CN102522481A - LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment - Google Patents
LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment Download PDFInfo
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- CN102522481A CN102522481A CN2012100021954A CN201210002195A CN102522481A CN 102522481 A CN102522481 A CN 102522481A CN 2012100021954 A CN2012100021954 A CN 2012100021954A CN 201210002195 A CN201210002195 A CN 201210002195A CN 102522481 A CN102522481 A CN 102522481A
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- China
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- metallic stamping
- plastic body
- eutectic
- stamping pieces
- polar region
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Abstract
The invention relates to an LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment, which comprises a plastic body and a plurality of metallic stamping parts, wherein the metallic stamping parts are arranged in the plastic body, the end parts of the metallic stamping parts extend out of the inner part of the plastic body, the upper surface of the plastic body is drilled with a groove to form a reflecting cup, the bottom of the reflecting cup is provided with the metallic stamping parts and is divided into an anode area and a cathode area, the junction of the anode area and the cathode area is provided with a solder dike, and the anode area is provided with at least one soldering-flux guiding slot. Compared with the prior art, the LED chip bracket has the advantages of simple process, low cost, reasonable structure and the like.
Description
Technical field
The present invention relates to a kind of led chip support, especially relate to a kind of brilliant led chip support of eutectic solid welding that is used for.
Background technology
At present, the brilliant support of LED eutectic solid welding that power density is big, instructions for use is high all adopts LTCC (LTCC) material manufacture.Owing to many factors such as thermal stress release in LTCC (LTCC) the sintering manufacturing process can be brought following defective:
1. be used for the difficult control of technology interface deformation of eutectic weldering, the quality consistency of goods is poor, and then influences the welding quality of eutectic weldering;
2. can't produce on the critical process surface and ensure the special process structure of eutectic weldering the LED global reliability;
3. the randomness that discharges of thermal stress can't be accomplished scale production this type of support, also can't realize that functional areas select to electroplate to reduce noble metal consumption simultaneously, causes manufacturing cost higher, is five to ten times of general led support.
Summary of the invention
The object of the invention is exactly for the defective that overcomes above-mentioned prior art existence a kind of brilliant led chip support of eutectic solid welding that is used for to be provided.
The object of the invention can be realized through following technical scheme:
A kind of brilliant led chip support of eutectic solid welding that is used for comprises plastic body and a plurality of metallic stamping pieces, and described metallic stamping pieces is located in the plastic body; Stretch out in plastic body the end of metallic stamping pieces; The upper surface of described plastic body has a groove and forms reflector, and the bottom of this reflector is a metallic stamping pieces, and is divided into positive polar region and negative pole district; The intersection in described positive polar region and negative pole district is provided with the scolder dike, and described positive polar region is provided with at least one scaling powder guiding groove.
Described plastic body is high temperature LCP (liquid crystal polymer), combines with metallic stamping pieces through the high-pressure injection moulding mode.
Described metallic stamping pieces has 6, and positive polar region and negative pole district include 3 metallic stamping pieces.
The metallic stamping pieces surface electrical that is positioned at the reflector bottom is coated with noble metal.
Described scaling powder guiding groove is provided with two.
Compared with prior art, the present invention has the following advantages:
1, the thermal characteristics of high temperature liquid crystal polymer can ensure in eutectic welder skill process, and the combination of plastic body and metallic stamping pieces thermal deformation can not take place or produces relative displacement;
2, because the intersection in positive polar region and negative pole district is provided with the scolder dike, can guarantee that a spot of scolder that overflows can not arrive the negative pole district, reduces the possibility of positive and negative intereelectrode short-circuit;
3, the scaling powder guide channel that is arranged on positive polar region can volatilize unnecessary scaling powder in residual this guiding groove of importing, to avoid it attached on the led chip, influences the product luminous efficiency.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
Embodiment
As shown in Figure 1, a kind of brilliant led chip support of eutectic solid welding that is used for comprises that plastic body 2 and 1,6 metallic stamping pieces 1 of 6 metallic stamping pieces all are located at the inside of plastic body 2, and stretch out in plastic body 2 end of metallic stamping pieces 1, and both sides respectively have three.The material of plastic body 2 is high temperature LCP, combines with metallic stamping pieces 1 through the high-pressure injection moulding mode, makes both that thermal deformation can not take place in the eutectic welding process and perhaps produces relative displacement.The upper surface of plastic body 2 has a groove and forms reflector 3; The bottom of reflector 3 is divided into positive polar region A and negative pole district B; The intersection of positive polar region A and negative pole district B is provided with scolder dike 4, can guarantee that a spot of scolder that overflows can not arrive the negative pole district, reduces the possibility of positive and negative intereelectrode short-circuit.And 6 metallic stamping pieces 1 just in time expose from the bottom of reflector 3, and wherein 3 are positioned at positive polar region A, and 3 are positioned at negative pole district B.Also be provided with two scaling powder guiding grooves 5 in the positive polar region A, in residual this guiding groove of importing that can unnecessary scaling powder be volatilized, to avoid it attached on the led chip.
During use, led chip is fixed on scaling powder on the metallic stamping pieces 1 of positive polar region A, can sends into the eutectic soldering equipment then and accomplish eutectic welder skill.This led chip support manufacturing process is easy relatively, and the product quality high conformity is fit to large-scale production; And low cost of manufacture; The manufacturing cost of prior art can reduce by four times relatively, and reasonable in internal structure implements to provide reliable structure technology guarantee for the eutectic welder plants; Can a plurality of this kind holder combination be formed bracket component, the high efficiency of welding for eutectic provides prerequisite.
Claims (5)
1. one kind is used for the brilliant led chip support of eutectic solid welding, it is characterized in that, comprises plastic body and a plurality of metallic stamping pieces; The upper surface of described plastic body has a groove and forms reflector; The bottom of this reflector is a metallic stamping pieces, and stretch out in plastic body the end of metallic stamping pieces, described reflector be divided into positive polar region and negative pole district; The intersection in described positive polar region and negative pole district is provided with the scolder dike, and described positive polar region is provided with at least one scaling powder guiding groove.
2. a kind of brilliant led support of eutectic solid welding that is used for according to claim 1 is characterized in that described plastic body is high temperature LCP, combines with metallic stamping pieces through the high-pressure injection moulding mode.
3. a kind of brilliant led support of eutectic solid welding that is used for according to claim 1 is characterized in that described metallic stamping pieces has 6, and positive polar region and negative pole district include 3 metallic stamping pieces.
4. a kind of brilliant led support of eutectic solid welding that is used for according to claim 1 is characterized in that the metallic stamping pieces surface electrical that is positioned at the reflector bottom is coated with noble metal.
5. a kind of brilliant led support of eutectic solid welding that is used for according to claim 1 is characterized in that described scaling powder guiding groove is provided with two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100021954A CN102522481A (en) | 2012-01-05 | 2012-01-05 | LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100021954A CN102522481A (en) | 2012-01-05 | 2012-01-05 | LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522481A true CN102522481A (en) | 2012-06-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100021954A Pending CN102522481A (en) | 2012-01-05 | 2012-01-05 | LED (Light-Emitting Diode) chip bracket for eutectic-soldering die attachment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102522481A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548277A (en) * | 2017-08-30 | 2018-01-05 | 成都雷电微力科技有限公司 | A kind of TR components ballast and installation method |
| CN113113525A (en) * | 2021-04-08 | 2021-07-13 | 广东良友科技有限公司 | Solderless LED patch bracket and welding method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101578711A (en) * | 2006-11-09 | 2009-11-11 | 跃进封装公司 | Leg reflective package |
| CN201490221U (en) * | 2009-07-14 | 2010-05-26 | 深圳市吾光电子有限公司 | LED bracket and PCB provided with same |
| CN101789484A (en) * | 2010-02-05 | 2010-07-28 | 江苏伯乐达光电科技有限公司 | Eutectic welding method of light-emitting diode |
| CN201732814U (en) * | 2010-07-20 | 2011-02-02 | 深圳市聚飞光电股份有限公司 | LED support and LED comprising the same for improving reliability |
| CN202434569U (en) * | 2012-01-05 | 2012-09-12 | 上海共晶电子科技有限公司 | Co-crystallizing welding crystal bracket of LED (Light Emitting Diode) chip |
-
2012
- 2012-01-05 CN CN2012100021954A patent/CN102522481A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101578711A (en) * | 2006-11-09 | 2009-11-11 | 跃进封装公司 | Leg reflective package |
| CN201490221U (en) * | 2009-07-14 | 2010-05-26 | 深圳市吾光电子有限公司 | LED bracket and PCB provided with same |
| CN101789484A (en) * | 2010-02-05 | 2010-07-28 | 江苏伯乐达光电科技有限公司 | Eutectic welding method of light-emitting diode |
| CN201732814U (en) * | 2010-07-20 | 2011-02-02 | 深圳市聚飞光电股份有限公司 | LED support and LED comprising the same for improving reliability |
| CN202434569U (en) * | 2012-01-05 | 2012-09-12 | 上海共晶电子科技有限公司 | Co-crystallizing welding crystal bracket of LED (Light Emitting Diode) chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548277A (en) * | 2017-08-30 | 2018-01-05 | 成都雷电微力科技有限公司 | A kind of TR components ballast and installation method |
| CN107548277B (en) * | 2017-08-30 | 2019-10-25 | 成都雷电微力科技有限公司 | A kind of TR component ballast and installation method |
| CN113113525A (en) * | 2021-04-08 | 2021-07-13 | 广东良友科技有限公司 | Solderless LED patch bracket and welding method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120627 |