CN201490221U - LED bracket and PCB provided with same - Google Patents
LED bracket and PCB provided with same Download PDFInfo
- Publication number
- CN201490221U CN201490221U CN2009201339116U CN200920133911U CN201490221U CN 201490221 U CN201490221 U CN 201490221U CN 2009201339116 U CN2009201339116 U CN 2009201339116U CN 200920133911 U CN200920133911 U CN 200920133911U CN 201490221 U CN201490221 U CN 201490221U
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- CN
- China
- Prior art keywords
- led support
- led
- colloid
- wire welding
- welding area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an LED bracket and a PCB provided with the same. The LED bracket comprises a cup and at least two die bonding wire regions which are insulated with each other and are positioned at the bottom of the cup. Insulating layers are arranged on the die bonding wire regions, at least one die bonding hole is arranged in the position where the insulating layers corresponds to each die bonding wire region, at least part of the die bonding wire region is exposed out of the die bonding hole to form a connection region for installing LED chip pins. The utility model also provides a PCB comprising the LED bracket. Through arranging the insulating layers at the bottom of the cup of the LED bracket and above the die bonding wire regions, the reflectivity of the light emitted from the LED chip inside the cup is the same, so as to effectively improve the reflectivity of light and improve the light-emitting brightness and the uniformity of the LED chip.
Description
Technical field
The utility model relates to the LED field, more particularly, relates to a kind of led support and has the pcb board of this led support.
Background technology
Adopting surface mounted LED (SMD type LED) is a kind of novel surface mounted type light emitting semiconductor device, has that volume is little, angle of scattering is big, uniformity of luminance is good, the reliability advantages of higher, and at present, paster type light emitting type has been widely used on the various electronic products.
As shown in Figure 1, existing adopting surface mounted LED comprises pcb board 1, reaches led chip (not shown), is placed with several led supports 2 on the described pcb board 1, and described led chip (not shown) is installed on the led support 2.As shown in Figures 2 and 3, existing led support 2, comprise: an end of colloid 11, colloid 11 is provided with the bowl cup 12 of indent, bowl cup 12 bottoms are provided with the solid brilliant wire welding area 13 of at least two mutually insulateds, described solid brilliant wire welding area 13 is used to carry out solid crystalline substance and bonding wire, the two pins of led chip is connected two solid brilliant wire welding areas 13 respectively, and led chip is fixed in wherein a solid brilliant wire welding area 13, apply positive and negative electrode voltage respectively in two solid brilliant wire welding areas 13, can make led chip discharge its light, and make that whole adopting surface mounted LED is luminous.
Yet above-mentioned led support has following shortcoming: because described solid brilliant wire welding area 13 areas are bigger, the employing electric conducting material is made, and colloid 11 adopts insulating material to make, the reflectivity of two kinds of materials is inconsistent, thereby, led chip in bowl cup 12 to around discharge light, inconsistent at the reflectivity of the solid brilliant wire welding area 13 of directive during with colloid 11, influence the luminosity and the uniformity of led chip, and then influence the luminosity of whole adopting surface mounted LED.
The utility model content
One of the technical problems to be solved in the utility model is, influences the shortcoming of the luminosity of led chip at above-mentioned existing led support; A kind of led support is provided, can effectively improves the reflection of light rate, promote the luminosity of led chip.
Two of the technical problems to be solved in the utility model is, at above-mentioned existing P CB plate, several existing led supports is set led chip is installed, and influences the shortcoming of the luminosity of integral LED chip; A kind of pcb board with led support is provided, adopts improved led support, can effectively improve the reflection of light rate, promote the luminosity of integral LED chip.
The technical scheme that the one technical problem that solves the utility model is adopted is: a kind of led support is provided, comprise: bowl cup and be positioned at the solid brilliant wire welding area of at least two mutually insulateds of bowl cup bottom, described solid brilliant wire welding area is provided with insulating barrier, the position that described insulating barrier is corresponding with each solid brilliant wire welding area is provided with at least one solid welding hole, and at least a portion of described solid brilliant wire welding area is exposed the bonding pad that described solid welding hole is formed for installing the led chip pin.
In led support described in the utility model, described led support comprises colloid, and described bowl cup is opened in an end of colloid.
In led support described in the utility model, described insulating barrier and described colloid are one-body molded.
In led support described in the utility model, described colloid is the PPA plastic parts, and described insulating barrier is the PPA plastic layer.
In led support described in the utility model, described led support comprises at least two metal electrodes that polarity is different, and described solid brilliant wire welding area is formed on the bottom that described at least two metal electrodes are arranged in the bowl cup that is made of colloid respectively.
In led support described in the utility model, described colloid is formed for separating the spacer block of metal electrode polarity between the solid brilliant wire welding area of described metal electrode.
In led support described in the utility model, described metal electrode is two, and each metal electrode is provided with at least one solid brilliant wire welding area.
In led support described in the utility model, the area of described bonding pad is less than the area of solid brilliant wire welding area.
In led support described in the utility model, described bowl cup is inverted round table-like.
The technical scheme that its another technical problem that solves the utility model adopts is: a kind of pcb board with led support is provided, comprises pcb board and several aforesaid led supports, described led support is arranged on the described pcb board.
Enforcement the utlity model has following beneficial effect: one, the bottom of the bowl cup of the colloid of led support, Gu the top of brilliant wire welding area is provided with insulating barrier, make solid brilliant wire welding area and except that the bonding pad that is used to install led chip, all be insulated layer and cover, because the material of insulating barrier is identical with the reflectivity of the material of colloid, led chip in the bowl cup to around discharge light, reflectivity in the directive bonding pad during with colloid is consistent, can effectively improve the reflection of light rate, promote the luminosity and the uniformity of led chip; Two, the pcb board that has led support adopts above-mentioned improved led support, and the independent respectively led chip of installing can integral body improve the reflection of light rate, promotes the luminosity that is installed on the integral LED chip on the pcb board.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of the pcb board of existing adopting surface mounted LED;
Fig. 2 is the schematic diagram of existing led support shown in Figure 1;
Fig. 3 is the cutaway view of Fig. 2 along the A-A direction;
Fig. 4 is the structural representation that the utlity model has the pcb board of led support;
Fig. 5 is the schematic diagram of led support of the present utility model shown in Figure 4;
Fig. 6 is the cutaway view of Fig. 5 along the A-A direction.
Embodiment
As shown in Figure 4, be the structural representation that the utlity model has the pcb board of led support, described pcb board with led support comprises: pcb board 1 and be arranged on the described pcb board 1 several and be used to install the led support 4 of led chip.Consult Fig. 5 and Fig. 6, Fig. 5 is the schematic diagram of led support of the present utility model 4 shown in Figure 4, and Fig. 6 is the cutaway view of Fig. 5 along the A-A direction; Described led support 4 comprises: colloid 41 and several metal electrodes 42.
The external form of described colloid 41 roughly is square body, body also can be rectangle, polygonal body or round etc., the inboard, upper end of described colloid 41 offers the bowl cup 43 of indent, bowl cup 43 is inverted round table-like, its side is the inclined-plane, effective divergent rays, colloid 41 is non-conductive plastic parts, can be by Merlon (Polycarbonate, PC), polyphthalamide (Polyphthalamide, PPA), polybutylene terephthalate (Polybutylene Terephthalte, PBT), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), or other known thermoplastic resin is made, the preferable polyphthalamide of preferred reflectance (Polyphthalamide, PPA).
Described several metal electrodes 42 are made by the material with conductivity, as copper, metal materials such as iron, in accompanying drawing of the present utility model, with six metal electrodes 42 is example, it is to be noted, described led support 4 comprises two metal electrodes 42 that polarity is different at least, can be provided with three according to actual demand, metal electrode 42 more than four or six, wherein, each metal electrode 42 is arranged in respectively and forms brilliant admittedly wire welding area 44 in the colloid 41 and in the bottom of bowl cup 43, stretch out from solid brilliant wire welding area 44 again the pin 45 that exposes colloid 41 is set, what deserves to be mentioned is, be formed with spacer block 46 by colloid 41 between the adjacent solid brilliant wire welding area 44, in order to the polarity that separates out metal electrode 42 (just, negative pole), colloid 41 can utilize technical approach such as ejection formation, to fix each metal electrode 42, but and mass production, thereby save manufacturing cost.
Main improvements of the present utility model are to be equipped with an insulating barrier 5 above the bottom of the bowl cup 43 of described colloid 41, solid brilliant wire welding area 44, described insulating barrier 5 and each solid brilliant wire welding area 44 corresponding positions are provided with at least one solid welding hole 51, in the present embodiment, the solid welding hole 51 corresponding with each solid brilliant wire welding area 44 is one, be understandable that, also can be more than two, can determine according to the quantity and the set-up mode of led chip.Described solid brilliant wire welding area 44 is revealed in the bonding pad 47 that is formed for installing led chip in the solid welding hole 51, the area of described bonding pad 47 is less than the area of solid brilliant wire welding area 44, the area size of bonding pad 47 can guarantee that solid brilliant bonding wire gets final product, and described solid brilliant bonding wire can pass through existing techniques in realizing.Described insulating barrier 5 is for adopting the non-conductive plastic layer made from colloid 41 identical materials, and in the present embodiment, described insulating barrier 5 is one-body molded with colloid 41, and (Polyphthalamide PPA) makes to adopt the preferable polyphthalamide of reflectivity.
When led support 4 of the present utility model is installed led chip, two bonding pads 47 that the two pins of led chip connected a metal electrode 42 correspondences respectively, and led chip is fixed in a wherein bonding pad 47, just applying respectively at pin 45 places of the metal electrode 42 that led chip is installed again, the voltage of negative pole, voltage is transmitted to the bonding pad 47 of metal electrode 42, make led chip discharge light, the quantity of led chip can be provided with according to the quantity of metal electrode 42 and solid brilliant wire welding area 44, for example can on the bonding pad 47 of three metal electrode 42 correspondences, be provided with red respectively, green, the led chip of Lan Sanse is to form the effect of white light.
In sum, led support of the present utility model is because in the bottom of the bowl cup 43 of colloid 41, Gu the top of brilliant wire welding area 44 is provided with insulating barrier 5, make solid brilliant wire welding area 44 except that the bonding pad 47 that is used to install led chip is and all be insulated layer 5 covering, and the material of insulating barrier 5 is identical with the material of colloid 41, led chip to around the light that discharged, directive colloid 41 during with insulating barrier 4 reflectivity identical, can effectively promote the luminosity and the uniformity of led chip.
The above; it only is the preferable embodiment of the utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (10)
1. led support, comprise: bowl cup (43) and be positioned at the solid brilliant wire welding area (44) of at least two mutually insulateds of bowl cup (43) bottom, it is characterized in that, described solid brilliant wire welding area (44) is provided with insulating barrier (5), the position that described insulating barrier (5) is corresponding with each solid brilliant wire welding area (44) is provided with at least one solid welding hole (51), and at least a portion of described solid brilliant wire welding area (44) is exposed the bonding pad (47) that described solid welding hole (51) is formed for installing the led chip pin.
2. led support according to claim 1 is characterized in that, described led support comprises colloid (41), and described bowl cup (43) is opened in an end of colloid (41).
3. led support according to claim 2 is characterized in that, described insulating barrier (5) is one-body molded with described colloid (41).
4. according to claim 2 or 3 described led supports, it is characterized in that described colloid (41) is the PPA plastic parts, described insulating barrier (5) is the PPA plastic layer.
5. led support according to claim 2, it is characterized in that, described led support comprises at least two metal electrodes (42) that polarity is different, and described solid brilliant wire welding area (44) is formed on the bottom that described at least two metal electrodes (42) are arranged in the bowl cup (43) that is made of colloid (41) respectively.
6. led support according to claim 5 is characterized in that, described colloid (41) is formed for separating the spacer block (46) of metal electrode (42) polarity between the solid brilliant wire welding area (44) of described metal electrode (42).
7. led support according to claim 5 is characterized in that, described metal electrode (42) is two, and each metal electrode (42) is provided with at least one solid brilliant wire welding area (44).
8. led support according to claim 1 is characterized in that, the area of described bonding pad (47) is less than the area of solid brilliant wire welding area (44).
9. led support according to claim 1 is characterized in that, described bowl cup (43) is inverted round table-like.
10. the pcb board with led support comprises pcb board (1) and several led supports as claimed in claim 1 (4), and described led support (4) is arranged on the described pcb board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201339116U CN201490221U (en) | 2009-07-14 | 2009-07-14 | LED bracket and PCB provided with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201339116U CN201490221U (en) | 2009-07-14 | 2009-07-14 | LED bracket and PCB provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201490221U true CN201490221U (en) | 2010-05-26 |
Family
ID=42429089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201339116U Expired - Fee Related CN201490221U (en) | 2009-07-14 | 2009-07-14 | LED bracket and PCB provided with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201490221U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522481A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment |
| WO2014180874A1 (en) * | 2013-05-08 | 2014-11-13 | Koninklijke Philips N.V. | Mounting layer for cooling structure |
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
-
2009
- 2009-07-14 CN CN2009201339116U patent/CN201490221U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522481A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment |
| WO2014180874A1 (en) * | 2013-05-08 | 2014-11-13 | Koninklijke Philips N.V. | Mounting layer for cooling structure |
| US9515453B2 (en) | 2013-05-08 | 2016-12-06 | Koninklijke Philips N.V. | Mounting layer for cooling structure |
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 Termination date: 20110714 |