WO2014013672A1 - Bulb-type lamp and illumination device - Google Patents

Bulb-type lamp and illumination device Download PDF

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Publication number
WO2014013672A1
WO2014013672A1 PCT/JP2013/003666 JP2013003666W WO2014013672A1 WO 2014013672 A1 WO2014013672 A1 WO 2014013672A1 JP 2013003666 W JP2013003666 W JP 2013003666W WO 2014013672 A1 WO2014013672 A1 WO 2014013672A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
light
substrate
led
emitting element
Prior art date
Application number
PCT/JP2013/003666
Other languages
French (fr)
Japanese (ja)
Inventor
直紀 田上
倉地　敏明
功幸 長浜
考志 大村
健太 渡邉
Original Assignee
パナソニック株式会社
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Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013541106A priority Critical patent/JP5417556B1/en
Publication of WO2014013672A1 publication Critical patent/WO2014013672A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp).
  • bulb-shaped LED lamp an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink.
  • a metal casing that functions as a heat sink is provided between a hemispherical globe and a base, and the LED module is placed on the upper surface of the metal casing. ing.
  • the LED module used for the bulb-type LED lamp is usually configured to extract light from only one side of the substrate (the surface on which the LED is mounted). Therefore, even if the above-described replacement configuration is used, the luminous flux toward the base side of the bulb-type LED lamp is low, and it is difficult to realize a wide light distribution angle.
  • another LED module that emits light toward the base can be added to the back surface (the surface on which the LED is not mounted) of the substrate of one LED module.
  • the light emitted directly from the LED of one LED module passes through the substrate and is emitted as the light of the other LED module. Therefore, the light is emitted in all directions by the two LED modules. Color unevenness occurs.
  • the present invention has been made to solve such a problem, and an object of the present invention is to provide a light bulb shaped lamp and a lighting device having a wide light distribution angle and capable of suppressing color unevenness.
  • an aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a support column provided to extend inward of the glove, and the glove.
  • a first wavelength conversion unit configured to cover the first light emitting element group and convert a wavelength of light emitted from the first light emitting element group, and the sub light emitting module is provided on a back surface of the substrate.
  • a second light emitting element group composed of a plurality of second light emitting elements, and a second wavelength conversion unit that is provided so as to cover the second light emitting element group and converts the wavelength of light emitted by the second light emitting element group
  • the first light emitting device The second light emitting element is disposed so as to face the first wavelength converter with the substrate interposed therebetween, and the second light emitting element is disposed so as to face the first wavelength converter with the substrate interposed therebetween.
  • the first light emitting element may be disposed to face the second light emitting element with the substrate interposed therebetween.
  • a center position of the first light emitting element is relative to a center position of the first wavelength conversion unit in a direction orthogonal to the arrangement direction of the plurality of first light emitting elements.
  • the center position of the second light emitting element is shifted from the center position of the second wavelength conversion unit in the direction orthogonal to the arrangement direction of the plurality of second light emitting elements, and the first light emission
  • the direction of element displacement and the direction of displacement of the second light emitting element may be opposite to each other.
  • the substrate includes: a main substrate on which the first light emitting element group is provided on a surface; and a sub substrate on which the second light emitting element group is provided on the surface.
  • the main substrate and the sub-substrate may be arranged such that back surfaces not provided with the first light emitting element group and the second light emitting element group are opposed to each other.
  • the first light emitting element group is composed of a plurality of first light emitting elements connected in series, and the second light emitting element group is a plurality of connected in series.
  • the first light-emitting element group may include the same number of elements as the second light-emitting element group.
  • the sub light emitting module is directly attached to the support column, and heat generated in the sub light emitting module is transferred to the support column, and the main light emitting module Is indirectly attached to the support via the sub-light-emitting module, and heat generated by the main light-emitting module is indirectly transferred to the support via the sub-light-emitting module.
  • a heat conducting member may be provided between the main light emitting module and the sub light emitting module.
  • the heat conducting member may be any one of a heat conducting resin, a ceramic paste, and a metal paste.
  • the sub-light emitting module may be bonded and fixed to the support column.
  • the substrate has a light reflectance of 50% or more with respect to light emitted from the first light emitting element group and the second light emitting element group. Can do.
  • the substrate may be mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2 .
  • the surface of the support column has a light reflectance of 30% or more with respect to light emitted from the first light emitting element group and the second light emitting element group. can do.
  • the support column may be mainly composed of any one of Al, Cu, and Fe.
  • the main light emitting module has at least two or more first light emitting element groups, and the sub light emitting module has at least two or more second light emitting elements. It has an element group.
  • an aspect of the lighting device according to the present invention is characterized by including the above-described light bulb shaped lamp.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. .
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are sectional views. .
  • FIG. 7 is an enlarged cross-sectional view showing a detailed configuration of a modified example of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8 is an enlarged cross-sectional view showing a detailed configuration of another modified example of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 9 is an enlarged cross-sectional view showing a detailed configuration of another modified example of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 is an enlarged cross-sectional view showing a detailed configuration of a modified example of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8 is an enlarged cross-sectional view showing a detailed configuration of another modified example of the light bulb shaped lamp according to the embodiment of the present
  • FIG. 10 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention, where (a) is a top view, and (b), (c), (d) and (e) are cross sections.
  • FIG. FIG. 11 is a diagram showing a configuration of a modification of the light bulb shaped lamp according to the embodiment of the present invention, in which (a) is a top view, and (b), (c), (d), and (e) are cross sections.
  • FIG. FIG. 12 is a cross-sectional view of a modification of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the paper is the front (upper) of the light bulb shaped lamp 1
  • the lower side of the paper is the rear (lower) of the light bulb shaped lamp 1
  • the left and right sides of the paper are the side of the light bulb shaped lamp 1.
  • “rear” refers to the direction of the base with respect to the substrate of the LED module
  • “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module.
  • the bulb-type lamp 1 is a bulb-type LED lamp (LED bulb) that is a substitute for a bulb-type fluorescent lamp or an incandescent bulb.
  • the light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70 and a lighting circuit 80.
  • the bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30.
  • the globe 10 houses the LED modules 20a and 20b.
  • the globe 10 is a light-transmitting globe that is made of a material that is transparent to the light from the LED modules 20a and 20b, and transmits the light from the LED modules 20a and 20b to the outside of the lamp.
  • a globe 10 for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light can be used.
  • the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the globe 10 does not need to be made of silica glass.
  • a globe 10 made of a resin material such as acrylic may be used.
  • the LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires.
  • the LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the support column 40.
  • the LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
  • the LED modules 20a and 20b are arranged so that the main surfaces (front surface and back surface) of the substrate intersect the lamp axis, for example, substantially perpendicular.
  • the LED module 20 a emits light toward the front of the light bulb shaped lamp 1
  • the LED module 20 b emits light toward the rear of the light bulb shaped lamp 1.
  • the lamp axis is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
  • the LED modules 20a and 20b configured in this way are configured as a single-sided light emitting LED module that emits light from both sides.
  • the detailed configuration of the LED modules 20a and 20b will be described later.
  • the base 30 is a power receiving unit that receives electric power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.
  • the base 30 is attached to a socket of a lighting fixture (lighting device), and turns on the light bulb shaped lamp 1 (LED modules 20a and 20b) by receiving power from the socket.
  • the base 30 is E-shaped, and a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface thereof, and a screwing portion for screwing the resin case 60 on the inner peripheral surface thereof. Is formed.
  • the base 30 has a bottomed cylindrical shape made of metal.
  • an E26 type or E17 type base or the like can be used as a screw-in type Edison type (E type) base.
  • a plug-in base may be used as the base 30.
  • the support column 40 is a stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and functions as a holding member that holds the LED modules 20 a and 20 b in the globe 10.
  • One end of the column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.
  • the support column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Accordingly, the heat radiation efficiency of the support column 40 can be increased by forming the support column 40 from a metal material having a high thermal conductivity, for example, aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As a result, it is possible to suppress a decrease in light emission efficiency and lifetime of the LED due to temperature rise.
  • pillar 40 can also be comprised with resin etc.
  • the support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area.
  • One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50.
  • the fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b.
  • the fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b.
  • the LED modules 20a and 20b and the fixed surface are bonded to each other with a resin adhesive such as a silicone resin.
  • the support base (support plate) 50 is a member that supports the support column 40 and is fixed to the resin case 60.
  • the support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10.
  • the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, like the support column 40, so that the heat radiation efficiency of the LED modules 20a and 20b that conduct the heat of the support column 40 by the support table 50 is increased. It is done. As a result, it is possible to further suppress the decrease in light emission efficiency and lifetime of the LED due to temperature rise.
  • the resin case 60 is an insulating case (circuit holder) that insulates the support column 40 and the base 30 and houses the lighting circuit 80.
  • the resin case 60 has a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second.
  • the case part 62 is comprised.
  • the resin case 60 can be molded by, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been.
  • the lead wire 70 also functions as a support portion that supports the LED modules 20a and 20b by being partly connected to the external terminals of the LED modules 20a and 20b.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.
  • the lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted.
  • the lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20a and 20b via the two lead wires 70. It is a drive circuit.
  • the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80.
  • the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 is a diagram showing a configuration of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 5 is an enlarged cross-sectional view of LEDs in the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1.
  • FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A
  • FIG. 4C is a line BB ′ in FIG.
  • FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A.
  • (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the LED module 20a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 21.
  • the LED module 20b is an example of a sub light emitting module (second light emitting module) and has a COB structure in which a bare chip is directly mounted on the back surface (the other main surface) of the substrate 21.
  • the LED module 20 a includes a substrate 21, a plurality of LEDs 22 provided on the surface of the substrate 21, a sealing member 23, metal wirings 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal (external terminal) 28. I have.
  • the LED module 20 b includes a substrate 21, a plurality of LEDs 32 provided on the back surface of the substrate 21, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.
  • the substrate 21 is, for example, a ceramic substrate made of a ceramic material such as aluminum oxide (alumina) or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate.
  • the substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22 and 32.
  • LED mounting substrate LED mounting substrate
  • the substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less, or a metal substrate.
  • the substrate 21 has a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32, and is composed of a substrate mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. be able to.
  • the light transmittance of the substrate 21 is high, a part of the light of the LED 22 on the front surface side of the substrate 21 is emitted from the back surface side of the substrate 21 in the LED module 20 a after passing through the substrate 21.
  • the LED module 20 b a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.
  • Two through holes 21b that penetrate from the front surface to the back surface of the substrate 21 are provided at both ends of the long side direction of the substrate 21. These two through holes 21b constitute terminals 28 and 38 for connecting the power supply lead wire 70 and the LED modules 20a and 20b, and the lead wire 70 is inserted into each of the two through holes 21b. .
  • one through hole 21 a that penetrates from the front surface to the back surface of the substrate 21 is provided.
  • the through-hole 21a is for fixing the LED modules 20a and 20b to the support column 40, and the protruding portion 42b of the support column 40 is fitted into the through-hole 21a.
  • the through hole 21a may not be provided.
  • a plurality of LEDs 22 are mounted on the surface of the substrate 21.
  • the plurality of LEDs 22 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22 in the element row of the LED 22. They are arranged so that they are lined up.
  • the plurality of LEDs 22 are connected in series in the element rows, and are connected in parallel in the element rows. This element row is an example of the first light emitting element group.
  • the distance (pitch) between adjacent LEDs 22 in the element row is 1.8 mm
  • the distance between the LED 22 in one element row and the LED 22 in the other element row in the adjacent element row is, for example, 4 mm. It is arranged to become.
  • a plurality of LEDs 32 are mounted on the back surface of the substrate 21.
  • the plurality of LEDs 32 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 32 in the element row of the LED 32. They are arranged so that they are lined up.
  • the plurality of LEDs 32 are connected in series in the element rows, and are connected in parallel in the element rows. This element row is an example of the second light emitting element group.
  • the LED 22 is disposed to face the sealing member 33 with the substrate 21 interposed therebetween, and the LED 32 is disposed to face the sealing member 23 with the substrate 21 interposed therebetween.
  • the entire lower surface of the LED 22 in contact with the substrate 21 faces the sealing member 33, and the entire lower surface of the LED 32 in contact with the substrate 21 faces the sealing member 23.
  • the entire LED 22 exists in the region B above the sealing member 33, and the entire LED 32 exists in the region A below the sealing member 23.
  • the LED 32 is disposed so as to be shifted toward the support column 40 with respect to the LED 22 in the short side direction of the substrate 21.
  • the LEDs 22 and 32 are arranged such that the position of one end of the LED 22 matches the position of one end of the sealing member 33 and the position of one end of the LED 32 matches the position of one end of the sealing member 23 in the short side direction of the substrate 21.
  • the LEDs 22 and 32 are mounted such that the non-mounting area of the LED 22 on the front surface of the substrate 21 and the mounting area of the LED 32 on the back surface of the substrate 21 face each other. Thereby, the heat
  • the LEDs 22 and 32 are bare chips that emit monochromatic visible light in all directions, that is, laterally, upwardly and downwardly.
  • the LEDs 22 and 32 emit, for example, 20% of the total amount of light laterally, 60% of the total amount of light upward, and 20% of the total amount of light downward.
  • the LEDs 22 and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, having a side length of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
  • the LEDs 22 and 32 include a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b that are stacked on the sapphire substrate 22a and have different compositions.
  • a cathode electrode 22c and an anode electrode 22d are provided at both ends of the upper surface of the nitride semiconductor layer 22b.
  • a wire bond portion 22e is provided on the cathode electrode 22c, and a wire bond portion 22f is provided on the anode electrode 22d.
  • the cathode electrode 22c of one LED 22 and the anode electrode 22d of the other LED 22 are connected by a wire 25 via wire bond portions 22e and 22f.
  • the LEDs 22 and 32 are fixed on the substrate 21 with a translucent chip bonding material 22g so that the surface on the sapphire substrate 22a side faces the front surface or the back surface of the substrate 21.
  • a translucent material for the chip bonding material 22g By using a translucent material for the chip bonding material 22g, the loss of light emitted from the side surface of the LED 22 can be reduced, and the generation of shadows by the chip bonding material 22g can be suppressed.
  • the sealing member 23 is a conversion member that converts the wavelength of light emitted from the LED 22, and is formed to cover the LED 22.
  • the sealing member 23 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22 and a resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by light emitted from the LED 22 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 23.
  • phosphor particles when the LED 22 is a blue LED chip that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23.
  • YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23.
  • the white light is emitted from the sealing member 23.
  • green phosphor particles, red phosphor particles, and the like may be used as the phosphor particles.
  • the LED 22 is an LED 22 that emits ultraviolet light
  • a combination of phosphor particles that emit light in the three primary colors (red, green, and blue) is used.
  • the resin material containing the phosphor particles a transparent resin material such as a silicone resin, an organic material such as a fluorine-based resin, and an inorganic material such as low-melting glass and sol-gel glass can be used.
  • the sealing member 23 having the above-described configuration is formed linearly along the arrangement direction of the plurality of LEDs 22 constituting the element row, and collectively seals the element rows of the LED 22. At the same time, a plurality of sealing members 23 are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • Each sealing member 23 has a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.
  • the sealing member 23 is arranged so as to be shifted to the opposite side of the support column 40 with respect to the sealing member 33 in the short side direction of the substrate 21.
  • the sealing member 23 is provided so that at least a part thereof is positioned above the LED 32 and is in contact with the surface of the substrate 21 above the LED 32.
  • the sealing member 23 located above the LED 32 converts the wavelength of the light of the LED 32 that is transmitted from the surface of the substrate 21 and emitted from the surface of the substrate 21 (the light of the LED 32 that passes through the surface of the substrate 21).
  • the sealing member 33 is a conversion member that converts the wavelength of light emitted by the LED 32 and is formed so as to cover the LED 32.
  • the sealing member 33 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and a resin material that contains the wavelength conversion material.
  • the wavelength conversion material phosphor particles that are excited by the light emitted from the LED 32 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light.
  • the sealing member 33 is formed linearly along the arrangement direction of the plurality of LEDs 32 constituting the element row, and collectively seals the element rows of the LED 32. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and individually seal different element rows.
  • the sealing member 33 is arranged so as to be shifted toward the support column 40 with respect to the sealing member 23 in the short side direction of the substrate 21.
  • the sealing member 33 is provided so that at least a part thereof is located below the LED 22 and is in contact with the back surface of the substrate 21 below the LED 22.
  • the sealing member 33 located below the LED 22 converts the wavelength of the light of the LED 22 that is transmitted through the substrate 21 and emitted from the back surface of the substrate 21 (the light of the LED 22 that passes through the back surface side of the substrate 21).
  • the sealing member 33 only needs to be displaced with respect to the sealing member 23 in the short side direction of the substrate 21, and may be disposed on the opposite side to the support column 40. Even in this case, since the widths of the sealing members 23 and 33 are larger than the widths of the LEDs 22 and 32 in the short side direction of the substrate 21, the LED 22 faces the sealing member 33 and the LED 32 faces the sealing member 23. Can do. For example, in the short side direction of the substrate 21, the width of the sealing members 23 and 33 is about 1.6 mm, and the width of the LED 32 is about 0.35 mm.
  • Two metal wirings 26 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 22 and the terminal 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22.
  • the metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the LED 22 on the surface of the substrate 21.
  • the protruding portion of the metal wiring 26 becomes a connection portion with the wire 25 from the LED 22.
  • two metal wirings 36 are formed in an island shape with a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.
  • the metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the LED 32 on the back surface of the substrate 21.
  • the protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.
  • the terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape.
  • Two terminals 28 are formed corresponding to each of the two metal wirings 26.
  • the pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.
  • the terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LED 22 to emit light, and supplies the received power to each LED 22 via the metal wirings 26 and 24 and the wire 25. .
  • the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land.
  • Two terminals 38 are formed corresponding to each of the two metal wirings 36.
  • the pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36.
  • One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.
  • the terminal 38 is a power feeding unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light, and supplies the received power to each LED 32 via the metal wirings 36 and 34 and the wire 35. .
  • the terminals 28 and 38 are arranged so as to be substantially concentric.
  • a plurality of metal wirings 24 are formed in a predetermined shape on the surface of the substrate 21 in order to electrically connect the plurality of LEDs 22 in series.
  • the plurality of metal wirings 24 are formed in an island shape on the surface of the substrate 21 between the LEDs 22 adjacent in the element array.
  • a plurality of metal wirings 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect the plurality of LEDs 32 in series.
  • the plurality of metal wirings 34 are formed in an island shape between the LEDs 32 adjacent in the element row on the back surface of the substrate 21.
  • the metal wirings 26 and 24 and the terminal 28 having the above-described configuration are simultaneously patterned with the same metal material.
  • the metal material for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used.
  • the metal wirings 26 and 24 and the surface of the terminal 28 may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wirings 26 and 24 and the terminal 28 may be comprised by a different metal material, and may be formed in a separate process.
  • the metal wirings 36 and 34 and the terminal 38 are simultaneously patterned with the same metal material.
  • the wire 25 is an electric wire for connecting the LED 22 and the metal wiring 26 or the LED 22 and the metal wiring 24, and is, for example, a gold wire. As described with reference to FIG. 5, the wire 25 connects the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 22 to the metal wiring 26 or the metal wiring 24 formed adjacent to both sides of the LED 22. Has been.
  • the entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23, for example.
  • the wire 35 is an electric wire for connecting the LED 32 and the metal wiring 36 or the LED 32 and the metal wiring 34. As described with reference to FIG. 5, by this wire 35, each of the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 32 and the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32 are wire-bonded. Has been.
  • the entire wire 35 is embedded in the sealing member 33 so as not to be exposed from the sealing member 33, for example.
  • the conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70.
  • the conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28.
  • the conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70.
  • the conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38.
  • the conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.
  • the conductive adhesive member 27 may be covered with an insulating resin.
  • the insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
  • the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37.
  • the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b.
  • a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28.
  • the terminal 28 and the terminal 38 are connected by the lead wire 70.
  • the terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 on the surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.
  • the current supplied to one positive lead wire 70 passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LED 22 and the metal wiring 24, and the other negative voltage. Is output from the lead wire 70 on the side.
  • the current supplied to one positive-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, and the metal wiring 34, and the other negative-side lead wire 70. Output from the lead wire 70.
  • the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the support column 40 are brought into contact with each other.
  • Each member is not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42. It is getting bigger.
  • elements of the plurality of LEDs 22 are sandwiched so as to sandwich a portion located above the contact surface with the fixing portion 42 of the substrate 21.
  • a column is provided. That is, the interval between the element rows of the LEDs 22 is larger than the interval between the other element rows in the element row sandwiching the portion located above the contact surface with the fixed portion 42 of the substrate 21.
  • the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b.
  • the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .
  • the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.
  • the LED 22 is placed on the LED module 20a on the surface of the substrate 21 above the contact surface with the fixing portion 42 of the substrate 21. May be provided.
  • the light bulb shaped lamp 1 includes the globe 10, the support column 40 provided so as to extend inward of the globe 10, and the light bulb shaped lamp 1 that is disposed in the globe 10 and fixed to the support column 40.
  • LED modules 20a and 20b are provided.
  • the LED module 20a is provided so as to cover the element array of the LED 22 composed of a plurality of LEDs 22 provided on the surface of the substrate 21 and the element array of the LED 22, and the wavelength of light emitted by the element array of the LED 22 is set.
  • a sealing member 23 to be converted.
  • the LED module 20b is provided so as to cover the element array of the LED 32 composed of a plurality of LEDs 32 provided on the back surface of the substrate 21 and the element array of the LED 32, and converts the wavelength of light emitted by the element array of the LED 32. And a sealing member 33 to be used.
  • the LED 22 is disposed so as to face the sealing member 33 with the substrate 21 interposed therebetween.
  • the LED 32 is disposed so as to face the sealing member 23 with the substrate 21 interposed therebetween. That is, the LED module 20a and the LED module 20b constitute one double-sided light emitting LED module that emits light from both sides.
  • the element array of the LED 22 is composed of a plurality of LEDs 22 connected in series
  • the element array of the LED 32 is composed of a plurality of LEDs 32 connected in series
  • the element array of the LED 22 is The number of LEDs is the same as the number of LEDs in the element row of the LEDs 32.
  • the surface of the support column 40 has a light reflectance of 30% or more with respect to light emitted from the element array of the LED 22 and the element array of the LED 32.
  • pillar 40 has either Al, Cu, and Fe as a main component.
  • the LED module 20a has an element array of a plurality of LEDs 22
  • the LED module 20b has an element array of a plurality of LEDs 32.
  • the light bulb shaped lamp 1 emits light from both sides of the substrate 21, light is taken out from the base side of the light bulb shaped lamp 1 and the opposite side thereof, thereby realizing the light bulb shaped lamp 1 having a wide light distribution angle. it can.
  • the light of the LED 32 transmitted through the substrate 21 and emitted from the surface of the substrate 21 is wavelength-converted by the sealing member 23 facing the LED 32 and emitted as light of the LED module 20a.
  • the light of the LED 22 transmitted through the substrate 21 and emitted from the back surface of the substrate 21 is wavelength-converted by the sealing member 33 facing the LED 22 and emitted as light of the LED module 20b.
  • high-intensity blue light emitted directly above the LED 32 is wavelength-converted by the sealing member 23 to be emitted as white light
  • high-intensity blue light emitted directly below the LED 22 is emitted from the sealing member 33. Wavelength converted and emitted as white light. Therefore, color unevenness can be suppressed for the light emitted from the LED modules 20a and 20b in all directions.
  • the light bulb shaped lamp 1 of the present embodiment power is supplied to the LED modules 20a and 20b simply by connecting the lead wire 70 through the through-hole 21b to the two terminals 28 and 38 by the conductive adhesive members 27 and 37. It is realized by connecting with. Therefore, compared to a configuration in which the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, a configuration of a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes.
  • the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.
  • the substrate 21 has a light reflectance of 50% or more with respect to light emitted from the element array of the LED 22 and the element array of the LED 32. Then, the substrate 21 is, for Al 2 O 3, MgO, SiO , and one of TiO 2 as a main component. Thereby, the light transmittance of the board
  • substrate 21 can be made low and the color nonuniformity of the light emitted from LED module 20a and 20b can be suppressed. Further, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low-cost white substrate for the substrate 21.
  • the back surface of the substrate 21 is bonded and fixed to the column 40 so as to be in contact with the column 40, and the LED modules 20 a and 20 b are directly fixed to the column 40. .
  • substrate 21 can be improved. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22 and 32 due to a temperature rise.
  • the LED 32 and the LED 22 are mounted on the substrate 21 so that the non-mounting area of the LED 22 and the mounting area of the LED 32 face each other.
  • the LED 32 and the LED 22 may be mounted on the substrate 21 so as to be positioned directly below each other so that the mounting region of the LED 22 and the mounting region of the LED 32 face each other.
  • the LED 22 may be disposed so as to face the LED 32 with the substrate 21 interposed therebetween.
  • the LED 22 and the LED 32 may be arranged so that the entire lower surface of the LED 22 faces the entire lower surface of the LED 32.
  • the LED 22 is disposed to face the sealing member 33 with the substrate 21 and the LED 32 interposed therebetween
  • the LED 32 is disposed to face the sealing member 23 with the substrate 21 and the LED 22 interposed therebetween.
  • the light of the LED 32 that is transmitted through the substrate 21 and emitted from the surface of the substrate 21 is reflected or absorbed by the LED 22 facing the LED 32 and is blocked, and is not emitted as the light of the LED module 20 a.
  • the light of the LED 22 that is transmitted through the substrate 21 and emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22 to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.
  • FIG. 6 is a top view when the LED module 20a is seen from upper direction in the state which remove
  • 6 (b) is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 6 (a)
  • FIG. 6 (c) is a line BB ′ in FIG. 6 (a)
  • FIG. 6D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ in FIG. 6A.
  • (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the center position is shifted between the LED 22 and the sealing member 23 covering the LED 22, and the center position is shifted between the LED 32 and the sealing member 33 covering the LED 32.
  • LED22 and 32 and sealing member 23 and 33 may be provided so that it may shift
  • the direction of deviation is reversed between the LEDs 22 and 32.
  • the center position of the LED 22 is shifted to the opposite side of the support column 40 with respect to the center position of the sealing member 23 that covers the LED 22, the center position of the LED 32 is the support column with respect to the center position of the sealing member 33 that covers the LED 32. It is made to shift to 40 side.
  • the sealing member 23 is provided on one side of the LED 22 wider than the other side, and the sealing member 33 is provided on one side of the LED 32 wider than the other side. Can do. Therefore, even when the positions of the LEDs 22 and 32 are largely shifted in the short side direction of the substrate 21, the LED 22 can be opposed to the sealing member 33 and the LED 32 can be opposed to the sealing member 23.
  • FIG. 7 is an enlarged cross-sectional view of a modified example of the light bulb shaped lamp 1 cut along the line B-B ′ in FIG.
  • FIG. 7 shows only an enlarged view of one set of LEDs 22 and 32, but all the other sets of LEDs 22 and 32 may have the same configuration as in FIG.
  • the sealing member 23 and the sealing member 33 having a substantially semicircular cross section are provided so as to partially overlap in the direction perpendicular to the main surface of the substrate 21. did.
  • the sealing member 23 and the sealing member 33 having a substantially semicircular cross section are provided so as not to overlap at all in the direction perpendicular to the main surface of the substrate 21 (so as to be completely displaced). It may be done. In this case, when the substrate 21 is viewed in plan (when viewed from above), there is no overlapping portion between the region A and the region B.
  • a wavelength conversion member (wavelength conversion unit) 33 ⁇ / b> A is provided on the back surface (lower surface) of the substrate 21 so as to face the LED 22, and the surface (upper surface) of the substrate 21 is opposed to the LED 32.
  • a wavelength conversion member (wavelength conversion unit) 23A is provided.
  • the LED 22 is disposed to face the wavelength conversion member 33A with the substrate 21 interposed therebetween
  • the LED 32 is disposed to face the wavelength conversion member 23A with the substrate 21 interposed therebetween.
  • the wavelength conversion member 23 ⁇ / b> A is provided to face not only the LED 32 but also the sealing member 33.
  • the wavelength conversion member 33A is provided to face not only the LED 22 but also the sealing member 23.
  • the sealing member 23 and the sealing member 33 are provided so as not to be completely overlapped (so as to be completely displaced) in the direction perpendicular to the main surface of the substrate 21, the light amount difference between both surfaces of the substrate 21.
  • the configuration shown in FIG. 9 can be adopted.
  • the LED 22 (sealing member 23) on the front surface of the substrate 21 is configured to be larger than the LEDs 32 (sealing member 33) on the back surface of the substrate 21. That is, the upper side is configured to have a larger light intensity than the lower side.
  • the wavelength conversion member 23A can be made of the same material as the sealing member 23. Further, the wavelength conversion member 33 ⁇ / b> A can be made of the same material as the sealing member 33.
  • the wavelength conversion members 23A and 33A can be formed in a sheet shape, for example, but may not be in a sheet shape.
  • FIGS. 8 and 9 are partially enlarged cross-sectional views of other modified examples of the light bulb shaped lamp 1 cut along the line B-B 'in FIG. 4 (a).
  • FIGS. 8 and 9 are partially enlarged cross-sectional views of other modified examples of the light bulb shaped lamp 1 cut along the line B-B 'in FIG. 4 (a).
  • all the other sets of LEDs 22 and 32 may have the same configuration as in FIGS. 8 and 9.
  • the light bulb shaped lamp 1 of the above embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front and back surfaces of a single substrate 21, and the light bulb shaped lamp 1 It was assumed that light was extracted to the base side and the opposite side. However, the light source and the wiring for emitting the light source are separately provided on the surfaces of two separate substrates, and the back surfaces of the two substrates are bonded together to form one substrate 21. The light can be extracted. Therefore, the light bulb shaped lamp 1 according to this modification is the above-described embodiment in that the substrate 21 of the LED module is configured by bonding two substrates each having a light source and wiring for emitting light on the surface thereof with an adhesive. It differs from the light bulb shaped lamp 1 of the form. Hereinafter, the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.
  • FIG. 10 is a diagram showing a configuration of the light bulb shaped lamp 1 according to this modification.
  • FIG. 10 is a top view when the LED module 120a is viewed from above in a state where the globe 10 is removed in the light bulb shaped lamp 1 according to the present modification.
  • 10B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 10A
  • FIG. 10C is a line BB ′ in FIG.
  • FIG. 10D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ in FIG. 10A.
  • (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the LED module 120a is an example of a main light emitting module (first light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 29.
  • the LED module 120b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 39.
  • the LED module 120 a includes a substrate 29, a plurality of LEDs 22 provided on the surface of the substrate 29, a sealing member 23, metal wirings 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal 28.
  • the LED module 120 b includes a substrate 39, a plurality of LEDs 32 provided on the surface of the substrate 39, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.
  • the substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub substrate.
  • the substrates 29 and 39 have the same configuration and shape, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21.
  • the substrates 29 and 39 are, for example, a ceramic substrate such as aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate.
  • the substrate 29 is a rectangular mounting substrate for mounting the LEDs 22, and the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.
  • the substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
  • the substrates 29 and 39 are substrates that have a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32 and are mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. Can be configured.
  • substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed.
  • substrate can be used for the board
  • Two through holes 29b are provided at both ends in the long side direction of the substrate 29 so as to penetrate from the front surface to the back surface of the substrate 29.
  • Two through-holes 39b penetrating toward are provided.
  • the through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a
  • the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b.
  • the through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.
  • One through-hole 29 a that penetrates from the front surface of the substrate 29 toward the back surface is provided in the central portion of the substrate 29, and one penetration that penetrates from the front surface of the substrate 39 toward the back surface also in the central portion of the substrate 39.
  • a hole 39a is provided.
  • the through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Accordingly, the protrusion 42b of the support column 40 is fitted into the continuous through holes 29a and 39a.
  • the adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste.
  • a resin such as a silicone resin
  • a metal paste such as an Ag paste.
  • the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased.
  • the light shielding property of the adhesive 90 that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.
  • the adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided. Further, the adhesive 90 does not interfere with the fitting between the through holes 29a and 39a and the protrusions of the support column 40, and between the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39. It is not provided in all of the spaces.
  • the LED modules 120a and 120b in FIG. 10 In the manufacture of the LED modules 120a and 120b in FIG. 10, first, a plurality of LEDs 22, a sealing member 23, metal wirings 24 and 26, wires 25, and terminals 28 are provided on the surface of the substrate 29. Similarly, a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39. Then, after the substrates 29 and 39 are bonded by the adhesive 90, the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.
  • the light bulb shaped lamp 1 of this modification for the same reason as the light bulb shaped lamp 1 of the above embodiment, the light bulb shaped lamp 1 having a wide light distribution angle and capable of suppressing color unevenness. Can be realized.
  • the substrate 21 is composed of a substrate 29 provided with an element array of LEDs 22 on the surface and a substrate 39 provided with an element array of LEDs 32 on the surface.
  • the substrates 29 and 39 are arranged so that the back surfaces of the LED 22 and the LED 32 that are not provided with the element rows face each other.
  • the LED module 120b may be bonded and fixed to the support column 40.
  • the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier.
  • the light bulb shaped lamp 1 that is easy to manufacture can be realized.
  • the LED module 120b is directly attached to the support column 40, and heat generated by the LED module 120b is transferred to the support column 40.
  • the LED module 120a is indirectly attached to the support column 40 via the LED module 120b, and the heat generated by the LED module 120a is indirectly transferred to the support column 40 via the LED module 120b.
  • An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b.
  • the adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste.
  • the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22 and 32 are further suppressed, and at the same time, the color unevenness of the light emitted by the LED modules 120a and 120b is further suppressed. Can do.
  • the substrate 39 has a through hole 39b that penetrates from the front surface to the back surface of the substrate 39, and the support column 40 penetrates through the through hole 39b of the substrate 39. You may contact the back side. That is, the through hole 39 b may be formed so as to fit the entire fixing portion 42 of the support column 40, and the fixing surface of the fixing portion 42 of the support column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. Thereby, fixation to the support
  • the LED module 120a is bonded and fixed to the support column 40 to shorten the heat dissipation path from the substrate 29 to the support column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the support column 40 are thermally conductive such as grease.
  • the heat dissipation path from the substrate 39 to the support column 40 can be widened by contacting through the member. As a result, it is possible to further suppress a decrease in the light emission efficiency and lifetime of the LEDs 22 and 32.
  • the light bulb shaped lamp according to the present invention has been described based on the embodiments and the modified examples. However, the present invention is not limited to these embodiments and modified examples. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in embodiment and a modification arbitrarily in the range which does not deviate from the meaning of invention.
  • an LED is exemplified as a light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, and other solid light emitting elements. May be used.
  • the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto.
  • a package type in which an LED chip is mounted in a concave portion (cavity) of a resin container and a phosphor-containing resin is sealed in the concave portion that is, a surface mount type (SMD) LED element is used.
  • SMD surface mount type
  • An LED module configured by mounting a plurality of SMD type LED elements on a substrate as light emitting elements may be used.
  • an SMD type LED module having a light-transmitting property with respect to LED light may be used.
  • a plurality of element rows are provided on each of the front and back surfaces of the substrate.
  • only one element row may be provided.
  • the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction.
  • the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.
  • the support column has a shape in which the width in the arrangement direction of the LED element rows narrows in the direction from the support base toward the LED module.
  • pillar may have a shape which the width
  • FIG. 11 is a top view when the LED module 20a is seen from the top in a state where the globe 10 is removed in the modification of the light bulb shaped lamp 1 according to the present embodiment.
  • 11 (b) is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 11 (a)
  • FIG. 11 (c) is a line BB ′ in FIG. 11 (a)
  • FIG. 11D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 11A.
  • (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
  • the lead wire is provided outside the support column.
  • the lead wire may be provided so as to pierce from the front surface side of the substrate by wrapping around the lead wire to the front surface side of the substrate.
  • the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp.
  • an illuminating device including the above-described light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached as an illuminating device 100 according to an embodiment of the present invention.
  • the lighting device 200 turns off and turns on the light bulb shaped lamp 1.
  • the lighting device 200 is attached to the ceiling, and the light transmissive or non-light transmissive lamp cover 220 covers the light bulb shaped lamp 1.
  • the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided in the opening of the lamp cover 220.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract

A bulb-type lamp (1) comprises a globe (10), LED modules (20a and 20b), and a support post (40). An LED module (20a) has an element array of LEDs (22) disposed on a surface of a base plate (21), and a sealing member (23) that is disposed so as to cover the element array of LEDs (22) and that converts the wavelength of light emitted by the element array of LEDs (22). An LED module (20b) has an element array of LEDs (32) disposed on the reverse surface of the base plate (21), and a sealing member (33) that is disposed so as to cover the element array of LEDs (32) and that converts the wavelength of light emitted by the element array of LEDs (32). LEDs (22) are arranged opposing the sealing member (33) with the base plate (21) sandwiched therebetween, and LEDs (32) are arranged opposing the sealing member (23) with the base plate (21) sandwiched therebetween.

Description

電球形ランプ及び照明装置Light bulb shaped lamp and lighting device
　本発明は、電球形ランプ及び照明装置に関し、例えば、半導体発光素子を用いた電球形ランプ及びこれを用いた照明装置に関する。 The present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.
　近年、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の半導体発光素子は、高効率及び長寿命であることから、各種ランプの新しい光源として期待されており、ＬＥＤを光源とするＬＥＤランプの研究開発が進められている。 In recent years, semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps because of their high efficiency and long life, and research and development of LED lamps using LEDs as light sources has been promoted. Yes.
　このようなＬＥＤランプとしては、電球形のＬＥＤランプ（電球形ＬＥＤランプ）があり、電球形ＬＥＤランプでは、基板と、基板上に実装された複数のＬＥＤとを備えるＬＥＤモジュールが用いられる。例えば、特許文献１には、従来の電球形ＬＥＤランプが開示されている。 As such an LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp). In the bulb-shaped LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used. For example, Patent Document 1 discloses a conventional bulb-type LED lamp.
特開２００６－３１３７１７号公報JP 2006-313717 A
　ところで、従来の電球形ＬＥＤランプでは、ＬＥＤで発生する熱を放熱するためにヒートシンクが用いられており、ＬＥＤモジュールはこのヒートシンクに固定される。例えば、特許文献１に開示された電球形ＬＥＤランプでは、半球状のグローブと口金との間に、ヒートシンクとして機能する金属筐体が設けられ、ＬＥＤモジュールはこの金属筐体の上面に載置されている。 By the way, in the conventional bulb-type LED lamp, a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink. For example, in the light bulb-type LED lamp disclosed in Patent Document 1, a metal casing that functions as a heat sink is provided between a hemispherical globe and a base, and the LED module is placed on the upper surface of the metal casing. ing.
　従って、このような従来の電球形ＬＥＤランプでは、ＬＥＤモジュールが発する光のうちヒートシンク側に放射される光は、金属製のヒートシンクによって遮られてしまうので、白熱電球又は電球形蛍光ランプ等の全配光特性を有するランプとは光の広がり方が異なる。つまり、従来の電球形ＬＥＤランプでは、白熱電球又は電球形蛍光ランプ等と同様の広い配光角を実現することが難しい。 Therefore, in such a conventional bulb-type LED lamp, the light emitted from the LED module to the heat sink side is blocked by the metal heat sink, so that all the incandescent bulbs, bulb-type fluorescent lamps, etc. The way the light spreads is different from a lamp having light distribution characteristics. That is, it is difficult to realize a wide light distribution angle similar to that of an incandescent bulb or a bulb-type fluorescent lamp with a conventional bulb-type LED lamp.
　そこで、電球形ＬＥＤランプにおいて、白熱電球と同様の構成を用いることが考えられる。つまり、ヒートシンクを用いずに、白熱電球のフィラメントコイルを単にＬＥＤモジュールに置き換えた構成の電球形ＬＥＤランプが考えられる。この場合、ＬＥＤモジュールからの光は、ヒートシンクによって遮られない。 Therefore, it is conceivable to use the same configuration as the incandescent bulb in the bulb-type LED lamp. That is, a bulb-type LED lamp having a configuration in which the filament coil of an incandescent bulb is simply replaced with an LED module without using a heat sink is conceivable. In this case, the light from the LED module is not blocked by the heat sink.
　しかしながら、電球形ＬＥＤランプに用いられるＬＥＤモジュールは、通常、基板の片面（ＬＥＤが実装された面）のみから光を取り出すような構成となっている。従って、上述した置き換えの構成を用いたとしても、電球形ＬＥＤランプの口金側への光束は低く、広い配光角を実現することは困難である。これに対し、一のＬＥＤモジュールの基板の裏面（ＬＥＤが実装されていない面）に、口金に向けて光を発する他のＬＥＤモジュールを付加することで対応することもできる。しかし、この場合には、一のＬＥＤモジュールのＬＥＤの直接基板に発せられた光は基板を透過して他のＬＥＤモジュールの光として発せられるため、２つのＬＥＤモジュールにより全方位に発せられる光に色ムラが生じてしまう。 However, the LED module used for the bulb-type LED lamp is usually configured to extract light from only one side of the substrate (the surface on which the LED is mounted). Therefore, even if the above-described replacement configuration is used, the luminous flux toward the base side of the bulb-type LED lamp is low, and it is difficult to realize a wide light distribution angle. On the other hand, another LED module that emits light toward the base can be added to the back surface (the surface on which the LED is not mounted) of the substrate of one LED module. However, in this case, the light emitted directly from the LED of one LED module passes through the substrate and is emitted as the light of the other LED module. Therefore, the light is emitted in all directions by the two LED modules. Color unevenness occurs.
　本発明は、このような問題を解決するためになされたものであり、広い配光角を持ち、色ムラを抑制することが可能な電球形ランプ及び照明装置を提供することを目的とする。 The present invention has been made to solve such a problem, and an object of the present invention is to provide a light bulb shaped lamp and a lighting device having a wide light distribution angle and capable of suppressing color unevenness.
　上記課題を解決するために、本発明に係る電球形ランプの一態様は、透光性のグローブと、前記グローブの内方に向かって延びるように設けられた支柱と、前記グローブ内に配置され、前記支柱に固定された主発光モジュール及び副発光モジュールとを備え、前記主発光モジュールは、基板の表面上に設けられた複数の第１発光素子から構成された第１発光素子群と、前記第１発光素子群を覆うように設けられ、前記第１発光素子群が発する光の波長を変換する第１波長変換部とを有し、前記副発光モジュールは、前記基板の裏面上に設けられた複数の第２発光素子から構成された第２発光素子群と、前記第２発光素子群を覆うように設けられ、前記第２発光素子群が発する光の波長を変換する第２波長変換部とを有し、前記第１発光素子は、前記基板を挟んで前記第２波長変換部と対向するように配置され、前記第２発光素子は、前記基板を挟んで前記第１波長変換部と対向するように配置されていることを特徴とする。 In order to solve the above-described problems, an aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a support column provided to extend inward of the glove, and the glove. A main light emitting module and a sub light emitting module fixed to the column, wherein the main light emitting module includes a first light emitting element group including a plurality of first light emitting elements provided on a surface of the substrate; A first wavelength conversion unit configured to cover the first light emitting element group and convert a wavelength of light emitted from the first light emitting element group, and the sub light emitting module is provided on a back surface of the substrate. A second light emitting element group composed of a plurality of second light emitting elements, and a second wavelength conversion unit that is provided so as to cover the second light emitting element group and converts the wavelength of light emitted by the second light emitting element group The first light emitting device The second light emitting element is disposed so as to face the first wavelength converter with the substrate interposed therebetween, and the second light emitting element is disposed so as to face the first wavelength converter with the substrate interposed therebetween. And
　さらに、本発明に係る電球形ランプの一態様において、前記第１発光素子は、前記基板を挟んで前記第２発光素子と対向するように配置されている、とすることができる。 Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the first light emitting element may be disposed to face the second light emitting element with the substrate interposed therebetween.
　さらに、本発明に係る電球形ランプの一態様において、前記複数の第１発光素子の並び方向と直交する方向において、前記第１発光素子の中心位置は前記第１波長変換部の中心位置に対してずれており、前記複数の第２発光素子の並び方向と直交する方向において、前記第２発光素子の中心位置は前記第２波長変換部の中心位置に対してずれており、前記第１発光素子のずれの向きと前記第２発光素子のずれの向きとは反対である、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, a center position of the first light emitting element is relative to a center position of the first wavelength conversion unit in a direction orthogonal to the arrangement direction of the plurality of first light emitting elements. The center position of the second light emitting element is shifted from the center position of the second wavelength conversion unit in the direction orthogonal to the arrangement direction of the plurality of second light emitting elements, and the first light emission The direction of element displacement and the direction of displacement of the second light emitting element may be opposite to each other.
　さらに、本発明に係る電球形ランプの一態様において、前記基板は、前記第１発光素子群が表面に設けられた主基板と、前記第２発光素子群が表面に設けられた副基板とから構成され、前記主基板及び前記副基板が、前記第１発光素子群及び前記第２発光素子群を設けていない裏面同士が互いに対向するように配置されている、とすることができる。 Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the substrate includes: a main substrate on which the first light emitting element group is provided on a surface; and a sub substrate on which the second light emitting element group is provided on the surface. The main substrate and the sub-substrate may be arranged such that back surfaces not provided with the first light emitting element group and the second light emitting element group are opposed to each other.
　さらに、本発明に係る電球形ランプの一態様において、前記第１発光素子群が、直列接続された複数の第１発光素子から構成され、前記第２発光素子群が、直列接続された複数の第２発光素子から構成され、前記第１発光素子群が、前記第２発光素子群の素子の数と同一の素子の数を有する、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the first light emitting element group is composed of a plurality of first light emitting elements connected in series, and the second light emitting element group is a plurality of connected in series. The first light-emitting element group may include the same number of elements as the second light-emitting element group.
　さらに、本発明に係る電球形ランプの一態様において、前記副発光モジュールが、前記支柱に直接的に取り付けられ、前記副発光モジュールで発生した熱を前記支柱に伝熱するとともに、前記主発光モジュールが、前記副発光モジュールを介して前記支柱に間接的に取り付けられ、前記主発光モジュールで発生した熱を、前記副発光モジュールを介して前記支柱に間接的に伝熱する、とすることができる。 Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the sub light emitting module is directly attached to the support column, and heat generated in the sub light emitting module is transferred to the support column, and the main light emitting module Is indirectly attached to the support via the sub-light-emitting module, and heat generated by the main light-emitting module is indirectly transferred to the support via the sub-light-emitting module. .
　さらに、本発明に係る電球形ランプの一態様において、前記主発光モジュールと前記副発光モジュールとの間に、熱伝導部材が設けられている、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, a heat conducting member may be provided between the main light emitting module and the sub light emitting module.
　さらに、本発明に係る電球形ランプの一態様において、前記熱伝導部材が、熱伝導性樹脂、セラミックペースト、及び金属ペーストのいずれかである、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the heat conducting member may be any one of a heat conducting resin, a ceramic paste, and a metal paste.
　さらに、本発明に係る電球形ランプの一態様において、前記副発光モジュールが、前記支柱に対し接着固定されている、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the sub-light emitting module may be bonded and fixed to the support column.
　さらに、本発明に係る電球形ランプの一態様において、前記基板が、前記第１発光素子群及び前記第２発光素子群から発せられる光に対して光反射率５０％以上を有する、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the substrate has a light reflectance of 50% or more with respect to light emitted from the first light emitting element group and the second light emitting element group. Can do.
　さらに、本発明に係る電球形ランプの一態様において、前記基板が、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the substrate may be mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2 .
　さらに、本発明に係る電球形ランプの一態様において、前記支柱の表面が、前記第１発光素子群及び前記第２発光素子群から発せられる光に対して光反射率３０％以上を有する、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the surface of the support column has a light reflectance of 30% or more with respect to light emitted from the first light emitting element group and the second light emitting element group. can do.
　さらに、本発明に係る電球形ランプの一態様において、前記支柱が、Ａｌ、Ｃｕ、及びＦｅのいずれかを主成分とする、とすることができる。 Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the support column may be mainly composed of any one of Al, Cu, and Fe.
　さらに、本発明に係る電球形ランプの一態様において、前記主発光モジュールは、少なくとも２つ以上の前記第１発光素子群を有し、前記副発光モジュールは、少なくとも２つ以上の前記第２発光素子群を有する、とすることができる。 Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the main light emitting module has at least two or more first light emitting element groups, and the sub light emitting module has at least two or more second light emitting elements. It has an element group.
　また、本発明に係る照明装置の一態様は、上記電球形ランプを備えることを特徴とする。 Further, an aspect of the lighting device according to the present invention is characterized by including the above-described light bulb shaped lamp.
　本発明によれば、広い配光角を持つ簡素な構造の電球形ランプ及び照明装置を実現することができる。 According to the present invention, it is possible to realize a light bulb shaped lamp and a lighting device with a simple structure having a wide light distribution angle.
図１は、本発明の実施の形態に係る電球形ランプの側面図である。FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る電球形ランプの分解斜視図である。FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る電球形ランプの断面図である。FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention. 図４は、本発明の実施の形態に係る電球形ランプの構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. . 図５は、本発明の実施の形態に係る電球形ランプのＬＥＤモジュールにおけるＬＥＤの拡大断面図である。FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention. 図６は、本発明の実施の形態に係る電球形ランプの構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 6 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are sectional views. . 図７は、本発明の実施の形態に係る電球形ランプの変形例の詳細な構成を示す拡大断面図である。FIG. 7 is an enlarged cross-sectional view showing a detailed configuration of a modified example of the light bulb shaped lamp according to the embodiment of the present invention. 図８は、本発明の実施の形態に係る電球形ランプの他の変形例の詳細な構成を示す拡大断面図である。FIG. 8 is an enlarged cross-sectional view showing a detailed configuration of another modified example of the light bulb shaped lamp according to the embodiment of the present invention. 図９は、本発明の実施の形態に係る電球形ランプの他の変形例の詳細な構成を示す拡大断面図である。FIG. 9 is an enlarged cross-sectional view showing a detailed configuration of another modified example of the light bulb shaped lamp according to the embodiment of the present invention. 図１０は、本発明の実施の形態の変形例に係る電球形ランプの構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 10 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention, where (a) is a top view, and (b), (c), (d) and (e) are cross sections. FIG. 図１１は、本発明の実施の形態に係る電球形ランプの変形例の構成を示す図であり、（ａ）は上面図、（ｂ）、（ｃ）、（ｄ）及び（ｅ）は断面図である。FIG. 11 is a diagram showing a configuration of a modification of the light bulb shaped lamp according to the embodiment of the present invention, in which (a) is a top view, and (b), (c), (d), and (e) are cross sections. FIG. 図１２は、本発明の実施の形態に係る電球形ランプの変形例の断面図である。FIG. 12 is a cross-sectional view of a modification of the light bulb shaped lamp according to the embodiment of the present invention. 図１３は、本発明の実施の形態に係る照明装置の概略断面図である。FIG. 13 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
　以下、本発明の実施の形態について、図面を用いて詳細に説明する。なお、以下で説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、ステップ、ステップの順序などは、一例であり、本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、本発明の課題を達成するのに必ずしも必要ではないが、より好ましい形態を構成するものとして説明される。また、図面において、実質的に同一の構成、動作、及び効果を表す要素については、同一の符号を付す。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept of the present invention are not necessarily required to achieve the object of the present invention. It will be described as constituting a preferred form. In the drawings, elements that represent substantially the same configuration, operation, and effect are denoted by the same reference numerals.
　まず、本発明の実施の形態に係る電球形ランプ１の全体構成について、図１～図３を参照しながら説明する。 First, the overall configuration of a light bulb shaped lamp 1 according to an embodiment of the present invention will be described with reference to FIGS.
　図１は、本実施の形態に係る電球形ランプ１の側面図である。図２は、本実施の形態に係る電球形ランプ１の分解斜視図である。図３は、本実施の形態に係る電球形ランプ１の断面図である。 FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment. FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
　なお、図１～図３において、紙面上方が電球形ランプ１の前方（上方）であり、紙面下方が電球形ランプ１の後方（下方）であり、紙面左右が電球形ランプ１の側方である。ここで、本明細書において、「後方」とは、ＬＥＤモジュールの基板を基準として口金側の方向のことであり、「前方」とは、ＬＥＤモジュールの基板を基準として口金と反対側の方向のことであり、「側方」とは、ＬＥＤモジュールの基板の主面と平行な方向のことである。 1 to 3, the upper side of the paper is the front (upper) of the light bulb shaped lamp 1, the lower side of the paper is the rear (lower) of the light bulb shaped lamp 1, and the left and right sides of the paper are the side of the light bulb shaped lamp 1. is there. Here, in this specification, “rear” refers to the direction of the base with respect to the substrate of the LED module, and “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module.
　電球形ランプ１は、電球形蛍光灯又は白熱電球の代替品となる電球形ＬＥＤランプ（ＬＥＤ電球）である。電球形ランプ１は、透光性のグローブ１０と、光源であるＬＥＤモジュール２０ａ及び２０ｂと、ランプ外部から電力を受ける口金３０と、支柱４０と、支持台５０と、樹脂ケース６０と、リード線７０と、点灯回路８０とを備える。 The bulb-type lamp 1 is a bulb-type LED lamp (LED bulb) that is a substitute for a bulb-type fluorescent lamp or an incandescent bulb. The light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70 and a lighting circuit 80.
　電球形ランプ１は、グローブ１０と樹脂ケース６０（第１ケース部６１）と口金３０とによって外囲器が構成されている。 The bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30.
　［グローブ］
　グローブ１０は、ＬＥＤモジュール２０ａ及び２０ｂを収納する。グローブ１０は、ＬＥＤモジュール２０ａ及び２０ｂからの光に対して透明な材料から構成され、ＬＥＤモジュール２０ａ及び２０ｂからの光を透過させてランプ外部に透光する透光性グローブである。このようなグローブ１０としては、例えば可視光に対して透明なシリカガラス製のガラスバルブ（クリアバルブ）とすることができる。この場合、グローブ１０内に収納されたＬＥＤモジュール２０ａ及び２０ｂは、グローブ１０の外側から視認することができる。 [Glove]
The globe 10 houses the LED modules 20a and 20b. The globe 10 is a light-transmitting globe that is made of a material that is transparent to the light from the LED modules 20a and 20b, and transmits the light from the LED modules 20a and 20b to the outside of the lamp. As such a globe 10, for example, a glass bulb (clear bulb) made of silica glass that is transparent to visible light can be used. In this case, the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.
　グローブ１０の形状は、一端が球状に閉塞され、他端に開口部１１を有する形状である。具体的に、グローブ１０の形状は、中空の球の一部が、球の中心部から遠ざかる方向に伸びながら狭まったような形状であり、球の中心部から遠ざかった位置に開口部１１が形成されている。このような形状のグローブ１０としては、一般的な白熱電球と同様の形状のガラスバルブを用いることができる。例えば、グローブ１０として、Ａ形、Ｇ形又はＥ形等のガラスバルブを用いることができる。 The shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere. Has been. As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
　なお、グローブ１０は、必ずしも可視光に対して透明である必要はなく、グローブ１０に光拡散機能を持たせてもよい。例えば、シリカや炭酸カルシウム等の光拡散材を含有する樹脂や白色顔料等をグローブ１０の内面又は外面の全面に塗布することによって乳白色の光拡散膜を形成してもよい。また、グローブ１０は、シリカガラス製である必要もない。例えば、アクリル等の樹脂材料によって作製されたグローブ１０を用いても構わない。 Note that the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10. Moreover, the globe 10 does not need to be made of silica glass. For example, a globe 10 made of a resin material such as acrylic may be used.
　［ＬＥＤモジュール］
　ＬＥＤモジュール２０ａ及び２０ｂは、ＬＥＤ（ＬＥＤチップ）を有し、リード線７０を介してＬＥＤに電力が供給されることにより発光する発光モジュールである。ＬＥＤモジュール２０ａ及び２０ｂは、支柱４０によってグローブ１０内の中空に保持されている。 [LED module]
The LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires. The LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the support column 40.
　ＬＥＤモジュール２０ａ及び２０ｂは、グローブ１０によって形成される球形状の中心位置（例えば、グローブ１０の内径が大きい径大部分の内部）に配置されることが好ましい。このように、グローブ１０の中心位置にＬＥＤモジュール２０ａ及び２０ｂが配置されることにより、電球形ランプ１の配光特性は、従来のフィラメントコイルを用いた一般白熱電球と近似した配光特性となる。 The LED modules 20a and 20b are preferably arranged at a spherical central position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED modules 20a and 20b at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
　ＬＥＤモジュール２０ａ及び２０ｂは、その基板の主面（表面及び裏面）がランプ軸と交差、例えば略垂直となるように配置されている。そして、ＬＥＤモジュール２０ａは、電球形ランプ１の前方に向かって光を発し、ＬＥＤモジュール２０ｂは、電球形ランプ１の後方に向かって光を発する。このとき、ランプ軸とは、電球形ランプ１を照明装置（不図示）のソケットに取り付ける際の回転中心となる軸であり、口金の回転軸と一致している。 The LED modules 20a and 20b are arranged so that the main surfaces (front surface and back surface) of the substrate intersect the lamp axis, for example, substantially perpendicular. The LED module 20 a emits light toward the front of the light bulb shaped lamp 1, and the LED module 20 b emits light toward the rear of the light bulb shaped lamp 1. At this time, the lamp axis is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
　このように構成されるＬＥＤモジュール２０ａ及び２０ｂは、両面から光を放出する両面発光型の１つのＬＥＤモジュールとして構成される。なお、ＬＥＤモジュール２０ａ及び２０ｂの詳細な構成については後述する。 The LED modules 20a and 20b configured in this way are configured as a single-sided light emitting LED module that emits light from both sides. The detailed configuration of the LED modules 20a and 20b will be described later.
　［口金］
　口金３０は、ＬＥＤモジュール２０ａ及び２０ｂのＬＥＤを発光させるための電力を電球形ランプ１外部から受ける受電部である。口金３０は、二接点によって交流電力を受電し、口金３０で受電した電力はリード線を介して点灯回路８０の電力入力部に入力される。口金３０は、照明器具（照明装置）のソケットに取り付けられてソケットから電力を受けることで電球形ランプ１（ＬＥＤモジュール２０ａ及び２０ｂ）を点灯させる。 [Base]
The base 30 is a power receiving unit that receives electric power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1. The base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire. The base 30 is attached to a socket of a lighting fixture (lighting device), and turns on the light bulb shaped lamp 1 ( LED modules 20a and 20b) by receiving power from the socket.
　例えば、口金３０はＥ形であり、その外周面には照明装置のソケットに螺合させるための螺合部が形成され、その内周面には樹脂ケース６０に螺合させるための螺合部が形成されている。口金３０は、金属製の有底筒体形状である。なお、口金３０としては、ねじ込み型のエジソンタイプ（Ｅ型）の口金として、Ｅ２６形又はＥ１７形の口金等を用いることができる。また、口金３０として、差し込み型の口金を用いてもよい。 For example, the base 30 is E-shaped, and a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface thereof, and a screwing portion for screwing the resin case 60 on the inner peripheral surface thereof. Is formed. The base 30 has a bottomed cylindrical shape made of metal. As the base 30, an E26 type or E17 type base or the like can be used as a screw-in type Edison type (E type) base. Further, a plug-in base may be used as the base 30.
　［支柱］
　支柱４０は、グローブ１０の開口部１１の近傍からグローブ１０の内方に向かって延びるように設けられたステムであり、グローブ１０内でＬＥＤモジュール２０ａ及び２０ｂを保持する保持部材として機能する。支柱４０の一端はＬＥＤモジュール２０ａ及び２０ｂに接続され、他端は支持台５０に接続されている。 [Support]
The support column 40 is a stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and functions as a holding member that holds the LED modules 20 a and 20 b in the globe 10. One end of the column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.
　支柱４０は、ＬＥＤモジュール２０ａ及び２０ｂで発生する熱を口金３０側に放熱させるための放熱部材としても機能する。従って、支柱４０を熱伝導率の高い金属材料、例えば熱伝導率が２３７［Ｗ／ｍ・Ｋ］のアルミニウム等により構成することで支柱４０による放熱効率を高めることができる。その結果、温度上昇によるＬＥＤの発光効率及び寿命の低下を抑制することができる。なお、支柱４０は、樹脂等により構成することもできる。 The support column 40 also functions as a heat radiating member for radiating heat generated in the LED modules 20a and 20b to the base 30 side. Accordingly, the heat radiation efficiency of the support column 40 can be increased by forming the support column 40 from a metal material having a high thermal conductivity, for example, aluminum having a thermal conductivity of 237 [W / m · K]. As a result, it is possible to suppress a decrease in light emission efficiency and lifetime of the LED due to temperature rise. In addition, the support | pillar 40 can also be comprised with resin etc.
　支柱４０は、主軸部４１と、固定部４２とが例えば一体成型されて構成されている。主軸部４１は、断面積が一定の円柱部材である。主軸部４１の一端は固定部４２に接続されており、他端は支持台５０に接続されている。固定部４２は、ＬＥＤモジュール２０ａ及び２０ｂが固定される固定面を有し、この固定面がＬＥＤモジュール２０ａ及び２０ｂの基板の裏面と接する。固定部４２は、さらに、固定面から突出する突起部を有し、この突起部はＬＥＤモジュール２０ａ及び２０ｂの基板に設けられた貫通孔と嵌合する。ＬＥＤモジュール２０ａ及び２０ｂと固定面とは、例えばシリコーン樹脂等の樹脂の接着剤により接着される。 The support column 40 is configured by, for example, integrally molding a main shaft portion 41 and a fixed portion 42. The main shaft portion 41 is a cylindrical member having a constant cross-sectional area. One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50. The fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b. The fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b. The LED modules 20a and 20b and the fixed surface are bonded to each other with a resin adhesive such as a silicone resin.
　［支持台］
　支持台（支持板）５０は、支柱４０を支持する部材であり、樹脂ケース６０に固定されている。支持台５０は、グローブ１０の開口部１１の開口端に接続されてグローブ１０の開口部１１を塞ぐように構成されている。具体的に、支持台５０は、周縁に段差部を有する円盤状部材で構成されており、その段差部にはグローブ１０の開口部１１の開口端が当接されている。そして、この段差部において、支持台５０と樹脂ケース６０とグローブ１０の開口部１１の開口端とは、接着剤によって固着されている。 [Support stand]
The support base (support plate) 50 is a member that supports the support column 40 and is fixed to the resin case 60. The support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10. Specifically, the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level | step-difference part, the support stand 50, the resin case 60, and the opening end of the opening part 11 of the globe 10 are adhere | attached with the adhesive agent.
　支持台５０は、支柱４０と同様に、アルミニウム等の熱伝導率の高い金属材料により構成されることで、支持台５０による支柱４０を熱伝導したＬＥＤモジュール２０ａ及び２０ｂの熱の放熱効率が高められる。その結果、温度上昇によるＬＥＤの発光効率及び寿命の低下をさらに抑制することができる。 The support base 50 is made of a metal material having a high thermal conductivity such as aluminum, like the support column 40, so that the heat radiation efficiency of the LED modules 20a and 20b that conduct the heat of the support column 40 by the support table 50 is increased. It is done. As a result, it is possible to further suppress the decrease in light emission efficiency and lifetime of the LED due to temperature rise.
　［樹脂ケース］
　樹脂ケース６０は、支柱４０と口金３０とを絶縁すると共に点灯回路８０を収納するための絶縁ケース（回路ホルダ）であり、大径円筒状の第１ケース部６１と、小径円筒状の第２ケース部６２とから構成されている。樹脂ケース６０は、例えば、ポリブチレンテレフタレート（ＰＢＴ）によって成形することができる。 [Resin case]
The resin case 60 is an insulating case (circuit holder) that insulates the support column 40 and the base 30 and houses the lighting circuit 80. The resin case 60 has a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second. The case part 62 is comprised. The resin case 60 can be molded by, for example, polybutylene terephthalate (PBT).
　第１ケース部６１の外表面は外気に露出しているので、樹脂ケース６０に伝導した熱は、主に第１ケース部６１から放熱される。第２ケース部６２は、外周面が口金３０の内周面と接触するように構成されており、第２ケース部６２の外周面には口金３０と螺合するための螺合部が形成されている。 Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61. The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
　［リード線］
　２本のリード線７０は、ＬＥＤモジュール２０ａ及び２０ｂを点灯させるための電力を点灯回路８０からＬＥＤモジュール２０ａ及び２０ｂに供給するためのリード線対であり、銅線等の針金状の金属電線より構成することができる。各リード線７０は、グローブ１０内に配置され、一端がＬＥＤモジュール２０ａ及び２０ｂの外部端子と電気的に接続され、他端が点灯回路８０の電力出力部、言い換えると口金３０と電気的に接続されている。リード線７０は、その一部がＬＥＤモジュール２０ａ及び２０ｂの外部端子に接続されることでＬＥＤモジュール２０ａ及び２０ｂを支持する支持部としても機能している。 [Lead]
The two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been. The lead wire 70 also functions as a support portion that supports the LED modules 20a and 20b by being partly connected to the external terminals of the LED modules 20a and 20b.
　なお、リード線７０のＬＥＤモジュール２０ａ及び２０ｂとの接続関係の詳細については後述する。 The details of the connection relationship between the lead wire 70 and the LED modules 20a and 20b will be described later.
　２本のリード線７０は、金属の芯線とこの芯線を被覆する絶縁性樹脂とで構成される例えばビニル線であり、ＬＥＤモジュール２０ａ及び２０ｂとは絶縁性樹脂で被覆されておらず表面がむき出しにされた芯線を介して電気的に接続される。このとき、２本のリード線７０における基板２１の表面から突き出した部分と、基板２１の裏面から３ｍｍ以下だけ突き出した部分とでは芯線が絶縁性樹脂によって被覆されていなくてもよい。 The two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.
　［点灯回路］
　点灯回路８０は、ＬＥＤモジュール２０ａ及び２０ｂのＬＥＤを点灯させるための回路ユニットであり、複数の回路素子と、各回路素子が実装される回路基板とを有する。点灯回路８０は、口金３０から給電された交流電力を直流電力に変換する回路を含み、２本のリード線７０を介して変換後の直流電力をＬＥＤモジュール２０ａ及び２０ｂのＬＥＤに供給するための駆動回路である。 [Lighting circuit]
The lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. The lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20a and 20b via the two lead wires 70. It is a drive circuit.
　なお、電球形ランプ１は、必ずしも点灯回路８０を備える必要はない。例えば、照明器具又は電池等から電球形ランプ１に直接直流電力が供給される場合には、電球形ランプ１は、点灯回路８０を備えなくてもよい。また、点灯回路８０は、平滑回路に限られるものではなく、調光回路及び昇圧回路等も適宜選択して組み合わせて構成することができる。 Note that the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the lighting circuit 80. Further, the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
　次に、ＬＥＤモジュール２０ａ及び２０ｂの詳細な構成と、ＬＥＤモジュール２０ａ及び２０ｂ並びにリード線７０の接続関係とについて、図４及び図５を用いて説明する。 Next, the detailed configuration of the LED modules 20a and 20b and the connection relationship between the LED modules 20a and 20b and the lead wire 70 will be described with reference to FIGS.
　図４は、本実施の形態に係る電球形ランプ１の構成を示す図である。図５は、本実施の形態に係る電球形ランプ１のＬＥＤモジュール２０ａ及び２０ｂにおけるＬＥＤの拡大断面図である。 FIG. 4 is a diagram showing a configuration of the light bulb shaped lamp 1 according to the present embodiment. FIG. 5 is an enlarged cross-sectional view of LEDs in the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.
　なお、図４の（ａ）は電球形ランプ１においてグローブ１０を除いた状態でＬＥＤモジュール２０ａを上方から見たときの平面図である。そして、図４の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプ１の断面図であり、図４の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプ１の断面図である。 4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1. FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A, and FIG. 4C is a line BB ′ in FIG. FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A. (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
　ＬＥＤモジュール２０ａは、主発光モジュール（第１発光モジュール）の一例であり、ベアチップが直接基板２１の表面（一方の主面）上に実装されたＣＯＢ（Ｃｈｉｐ　Ｏｎ　Ｂｏａｒｄ）構造である。一方、ＬＥＤモジュール２０ｂは、副発光モジュール（第２発光モジュール）の一例であり、ベアチップが直接基板２１の裏面（他方の主面）上に実装されたＣＯＢ構造である。 The LED module 20a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 21. On the other hand, the LED module 20b is an example of a sub light emitting module (second light emitting module) and has a COB structure in which a bare chip is directly mounted on the back surface (the other main surface) of the substrate 21.
　ＬＥＤモジュール２０ａは、基板２１と、基板２１の表面上に設けられた複数のＬＥＤ２２、封止部材２３、金属配線２４及び２６、ワイヤー２５、導電性接着部材２７並びに端子（外部端子）２８とを備えている。一方、ＬＥＤモジュール２０ｂは、基板２１と、基板２１の裏面上に設けられた複数のＬＥＤ３２、封止部材３３、金属配線３４及び３６、ワイヤー３５、導電性接着部材３７並びに端子３８とを備えている。 The LED module 20 a includes a substrate 21, a plurality of LEDs 22 provided on the surface of the substrate 21, a sealing member 23, metal wirings 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal (external terminal) 28. I have. On the other hand, the LED module 20 b includes a substrate 21, a plurality of LEDs 32 provided on the back surface of the substrate 21, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.
　［基板］
　基板２１は、透光性基板又は非透光性基板を用いることができる。基板２１は、例えば酸化アルミニウム（アルミナ）又は窒化アルミニウム等のセラミック材料からなるセラミック基板、金属基板、樹脂基板、ガラス基板、フレキシブル基板又はアルミナ基板等である。基板２１は、ＬＥＤ２２及び３２を実装するための矩形状の実装基板（ＬＥＤ実装用基板）である。基板２１は、その長辺の長さをＬ１とし、短辺の長さをＬ２とし、厚みをｄとすると、例えばＬ１＝２６ｍｍ、Ｌ２＝１３ｍｍ、ｄ＝１ｍｍとされる。 [substrate]
As the substrate 21, a light-transmitting substrate or a non-light-transmitting substrate can be used. The substrate 21 is, for example, a ceramic substrate made of a ceramic material such as aluminum oxide (alumina) or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate. The substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22 and 32. When the length of the long side of the substrate 21 is L1, the length of the short side is L2, and the thickness is d, for example, L1 = 26 mm, L2 = 13 mm, and d = 1 mm.
　基板２１は、ＬＥＤ２２及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色アルミナ基板等の白色基板又は金属基板等で構成されることが好ましい。例えば、基板２１は、ＬＥＤ２２及び３２から発せられる光に対して光反射率５０％以上を有し、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする基板で構成することができる。基板２１の光透過率が高い場合、ＬＥＤモジュール２０ａにおいて、基板２１の表面側のＬＥＤ２２の光の一部が基板２１を通過した後、基板２１の裏面側から発せられる。同様に、ＬＥＤモジュール２０ｂにおいて、基板２１の裏面側のＬＥＤ３２の光の一部が基板２１を通過した後、基板２１の表面側から発せられる。従って、電球形ランプ１において、口金側及びそれと反対側から取り出される光について色ムラが発生する。これに対し、基板２１の光透過率を低くすることでこのような色ムラを抑制することができる。また、安価な白色基板を用いることができるので、電球形ランプ１の低コスト化を実現できる。 The substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less, or a metal substrate. For example, the substrate 21 has a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32, and is composed of a substrate mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. be able to. When the light transmittance of the substrate 21 is high, a part of the light of the LED 22 on the front surface side of the substrate 21 is emitted from the back surface side of the substrate 21 in the LED module 20 a after passing through the substrate 21. Similarly, in the LED module 20 b, a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.
　基板２１の長辺方向の両端部には基板２１の表面から裏面に向けて貫通する２つの貫通孔２１ｂが設けられている。これら２つの貫通孔２１ｂは給電用のリード線７０とＬＥＤモジュール２０ａ及び２０ｂとを接続するための端子２８及び３８を構成し、２つの貫通孔２１ｂのそれぞれにはリード線７０が挿通されている。 Two through holes 21b that penetrate from the front surface to the back surface of the substrate 21 are provided at both ends of the long side direction of the substrate 21. These two through holes 21b constitute terminals 28 and 38 for connecting the power supply lead wire 70 and the LED modules 20a and 20b, and the lead wire 70 is inserted into each of the two through holes 21b. .
　基板２１の中央部には基板２１の表面から裏面に向けて貫通する１つの貫通孔２１ａが設けられている。この貫通孔２１ａは、ＬＥＤモジュール２０ａ及び２０ｂを支柱４０に固定するためのものであり、貫通孔２１ａには支柱４０の突起部４２ｂが嵌合されている。 In the central part of the substrate 21, one through hole 21 a that penetrates from the front surface to the back surface of the substrate 21 is provided. The through-hole 21a is for fixing the LED modules 20a and 20b to the support column 40, and the protruding portion 42b of the support column 40 is fitted into the through-hole 21a.
　なお、貫通孔２１ａがなくても接着剤によりＬＥＤモジュール２０ａ及び２０ｂの支柱４０への固定は可能である。従って、貫通孔２１ａは設けられなくても構わない。 In addition, even if there is no through-hole 21a, it is possible to fix the LED modules 20a and 20b to the support column 40 with an adhesive. Accordingly, the through hole 21a may not be provided.
　［ＬＥＤ］
　ＬＥＤ２２は、基板２１の表面の上に複数実装されている。複数のＬＥＤ２２は、基板２１の長辺方向に同一ピッチで直線状に配列されて構成された素子列が基板２１の短辺方向つまりＬＥＤ２２の素子列におけるＬＥＤ２２の並び方向と直交する方向に複数本並べられるように配設されている。複数のＬＥＤ２２は素子列において直列接続され、素子列同士において並列接続されている。この素子列が第１発光素子群の一例である。例えば、複数のＬＥＤ２２は、素子列内において隣り合うＬＥＤ２２の間隔（ピッチ）が１．８ｍｍとなり、隣り合う素子列において一方の素子列のＬＥＤ２２と他方の素子列のＬＥＤ２２との間隔が例えば４ｍｍとなるように配設されている。 [LED]
A plurality of LEDs 22 are mounted on the surface of the substrate 21. The plurality of LEDs 22 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22 in the element row of the LED 22. They are arranged so that they are lined up. The plurality of LEDs 22 are connected in series in the element rows, and are connected in parallel in the element rows. This element row is an example of the first light emitting element group. For example, in the plurality of LEDs 22, the distance (pitch) between adjacent LEDs 22 in the element row is 1.8 mm, and the distance between the LED 22 in one element row and the LED 22 in the other element row in the adjacent element row is, for example, 4 mm. It is arranged to become.
　同様に、ＬＥＤ３２は、基板２１の裏面の上に複数実装されている。複数のＬＥＤ３２は、基板２１の長辺方向に同一ピッチで直線状に配列されて構成された素子列が基板２１の短辺方向つまりＬＥＤ３２の素子列におけるＬＥＤ３２の並び方向と直交する方向に複数本並べられるように配設されている。複数のＬＥＤ３２は素子列において直列接続され、素子列同士において並列接続されている。この素子列が第２発光素子群の一例である。 Similarly, a plurality of LEDs 32 are mounted on the back surface of the substrate 21. The plurality of LEDs 32 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 32 in the element row of the LED 32. They are arranged so that they are lined up. The plurality of LEDs 32 are connected in series in the element rows, and are connected in parallel in the element rows. This element row is an example of the second light emitting element group.
　ＬＥＤ２２は、基板２１を挟んで封止部材３３と対向するように配置され、ＬＥＤ３２は、基板２１を挟んで封止部材２３と対向するように配置されている。例えば、ＬＥＤ２２の基板２１と接する下面の全面が封止部材３３と対向し、ＬＥＤ３２の基板２１と接する下面の全面が封止部材２３と対向するように配置されている。この場合、ＬＥＤ２２はその全体が封止部材３３の上方の領域Ｂ内に存在し、ＬＥＤ３２はその全体が封止部材２３の下方の領域Ａ内に存在する。 The LED 22 is disposed to face the sealing member 33 with the substrate 21 interposed therebetween, and the LED 32 is disposed to face the sealing member 23 with the substrate 21 interposed therebetween. For example, the entire lower surface of the LED 22 in contact with the substrate 21 faces the sealing member 33, and the entire lower surface of the LED 32 in contact with the substrate 21 faces the sealing member 23. In this case, the entire LED 22 exists in the region B above the sealing member 33, and the entire LED 32 exists in the region A below the sealing member 23.
　ＬＥＤ３２は、基板２１の短辺方向において、ＬＥＤ２２に対して支柱４０側にずれて配置されている。そして、ＬＥＤ２２及び３２は、基板２１の短辺方向において、ＬＥＤ２２の一端の位置が封止部材３３の一端の位置と一致し、ＬＥＤ３２の一端の位置が封止部材２３の一端の位置と一致するように配置されている。また、ＬＥＤ２２及び３２は、基板２１の表面におけるＬＥＤ２２の非実装領域と、基板２１の裏面におけるＬＥＤ３２の実装領域とが対向するように、実装されている。これにより、効率良くＬＥＤ２２の熱を支柱４０に効率良く放熱することができる。 The LED 32 is disposed so as to be shifted toward the support column 40 with respect to the LED 22 in the short side direction of the substrate 21. The LEDs 22 and 32 are arranged such that the position of one end of the LED 22 matches the position of one end of the sealing member 33 and the position of one end of the LED 32 matches the position of one end of the sealing member 23 in the short side direction of the substrate 21. Are arranged as follows. The LEDs 22 and 32 are mounted such that the non-mounting area of the LED 22 on the front surface of the substrate 21 and the mounting area of the LED 32 on the back surface of the substrate 21 face each other. Thereby, the heat | fever of LED22 can be efficiently radiated | emitted to the support | pillar 40 efficiently.
　ＬＥＤ２２及び３２は、全方位、つまり側方、上方及び下方に向けて単色の可視光を発するベアチップである。ＬＥＤ２２及び３２は、例えば、側方に全光量の２０％、上方に全光量の６０％、下方に全光量の２０％の光を発する。 The LEDs 22 and 32 are bare chips that emit monochromatic visible light in all directions, that is, laterally, upwardly and downwardly. The LEDs 22 and 32 emit, for example, 20% of the total amount of light laterally, 60% of the total amount of light upward, and 20% of the total amount of light downward.
　ＬＥＤ２２及び３２は、例えば一辺の長さが約０．３５ｍｍ（３５０μｍ）で、通電されることで青色光を発する矩形状（正方形）の青色ＬＥＤチップである。青色ＬＥＤチップとしては、例えばＩｎＧａＮ系の材料によって構成された、中心波長が４４０ｎｍ～４７０ｎｍの窒化ガリウム系の半導体発光素子を用いることができる。 The LEDs 22 and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, having a side length of about 0.35 mm (350 μm). As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
　ＬＥＤ２２及び３２は、図５に示すように、サファイア基板２２ａと、サファイア基板２２ａ上に積層された、互いに異なる組成から構成される複数の窒化物半導体層２２ｂとを有する。 As shown in FIG. 5, the LEDs 22 and 32 include a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b that are stacked on the sapphire substrate 22a and have different compositions.
　窒化物半導体層２２ｂの上面の両端部には、カソード電極２２ｃとアノード電極２２ｄとが設けられている。そして、カソード電極２２ｃの上にはワイヤーボンド部２２ｅが設けられ、アノード電極２２ｄの上にはワイヤーボンド部２２ｆが設けられている。例えば、隣り合うＬＥＤ２２において、一方のＬＥＤ２２のカソード電極２２ｃと他方のＬＥＤ２２のアノード電極２２ｄとは、ワイヤーボンド部２２ｅ及び２２ｆを介して、ワイヤー２５により接続されている。 A cathode electrode 22c and an anode electrode 22d are provided at both ends of the upper surface of the nitride semiconductor layer 22b. A wire bond portion 22e is provided on the cathode electrode 22c, and a wire bond portion 22f is provided on the anode electrode 22d. For example, in the adjacent LEDs 22, the cathode electrode 22c of one LED 22 and the anode electrode 22d of the other LED 22 are connected by a wire 25 via wire bond portions 22e and 22f.
　ＬＥＤ２２及び３２は、サファイア基板２２ａ側の面が基板２１の表面又は裏面と対向するように、透光性のチップボンディング材２２ｇにより基板２１の上に固定されている。チップボンディング材２２ｇには、酸化金属から構成されるフィラーを含有したシリコーン樹脂等を用いることができる。チップボンディング材２２ｇに透光性材料を使用することにより、ＬＥＤ２２の側面から出る光の損失を低減することができ、チップボンディング材２２ｇによる影の発生を抑制することができる。 The LEDs 22 and 32 are fixed on the substrate 21 with a translucent chip bonding material 22g so that the surface on the sapphire substrate 22a side faces the front surface or the back surface of the substrate 21. For the chip bonding material 22g, a silicone resin containing a filler made of a metal oxide can be used. By using a translucent material for the chip bonding material 22g, the loss of light emitted from the side surface of the LED 22 can be reduced, and the generation of shadows by the chip bonding material 22g can be suppressed.
　［封止部材］
　封止部材２３は、ＬＥＤ２２が発する光の波長を変換する変換部材であり、ＬＥＤ２２を覆うように形成されている。封止部材２３は、ＬＥＤ２２が発する光の波長を変換する波長変換材と、波長変換材を含有する樹脂材料とから構成される封止樹脂である。波長変換材としては、ＬＥＤ２２が発する光によって励起されて所望の色（波長）の光を放出する蛍光体粒子を用いることもできるし、半導体、金属錯体、有機染料及び顔料等のある波長の光を吸収して吸収した光とは異なる波長の光を発する物質を含む材料を用いることもできる。なお、封止部材２３には、シリカ粒子等の光拡散材が分散されていてもよい。 [Sealing member]
The sealing member 23 is a conversion member that converts the wavelength of light emitted from the LED 22, and is formed to cover the LED 22. The sealing member 23 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22 and a resin material containing the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by light emitted from the LED 22 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 23.
　このような蛍光体粒子としては、ＬＥＤ２２が青色光を発する青色ＬＥＤチップである場合、封止部材２３から白色光を出射させるために、青色光を黄色光に波長変換する蛍光体粒子が用いられる。例えば、蛍光体粒子としてＹＡＧ（イットリウム・アルミニウム・ガーネット）系の黄色蛍光体粒子を用いることができる。これにより、ＬＥＤ２２が発した青色光の一部は、封止部材２３に含まれる黄色蛍光体粒子によって黄色光に波長変換される。そして、黄色蛍光体粒子に吸収されなかった（波長変換されなかった）青色光と、黄色蛍光体粒子によって波長変換された黄色光とは、封止部材２３の中で拡散及び混合されることにより、封止部材２３から白色光となって出射される。なお、蛍光体粒子として、黄色蛍光体粒子以外に緑色蛍光体粒子及び赤色蛍光体粒子等が用いられてもよく、ＬＥＤ２２が紫外線を発するＬＥＤ２２である場合、波長変換材である蛍光体粒子としては、三原色（赤色、緑色、青色）に発光する各色蛍光体粒子を組み合わせたものが用いられる。 As such phosphor particles, when the LED 22 is a blue LED chip that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23. . For example, YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles. Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. And the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23. The white light is emitted from the sealing member 23. In addition to the yellow phosphor particles, green phosphor particles, red phosphor particles, and the like may be used as the phosphor particles. When the LED 22 is an LED 22 that emits ultraviolet light, A combination of phosphor particles that emit light in the three primary colors (red, green, and blue) is used.
　一方、蛍光体粒子を含有させる樹脂材料としては、シリコーン樹脂等の透明樹脂材料、フッ素系樹脂等の有機材、並びに低融点ガラス及びゾルゲルガラス等の無機材等を用いることができる。 On the other hand, as the resin material containing the phosphor particles, a transparent resin material such as a silicone resin, an organic material such as a fluorine-based resin, and an inorganic material such as low-melting glass and sol-gel glass can be used.
　上述した構成の封止部材２３は、素子列を構成する複数のＬＥＤ２２の配列方向に沿って直線状に形成され、ＬＥＤ２２の素子列を一括封止している。同時に、封止部材２３は、素子列の配列方向に沿って複数形成され、異なる素子列を個別に封止している。１本あたりの封止部材２３は、例えば、長さが２４ｍｍ、線幅が１．６ｍｍ、中心最大高さが０．７ｍｍである。 The sealing member 23 having the above-described configuration is formed linearly along the arrangement direction of the plurality of LEDs 22 constituting the element row, and collectively seals the element rows of the LED 22. At the same time, a plurality of sealing members 23 are formed along the arrangement direction of the element rows, and individually seal different element rows. Each sealing member 23 has a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.
　封止部材２３は、基板２１の短辺方向において、封止部材３３に対して支柱４０と反対側にずれて配置されている。そして、封止部材２３は、少なくともその一部がＬＥＤ３２の上方に位置し、ＬＥＤ３２の上方で基板２１の表面と接するように設けられている。ＬＥＤ３２の上方に位置する封止部材２３は、基板２１を透過して基板２１の表面から発せられるＬＥＤ３２の光（基板２１の表面側に抜けるＬＥＤ３２の光）の波長を変換している。 The sealing member 23 is arranged so as to be shifted to the opposite side of the support column 40 with respect to the sealing member 33 in the short side direction of the substrate 21. The sealing member 23 is provided so that at least a part thereof is positioned above the LED 32 and is in contact with the surface of the substrate 21 above the LED 32. The sealing member 23 located above the LED 32 converts the wavelength of the light of the LED 32 that is transmitted from the surface of the substrate 21 and emitted from the surface of the substrate 21 (the light of the LED 32 that passes through the surface of the substrate 21).
　同様に、封止部材３３は、ＬＥＤ３２が発する光の波長を変換する変換部材であり、ＬＥＤ３２を覆うように形成されている。封止部材３３は、ＬＥＤ３２が発する光の波長を変換する波長変換材と、波長変換材を含有する樹脂材料とから構成される封止樹脂である。波長変換材としては、ＬＥＤ３２が発する光によって励起されて所望の色（波長）の光を放出する蛍光体粒子を用いることもできるし、半導体、金属錯体、有機染料及び顔料等のある波長の光を吸収して吸収した光とは異なる波長の光を発する物質を含む材料を用いることもできる。 Similarly, the sealing member 33 is a conversion member that converts the wavelength of light emitted by the LED 32 and is formed so as to cover the LED 32. The sealing member 33 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and a resin material that contains the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by the light emitted from the LED 32 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light.
　封止部材３３は、素子列を構成する複数のＬＥＤ３２の配列方向に沿って直線状に形成され、ＬＥＤ３２の素子列を一括封止している。同時に、封止部材３３は、素子列の配列方向に沿って複数形成され、異なる素子列を個別に封止している。 The sealing member 33 is formed linearly along the arrangement direction of the plurality of LEDs 32 constituting the element row, and collectively seals the element rows of the LED 32. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and individually seal different element rows.
　封止部材３３は、基板２１の短辺方向において、封止部材２３に対して支柱４０側にずれて配置されている。そして、封止部材３３は、少なくともその一部がＬＥＤ２２の下方に位置し、ＬＥＤ２２の下方で基板２１の裏面と接するように設けられている。ＬＥＤ２２の下方に位置する封止部材３３は、基板２１を透過して基板２１の裏面から発せられるＬＥＤ２２の光（基板２１の裏面側に抜けるＬＥＤ２２の光）の波長を変換している。 The sealing member 33 is arranged so as to be shifted toward the support column 40 with respect to the sealing member 23 in the short side direction of the substrate 21. The sealing member 33 is provided so that at least a part thereof is located below the LED 22 and is in contact with the back surface of the substrate 21 below the LED 22. The sealing member 33 located below the LED 22 converts the wavelength of the light of the LED 22 that is transmitted through the substrate 21 and emitted from the back surface of the substrate 21 (the light of the LED 22 that passes through the back surface side of the substrate 21).
　なお、封止部材３３は、基板２１の短辺方向において、封止部材２３に対してずれて配置されればよく、支柱４０と反対側にずれて配置されても構わない。この場合でも、基板２１の短辺方向において、封止部材２３及び３３の幅はＬＥＤ２２及び３２の幅より大きいため、ＬＥＤ２２を封止部材３３に対向させ、ＬＥＤ３２を封止部材２３に対向させることができる。例えば、基板２１の短辺方向において、封止部材２３及び３３の幅は約１．６ｍｍであり、ＬＥＤ３２の幅は約０．３５ｍｍである。 It should be noted that the sealing member 33 only needs to be displaced with respect to the sealing member 23 in the short side direction of the substrate 21, and may be disposed on the opposite side to the support column 40. Even in this case, since the widths of the sealing members 23 and 33 are larger than the widths of the LEDs 22 and 32 in the short side direction of the substrate 21, the LED 22 faces the sealing member 33 and the LED 32 faces the sealing member 23. Can do. For example, in the short side direction of the substrate 21, the width of the sealing members 23 and 33 is about 1.6 mm, and the width of the LED 32 is about 0.35 mm.
　［金属配線、端子］
　金属配線２６は、ＬＥＤ２２の素子列と端子２８とを電気的に並列接続するために、基板２１の両端部に所定形状で島状に２つ形成されている。これら２つの金属配線２６は、基板２１の表面において、複数のＬＥＤ２２の素子列を挟み込むように形成されている。 [Metal wiring, terminals]
Two metal wirings 26 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 22 and the terminal 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22.
　金属配線２６は、基板２１の表面において、ＬＥＤ２２の素子列と隣り合う部分で素子列に向かって突出している。この金属配線２６の突出部は、ＬＥＤ２２からのワイヤー２５との接続箇所となる。 The metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the LED 22 on the surface of the substrate 21. The protruding portion of the metal wiring 26 becomes a connection portion with the wire 25 from the LED 22.
　同様に、金属配線３６は、ＬＥＤ３２の素子列と端子３８とを電気的に並列接続するために、基板２１の両端部に所定形状で島状に２つ形成されている。これら２つの金属配線３６は、基板２１の裏面において、複数のＬＥＤ３２の素子列を挟み込むように形成されている。 Similarly, two metal wirings 36 are formed in an island shape with a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.
　金属配線３６は、基板２１の裏面において、ＬＥＤ３２の素子列と隣り合う部分で素子列に向かって突出している。この金属配線３６の突出部は、ＬＥＤ３２からのワイヤー３５との接続箇所となる。 The metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the LED 32 on the back surface of the substrate 21. The protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.
　端子２８は、導電性接着部材２７が設けられる給電電極、例えば半田付けが行われる半田電極であり、貫通孔２１ｂと、貫通孔２１ｂの基板２１の表面側の開口を囲むように基板２１の表面に所定形状で形成された接続用ランドとから構成されている。端子２８は、２つの金属配線２６のそれぞれに対応して２つ形成されている。この一対の端子２８は、それぞれ対応する金属配線２６と一体化して形成され、対応する金属配線２６と接することで接続されている。このような対応する１組の金属配線２６及び端子２８により１つの配線パターンが構成されている。 The terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape. Two terminals 28 are formed corresponding to each of the two metal wirings 26. The pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26. One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.
　端子２８は、ＬＥＤモジュール２０ａの給電部であって、ＬＥＤ２２を発光させるために、ＬＥＤモジュール２０ａ外部から電力を受け、受けた電力を金属配線２６及び２４並びにワイヤー２５を介して各ＬＥＤ２２に供給する。 The terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LED 22 to emit light, and supplies the received power to each LED 22 via the metal wirings 26 and 24 and the wire 25. .
　同様に、端子３８は、導電性接着部材３７が設けられる給電電極であり、貫通孔２１ｂと、貫通孔２１ｂの基板２１の裏面側の開口を囲むように基板２１の裏面に所定形状で形成された接続用ランドとから構成されている。端子３８は、２つの金属配線３６のそれぞれに対応して２つ形成されている。この一対の端子３８は、それぞれ対応する金属配線３６と一体化して形成され、対応する金属配線３６と接することで接続されている。このような対応する１組の金属配線３６及び端子３８により１つの配線パターンが構成されている。 Similarly, the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land. Two terminals 38 are formed corresponding to each of the two metal wirings 36. The pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36. One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.
　端子３８は、ＬＥＤモジュール２０ｂの給電部であって、ＬＥＤ３２を発光させるために、ＬＥＤモジュール２０ｂ外部から電力を受け、受けた電力を金属配線３６及び３４並びにワイヤー３５を介して各ＬＥＤ３２に供給する。端子２８及び３８は、概略同心となるように配置されている。 The terminal 38 is a power feeding unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light, and supplies the received power to each LED 32 via the metal wirings 36 and 34 and the wire 35. . The terminals 28 and 38 are arranged so as to be substantially concentric.
　金属配線２４は、複数のＬＥＤ２２同士を電気的に直列接続するために、基板２１の表面に所定形状で複数形成されている。これら複数の金属配線２４は、基板２１の表面において、素子列内で隣り合うＬＥＤ２２の間に島状に形成されている。 A plurality of metal wirings 24 are formed in a predetermined shape on the surface of the substrate 21 in order to electrically connect the plurality of LEDs 22 in series. The plurality of metal wirings 24 are formed in an island shape on the surface of the substrate 21 between the LEDs 22 adjacent in the element array.
　同様に、金属配線３４は、複数のＬＥＤ３２同士を電気的に直列接続するために、基板２１の裏面に所定形状で複数形成されている。これら複数の金属配線３４は、基板２１の裏面において、素子列内で隣り合うＬＥＤ３２の間に島状に形成されている。 Similarly, a plurality of metal wirings 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect the plurality of LEDs 32 in series. The plurality of metal wirings 34 are formed in an island shape between the LEDs 32 adjacent in the element row on the back surface of the substrate 21.
　上述した構成の金属配線２６及び２４並びに端子２８は同じ金属材料で同時にパターン形成される。金属材料としては、例えば、銀（Ａｇ）、タングステン（Ｗ）又は銅（Ｃｕ）等を用いることができる。なお、金属配線２６及び２４並びに端子２８の表面に、ニッケル（Ｎｉ）／金（Ａｕ）等のメッキ処理を施しても構わない。また、金属配線２６及び２４並びに端子２８は、異なる金属材料により構成されてもよいし、別々の工程で形成されてもよい。 The metal wirings 26 and 24 and the terminal 28 having the above-described configuration are simultaneously patterned with the same metal material. As the metal material, for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. The metal wirings 26 and 24 and the surface of the terminal 28 may be plated with nickel (Ni) / gold (Au) or the like. Moreover, the metal wirings 26 and 24 and the terminal 28 may be comprised by a different metal material, and may be formed in a separate process.
　同様に、金属配線３６及び３４並びに端子３８は同じ金属材料で同時にパターン形成される。 Similarly, the metal wirings 36 and 34 and the terminal 38 are simultaneously patterned with the same metal material.
　［ワイヤー］
　ワイヤー２５は、ＬＥＤ２２と金属配線２６、又はＬＥＤ２２と金属配線２４とを接続するための電線であり、例えば、金ワイヤーである。図５で説明したように、このワイヤー２５により、ＬＥＤ２２の上面に設けられたワイヤーボンド部２２ｅ及び２２ｆのそれぞれとＬＥＤ２２の両側に隣接して形成された金属配線２６又は金属配線２４とがワイヤボンディングされている。 [wire]
The wire 25 is an electric wire for connecting the LED 22 and the metal wiring 26 or the LED 22 and the metal wiring 24, and is, for example, a gold wire. As described with reference to FIG. 5, the wire 25 connects the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 22 to the metal wiring 26 or the metal wiring 24 formed adjacent to both sides of the LED 22. Has been.
　ワイヤー２５は、例えば、封止部材２３から露出しないように、全体が封止部材２３の中に埋め込まれる。 The entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23, for example.
　同様に、ワイヤー３５は、ＬＥＤ３２と金属配線３６、又はＬＥＤ３２と金属配線３４とを接続するための電線である。図５で説明したように、このワイヤー３５により、ＬＥＤ３２の上面に設けられたワイヤーボンド部２２ｅ及び２２ｆのそれぞれとＬＥＤ３２の両側に隣接して形成された金属配線３６又は金属配線３４とがワイヤボンディングされている。 Similarly, the wire 35 is an electric wire for connecting the LED 32 and the metal wiring 36 or the LED 32 and the metal wiring 34. As described with reference to FIG. 5, by this wire 35, each of the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 32 and the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32 are wire-bonded. Has been.
　ワイヤー３５は、例えば、封止部材３３から露出しないように、全体が封止部材３３の中に埋め込まれる。 The entire wire 35 is embedded in the sealing member 33 so as not to be exposed from the sealing member 33, for example.
　［導電性部材］
　導電性接着部材２７は、端子２８をリード線７０と接続する半田又は銀ペースト等の導電性接着剤である。導電性接着部材２７は、端子２８の表面上でリード線７０の一端の側面を被覆するように、端子２８及びリード線７０の両方に接して設けられている。導電性接着部材２７は、貫通孔２１ｂの基板２１の表面側の開口を塞ぐように設けられている。 [Conductive member]
The conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70. The conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28. The conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.
　同様に、導電性接着部材３７は、端子３８をリード線７０と接続する導電性接着剤である。導電性接着部材３７は、端子３８の表面上でリード線７０の一端の側面を被覆するように、端子３８及びリード線７０の両方に接して設けられている。導電性接着部材３７は、貫通孔２１ｂの基板２１の裏面側の開口を塞ぐように設けられている。 Similarly, the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70. The conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38. The conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.
　ここで、導電性接着部材２７は、絶縁性樹脂によって被覆されていてもよい。そして、この絶縁性樹脂が、ＬＥＤ２２及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色樹脂であってもよい。 Here, the conductive adhesive member 27 may be covered with an insulating resin. The insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
　図４のＬＥＤモジュール２０ａ及び２０ｂは、導電性接着部材２７及び３７を除く各部材を基板２１の表面及び裏面上に設けた後、導電性接着部材２７により２つのリード線７０と端子３８とを接続し、導電性接着部材３７により２つのリード線７０と端子２８とを接続することで形成される。このとき、リード線７０と端子３８との電気的な接続では、まず、リード線７０が貫通孔２１ｂの裏面側の開口から挿入されて貫通孔２１ｂの表面側の開口から突き出るように設けられる。その後、そのリード線７０の裏面側の部分と端子３８との両方に接するように導電性接着部材３７が設けられ、表面側の部分と端子２８との両方に接するように導電性接着部材２７が設けられる。従って、リード線７０により端子２８と端子３８とが接続される。そして、同じリード線７０に端子２８及び３８が接続されて、基板２１表面の複数のＬＥＤ２２と、基板２１裏面の複数のＬＥＤ３２とはリード線７０に並列接続される。つまり、ＬＥＤモジュール２０ａとＬＥＤモジュール２０ｂとは、一対のリード線７０を介して電気的に並列接続される。 In the LED modules 20a and 20b in FIG. 4, after the members except the conductive adhesive members 27 and 37 are provided on the front surface and the back surface of the substrate 21, the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37. At this time, in the electrical connection between the lead wire 70 and the terminal 38, first, the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b. Thereafter, a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28. Provided. Therefore, the terminal 28 and the terminal 38 are connected by the lead wire 70. The terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 on the surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.
　また、図４のＬＥＤモジュール２０ａでは、一方のプラス側のリード線７０に供給された電流は、導電性接着部材２７、端子２８、金属配線２６、ＬＥＤ２２及び金属配線２４を通過し、他方のマイナス側のリード線７０から出力される。同様に、ＬＥＤモジュール２０ｂでは、一方のプラス側のリード線７０に供給された電流は、導電性接着部材３７、端子３８、金属配線３６、ＬＥＤ３２及び金属配線３４を通過し、他方のマイナス側のリード線７０から出力される。 Further, in the LED module 20a of FIG. 4, the current supplied to one positive lead wire 70 passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LED 22 and the metal wiring 24, and the other negative voltage. Is output from the lead wire 70 on the side. Similarly, in the LED module 20b, the current supplied to one positive-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, and the metal wiring 34, and the other negative-side lead wire 70. Output from the lead wire 70.
　また、図４のＬＥＤモジュール２０ｂでは、基板２１の裏面と支柱４０の固定部４２の固定面とを接触させるため、基板２１の裏面の固定面と接する部分にはＬＥＤ３２及び封止部材３３等の各部材が設けられていない。従って、基板２１の裏面において、複数のＬＥＤ３２の素子列は固定部４２を挟むように設けられており、素子列の間隔は支柱４０の固定部４２を挟む素子列で他の素子列の間隔より大きくなっている。また、ＬＥＤモジュール２０ａ及び２０ｂの発光特性を揃えるために、基板２１の表面のＬＥＤモジュール２０ａにおいて、基板２１の固定部４２との接触面の上方に位置する部分を挟むように複数のＬＥＤ２２の素子列が設けられている。つまり、ＬＥＤ２２の素子列の間隔は基板２１の固定部４２との接触面の上方に位置する部分を挟む素子列で他の素子列の間隔より大きくなっている。 Further, in the LED module 20b of FIG. 4, the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the support column 40 are brought into contact with each other. Each member is not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42. It is getting bigger. Further, in order to make the light emission characteristics of the LED modules 20a and 20b uniform, in the LED module 20a on the surface of the substrate 21, elements of the plurality of LEDs 22 are sandwiched so as to sandwich a portion located above the contact surface with the fixing portion 42 of the substrate 21. A column is provided. That is, the interval between the element rows of the LEDs 22 is larger than the interval between the other element rows in the element row sandwiching the portion located above the contact surface with the fixed portion 42 of the substrate 21.
　なお、図４のＬＥＤモジュール２０ａ及び２０ｂでは、導電性接着部材２７及び３７は貫通孔２１ｂ内の空間を隔てて離れて設けられるとした。しかし、複数のＬＥＤ２２及び３２はリード線７０に対して並列接続されるため、導電性接着部材２７及び３７は接していても特に問題はない。従って、導電性接着部材２７及び３７は別々の部材でなく、一体となって１つの接着部材として設けられても構わない。つまり、１つの導電性部材が、端子２８及び３８並びにリード線７０と接するように、貫通孔２１ｂ内と、基板２１の表面上と、基板２１の裏面上とに連続して設けられてもよい。 In the LED modules 20a and 20b in FIG. 4, the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b. However, since the plurality of LEDs 22 and 32 are connected in parallel to the lead wire 70, there is no particular problem even if the conductive adhesive members 27 and 37 are in contact with each other. Therefore, the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .
　また、図４のＬＥＤモジュール２０ａでは、リード線７０の先端が導電性接着部材２７の表面で露出するように設けられるとしたが、導電性接着部材２７により完全に被覆されていてもよい。この場合には、リード線７０と導電性接着部材２７との接触面積が増加するため、両者の接続を強固にすることができる。 Further, in the LED module 20 a of FIG. 4, the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.
　また、図４のＬＥＤモジュール２０ａ及び２０ｂの発光特性を揃える必要のないときは、基板２１の表面のＬＥＤモジュール２０ａにおいて、基板２１の固定部４２との接触面の上方に位置する部分に、ＬＥＤ２２の素子列を設けてもよい。 Further, when it is not necessary to align the light emission characteristics of the LED modules 20a and 20b in FIG. 4, the LED 22 is placed on the LED module 20a on the surface of the substrate 21 above the contact surface with the fixing portion 42 of the substrate 21. May be provided.
　以上のように本実施の形態の電球形ランプ１は、グローブ１０と、グローブ１０の内方に向かって延びるように設けられた支柱４０と、グローブ１０内に配置され、支柱４０に固定されたＬＥＤモジュール２０ａ及び２０ｂとを備える。そして、ＬＥＤモジュール２０ａは、基板２１の表面上に設けられた複数のＬＥＤ２２から構成されたＬＥＤ２２の素子列と、ＬＥＤ２２の素子列を覆うように設けられ、ＬＥＤ２２の素子列が発する光の波長を変換する封止部材２３とを有する。そして、ＬＥＤモジュール２０ｂは、基板２１の裏面上に設けられた複数のＬＥＤ３２から構成されたＬＥＤ３２の素子列と、ＬＥＤ３２の素子列を覆うよう設けられ、ＬＥＤ３２の素子列が発する光の波長を変換する封止部材３３とを有する。そして、ＬＥＤ２２は、基板２１を挟んで封止部材３３と対向するように配置されている。そして、ＬＥＤ３２は、基板２１を挟んで封止部材２３と対向するように配置されている。つまり、ＬＥＤモジュール２０ａとＬＥＤモジュール２０ｂとによって、両面から光を放出する１つの両面発光型のＬＥＤモジュールが構成されている。 As described above, the light bulb shaped lamp 1 according to the present embodiment includes the globe 10, the support column 40 provided so as to extend inward of the globe 10, and the light bulb shaped lamp 1 that is disposed in the globe 10 and fixed to the support column 40. LED modules 20a and 20b are provided. The LED module 20a is provided so as to cover the element array of the LED 22 composed of a plurality of LEDs 22 provided on the surface of the substrate 21 and the element array of the LED 22, and the wavelength of light emitted by the element array of the LED 22 is set. And a sealing member 23 to be converted. The LED module 20b is provided so as to cover the element array of the LED 32 composed of a plurality of LEDs 32 provided on the back surface of the substrate 21 and the element array of the LED 32, and converts the wavelength of light emitted by the element array of the LED 32. And a sealing member 33 to be used. The LED 22 is disposed so as to face the sealing member 33 with the substrate 21 interposed therebetween. The LED 32 is disposed so as to face the sealing member 23 with the substrate 21 interposed therebetween. That is, the LED module 20a and the LED module 20b constitute one double-sided light emitting LED module that emits light from both sides.
　また、本実施の形態の電球形ランプ１では、ＬＥＤ２２の素子列が直列接続された複数のＬＥＤ２２から構成され、ＬＥＤ３２の素子列が直列接続された複数のＬＥＤ３２から構成され、ＬＥＤ２２の素子列が、ＬＥＤ３２の素子列のＬＥＤの数と同一のＬＥＤの数を有する。 Moreover, in the light bulb shaped lamp 1 of the present embodiment, the element array of the LED 22 is composed of a plurality of LEDs 22 connected in series, the element array of the LED 32 is composed of a plurality of LEDs 32 connected in series, and the element array of the LED 22 is The number of LEDs is the same as the number of LEDs in the element row of the LEDs 32.
　また、本実施の形態の電球形ランプ１では、支柱４０の表面が、ＬＥＤ２２の素子列及びＬＥＤ３２の素子列から発せられる光に対して光反射率３０％以上を有する。そして、支柱４０が、Ａｌ、Ｃｕ、及びＦｅのいずれかを主成分とする。 Further, in the light bulb shaped lamp 1 of the present embodiment, the surface of the support column 40 has a light reflectance of 30% or more with respect to light emitted from the element array of the LED 22 and the element array of the LED 32. And the support | pillar 40 has either Al, Cu, and Fe as a main component.
　また、本実施の形態の電球形ランプでは、ＬＥＤモジュール２０ａは、複数のＬＥＤ２２の素子列を有し、ＬＥＤモジュール２０ｂは、複数のＬＥＤ３２の素子列を有する。 Further, in the light bulb shaped lamp of the present embodiment, the LED module 20a has an element array of a plurality of LEDs 22, and the LED module 20b has an element array of a plurality of LEDs 32.
　これにより、電球形ランプ１は基板２１の両面から光を発するため、電球形ランプ１の口金側及びそれと反対側から光が取り出され、広い配光角を持つ電球形ランプ１を実現することができる。 Thereby, since the light bulb shaped lamp 1 emits light from both sides of the substrate 21, light is taken out from the base side of the light bulb shaped lamp 1 and the opposite side thereof, thereby realizing the light bulb shaped lamp 1 having a wide light distribution angle. it can.
　また、基板２１を透過して基板２１の表面から発せられるＬＥＤ３２の光は、ＬＥＤ３２と対向する封止部材２３により波長変換され、ＬＥＤモジュール２０ａの光として発せられる。同様に、基板２１を透過して基板２１の裏面から発せられるＬＥＤ２２の光は、ＬＥＤ２２と対向する封止部材３３により波長変換され、ＬＥＤモジュール２０ｂの光として発せられる。例えば、ＬＥＤ３２の直上に発せられた強度の高い青色光は、封止部材２３により波長変換されて白色光として発せられ、ＬＥＤ２２の直下に発せられた強度の高い青色光は、封止部材３３により波長変換されて白色光として発せられる。従って、ＬＥＤモジュール２０ａ及び２０ｂから全方位に発せられる光について色ムラを抑制することができる。 Further, the light of the LED 32 transmitted through the substrate 21 and emitted from the surface of the substrate 21 is wavelength-converted by the sealing member 23 facing the LED 32 and emitted as light of the LED module 20a. Similarly, the light of the LED 22 transmitted through the substrate 21 and emitted from the back surface of the substrate 21 is wavelength-converted by the sealing member 33 facing the LED 22 and emitted as light of the LED module 20b. For example, high-intensity blue light emitted directly above the LED 32 is wavelength-converted by the sealing member 23 to be emitted as white light, and high-intensity blue light emitted directly below the LED 22 is emitted from the sealing member 33. Wavelength converted and emitted as white light. Therefore, color unevenness can be suppressed for the light emitted from the LED modules 20a and 20b in all directions.
　また、本実施の形態の電球形ランプ１では、ＬＥＤモジュール２０ａ及び２０ｂへの給電が、単に、リード線７０を、貫通孔２１ｂを通して導電性接着部材２７及び３７により２つの端子２８及び３８の両方と接続することで実現される。従って、端子２８及び３８のいずれかにリード線７０を接続し、ビアホール等により端子２８と端子３８とを接続する構成と比較して、端子２８と端子３８とを接続するビアホール等の構成が不要となる。また、端子２８及び３８に別々のリード線７０を接続する構成と比較してリード線７０の数を半分にすることができる。その結果、簡素な構造の電球形ランプ１を実現することができる。 Further, in the light bulb shaped lamp 1 of the present embodiment, power is supplied to the LED modules 20a and 20b simply by connecting the lead wire 70 through the through-hole 21b to the two terminals 28 and 38 by the conductive adhesive members 27 and 37. It is realized by connecting with. Therefore, compared to a configuration in which the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, a configuration of a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes. In addition, the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.
　また、本実施の形態の電球形ランプ１では、基板２１が、ＬＥＤ２２の素子列及びＬＥＤ３２の素子列から発せられる光に対して光反射率５０％以上を有する。そして、基板２１が、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする。これにより、基板２１の光透過率を低くしてＬＥＤモジュール２０ａ及び２０ｂから発せられる光の色ムラを抑制することができる。また、基板２１に低コストの白色基板を用いて電球形ランプ１を低コスト化することもできる。 Further, in the light bulb shaped lamp 1 of the present embodiment, the substrate 21 has a light reflectance of 50% or more with respect to light emitted from the element array of the LED 22 and the element array of the LED 32. Then, the substrate 21 is, for Al 2 O 3, MgO, SiO , and one of TiO 2 as a main component. Thereby, the light transmittance of the board | substrate 21 can be made low and the color nonuniformity of the light emitted from LED module 20a and 20b can be suppressed. Further, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low-cost white substrate for the substrate 21.
　また、本実施の形態の電球形ランプ１では、基板２１の裏面は、支柱４０と接するように支柱４０に対し接着固定され、ＬＥＤモジュール２０ａ及び２０ｂが、支柱４０に直接的に固定されている。これにより、基板２１の放熱効率を高めることができる。その結果、温度上昇によるＬＥＤ２２及び３２の発光効率及び寿命の低下を抑制することができる。 Further, in the light bulb shaped lamp 1 of the present embodiment, the back surface of the substrate 21 is bonded and fixed to the column 40 so as to be in contact with the column 40, and the LED modules 20 a and 20 b are directly fixed to the column 40. . Thereby, the thermal radiation efficiency of the board | substrate 21 can be improved. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22 and 32 due to a temperature rise.
　なお、本実施の形態の電球形ランプ１では、ＬＥＤ２２の非実装領域とＬＥＤ３２の実装領域とが対向するように、ＬＥＤ３２及びＬＥＤ２２が基板２１に実装されるとした。しかし、図６に示されるように、ＬＥＤ２２の実装領域とＬＥＤ３２の実装領域とが対向するように、ＬＥＤ３２及びＬＥＤ２２が互いの直下に位置するように基板２１に実装されてもよい。言い換えると、ＬＥＤ２２が基板２１を挟んでＬＥＤ３２と対向するように配置されてもよい。例えば、ＬＥＤ２２及びＬＥＤ３２は、ＬＥＤ２２の下面の全面とＬＥＤ３２の下面の全面とが対向するように配置されてもよい。この場合、ＬＥＤ２２は、基板２１及びＬＥＤ３２を挟んで封止部材３３と対向するように配置され、ＬＥＤ３２は、基板２１及びＬＥＤ２２を挟んで封止部材２３と対向するように配置される。 In the light bulb shaped lamp 1 according to the present embodiment, the LED 32 and the LED 22 are mounted on the substrate 21 so that the non-mounting area of the LED 22 and the mounting area of the LED 32 face each other. However, as shown in FIG. 6, the LED 32 and the LED 22 may be mounted on the substrate 21 so as to be positioned directly below each other so that the mounting region of the LED 22 and the mounting region of the LED 32 face each other. In other words, the LED 22 may be disposed so as to face the LED 32 with the substrate 21 interposed therebetween. For example, the LED 22 and the LED 32 may be arranged so that the entire lower surface of the LED 22 faces the entire lower surface of the LED 32. In this case, the LED 22 is disposed to face the sealing member 33 with the substrate 21 and the LED 32 interposed therebetween, and the LED 32 is disposed to face the sealing member 23 with the substrate 21 and the LED 22 interposed therebetween.
　図６の構成では、基板２１を透過して基板２１の表面から発せられるＬＥＤ３２の光は、ＬＥＤ３２と対向するＬＥＤ２２により反射又は吸収されて遮光され、ＬＥＤモジュール２０ａの光として発せられない。同様に、基板２１を透過して基板２１の裏面から発せられるＬＥＤ２２の光は、ＬＥＤ２２と対向するＬＥＤ３２により反射又は吸収されて遮光され、ＬＥＤモジュール２０ｂの光として発せられない。従って、ＬＥＤモジュール２０ａ及び２０ｂにより全方位に発せられる光について色ムラを抑制することができる。 In the configuration of FIG. 6, the light of the LED 32 that is transmitted through the substrate 21 and emitted from the surface of the substrate 21 is reflected or absorbed by the LED 22 facing the LED 32 and is blocked, and is not emitted as the light of the LED module 20 a. Similarly, the light of the LED 22 that is transmitted through the substrate 21 and emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22 to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.
　なお、図６の（ａ）は本実施の形態に係る電球形ランプ１においてグローブ１０を除いた状態でＬＥＤモジュール２０ａを上方から見たときの平面図である。そして、図６の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプ１の断面図であり、図６の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプ１の断面図であり、図６の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプ１の断面図であり、図６の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプ１の断面図である。 In addition, (a) of FIG. 6 is a top view when the LED module 20a is seen from upper direction in the state which remove | excluded the globe 10 in the lightbulb-shaped lamp 1 which concerns on this Embodiment. 6 (b) is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 6 (a), and FIG. 6 (c) is a line BB ′ in FIG. 6 (a). FIG. 6D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ in FIG. 6A. (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
　また、図４及び図６に示す本実施の形態の電球形ランプ１では、ＬＥＤ２２の素子列におけるＬＥＤ２２の並び方向と直交する方向（基板２１の短辺方向）において、ＬＥＤ２２とそれを被覆する封止部材２３とで中心位置が一致するように、ＬＥＤ２２と封止部材２３とが設けられるとした。同様に、ＬＥＤ３２の素子列におけるＬＥＤ３２の並び方向と直交する方向（基板２１の短辺方向）において、ＬＥＤ３２とそれを被覆する封止部材３３とで中心位置が一致するように、ＬＥＤ３２と封止部材３３とが設けられるとした。しかし、図７に示されるように、基板２１の短辺方向において、ＬＥＤ２２とそれを被覆する封止部材２３とで中心位置がずれ、ＬＥＤ３２とそれを被覆する封止部材３３とで中心位置がずれるように、ＬＥＤ２２及び３２と封止部材２３及び３３とが設けられてもよい。このとき、ずれの向きはＬＥＤ２２及び３２で反対とされる。例えば、ＬＥＤ２２の中心位置がそれを被覆する封止部材２３の中心位置に対して支柱４０と反対側にずれる場合、ＬＥＤ３２の中心位置はそれを被覆する封止部材３３の中心位置に対して支柱４０側にずれるようにされる。 Further, in the light bulb shaped lamp 1 of the present embodiment shown in FIGS. 4 and 6, the LED 22 and the sealing covering the LED 22 in the direction (short side direction of the substrate 21) perpendicular to the arrangement direction of the LEDs 22 in the element array of the LED 22. It is assumed that the LED 22 and the sealing member 23 are provided so that the center positions thereof coincide with the stop member 23. Similarly, the LED 32 is sealed with the LED 32 so that the center positions of the LED 32 and the sealing member 33 covering the LED 32 coincide with each other in the direction orthogonal to the arrangement direction of the LEDs 32 in the element array of the LED 32 (the short side direction of the substrate 21). The member 33 is provided. However, as shown in FIG. 7, in the short side direction of the substrate 21, the center position is shifted between the LED 22 and the sealing member 23 covering the LED 22, and the center position is shifted between the LED 32 and the sealing member 33 covering the LED 32. LED22 and 32 and sealing member 23 and 33 may be provided so that it may shift | deviate. At this time, the direction of deviation is reversed between the LEDs 22 and 32. For example, when the center position of the LED 22 is shifted to the opposite side of the support column 40 with respect to the center position of the sealing member 23 that covers the LED 22, the center position of the LED 32 is the support column with respect to the center position of the sealing member 33 that covers the LED 32. It is made to shift to 40 side.
　図７の構成では、基板２１の短辺方向において、ＬＥＤ２２の一方の側に他方の側より広く封止部材２３を設け、ＬＥＤ３２の一方の側に他方の側より広く封止部材３３を設けることができる。従って、基板２１の短辺方向において、ＬＥＤ２２及び３２の位置を大きくずらす場合でも、ＬＥＤ２２を封止部材３３に対向させ、ＬＥＤ３２を封止部材２３に対向させることができる。 In the configuration of FIG. 7, in the short side direction of the substrate 21, the sealing member 23 is provided on one side of the LED 22 wider than the other side, and the sealing member 33 is provided on one side of the LED 32 wider than the other side. Can do. Therefore, even when the positions of the LEDs 22 and 32 are largely shifted in the short side direction of the substrate 21, the LED 22 can be opposed to the sealing member 33 and the LED 32 can be opposed to the sealing member 23.
　なお、図７は、図４の（ａ）のＢ－Ｂ’線に沿って切断した電球形ランプ１の変形例の拡大断面図である。ここで、図７では１組のＬＥＤ２２及び３２の拡大図のみを示しているが、他の全ての組のＬＥＤ２２及び３２も図７と同様の構成を有しても構わない。 FIG. 7 is an enlarged cross-sectional view of a modified example of the light bulb shaped lamp 1 cut along the line B-B ′ in FIG. Here, FIG. 7 shows only an enlarged view of one set of LEDs 22 and 32, but all the other sets of LEDs 22 and 32 may have the same configuration as in FIG.
　また、図４に示す本実施の形態の電球形ランプ１では、断面略半円状の封止部材２３と封止部材３３とが基板２１の主面垂直方向において一部重なるように設けられるとした。しかし、図８に示されるように、断面略半円状の封止部材２３と封止部材３３とが基板２１の主面垂直方向において全く重ならないように（完全にずれているように）設けられていてもよい。この場合、基板２１を平面視したときに（上方から見たときに）、領域Ａと領域Ｂとの重なり部分はない。 Further, in the light bulb shaped lamp 1 of the present embodiment shown in FIG. 4, when the sealing member 23 and the sealing member 33 having a substantially semicircular cross section are provided so as to partially overlap in the direction perpendicular to the main surface of the substrate 21. did. However, as shown in FIG. 8, the sealing member 23 and the sealing member 33 having a substantially semicircular cross section are provided so as not to overlap at all in the direction perpendicular to the main surface of the substrate 21 (so as to be completely displaced). It may be done. In this case, when the substrate 21 is viewed in plan (when viewed from above), there is no overlapping portion between the region A and the region B.
　図８では、基板２１の裏面（下面）にはＬＥＤ２２と対向するようにして波長変換部材（波長変換部）３３Ａが設けられるとともに、基板２１の表面（上面）にはＬＥＤ３２と対向するようにして波長変換部材（波長変換部）２３Ａが設けられる。言い換えると、ＬＥＤ２２は、基板２１を挟んで波長変換部材３３Ａと対向するように配置され、ＬＥＤ３２は、基板２１を挟んで波長変換部材２３Ａと対向するように配置されている。 In FIG. 8, a wavelength conversion member (wavelength conversion unit) 33 </ b> A is provided on the back surface (lower surface) of the substrate 21 so as to face the LED 22, and the surface (upper surface) of the substrate 21 is opposed to the LED 32. A wavelength conversion member (wavelength conversion unit) 23A is provided. In other words, the LED 22 is disposed to face the wavelength conversion member 33A with the substrate 21 interposed therebetween, and the LED 32 is disposed to face the wavelength conversion member 23A with the substrate 21 interposed therebetween.
　また、図８の構成において、波長変換部材２３Ａは、ＬＥＤ３２だけではなく封止部材３３にも対向するように設けられている。また、波長変換部材３３Ａは、ＬＥＤ２２だけではなく封止部材２３にも対向するように設けられている。 In the configuration of FIG. 8, the wavelength conversion member 23 </ b> A is provided to face not only the LED 32 but also the sealing member 33. The wavelength conversion member 33A is provided to face not only the LED 22 but also the sealing member 23.
　さらに、封止部材２３と封止部材３３とが基板２１の主面垂直方向において完全に重ならないように（完全にずれているように）設けられている場合に、基板２１の両面で光量差（光量分布）をつけたい場合は、図９に示すような構成とすることができる。図９の構成では、基板２１の表面におけるＬＥＤ２２（封止部材２３）が基板２１の裏面におけるＬＥＤ３２（封止部材３３）よりも多くなるように構成されている。つまり、上方側が下方側よりも光量が大きくなるように構成されている。 Further, when the sealing member 23 and the sealing member 33 are provided so as not to be completely overlapped (so as to be completely displaced) in the direction perpendicular to the main surface of the substrate 21, the light amount difference between both surfaces of the substrate 21. When it is desired to add (light quantity distribution), the configuration shown in FIG. 9 can be adopted. In the configuration of FIG. 9, the LED 22 (sealing member 23) on the front surface of the substrate 21 is configured to be larger than the LEDs 32 (sealing member 33) on the back surface of the substrate 21. That is, the upper side is configured to have a larger light intensity than the lower side.
　図８及び図９において、波長変換部材２３Ａは、封止部材２３と同じ材料で構成することができる。また、波長変換部材３３Ａは、封止部材３３と同じ材料で構成することができる。波長変換部材２３Ａ及び３３Ａは、例えばシート状に形成することができるが、シート状でなくても構わない。 8 and 9, the wavelength conversion member 23A can be made of the same material as the sealing member 23. Further, the wavelength conversion member 33 </ b> A can be made of the same material as the sealing member 33. The wavelength conversion members 23A and 33A can be formed in a sheet shape, for example, but may not be in a sheet shape.
　なお、図８及び図９は、図４の（ａ）のＢ－Ｂ’線に沿って切断した電球形ランプ１の他の変形例の一部拡大断面図である。ここで、図８及９では一部のみを示しているが、他の全ての組のＬＥＤ２２及び３２も図８及び図９と同様の構成を有しても構わない。 8 and 9 are partially enlarged cross-sectional views of other modified examples of the light bulb shaped lamp 1 cut along the line B-B 'in FIG. 4 (a). Here, although only a part is shown in FIGS. 8 and 9, all the other sets of LEDs 22 and 32 may have the same configuration as in FIGS. 8 and 9.
　図８及び図９に示すように構成した場合でも、広い配光角を持ち、色ムラを抑制できる電球形ランプを実現することができる。 Even when configured as shown in FIGS. 8 and 9, a light bulb shaped lamp having a wide light distribution angle and capable of suppressing color unevenness can be realized.
　（変形例）
　上記の実施の形態の電球形ランプ１は、１つの基板２１の表面及び裏面の両面に光源及びこれを発光させる配線を設けることで、２つのＬＥＤモジュール２０ａ及び２０ｂを形成し、電球形ランプ１の口金側及びそれと反対側に光を取り出すとした。しかしながら、２つの別々の基板の表面に個別に光源及びこれを発光させる配線を設け、２つの基板の裏面を張り合わせて１つの基板２１とすることでも、電球形ランプ１の口金側及びそれと反対側に光を取り出すことができる。従って、本変形例に係る電球形ランプ１は、ＬＥＤモジュールの基板２１がそれぞれ表面に光源及びこれを発光させる配線を備える２つの基板を接着剤で接着して構成される点で上記の実施の形態の電球形ランプ１と異なる。以下、上記の実施の形態の電球形ランプ１と異なる点を中心に詳述する。 (Modification)
The light bulb shaped lamp 1 of the above embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front and back surfaces of a single substrate 21, and the light bulb shaped lamp 1 It was assumed that light was extracted to the base side and the opposite side. However, the light source and the wiring for emitting the light source are separately provided on the surfaces of two separate substrates, and the back surfaces of the two substrates are bonded together to form one substrate 21. The light can be extracted. Therefore, the light bulb shaped lamp 1 according to this modification is the above-described embodiment in that the substrate 21 of the LED module is configured by bonding two substrates each having a light source and wiring for emitting light on the surface thereof with an adhesive. It differs from the light bulb shaped lamp 1 of the form. Hereinafter, the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.
　図１０は、本変形例に係る電球形ランプ１の構成を示す図である。 FIG. 10 is a diagram showing a configuration of the light bulb shaped lamp 1 according to this modification.
　なお、図１０の（ａ）は本変形例に係る電球形ランプ１においてグローブ１０を除いた状態でＬＥＤモジュール１２０ａを上方から見たときの平面図である。そして、図１０の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプ１の断面図であり、図１０の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプ１の断面図であり、図１０の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプ１の断面図であり、図１０の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプ１の断面図である。 In addition, (a) of FIG. 10 is a top view when the LED module 120a is viewed from above in a state where the globe 10 is removed in the light bulb shaped lamp 1 according to the present modification. 10B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 10A, and FIG. 10C is a line BB ′ in FIG. FIG. 10D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ in FIG. 10A. (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
　ＬＥＤモジュール１２０ａは、主発光モジュール（第１発光モジュール）の一例であり、ベアチップが直接基板２９の表面（一方の主面）上に実装されたＣＯＢ構造である。一方、ＬＥＤモジュール１２０ｂは、副発光モジュール（第２発光モジュール）の一例であり、ベアチップが直接基板３９の表面（一方の主面）上に実装されたＣＯＢ構造である。 The LED module 120a is an example of a main light emitting module (first light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 29. On the other hand, the LED module 120b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 39.
　ＬＥＤモジュール１２０ａは、基板２９と、基板２９の表面上に設けられた複数のＬＥＤ２２、封止部材２３、金属配線２４及び２６、ワイヤー２５、導電性接着部材２７並びに端子２８とを備えている。一方、ＬＥＤモジュール１２０ｂは、基板３９と、基板３９の表面上に設けられた複数のＬＥＤ３２、封止部材３３、金属配線３４及び３６、ワイヤー３５、導電性接着部材３７並びに端子３８とを備えている。 The LED module 120 a includes a substrate 29, a plurality of LEDs 22 provided on the surface of the substrate 29, a sealing member 23, metal wirings 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal 28. On the other hand, the LED module 120 b includes a substrate 39, a plurality of LEDs 32 provided on the surface of the substrate 39, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.
　なお、基板２９は主基板の一例であり、基板３９は副基板の一例である。 The substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub substrate.
　［基板］
　基板２９及び３９は、同様の構成及び形状を有し、接着剤９０により互いの裏面が接着されて１つの基板２１を構成している。基板２９及び３９は、例えば窒化アルミニウム等のセラミック基板、金属基板、樹脂基板、ガラス基板、フレキシブル基板又はアルミナ基板等である。基板２９はＬＥＤ２２を実装するための矩形状の実装基板であり、基板３９はＬＥＤ３２を実装するための矩形状の実装基板である。 [substrate]
The substrates 29 and 39 have the same configuration and shape, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21. The substrates 29 and 39 are, for example, a ceramic substrate such as aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate. The substrate 29 is a rectangular mounting substrate for mounting the LEDs 22, and the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.
　基板２９及び３９は、ＬＥＤ２２及び３２から発せられる光に対して光透過率が低く例えば１０％以下の白色アルミナ基板等の白色基板で構成されることが好ましい。例えば、基板２９及び３９は、ＬＥＤ２２及び３２から発せられる光に対して光反射率５０％以上を有し、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする基板で構成することができる。これにより、基板２１としての光透過率を低くしてＬＥＤモジュール１２０ａ及び１２０ｂから発せられる光の色ムラを抑制することができる。また、基板２９及び３９に低コストの白色基板を用いて電球形ランプ１を低コスト化することができる。 The substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less. For example, the substrates 29 and 39 are substrates that have a light reflectance of 50% or more with respect to the light emitted from the LEDs 22 and 32 and are mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2. Can be configured. Thereby, the light transmittance as the board | substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed. Moreover, the low-cost white board | substrate can be used for the board | substrates 29 and 39, and the light bulb-type lamp 1 can be reduced in cost.
　基板２９の長辺方向の両端部には基板２９の表面から裏面に向けて貫通する２つの貫通孔２９ｂが設けられており、基板３９の長辺方向の両端部にも基板３９の表面から裏面に向けて貫通する２つの貫通孔３９ｂが設けられている。貫通孔２９ｂは、給電用のリード線７０とＬＥＤモジュール１２０ａとを接続するための端子２８を構成し、貫通孔３９ｂは、給電用のリード線７０とＬＥＤモジュール１２０ｂとを接続するための端子３８を構成している。貫通孔２９ｂ及び３９ｂは、連続するように配置されて基板２１の貫通孔２１ｂを構成している。従って、１つのリード線７０は、連続する１つの貫通孔２９ｂ及び３９ｂを挿通している。 Two through holes 29b are provided at both ends in the long side direction of the substrate 29 so as to penetrate from the front surface to the back surface of the substrate 29. Two through-holes 39b penetrating toward are provided. The through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a, and the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b. Is configured. The through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.
　基板２９の中央部には基板２９の表面から裏面に向けて貫通する１つの貫通孔２９ａが設けられており、基板３９の中央部にも基板３９の表面から裏面に向けて貫通する１つの貫通孔３９ａが設けられている。貫通孔２９ａ及び３９ａは、ＬＥＤモジュール１２０ａ及び１２０ｂを支柱４０に固定するためのものであり、連続するように配置されて基板２１の１つの貫通孔２１ａを構成している。従って、支柱４０の突起部４２ｂは、連続する貫通孔２９ａ及び３９ａと嵌合される。 One through-hole 29 a that penetrates from the front surface of the substrate 29 toward the back surface is provided in the central portion of the substrate 29, and one penetration that penetrates from the front surface of the substrate 39 toward the back surface also in the central portion of the substrate 39. A hole 39a is provided. The through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Accordingly, the protrusion 42b of the support column 40 is fitted into the continuous through holes 29a and 39a.
　［接着剤］
　接着剤９０は、基板２９の裏面と基板３９の裏面との間に設けられ、両者を接着するものであり、例えばシリコーン樹脂等の樹脂又はＡｇペースト等の金属ペースト等により構成されている。金属ペーストの場合、基板２９と基板３９との間での熱伝導率を高めて基板２１としての熱伝導率が高められるので、基板２１の放熱効率を高めることができる。その結果、温度上昇によるＬＥＤ２２及び３２の発光効率及び寿命の低下を抑制することができる。また、接着剤９０の遮光性つまり基板２１の遮光性を高めることができるので、基板２９及び３９の表面から裏面に向かう光による色ムラも抑制することができる。 [adhesive]
The adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste. In the case of the metal paste, the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22 and 32 due to a temperature rise. In addition, since the light shielding property of the adhesive 90, that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.
　接着剤９０は、リード線７０が貫通孔２９ｂ及び３９ｂを挿通することを邪魔しないように、基板２９の裏面と基板３９の裏面との間における貫通孔２９ｂ及び３９ｂの間の空間の少なくとも一部には設けられていない。また、接着剤９０は、貫通孔２９ａ及び３９ａと支柱４０の突起部とが嵌合することを邪魔しないように、基板２９の裏面と基板３９の裏面との間における貫通孔２９ａ及び３９ａの間の空間の全てにおいても設けられていない。 The adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided. Further, the adhesive 90 does not interfere with the fitting between the through holes 29a and 39a and the protrusions of the support column 40, and between the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39. It is not provided in all of the spaces.
　図１０のＬＥＤモジュール１２０ａ及び１２０ｂの製造では、まず、複数のＬＥＤ２２、封止部材２３、金属配線２４及び２６、ワイヤー２５並びに端子２８が基板２９の表面の上に設けられる。同様に、複数のＬＥＤ３２、封止部材３３、金属配線３４及び３６、ワイヤー３５並びに端子３８が基板３９の表面の上に設けられる。その後、基板２９及び３９が接着剤９０により接着された後、導電性接着部材２７により２つのリード線７０と端子２８とが接続され、導電性接着部材３７により２つのリード線７０と端子３８とが接続される。従って、１つの基板２９の表面及び裏面の両面に光源及びこれを発光させる配線を設ける場合と比較して、ＬＥＤモジュール１２０ａ及び１２０ｂの製造を容易にすることができる。 In the manufacture of the LED modules 120a and 120b in FIG. 10, first, a plurality of LEDs 22, a sealing member 23, metal wirings 24 and 26, wires 25, and terminals 28 are provided on the surface of the substrate 29. Similarly, a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39. Then, after the substrates 29 and 39 are bonded by the adhesive 90, the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.
　以上のように本変形例の電球形ランプ１では、上記の実施の形態の電球形ランプ１と同様の理由により、広い配光角を持ち、色ムラを抑制することが可能な電球形ランプ１を実現することができる。 As described above, in the light bulb shaped lamp 1 of this modification, for the same reason as the light bulb shaped lamp 1 of the above embodiment, the light bulb shaped lamp 1 having a wide light distribution angle and capable of suppressing color unevenness. Can be realized.
　また、本変形例の電球形ランプ１では、基板２１は、ＬＥＤ２２の素子列が表面に設けられた基板２９と、ＬＥＤ３２の素子列が表面に設けられた基板３９とから構成される。そして、基板２９及び３９が、ＬＥＤ２２の素子列及びＬＥＤ３２の素子列を設けていない裏面同士が互いに対向するように配置されている。このとき、ＬＥＤモジュール１２０ｂが、支柱４０に対し接着固定されていてもよい。これにより、別々の基板２９及び３９を用意して、それぞれの表面に個別に各部材を設けた後、それらを接着するだけでＬＥＤモジュール１２０ａ及び１２０ｂを製造できるので、ＬＥＤモジュール１２０ａ及び１２０ｂの製造を容易にすることができる。その結果、製造が容易な電球形ランプ１を実現することができる。 Further, in the light bulb shaped lamp 1 of the present modification, the substrate 21 is composed of a substrate 29 provided with an element array of LEDs 22 on the surface and a substrate 39 provided with an element array of LEDs 32 on the surface. The substrates 29 and 39 are arranged so that the back surfaces of the LED 22 and the LED 32 that are not provided with the element rows face each other. At this time, the LED module 120b may be bonded and fixed to the support column 40. As a result, the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier. As a result, the light bulb shaped lamp 1 that is easy to manufacture can be realized.
　また、本変形例の電球形ランプ１では、ＬＥＤモジュール１２０ｂが、支柱４０に直接的に取り付けられ、ＬＥＤモジュール１２０ｂで発生した熱を支柱４０に伝熱する。そしてＬＥＤモジュール１２０ａが、ＬＥＤモジュール１２０ｂを介して支柱４０に間接的に取り付けられ、ＬＥＤモジュール１２０ａで発生した熱を、ＬＥＤモジュール１２０ｂを介して支柱４０に間接的に伝熱する。そして、ＬＥＤモジュール１２０ａ及び１２０ｂの間に、熱伝導部材としての接着剤９０が設けられている。この接着剤９０は、熱伝導性樹脂、セラミックペースト、及び金属ペーストのいずれかである。これにより、基板２１の放熱効率及び遮光性を高めることができるので、ＬＥＤ２２及び３２の発光効率及び寿命の低下をさらに抑制し、同時にＬＥＤモジュール１２０ａ及び１２０ｂが発する光の色ムラをさらに抑制することができる。 Further, in the light bulb shaped lamp 1 of this modification, the LED module 120b is directly attached to the support column 40, and heat generated by the LED module 120b is transferred to the support column 40. The LED module 120a is indirectly attached to the support column 40 via the LED module 120b, and the heat generated by the LED module 120a is indirectly transferred to the support column 40 via the LED module 120b. An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b. The adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste. As a result, the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22 and 32 are further suppressed, and at the same time, the color unevenness of the light emitted by the LED modules 120a and 120b is further suppressed. Can do.
　なお、本変形例の電球形ランプ１では、基板３９は、基板３９の表面から裏面に向けて貫通する貫通孔３９ｂを有し、支柱４０は、基板３９の貫通孔３９ｂを突き抜けて基板２９の裏面と接してもよい。つまり、貫通孔３９ｂが支柱４０の固定部４２の全体と嵌合するように形成され、支柱４０の固定部４２の固定面と基板２９の裏面とが接着剤９０により接着されてもよい。これにより、ＬＥＤモジュール１２０ａ及び１２０ｂの支柱４０への固定が容易になり、製造が容易な電球形ランプ１を実現することができる。また、ＬＥＤモジュール１２０ａを支柱４０に対し接着固定して基板２９から支柱４０への放熱経路を短くし、また基板３９の貫通孔３９ｂの内壁と支柱４０の固定部４２とをグリース等の熱伝導部材を介して接触させて基板３９から支柱４０への放熱経路を広くできる。その結果、ＬＥＤ２２及び３２の発光効率及び寿命の低下をさらに抑制することができる。 In the light bulb shaped lamp 1 of this modification, the substrate 39 has a through hole 39b that penetrates from the front surface to the back surface of the substrate 39, and the support column 40 penetrates through the through hole 39b of the substrate 39. You may contact the back side. That is, the through hole 39 b may be formed so as to fit the entire fixing portion 42 of the support column 40, and the fixing surface of the fixing portion 42 of the support column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. Thereby, fixation to the support | pillar 40 of LED module 120a and 120b becomes easy, and the lightbulb-shaped lamp 1 with easy manufacture is realizable. Further, the LED module 120a is bonded and fixed to the support column 40 to shorten the heat dissipation path from the substrate 29 to the support column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the support column 40 are thermally conductive such as grease. The heat dissipation path from the substrate 39 to the support column 40 can be widened by contacting through the member. As a result, it is possible to further suppress a decrease in the light emission efficiency and lifetime of the LEDs 22 and 32.
　（その他の変形例）
　以上、本発明に係る電球形ランプについて、実施の形態及び変形例に基づいて説明したが、本発明は、これらの実施の形態及び変形例に限定されるものではない。本発明の要旨を逸脱しない範囲内で当業者が思いつく各種変形を施したものも本発明の範囲内に含まれる。また、発明の趣旨を逸脱しない範囲で、実施の形態及び変形例における各構成要素を任意に組み合わせてもよい。 (Other variations)
As described above, the light bulb shaped lamp according to the present invention has been described based on the embodiments and the modified examples. However, the present invention is not limited to these embodiments and modified examples. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in embodiment and a modification arbitrarily in the range which does not deviate from the meaning of invention.
　例えば、上記の実施の形態及び変形例において、発光素子としてＬＥＤを例示したが、半導体レーザ等の半導体発光素子、又は、有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）や無機ＥＬ等のＥＬ素子、その他の固体発光素子を用いてもよい。 For example, in the above embodiments and modifications, an LED is exemplified as a light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, and other solid light emitting elements. May be used.
　また、上記の実施の形態及び変形例において、ＬＥＤモジュールは基板上にＬＥＤチップを直接実装したＣＯＢ型の構成としたが、これに限らない。例えば、樹脂製の容器の凹部（キャビティ）の中にＬＥＤチップを実装して当該凹部内に蛍光体含有樹脂を封入したパッケージ型、つまり表面実装型（ＳＭＤ：Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）のＬＥＤ素子を用いて、このＳＭＤ型のＬＥＤ素子を発光素子として基板上に複数個実装することで構成されたＬＥＤモジュールを用いても構わない。特に、パッケージがＬＥＤの光に対して透光性を有するＳＭＤ型のＬＥＤモジュールを用いても構わない。 Further, in the above-described embodiments and modifications, the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto. For example, a package type in which an LED chip is mounted in a concave portion (cavity) of a resin container and a phosphor-containing resin is sealed in the concave portion, that is, a surface mount type (SMD) LED element is used. An LED module configured by mounting a plurality of SMD type LED elements on a substrate as light emitting elements may be used. In particular, an SMD type LED module having a light-transmitting property with respect to LED light may be used.
　また、上記の実施の形態及び変形例において、基板の表面及び裏面のそれぞれの上には複数の素子列が設けられるとしたが、１つの素子列だけが設けられてもよい。 In the above-described embodiments and modifications, a plurality of element rows are provided on each of the front and back surfaces of the substrate. However, only one element row may be provided.
　また、上記の実施の形態及び変形例において、基板の表面及び裏面のＬＥＤの素子列でＬＥＤの並び方向は平行であり、この並び方向と交差、例えば直交し、基板の面内に含まれる所定の方向の一例として基板の短辺方向を示したが、所定の方向は短辺方向に限られない。 Further, in the above-described embodiment and modification, the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction. Although the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.
　また、上記の実施の形態及び変形例において、支柱は、支持台からＬＥＤモジュールに向かう方向において、ＬＥＤの素子列の並び方向の幅が狭まる形状を有するとした。しかし、図１１に示されるように、支柱は、支持台からＬＥＤモジュールに向かう方向において、ＬＥＤの素子列の並び方向の幅が広がる形状を有してもよい。 Further, in the above-described embodiment and modification, the support column has a shape in which the width in the arrangement direction of the LED element rows narrows in the direction from the support base toward the LED module. However, as FIG. 11 shows, the support | pillar may have a shape which the width | variety of the row direction of the element row | line | column of LED spreads in the direction which goes to a LED module from a support stand.
　なお、図１１の（ａ）は本実施の形態に係る電球形ランプ１の変形例においてグローブ１０を除いた状態でＬＥＤモジュール２０ａを上方から見たときの平面図である。そして、図１１の（ｂ）は（ａ）のＡ－Ａ’線に沿って切断した同電球形ランプ１の断面図であり、図１１の（ｃ）は（ａ）のＢ－Ｂ’線に沿って切断した同電球形ランプ１の断面図であり、図１１の（ｄ）は（ａ）のＣ－Ｃ’線に沿って切断した同電球形ランプ１の断面図であり、図１１の（ｅ）は（ａ）のＤ－Ｄ’線に沿って切断した同電球形ランプ１の断面図である。 In addition, (a) of FIG. 11 is a top view when the LED module 20a is seen from the top in a state where the globe 10 is removed in the modification of the light bulb shaped lamp 1 according to the present embodiment. 11 (b) is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 11 (a), and FIG. 11 (c) is a line BB ′ in FIG. 11 (a). FIG. 11D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 11A. (E) is a cross-sectional view of the bulb-type lamp 1 cut along the line DD ′ in (a).
　また、上記の実施の形態及び変形例において、リード線は支柱の外部に設けられるとしたが、図１２の電球形ランプの断面図に示されるように、支柱内に空洞が設けられ、リード線の一部は支柱の空洞に設けられてもよい。この場合、リード線は、支持台から直接支柱内の空洞に入った後、ＬＥＤモジュールの近傍で支柱の上部側面から飛び出してＬＥＤモジュールと接続される。これにより、ＬＥＤモジュールの光がリード線により遮光されるのを低減することができる。図１２において、リード線は、基板の裏面側から基板に突き刺すように設けられているが、リード線を基板の表面側まで回り込ませて基板の表面側から突き刺すように設けられてもよい。 Further, in the above embodiment and modification, the lead wire is provided outside the support column. However, as shown in the cross-sectional view of the light bulb shaped lamp in FIG. May be provided in the column cavity. In this case, after the lead wire enters the cavity in the column directly from the support base, it jumps out from the upper side surface of the column in the vicinity of the LED module and is connected to the LED module. Thereby, it can reduce that the light of an LED module is shielded by a lead wire. In FIG. 12, the lead wire is provided so as to pierce the substrate from the back surface side of the substrate. However, the lead wire may be provided so as to pierce from the front surface side of the substrate by wrapping around the lead wire to the front surface side of the substrate.
　また、本発明は、上記の電球形ランプを備える照明装置として実現することもできる。例えば、図１３に示すように、本発明の実施の形態に係る照明装置１００として、上記の電球形ランプ１と、当該電球形ランプ１が取り付けられる点灯器具（照明器具）２００とを備える照明装置として構成することができる。この場合、点灯器具２００は電球形ランプ１の消灯及び点灯を行うものであり、例えば、天井に取り付けられる器具本体２１０と、電球形ランプ１を覆う透光性又は非透光性のランプカバー２２０とを備える。このうち、器具本体２１０は、電球形ランプ１の口金が装着されるとともに電球形ランプ１に給電を行うソケット２１１を有する。なお、ランプカバー２２０の開口部に透光性プレートを設けてもよい。 Moreover, the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp. For example, as shown in FIG. 13, an illuminating device including the above-described light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached as an illuminating device 100 according to an embodiment of the present invention. Can be configured. In this case, the lighting device 200 turns off and turns on the light bulb shaped lamp 1. For example, the lighting device 200 is attached to the ceiling, and the light transmissive or non-light transmissive lamp cover 220 covers the light bulb shaped lamp 1. With. Among these, the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1. A translucent plate may be provided in the opening of the lamp cover 220.
　本発明は、従来の白熱電球等を代替する電球形ランプとして有用であり、照明装置等において広く利用することができる。 The present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
　１　電球形ランプ
　１０　グローブ
　１１　開口部
　２０ａ、２０ｂ、１２０ａ、１２０ｂ　ＬＥＤモジュール
　２１、２９、３９　基板
　２１ａ、２１ｂ、２９ａ、２９ｂ、３９ａ、３９ｂ　貫通孔
　２２、３２　ＬＥＤ
　２２ａ　サファイア基板
　２２ｂ　窒化物半導体層
　２２ｃ　カソード電極
　２２ｄ　アノード電極
　２２ｅ、２２ｆ　ワイヤーボンド部
　２２ｇ　チップボンディング材
　２３、３３　封止部材
　２３Ａ、３３Ａ　波長変換部材
　２４、２６、３４、３６　金属配線
　２５、３５　ワイヤー
　２７、３７　導電性接着部材
　２８、３８　端子
　３０　口金
　４０　支柱
　４１　主軸部
　４２　固定部
　４２ｂ　突起部
　５０　支持台
　６０　樹脂ケース
　６１　第１ケース部
　６２　第２ケース部
　７０　リード線
　８０　点灯回路
　９０　接着剤
　１００　照明装置
　２００　点灯器具
　２１０　器具本体
　２１１　ソケット
　２２０　ランプカバー DESCRIPTION OF SYMBOLS 1 Light bulb-shaped lamp 10 Globe 11 Opening part 20a, 20b, 120a, 120b LED module 21, 29, 39 Board | substrate 21a, 21b, 29a, 29b, 39a, 39b Through- hole 22, 32 LED
22a Sapphire substrate 22b Nitride semiconductor layer 22c Cathode electrode 22d Anode electrode 22e, 22f Wire bonding part 22g Chip bonding material 23, 33 Sealing member 23A, 33A Wavelength conversion member 24, 26, 34, 36 Metal wiring 25, 35 Wire 27 , 37 Conductive adhesive member 28, 38 Terminal 30 Base 40 Support column 41 Main shaft portion 42 Fixing portion 42b Projection portion 50 Support base 60 Resin case 61 First case portion 62 Second case portion 70 Lead wire 80 Lighting circuit 90 Adhesive 100 Illumination Device 200 Lighting fixture 210 Appliance body 211 Socket 220 Lamp cover

Claims (15)

  1. 　透光性のグローブと、
    　前記グローブの内方に向かって延びるように設けられた支柱と、
    　前記グローブ内に配置され、前記支柱に固定された主発光モジュール及び副発光モジュールとを備え、
    　前記主発光モジュールは、
    　基板の表面上に設けられた複数の第１発光素子から構成された第１発光素子群と、
    　前記第１発光素子群を覆うように設けられ、前記第１発光素子群が発する光の波長を変換する第１波長変換部とを有し、
    　前記副発光モジュールは、
    　前記基板の裏面上に設けられた複数の第２発光素子から構成された第２発光素子群と、
    　前記第２発光素子群を覆うように設けられ、前記第２発光素子群が発する光の波長を変換する第２波長変換部とを有し、
    　前記第１発光素子は、前記基板を挟んで前記第２波長変換部と対向するように配置され、
    　前記第２発光素子は、前記基板を挟んで前記第１波長変換部と対向するように配置されている
    　電球形ランプ。     Translucent gloves,
    A support provided to extend inward of the globe;
    A main light emitting module and a sub light emitting module disposed in the globe and fixed to the column;
    The main light emitting module is
    A first light emitting element group composed of a plurality of first light emitting elements provided on the surface of the substrate;
    A first wavelength converter provided so as to cover the first light emitting element group and converting a wavelength of light emitted by the first light emitting element group;
    The sub-light emitting module is
    A second light emitting element group composed of a plurality of second light emitting elements provided on the back surface of the substrate;
    A second wavelength conversion unit provided so as to cover the second light emitting element group and converting a wavelength of light emitted by the second light emitting element group;
    The first light emitting element is disposed so as to face the second wavelength conversion unit across the substrate,
    The second light emitting element is disposed so as to face the first wavelength conversion unit with the substrate interposed therebetween.
  2. 　前記第１発光素子は、前記基板を挟んで前記第２発光素子と対向するように配置されている
    　請求項１に記載の電球形ランプ。     The light bulb shaped lamp according to claim 1, wherein the first light emitting element is disposed so as to face the second light emitting element with the substrate interposed therebetween.
  3. 　前記複数の第１発光素子の並び方向と直交する方向において、前記第１発光素子の中心位置は前記第１波長変換部の中心位置に対してずれており、
    　前記複数の第２発光素子の並び方向と直交する方向において、前記第２発光素子の中心位置は前記第２波長変換部の中心位置に対してずれており、
    　前記第１発光素子のずれの向きと前記第２発光素子のずれの向きとは反対である
    　請求項１又は請求項２に記載の電球形ランプ。     In the direction orthogonal to the arrangement direction of the plurality of first light emitting elements, the center position of the first light emitting element is shifted with respect to the center position of the first wavelength converter,
    In a direction orthogonal to the arrangement direction of the plurality of second light emitting elements, the center position of the second light emitting element is shifted from the center position of the second wavelength conversion unit,
    The light bulb shaped lamp according to claim 1 or 2, wherein a direction of deviation of the first light emitting element is opposite to a direction of deviation of the second light emitting element.
  4. 　前記基板は、前記第１発光素子群が表面に設けられた主基板と、前記第２発光素子群が表面に設けられた副基板とから構成され、
    　前記主基板及び前記副基板が、前記第１発光素子群及び前記第２発光素子群を設けていない裏面同士が互いに対向するように配置されている
    　請求項１から請求項３のいずれか１項に記載の電球形ランプ。     The substrate is composed of a main substrate having the first light emitting element group provided on the surface and a sub-substrate having the second light emitting element group provided on the surface,
    The main substrate and the sub-substrate are arranged such that back surfaces not provided with the first light-emitting element group and the second light-emitting element group are opposed to each other. The light bulb shaped lamp described in 1.
  5. 　前記第１発光素子群が、直列接続された複数の第１発光素子から構成され、
    　前記第２発光素子群が、直列接続された複数の第２発光素子から構成され、
    　前記第１発光素子群が、前記第２発光素子群の素子の数と同一の素子の数を有する
    　請求項１から請求項４のいずれか１項に記載の電球形ランプ。     The first light emitting element group is composed of a plurality of first light emitting elements connected in series,
    The second light emitting element group includes a plurality of second light emitting elements connected in series,
    The light bulb shaped lamp according to any one of claims 1 to 4, wherein the first light emitting element group has the same number of elements as the number of elements of the second light emitting element group.
  6. 　前記副発光モジュールが、前記支柱に直接的に取り付けられ、前記副発光モジュールで発生した熱を前記支柱に伝熱するとともに、
    　前記主発光モジュールが、前記副発光モジュールを介して前記支柱に間接的に取り付けられ、前記主発光モジュールで発生した熱を、前記副発光モジュールを介して前記支柱に間接的に伝熱する
    　請求項４に記載の電球形ランプ。     The sub light emitting module is directly attached to the support column, and transfers heat generated by the sub light emitting module to the support column.
    The main light emitting module is indirectly attached to the support through the sub light emitting module, and heat generated in the main light emitting module is indirectly transferred to the support through the sub light emitting module. 4. The light bulb shaped lamp according to 4.
  7. 　前記主発光モジュールと前記副発光モジュールとの間に、熱伝導部材が設けられている
    　請求項６に記載の電球形ランプ。     The light bulb shaped lamp according to claim 6, wherein a heat conducting member is provided between the main light emitting module and the sub light emitting module.
  8. 　前記熱伝導部材が、熱伝導性樹脂、セラミックペースト、及び金属ペーストのいずれかである
    　請求項７に記載の電球形ランプ。     The light bulb shaped lamp according to claim 7, wherein the heat conducting member is any one of a heat conducting resin, a ceramic paste, and a metal paste.
  9. 　前記副発光モジュールが、前記支柱に対し接着固定されている
    　請求項６から請求項８のいずれか１項に記載の電球形ランプ。     The light bulb shaped lamp according to any one of claims 6 to 8, wherein the sub light emitting module is bonded and fixed to the support column.
  10. 　前記基板が、前記第１発光素子群及び前記第２発光素子群から発せられる光に対して光反射率５０％以上を有する
    　請求項１に記載の電球形ランプ。     The light bulb shaped lamp according to claim 1, wherein the substrate has a light reflectance of 50% or more with respect to light emitted from the first light emitting element group and the second light emitting element group.
  11. 　前記基板が、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする
    　請求項１０に記載の電球形ランプ。     The light bulb shaped lamp according to claim 10, wherein the substrate is mainly composed of any one of Al 2 O 3 , MgO, SiO, and TiO 2 .
  12. 　前記支柱の表面が、前記第１発光素子群及び前記第２発光素子群から発せられる光に対して光反射率３０％以上を有する
    　請求項１に記載の電球形ランプ。     The light bulb shaped lamp according to claim 1, wherein a surface of the support column has a light reflectance of 30% or more with respect to light emitted from the first light emitting element group and the second light emitting element group.
  13. 　前記支柱が、Ａｌ、Ｃｕ、及びＦｅのいずれかを主成分とする
    　請求項１２に記載の電球形ランプ。     The light bulb shaped lamp according to claim 12, wherein the support column is mainly composed of any one of Al, Cu, and Fe.
  14. 　前記主発光モジュールは、少なくとも２つ以上の前記第１発光素子群を有し、
    　前記副発光モジュールは、少なくとも２つ以上の前記第２発光素子群を有する
    　請求項１から請求項１３のいずれか１項に記載の電球形ランプ     The main light emitting module has at least two or more first light emitting element groups,
    The light bulb shaped lamp according to any one of claims 1 to 13, wherein the sub light emitting module has at least two or more second light emitting element groups.
  15. 　請求項１から請求項１４のいずれか１項に記載の電球形ランプを備える
    　照明装置。
          An illuminating device comprising the light bulb shaped lamp according to any one of claims 1 to 14.
PCT/JP2013/003666 2012-07-17 2013-06-11 Bulb-type lamp and illumination device WO2014013672A1 (en)

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WO2012086109A1 (en) * 2010-12-24 2012-06-28 パナソニック株式会社 Bulb-shaped lamp and lighting device

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Publication number Priority date Publication date Assignee Title
WO2012086109A1 (en) * 2010-12-24 2012-06-28 パナソニック株式会社 Bulb-shaped lamp and lighting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201600111812A1 (en) * 2016-11-07 2018-05-07 Philed S R L LIGHTING DEVICE IN LED TECHNOLOGY AND ITS MANUFACTURING PROCEDURE

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