CN203983276U - Flip-over type LED360 ° light-emitting component - Google Patents
Flip-over type LED360 ° light-emitting component Download PDFInfo
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- CN203983276U CN203983276U CN201420394285.7U CN201420394285U CN203983276U CN 203983276 U CN203983276 U CN 203983276U CN 201420394285 U CN201420394285 U CN 201420394285U CN 203983276 U CN203983276 U CN 203983276U
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- led luminescence
- light
- flip
- luminescence chip
- led360
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Abstract
The utility model discloses a kind of flip-over type LED360 ° light-emitting component, comprise support, on described support, be provided with metal level, on described metal level, be provided with the LED luminescence chip of multiple upside-down mountings, described LED luminescence chip is connected with metal level according to polar character, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chips, on the metal level of the one or both ends of described support, be provided with conductive pin, on described support, be provided with fluorescent adhesive layer.Good heat dissipation effect when LED360 ° of light-emitting component of the utility model flip-over type lighted, can reach 360 ° of illumination effects, also can improve the power of each LED luminescence chip, and the stability of improving product, is better approved by market.
Description
Technical field
The utility model relates to a kind of light-emitting component, espespecially a kind of flip-over type LED360 ° light-emitting component.
Background technology
LED (Lighting emitting diode) is a kind of light-emitting diode, the solid-state semiconductor device that is visible ray by electric energy conversion.It is the green light source of a kind of high energy-conservation, high life, high light efficiency, environmental protection.
At present, what LED Packaging Industry did that 360 ° of light-emitting components use is that support two millet cake glue or glue wrap up mode entirely support, but glue heat conduction rate variance, operation can make heat all be wrapped in glue and can't get out like this, time, longer temperature was higher, can make the light decay of filament large, and serious meeting causes glue to split dead lamp, cause 360 ° of light-emitting component power can not do height, can not be received by market completely.
Utility model content
Main purpose of the present utility model is to provide a kind of flip-over type LED360 ° light-emitting component, good heat dissipation effect when it is lighted, can reach 360 ° of illumination effects, also can improve the power of each LED luminescence chip, the stability of improving product, is better approved by market.
To achieve these goals, technical solution of the present utility model is: a kind of flip-over type LED360 ° light-emitting component, comprising support, on described support, be provided with metal level, on described metal level, be provided with the LED luminescence chip of multiple upside-down mountings, described LED luminescence chip is connected with metal level according to polar character, form the string of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chips, parallel mixing circuit, on the metal level of the one or both ends of described support, be provided with conductive pin, on described support, be provided with fluorescent adhesive layer.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said metal level is arranged at the upper surface front portion of support, and described fluorescent adhesive layer is vertically installed in the upper surface rear portion of support, and the height of described fluorescent adhesive layer is greater than the height of LED luminescence chip.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said fluorescent adhesive layer is brushed on support by steel mesh brush coating mode.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said rack upper surface is by plating mode or sintering processing electroplated metal layer.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said support is made up of pottery or sapphire material.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said LED luminescence chip is fixed together with metal bonding layer by high-temperature baking silver slurry.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said fluorescent glue is formed by fluorescent material and glue allotment.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said LED luminescence chip is blue-ray LED luminescence chip or red-light LED luminescence chip or green light LED luminescence chip or purple LED luminescence chip.
LED360 ° of light-emitting component of the utility model flip-over type, wherein said conductive pin is made up of metal material.
Adopt after such scheme, LED360 ° of light-emitting component of the utility model flip-over type is by using pottery or sapphire as support, and electroplate or sintered metal layer on support, recycling steel mesh brush coating mode is brushed fluorescent glue in the demand point of support, then with silver slurry, flip LED luminescence chip is fixed on to the position that support is set, finally utilize some glue coating method fluorescent glue to be coated on the support that is brushed with fluorescent glue, while lighting, heat on flip LED luminescence chip can directly be led on pottery or sapphire support by the electrode on flip LED luminescence chip, lead in air from support again, reach better radiating effect, can reach like this 360 ° of illumination effects, also can improve the power of each LED luminescence chip, the stability of improving product, better approved by market.
Brief description of the drawings
Fig. 1 is the structural representation of LED360 ° of light-emitting component of the utility model flip-over type.
Embodiment
As shown in Figure 1, the utility model flip-over type LED360 light-emitting component, comprise the support 1 of being made by pottery or sapphire material, the upper surface front portion of support 1 is electroplate with metal level 2 by plating mode or sintering processing, on metal level 2, be provided with the LED luminescence chip 3 of multiple upside-down mountings, LED luminescence chip 3 is blue-ray LED luminescence chip or red-light LED luminescence chip or green light LED luminescence chip or purple LED luminescence chip.Together with LED luminescence chip 3 is adhesively fixed with metal level 2 by high-temperature baking silver slurry.LED luminescence chip 3 is connected with metal level 2 according to polar character, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip 3 or the parallel circuits of at least two LED luminescence chips 3 or multiple LED luminescence chips 3, on the metal level 2 at the two ends of support 1, be provided with the conductive pin 4 that metal material is made, the upper surface rear portion of support 1 is brushed with fluorescent adhesive layer 5 by steel mesh brush coating mode.Fluorescent adhesive layer 5 is vertically installed in the upper surface rear portion of support 1, and the height of fluorescent adhesive layer 5 is greater than the height of LED luminescence chip 3.Fluorescent glue stirs together with being allocated according to required ratio with glue by fluorescent material, and vacuumizing and defoaming forms.
The step of LED360 ° of light-emitting component processing method of this flip-over type is:
(1) the anterior electroplated metal layer 2 of support 1 upper surface that first utilizes plating mode or sintering processing to make at pottery or sapphire, as conductive layer and the articulamentum of flip LED luminescence chip 3 electrodes;
(2) connect conductive pin 4 at the conductive layer at the two ends of support 1 afterwards, as flip-over type LED luminescence chip 3 positive and negative electrode conductive pins;
(3) finally the fluorescent glue preparing is brushed at support 1 upper surface rear portion by steel mesh brush coating mode and preliminary baking molding, flip LED luminescence chip 3 is starched by high-temperature baking silver, flip LED luminescence chip 3 and metal level 2 are bonded together, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip 3 or the parallel circuits of at least two LED luminescence chips 3 or multiple LED luminescence chips 3, the fluorescent glue preparing is covered to support 1 surface the baking molding that is brushed with fluorescent glue by a glue mode again, form fluorescent adhesive layer 5.
LED360 ° of light-emitting component of the utility model flip-over type is by using pottery or sapphire as support 1, and electroplate or sintered metal layer 2 on support 1, recycling steel mesh brush coating mode is brushed fluorescent glue in the demand point of support 1, then with silver slurry, flip LED luminescence chip 3 is fixed on to the position that support 1 is set, finally utilize some glue coating method fluorescent glue to be coated on the support 1 that is brushed with fluorescent glue, while lighting, heat on flip LED luminescence chip 3 can directly be led on pottery or sapphire support 1 by the electrode on flip LED luminescence chip 3, lead in air from support 1 again, reach better radiating effect, can reach like this 360 ° of illumination effects, also can improve the power of each LED luminescence chip 3, the stability of improving product, better approved by market.
The above embodiment is described preferred implementation of the present utility model; not scope of the present utility model is limited; do not departing under the prerequisite of the utility model design spirit; various distortion and improvement that the common engineers and technicians in this area make the technical solution of the utility model, all should fall in the definite protection range of claims of the present utility model.
Claims (9)
1. a flip-over type LED360 ° light-emitting component, it is characterized in that: comprise support, on described support, be provided with metal level, on described metal level, be provided with the LED luminescence chip of multiple upside-down mountings, described LED luminescence chip is connected with metal level according to polar character, form the series and parallel hybrid circuit of the series circuit of at least one LED luminescence chip or the parallel circuits of at least two LED luminescence chips or multiple LED luminescence chips, on the metal level of the one or both ends of described support, be provided with conductive pin, on described support, be provided with fluorescent adhesive layer.
2. flip-over type LED360 ° light-emitting component as claimed in claim 1, it is characterized in that: described metal level is arranged at the upper surface front portion of support, described fluorescent adhesive layer is vertically installed in the upper surface rear portion of support, and the height of described fluorescent adhesive layer is greater than the height of LED luminescence chip.
3. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described fluorescent adhesive layer is brushed on support by steel mesh brush coating mode.
4. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described rack upper surface is by plating mode or sintering processing electroplated metal layer.
5. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described support is made up of pottery or sapphire material.
6. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described LED luminescence chip is fixed together with metal bonding layer by high-temperature baking silver slurry.
7. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described fluorescent glue is formed by fluorescent material and glue allotment.
8. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described LED luminescence chip is blue-ray LED luminescence chip or red-light LED luminescence chip or green light LED luminescence chip or purple LED luminescence chip.
9. flip-over type LED360 ° light-emitting component as claimed in claim 1, is characterized in that: described conductive pin is made up of metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420394285.7U CN203983276U (en) | 2014-07-17 | 2014-07-17 | Flip-over type LED360 ° light-emitting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420394285.7U CN203983276U (en) | 2014-07-17 | 2014-07-17 | Flip-over type LED360 ° light-emitting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203983276U true CN203983276U (en) | 2014-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420394285.7U Expired - Fee Related CN203983276U (en) | 2014-07-17 | 2014-07-17 | Flip-over type LED360 ° light-emitting component |
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| CN (1) | CN203983276U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023919A (en) * | 2014-07-17 | 2015-11-04 | 王志根 | Flip type LED 360-degree light emitting element and processing method thereof |
-
2014
- 2014-07-17 CN CN201420394285.7U patent/CN203983276U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023919A (en) * | 2014-07-17 | 2015-11-04 | 王志根 | Flip type LED 360-degree light emitting element and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HANGZHOU HENGCHENG OPTOELECTRONIC TECHNOLOGY CO., Free format text: FORMER OWNER: WANG ZHIGEN Effective date: 20150520 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150520 Address after: 311307 Zhejiang city of Ling'an province Gao Yang Road No. 28 Patentee after: HANGZHOU HENGCHENG OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 311307 Zhejiang city of Ling'an province Gao Yang Road No. 28 Patentee before: Wang Zhigen |
|
| C56 | Change in the name or address of the patentee |
Owner name: HANGZHOU HESUNNY PHOTOELECTRIC TECHNOLOGY CO., LTD Free format text: FORMER NAME: HANGZHOU HENGCHENG OPTOELECTRONIC TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 311307 Zhejiang city of Ling'an province Gao Yang Road No. 28 Patentee after: Hangzhou star high rainbow Photoelectric Technology Co., Ltd. Address before: 311307 Zhejiang city of Ling'an province Gao Yang Road No. 28 Patentee before: HANGZHOU HENGCHENG OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20200717 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |