting device of 1st Embodiment from the lower surface side. 1 is a schematic cross-sectional view showing a light emitting device according to a first embodiment; FIG. It is a schematic plan view which shows an example of the manufacturing method which concerns on 1st Embodiment. It is a schematic plan view which shows an example of the manufacturing method which concerns on 1st Embodiment. It is a schematic plan view which shows an example of the manufacturing method which concerns on 1st Embodiment. It is a schematic plan view which shows an example of the manufacturing method which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the light-emitting device of 2nd Embodiment. FIG. 10 is a schematic perspective view showing a state in which the first convex portion, the second convex portion, and the covering member are removed in the light emitting device of the second embodiment; It is a schematic side view which shows an example of the manufacturing method which concerns on 2nd Embodiment. It is a schematic side view which shows an example of the manufacturing method which concerns on 2nd Embodiment. FIG. 4A is a schematic top view showing an example of a wiring shape of a substrate of a light-emitting device according to the present disclosure; FIG. 4 is a schematic bottom view showing an example of wiring shape of a substrate of a light emitting device according to the present disclosure; FIG. 6C is a schematic perspective view showing an example of a light emitting device having the wiring shape of FIGS. 6A and 6B; FIG. 4A is a schematic top view showing an example of a wiring shape of a substrate of a light-emitting device according to the present disclosure; FIG. 4 is a schematic bottom view showing an example of wiring shape of a substrate of a light emitting device according to the present disclosure; 7B is a schematic perspective view showing an example of a light emitting device having the wiring shape of FIGS. 7A and 7B; FIG. FIG. 4A is a schematic top view showing an example of a wiring shape of a substrate of a light-emitting device according to the present disclosure; FIG. 4 is a schematic bottom view showing an example of wiring shape of a substrate of a light emitting device according to the present disclosure; FIG. 8B is a schematic perspective view showing an example of a light emitting device having the wiring shape of FIGS. 8A and 8B; FIG. 11 is a schematic perspective view showing a first modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 11 is a schematic perspective view showing a second modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 11 is a schematic perspective view showing a third modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 11 is a schematic perspective view showing a fourth modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 11 is a schematic perspective view showing a fifth modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 11 is a schematic perspective view showing a sixth modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 14 is a schematic perspective view showing a seventh modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 20 is a schematic perspective view showing an eighth modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 20 is a schematic perspective view showing a ninth modified example of the first convex portion of the light emitting device according to the present disclosure; FIG. 4 is a schematic cross-sectional view showing an example of a light-emitting device according to the present disclosure that does not include a substrate; 4 is a flow chart showing a method for manufacturing a light emitting device according to the present disclosure; 2 is an enlarged cross-sectional view of part of the light emitting device of the first embodiment; FIG.

Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. However, the embodiments described below are for embodying the technical idea of the present disclosure, and unless there is a specific description, the invention is not limited to the following. Contents described in one embodiment can also be applied to other embodiments and modifications. In addition, the drawings schematically show the embodiments, and in order to clarify the description, the scale, spacing, positional relationship, etc. of each member may be exaggerated, or the illustration of a part of the member may be omitted. be. The directions shown in the figures indicate relative positions between components and are not intended to indicate absolute positions. In principle, the same names and symbols indicate the same or homogeneous members, and detailed explanations thereof will be omitted as appropriate.

[First embodiment]
A light emitting device 100 of the first embodiment will be described with reference to FIGS. 1A, 1B, and 2. FIG.
The light emitting device 100 includes a plurality of light emitting elements 20 arranged side by side in a first direction D1, a plurality of translucent members 30 respectively arranged on the upper surfaces of the light emitting elements 20, and a plurality of light transmissive members 30. a covering member 40 including a first covering portion 41 arranged in the first direction D1 and a second covering portion 42 arranged across a plurality of translucent members 30 in the first direction D1; and an upper surface of the first covering portion 41 and is separated from the translucent member 30 ;
Each configuration of the light emitting device 100 will be described below. In addition, in a plan view of the light emitting device 100, the first direction D1 is the longitudinal direction, and the second direction D2 orthogonal to the first direction D1 is the lateral direction.

(substrate)
The substrate 10 is a member on which the light emitting element 20 is placed. The light emitting elements 20 are arranged side by side on the substrate 10 in the longitudinal direction D1. The substrate 10 includes at least a base material 11 , wiring 12 and via holes 15 . The via hole 15 includes a conductive member arranged in the through hole, and as the material of this conductive member, for example, the same metal material as that of the wiring 12 to be described later can be used.
The material of the base material 11 can be a resin such as epoxy, glass epoxy, bismaleimide triazine, or polyimide, or an insulating member such as ceramics or glass. It is preferable to use From the viewpoint of the strength of the substrate, the lower limit of the thickness of the substrate is preferably 0.05 mm or more, more preferably 0.2 mm or more. In addition, the upper limit of the thickness of the base material is preferably 0.6 mm or less, more preferably 0.5 mm or less, and 0.4 mm or less from the viewpoint of the thickness of the light-emitting device. Even more preferred. The wiring 12 is arranged on the upper and lower surfaces of the substrate 10 and serves as a path for supplying power to the light emitting element 20 . The wiring on the upper surface of the substrate 10 and the wiring on the lower surface are connected through the via holes 15 . The wiring 12 can be made of metals such as copper, iron, nickel, tungsten, chromium, aluminum, titanium, palladium, rhodium, silver, platinum, gold, or alloys thereof. Also, the wiring 12 can be formed of a single layer or multiple layers of these metals or alloys.
An insulating film 70 may be disposed on the lower surface of the substrate 10 to ensure insulation and prevent short circuits. A known resin material can be used as the material of the insulating film, and examples thereof include thermosetting resins and thermoplastic resins. Further, as shown in an example in FIG. 2B, a depression 14 for fixing to an external mounting substrate can be provided on the bottom surface of the substrate 10, and the electrode, which is the wiring 12, can be formed along the depression 14. FIG. The wiring in the recess 14 and the external mounting substrate can be electrically connected via a bonding member such as solder. Here, the wiring 12 is formed so that the wiring ends 12a to 12d are exposed at one end of the insulating film 70, as an example.

(light emitting element)
The light emitting element 20 is a semiconductor element that emits light by itself when a voltage is applied, such as an LED chip. The light emitting element 20 includes at least a semiconductor laminate 22 and has a pair of positive and negative electrodes 21 . As the semiconductor material, it is preferable to use a nitride semiconductor, which is a material capable of emitting short-wavelength light that can efficiently excite the wavelength conversion substance. Nitride semiconductors are mainly represented by the general formula InxAlyGa1 _-xyN (0≤x, _0≤y , _x +y≤1). The emission peak wavelength of the light-emitting element 20 is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and 450 nm or more and 475 nm or less, from the viewpoints of luminous efficiency, excitation of the wavelength conversion substance, color mixing relationship with light emission, and the like. much more preferable. InAlGaAs-based semiconductors, InAlGaP-based semiconductors, and the like can also be used as semiconductor materials.

(translucent member)
The translucent member 30 is a member that is arranged on each of the light emitting elements 20 and protects the light emitting elements 20 . Moreover, the translucent member 30 can contain the wavelength conversion substance 32 in the translucent base material 31 . The material of the base material 31 of the translucent member is, for example, resin such as silicone, epoxy, phenol, polycarbonate, or acrylic, or glass. The base material 31 of the translucent member may contain filler such as silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide. The light-transmitting member can be composed of a single layer of one of these base materials, or a laminate of two or more of these base materials.
The translucent member 30 may be arranged via the light-guiding adhesive member 60 . The light-guiding adhesive member 60 is a member that adheres the light-emitting element 20 and the translucent member 30 together and guides the light from the light-emitting element 20 to the translucent member 30 . The material of the light-guiding adhesive member 60 is, for example, silicone resin, and may contain the same filler as the base material 31 of the light-transmitting member. It should be noted that the filler of the light-guiding adhesive member 60 may be the above-described inorganic substance or organic substance. Moreover, one type of filler may be used, or a combination of two or more types may be used. Examples of organic fillers that can be used include resins such as epoxy resins, silicone resins, and amorphous fluororesins.

The wavelength conversion substance 32 is a member that absorbs at least part of the primary light emitted by the light emitting element 20 and emits secondary light with a wavelength different from that of the primary light. As the wavelength conversion substance 32, for example, yttrium-aluminum-garnet-based phosphor (eg, Y3 ₍ Al, Ga) _5O12 :Ce), lutetium-aluminum-garnet-based phosphor (eg, _{Lu3 (} Al, Ga) ₅ O ₁₂ :Ce), terbium-aluminum-garnet-based phosphors (e.g., Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce), β-sialon phosphors (e.g., (Si, Al) ₃ (O, N) ₄ :Eu), an α-sialon phosphor (for example, M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0<z≦2, M is Li, Mg, Ca, Y, and Lanthanide elements excluding La and Ce)), nitride phosphors such as CASN phosphors (e.g. CaAlSiN ₃ :Eu) or SCASN phosphors (e.g. (Sr, Ca)AlSiN ₃ :Eu), KSF phosphors Fluoride-based phosphors such as phosphors (eg, K ₂ SiF ₆ :Mn) or MGF-based phosphors (eg, 3.5MgO·0.5MgF ₂ ·GeO ₂ :Mn), CCA-based phosphors (eg, ( Ca, Sr) ₁₀ (PO ₄ ) ₆ Cl ₂ :Eu), or a quantum dot phosphor or the like can be used. Also, the wavelength conversion substance 32 can use one of these phosphors alone or a combination of two or more of these phosphors.

(coating member)
The covering member 40 is a member that covers and protects the upper surface of the substrate 10 and the side surfaces of the light emitting elements 20 and the translucent member 30 . A first covering portion 41 of the covering member 40 indicates a portion located between adjacent translucent members 30 in the longitudinal direction D1. The second covering portion 42 indicates a portion located outside the translucent member 30 (on the side opposite to the side on which the first covering portion 41 is located) in the longitudinal direction D1. The width of the first covering portion 41 and the second covering portion 42 in the lateral direction D2 is the same as the width of the light emitting device 100 . A first convex portion 51 is arranged on the first covering portion 41 , and a second convex portion 52 is arranged on the second covering portion 42 .

The covering member 40 preferably has light reflectivity in order to extract the light from the light emitting element 20 to the upper surface side. It is more preferably 80% or more, and even more preferably 90% or more. Moreover, the covering member 40 is preferably white, and the base material of the covering member 40 preferably contains a white pigment such as titanium oxide or magnesium oxide. Examples of the base material of the covering member 40 include resins such as silicone, epoxy, phenol, polycarbonate, and acrylic, or modified resins thereof. Also, the base material of the covering member 40 may contain the same filler as the base material 31 of the translucent member.

(First convex portion and second convex portion)
The first projecting portion 51 and the second projecting portion 52 are members arranged on the upper surface of the covering member 40 to prevent contact between the upper surface of the translucent member 30 and other external components. The other external parts and the like are, for example, a light guide plate for backlight. The first convex portion 51 is arranged on the upper surface of the first covering portion 41 and is separated from the translucent member 30 by a gap G1. The second convex portion 52 is arranged on the upper surface of the second covering portion 42 . The second convex portion 52 may be separated from the translucent member 30 by a gap G1, like the first convex portion 51, or may be separated by a gap different from the gap G1. In addition, the second convex portion 52 may be in contact with the upper surface of the translucent member 30, which can further prevent the translucent member 30 from coming into contact with other external parts and the like and being damaged.

The sizes of the first convex portion 51 and the second convex portion 52 can be adjusted according to the size of the light emitting device 100, the pressure applied to the upper surface of the light emitting device 100, the material of other external parts, and the like. As an example, the heights H1 and H2 of the first convex portion 51 and the second convex portion 52 from the upper surface of the first covering portion 41 are set to 10 μm to 100 μm, respectively. The light-emitting device 100 includes the first convex portion 51 and the second convex portion 52 to prevent the translucent member 30 from directly contacting other external components, particularly the light guide plate. to prevent damage to the Furthermore, by securing an air layer of at least 10 μm between the translucent member 30 and the light guide plate, a light dispersion effect can be obtained at the light entrance portion of the light guide plate. If the air layer is too large, such as several hundreds of micrometers, the output of the backlight decreases. Therefore, the heights H1 and H2 are preferably 10 μm to 100 μm, more preferably 20 μm to 50 μm. In the longitudinal direction D1 of the light emitting device 100, for example, the width of the upper surface of the first covering portion 41 is set to 470 μm to 530 μm, the width of the upper surface of the second covering portion 42 is set to 70 μm to 130 μm, and the width of the upper surface of the translucent member 30 is set to They are 1.2 mm to 1.26 mm, respectively. In this case, the interval G1 is preferably 10 μm to 125 μm, more preferably 50 μm to 100 μm. As a result, the influence of the first projections 51 on the light extracted from the upper surface of the translucent member 30 can be suppressed, and the light distribution characteristics of the light emitting device 100 can be maintained well.

A cross section of the first convex portion 51 in the longitudinal direction D1 is formed in a semicircular shape. For this reason, the first convex portion 51 has a curved upper surface, that is, the upper surface in a cross-sectional view is arcuate and has no sharp portion. 51 is hard to be damaged. The term "semicircular" refers to a shape in which the upper portion is a convex curve and the lower portion is a straight line, and includes, for example, those whose upper portion is a part of an arc, an ellipse, a parabola, or the like. The first convex portion 51 has a rectangular shape in a plan view, and is formed to extend to the edge of the upper surface of the first covering portion 41 in the lateral direction D2. Therefore, it is possible to reduce the inclination of the light emitting surface of the light emitting device 100 (the upper surface of the translucent member 30) with respect to the light incident surface of the light guide plate. In addition, since the first convex portion 51 and the second convex portion 52 are made of the same material as the covering member 40, it is possible to increase the adhesion force with the covering member 40. Detachment from the covering member 40 can be suppressed. However, the first convex portion 51 and the second convex portion 52 preferably have higher rigidity than the covering member 40 in order to strengthen contact resistance with other external components. For example, the rigidity can be increased by including titanium oxide or the like as a reinforcing material in the first protrusions 51 and the second protrusions 52 . The content of the reinforcing material is preferably 10 wt % to 60 wt %, more preferably 30 wt % to 40 wt %. When phenylsilicone resin is used for the coating member 40 in consideration of reliability, the first protrusions 51 and the second protrusions 52 are made of the same type of silicone resin as the coating member 40, for example, It is preferable to use a high-strength modified silicone resin with good adhesion. As a result, the strength of the resin used for the first convex portion 51 and the second convex portion 52 can be two to three times the strength of the resin used for the covering member 40. The 51 and the second protrusion 52 can have higher rigidity than the covering member 40 . In addition, stiffness can be measured by a tensile test. Further, although the first convex portion 51 and the second convex portion 52 are formed separately from the covering member 40 in this embodiment, they may be the same member integrally formed with the covering member 40. .

The light-emitting device 100 includes the first convex portion 51 and the second convex portion 52, so that the first convex portion 51 is separated from the translucent member 30 while suppressing contact between the light-emitting surface and other external components. By doing so, it is possible to realize a light-emitting device with a thin and narrow frame that can suppress the influence on light extraction and maintain good light distribution characteristics.

[Manufacturing Method of Light Emitting Device of First Embodiment]
Next, a method for manufacturing the light emitting device 100 will be described with reference to FIGS. 2 to 3D and 11. FIG.
The method for manufacturing the light-emitting device 100 includes a step S11 of arranging a plurality of light-emitting elements 20 on the upper surface of the substrate 1000 before singulation in a row direction D3 and a column direction D4 orthogonal to the row direction D3; step S12 of placing the translucent member 30 on the upper surface of the substrate 1000; step S13 of forming the covering member 400 covering the upper surface of the substrate 1000 and the side surfaces of the light emitting element 20 and the translucent member 30; step S14 of forming the convex portion 500, and the substrate 1000, the covering member 400, and the convex portion 500 are arranged in the row direction D3 or the column direction D4 for each division unit P1 of the predetermined light emitting elements 20 and the translucent member 30. and a singulation step S15 of cutting along the cutting surface. In the step S14 of forming the projections 500, the first projections 510 that are not cut along the line direction D4 and the second projections 520 that are cut along the line direction D4 are formed. The portion 510 is formed apart from the translucent member 30 .
Each step of the method for manufacturing the light emitting device 100 will be described below. Here, the first convex portion 510 and the second convex portion 520 refer to those before singulation. Further, the row direction D3 is the longitudinal direction D1 of the light emitting device 100 after singulation, and the column direction D4 is the width direction D2 of the light emitting device 100 after singulation.

(Process of arranging light-emitting elements side by side)
First, as shown in FIG. 3A, a plurality of light emitting elements 20 are arranged side by side in the row direction D3 and the column direction D4 on the upper surface of the substrate 1000 before singulation. Wirings that become the wirings 12 shown in FIG. FIG. 3A shows a portion of the substrate 1000 and omits the wiring. A pair of positive and negative electrodes 21 of the light emitting element 20 are electrically connected to wiring on the upper surface of the substrate 1000 by a conductive adhesive member. The conductive adhesive member includes, for example, bumps of gold, silver, copper, etc., conductive pastes containing metal powders of gold, silver, copper, platinum, aluminum, etc. and resin binders, tin-silver-copper (SAC)-based and tin-bismuth (SnBi) solder.

(Step of Arranging Translucent Member)
Subsequently, the translucent member 30 is arranged on the upper surface of each of the light emitting elements 20 . The light-transmitting member 30 is arranged, for example, by bonding a light-transmitting member 30 formed in advance to a size that covers the top surface of one light emitting element 20 to the top surface of each light emitting element 20 . The translucent member 30 can be adhered to the light-emitting element 20 via the light-guiding adhesive member 60 .

(Step of forming covering member)
Subsequently, a covering member 400 covering the upper surface of the substrate 1000 and the side surfaces of the light emitting elements 20 and the translucent member 30 is formed. FIG. 3B shows an intermediate body in which the light emitting element 20 and the translucent member 30 are arranged on the upper surface of the substrate 1000 and the covering member 400 is formed. The covering member 400 may be formed to a height that covers the entire translucent member 30, and the upper surface of the translucent member 30 may be exposed by grinding or the like. In addition, it is preferable to include a polishing step for flattening the upper surfaces of the translucent member 30 and the covering member 400 before the step S14 of forming convex portions, which will be described later.

(Step of forming convex portion)
Subsequently, as shown in FIG. 3C, a convex portion 500 is formed on the top surface of the covering member 400 . The convex portions 500 are formed using a mask having openings of the shape of the convex portions 500 in plan view between the adjacent translucent members 30 . The projections 500 are formed by using a mask, for example, by printing an uncured resin material, or by jetting or spraying an uncured resin material. An example of a mask M1 with openings F1 is shown in FIG. 3D.
In the step S14 of forming the convex portions 500, the first convex portions 510 and the second convex portions 520 before singulation are formed. In the singulated light emitting device 100, the first convex portion 510 formed in the region 41A to be the first covering portion 41 is not cut along the column direction D4 in the singulation step S15. The second convex portion 520 formed in the region 42A to be the second covering portion 42 in the singulated light emitting device 100 is cut along the column direction D4 in the singulation step S15.

The first protrusion 510 is formed apart from the translucent member 30 . The second convex portion 520 is formed in a symmetrical shape with respect to the cross section in the column direction D4. In addition, as shown in FIG. 3C, the apexes of the second protrusions 520 and the first protrusions 510 are formed linearly along the column direction D4.
By forming in this way, in the light-emitting device 100 after singulation, the first protrusions 51 can be separated from each other without covering the translucent member 30 . In addition, in the light emitting device 100 after singulation, the second convex portions 52 can have the same shape.
The convex portion 500 can be formed, for example, by placing an uncured resin material and then curing it.

(Singulation process)
Subsequently, the substrate 1000, the covering member 400, and the convex portion 500 before singulation are cut in the row direction D3 or the column direction D4 for each division unit P1 of the predetermined light emitting elements 20 and the translucent members 30. Cut into individual pieces. Cutting can be performed, for example, by a rotary blade or laser.
A step of grinding the side surface of the translucent member 30 may be provided before the step of forming the covering member. The thickness of the covering member can be ensured by grinding the side surface of the translucent member 30 to adjust the position and angle of the side surface with respect to the unit P1 of the division set in advance, and by flattening the side surface.

[Second embodiment]
Next, the light emitting device 200 of the second embodiment will be described with reference to FIGS. 4 and 5A to 5C. As shown in FIG. 4, the light emitting device 200 differs from the light emitting device 100 of the first embodiment in the shapes of the translucent member and the covering member.
The translucent member 30A of the light-emitting device 200 has stepped portions 301 at both ends thereof at least in the cross section in the longitudinal direction D1. The stepped portion 301 is a portion formed with a thin thickness of the translucent member 30A. By having the stepped portion 301, in the cross section of the translucent member 30A in the longitudinal direction D1, the upper surface side has a narrower width and the lower surface side has a wider width. Note that the translucent member 30A may also have a stepped portion in the cross section in the lateral direction D2 as well. In other words, the translucent member 30A may have a stepped portion that continues along the entire circumference of the side surface. In addition, it is preferable that the surface roughness of the side surfaces at the wide width portion on the lower surface side of the side surfaces at both ends in the longitudinal direction D1 of the translucent member 30A is larger than the surface roughness of the side surface at the narrow width portion on the upper surface side.

The first convex portion 51 and the second convex portion 52 are arranged apart from the translucent member 30A. The separation width between the first convex portion 51 and the translucent member 30A may be different from the separation width between the second convex portion 52 and the translucent member 30A. Alternatively, only the first convex portion 51 may be separated from the translucent member 30A. Moreover, it is preferable that at least a part of the first convex portion 51 and the second convex portion 52 overlaps the stepped portion 301 in plan view.

The translucent member 30A has the stepped portion 301 at the end portion in the longitudinal direction D1 where thermal stress is more likely to occur than at the end portion in the lateral direction D2, so that separation from the covering member 40 can be effectively suppressed. Moreover, since the translucent member 30</b>A has a large surface roughness on the side surface of the stepped portion 301 , peeling from the covering member 40 can be further suppressed. Since the first convex portion 51 and the second convex portion 52 overlap the stepped portion 301 in plan view, the covering member 40 is reinforced, and peeling of the translucent member 30A can be further suppressed.

The stepped portion 301 of the translucent member 30A may be formed before placing the translucent member on the upper surface of the light emitting element 20, or may be formed after placing the translucent member on the upper surface of the light emitting element 20. good.
The stepped portion 301 can be formed by grinding the side surface of the translucent member. For grinding, for example, a disk-shaped rotary blade can be used. For example, as shown in FIG. 5B, the stepped portion may be formed by cutting a portion of the upper surface side of each of the side surfaces at both ends of the translucent member using a disk-shaped rotary blade B1. Further, as an example is shown in FIG. 5C, the sheet-like translucent member 30B may be ground or cut using two types of disk-like rotary blades B2 and B3 having different thicknesses. In the example shown in FIG. 5C, the thick rotary blade B2 forms a recess in the sheet-like translucent member 30B, and the thin rotary blade B3 separates the translucent member at the bottom surface of the formed recess, thereby forming a line direction D4. In cross section, a stepped portion is formed at the end of the translucent member 30B.

(Example of wiring shape)
The wiring 12 arranged on the upper and lower surfaces of the substrate 10 can have various shapes according to the application and manufacturing method of the light emitting device. Here are some examples:
As shown in FIGS. 6A to 6C, the light emitting device 101 has six wirings exposed on its side surface. That is, on one short side surface, the wiring 121a is exposed from the covering member 40 on the upper surface of the substrate 10, and the wiring 121c is exposed from the insulating film 70 on the lower surface of the substrate 10. FIG. The wirings 121a and 121c are electrically connected through the via hole 151a. The same applies to the other short side surface. Also, the wiring 121b is exposed from one of the insulating films 70 on the bottom surface of the substrate 10 on one long side surface. The same applies to the other long side surface.
As shown in FIGS. 7A to 7C, the light emitting device 102 has six wirings exposed on its side surface. That is, on one short side surface, the wiring 122a is exposed from the covering member 40 on the upper surface of the substrate 10, and the wiring 122d is exposed from the insulating film 70 on the lower surface of the substrate 10. FIG. The wirings 122a and 122d are electrically connected through the via hole 152a. The same applies to the other short side surface. Also, wirings 122b and 122c are exposed from two of the insulating film 70 on the bottom surface of the substrate 10 on one long side surface. The wirings 122b and 122c are conducted by the wiring 12 on the bottom surface of the substrate 10. FIG.
As shown in FIGS. 8A to 8C, the light emitting device 103 has six wirings exposed on its side surface. That is, the wiring 123b is exposed from the covering member 40 on the upper surface of the substrate 10, and the wiring 123c is exposed from the insulating film 70 on the lower surface of the substrate 10, on one short side surface. The wirings 123b and 123c are electrically connected through the via hole 153a. The same applies to the other short side surface. Also, the wiring 123a is exposed from the covering member 40 on the upper surface of the substrate 10 on one long side surface. The same applies to the other long side surface.
The examples of wiring shapes in FIGS. 6A to 8C can be applied to each embodiment and each modified example in which the shape of the first convex portion is modified. A side surface of the light emitting device may face an external conductive component such as metal. In such a case, the wiring 12 portion leading to the positive electrode and the wiring 12 portion leading to the negative electrode of the light emitting element 20 are not exposed on the same side surface of the light emitting device, thereby further avoiding the risk of short circuit.

[Modification]
(Example without substrate)
The light-emitting device may not have a substrate like the light-emitting device 300 shown in FIG. Light emitting device 300 is miniaturized because it does not include a substrate. Wiring to the light emitting element 20 without a substrate can be performed by forming a conductive film 16 facing the element electrode 21 of the light emitting element 20, for example. The light-emitting device 300 can be stably fixed to an external mounting substrate using, for example, the surface on which the conductive film 16 is arranged as a mounting surface.

(Modified example of first convex shape)
The shape of the first convex portion 51 can be adjusted according to the shape and properties of other external components that the light emitting device faces. Modified examples of the shape of the first projection 51 will be described with reference to FIGS. 9A to 9I.

(First modification)
As shown in FIG. 9A, in the light emitting device 100A, the cross section of the first projection 51 in the second direction D2 may be formed in a semicircular shape. Also, the second convex portion 52 may have the same shape as that already described. Since the first convex portion 51 of the light emitting device 100A has a semicircular cross section, the upper surface thereof has a curved surface, so that the first convex portion 51 is less likely to be damaged when it comes into contact with other external components or the like.

(Second modification)
As shown in FIG. 9B, in the light emitting device 100B, the cross section of the first projection 51 in the first direction D1 may be trapezoidal. If the upper surface of the first convex portion 51 is flat, it can face other external parts or the like. The second convex portion 52 may also have a trapezoidal cross section in the first direction D1. Further, the upper surfaces of the first convex portion 51 and the second convex portion 52 may be on the same plane.

(Third modification)
As shown in FIG. 9C, in the light emitting device 100C, the first convex portion 51 may have a circular shape in plan view, and may have a shape that forms part of a sphere. Since the first convex portion 51 has a circular shape in a plan view, the outer edge of the first convex portion 51 does not have unevenness in a plan view and is less likely to be damaged. The second protrusion 52 may have the same shape as already described. Since the first convex portion 51 of the light emitting device 100C is shaped like a part of a sphere, the upper surface of the first convex portion 51 has a curved surface, and the first convex portion 51 is damaged when it comes into contact with other external components. hard to do.

The width of the first convex portion 51 is preferably wider than the width of the translucent member 30 in the second direction (transverse direction) D2. Since the width of the first convex portion 51 in the lateral direction D2 is wider than the width of the translucent member 30, the force exerted on the first convex portion 51 by other external components or the like is dispersed over a wide range. Therefore, the covering member 40 can suppress deformation in the vicinity of the translucent member 30 .

(Modified example in which the first protrusion includes the first portion and the second portion)
The first convex portion may include a first portion and a second portion, depending on the shape and properties of other external components that the light emitting device faces. Next, some examples of the first protrusions including the first portion and the second portion are shown. The configurations that have already been described are given the same reference numerals, and the description thereof is omitted. Note that the grooves shown in each modification may be formed using a mask provided with an opening shape for forming the grooves. Further, the grooves having the shape shown in each modified example may be formed by grinding after forming the first convex portion having no groove.

(Fourth modification)
As shown in FIG. 9D, in the light emitting device 100D, the first convex portion 51D includes a first portion and a second portion arranged in the first direction D1 via the groove Md. The distance between the first portion and the second portion (the width of the groove Md) is preferably 15 μm or more and 100 μm or less, more preferably 30 μm or more and 50 μm or less. The first portion and the second portion are formed in a flattened quadrant shape in cross section in the first direction D1, and the vertical surfaces face each other.

(Fifth modification)
As shown in FIG. 9E, in the light emitting device 100E, the first convex portion 51E includes a first portion and a second portion arranged in the first direction D1 with the groove Me therebetween. Sections of the portions in the first direction D1 are each formed in a semicircular shape. The distance between the first portion and the second portion (the width of the groove Me) is preferably 30 μm or more and 100 μm or less, more preferably 50 μm or more and 80 μm or less.

(Sixth modification)
As shown in FIG. 9F, in the light emitting device 100F, the first convex portion 51F includes a first portion and a second portion arranged in the first direction D1 via the groove Mf. Each portion has a rectangular cross section in the first direction D1 and a semicircular cross section in the second direction D2. The distance between the first portion and the second portion (the width of the groove Mf) is preferably 15 μm or more and 100 μm or less, more preferably 30 μm or more and 50 μm or less.

(7th to 9th Modifications)
As shown in FIGS. 9G to 9I, in the light emitting devices 100G to 100I, the installation directions of the first projections 51D to 51F described in the fourth to sixth modifications are changed by 90 degrees, and the first projections 51G to 51I. Therefore, the first portion and the second portion of the first convex portion 51G are formed in a quadrant shape with a flattened cross section in the second direction D2, and the vertical surfaces face each other. In addition, the first portion and the second portion of the first convex portion 51H are each formed to have a semicircular cross section in the second direction D2. In addition, the first portion and the second portion of the first convex portion 51I are each formed to have a semicircular cross section in the first direction D1.

In the light emitting devices 100D to 100I, the first protrusion is separated from the first portion and the second portion by the groove, but the groove may have a depth that does not completely separate the first protrusion. The groove may be formed deeper than the upper surface of the covering member 40, or may have a depth that penetrates the covering member 40 and exposes the upper surface of the substrate 10. FIG.
By separating the first convex portion into the first portion and the second portion, the volume of each of the first portion and the second portion can be made close to the volume of the second convex portion 52 . Therefore, the height uniformity during thermal expansion is improved. Further, by providing grooves in advance, it is possible to reduce the risk of resin cracking in the first convex portion at high temperatures. Since the first protrusion includes the first portion and the second portion, it is possible to adjust the range and position in which the first protrusion is in contact with other external components or the like. Note that the first portion and the second portion may be arranged in a direction other than the first direction D1 or the second direction D2.

The first portion and the second portion aligned in the second direction D2 may be arranged outside the upper surface of the translucent member 30 in the second direction D2. Thereby, the first convex portion can further suppress the influence on light extraction. Further, by widening the distance between the ridgeline of the first portion and the ridgeline of the second portion, the first convex portion can more stably support other external components.

(Modified example of light-guiding adhesive member)
When the light-transmitting member 30 is arranged on the light-emitting element 20 via the light-guiding adhesive member 60, the above-described The light emitting devices according to the embodiments and modifications can obtain a larger luminous flux while maintaining thinness. A modification in which the light-guiding adhesive member 60 contains the filler 62 will be described below.

As shown in FIG. 2 , the light-guiding adhesive member 60 is provided on the side surface of the light-emitting element 20 , and the covering member 40 is arranged in contact with the light-transmitting member 30 . FIG. 12 shows an enlarged cross-sectional view of the vicinity of the side surface of the light emitting element 20. As shown in FIG. A part of the light emitted from the side surface 26 of the light emitting element 20 is reflected by the covering member 40 like the light L1. However, the light that is not reflected by the covering member 40 and passes through the covering member 40 like the light L3 does not contribute to the luminous flux extracted from the upper surface side of the light emitting device. Like the light L2, light is scattered by the filler 62 contained in the light-guiding adhesive member 60 to reduce the light that passes through the covering member 40 and increase the light that contributes to the luminous flux extracted from the upper surface side of the light emitting device. can be done.

The light-guiding adhesive member 60 provided on the side surface 26 of the light emitting element 20 extends from the periphery of the lower surface 35 of the translucent member 30 to the side surface 26 of the light emitting element 20, as shown in FIG. is preferred. At this time, the surface 45 of the covering member 40 in contact with the light-guiding adhesive member 60 forms an acute angle with the lower surface 35 of the translucent member 30 . Therefore, the covering member 40 can efficiently reflect the light emitted from the side surface 26 of the light emitting element 20 toward the translucent member 30 . When viewed in cross-section, the shape of the light-guiding adhesive member 60 has a substantially inverted triangular shape, as shown in FIGS. 2 and 12 .

The light-guiding adhesive member 60 contains a filler 62 of organic particles dispersed in a base material 61 here. From the viewpoint of heat resistance and light resistance, the organic particle filler 62 is preferably a silicone resin having a refractive index of 1.35 or more and 1.55 or less. Further, as a viscosity modifier, for example, nanosilica having a particle size of less than 100 nm or zirconium oxide may be added.
As the base material 61, an epoxy resin, a silicone resin, a modified resin thereof, or a hybrid resin thereof is preferable because of its excellent translucency. In particular, a silicone resin having a refractive index of 1.45 or more and 1.60 or less is preferable.
By increasing the difference between the refractive index of the light-guiding adhesive member 60 and the refractive index of the covering member 40 , light can be efficiently reflected even at the interface between the light-guiding adhesive member 60 and the covering member 40 .

If the particle size of the filler 62 is small, it tends to aggregate due to capillary force. end up For this reason, the filler 62 of organic particles preferably has an average particle size of 0.5 μm or more and 1.2 μm or less. Since the particle size of the organic particle filler 62 is larger than that of the viscosity modifier, even if the filler 62 is contained in the light-guiding adhesive member 60, the viscosity does not easily increase. In addition, Rayleigh scattering occurs in the case of particles having a small particle diameter such as the viscosity modifier, but Mie scattering occurs in the filler 62 of organic particles, and the light from the light emitting element 20 is diffused efficiently. Further, in order to make the dispersibility of the filler 62 uniform, it is preferable that the particle size of the filler 62 is uniform as much as possible. More preferably, particles having a particle size of 0.3 μm or more and 2.0 μm or less account for 85% by volume or more. In particular, it is preferable that the number of fillers 62 having a large particle size is small, and that the number of fillers 62 having a particle size of 2.5 μm or more is preferably 4% by volume or less. In addition, volume % here is a ratio of the volume of the filler of the particle size with respect to the volume of the whole filler. Also, the particle size of the filler 62 can be obtained by, for example, an electrical resistance method.

Further, when the absolute value of the difference between the refractive index of the filler 62 and the refractive index of the base material 61 is small, the light scattered by the filler 62 becomes weak. Therefore, it is preferable that the absolute value of the difference between the refractive index of the filler 62 of organic particles and the refractive index of the base material 61 is 0.05 or more. Since the refractive index of the base material 61 and the refractive index of the filler 62 are separated, light can be efficiently scattered.

By including the filler 62 in the light-guiding adhesive member 60 provided on the side surface 26 of the light emitting element 20, the light emitted from the side surface 26 of the light emitting element 20 can be scattered and coated regardless of the number of the light emitting elements 20. It is possible to reduce the amount of light transmitted through the member 40 and increase the luminous flux extracted from the upper surface side of the light emitting device. Including the filler 62 in the light-guiding adhesive member 60 does not affect the thinness of the light-emitting device. Therefore, the light emitting device can obtain a larger luminous flux while maintaining its thinness.

The manufacturing method of the light-emitting device in which the filler 62 is contained in the light-guiding adhesive member 60 is the same as the manufacturing method of each of the already described embodiments and modifications. Here, points related to the light-guiding adhesive member 60 will be described.
The light-guiding adhesive member 60 is manufactured by adding a filler 62 to a base material 61 and stirring the mixture. The filler 62 can be dispersed in the base material 61 by stirring. The fillers 62 are preferably dispersed in the base material 61 in order to scatter light efficiently. If the filler 62 having a specific gravity close to that of the base material 61 is used, the dispersed state of the filler 62 in the base material 61 can be maintained.
Then, in step S<b>12 of arranging the light-transmitting member, the light-transmitting member 30 is pressed against the light emitting element 20 via the light-guiding adhesive member 60 , so that the light-transmitting member 60 adheres to the lower surface of the light-transmitting member 30 . It is possible to form a light-guiding adhesive member 60 that wets and spreads from the peripheral edge of 35 to the side surface 26 of the light emitting element 20 and presents a substantially inverted triangular cross section. Incidentally, the oblique side of the substantially inverted triangle in the cross section may be formed so as to be curved or formed substantially straight.

[Example]
An example of a light-emitting device in which a filler 62 is contained in the light-guiding adhesive member 60 will be described below.
Phenyl silicone resin with a refractive index of 1.54 is used as the base material 61 of the light-guiding adhesive member 60, silicone resin particles with a refractive index of 1.43 are used as the filler 62, and the silicone resin of the light-guiding adhesive member 60 is used. Examples 1 to 3 were prepared with different particle contents. The absolute value of the difference between the refractive index of the base material 61 and the refractive index of the filler 62 is 0.11.
In addition, the average particle diameter of the filler 62 is 0.8 μm, and the filler 62 has a particle diameter of 2.5 μm or more at 4 vol % or less, and a particle diameter of 0.3 μm or more and 2.0 μm or less at 80 vol % or more. meets The particle size can be measured by an electrical resistance method, and the average particle size is the average value.
A light-emitting device manufactured in the same manner as in Example 1, except that it did not contain silicone resin particles, was used as a comparative example.

These evaluation results are shown in Table 1. The scattered light value is a value calculated by 100−(linear transmittance/total light transmittance×100).

From Table 1, there was a tendency that when the content of the silicone resin particles was increased, the scattered light became stronger and the luminous flux of the light emitting device increased. Moreover, even if the base material 61 contained silicone resin particles, the total light transmittance did not decrease significantly. When the content of the organic particle filler 62 is increased, the viscosity of the light-guiding adhesive member 60 increases, making it difficult to handle, and the total light transmittance of the light-guiding adhesive member 60 tends to decrease. Therefore, the content of the organic particles (silicone resin particles) is preferably 0.01% by weight or more and 2.0% by weight or less, and more preferably 0.05% by weight or more and 0.5% by weight or less. . The weight percentage is the ratio of the mass of the filler to the mass of the base material.

It was confirmed that the luminous flux can be increased while maintaining the thinness of the light-emitting device by including the filler 62 whose particle size and refractive index are adjusted in the light-guiding adhesive member 60 . Even when an inorganic filler is used as the filler 62, if the particle size and refractive index are approximately the same as those of the silicone resin particles, it is considered to have the same effect of increasing the luminous flux.

REFERENCE SIGNS LIST 10 substrate 11 base material of substrate 12 wiring of substrate 16 conductive film 20 light emitting element 21 electrode of light emitting element 22 semiconductor laminate of light emitting element 30, 30A translucent member 31 base material of translucent member 32 wavelength conversion substance 40 coating Member 41 First Covering Part 42 Second Covering Part 51 First Projection 52 Second Projection 60 Light Guide Adhesive Member 62 Filler 70 Insulating Film 100 Light Emitting Device According to First Embodiment 200 Light Emitting Device According to Second Embodiment 301 Transparent Stepped portion of optical member 400 Coating member before singulation 500 Convex portion before singulation 1000 Substrate before singulation B1, B2, B3 Disk-shaped rotary blades D1, D2 Direction in light emitting device D3, D4 Direction on the substrate before separation G1 Distance between the translucent member and the first convex portion on the upper surface of the light emitting device M1 Mask F1 Example of mask opening P1 Unit of division set in advance

Claims (21)

a plurality of light emitting elements arranged side by side in a first direction;
a plurality of translucent members respectively arranged on the upper surface of the light emitting element;
a covering member including a first covering portion arranged between the plurality of translucent members and a second covering portion arranged with the plurality of translucent members interposed in the first direction;
a first convex portion located on the upper surface of the first covering portion and separated from the translucent member;
A second convex portion located on the upper surface of the second covering portion ,
The light emitting device , wherein the first convex portion and the second convex portion have higher rigidity than the covering member . a plurality of light emitting elements arranged side by side in a first direction;
a plurality of translucent members respectively arranged on the upper surface of the light emitting element;
a covering member including a first covering portion arranged between the plurality of translucent members and a second covering portion arranged with the plurality of translucent members interposed in the first direction;
a first convex portion located on the upper surface of the first covering portion and separated from the translucent member;
A second convex portion located on the upper surface of the second covering portion,
The first convex portion includes a first portion and a second portion,
The first portion and the second portion are arranged in the first direction,
The light emitting device, wherein the first portion and the second portion are formed in a flattened quadrant shape in cross section in the first direction, and have vertical surfaces facing each other. a plurality of light emitting elements arranged side by side in a first direction;
a plurality of translucent members respectively arranged on the upper surface of the light emitting element;
a covering member including a first covering portion arranged between the plurality of translucent members and a second covering portion arranged with the plurality of translucent members interposed in the first direction;
a first convex portion located on the upper surface of the first covering portion and separated from the translucent member;
A second convex portion located on the upper surface of the second covering portion,
The first convex portion includes a first portion and a second portion,
The first portion and the second portion are arranged in the first direction,
The light-emitting device, wherein cross sections of the first portion and the second portion in the first direction are each formed in a semicircular shape. 4. The light emitting device according to claim 2 , wherein the first protrusion and the second protrusion are made of the same material as the covering member. 4. The light-emitting device according to claim 2 , wherein the first convex portion and the second convex portion have higher rigidity than the covering member. The light emitting device according to any one of claims 1 to 3, wherein the first convex portion has a rectangular shape in plan view. The light emitting device according to any one of claims 1 to 3, wherein the first convex portion has a circular shape in plan view. 2. The light emitting device according to claim 1 , wherein the first projection has a semicircular cross section in the first direction. 2. The light-emitting device according to claim 1 , wherein a cross section of said first protrusion in a second direction perpendicular to said first direction is formed in a semicircular shape. 2. The light emitting device according to claim 1 , wherein a cross section of said first projection in said first direction is trapezoidal. The light emitting device according to any one of claims 1 to 8, wherein the width of the first protrusion is wider than the width of the translucent member in a second direction orthogonal to the first direction. The light emitting device according to any one of claims 1 to 9, wherein the first convex portion extends to an edge of the upper surface of the first covering portion in a second direction orthogonal to the first direction. The first convex portion includes a first portion and a second portion,
The light emitting device according to claim 1 , wherein the first portion and the second portion are arranged in the first direction. The first convex portion includes a first portion and a second portion,
The light emitting device according to claim 1 , wherein the first portion and the second portion are arranged in a second direction orthogonal to the first direction. 14. The light emitting device according to claim 13 , wherein the first portion and the second portion are formed in a flattened quadrant shape in cross section in the first direction, and the vertical surfaces face each other. 14. The light emitting device according to claim 13 , wherein each of the first portion and the second portion has a semicircular cross-section in the first direction. 14. The light-emitting device according to claim 13 , wherein cross sections of said first portion and said second portion in a second direction orthogonal to said first direction are each formed in a semicircular shape. 15. The light emitting device according to claim 14 , wherein the first portion and the second portion are formed in a flattened quadrant shape in cross section in the second direction, and the vertical surfaces face each other. 15. The light emitting device according to claim 14 , wherein the first portion and the second portion each have a semicircular cross section in the second direction. 15. The light emitting device according to claim 14 , wherein each of the first portion and the second portion has a semicircular cross-section in the first direction. 15. The light emitting device according to claim 14 , wherein the first portion and the second portion are arranged outside an upper surface of the translucent member in the second direction.

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