M384960 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種發光二極體照明裝置，且特別是有關於 一種具有散熱結構之發光二極體照明裝置。 【先前技術】 照明設備的使用為現代人帶來了許多的便利性，成為現代人 生活中不可缺少的必需品之一。發光二極體（light emitting φ diode，LED)為通電時可發光的電子元件，是由半導體材料所製 成的發光元件，由於發光二極體具有反應速度快、發光壽命長、 體積小、耗電量低、污染低及可靠度高等優點，使得發光二極體 很容易被應用在汽車、通訊產業、電腦、交通號誌及液晶顯示器 等眾多領域，相當廣泛。然而，目前高功率發光二極體的輸入功 率僅有20%會轉換成光，其餘80%則轉變成為熱，若這些熱未 能及時排出至外界，會使其他元件受損。因此有賴有效的散熱技 術把熱排出，以避免降低其發光效率及壽命。 【新型内容】 本創作係有關於一種照明裝置，具有電極接腳用以插在現有 燈座的電極插孔上，可以取代傳統的照明燈具；此外，本創作之 照明裝置之散熱元件緊連於發光模組並至少包括基座及與其垂 直之擋牆，藉由鄰近散熱源以及增加散熱面積的方式提高散熱效 果。 根據本創作之一方面，提出一種照明裝置包括發光模組、導 光體以及散熱元件；發光模組包括電路板及設置於電路板上的發 3 的修ΐ日補充 光二極體’導光體係沿著電路板之法線方向設置於發光二極體前 方，散熱元件包括基座及與其垂直之擋牆，其中電路板係設置於 基座上，且擋牆係位於發光二極體之側面。 根據本創作之再—方面’提出—種照明裝置包括發光模組、 電極接腳以及散熱元件；發光模組包括電路板以及設置於其上的 發光-極體’電極接腳係電性連接於電路板，散熱元件包括基座 及與其垂直之擋牆，其中發光模組係設置於基座上，電極接腳係 穿過基座或擋牆其中—者並突出於散熱元件之表面。 為讓本創作之上述内容能更明顯易僅，下文特舉 例，並配合所附圖式，作詳細說明如下： 貫施 【實施方式】 以下係舉出歲組實施例配合圖示作詳細說明，其中第M384960 V. New Description: [New Technical Field] The present invention relates to a light-emitting diode lighting device, and more particularly to a light-emitting diode lighting device having a heat-dissipating structure. [Prior Art] The use of lighting equipment has brought a lot of convenience to modern people and has become one of the indispensable necessities in modern life. A light emitting diode (LED) is an electronic component that emits light when energized, and is a light-emitting component made of a semiconductor material. The light-emitting diode has a fast reaction speed, a long light-emitting life, and a small volume. The advantages of low power, low pollution and high reliability make the LEDs easy to be used in many fields such as automotive, communication industry, computers, traffic signs and liquid crystal displays. However, at present, only 20% of the input power of the high-power light-emitting diode is converted into light, and the remaining 80% is converted into heat. If the heat is not discharged to the outside in time, other components may be damaged. Therefore, effective heat dissipation technology is required to discharge heat to avoid reducing its luminous efficiency and life. [New content] This creation is about a lighting device with electrode pins for inserting into the electrode socket of the existing lamp holder, which can replace the traditional lighting fixture; in addition, the heat dissipating component of the lighting device of the present invention is closely connected to The illuminating module includes at least a pedestal and a retaining wall perpendicular thereto, and the heat dissipating effect is improved by being adjacent to the heat dissipating source and increasing the heat dissipating area. According to one aspect of the present invention, a lighting device includes a light emitting module, a light guiding body and a heat dissipating component. The lighting module includes a circuit board and a repairing day complementary light diode 'light guiding system of the hair 3 disposed on the circuit board The heat dissipating component includes a pedestal and a retaining wall perpendicular thereto, wherein the circuit board is disposed on the pedestal and the retaining wall is located at a side of the illuminating diode. According to the re-invention of the present invention, a lighting device includes a light emitting module, an electrode pin and a heat dissipating component; the light emitting module includes a circuit board and a light-polar body electrode pin disposed thereon is electrically connected to The circuit board, the heat dissipating component comprises a base and a retaining wall perpendicular thereto, wherein the light emitting module is disposed on the base, and the electrode pin passes through the base or the retaining wall and protrudes from the surface of the heat dissipating component. In order to make the above-mentioned contents of the present invention more obvious, the following is a detailed description, and the following is a detailed description of the following: [Embodiment] The following is a detailed description of the embodiment of the old group with the accompanying drawings. Which number
:實施例之照明裝置的電極接腳是穿過基座，第三實施例之昭I 裝置的電極接腳収f過擋t然本創作之絲護範圍並不限 於此些文字與圖示。 第一實施例 炸圖“ Γ日不依照本創作之第—實施例之—種照明裝置的海 =圖1 ㈣本創作之卜實施狀—種照明裝置的 至,同時參照第1、1日圖，本較佳實施例之照明裝置100 至乂包括發光模組H0、态 以及電極_16〇。套靖120、導光體140、散熱元件_ 模組110包括電路板112與發光二極體114，發 4係設置於電路板川上。導光體⑽係沿著電路板心 0碧修正 日補充 M384960 * 年月 * · 法線方向（如箭頭Α所示方向）設置於發光二極體114前方，則 發光二極體114所發出的光線則由導光體140的側面射入，透過 導光體140表面的微結構層及反射層反射，最後由導光體140的 前方射出，提供照明。導光體140可以是玻璃、聚甲基丙烯酸甲 酯（Polymethylmethacrylate, PMMA)、聚碳酸酯（Polycarbonate， PC)、聚對苯二甲酸乙酯（polyethylene terephthalate, PET)或其 他透光材質，形狀可以是片狀、棒狀、柱狀、板狀等各種形狀β 照明裝置100更包括套筒120,其一端係套接於發光二極體 • 114，其另一端係套接於導光體140，用以連接發光模組11〇及 導光體140，並固定兩者之間的相對關係。 照明裝置100可以選擇性地裝設濾光片130,用以改變照明 裝置發出的光色或波長；濾光片130設置於發光二極體114與導 光體140之間，如第1Α圖所示，套筒120内壁可以具有凸環 122 ’用以承載濾光片130，使其介於發光二極體114與導光體 140之間，例如發光二極體114可發出白光，濾光片130濾除其 他波長的光，只讓黃色波段（570〜590nm)的光通過，則照明 ® 裝置100係可發出黃光，以此應用於半導體製程常見的黃光室 裡。另外，濾光片130也可以將光源轉換成其他波段的光’例如 具有兩個主要峰值（main peak)波長，分別是紅光與藍光，作 為植物栽培的照明使用。 請同時參照第1A-1B圖，散熱元件150包括基摩152及與 其垂直之擋牆154，電路板112設置於基座152上，其擋牆154 係位於發光二極體114之側面；可以用散熱膏或散熱賸等接著劑 將電路板112固定至基座152上，並提高其熱傳導效率。再者， 在本實施例中，擋牆154係環繞基座152，與擋牆154形狀相配 5The electrode pins of the illuminating device of the embodiment are passed through the pedestal, and the electrode pins of the first embodiment of the third embodiment are not limited to the text and illustration. The first embodiment of the fried map "The next day is not in accordance with the present invention - the embodiment of the sea of the lighting device = Figure 1 (four) the implementation of the creation of the type of illumination device, while referring to the first and first day chart The illuminating device 100 to 乂 of the preferred embodiment includes a light emitting module H0, a state, and an electrode _16 〇. The tempering body 120, the light guiding body 140, and the heat dissipating component _ module 110 include the circuit board 112 and the light emitting diode 114. The hair 4 body is placed on the circuit board. The light guide body (10) is added along the circuit board core 0 碧 revision day M384960 * year month * · the normal direction (as indicated by the arrow Α) is placed in front of the light emitting diode 114 Then, the light emitted from the light-emitting diode 114 is incident on the side surface of the light guide body 140, is transmitted through the microstructure layer and the reflective layer on the surface of the light guide body 140, and is finally emitted from the front side of the light guide body 140 to provide illumination. The light guide body 140 may be glass, polymethylmethacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyethylene terephthalate (PET) or other light transmissive materials, and the shape may be Is a sheet, rod, column The illuminating device 100 of the various shapes, such as a plate, further includes a sleeve 120, one end of which is sleeved on the light emitting diode 114, and the other end of which is sleeved on the light guiding body 140 for connecting the light emitting module 11 and the guiding The light body 140 is fixed and the relative relationship between the two is fixed. The illumination device 100 can selectively be provided with a filter 130 for changing the color or wavelength of light emitted by the illumination device; the filter 130 is disposed on the LED Between the 114 and the light guide body 140, as shown in FIG. 1 , the inner wall of the sleeve 120 may have a convex ring 122 ′ for carrying the filter 130 between the light emitting diode 114 and the light guide body 140 . For example, the light emitting diode 114 can emit white light, and the filter 130 filters out light of other wavelengths, and only the light of the yellow wavelength band (570 to 590 nm) passes, and the illumination device 100 can emit yellow light for application. In the common yellow light chamber of the semiconductor process. In addition, the filter 130 can also convert the light source into light of other wavelengths, for example, having two main peak wavelengths, red light and blue light, respectively, as plant cultivation lighting. Please use also refer to Figure 1A-1B, heat dissipation element 150 includes a base 152 and a retaining wall 154 perpendicular thereto. The circuit board 112 is disposed on the base 152, and the retaining wall 154 is located on the side of the light emitting diode 114. The circuit board can be replaced by a thermal grease or a heat-dissipating adhesive. 112 is fixed to the base 152 and improves its heat transfer efficiency. Further, in the present embodiment, the retaining wall 154 surrounds the base 152 to match the shape of the retaining wall 154.
-起如位、鎖附、黏料方式與擋牆彳54固定在 :起第1Β圖所示，當散熱元件咖與發光模組110組裝後， 路板112會與基座152接觸，擋牆154會包圍發光二極體…， ^0此上由發光模組110發出的熱能可以报迅速的傳遞至散熱元件 散熱元件150的材質為熱傳導係數高的材料其外表且有至 少一個散熱結構⑸，本實_之散熱树的散熱結構⑸係數 條相互平打的凸條，如第1Α圖所示。藉由將散熱元件150緊連 於發先模組110增加熱傳導效率，還增加散熱面積提高散熱效 率，藉此改善高功率發光二極體存在已久的散熱問題。 然本技術領域具有通常知識者當可明瞭散熱結構 151並不 限定於此，只要是可以增加散熱面積的均等結構都可以應用於 此，例如散熱結構可以是凸出或凹陷於·元件的表面可以分 佈在基座、擋牆或兩者的外表面，排列方式不拘（可以是平行、 陣列、交錯㈣财式），胸狀不拘（可以是眺體、長條體、 正方體、螺旋形長條體、三角錐等形狀）。 請同時參照第1Α-1Β圖，照明裝置1〇〇更包括電極接腳 160,係電性連接於電路板112並伸出基座152之表面，突出於 基座152之外的電極接腳16〇可以插在現有的燈座電極插孔（未 繪示）上’取代傳統的日紐管、螢光燈具或其他照明商品。電極 接腳160可以相互絕緣的兩根金屬桿，各個電極接腳16〇的一端 固定在電路板112,桿身穿過基座152上的貫孔，另—端則突出 於基座152之表面；在散熱元件15〇與電極接腳16〇之間（例如 是基座152的貫孔内壁）可以設置絕熱部155，用以避免熱能透過 電極接腳16G傳遞至燈座，造成電線走火，絕熱部155的材料例 6 M384960- the position, the locking, the sticking mode and the retaining wall 彳 54 are fixed: as shown in the first figure, when the heat dissipating component is assembled with the light emitting module 110, the road board 112 will be in contact with the base 152, and the retaining wall 154 will surround the light emitting diodes..., ^0, the thermal energy emitted by the light emitting module 110 can be quickly transmitted to the heat dissipating component. The heat dissipating component 150 is made of a material having a high thermal conductivity and having at least one heat dissipating structure (5). The heat dissipation structure of the heat dissipation tree of the present invention (5) the convex strips of the coefficient strips are flush with each other, as shown in the first figure. By connecting the heat dissipating component 150 to the firing module 110 to increase the heat transfer efficiency, the heat dissipating area is also increased to improve the heat dissipating efficiency, thereby improving the long-standing heat dissipation problem of the high power light emitting diode. However, those skilled in the art can understand that the heat dissipation structure 151 is not limited thereto, and any uniform structure that can increase the heat dissipation area can be applied thereto. For example, the heat dissipation structure may be convex or concave on the surface of the component. Distributed on the outer surface of the base, retaining wall or both, the arrangement is not limited (can be parallel, array, staggered (four) financial), chest-shaped (can be a body, long strip, square, spiral strip) , triangle cone and other shapes). Referring to FIG. 1 to FIG. 1 , the illumination device 1 further includes an electrode pin 160 electrically connected to the circuit board 112 and extending from the surface of the base 152 , and the electrode pin 16 protruding from the base 152 . 〇 can be inserted into the existing lamp holder electrode socket (not shown) to replace the traditional Japanese neon tube, fluorescent lamps or other lighting products. The electrode pins 160 can be insulated from each other by two metal rods. One end of each of the electrode pins 16 is fixed to the circuit board 112. The shaft passes through the through hole of the base 152, and the other end protrudes from the surface of the base 152. Between the heat dissipating component 15 〇 and the electrode pin 16 ( (for example, the inner wall of the through hole of the pedestal 152 ), a heat insulating portion 155 may be disposed to prevent heat from being transmitted to the lamp holder through the electrode pin 16G, thereby causing the wire to escape, and the heat is insulated. Part 155 material example 6 M384960
如是雲母、墊木等熱傳導係數低的材料，較佳的是可以絕熱又可 絕緣的材料。本技術領域具有通常知識者當可明瞭，電極接腳160 與電路板112的連接方式並不限定於此，例如是利用導線連接電 極接腳160與電路板112,並在基座152表面與電極接腳160相 接處增設絕熱部155即可避免電線走火的問題。 照明裝置100在導光體140單側設置發光模組110與散熱 元件150，然而本實施例之照明裝置可以依照現有的燈座或其對 應的燈具做出各種不同的設計。舉例來說，第2圖繪示依照本新 ® 型之第一實施例之變化例之一種照明裝置的立體圖。照明裝置 101分別在導光體140兩側設置兩組發光模組110及散熱元件 150，可以應用在日光燈座、檯燈座等具有雙邊電極插座的燈具 上。此外，照明裝置101也可以僅在導光體140的一側設置一組 發光模組110及散熱元件150，應用於具單邊插座的檯燈座（未 圖式）。 第二實施例 本實施例之照明裝置與上述實施例不同之處在於散熱元件 的位置外型及連接元件，其餘元件皆相同，於此不再贅述。 第3A圖繪示依照本創作之第二實施例之一種照明裝置的爆 炸圖，第3B圖繪示依照本創作之第二實施例之一種照明裝置的 剖面圖。請同時參照第3A-3B圖，本較佳實施例之照明裝置200, 至少包括發光模組110、套筒120、導光體140、散熱元件250 以及電極接腳160，散熱元件250包括基座252及與其垂直之擋 牆254，電路板112設置於基座252上，可以用散熱膏或散熱膠 等接著劑108將電路板112固定至基座252上，並提高其熱傳導 7If it is a material having a low heat transfer coefficient such as mica or shovel, it is preferably a material which can be insulated and insulated. It will be apparent to those skilled in the art that the manner in which the electrode pins 160 are connected to the circuit board 112 is not limited thereto, for example, by connecting the electrode pins 160 to the circuit board 112 by wires, and on the surface and electrodes of the susceptor 152. Adding a heat insulating portion 155 at the junction of the pins 160 can avoid the problem of wire fire. The illumination device 100 is provided with the light-emitting module 110 and the heat-dissipating component 150 on one side of the light guide body 140. However, the illumination device of the embodiment can be designed in various ways according to the existing lamp holder or its corresponding lamp. For example, FIG. 2 is a perspective view of a lighting device according to a variation of the first embodiment of the present new type. The illuminating device 101 is provided with two sets of the light emitting module 110 and the heat dissipating component 150 on both sides of the light guiding body 140, and can be applied to a luminaire having a bilateral electrode socket such as a fluorescent lamp holder or a lamp socket. In addition, the illumination device 101 may be provided with only one set of the light-emitting module 110 and the heat-dissipating element 150 on one side of the light guide body 140, and applied to a lamp socket (not shown) having a single-sided socket. The second embodiment differs from the above embodiment in the position of the heat dissipating component and the connecting component, and the remaining components are the same, and will not be described again. 3A is a view showing an explosion of a lighting device according to a second embodiment of the present invention, and FIG. 3B is a cross-sectional view showing a lighting device according to a second embodiment of the present invention. The illuminating device 200 of the preferred embodiment includes at least a light emitting module 110, a sleeve 120, a light guiding body 140, a heat dissipating component 250, and an electrode pin 160. The heat dissipating component 250 includes a pedestal. 252 and its vertical retaining wall 254, the circuit board 112 is disposed on the base 252, and the circuit board 112 can be fixed to the base 252 by using an adhesive 108 such as a thermal grease or a thermal adhesive, and the heat conduction thereof is improved.
效率；擋牆254沿電路板112之法線方向（如箭頭A所示方向） 延伸至導光體140之側面，絕緣部262包覆在散熱元件250、套 筒120以及發光模組110的外圍，將此些元件固定在一起，亦可 以在任何兩元件之間用限位、鎖附、黏貼等方式加強固定，電極 接腳160穿過基座252的貫孔256以及絕緣部262的貫孔264 而伸出散熱元件250的表面。 如第3B圖所示，當散熱元件250與發光模組110組裝後， 電路板112會與基座252接觸，擋牆254位於發光二極體114 的側面，並延伸到導光體140側面，散熱元件250緊鄰熱源可以 迅速的將熱能傳遞出去。此外，由於導光體140表面本來就會有 微結構層及反射層等不透光材質，只要散熱元件250的擋牆254 是對應不透光層，就不會影響照明裝置的照度，又可以增加散熱 面積。 散熱元件的外型與其細部的散熱結構有很多變化。散熱元件 250的外表具有至少一個散熱結構251，本實施例之散熱元件的 散熱結構251係數條相互平行的凸條，如第3A圖所示。然本技 術領域具有通常知識者當可明瞭散熱結構並不限定於此，只要是 可以增加散熱面積的均等結構都可以應用於此；舉例來說，第4A 圖繪示依照本創作之第二實施例之散熱元件之變化例一的立體 圖，散熱元件250a的外表同樣具有數條平行的凸條251a，儘管 排列方向不同卻可達到相同的目的；第4B圖繪示依照本創作之 第二實施例之散熱元件之變化例二的立體圖，散熱元件250b的 基座252b形狀為方形，擋牆254b則為平板狀，儘管外型不同， 但以類似的組裝方式與配置關係一樣可以達到散熱的目的。 照明裝置200在導光體140單側設置發光模組110、散熱元 8 M384960 件 250與電極接腳160，然而本實施例之照明裝置Efficiency; the retaining wall 254 extends along the normal direction of the circuit board 112 (in the direction indicated by the arrow A) to the side of the light guide body 140, and the insulating portion 262 is wrapped around the heat dissipating component 250, the sleeve 120, and the periphery of the light emitting module 110. The components may be fixed together, and may be fixed and fixed between any two components by means of limiting, locking, pasting, etc., and the electrode pins 160 pass through the through holes 256 of the base 252 and the through holes of the insulating portion 262. 264 extends beyond the surface of the heat dissipating component 250. As shown in FIG. 3B, after the heat dissipating component 250 is assembled with the light emitting module 110, the circuit board 112 is in contact with the base 252. The retaining wall 254 is located on the side of the light emitting diode 114 and extends to the side of the light guiding body 140. The heat dissipating component 250 can quickly transfer thermal energy away from the heat source. In addition, since the surface of the light guide body 140 originally has an opaque material such as a microstructure layer and a reflective layer, as long as the retaining wall 254 of the heat dissipating component 250 corresponds to the opaque layer, the illuminance of the illuminating device is not affected, and Increase the heat dissipation area. There are many variations in the shape of the heat dissipating component and the heat dissipation structure of its detail. The outer surface of the heat dissipating component 250 has at least one heat dissipating structure 251. The heat dissipating structure 251 of the heat dissipating component of the present embodiment has ribs parallel to each other, as shown in FIG. 3A. However, those skilled in the art can understand that the heat dissipation structure is not limited thereto, and any uniform structure that can increase the heat dissipation area can be applied thereto; for example, FIG. 4A shows the second implementation according to the present creation. For example, in the perspective view of the first embodiment of the heat dissipating component, the outer surface of the heat dissipating component 250a also has a plurality of parallel ribs 251a, which can achieve the same purpose despite different alignment directions. FIG. 4B illustrates a second embodiment according to the present invention. In the perspective view of the second embodiment of the heat dissipating component, the base 252b of the heat dissipating component 250b has a square shape, and the retaining wall 254b has a flat shape. Although the outer shape is different, the similar assembling manner and the arrangement relationship can achieve the purpose of dissipating heat. The illuminating device 200 is provided with a light emitting module 110, a heat dissipating element 8 M384960 member 250 and an electrode pin 160 on one side of the light guiding body 140. However, the lighting device of the embodiment
可以依照現有 的燈座或其對應的燈具做出各種不同的設計。舉例來說，照明裝 置可以在導光體140雙侧都設置電極接腳160，可以應用在曰光 燈座、檯燈座等具有雙邊電極插座的燈具上；第5圖繪示依照本 創作之第二實施例之變化例一之一種照明裝置的立體圖。照明裝 置201分別在導光體140兩側各設置一組發光模組及電極接腳 160，散熱元件250如第3B圖設置於發光模組與電極接腳160 附近’兩組散熱元件250的兩片擋牆254是互相分離的。請參照 第6圖’其繪示依照本創作之第二實施例之變化例二之一種照明 裝置的立體圖。照明裝置202分別在導光體140兩側各設置一組 發光模組及電極接腳160，雙邊的散熱元件是連接在一起的，由 兩個基座252c以及一個擋牆254c構成U形的散熱元件250c， 散熱元件250c的延伸範圍增加，其散熱效果更好。 第三實施例 本實施例之照明裝置與上述實施例不同之處在於散熱元 件、發光模組其配置關係，雖然發光模組由多個發光二極體構 成，但散熱元件仍然是緊連電路板並包圍發光二極體與電極接腳 的側面，本實屬本創作精神下的另一種實施方式。 第7圖繪示依照本創作之第三實施例之一種照明裝置的剖 面圖。照明裝置300包括發光模組310、散熱元件350以及電極 接腳360，發光模組310包括電路板312以及多個發光二極體 314，散熱元件350係由基座352及與其垂直之兩擋牆354a和 354b構成U字形結構，電路板312設置於基座352上，電極接 腳360連接在電路板312的側面，並穿過擋牆354a或354b的 9A variety of different designs can be made in accordance with existing lamp holders or their corresponding lamps. For example, the illumination device can be provided with electrode pins 160 on both sides of the light guide body 140, and can be applied to a lamp having a bilateral electrode socket such as a lamp holder or a lamp holder; FIG. 5 is a diagram showing the A perspective view of a lighting device according to a first variation of the second embodiment. The illumination device 201 is respectively provided with a plurality of light-emitting modules and electrode pins 160 on both sides of the light guide body 140. The heat-dissipating component 250 is disposed in the vicinity of the light-emitting module and the electrode pin 160 as shown in FIG. 3B. The sheet retaining walls 254 are separated from each other. Referring to Fig. 6, a perspective view of a lighting device according to a second variation of the second embodiment of the present invention is shown. The illumination device 202 is respectively provided with a set of light-emitting modules and electrode pins 160 on both sides of the light guide body 140. The bilateral heat-dissipating components are connected together, and the two bases 252c and one retaining wall 254c form a U-shaped heat dissipation. The extension of the component 250c and the heat dissipating component 250c is increased, and the heat dissipation effect is better. The illuminating device of the present embodiment differs from the above embodiment in the arrangement relationship between the heat dissipating component and the illuminating module. Although the illuminating module is composed of a plurality of illuminating diodes, the heat dissipating component is still a tight circuit board. And surrounding the side of the light-emitting diode and the electrode pin, this is another embodiment under the spirit of the present creation. Figure 7 is a cross-sectional view showing a lighting device in accordance with a third embodiment of the present invention. The illumination device 300 includes a light-emitting module 310, a heat-dissipating component 350, and an electrode pin 360. The light-emitting module 310 includes a circuit board 312 and a plurality of light-emitting diodes 314. The heat-dissipating component 350 is composed of a base 352 and two retaining walls perpendicular thereto. 354a and 354b form a U-shaped structure, the circuit board 312 is disposed on the base 352, and the electrode pins 360 are connected to the side of the circuit board 312 and pass through the retaining wall 354a or 354b.
貫孔（未顯示）而伸出散熱元件350的表面。 當散熱元件350與發光模組310組裝後，電路板312會與 基座352接觸，擋牆354a和354b位於多個發光二極體314的 外側，散熱元件350緊鄰熱源可以迅速的將熱能傳遞出去。 本實施例之散熱元件的散熱結構351係數條凸起物，然本技 術領域具有通常知識者當可明瞭散熱結構並不限定於此，只要是 可以增加散熱面積的均等結構都可以應用於此。 本創作上述實施例所揭露之照明裝置，具有多項優點，以下 僅列舉部分優點說明如下： 1. 以發光二極體作為光源的照明裝置具有電極接腳，可以 插在現有燈座的電極插孔上，直接取代傳統的照明燈具； 2. 照明裝置之散熱元件緊連於發光模組並至少包括基座及 與其垂直之擋牆，藉由鄰近熱源以及增加散熱面積的方式提高散 熱效果。 綜上所述，雖然本創作已以一較佳實施例揭露如上，然其並 非用以限定本創作。本創作所屬技術領域中具有通常知識者，在 不脫離本創作之精神和範圍内，當可作各種之更動與潤飾。因 此，本創作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1A圖繪示依照本創作之第一實施例之一種照明裝置的爆 炸圖。 第1B圖繪示依照本創作之第一實施例之一種照明裝置的剖 面圖。 10 第2圖 护番 s 丁依照本創作之第一實施例之變化例之一種照明 衣1的立體圖。 補无 炸圖 第3A圖繪不依照本創作之第二實施例之一種照明裝置的爆 面圖 第3B圖繪示依照本創作 之第二實施例之一種照明裝置的剖 第4A圖繪示依照本創作 的立體圖。 第4B圖繪示依照本創作 之第二實施例之散熱元件之變化例 之第二實施例之散熱元件之變化例 第5圖繪示依照本創 明驻苗从 〗作之第二實施例之變化例一 明裝置的立體圖。 第6圖繪示依照本創 4邛之第二實施例之變化例二之一種照 啊裝置的立體圖。 第7圖繪示依照本創 面圖。 <第三實施例之一種照明裝置的剖 之一種照 【主要元件符號說明】 100、 101 :照明裝 110 : 發光模組 114 ： 發光二極體 122 ： 凸環 140 ： 導光體 151 ： 散熱結構 154 ： 擋牆 108 ： 接著劑 112 ： 電路板 120 ： 套筒 130 ： 濾光片 150 ： 散熱元件 152 ： 基座 155 ： 絕熱部A through hole (not shown) extends beyond the surface of the heat dissipating member 350. After the heat dissipating component 350 is assembled with the light emitting module 310, the circuit board 312 is in contact with the pedestal 352. The retaining walls 354a and 354b are located outside the plurality of light emitting diodes 314, and the heat dissipating component 350 can quickly transfer heat energy away from the heat source. . The heat dissipating structure 351 of the heat dissipating component of the present embodiment has a coefficient of a bump. However, those skilled in the art can understand that the heat dissipating structure is not limited thereto, and any uniform structure that can increase the heat dissipating area can be applied thereto. The illuminating device disclosed in the above embodiments has a plurality of advantages. The following only some of the advantages are described as follows: 1. The illuminating device using the illuminating diode as a light source has an electrode pin and can be inserted into the electrode socket of the existing lamp holder. Directly replacing the traditional lighting fixtures; 2. The heat dissipating component of the lighting device is closely connected to the lighting module and includes at least the base and the retaining wall perpendicular thereto, and the heat dissipating effect is improved by the proximity of the heat source and the increase of the heat dissipating area. In summary, although the present invention has been disclosed above in a preferred embodiment, it is not intended to limit the present invention. Those of ordinary skill in the art to which the present invention pertains may make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a view showing an explosion of a lighting apparatus according to a first embodiment of the present invention. Fig. 1B is a cross-sectional view showing a lighting device in accordance with a first embodiment of the present invention. 10 Fig. 2 is a perspective view of a lighting garment 1 according to a variation of the first embodiment of the present invention. 3A is a cross-sectional view of a lighting device according to a second embodiment of the present invention. FIG. 3B is a cross-sectional view of a lighting device according to a second embodiment of the present invention. A perspective view of the creation. 4B is a diagram showing a variation of the heat dissipating component of the second embodiment of the heat dissipating component according to the second embodiment of the present invention. FIG. 5 is a view showing the second embodiment of the invention according to the present invention. A variation of the device is a perspective view of the device. Fig. 6 is a perspective view showing a device according to a second modification of the second embodiment of the present invention. Figure 7 is a diagram showing the present invention in accordance with the present invention. <Photograph of a illuminating device of a third embodiment [Description of main components] 100, 101: illuminating device 110: illuminating module 114: illuminating diode 122: convex ring 140: light guiding body 151: heat dissipation Structure 154: Retaining wall 108: Adhesive 112: Circuit board 120: Sleeve 130: Filter 150: Heat dissipating component 152: Base 155: Insulation
160 :電極接腳 200、201、202 ·•照明裝置 250、250a、250b、250c : 散熱元件 251 :散熱結構 251a :凸條 252、252b、252c :基座 254、254b、254c :擋牆 256 :貫孔 262 ： 絕緣部 264 :貫孔 300 ： 照明裝置 310 :發光模組 312 ： 電路板 314 :發光二極體 350 ： 散熱元件 351 :散熱結構 352 ： 基座 354a、354b :檔牆 360 ： 電極接腳 A :箭頭 12160: electrode pins 200, 201, 202 · illuminating devices 250, 250a, 250b, 250c: heat dissipating member 251: heat dissipating structure 251a: ribs 252, 252b, 252c: pedestals 254, 254b, 254c: retaining wall 256: Through hole 262: Insulation portion 264: Through hole 300: Illumination device 310: Light-emitting module 312: Circuit board 314: Light-emitting diode 350: Heat-dissipating element 351: Heat-dissipating structure 352: Base 354a, 354b: Wall 360: Electrode Pin A: Arrow 12