CN112066274A - LED light source module and lighting device - Google Patents

LED light source module and lighting device Download PDF

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Publication number
CN112066274A
CN112066274A CN201910494751.6A CN201910494751A CN112066274A CN 112066274 A CN112066274 A CN 112066274A CN 201910494751 A CN201910494751 A CN 201910494751A CN 112066274 A CN112066274 A CN 112066274A
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China
Prior art keywords
led chip
polarity
pad
led
light
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CN201910494751.6A
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Chinese (zh)
Inventor
王保兴
郭豪杰
李树琪
陈宝瑨
蔡勇
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Ningbo Tianju Optoelectronics Technology Co ltd
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Ningbo Tianju Optoelectronics Technology Co ltd
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Priority to CN201910494751.6A priority Critical patent/CN112066274A/en
Publication of CN112066274A publication Critical patent/CN112066274A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an LED light source module and a lighting device, wherein the LED light source module comprises: a light-transmitting substrate having a first mounting surface and a second mounting surface that are opposite to each other; the LED chip comprises a first LED chip and a second LED chip, wherein the first LED chip is attached to the first mounting surface, the second LED chip is attached to the second mounting surface, and the first LED chip and the second LED chip correspond to each other; a first phosphor layer covering the first LED chip and a second phosphor layer covering the second LED chip. By respectively attaching the single LED chips to the two sides of the light-transmitting substrate and coating the fluorescent layers in a matching manner, compared with a multi-chip combination copying mode, the light-emitting diode is closer to the actual light-emitting area of the halogen lamp, the light-emitting shape is compact, the light field is also close to the halogen lamp, and the halogen lamp can be replaced and applied better.

Description

LED light source module and lighting device
Technical Field
The invention belongs to the technical field of manufacturing of light-emitting semiconductors, and particularly relates to an LED light source module and a lighting device with the same.
Background
As a new illumination light source, LED has a development trend of a new generation of light source due to its advantages of long life, high luminous efficiency, multiple light colors, and one-time light distribution directional irradiation function, and can operate under a safe voltage. At present, with the popularization of the LED light source, the LED light source imitating the halogen filament is also increasingly popularized and applied widely. In the prior art, the halogen filament-imitated LED light source scheme is generally used by a single chip or a module composed of multiple chips based on a conventional LED blue light chip, and the light source scheme is implemented by coating fluorescent powder on the chip or the module. There is a problem in that the light emitting region shape of such an LED light source is greatly different from that of a halogen filament, which is disadvantageous for practical replacement applications.
Disclosure of Invention
In view of the above, the present invention provides an LED light source module and a lighting device, so as to simulate the shape of a light emitting region of a halogen lamp, and facilitate the replacement of the halogen lamp.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an LED light source module, comprising:
a light-transmitting substrate having a first mounting surface and a second mounting surface that are opposite to each other;
the first LED chip is attached to the first mounting surface, the second LED chip is attached to the second mounting surface, and the first LED chip and the second LED chip correspond to each other;
the LED chip comprises a first fluorescent layer covering the first LED chip and a second fluorescent layer covering the second LED chip.
In one embodiment, a vertical projection of the first LED chip on the light-transmitting substrate is located within a vertical projection of the second LED chip on the light-transmitting substrate.
In one embodiment, the vertical projections of the first LED chip and the second LED chip on the light-transmitting substrate overlap each other.
In one embodiment, the ratio of the coverage area of the first fluorescent layer to the light emitting area of the first LED chip is less than or equal to 1.3; and/or the ratio of the coverage area of the second fluorescent layer to the light emitting area of the second LED chip is less than or equal to 1.3.
In one embodiment, a perpendicular projection of the first phosphor layer on the light-transmissive substrate is located within a perpendicular projection of the second phosphor layer on the light-transmissive substrate.
In one embodiment, perpendicular projections of the first and second phosphor layers on the light-transmitting substrate overlap each other.
In one embodiment, the LED light source module further includes:
the first conducting layer is arranged on the first mounting surface and comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conducting layer through leads respectively; and/or the presence of a gas in the gas,
and the second conductive layer is arranged on the second mounting surface and comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
In one embodiment, the first polarity path of the first conductive layer includes a first lead pad and a first external pad at two ends thereof, the second polarity path of the first conductive layer includes a second lead pad and a second external pad at two ends thereof, the first lead pad has an area smaller than that of the first external pad, the second lead pad has an area smaller than that of the second external pad, and the first LED chip is connected to the first lead pad and the second lead pad through wires, respectively; and/or the presence of a gas in the gas,
the first polarity route of second conducting layer is including the third lead wire pad and the external pad of third that are located its both ends, the second polarity route of second conducting layer is including the fourth lead wire pad and the external pad of fourth that are located its both ends, the area of third lead wire pad is less than the external pad of third, the area of fourth lead wire pad is less than the external pad of fourth, the second LED chip is respectively through pin connection to third lead wire pad and fourth lead wire pad.
In one embodiment, the first LED chip includes a first polarity pad and a second polarity pad on the same side, and the first polarity pad and the second polarity pad of the first LED chip are respectively connected to the first polarity path and the second polarity path of the first conductive layer through leads on the same side; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity bonding pad and a second polarity bonding pad which are positioned on the same side of the second LED chip, and the first polarity bonding pad and the second polarity bonding pad of the second LED chip are respectively connected to the first polarity access and the second polarity access of the second conducting layer through leads on the same side.
In one embodiment, the first LED chip includes a first polarity wire and a second polarity wire connected to a first polarity pad and a second polarity pad thereof, respectively, the first polarity wire of the first LED chip gradually decreases in width in a direction away from the first polarity pad thereof, and the second polarity wire of the first LED chip gradually decreases in width in a direction away from the second polarity pad thereof; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity wiring and a second polarity wiring which are respectively connected with a first polarity bonding pad and a second polarity bonding pad of the second LED chip, the width of the first polarity wiring of the second LED chip in the direction far away from the first polarity bonding pad of the second LED chip is gradually reduced, and the width of the second polarity wiring of the second LED chip in the direction far away from the second polarity bonding pad of the second LED chip is gradually reduced.
In one embodiment, the leads are selected from one or a combination of curable conductive leads, wire-type leads, conductive strips; preferably, the curable conductive leads are selected from one or a combination of silver paste leads, conductive ink leads, and solder paste leads.
In one embodiment, the first LED chip and the second LED chip have a length of 1-12 mm and a width of 0.5-5 mm; and/or the thickness of the light-transmitting substrate is 0.5 mm-5 mm; and/or the power of the first LED chip and the second LED chip is 0.5-50W; and/or the voltage of the first LED chip and the second LED chip is 80-200V.
In one embodiment, the first LED chip and the second LED chip respectively include a plurality of unit cells capable of emitting light independently, and the plurality of unit cells are connected in series and/or in parallel.
An embodiment of the present application further provides a lighting device, including the LED light source module described above.
The invention has the following beneficial effects: by respectively attaching the single LED chips to the two sides of the light-transmitting substrate and coating the fluorescent layers in a matching manner, compared with a multi-chip combination copying mode, the light-emitting diode is closer to the actual light-emitting area of the halogen lamp, the light-emitting shape is compact, the light field is also close to the halogen lamp, and the halogen lamp can be replaced and applied better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a perspective view of an LED light source module according to an embodiment of the present invention, the LED light source module being configured in a direction perpendicular to a substrate;
FIG. 2 is a perspective view of an LED light source module according to an embodiment of the present invention;
FIG. 3 is a perspective view of an LED light source module according to another embodiment of the present invention, the LED light source module being configured in a direction perpendicular to a substrate;
FIG. 4 is a perspective view of an LED light source module according to another embodiment of the present invention;
fig. 5 and 6 are schematic structural diagrams of the LED chip of the LED light source module according to the present invention, in which the bonding pads are disposed on two sides and on the same side.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, an embodiment of an LED light source module 100 according to the present invention is described. In the present embodiment, the LED light source module 100 includes a light-transmitting substrate 10, a first LED chip 20, a second LED chip 30, a first fluorescent layer 40, and a second fluorescent layer 50.
The transparent substrate 10 may be made of a transparent or translucent material, such as sapphire, silicon carbide, glass, or an organic transparent material, or the transparent substrate 10 may be made of a laminated combination of these materials to meet the requirements of practical applications regarding processing strength and transparency. The light-transmitting substrate 10 has a first mounting surface 11 and a second mounting surface 12 which are opposite to each other, the first LED chip 20 and the second LED chip 30 are respectively attached to the first mounting surface 11 and the second mounting surface 12, and the first LED chip 20 and the second LED chip 30 correspond to each other, where the correspondence is: the positions of the first and second LED chips 20 and 30 at both sides of the light-transmitting substrate 10 are substantially the same.
Referring to fig. 5, in an embodiment, the first LED chip 20 and the second LED chip 30 respectively include a plurality of unit cells capable of independently emitting light, and the plurality of unit cells are connected in series and/or in parallel with each other. The structure can reduce the distance between the basic luminous units on one hand, and can also obtain a larger luminous surface in a chip with the same size on the other hand, thereby effectively improving the power density of the chip. In the present embodiment, the first mounting surface 11 and the second mounting surface 12 of the light-transmitting substrate 10 are respectively provided with only a single one of the first LED chip 20 and the second LED chip 30, so as to provide sufficient optical power while simulating the light-emitting shape of a halogen lamp.
The first LED chip 20 and the second LED chip 30 are directly attached on the light-transmitting substrate 10, respectively. Of course, in an alternative embodiment, if the transparent substrate 10 itself is made of a conductive material, a non-conductive transparent material may be disposed at the corresponding attaching positions of the first LED chip 20 and the second LED chip 30 on both sides of the transparent substrate 10, so as to achieve the same technical effect.
In one embodiment, the vertical projection of the first LED chip 20 on the transparent substrate 10 is located within the vertical projection of the second LED chip 30 on the transparent substrate 10, that is, the position and size of the first LED chip 20 are set to be at least not deviated from the vertical projection of the second LED chip 30 on the transparent substrate 10. In a further preferred embodiment, the vertical projections of the first LED chip 20 and the second LED chip 30 on the transparent substrate 10 overlap each other, that is, the first LED chip 20 and the second LED chip 30 are set to be the same in size and completely correspond to each other in position on both sides of the transparent substrate 10, so as to better simulate the light emitting shape of a halogen lamp.
The first and second phosphor layers 40 and 50 respectively cover the first and second LED chips 20 and 30, wherein the first and second phosphor layers 40 and 50 are typically curable light-transmissive materials mixed with phosphor, for example, silica gel mixed with phosphor in one embodiment. The coverage area of the first phosphor layer 40 and the second phosphor layer 50 is preferably set to be slightly larger than the light emitting area of the first LED chip 20 and the second LED chip 30, and it should be noted that the light emitting area of the first LED chip 20 and the second LED chip 30 is referred to as the light emitting area of the first LED chip 20 and the second LED chip 30 in the direction perpendicular to the light-transmitting substrate 10.
In one embodiment, the ratio of the coverage area of the first fluorescent layer 40 to the light emitting area of the first LED chip 20 is less than or equal to 1.3; and/or the ratio of the coverage area of the second fluorescent layer 50 to the light emitting area of the second LED chip 30 is less than or equal to 1.3.
In the present embodiment, the first mounting surface 11 of the transparent substrate 10 is further provided with a first conductive layer (not shown), and the second mounting surface 12 of the transparent substrate 10 is further provided with a second conductive layer (not shown). The first conductive layer includes a first polarity via 61 and a second polarity via 62, and the first LED chip 20 is connected to the first polarity via 61 and the second polarity via 62 of the first conductive layer through wires 80, respectively; the second conductive layer also includes a first polarity path (not labeled) and a second polarity path 72, and the second LED chip 30 is connected to the first polarity path and the second polarity path 72 of the second conductive layer by wires 80, respectively.
Specifically, the first LED chip 20 includes a first polarity pad 21 and a second polarity pad 22 at two opposite sides thereof, the first polarity pad 21 of the first LED chip 20 is connected to the first polarity path 61 of the first conductive layer through a wire 80, and the second polarity pad 22 of the first LED chip 20 is connected to the second polarity path 62 of the first conductive layer through a wire 80; the second LED chip 30 includes a first polarity pad 31 and a second polarity pad 32 at opposite sides thereof, the first polarity pad 31 of the second LED chip 30 is connected to the first polarity path of the second conductive layer through a wire 80, and the second polarity pad 32 of the second LED chip 30 is connected to the second polarity path 72 of the second conductive layer through a wire 80.
Referring to fig. 5, the first LED chip 20 includes a first polarity wire and a second polarity wire connected to a first polarity pad 21 and a second polarity pad 22 of the first LED chip, respectively, the first polarity wire and the second polarity wire of the first LED chip 20 are distributed in a finger-inserting shape, the width of the first polarity wire of the first LED chip in a direction away from the first polarity pad 21 is gradually reduced, and the width of the second polarity wire in a direction away from the second polarity pad 22 is gradually reduced; similarly, in the second LED chip 30 not shown in the drawings, the first polarity wiring and the second polarity wiring thereon are also distributed in a finger-inserted shape, and the widths thereof in the directions respectively away from the first polarity pad 31 and the second polarity pad 32 thereon are also gradually reduced. By such an arrangement, the first LED chip 20 and the second LED chip 30 can have a larger light emitting area, and the light emitting efficiency of the chips is improved.
The two electrodes of the first LED chip 20 and the second LED chip 30 are connected to the corresponding polarity paths through only one lead 80, wherein the lead 80 can be one or a combination of a curable conductive lead, a linear lead, a conductive strip, and a conductive sheet. In one embodiment, the curable conductive leads are selected from one or a combination of silver paste leads, conductive ink leads, and solder paste leads. Through setting up the mode of optional multiple electric connection, can be according to the practical application needs, the combination of the different electric connection modes of configuration, it is more nimble convenient.
In this embodiment, the first polarity path 61 of the first conductive layer includes a first lead pad 611 and a first external pad 612 at both ends thereof, the second polarity path 62 of the first conductive layer includes a second lead pad 621 and a second external pad 622 at both ends thereof, the area of the first lead pad 611 is smaller than that of the first external pad 612, the area of the second lead pad 621 is smaller than that of the second external pad 622, the first LED chip 20 is connected to the first lead pad 611 and the second lead pad 621 through a lead 80, respectively; and, the first polarity path of the second conductive layer includes a third lead pad 711 and a third external pad (not shown) at both ends thereof, the second polarity path 72 of the second conductive layer includes a fourth lead pad 721 and a fourth external pad 722 at both ends thereof, the area of the third lead pad 711 is smaller than that of the third external pad, the area of the fourth lead pad 721 is smaller than that of the fourth external pad 722, and the second LED chip 30 is connected to the third lead pad 711 and the fourth lead pad 721 through the wire 80, respectively.
In an embodiment of practical processing application, the first LED chip 20 and the second LED chip 30 have a length of 1 to 12mm and a width of 0.5 to 5 mm; and/or the thickness of the light-transmitting substrate 10 is 0.5 mm-5 mm; and/or the power of the first LED chip 20 and the second LED chip 30 is 0.5-50W; and/or the voltage of the first LED chip 20 and the second LED chip 30 is 80-200V.
The light field, processing and reliability requirements can be met by proper thickness of the light-transmitting substrate, and full-angle light emission is realized. The first LED chip 20 and the second LED chip 30 are disposed to be close to or identical to the halogen filament, and ensure light emitting power through a multi-cell structure, and the chip voltage can be ensured to be adapted to a commercially available LED driving voltage, so as to facilitate replacement application.
Fig. 3, 4 and 6 show another embodiment of an LED light source module 200 according to the present invention. Unlike the previous embodiment, in the present embodiment, the first polarity pad 21a and the second polarity pad 22a on the first LED chip 20a are located on the same side of the chip, and the first polarity pad and the second polarity pad 32a on the second LED chip 30a are also located on the same side of the chip, so that the first polarity pad 21a and the second polarity pad 22a of the first LED chip 20a can be connected to the first polarity via 61a and the second polarity via 62a of the first conductive layer through the lead 80a on the same side, respectively, and similarly, the first polarity pad and the second polarity pad 32a of the second LED chip 30a can also be connected to the first polarity via (not shown) and the second polarity via 72a of the second conductive layer through the lead 80a on the same side, respectively. Thus, when the LED light source module 200 is used for high-temperature bubble sealing, the sealing can be performed at the end of the LED light source module 200 away from the bonding pads on the first LED chip 20a and the second LED chip 30a, so as to avoid the failure of the chips and the leads caused by the high temperature, and ensure the reliability of the LED light source module 200. An embodiment of the present application also provides a lighting device, which includes an LED light source module, and the LED light source module may be fully referenced to the LED light source module 100 mentioned in the above embodiments/examples. Further, since the other parts of the lighting device are not improved, further description of the structure of the other parts of the lighting device is omitted here.
According to the technical scheme, the invention has the following advantages:
according to the invention, the single LED chips are respectively attached to the two sides of the light-transmitting substrate, and the fluorescent layer is coated in a matching manner, so that compared with a multi-chip combination copying mode, the shape of an actual light emitting region of the halogen lamp is closer, the light emitting shape is compact, the light field is also close to the halogen lamp, and the replacement application of the halogen lamp can be better realized.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An LED light source module, comprising:
a light-transmitting substrate having a first mounting surface and a second mounting surface that are opposite to each other;
the first LED chip is attached to the first mounting surface, the second LED chip is attached to the second mounting surface, and the first LED chip and the second LED chip correspond to each other;
the LED chip comprises a first fluorescent layer covering the first LED chip and a second fluorescent layer covering the second LED chip.
2. The LED light source module as claimed in claim 1, wherein a vertical projection of the first LED chip on the light-transmissive substrate is located within a vertical projection of the second LED chip on the light-transmissive substrate; and/or the vertical projections of the first LED chip and the second LED chip on the light-transmitting substrate are overlapped with each other; and/or the ratio of the coverage area of the first fluorescent layer to the light emitting area of the first LED chip is less than or equal to 1.3; and/or the ratio of the coverage area of the second fluorescent layer to the light emitting area of the second LED chip is less than or equal to 1.3; and/or the vertical projection of the first fluorescent layer on the light-transmitting substrate is positioned in the vertical projection of the second fluorescent layer on the light-transmitting substrate; and/or the vertical projections of the first fluorescent layer and the second fluorescent layer on the light-transmitting substrate are overlapped with each other.
3. The LED light source module of claim 1 or 2, further comprising:
the first conducting layer is arranged on the first mounting surface and comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conducting layer through leads respectively; and/or the presence of a gas in the gas,
and the second conductive layer is arranged on the second mounting surface and comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
4. The LED light source module as claimed in claim 3, wherein the first polarity path of the first conductive layer includes a first lead pad and a first external pad at two ends thereof, the second polarity path of the first conductive layer includes a second lead pad and a second external pad at two ends thereof, the first lead pad has an area smaller than that of the first external pad, the second lead pad has an area smaller than that of the second external pad, and the first LED chip is connected to the first lead pad and the second lead pad through leads, respectively; and/or the presence of a gas in the gas,
the first polarity route of second conducting layer is including the third lead wire pad and the external pad of third that are located its both ends, the second polarity route of second conducting layer is including the fourth lead wire pad and the external pad of fourth that are located its both ends, the area of third lead wire pad is less than the external pad of third, the area of fourth lead wire pad is less than the external pad of fourth, the second LED chip is respectively through pin connection to third lead wire pad and fourth lead wire pad.
5. The LED light source module as claimed in claim 3, wherein the first LED chip includes a first polarity pad and a second polarity pad on the same side, and the first polarity pad and the second polarity pad of the first LED chip are respectively connected to the first polarity path and the second polarity path of the first conductive layer through leads on the same side; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity bonding pad and a second polarity bonding pad which are positioned on the same side of the second LED chip, and the first polarity bonding pad and the second polarity bonding pad of the second LED chip are respectively connected to the first polarity access and the second polarity access of the second conducting layer through leads on the same side.
6. The LED light source module according to claim 5, wherein the first LED chip comprises a first polarity wire and a second polarity wire connected to the first polarity pad and the second polarity pad thereof, respectively, the first polarity wire of the first LED chip gradually decreases in width in a direction away from the first polarity pad thereof, and the second polarity wire of the first LED chip gradually decreases in width in a direction away from the second polarity pad thereof; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity wiring and a second polarity wiring which are respectively connected with a first polarity bonding pad and a second polarity bonding pad of the second LED chip, the width of the first polarity wiring of the second LED chip in the direction far away from the first polarity bonding pad of the second LED chip is gradually reduced, and the width of the second polarity wiring of the second LED chip in the direction far away from the second polarity bonding pad of the second LED chip is gradually reduced.
7. The LED light source module as claimed in claim 3, wherein the leads are selected from one or a combination of curable conductive leads, linear leads, conductive strips, and conductive sheets; preferably, the curable conductive leads are selected from one or a combination of silver paste leads, conductive ink leads, and solder paste leads.
8. The LED light source module as claimed in claim 3, wherein the first LED chip and the second LED chip have a length of 1-12 mm and a width of 0.5-5 mm; and/or the thickness of the light-transmitting substrate is 0.5 mm-5 mm; and/or the power of the first LED chip and the second LED chip is 0.5-50W; and/or the voltage of the first LED chip and the second LED chip is 80-200V.
9. The LED light source module of claim 1, wherein the first LED chip and the second LED chip respectively comprise a plurality of unit cells capable of emitting light independently, and the plurality of unit cells are connected in series and/or in parallel with each other.
10. An illumination device is characterized by comprising the LED light source module.
CN201910494751.6A 2019-06-10 2019-06-10 LED light source module and lighting device Pending CN112066274A (en)

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CN208503968U (en) * 2018-05-15 2019-02-15 海宁市鑫诚电子有限公司 A kind of LED luminescence component that power drives are integrated with LED light source
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CN103292173A (en) * 2013-04-28 2013-09-11 杭州杭科光电股份有限公司 4 Pi luminous LED light source module
CN203277495U (en) * 2013-05-28 2013-11-06 杭州杭科光电股份有限公司 All light beam angle luminescence LED light source module
CN103322453A (en) * 2013-06-08 2013-09-25 杭州杭科光电股份有限公司 Light-emitting diode (LED) light source module capable of emitting light evenly in full space
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