CN204088373U - Bent LED silk and bulb structure thereof - Google Patents
Bent LED silk and bulb structure thereof Download PDFInfo
- Publication number
- CN204088373U CN204088373U CN201420574916.3U CN201420574916U CN204088373U CN 204088373 U CN204088373 U CN 204088373U CN 201420574916 U CN201420574916 U CN 201420574916U CN 204088373 U CN204088373 U CN 204088373U
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- led
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- glass substrate
- transparent glass
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Abstract
The utility model discloses a kind of bent LED silk and bulb structure thereof.This LED silk comprises transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Blue-light LED chip and red LED chip are flip-chip, and chip is arranged on electrode by P-N junction order.A kind of LED is by multiple LED silk, cell-shell, lamp screw base, heat radiation protection gas composition; Multiple above-mentioned LED silk adopts two strings two mode also to connect and is sealed in cell-shell.The utility model, by transparent glass substrate is arranged to arc, effectively increases rising angle and improves light extraction efficiency; Blue chip interval red light chips is set, effectively raises the color rendering index of LED silk.
Description
Technical field
The utility model relates to LED and lighting field thereof, refers in particular to bent LED silk and bulb structure thereof
Background technology
Along with the development of science and technology, LED progressively instead of traditional lighting light fixture.Existing LED generally comprises LED silk, is arranged on the LED chip of LED support both sides and wraps the fluorescent glue of LED chip.Existing LED is generally adopt blue chip and fluorescent material excited white light, and its color rendering index is lower.In addition, what existing LED support generally adopted is that the metal material such as copper, aluminium injects PPA formation, due to the opaqueness of material itself, the side that its rising angle can arrange chip at it at most realizes 180 °, and As time goes on PPA material is easy to aging and yellow variable color, affects its light extraction efficiency.
Summary of the invention
An object of the present utility model is for the deficiencies in the prior art, provides a kind of bent LED silk, and this LED silk overcomes the shortcomings such as LED color rendering index is low, light extraction efficiency is low, blue light leakage lamp.
The utility model LED silk comprises transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; Described transparent glass substrate is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Described blue-light LED chip and red LED chip are flip-chip, and chip is set in sequence on the electrode of the outer intrados of transparent glass substrate by P-N junction; Electrode on the outer intrados of transparent glass substrate is electrically connected by the electrode outlet line of gold thread with transparent glass substrate two ends; Transparent glass substrate, LED chip adopt encapsulating technology to be enclosed with fluorescent material glue-line.
The arc length of described transparent glass substrate is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm;
The material of described fluorescent material glue-line is the composite material of fluorescent material and silica gel;
The utility model LED silk adopts arc clear glass as base plate for packaging (i.e. transparent glass substrate), increase the radiation exiting surface of globular bulb light source, and then increase its luminous flux, improve light extraction efficiency, adopt blue-light LED chip and red LED chip hybrid package mode, effectively add the color rendering index of LED silk, show the real property of object under light more really.
Another object of the present utility model there is provided a kind of LED, by multiple above-mentioned LED silk, cell-shell, lamp screw base, heat radiation protection gas composition; Cell-shell is fixedly connected with lamp screw base, and multiple above-mentioned LED silk adopts two strings two mode also to connect and is sealed in cell-shell, and is filled with heat radiation protection gas in cell-shell;
Described heat radiation protection gas is the inert gases such as helium, hydrogen, helium hydrogen mixed gas, nitrogen or neon.
The utility model forms the main body of LED silk by transparent glass substrate being arranged to arc; Described baseplate material adopts transparent glass substrate, effectively increases rising angle and improves light extraction efficiency; Blue chip interval red light chips is set in the both sides of described substrate, effectively raise the color rendering index of LED silk, adopt 360 ° of molding encapsulating mode point glue, phosphor gel wraps LED silk completely, effectively prevent LED and dazzles the shortcoming such as light and blue light leakage.
Accompanying drawing explanation
Fig. 1 is LED silk schematic diagram of the present utility model;
Fig. 2 is LED lamp structure schematic diagram of the present utility model;
Wherein 1-1 is transparent glass substrate, 1-2 is blue-light LED chip, 1-3 is red LED chip, 1-4 is fluorescent material glue-line, 1-5 is electrode, 1-6 is electrode outlet line, 1-7 gold thread, 1 is LED silk, 2 be cell-shell, 3 be lamp screw base, 4 be heat radiation protection gas.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated.
As shown in Figure 1, the utility model LED silk 1 comprise transparent glass substrate 1-1, LED chip, fluorescent material glue-line 1-4, two be located at electrode 1-5 on the outer intrados of transparent glass substrate 1-1, the electrode outlet line 1-6 at transparent glass substrate 1-1 two ends, gold thread 1-7; Described transparent glass substrate 1-1 is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chip 1-2 and red LED chip 1-3; Described blue-light LED chip 1-2 and red LED chip 1-3 is flip-chip, and chip is set in sequence on the electrode 1-5 of the outer intrados of transparent glass substrate 1-1 by P-N junction; Electrode 1-5 on the outer intrados of transparent glass substrate 1-1 is electrically connected with the electrode outlet line 1-6 at transparent glass substrate 1-1 two ends by gold thread 1-7; Transparent glass substrate 1-1, LED chip adopt encapsulating technology to be enclosed with fluorescent material glue-line 1-4.
The arc length of described transparent glass substrate 1-1 is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm;
The material of described fluorescent material glue-line 1-4 is the composite material of fluorescent material and silica gel;
The utility model LED silk 1 adopts arc clear glass as base plate for packaging (i.e. transparent glass substrate 1-1), increase the radiation exiting surface of globular bulb light source, and then increase its luminous flux, improve light extraction efficiency, adopt blue-light LED chip and red LED chip hybrid package mode, effectively add the color rendering index of LED silk, show the real property of object under light more really.
As shown in Figure 2, a kind of LED is made up of multiple above-mentioned LED silk 1, cell-shell 2, lamp screw base 3, heat radiation protection gas 4; Cell-shell 2 is fixedly connected with lamp screw base 3, and multiple above-mentioned LED silk 1 adopts two strings two mode also to connect and is sealed in cell-shell 2, and is filled with heat radiation protection gas 4 in cell-shell 2;
Described heat radiation protection gas 4 is the inert gases such as helium, hydrogen, helium hydrogen mixed gas, nitrogen or neon.
Above-described embodiment is not that the present invention is not limited only to above-described embodiment for restriction of the present invention, as long as meet application claims, all belongs to protection scope of the present invention.
Claims (2)
1. a LED silk, is characterized in that comprising transparent glass substrate, LED chip, fluorescent material glue-line, two electrode, the electrode outlet line at transparent glass substrate two ends, gold threads be located on the outer intrados of transparent glass substrate; Described transparent glass substrate is arc strip; Described LED chip comprises multiple chip unit, and each chip unit is made up of three blue-light LED chips and a red LED chip; Described blue-light LED chip and red LED chip are flip-chip, and chip is set in sequence on the electrode of the outer intrados of transparent glass substrate by P-N junction; Electrode on the outer intrados of transparent glass substrate is electrically connected by the electrode outlet line of gold thread with transparent glass substrate two ends; Transparent glass substrate, LED chip adopt encapsulating technology to be enclosed with fluorescent material glue-line;
The arc length of described transparent glass substrate is 30.0mm ~ 35.0mm, and width is 0.8mm ~ 1.0mm, and thickness is 0.2 ~ 0.4mm.
2. a LED, is characterized in that by multiple LED silk as claimed in claim 1, cell-shell, lamp screw base, heat radiation protection gas composition; Cell-shell is fixedly connected with lamp screw base, and multiple LED silk as claimed in claim 1 adopts two strings two mode also to connect and is sealed in cell-shell, and is filled with heat radiation protection gas in cell-shell;
Described heat radiation protection gas is inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420574916.3U CN204088373U (en) | 2014-09-30 | 2014-09-30 | Bent LED silk and bulb structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420574916.3U CN204088373U (en) | 2014-09-30 | 2014-09-30 | Bent LED silk and bulb structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204088373U true CN204088373U (en) | 2015-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420574916.3U Expired - Fee Related CN204088373U (en) | 2014-09-30 | 2014-09-30 | Bent LED silk and bulb structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204088373U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300070A (en) * | 2014-09-30 | 2015-01-21 | 杭州电子科技大学 | Bendable LED lamp filament and bulb structure thereof |
| EP3745014A1 (en) * | 2019-05-31 | 2020-12-02 | Leedarson Lighting Co., Ltd. | Light bulb |
-
2014
- 2014-09-30 CN CN201420574916.3U patent/CN204088373U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300070A (en) * | 2014-09-30 | 2015-01-21 | 杭州电子科技大学 | Bendable LED lamp filament and bulb structure thereof |
| EP3745014A1 (en) * | 2019-05-31 | 2020-12-02 | Leedarson Lighting Co., Ltd. | Light bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20150930 |
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| EXPY | Termination of patent right or utility model |