CN203277495U - All light beam angle luminescence LED light source module - Google Patents

All light beam angle luminescence LED light source module Download PDF

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Publication number
CN203277495U
CN203277495U CN2013202975030U CN201320297503U CN203277495U CN 203277495 U CN203277495 U CN 203277495U CN 2013202975030 U CN2013202975030 U CN 2013202975030U CN 201320297503 U CN201320297503 U CN 201320297503U CN 203277495 U CN203277495 U CN 203277495U
Authority
CN
China
Prior art keywords
light source
source module
beam angle
metal electrode
led chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2013202975030U
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Chinese (zh)
Inventor
严钱军
高基伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Hangke Optoelectronics Group Co ltd
Original Assignee
HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU HANGKE PHOTOELECTRIC CO Ltd filed Critical HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
Priority to CN2013202975030U priority Critical patent/CN203277495U/en
Application granted granted Critical
Publication of CN203277495U publication Critical patent/CN203277495U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Led Devices (AREA)

Abstract

The utility model discloses an all light beam angle luminescence LED light source module. The module comprises a transparent substrate, a metal electrode, LED chips and a fluorescent powder wrapping layer. The metal electrode is fixed on the transparent substrate through silk-screen printing. The LED chips are fixed on the transparent substrate. The metal electrode and the LED chips are connected and the LED chips are connected through metal wires so as to form series and parallel structures. The fluorescent powder wrapping layer wraps on the LED chips. By using the light source module provided in the utility model, peripheral space luminescence can be realized and luminous efficiency can be improved above 50%.

Description

The LED light source module that a kind of full beam angle is luminous
Technical field
The utility model relates to a kind of LED light source module, relates in particular to the luminous LED light source module of a kind of full beam angle.
Background technology
Semiconductor light-emitting-diode (LED) illumination is considered to one of field of tool development prospect of 21 century, and it also will be for promoting energy-saving and emission-reduction, setting up conservation-minded society and make major contribution when causing the illumination revolution.
Traditional multi-chip LED light source module generally adopts aluminium base, copper base or ceramic substrate, and is basic own opaque, so after welding the LED light source particle above the light source module, the bright dipping that can only make progress is larger for design, the luminous intensity distribution restriction of light fixture.
Take bulb lamp as example, when opaque substrate module is directly used in lamp, can only reach the effect of half luminous intensity distribution type (beam angle is less than 180 degree) bulb lamp; Want to realize that (beam angle is spent greater than 180 for accurate full luminous intensity distribution (beam angle is greater than 180 degree) in national and foreign standards and full luminous intensity distribution type, and the luminous flux in 135 ~ 180 degree zones be not less than total light flux 5%) requirement, just must increase secondary optical lens in light fixture, increase the cost of light fixture.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of full beam angle luminous LED light source module.
The purpose of this utility model is achieved through the following technical solutions: the LED light source module that a kind of full beam angle is luminous, and it comprises transparency carrier, metal electrode, LED chip and fluorescent material integument; Wherein, described metal electrode is fixed on transparency carrier by silk screen printing, and LED chip is fixed on transparency carrier, between metal electrode and LED chip and all be connected with metal wire between LED chip, forms the series and parallel structure; The fluorescent material integument is wrapped on LED chip.
The beneficial effects of the utility model are, the utility model adopts transparency carrier, and directly be fixed on luminescence chip on transparency carrier with COB (chip on board) technique, such LED light source module can be simultaneously luminous to total space angle when energising, not only significantly increase lighting angle, also can improve light extraction efficiency more than 50%, be used for light fixture and can realize luminous intensity distribution design flexibly, and save the cost of radiator.
Description of drawings
Fig. 1 is the luminous LED light source module schematic diagram of the full beam angle of the utility model;
Fig. 2 is sectional side view;
In figure, transparency carrier 1, metal electrode 2, LED chip 3, metal wire 4, fluorescent material integument 5.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
As shown in Fig. 1-2, the LED light source module that full beam angle of the present utility model is luminous, comprise transparency carrier 1, metal electrode 2, LED chip 3 and fluorescent material integument 5, metal electrode 2 prepares on transparency carrier 1 by silk screen printing, LED chip 3 is fixed on transparency carrier 1, between metal electrode 2 and LED chip 3 and all be connected with metal wire 4 between LED chip 3, form the series and parallel structure, fluorescent material integument 5 is wrapped on LED chip 3.
The LED light source module that the full beam angle of the utility model is luminous adopts transparency carrier, can realize two-sided or multifaceted light-emitting, reaches the luminous effect of total space angle, can improve luminous efficiency more than 50%.

Claims (1)

1. the LED light source module that full beam angle is luminous, is characterized in that, it comprises transparency carrier (1), metal electrode (2), LED chip (3) and fluorescent material integument (5); Wherein, described metal electrode (2) is fixed on transparency carrier (1) by silk screen printing, LED chip (3) is fixed on transparency carrier (1), between metal electrode (2) and LED chip (3) and all be connected with metal wire (4) between LED chip (3), forms the series and parallel structure; Fluorescent material integument (5) is wrapped on LED chip (3).
CN2013202975030U 2013-05-28 2013-05-28 All light beam angle luminescence LED light source module Expired - Lifetime CN203277495U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013202975030U CN203277495U (en) 2013-05-28 2013-05-28 All light beam angle luminescence LED light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013202975030U CN203277495U (en) 2013-05-28 2013-05-28 All light beam angle luminescence LED light source module

Publications (1)

Publication Number Publication Date
CN203277495U true CN203277495U (en) 2013-11-06

Family

ID=49507840

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013202975030U Expired - Lifetime CN203277495U (en) 2013-05-28 2013-05-28 All light beam angle luminescence LED light source module

Country Status (1)

Country Link
CN (1) CN203277495U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112066274A (en) * 2019-06-10 2020-12-11 宁波天炬光电科技有限公司 LED light source module and lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112066274A (en) * 2019-06-10 2020-12-11 宁波天炬光电科技有限公司 LED light source module and lighting device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee after: HANGZHOU HANGKE OPTOELECTRONICS GROUP Co.,Ltd.

Address before: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee before: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20131106