KR101312045B1 - LED Array - Google Patents

Abstract

According to an aspect of the present invention, there is provided a light emitting device including: a second light emitting unit arranged in reverse polarity with respect to the first light emitting unit so as to alternately emit light with the first light emitting unit by supply of an AC power source; Disclosed is an LED array including a portion. Wherein the first light emitting unit and the second light emitting unit each include at least one LED module; The LED module may include a cover substrate provided with a circuit pattern, an LED chip mounted on the cover substrate and electrically connected to the circuit pattern, and provided on one side of the cover substrate so that the emission light of the LED chip is diffused. And a reflector configured to reflect and diffuse the light emitted from the chip toward the cover substrate. According to the present invention, since the light emitted from the LED chip is transmitted to the outside through the cover substrate while being diffused by the reflector, the glare can be improved, and furthermore, when the LED module has a rectangular shape, in particular, a hexahedral shape The regular arrangement of the LED modules is easy, thereby facilitating the configuration of the LED array.

Description

LED Array {LED Array}

The present invention relates to a light emitting diode, and more particularly, to an LED array having an LED (Light Emitting Diode) module having a structure that reflects the light of the LED chip and exits to the outside.

Light emitting diodes, or LEDs, are light sources that convert electrical energy into light energy to emit high brightness light, and LED arrays are a plurality of LED modules arranged in recent years. Due to the advantages of diodes, LED applications are spreading to various fields.

In other words, since the LED has advantages such as high energy efficiency, long life, and advanced light, its field of application has been expanded, and LED-related technologies have been developed in various ways.

The LED is used in various fields such as a display device, a street light or an indoor light, or a decoration such as a light source of a mobile communication terminal, a TV, a monitor, a signboard, an advertisement board, a backlight unit, and the like, and the fields of application are different. It is also rapidly expanding into the field.

Here, the LED may implement various colors through a combination of red, green, and blue LEDs. The LED includes a transparent cover such as an LED chip mounted on a substrate and a lens covering the front surface of the LED chip, and high luminance light emitted from the LED chip to the transparent cover is transmitted through the transparent cover as it is. When emitted to the outside, when facing the optical axis of the light emitted from the LED chip there is a problem that causes the glare by causing glare.

Republic of Korea Patent No. 10-0997172 (Insung Electronics Co., Ltd.), registered November 23, 2010 Republic of Korea Patent Publication No. 10-1999-0078736 (Kyungbong Semiconductor Co., Ltd.), published November 5, 1999 Republic of Korea Patent Publication No. 10-2008-0045779 (Koden City Co., Ltd.), published May 26, 2008

It is an object of the present invention to provide an LED array using an LED module having a structure capable of eliminating glare.

Another object of the present invention is to provide an LED module and an LED array having the same, which is configured to enable the surface mounting of the LED chip to improve the mounting structure of the LED chip.

Still another object of the present invention is to provide an LED array having an LED module having a structure capable of preventing a female band from being formed on the light exit surface of the LED module.

It is still another object of the present invention to provide an LED array having an LED module in which the light emitted from the LED chip is dispersed and emitted widely, thereby eliminating glare and improving the mounting structure and the luminous efficiency of the LED chip.

Another object of the present invention is to provide an LED array having an LED module with improved uniformity of light output to the outside of the LED module.

It is a still further object of the present invention to provide an LED array having an LED module of a structure which is easy to manufacture and particularly easy to assemble.

In order to solve the above object, the present invention provides a first light emitting unit and the first light emitting unit is disposed in reverse polarity with respect to the first light emitting unit so as to emit light alternately with the first light emitting unit by supply of AC power. An LED array comprising a second light emitting unit connected in parallel to the unit is provided. Wherein the first light emitting unit and the second light emitting unit each include at least one LED module; The LED module may include a cover substrate provided with a circuit pattern, an LED chip mounted on the cover substrate and electrically connected to the circuit pattern, and provided on one side of the cover substrate so that the emission light of the LED chip is diffused. And a reflector configured to reflect and diffuse the light emitted from the chip toward the cover substrate.

The cover substrate comprises a glass substrate capable of transmitting light; The circuit pattern is printed on the surface of the glass substrate; The LED chip is mounted on the surface of the glass substrate and electrically connected to the circuit pattern.

The LED chip is surface mounted on the surface of the glass substrate so as to be connected to the circuit pattern. The circuit pattern may have wirings divided into a plurality of lines.

Leads are printed on the outer surface of the reflector; The lead is electrically connected to the circuit pattern.

The reflector; And a rectangular box-shaped reflective cap covering the LED chip and having a hollow formed therein, and a light dispersion provided inside the reflective cap to disperse the emitted light of the LED chip into the reflective cap. do.

Phosphor is applied to the surface of the glass substrate or the surface of the LED chip.

The first light emitting unit and the second light emitting unit may be configured to include a plurality of LED modules, respectively arranged in a straight line connected in series.

According to the LED array according to the present invention has the following effects.

First, according to the present invention, since the light emitted from the LED chip is transmitted to the outside through the cover substrate while being diffused by the reflector, the glare can be improved, and furthermore, the LED module has a square shape, particularly a hexahedral shape. In this case, the regular arrangement of the LED module is easy, which makes it easy to configure the LED array.

Second, according to the present invention, since the LED chip can be surface-mounted on the surface of the glass substrate by surface mounting technology, the mounting process of the LED chip can be simplified and the molding process for packaging the LED chip can be omitted. The productivity can be improved, and the light transmission efficiency is excellent compared to the structure in which a separate electrode plate (for example, ITO) is laminated inside the glass substrate for wire bonding of the LED chip, thereby improving the luminous efficiency. have.

Third, according to the present invention, since a phenomenon in which dark bands, for example, streaks are formed on the light exit surface of the LED module is prevented by the circuit pattern connected to the LED chip, the luminous efficiency may be improved and the light quality may be improved.

Fourth, according to the present invention, since the light emitted from the LED chip can be evenly distributed (dispersed) to the periphery of the light dispersion by the light dispersion inside the reflector, the light emitted from the outside through the light exit surface Efficiency and light uniformity can be improved.

Fifth, according to the present invention, since the lid is printed on the surface of the reflector, the assembly process of the LED module can be simplified, thereby improving productivity and reducing manufacturing costs.

1 is a perspective view showing an embodiment of an LED array according to the present invention.
FIG. 2 is a circuit diagram illustrating a state in which the LED array of FIG. 1 is connected to a power supply unit.
3 is a cross-sectional view showing an embodiment of the LED module for the LED array according to the present invention.
4 is an exploded perspective view of the LED module of FIG. 2.
5 is an exploded perspective view showing another embodiment of the LED module for the LED array according to the present invention.
6 is a diagram schematically illustrating an example of a circuit pattern applied to the LED module of FIG. 5.
7 is a view schematically showing another example of a circuit pattern applicable to the LED module of the LED array according to the present invention.
8 is a view schematically showing another example of a circuit pattern applicable to the LED module of the LED array according to the present invention.
9 is a perspective view showing another embodiment of the LED module for the LED array according to the present invention.
FIG. 10 is a side view of the LED module shown in FIG. 9.
FIG. 11 is a bottom view of the LED module shown in FIG. 9.
FIG. 12 is a bottom view of one embodiment of a glass substrate for the LED module shown in FIG. 9.
FIG. 13 is a plan view illustrating an embodiment of a reflector that is applicable to the glass substrate of FIG. 12.
FIG. 14 is a plan view illustrating another embodiment of the reflector applicable to the glass substrate of FIG. 12.
FIG. 15 is a bottom view of another embodiment of the glass substrate for the LED module shown in FIG. 9.

Best Mode for Carrying Out the Invention Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In describing the present embodiment, the same reference numerals and symbols are used for the same components, and additional description and overlapping description thereof will be omitted below.

First, an embodiment of an LED array according to the present invention will be described with reference to FIGS. 1 and 2. 1 is a perspective view showing an embodiment of an LED array according to the present invention, Figure 2 is a circuit diagram showing a state in which the LED array of Figure 1 is connected to the power supply.

1 and 2, the LED array according to the present invention includes a first light emitting unit 10 and a second light emitting unit 20, and the first light emitting unit 10 and the second light emitting unit. The unit 20 includes at least one LED module 100 and 200, respectively.

The second light emitting part 20 is connected in the opposite direction with respect to the electrode as shown in FIG. 2 so as to be disposed in reverse polarity with respect to the first light emitting part 10, and to the first light emitting part 10. It is connected in parallel. Accordingly, when AC power is supplied by the power supply unit, the first light emitting unit 10 and the second light emitting unit 20 alternately emit light.

In the present exemplary embodiment, the first light emitting unit 10 and the second light emitting unit 20 each include a plurality of LED modules, wherein the LED modules of the first light emitting unit are connected in series with each other, and the second light emitting unit The LED modules are also connected in series with each other, but as described above, the LED modules of the first light emitting unit 10 and the LED modules of the second light emitting unit 20 are parallel to each other in reverse polarity with respect to an electrode (driving electrode). Is connected to.

When the LED module is used as a light source for illumination, it is convenient to use AC as a power source and be used at a driving voltage of 100V or more. In addition, if the same power is supplied to obtain the same level of light emission output, applying a high voltage while maintaining a low current value can reduce the power loss.

As shown in Figs. 1 and 2, when the LED array has two sets of the first light emitting portion 10 and the second light emitting portion 20, the LED modules 100 and 200 of each set are connected in series, respectively. The second set 20 (second light emitting unit) is connected in parallel so as to be reverse polarity with respect to the electrode (drive electrode). That is, the first article 10 (first light emitting part) and the second article 20 (second light emitting part) are arranged in opposite directions to each other, and in the positive voltage section when AC power is applied from the power supply part. The current flows to the set 10 so that the light emitting operation of the LED module belonging to the first article is performed, and in the negative voltage section, the current flows to the second article 20 to perform the light emitting operation of the LED module belonging to the second article, Article 1 and Article 2 may alternately perform the light emitting operation.

Since the array of LED modules in each group is connected in series, the LED modules can be driven at a high voltage to which respective driving voltages are added, and since the first and second articles are connected in parallel to the electrodes so that the polar polarities are reversed, Even when using AC power as a power source, it is alternately operated to improve luminous efficiency.

Next, an embodiment of an LED module for an LED array according to the present invention is described with reference to FIGS. 3 and 4.

3 and 4, an embodiment 100 of the LED module includes a cover substrate 110, an LED chip 120, and a reflector 130.

A circuit pattern 111 is provided on the cover substrate 110, and the LED chip 120 is mounted on the cover substrate 110 and electrically connected to the circuit pattern 111. In addition, in the present embodiment, the cover substrate 110 forms a light exit surface of the LED module. More specifically, the outer surface (upper side based on FIG. 3) of the cover substrate 110 is the light exit surface. Form a face. In the present exemplary embodiment, the cover substrate 110 has a rectangular shape, that is, a rectangular panel shape is not limited thereto.

In more detail, the LED chip 120 is mounted on one side, that is, the inner side of the cover substrate 110. 3 and 4, the LED chip 120 is mounted on the bottom surface of the cover substrate 110 to emit light downward.

The reflector 130 is provided at one side of the cover substrate 110 to reflect the light emitted from the LED chip 120, that is, the light emitted from the LED chip toward the cover substrate 110. The light reflected by the 130, that is, the reflected light passes through the cover substrate 110 and is output to the outside of the LED module.

In the present exemplary embodiment, the reflector 130 is provided on one side of the cover substrate 110 to cover the LED chip 120, and an inner surface of the reflector 130 reflects light. To form. 3 and 4, the upper surface of the reflector 130 is covered by the cover substrate 110, and the reflector 130 diffusely reflects the emitted light of the LED chip. The reflected light is diffused toward the bottom surface of the cover substrate 110, that is, in a widely dispersed state. In the present exemplary embodiment, the reflector 130 has a rectangular box shape in appearance but is not limited thereto.

In this embodiment, since the cover substrate 110 is coupled to the upper side of the reflector 130 with reference to FIG. 3, the coupling relationship between the components of the LED module and the light traveling direction are described. As the direction is different, the cover substrate 110 may be the front surface or the bottom of the LED module.

The reflector 130 has a structure in which one side (upper side) is opened and a hollow is formed therein, in particular, a cap shape having a rectangular appearance, and more particularly, has a square or rectangular box structure, and the reflector The cover substrate 110 is fixed to the upper side of the 130, and the lead 140 is electrically connected to the circuit pattern 111 provided in the cover substrate 110. The lead 140 may be printed on the outer wall of the reflector 230 or the lead 140 may be composed of a wire or a pin and assembled to the outer wall of the reflector. One end of the lead 140 is connected to the circuit pattern 111 and the other end of the lead 140 is electrically connected to the main circuit board.

When the lead 140 is printed on the outer wall of the reflector 130 and provided in an integrated state with the reflector, the lead 140 is integrated with the glass substrate 110 integrally with the reflector 130 and the circuit Since it may be connected to the pattern 111, the assembly process of the LED module can be easily performed. Accordingly, the LED chip 120 may be connected to the main circuit board (not shown) through the circuit pattern 111 and the lead 140, and may receive power and other electrical signals.

In this embodiment, the lead 140 is provided in the vertical direction on the one outer wall and the other outer wall of the reflector 130, respectively, the hollow shape of the reflector 130 is not limited, but the LED chip 120 As long as the light emitted from the reflecting light is reflected toward the cover substrate 110, the reflected light reflected from the inner surface of the reflector 130 may be diffused (dispersed) evenly on the cover substrate 110. Can be changed. The inner surface of the reflector 130, that is, the inner surface of the hollow portion is a light reflecting surface, and a light reflecting material for reflecting light may be coated on the surface of the hollow portion.

The inner surface of the hollow portion of the reflector 130 may be formed in a hemispherical surface or other various shapes, in the present embodiment the appearance of the reflector 130 has a rectangular box shape as described above.

In the present exemplary embodiment, the reflector 130 includes a rectangular box-shaped reflective cap 131 having a hollow formed therein and a light dispersion 132 provided inside the reflective cap. The reflective cap 131 has an open shape at one side thereof, is mounted on one side of the cover substrate 110 to cover the LED chip 120, and the inner space is shielded by the cover substrate 110. In addition, the light disperser 132 is configured to disperse the emitted light of the LED chip, and more specifically, reflects the emitted light of the LED chip to diffuse / disperse the inside of the reflective cap 131 widely.

The lead 140 is printed on the outer surface (outer wall) of the reflective cap 131 to be integrated with the reflective cap 131, and the light dispersion 132 protrudes toward the cover substrate 110 to provide the The LED chip reflects the emitted light to the periphery of the light dispersion 132. In this embodiment, the light dispersion 132 has a horn shape facing the LED chip 120.

In more detail, the light dispersion 132 is a horn shape protruding toward the LED chip 120, and may be configured, for example, in a cone or polygonal horn shape.

In the present exemplary embodiment, the light dispersion 132 may be configured in the shape of a sharp horn, and may have a shape in which the cross-sectional area decreases closer to the LED chip 120 even though the tip is not sharp. However, it is preferable that a plane perpendicular to the axis line of the LED chip 120 is not formed at the tip of the light dispersion 132, and as described above, the center light of the exiting light in the case of the sharp tip-shaped tip, that is, By effectively dispersing light on the optical axis, light loss can be prevented or minimized.

By the light disperser, the light emitted from the LED chip 120 is reflected from the surface of the light disperser 131 to the periphery of the light disperser 131 and diffused widely into the inner space of the reflector 130. In addition, since the light is emitted through the cover substrate 110 through the reflection process on the inner surface of the reflector 130, glare may be improved by the scattered light emission. The LED chip 120 is mounted at the center of the cover substrate 110 so that the axis of the light dispersion 131 coincides with the light axis of the LED chip 120, and the light dispersion 131 is disposed on the LED chip 120. It is provided at the center of the reflector 130.

The cover substrate 110 may be composed of a plurality of layers, or may be composed of a single layer as described below. For example, the cover substrate 110 may include an electrode plate and a front substrate stacked on the outside of the electrode plate. Examples of the electrode plate may include an indium-tin oxide (ITO) film. As an example of the said front substrate, a glass substrate is mentioned.

In the present embodiment, the cover substrate 110 is configured to include a glass substrate, the circuit pattern 111 is printed on the surface of the glass substrate is electrically connected to the LED chip 120. When the circuit pattern 111 is printed on the surface of the glass substrate, the cover substrate 110 may be composed of a single layer, whereby the glass substrate forms a single layer cover substrate and An outer surface (upper surface) becomes a light emitting surface of the LED module, and the LED chip is mounted on an inner surface (lower surface) of the glass substrate. In this embodiment, the reference numerals of the cover substrates are the same as the reference numerals of the glass substrates.

In other words, the cover substrate 110 according to the present embodiment is a rectangular glass substrate (glass substrate) on which the circuit pattern 111 is printed, that is, a single layer substrate capable of transmitting light. The LED chip 120 is surface mounted on a surface of the 110 to be electrically connected to the circuit pattern 111, and the LED chip 120 is powered by other circuits through the circuit pattern 111. Can be supplied. Of course, a separate film or sheet may be laminated to the glass substrate, but in consideration of light transmission efficiency, a single layer may be preferable. The glass substrate 110 is stacked on one side of the reflector 130, and the glass substrate 110 and one side of the reflector opposite thereto have the same size.

As described above, when the circuit pattern is printed on the glass substrate 110 and the LED chip 120 is surface-mounted and mounted on the glass substrate, the LED chip 120 is mounted on the cover substrate, that is, the glass substrate 110. The mounting process may be simplified, and the optical loss may be reduced compared to the case where the LED chip is mounted on the ITO in a state in which a separate layer, for example, an ITO film is laminated on the glass substrate 110. Since the LED chip is directly mounted on the surface of the glass substrate by SMT (surface mounting technology) without wire bonding, a molding process for packaging may be omitted.

More specifically, since glass substrates generally have thermal resistance (heat resistance) to withstand high temperatures (about 200 ° C.), it is possible to mount LED chips through SMT, which is advantageous for mass production of LED modules. Since the process is unnecessary, productivity can be improved. However, in the case of ITO, it is impossible to mount the LED chip through SMT because it is not thermally resistant at high temperature, for example, at the above temperature (about 200 ° C). Therefore, in the case of the above-described ITO, wire bonding is performed to connect the ITO electrode pattern and the LED chip, and molding is performed to prevent disconnection of the bonded wire, but in the case of a glass substrate, The molding may be omitted due to the mounting of the LED chip.

Of course, a single layer substrate capable of transmitting light may be applied as the cover substrate 110 other than the glass substrate, and the LED chip 120 is packaged by a molding material, thereby molding the inside of the glass substrate. In addition, a reflective layer may be coated on the outer surface of the molding part to form a rectangular box-shaped reflector, or the molding part may form a reflector having a structure in which the rectangular box-shaped reflective cap is covered.

The cover substrate 110, in particular the glass substrate, is combined with the reflector 130 to form an LED module having an appearance of a cube, for example, a cube or a cube, with the reflector 130. As shown in FIG. 1, an LED module having the above-described shape (a square box shape) may be easily configured as an LED array by regularly arranging rectangular LED modules as shown in FIG. 1. Since the LED array of the structure can be configured, the model applicability can be improved.

On the other hand, a phosphor (Phosphor) is applied to the surface of the cover substrate 110 or the surface of the LED chip 120 may reduce the color temperature variation. For example, when the LED chip 120 is a blue LED chip and a yellow phosphor is coated on the surface of the glass substrate 110, color temperature variation may be minimized. Of course, the type of the LED chip 120 is not limited to the blue LED.

The circuit pattern 111 may be composed of a single line or may be composed of wirings divided into a plurality of lines as described below. In other words, the circuit pattern may include a first electrode pattern and a second electrode pattern. The first electrode pattern and the second electrode pattern may be configured as a single line or may be divided into a plurality of lines.

Meanwhile, the circuit pattern 111 of the glass substrate 110 may be divided into a plurality of lines of wirings 111a and electrically connected to the LED chip 120. Accordingly, a gap is formed between the wirings 111a. Can be formed.

An example of an LED module having a structure in which the circuit pattern 111 is divided into a plurality of lines of wirings 111a is illustrated in FIG. 5, and various structures of the circuit pattern are illustrated in FIGS. 6 to 8. 5 to 8, the circuit pattern 111 of the cover substrate 110 is divided into a plurality of lines of wirings 111a and electrically connected to the LED chip 120. A gap may be formed between the 111a).

For example, the driving current / voltage of the LED chip 120 is required to be 1000 mA to 1300 mA / 2.5 V to 4.5 V. When the circuit pattern 111 is composed of a single line, the width and thickness of the circuit pattern are large. Reflected light traveling to the cover substrate 110 by the reflector 130 interferes with the circuit pattern, and a dark band, ie, a stripe is formed on the front surface of the cover substrate 110, that is, the light exit surface, by the circuit pattern.

However, when the circuit pattern 111 is divided into a plurality of lines 111a and constituted by fine wirings as in the example of the circuit patterns illustrated in FIGS. 6 to 8, a gap is formed between the lines 111a. As a result, a female band may be prevented from being formed on the front surface of the cover substrate 110. The circuit pattern 111 is an electrode pattern connected to an electrode of the LED chip for driving the LED chip, and a first electrode pattern (for example, a + pole) and a second electrode pattern (for example, a-pole) are respectively formed. It is divided into a plurality of lines of wiring.

The circuit pattern 111 may have a fan-shaped pattern shape in which the gap between the wirings 111a is gradually expanded, and the gap between the wirings 111a may have a constant parallel pattern shape, but is not limited thereto. It may be variously changed and may be a combination of several pattern shapes, for example, a combination of the fan pattern and the parallel pattern shape.

6 shows a parallel pattern shape in which the wires are parallel to each other, and FIG. 7 shows an example in which the circuit pattern is composed of a plurality of lines extending radially, that is, a fan shape pattern, and FIG. 8 shows a fan shape pattern. The example which combined shape and parallel pattern shape is shown.

The wires 111a extend in both directions about the LED chip 120 on the rectangular cover substrate 110, but the extension direction of the wires is not limited thereto, and the position of the lead or the design of the LED module is not limited thereto. It may be variously changed according to conditions.

The plurality of lines may be formed on a separate electrode plate, for example, an ITO film, but as described above, the lines of the lines may be directly printed on a glass substrate to improve mounting convenience and luminous efficiency of the LED chip. Good for

Next, another embodiment 200 of an LED module for an LED array according to the present invention will be described with reference to FIGS. 9 to 11.

Figure 9 is a perspective view showing another embodiment of the LED module for the LED array according to the present invention, Figure 10 is a side view of the LED module shown in Figure 9, Figure 11 is a bottom view of the LED module shown in Figure 9 to be.

The LED module 200 according to the present embodiment includes a rectangular cover substrate 210 having a circuit pattern 211 and an LED chip mounted on a bottom surface of the cover substrate 210 to emit light downward. And a reflector 230 reflecting the light emitted from the LED chip 220 (the light emitted from the LED chip) toward the cover substrate 210. In the present exemplary embodiment, the reflector 230 has a rectangular box shape in which one side (upper side when referring to FIG. 9) is opened, and the reflector 230 is covered by the cover substrate 210, and the cover substrate ( 210 is fixed to the upper side of the reflector 230 to shield the internal space of the reflector 230.

The LED module having the above-described shape can be easily arranged regularly in a rectangular LED array, which makes it easy to manufacture and excellent model applicability.

The circuit pattern 211 is divided into a plurality of lines as described in the above-described embodiment, and more preferably, the other of the lines 211a at one end of the lines 211a to which the LED chip is connected. It may have a pattern structure, for example, a radial structure (shade pattern shape) in which the gap between wirings becomes larger toward the side end.

One end of the circuit pattern 211, that is, one end of the wirings 211a is connected to the LED chip 220, and the other end of the wirings (end) is electrically connected to the lead 240. The lead 240 is provided on an outer wall of the reflector 230, and more specifically, is formed in the vertical wall of the reflector 230 in a vertical direction as shown in FIGS. 9 and 10. The lead 240 may be printed on the outer wall of the reflector 230, or may be a separate conductor coupled to the outside of the reflector, for example, a wire or fin structure. The bottom contact 242 of the lead 240 is electrically connected to the main circuit board as described above.

A contact may be formed to connect the wires with the lead 240. As shown in FIG. 12, the other end of the wires, that is, the front end thereof are connected to each other by the contact circuit 211b, and the lead 240 Is connected to the contact circuit 211b.

The upper contact 241 of the lead may be formed to have a length and width corresponding to the contact circuit 211a as shown in FIG. 13, or may be formed shorter than the contact circuit 211a as shown in FIG. 14. Conversely, it may be formed longer.

As shown in FIG. 15, when the other end of the circuit pattern 211, that is, the other end of the wiring 211a is short-circuited with each other, the other end of the wiring 211a is the upper end of the lead. The contacts 241 may also be interconnected by, for example, long top contacts of the type shown in FIG. 13. The structure of the circuit pattern 211 and the lead 240 can be equally applied to the LED module presented in the above-described embodiment.

On the contrary, the internal structure of the reflector 230 or the structure of the cover substrate 210 may be equally applied to the technical spirit described in the above-described embodiment. In other words, the above-described light dispersion may be applied to the reflector 230, the inner space of the reflector 230 may be formed in a hemispherical shape, and the cover substrate 210 is a glass substrate directly on the surface of the glass substrate. The circuit pattern may be printed, and the plural lines of divided wirings may be formed on an electrode plate laminated on a glass substrate, for example, an ITO film, or directly on the glass substrate.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is obvious to them.

Therefore, the above-described embodiments should be regarded as illustrative rather than restrictive, and thus, the present invention is not limited to the above description and may be modified within the scope of the appended claims and their equivalents.

10: first light emitting unit 20: second light emitting unit
110, 210: cover substrate 111, 211: circuit pattern
120, 220: LED chip 130, 230: reflector
131: light dispersion 140, 240: lead

Claims (8)

And a first light emitting part and a second light emitting part arranged in reverse polarity with respect to the first light emitting part so as to alternately emit light with the first light emitting part by supply of AC power. As an led array;
The first light emitting unit and the second light emitting unit each include at least one LED module;
The LED module is;
A cover substrate having a circuit pattern formed on one surface thereof;
An LED chip mounted directly on one surface of the cover substrate on which the circuit pattern of the cover substrate is printed and electrically connected to the circuit pattern; And
It is provided on one side of the cover substrate, and comprises a reflector for reflecting the diffused light of the LED chip toward the cover substrate to diffuse the light emitted from the LED chip,
And a circuit pattern printed on one surface of the cover substrate is divided into a plurality of lines to form a fine wiring so that a dark band does not occur on the front surface of the cover substrate which is a light exit surface. The method of claim 1,
The cover substrate comprises a glass substrate capable of transmitting light; The circuit pattern is printed on the surface of the glass substrate; And an LED chip mounted on a surface of the glass substrate and electrically connected to the circuit pattern. The method of claim 2,
And the LED chip is surface mounted on a surface of the glass substrate so as to be connected to the circuit pattern. delete The method of claim 1,
Leads are printed on the outer surface of the reflector; And the leads are electrically connected to the circuit patterns. The method of claim 1,
The reflector;
A rectangular box-shaped reflective cap covering the LED chip and having a hollow formed therein, and
The LED array comprising a light dispersion provided in the reflection cap in order to distribute the light emitted from the LED chip into the reflection cap. The method of claim 1,
LED array is a phosphor (Phosphor) is applied to the surface of the cover substrate or the surface of the LED chip. The method of claim 1,
The first light emitting unit and the second light emitting unit, each LED array comprises a plurality of LED modules are arranged in a straight line connected in series.

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