CN204189825U

CN204189825U - Surface welded LED encapsulation module

Info

Publication number: CN204189825U
Application number: CN201420654311.5U
Authority: CN
Inventors: 陈天宇
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-11-04
Filing date: 2014-11-04
Publication date: 2015-03-04
Anticipated expiration: 2024-11-04

Abstract

A kind of surface welded LED encapsulation module, includes multiple PCB type LED element or SMD element, at least one circuit board and at least one shot platen.PCB type LED element or SMD element bottom surface are fixed electric connection and are located at this circuit board, in order to first to carry out yield test to PCB type LED element or SMD element by system; Allowing yield test passes PCB type LED element or SMD element fix in adhesive surface mode and to be electrically connected is located on circuit board; Combine movable corresponding to circuit board and shot platen again, make die cavity set by burn-in test qualified PCB type LED element or SMD element implantation shot platen interior and be dipped in a transparent material body, after the sclerosis of this transparent material body, make this transparent material body fixedly can form in PCB type LED element or SMD element-external, namely complete the encapsulation of LED module.By this, effectively can promote the convenience of encapsulation, reduce the cost of encapsulation process simultaneously.

Description

Surface welded LED encapsulation module

Technical field

PCB type LED element or SMD element are first fixed electric connection and are located at this circuit board by a kind of surface welded LED encapsulation module, particularly one, and after carrying out yield test; Fit corresponding mutually at least one shot platen and a circuit board again, qualified PCB type LED element or SMD element to be implanted in die cavity set by shot platen and to be dipped in a transparent material body, this transparent material body can be shaped and be fixed on PCB type LED element or SMD element-external, reach tool and make the convenience with maintenance, and the LED of processing cost can be reduced.

Background technology

LED light-emittingdiode major advantage compared with conventional bulb is: volume is little, reaction is fast, the life-span is long, not easily decay, firm in appearance, vibration resistance, can full-color light-emitting (containing invisible light), point to design easily, low-voltage, low current, conversion loss are low, thermal radiation is little, volume production is easy, environmental protection etc.Because market demand continues to increase, and the manufacturing technology of blue light, white light LEDs and high-brightness LED constantly breaks through in succession recently.

And known LED module packaging processing procedure, such as support rack type LED module: 1, utilize LED wafer to be fixed on metallic support, a conduction path is formed through playing (weldering) line, again these semi-finished product are implanted in the mould bar of plastic mold, after high-temperature baking is shaping and from mould, then the place that metallic support is connected is utilized punching press, its punching press is removed, formation both positive and negative polarity is connected, then tests; 2, after test, then after bad LED wafer being removed, then its connected part is excised by punching press completely, like this LEDs light-emitting component; 3, again by LED light-emitting component through light splitting machine, test light splitting graduation; 4, the LED light-emitting component of point good grade is welded on the circuit board with drive circuit again, has used one group of LED illuminating module.

Again, known LED module packaging processing procedure is directly LED wafer to be fixed on a planar bracket, its luminance shortage of limited plane support, Gu usually all add injection moulding goblet on planar bracket side, increases brightness to get its reflecting effect.

Or, directly LED wafer is fixed on the resistant to elevated temperatures pcb board of plane, by its injection moulding sealing, then excision forming.

But known support rack type LED module, must be inserted on pcb board again and cross tin stove (as: wave-soldering) with welding fabrication, cause processed complex, contact point is many, causes product reliability poor.In addition, the LED of known direct forming on planar bracket (i.e. SMD) module, though can utilize adhesive surface mode (SMT) to be fixed on circuit board; Only, the LED module of this mode output, its luminance shortage, is often only applicable to indoor, to be applied to outdoor, then must strengthen LED wafer brightness or size, just can obtain meeting outdoor brightness, thus, cost certainly will be caused relatively to increase.

Utility model content

Because the shortcoming existing for above-mentioned known LED module packaging, namely the purpose of this utility model is to provide a kind of surface welded LED encapsulation module, and its structure is simple, and encapsulation is convenient, can reduce costs, raise the efficiency.

For achieving the above object, the utility model discloses a kind of surface welded LED encapsulation module, it is characterized in that this encapsulation module includes:

Multiple PCB type LED element or SMD element, described PCB type LED element or SMD element are provided with the bottom surface that a surface and has die bond, electrode tip, bonding wire and pcb board, and the surface of described PCB type LED element or SMD element is towards the outside;

At least one circuit board, the bottom surface of described PCB type LED element or SMD element is fixed electric connection and is located at this circuit board; And

At least one shot platen, combine with this circuit board is movable corresponding, this shot platen is provided with multiple die cavity, is provided with transparent material body in each this die cavity.

Wherein, this PCB type LED element or SMD element comprise pcb board.

Wherein, the shape of this die cavity is circular.

Wherein, the shape of this die cavity is oval.

Wherein, the shape of this die cavity is rectangle.

Pass through said structure, surface welded LED encapsulation module of the present utility model is in order to encapsulate multiple PCB type LED element or SMD element, be located at after the described PCB type LED element of this circuit board or SMD element first can carry out a check problem, this circuit board is corresponding with this shot platen to be combined, the described PCB type LED element making yield qualified or SMD element correspondence are implanted in described die cavity, after the sclerosis of this transparent material body, make this transparent material body fixedly form in described PCB type LED element or SMD element-external, namely complete the encapsulation of LED module.By this, effectively can promote the convenience of LED module packaging, reduce the cost of LED module packaging processing simultaneously.

Accompanying drawing explanation

Fig. 1: the utility model LED module first Application Example schematic diagram.

Fig. 2: the utility model LED module second Application Example schematic diagram.

Fig. 3: the utility model LED module the 3rd Application Example schematic diagram.

Fig. 4: the utility model LED module the 4th Application Example schematic diagram.

Embodiment

Refer to the schematic diagram shown in Fig. 1 to Fig. 4, the utility model system discloses a kind of surface welded LED or SMD component encapsulation module, in order to encapsulate multiple PCB type LED element or SMD element 1, its one side of each PCB type LED element or SMD element 1 is provided with a surface 11 and another side is provided with the bottom surface 12 with electrode tip, that is, pcb board carries out the operation of die bond, electrode tip, bonding wire and some glue, and forms PCB type LED element or SMD element 1; Encapsulation module disclosed by the utility model includes at least one circuit board 3 and at least one shot platen 4.

Circuit board 3 and PCB type LED element or SMD element 1 is mutually corresponding fits, described circuit board 3 can be provided with drive circuit; When circuit board 3 and PCB type LED element or SMD element 1 mutually corresponding fit time, the bottom surface 12 of described multiple PCB type LED element or SMD element 1 can utilize adhesive surface mode (SMT) to fix and be electrically connected to be located on circuit board 3, multiple PCB type LED element or SMD element 1 are formed with the drive circuit of circuit board 3 be electrically connected, the surface 11 of multiple PCB type LED element or SMD element 1 then towards the outside.

Shot platen 4 combines with circuit board 3 is movable corresponding, this shot platen 4 is provided with multiple die cavity 41, at least one transparent material body 42 is provided with in each die cavity 41, and multiple die cavitys 41 set by this shot platen 4 are corresponding with PCB type LED element multiple on circuit board 3 or SMD element 1, and the surface 11 of PCB type LED element or SMD element 1 can towards the die cavity 41 of shot platen 4; When shot platen 4 and circuit board 3 movable corresponding in conjunction with time, PCB type LED element or SMD element 1 may correspond to be implanted in die cavity 41, and is dipped among transparent material body 42.Described die cavity 41 shape can be other shapes such as circle, ellipse or rectangle.

For enable further understanding feature of the present utility model, as follows especially exemplified by an application implementation step:

Step 1: multiple PCB type LED element or SMD element 1 can utilize SMT mode and circuit board 3 to be fixedly installed (as shown in Figure 1), and carry out PCB type LED element or the test of SMD element 1 yield, bad PCB type LED element or SMD element 1 are removed, retains qualified PCB type LED element or SMD element 1.

Step 2: the drive circuit set by multiple PCB type LED element or SMD element 1 and circuit board 3 is formed and is electrically connected, PCB type LED element or SMD element 1 and circuit board 3 are carried out aging of product test, bad PCB type LED element or SMD element 1 are removed, retains qualified PCB type LED element or SMD element 1.

Step 3: the circuit board 3 being provided with PCB type LED element or SMD element 1 is combined with shot platen 4 is movable corresponding, the surface 11 of PCB type LED element or SMD element 1 is then towards the die cavity 41 of shot platen 4, PCB type LED element or SMD element 1 be may correspond to implant in die cavity 41, and be dipped in (as shown in Figure 2,3) among transparent material body 42.

Step 4: by transparent material body 42 via after high-temperature baking, makes this transparent material body 42 harden and can depart from the die cavity 41 of shot platen 4.

Step 5: the transparent material body 42 after sclerosis can be shaped and be fixed on PCB type LED element or SMD element 1 outside, namely completes the encapsulation (as shown in Figure 4) of LED module.

The utility model system can utilize adhesive surface mode (SMT) PCB type LED element or SMD element 1 to be electrically connected and be located on circuit board 3, effectively can promote LED module packaging and make the convenience with maintenance, more can reduce the cost of encapsulation process simultaneously; Moreover, form in PCB type LED element or SMD element 1 outside by transparent material body 42, utilize this transparent material body 42 protrude and have lens effect, the brightness effectively increasing PCB type LED element or SMD element 1 can be reached.

In sum, the surface welded LED encapsulation module designed by the utility model is novel and practical, and functionally far win habit formula, tool progressive and industrial utilization, should meet utility model patent important document, and whence proposes the application of utility model patent in accordance with the law.

Above-mentioned specific embodiment is used to describe the purpose of this utility model, feature and effect in detail, be only section Example of the present utility model, when not limiting practical range of the present utility model with this, all people's bodyguards being familiar with this type of skill, according to the above description, and according in the contained architectural feature of following claim and effect do conversion or the amendment of equivalence, its essence does not detach scope person of the present utility model, all should be included in patent right scope of the present utility model.

Claims

1. a surface welded LED encapsulation module, is characterized in that this encapsulation module includes:

At least one shot platen, combine with this circuit board is movable corresponding, this shot platen is provided with multiple die cavity, transparent material body is provided with in each this die cavity, described die cavity and described PCB type LED element or SMD elements relative should in conjunction with after be combined with this transparent material body again, make this transparent material body be fixed on described PCB type LED element or SMD element-external.

2. surface welded LED encapsulation module as claimed in claim 1, it is characterized in that, this PCB type LED element or SMD element comprise pcb board.

3. surface welded LED encapsulation module as claimed in claim 1, is characterized in that, the shape of this die cavity is circular.

4. surface welded LED encapsulation module as claimed in claim 1, is characterized in that, the shape of this die cavity is oval.

5. surface welded LED encapsulation module as claimed in claim 1, it is characterized in that, the shape of this die cavity is rectangle.