CN203836687U - Inverted LED integrated substrate - Google Patents
Inverted LED integrated substrate Download PDFInfo
- Publication number
- CN203836687U CN203836687U CN201420223123.7U CN201420223123U CN203836687U CN 203836687 U CN203836687 U CN 203836687U CN 201420223123 U CN201420223123 U CN 201420223123U CN 203836687 U CN203836687 U CN 203836687U
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- CN
- China
- Prior art keywords
- substrate
- led
- solder joint
- chip
- sapphire
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- Expired - Fee Related
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Abstract
The utility model discloses an inverted LED integrated substrate which comprises a substrate body, substrate welding points, a plurality of LED chips and substrate wires, wherein the substrate welding points and the LED chips are arranged on the substrate, the substrate welding points include an anode welding point and a cathode welding point, and two ends of the LED chips are connected with the anode welding point or the cathode welding point respectively through the substrate wires. The LED chips are inverted, each LED chip comprises two supports identical in dimension, conductive adhesives are coated at close ends of the supports and used for allowing the substrate body to be connected with PN junctions, sapphires are arranged on the PN junctions, end faces of the bottom ends of the sapphires are connected with top surfaces of the PN junctions, and a layer of fluorescent powder is coated on the end face of the top end of each sapphire. The inverted LED integrated substrate is small in thermal resistance and good in radiating by means of improvement on a chip installation structure of the existing LED substrate.
Description
Technical field
The utility model relates to LED field of light fittings, specifically, specially refers to the integrated flip-chip substrate of a kind of LED.
Background technology
LED be called as the 4th generation lighting source or green light source, along with the development of LED, LED is energy-conservation owing to having, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has the advantages such as environmental benefit and enjoys the concern of all circles.At present, LED is widely used in the fields such as various instructions, demonstration, decoration, backlight, general lighting and urban landscape.
Due to LED in the course of the work, except luminous, produce amount of heat simultaneously, conventionally LED high power products input power is about 15% and can converts light to, remaining 85% electric energy is all converted to heat energy.
Generally speaking, if the heat energy producing when LED is luminous cannot be derived, will make LED knot surface temperature too high, and then affect life cycle, luminous efficiency, the stability of LED product.
Utility model content
The purpose of this utility model is for the deficiencies in the prior art, provides the integrated flip-chip substrate of a kind of LED, to address the above problem.
The technical problem that the utility model solves can realize by the following technical solutions:
The integrated flip-chip substrate of LED, comprises substrate, substrate solder joint, LED chip and substrate cabling; Described substrate is provided with substrate solder joint and some LED chips, and substrate solder joint comprises anodal solder joint and negative pole solder joint, and the two ends of all LED chips are all connected with anodal solder joint or negative pole solder joint respectively by substrate cabling; Described LED chip is flip-chip, it comprises two measure-alike supports, near-end at two supports scribbles conductive adhesive, described conductive adhesive is for connection substrate and PN junction, sapphire is installed on PN junction, described sapphire bottom end face is connected with the end face of PN junction, and on sapphire top, end face scribbles layer of fluorescent powder.
Further, described conductive adhesive is alloy tin cream.
Further, described substrate is aluminium base.
Compared with prior art, the beneficial effects of the utility model are as follows:
1. adopt the substrate of aluminum, and substrate cabling, good heat dissipation effect are set on aluminium base.
The two ends of 2.LED chip are directly connected with substrate cabling, and thermal resistance is low, no color differnece.
3.PN knot is directly connected with support by conductive adhesive, and current spread is fast.
4. support, PN junction and sapphire set gradually from the bottom to top, and thermal conductivity is high.
Brief description of the drawings
Fig. 1 is the structural representation of the integrated flip-chip substrate of LED described in the utility model.
Fig. 2 is the structural representation of LED chip described in the utility model.
Number in the figure explanation: substrate solder joint 1, substrate 2, LED chip 3, substrate cabling 4, support 5, conductive adhesive 6, PN junction 7, sapphire 8, fluorescent material 9.
Detailed description of the invention
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with detailed description of the invention, further set forth the utility model.
Referring to Fig. 1 and Fig. 2, the integrated flip-chip substrate of LED described in the utility model, mainly comprises substrate 2, substrate solder joint 1, LED chip 3 and substrate cabling 4.
Wherein, be provided with substrate solder joint 1 and some LED chips 3 on substrate 2, substrate solder joint 1 comprises anodal solder joint and negative pole solder joint, and the two ends of all LED chips 3 are all connected with anodal solder joint or negative pole solder joint respectively by substrate cabling 4.Described LED chip 3 is flip-chip, it comprises two measure-alike supports 5, scribble conductive adhesive 6 at the near-end of two supports 5, described conductive adhesive 6 is for connection bracket 5 and PN junction 7, sapphire 8 is installed on PN junction 7, the bottom end face of described sapphire 8 is connected with the end face of PN junction 7, and on the top of sapphire 8, end face scribbles layer of fluorescent powder 9.
It is pointed out that described conductive adhesive 6 is alloy tin cream, it is Halogen and lead not, at high temperature can not produce pollutant, more environmental protection.
In addition, described substrate 2 is aluminium base, by adopting said structure design, is convenient to transport and installs.
More than show and described general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and description, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
- The integrated flip-chip substrate of 1.LED, is characterized in that: comprise substrate, substrate solder joint, LED chip and substrate cabling; Described substrate is provided with substrate solder joint and some LED chips, and substrate solder joint comprises anodal solder joint and negative pole solder joint, and the two ends of all LED chips are all connected with anodal solder joint or negative pole solder joint respectively by substrate cabling; Described LED chip is flip-chip, it comprises two measure-alike supports, near-end at two supports scribbles conductive adhesive, described conductive adhesive is for connection substrate and PN junction, sapphire is installed on PN junction, described sapphire bottom end face is connected with the end face of PN junction, and on sapphire top, end face scribbles layer of fluorescent powder.
- 2. the integrated flip-chip substrate of LED according to claim 1, is characterized in that: described conductive adhesive is alloy tin cream.
- 3. the integrated flip-chip substrate of LED according to claim 1, is characterized in that: described substrate is aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420223123.7U CN203836687U (en) | 2014-04-30 | 2014-04-30 | Inverted LED integrated substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420223123.7U CN203836687U (en) | 2014-04-30 | 2014-04-30 | Inverted LED integrated substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203836687U true CN203836687U (en) | 2014-09-17 |
Family
ID=51514524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420223123.7U Expired - Fee Related CN203836687U (en) | 2014-04-30 | 2014-04-30 | Inverted LED integrated substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203836687U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992938A (en) * | 2015-07-20 | 2015-10-21 | 深圳市君和光电子有限公司 | A flip integrated LED light source |
| CN110139469A (en) * | 2019-05-08 | 2019-08-16 | 格瑞电子（厦门）有限公司 | A kind of small array LED lamp group circuit board |
-
2014
- 2014-04-30 CN CN201420223123.7U patent/CN203836687U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992938A (en) * | 2015-07-20 | 2015-10-21 | 深圳市君和光电子有限公司 | A flip integrated LED light source |
| CN110139469A (en) * | 2019-05-08 | 2019-08-16 | 格瑞电子（厦门）有限公司 | A kind of small array LED lamp group circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140917 Termination date: 20170430 |