CN106876543A - A kind of QFN surface mounts RGB LED packages and its manufacture method - Google Patents
A kind of QFN surface mounts RGB LED packages and its manufacture method Download PDFInfo
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- CN106876543A CN106876543A CN201710194334.0A CN201710194334A CN106876543A CN 106876543 A CN106876543 A CN 106876543A CN 201710194334 A CN201710194334 A CN 201710194334A CN 106876543 A CN106876543 A CN 106876543A
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- base plate
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- bowl
- die bond
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- 238000000034 method Methods 0.000 title claims abstract description 20
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- 238000003466 welding Methods 0.000 claims abstract description 34
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims description 21
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
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- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- WBLJAACUUGHPMU-UHFFFAOYSA-N copper platinum Chemical compound [Cu].[Pt] WBLJAACUUGHPMU-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
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- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of QFN surface mounts RGB LED packages and its manufacture method, including metal base plate and Insulating frame, the metal base plate front is provided with luminous zone, described lighting divides into four die bond wire welding areas, for die bond bonding wire, it is connected by Insulating frame between the die bond wire welding area, the Insulating frame forms bowl around the luminous zone, RGB LED chips are provided with the bowl and the key and line of the RGB LED chips and die bond wire welding area is connected, the RGB LED chips and key and line are encapsulated in the bowl by protective layer, the metal base plate reverse side is provided with the pad for being connected with external circuit.The present invention concentrates light by bowl structure, makes light-emitting area unique, and then make the display resolution made more excellent；Directly contacted with pcb board by metal base plate, enhance heat dispersion.
Description
Technical field
The present invention relates to SMD LED encapsulation technologies, more particularly to QFN（Quad Flat No-leadPackage, side
Shape flat no-lead packages）Surface mount RGB LED packages and its manufacture method.
Background technology
As display screen industry is continued to develop, display screen LED is by original DIP（dual inline-pin
Package, dual-inline package technology）Structure high-speed is to SMD（Surface Mounted Devices, surface mount device
Part）Structure changes, the LED of SMD structures have it is lightweight, individual it is smaller, automation is installed, lighting angle is big, color is uniform, decline
The advantages of reduction, is increasingly accepted, although general SMD LED have an above advantage, but there are that decay is larger, leads
Hot path is long, low, production is complicated to carry electric current, and reliability is low, and humidity resistance is low, the problems such as against weather difference.If do not changed
In the case of becoming the overall structure of product, the reliability of product is improved, so far in the industry cycle still without preferable solution.
In existing SMD RGB LED manufactures, using PLCC4（Plastic Leaded Chip Carrier 4,
Special pin chip package）The product of structure（Such as 3528,2121,1010 equal-specifications）, but said structure is all using common
Mode：PPA+ copper or iron pin（As shown in Figure 1）, or PCB+ copper platinum plating modes（As shown in Figure 2）.This two kinds of modes
Product has inborn deficiency, is to be entered thermoplastic 701 with metal 702 by injection machine as PPA+ metal pins modes
Row is adjacent to, and is not stained with and is connected together, and when expanding with heat and contract with cold, gap is easily produced between them, when End-Customer is outer when in use
The water and steam on boundary enter in packaging body easily by gap, so as to cause product failure；And PCB schemes are mainly used in small
Away from it also has its inborn deficiency, and it is that glass is surrounded into compacting by with resin 801 first, then by being stained with copper platinum
Circuit etching is formed, and the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, and the later stage is flat
One layer of flat glue 802 is molded on face again as protective layer, this mode has no idea to form a cup-shaped protection, can exist following
Problem：Because being to be stained with conjunction by two-layer, edge is not protected, and water and steam are easy to by entering lamp body between the two
Between, cause product failure；Circuit is by electroplating the very thin metal of last layer for conductive and radiating, radiating poor.
Therefore, prior art has yet to be improved and developed.
The content of the invention
It is an object of the invention to provide a kind of QFN surface mounts RGB LED packages and its manufacture method, it is intended to solve
Existing SMD RGB LED packages heat dispersion is poor, poor waterproof properties problems.
To solve the above problems, technical scheme is as follows：
A kind of QFN surface mounts RGB LED packages, including metal base plate and Insulating frame, the metal base plate front is provided with
Luminous zone, described lighting divides into four die bond wire welding areas, for die bond bonding wire, by Insulating frame between the die bond wire welding area
It is connected, the Insulating frame forms bowl around the luminous zone, RGB LED chips and connection institute is provided with the bowl
The key and line of RGB LED chips and die bond wire welding area are stated, the RGB LED chips and key and line are encapsulated in described by protective layer
In bowl, the metal base plate reverse side is provided with the pad for being connected with external circuit.
Described QFN surface mount RGB LED packages, wherein, the metal base plate front and/or reverse side are provided with platform
Rank.
Described QFN surface mount RGB LED packages, wherein, it is additionally provided with the metal base plate high with the pad
The concordant Support of degree.
Described QFN surface mount RGB LED packages, wherein, four regions of the luminous zone are divided into positioned at centre
For placing " L " shape of RGB LED chips or the chip weld zone of inverted "L" shaped and being located at the upper left corner, the upper right corner and the right side respectively
First wire welding area of inferior horn, the second wire welding area and the 3rd wire welding area.
A kind of manufacture method of QFN surface mounts RGB LED packages, comprises the following steps：
Step 1：Metal base plate is made into conducting wire, pad is made at the metal base plate back side；
Step 2：Glue is wrapped on the metal base plate, the metal electrode of die bond and bonding wire is reserved, is formed with bowl shape
Package support；
Step 3：Metal is plated on the metal electrode；
Step 4：By RGB LED chips die bond in the bowl of the package support, and bonding wire is carried out, form physics and electrically connect
Connect；
Step 5：The injection pressure protective layer in the bowl.
The manufacture method of described QFN surface mount RGB LED packages, wherein, the injection pressure mode bag of the step 5
Include：Epoxide-resin glue with diffusant is injected in the bowl chamber by way of putting or filling, the mode of heating is reused
Solidified.
The manufacture method of described QFN surface mount RGB LED packages, wherein, the injection pressure mode of the step 5 is logical
Cross MGP moulds the epoxide-resin glue with diffusant is pressed into the bowl chamber, the epoxide-resin glue with diffusant
It is liquid glue or solid gum cake.
The manufacture method of described QFN surface mount RGB LED packages, wherein, the step 1 is additionally included in the gold
Category base plate front and/or reverse side make step.
The manufacture method of described QFN surface mount RGB LED packages, wherein, the step 1 is additionally included in the gold
The back side for belonging to base plate makes the Support concordant with pad height.
The manufacture method of described QFN surface mount RGB LED packages, wherein, also including step 6：Carry out toasting old
Change, baking temperature is 100-300 degrees Celsius.
Beneficial effects of the present invention include：QFN surface mount RGB LED packages and its manufacturer that the present invention is provided
Method, using QFN encapsulating structures, is directly contacted by metal base plate with pcb board, and heat dissipation path is shorter, and chip heat can be quick
Derive；The structure of bowl is formed by front, light is concentrated, makes light-emitting area unique, and then the display resolution, bright for making to make
Dark contrast etc. is more excellent；By making step on metal base plate, it is ensured that the compactness and package support combined with Insulating frame
Stability.
Brief description of the drawings
The structural representation of the existing PPA supports of Fig. 1.
The structural representation of the existing CHIP type packages supports of Fig. 2.
A kind of profile of QFN surface mounts RGB LED packages that Fig. 3 is provided for the present invention.
A kind of front elevation of QFN surface mounts RGB LED packages that Fig. 4 is provided for the present invention.
A kind of back view of QFN surface mounts RGB LED packages that Fig. 5 is provided for the present invention.
A kind of manufacturing flow chart of QFN surface mounts RGB LED packages that Fig. 6 is provided for the present invention.
Description of reference numerals：1st, metal base plate；2nd, Insulating frame；101st, step；102nd, Support；103rd, pad；104、
First wire welding area；105th, the second wire welding area；106th, the 3rd wire welding area；107th, chip weld zone；201st, bowl；202nd, epoxy resin
Glue；301st, RGB LED chips；302nd, key and line；701st, thermoplastic；702nd, metal；801st, resin；802nd, flat glue.
Specific embodiment
To make the objects, technical solutions and advantages of the present invention clearer, clear and definite, develop simultaneously embodiment pair referring to the drawings
The present invention is further described.
Fig. 1 is the structural representation of the package support of existing PPA+ copper pin, because the package support of the type passes through
With metal be adjacent to thermoplastic by injection machine, is not stained with and is connected together, and when expanding with heat and contract with cold, is easily produced between them
Gap, when End-Customer water extraneous when in use and steam enter in packaging body easily by gap, so as to cause product to lose
Effect.Fig. 2 is the structural representation of existing CHIP type packages support, is compacted by being surrounded glass with resin 801, is then passed through
It is stained with copper platinum circuit etching to form, the gap of material and hydroscopicity are all very high, and the expansion rate of this multiple material is different, and
Later stage is molded one layer of flat glue 802 as protective layer again in the plane, and this mode has no idea to form a cup-shaped protection, will
There are problems.
It is a kind of QFN surface mounts RGB LED packages that the present invention is provided referring to Fig. 3-Fig. 5, including metal base plate 1
With Insulating frame 2.The material of metal base plate 1 can be copper or iron etc., and electroplate or gold-plated strengthens electric conductivity, convenient welding.
Insulating frame 2 can be made of thermoplasticity or thermosets, it is preferred to use thermosets is made, it is ensured that produced
During product use, the stability of Insulating frame 2 will not be influenceed because of temperature change；Further, its material can be ring
The material such as oxygen tree fat, PPA, PCT, is in the present embodiment epoxy resin.Existing plating thin is replaced by using metal base plate 1
The mode of metal, enhances electric conductivity, meanwhile, directly being contacted with pcb board by metal base plate 1, heat dissipation path is shorter, chip
Heat can be derived quickly.
The front of metal base plate 1 is provided with luminous zone, and described lighting divides into four die bond wire welding areas, for die bond bonding wire, institute
State and be connected by Insulating frame between die bond wire welding area.The shape and structure of the die bond wire welding area are not limited.Preferably, be with
QFN surface mounting structures are closed, the die bond bonding wire is divided into positioned at the middle core for placing the inverted "L" shaped of RGB LED chips
Piece weld zone 107 and respectively positioned at first wire welding area 104 in the upper left corner, the upper right corner and the lower right corner, the second wire welding area 105 and
3rd wire welding area 106, aforementioned four die bond wire welding area constitutes a square overall luminous zone.
Insulating frame 2 forms bowl 201 around the luminous zone, be provided with bowl 201 RGB LED chips 301 and
Connection RGB LED chips 301 and the key and line 302 of die bond wire welding area.The structure of bowl 201 is formed by front, light is concentrated,
Make light-emitting area unique, and then make display resolution, the bright dark contrast made etc. more excellent.In actual applications, RGB LED cores
Piece 301 can select to be fixed on chip weld zone 107, the first wire welding area 104, the second wire welding area 105 or the 3rd by crystal-bonding adhesive
On the one of region in wire welding area 106, it is preferable that RGB LED chips 301 can be selected by crystal-bonding adhesive to be fixed on chip weldering
Connect in area 107, the first wire welding area 104, the second wire welding area 105 or the 3rd wire welding area 106 one of them as public polar region, favorably
Concentrated in light.RGB LED chips 301 and key and line 302 are encapsulated in the bowl by protective layer, it is preferable that the guarantor
Sheath is the translucent epoxy glue with diffusant, and translucent epoxy glue forms protective layer, prevents water with bowl 201
Vapour penetrates into, and the protective layer compared with the simple molding of technology is different, because the material of bowl 201 is similarly epoxide-resin glue, because
For the protective layer that the present invention is formed can combine closely with bowl 201, than the waterproof of the bonding of the metal and plastics of prior art
Effect is far better.On the other hand, the translucent epoxy adhesive tape has diffusant, with reference to the structure of bowl 201, forms light
Lens, make LED light line more concentrate.The reverse side of metal base plate 1 is provided with the pad 103 for being connected with external circuit.
In actual applications, the front of metal base plate 1 and/or reverse side are provided with step 101, for strengthening the metal base plate
1 compactness and stability combined with Insulating frame 2, prevents the entrance of water and steam, while further enhancing the machine of support
Tool intensity.Preferably, the tow sides of metal base plate 1 are provided with step 101.
Referring to Fig. 5, the Support 102 highly concordant with pad 103 is additionally provided with the reverse side of metal base plate 1.Supporting construction 102
Setting can ensure the planarization of metal base plate 1 in support manufacturing process.Preferably, Support 102 can be circular, square
Or Support or the support column of irregular shape.
It is a kind of manufacture method of QFN surface mounts RGB LED packages that the present invention is provided referring to Fig. 6, including it is following
Step：
Step 1：Metal base plate 1 is made into conducting wire by way of etching or punching press, pad is made at the back side of metal base plate 1
103；It is improve production efficiency in actual production, the disposable multiple package supports of production can be added to one piece big metallic plate
Work, while etching multiple metal base plates 1, and is cut in subsequent handling.
Step 2：Glue is wrapped on metal base plate 1 by moulding press, reserves the metal electrode of die bond and bonding wire, form tool
There is the package support of bowl shape；To ensure swelling stress release of the metal base plate 1 under subsequent high temperature, with single metal base plate 1
It is unit, makes release hollow out on each unit periphery, and take datum line of the datum line as follow-up cutting action around.
Step 3：Metal is plated on the metal electrode by plating or depositional mode, is conducive to follow-up welding, led
It is electric and reflective.
Step 4：By the die bond of RGB LED chips 301 in the bowl 201 of the package support, and carry out bonding wire, formation
Reason is electrically connected with.
Step 5：Epoxide-resin glue of the injection pressure with diffusant is protected and optical lens in bowl 201.The injection pressure side
Formula can be injected in the bowl chamber epoxide-resin glue liquid of the diffusant by way of putting or filling, and reuse heating
Mode solidified, the temperature of heating is preferably 100-300 degrees Celsius.This kind of mode be full bowl protective layer, protective layer with
The height of bowl 201 is concordant, and the height of bowl 201 can be 0.5-0.7mm, and the protective layer stability that this kind of mode is made is more
It is high.
The injection pressure mode can also be that the epoxide-resin glue of the diffusant is pressed into institute by the MGP moulds for designing
State in bowl chamber, the epoxide-resin glue of the diffusant is liquid glue or solid gum cake.This kind of mode is half bowl protective layer, bowl
The height of cup 201 is slightly below the height of protective layer, and the height of bowl 201 can be 0.3-0.5mm, the protection that this kind of mode is supported
Layer cost is relatively low.
In actual applications, the manufacture method of described QFN surface mount RGB LED packages, wherein, the step 1
It is additionally included in the front of metal base plate 1 and/or reverse side makes step 101, is made and the height of pad 103 at the back side of metal base plate 1
Concordant Support 102.
In actual applications, after packaging body making is completed, also need that the packaging body is carried out to toast aging, it is entered one
Step stabilization, baking temperature is 100-300 degrees Celsius, then is cut into single led product by cutting machine.
It should be appreciated that application of the invention is not limited to above-mentioned citing, and for those of ordinary skills, can
To be improved according to the above description or converted, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Shield scope.
Claims (10)
1. a kind of QFN surface mounts RGB-LED packaging bodies, it is characterised in that including metal base plate and Insulating frame, the metal
Base plate front is provided with luminous zone, it is described it is luminous divide into four die bond wire welding areas, for die bond bonding wire, the die bond wire welding area it
Between be connected by Insulating frame, the Insulating frame forms bowl around the luminous zone, and RGB LED cores are provided with the bowl
Piece and the key and line of the connection RGB-LED chips and die bond wire welding area, the RGB LED chips and key and line are by protection
Layer is encapsulated in the bowl, and the metal base plate reverse side is provided with the pad for being connected with external circuit.
2. QFN surface mounts RGB-LED packaging bodies according to claim 1, it is characterised in that the metal base plate front
And/or reverse side is provided with step.
3. QFN surface mounts RGB-LED packaging bodies according to claim 1, it is characterised in that on the metal base plate also
It is provided with the Support concordant with the pad height.
4. QFN surface-adhered types RGB-LED package supports according to claim 1, it is characterised in that the luminous zone
Four regions are divided into positioned at middle for placing " L " shape of RGB LED chips or the chip weld zone of inverted "L" shaped and respectively position
The first wire welding area, the second wire welding area and the 3rd wire welding area in the upper left corner, the upper right corner and the lower right corner.
5. a kind of manufacture method of QFN surface mounts RGB-LED packaging bodies, it is characterised in that comprise the following steps：
Step 1：Metal base plate is made into conducting wire, pad is made at the metal base plate back side；
Step 2：Glue is wrapped on the metal base plate, the metal electrode of die bond and bonding wire is reserved, is formed with bowl shape
Package support；
Step 3：Metal is plated on the metal electrode；
Step 4：By RGB LED chips die bond in the bowl of the package support, and bonding wire is carried out, form physics and electrically connect
Connect；
Step 5：The injection pressure protective layer in the bowl.
6. the manufacture method of QFN surface mounts RGB-LED packaging bodies according to claim 5, it is characterised in that the step
Rapid 5 injection pressure mode includes：Epoxide-resin glue liquid with diffusant is injected into the bowl chamber by way of putting or filling
Interior, the mode for reusing heating is solidified.
7. the manufacture method of QFN surface mounts RGB-LED packaging bodies according to claim 5, it is characterised in that the step
Rapid 5 injection pressure mode is that the epoxide-resin glue with diffusant is pressed into the bowl chamber by MGP moulds, the diffusant
Epoxide-resin glue be liquid glue or solid gum cake.
8. the manufacture method of QFN surface mounts RGB-LED packaging bodies according to claim 5, it is characterised in that the step
Rapid 1 is additionally included in the metal base plate front and/or reverse side making step.
9. the manufacture method of QFN surface mounts RGB-LED packaging bodies according to claim 5, it is characterised in that the step
Rapid 1 back side for being additionally included in the metal base plate makes the Support concordant with pad height.
10. the manufacture method of QFN surface mounts RGB-LED packaging bodies according to claim 5, it is characterised in that also wrap
Include step 6：Carry out baking aging, baking temperature is 100-300 degrees Celsius.
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Application publication date: 20170620 |