TWM459520U - LED lamp board structure with double-sided lighting - Google Patents

Description

Double-sided LED panel structure

The present invention is an LED light board structure, in particular, a double-sided light-emitting LED light board structure.

The light-emitting diode (hereinafter referred to as LED) is a kind of light-emitting element which is quite energy-saving and has the advantages of long life, no harmful metal pollution to the environment, etc., and has gradually replaced the traditional power-saving light bulb, fluorescent lamp, incandescent lamp and fluorescent light. Lights, etc., become the source of illumination in everyday life.

In order to be compatible with the shape of a conventional light bulb or a light tube, current LED lighting lamps are mostly made of various bulbs or tubes, but in some special applications, such as advertising billboards, indicating boards, etc. Shaped or light tubular LED lights are not suitable, but rather than tailor-made LED lights are more efficient.

A typical LED lamp is provided with a plurality of LED wafers on an opaque substrate, and can only emit light in a specific direction. However, if it is required to emit light at different angles, such as double-sided illumination, it is necessary to LED crystal cells are required on both the front and the back of the substrate, as described in the National New Publication No. 511299 "Double-sided light-emitting unit with double-sided LEDs on a metal substrate" Revealed technical content. In addition, as disclosed in the Japanese Patent No. I351549, "Double-Sided Illumination Backlight Module", a light guide plate and a reflection plate are used to introduce a plurality of LED light sources from a side into a light guide plate, and then a reflection plate in the light guide plate is used to reflect light into Double-sided lighting technology. Another example is the "new bi-directional light-emitting diode" of the domestic novel No. M332942, which discloses that a through hole is arranged on a substrate, an LED wafer is arranged in the through hole, and a lens cover is covered on the outside to cover the LED wafer. An LED crystal cell produces double-sided illumination. However, it is necessary to provide a through hole on the substrate, and then to arrange the wafer in the through hole requires a relatively high precision packaging technology, and the process is also quite complicated.

An embodiment of the present invention discloses a double-sided LED lamp panel structure, comprising a transparent substrate on which a light transmissive region is formed; a patterned conductive trace disposed on the transparent substrate, and the patterned conductive trace avoids The LED region is disposed in the light-transmitting region, and the two electrode ends of the LED wafer are respectively coupled to the patterned conductive line, so that the LED wafer can form a double-sided light through the light-transmitting region when the light is illuminated.

An embodiment of the present invention discloses the double-sided LED panel structure, wherein the fluorescent layer is further coated on the other surface of the transparent substrate opposite to the LED wafer. The phosphor layer can be applied only to the light-transmitting region.

An embodiment of the present invention discloses the double-sided light-emitting LED light panel structure, further comprising a first light-transmitting plate for covering and sealing the fluorescent layer; and a second light-transmitting plate for covering the light-transmitting LED wafer on the substrate, dense Sealed to protect the LED die. The second light-transmitting plate is coated with a fluorescent layer on the inner surface of the LED wafer. The phosphor layer may correspond to only the light transmissive area.

An embodiment of the present invention discloses a method for manufacturing an LED light panel, the method comprising: preparing a transparent substrate, forming at least one light transmissive region thereon; laying out a patterned conductive trace on the transparent substrate, and patterning the conductive trace Avoiding the light-transmissive region; arranging the LED wafer on the light-transmissive substrate and aligning the LED wafer with the light-transmitting region; and coupling the two electrode ends of the LED wafer to the patterned conductive line.

Other purposes of this creation, some of which are set forth in the following description, may be readily apparent from the description of the content or may be known from the practice of the present invention. The various aspects of the present invention will be understood and attained by the elements and combinations particularly pointed out in the appended claims. It is to be understood that the general description and the following detailed description are for illustrative purposes only and are not intended to be limiting.

The technical features and advantages of the present invention have been broadly summarized above, so that a detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the patent application of this creation will be described below. It will be appreciated by those of ordinary skill in the art that the present invention may be practiced with the same or equivalents. Those of ordinary skill in the art to which this creation belongs should also understand that such equivalent construction cannot be separated from the spirit of the creation as defined in the appended patent application. And scope.

11,31,51,71,81‧‧‧Transparent substrate

12,32,82‧‧‧patterned conductive lines

13,33,53,83‧‧‧Lighting area

14,34,54,74,84‧‧‧LED wafer

15‧‧‧ lead

55,75‧‧‧Flame powder layer

76‧‧‧First light transmissive plate

77‧‧‧Second light-transmissive plate

S101, S103, S105, S107, S109, S110‧‧‧ LED light board manufacturing steps

1 is a plan view showing an embodiment of an LED lamp panel; FIG. 2 is a side view of the embodiment of FIG. 1; FIG. 3 is an embodiment of a parallel pattern of LED wafers; FIG. 5 is a schematic view showing an embodiment of a fluorescent layer added to a light-transmitting substrate; FIG. 6A to FIG. 6C are schematic views showing an embodiment of a shape of a fluorescent layer; FIG. 7 is a schematic view showing an embodiment of sealing and protecting an LED crystal element. And Figure 8 is a schematic diagram of an embodiment of a double-sided LED die.

In order to fully understand the present work, detailed steps and structures will be set forth in the preferred embodiments below. Obviously, the implementation of this creation is not limited to the specific details familiar to those skilled in the relevant art. However, the present invention can be widely practiced in other embodiments in addition to the detailed description, and the scope of the present invention is not limited, and the scope of the following patents will prevail.

The embodiments of the present invention are hereinafter described in conjunction with the drawings to illustrate the details. Some embodiments are described below as a description of the present work, but the present work is not limited to the embodiments. Further, various embodiments may be combined as appropriate to each other to achieve other embodiments.

Referring to the embodiment of FIG. 1 , it is a schematic plan view of an embodiment of the LED light board of the present invention, and FIG. 2 is a side view of the embodiment of FIG. 1 , please refer to FIG. 1 and FIG. 2 together. In one embodiment, the LED light panel 10 uses a plate-shaped transparent substrate 11, and the material of the transparent substrate 11 may be a light transmissive glass, plastic, resin, silicone or ceramic, etc.; Made of flexible polyethylene (PE) series of plastic, polymethyl methacrylate (PMMA), polycarboxylate (PC) or polyimide (PI), but The material of the present transparent substrate 11 is not limited to the above materials.

In the embodiment of FIG. 1, patterned conductive lines 12 are disposed on one surface of the transparent substrate 11, and the patterned conductive lines 12 are arranged in a plurality of I-shapes. A light transmitting region 13 is formed between each adjacent two I-shaped conductive lines 12, and one LED crystal element 14 is disposed on each of the light transmitting regions 13, and two electrode ends of the LED crystal elements 14 are respectively coupled to the two The adjacent I-shaped patterns are patterned on the conductive line 12. In another embodiment, the patterned conductive lines, the light-transmissive regions, and the LED wafers may be arranged in an array in a plurality of columns on the light-transmissive substrate, but the creation is not limited by the number of arrays and the arrangement pattern.

In the embodiment of FIG. 1 and FIG. 2, the positive end of each LED die 14 is coupled to the negative terminal of the previous LED die 14, and the negative terminal of each LED die is opposite to the latter LED. The positive terminal of the element 14 is coupled to form a series pattern of a plurality of LED wafers. The coupling of the two electrode ends of the LED element 14 to the patterned conductive line 12 may be coupled by a lead 15 or by wire bonding. Therefore, the electrode end of the LED wafer is directly soldered to the patterned conductive line by using a spot welding technique, but the coupling manner of the present invention is not limited by the embodiment.

In the embodiment of FIG. 1 and FIG. 2, the LED chip 14 at the front end is coupled to a positive potential of a power supply terminal (not shown), and the LED transistor 14 at the last end is coupled to the above. The negative potential of the power supply terminal, so that when the power supply terminal supplies power, the LED crystal element 14 emits light, and the light will pass through the light transmitting area 13 of the transparent substrate 11 to form a double-sided light. LED light board 10 structure.

Therefore, it can be seen from the above embodiments that the LED lamp panel 10 of the present invention includes a transparent substrate 11 on which the light transmissive region 13 is formed, and the patterned conductive trace 12 is disposed on one surface of the transparent substrate 11. Up and away from the light-transmitting region 13, the LED wafer 14 is correspondingly disposed in the light-transmitting region 13, so that the light when the LED wafer 14 emits light can pass through the light-transmitting region 13 to form double-sided light.

In the embodiment of FIG. 1 and FIG. 2, the LED crystal cells are in a series configuration, and an embodiment of the LED crystal cell parallel configuration is shown in FIG. 3. In the embodiment of FIG. 3, the transparent substrate 31 is used. The patterned conductive line 32 of the upper layout has two parallel lines, but in another embodiment, the patterned conductive line may also be an even number of parallel lines of four, six, etc., so the creation is not affected by the patterned conductive line. Number of restrictions.

In the embodiment of FIG. 3, a plurality of upper and lower corresponding T-shapes are further extended between the two parallel lines, and the above-mentioned light-transmitting region 33 is formed between each corresponding T-shaped shape, and the LED wafer 34 is formed. Then disposed in the light transmitting area 33. And as In another embodiment of FIG. 4, the patterned conductive line 32 has no T-shape, and a long strip-shaped transparent region 33 is formed between the two parallel lines, and a plurality of rows arranged in a row are arranged in the light-transmitting region 33. LED wafers 34.

In the embodiment of FIG. 3 and FIG. 4, the two parallel lines of the patterned conductive line 32 are respectively coupled to the two electrode ends of the LED die 34, for example, the upper row is coupled to the positive end of each LED die 34. The following is coupled to the negative terminal of each LED die 34 to form a parallel connection of a plurality of LED transistors 34. The upper column is recoupled to the positive terminal of the power supply terminal (not shown), and the following is coupled to the power supply. The negative side of the supply side to provide power to drive the LED illumination.

As shown in the embodiment of FIG. 1 and FIG. 2, the coupling manner of the present invention can be coupled to the two ends by means of wire bonding, or can be directly coupled by spot welding, so the formation of the original coupling is not limited. . The couplings of the following embodiments are the same, and therefore will not be described again.

In an embodiment of another array of LED wafers (not shown) in the present invention, a plurality of LED wafers may be used in series only, or only in parallel, or in series or in parallel, to mix LEDs. The cell string/parallel is mainly based on the voltage and current of the above power supply terminal, so as to achieve the purpose of matching the optimal power factor.

The present invention is to enhance the luminous efficiency of the LED wafer, and thus has an embodiment of adding a fluorescent layer. As shown in the embodiment of FIG. 5, a schematic diagram of an embodiment of adding a fluorescent layer 55 to the transparent substrate 51 is shown in FIG. 5. In the embodiment, the LED wafer 54 is disposed only on a single surface of the transparent substrate 51, and thus is in the transparent substrate. The plate 51 can be coated with phosphor powder to form at least one layer of the phosphor layer 55 on the other surface of the LED wafer, so that the LED wafer 54 can pass through the phosphor substrate 55 when it penetrates the transparent substrate 51. Powder enhances luminous efficiency.

In another embodiment, the phosphor layer 55 of the transparent substrate 51 corresponds to the light-transmitting region. As shown in the embodiment of FIGS. 6A-6C, the phosphor layer 55 may have a circular shape corresponding to the light-transmitting region 53 (eg, Fig. 6A), an elliptical shape, a square shape (as shown in Fig. 6B) or a long rectangular shape (as shown in Fig. 6C) are polygonal, but the phosphor layer of the present invention is not limited by the shape of the above embodiment.

As shown in the embodiment of FIG. 7 , a schematic diagram of an embodiment of the LED element for sealing and protecting the LED is provided. In the embodiment of FIG. 7 , a first transparent plate 76 is further disposed outside the phosphor layer 75 of the transparent substrate 71 . The coating is sealed outside the phosphor layer 75. A second light-transmissive plate 77 is further disposed on the LED wafer 74 to cover the LED wafer 74 to seal and protect the LED wafer 74. In order to enhance the luminosity energy above the LED wafer, as shown in the embodiment of FIG. 7, the second light-transmissive plate 77 is coated with the phosphor powder on the inner surface of the LED wafer 74 to form at least one layer. Fluorescent layer 75. The above-mentioned phosphor layer 75 can also correspond to the range of the above-mentioned LED wafer, and exhibits the shape of the embodiment of FIG. 6, but is not limited by the shape of the embodiment of FIG.

FIG. 8 is a schematic diagram of an embodiment in which LED pixels are provided on both sides of the creation. In the embodiment of FIG. 8 , both sides of the transparent substrate 81 are patterned with patterned conductive lines 82, and the layout manner thereof may be symmetric. Or an asymmetrical strip arrangement or array arrangement, as described in FIG. 1 and FIG. 3, which will not be described again. A plurality of transparent regions 83 are formed on the transparent substrate 81, and the patterned conductive traces 82 avoid the transparent regions 83. The plurality of LED wafers 84 are disposed in the transparent regions 83, and each of the LED wafers 84 is disposed. The two electrode ends are respectively coupled to the patterned conductive line, and the coupling manner thereof may be serial or parallel, as described in FIG. 1 and FIG. 3 , and details are not described herein again.

The present invention emphasizes that, in the embodiment of FIG. 8, the light-transmitting regions 83 on both sides of the transparent substrate 81 are arranged offset from each other, in other words, each strip-shaped patterned conductive line on both sides of the transparent substrate 81 82 and the LED die 84 are mutually offset, for example, between adjacent two arrays of LED wafers, at least one LED cell width is disposed at intervals, and the other surface of the transparent substrate is disposed within the interval. LED wafers. In another embodiment, the plurality of LED arrays may be arranged on a surface of the transparent substrate, and the distance between the two adjacent LED arrays is at least one LED array, and the separation distance is Then corresponding to the plurality of LED wafer arrays on the other surface of the transparent substrate.

Similarly, the embodiment in which the LED wafer 84 is disposed on both sides of the transparent substrate 81 in FIG. 8 can also use the embodiment of FIG. 7 to cover the LED wafers on both sides of the transparent substrate with the second transparent plate for sealing protection. LED wafer. And the second light-transmitting plate can also coat the fluorescent layer to enhance the luminous efficacy of the LED wafer. The embodiment is shown in FIG. 7 and therefore will not be described again.

The technical content and technical features of the present invention have been disclosed as above. However, those having ordinary knowledge in the technical field of the present invention should understand that the present invention does not deviate from the spirit and scope of the creation defined by the scope of the appended patent application. The teachings and disclosures can be used for various substitutions and modifications. For example, many of the elements disclosed above may be implemented in different structures or in other structures having the same function, or a combination of the two.

Further, the scope of the present invention is not limited to the apparatus, elements or structures of the specific embodiments disclosed above. It should be understood by those of ordinary skill in the art to which the present teachings, based on the present teachings and disclosure devices, components or structures, whether presently present or future developers, perform substantially the same in substantially the same manner as the present embodiment. The function, while achieving substantially the same result, can also be used in this creation. Therefore, the following patent claims are intended to cover such devices, elements or structures.

11‧‧‧Transparent substrate

12‧‧‧ patterned conductive lines

13‧‧‧Light transmission area

14‧‧‧LED wafer

15‧‧‧ lead

Claims (15)

A double-sided LED lamp panel structure comprising: a transparent substrate on which at least one light transmissive region is formed; at least one patterned conductive trace disposed on the transparent substrate, and the patterned conductive trace avoids The light-transmitting region; and the at least one LED wafer are correspondingly disposed in the light-transmitting region, and the two electrode ends of the LED wafer are respectively coupled to the patterned conductive line, so that the LED wafer can pass through when the light is emitted The light transmitting region forms a double-sided light. The double-sided LED lamp panel structure according to claim 1, wherein the transparent substrate is made of a light transmissive glass, plastic, resin, silicone or ceramic material. The double-sided LED panel structure according to claim 1, wherein the transparent substrate is a flexible polyethylene (PE) series plastic, polymethyl methacrylate (PMMA), poly Polycarbonate (PC) or Polyimide (PI). The double-sided light-emitting LED light panel structure according to claim 1, wherein the light-transmissive area is elongated, and the light-transmissive area is provided with a plurality of LED crystal cells arranged in a row. The double-sided LED panel structure of claim 1, wherein the patterned conductive line and the LED die are disposed on one surface of the transparent substrate. The LED lamp panel structure of the double-sided illumination according to the first aspect of the invention, wherein the patterned conductive line and the LED die are disposed on both sides of the transparent substrate, and opposite to the two sides of the transparent substrate Patterned conductive line and the The LED die is a staggered configuration. The LED light panel structure of the double-sided illumination according to claim 1, wherein the LED wafer and the patterned conductive line are arranged in a strip shape or in an array. The double-sided LED panel structure as described in claim 1, wherein the method further comprises: at least one phosphor layer, coating the phosphor on the other surface of the transparent substrate opposite to the LED wafers . The double-sided light-emitting LED light panel structure according to claim 8, wherein the phosphor layer corresponds to the light-transmitting regions. The double-sided LED panel structure as claimed in claim 8 further comprising: a first light-transmitting plate covering and sealing the phosphor layer. The LED light panel structure of the double-sided illumination according to claim 1, further comprising: a second light transmissive plate covering the LED crystal cells on the transparent substrate to seal the LED crystals yuan. The double-sided light-emitting LED light panel structure according to claim 11, wherein the second light-transmitting sheet is coated with at least one phosphor layer facing the inner surface of the LED wafer. The double-sided LED panel structure according to claim 12, wherein the phosphor layer only corresponds to the range of the LED wafer. The LED lamp panel structure of the double-sided illumination according to the first aspect of the invention, wherein the two electrode ends of the LED crystal cells are coupled to the patterned conductive The line is soldered using spot welding technology. The double-sided LED panel structure according to claim 1, wherein the two electrode ends of the LED transistors are coupled to the patterned conductive line by a wire bonding.