WO2014006901A1 - Lamp and lighting apparatus - Google Patents

Lamp and lighting apparatus Download PDF

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Publication number
WO2014006901A1
WO2014006901A1 PCT/JP2013/004142 JP2013004142W WO2014006901A1 WO 2014006901 A1 WO2014006901 A1 WO 2014006901A1 JP 2013004142 W JP2013004142 W JP 2013004142W WO 2014006901 A1 WO2014006901 A1 WO 2014006901A1
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WO
WIPO (PCT)
Prior art keywords
lamp
base
light
light emitting
led
Prior art date
Application number
PCT/JP2013/004142
Other languages
French (fr)
Japanese (ja)
Inventor
高橋 健治
堀内 誠
隆在 植本
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201390000084.8U priority Critical patent/CN203743910U/en
Priority to JP2013548663A priority patent/JP5887519B2/en
Publication of WO2014006901A1 publication Critical patent/WO2014006901A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes

Definitions

  • the present invention relates to a lamp and a lighting device, for example, a straight tube type LED lamp using a light emitting diode (LED) and a lighting device including the same.
  • a lighting device for example, a straight tube type LED lamp using a light emitting diode (LED) and a lighting device including the same.
  • LED light emitting diode
  • LED is expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps known from the viewpoint of high efficiency and long life, and research and development of lamps using LEDs (LED lamps) is promoted ing.
  • Patent Document 1 discloses a conventional straight tube LED lamp.
  • an LED module including a mounting substrate and a plurality of LEDs mounted on the mounting substrate is used as a light source. And in such an LED module, the light emission part (area
  • an object of this invention is to provide the lamp
  • a lamp according to one aspect of the present invention is a long lamp, and a light emitting module having a light emitting element and a substrate provided with the light emitting element, and the light emitting module
  • An elongated base provided with a recess is formed on the surface, an elongated translucent cover configured to cover the light emitting module, and the inside of the recess or above the recess
  • it is characterized in that it comprises: a diffusion member provided between the light emitting module and the light transmitting cover, for diffusing light emitted from the light emitting element.
  • a step is formed on the side wall of the recess of the base, and the diffusion member has a plate shape, and the step is formed on the step so as to cover at least a part of the opening of the recess of the base. It may be placed on the
  • the diffusion member may be a resin, and may be provided in the recess so as to be in contact with the light emitting element.
  • the diffusion member may have a high diffusion rate above the portion of the substrate on which the light emitting element is provided and a low diffusion rate above the portion of the substrate on which the light emitting element is not provided.
  • the side surface of the recess of the base may reflect light emitted from the light emitting element toward the opening of the recess.
  • the base may be made of metal, and the diffusion member may be in contact with the base.
  • the light transmitting cover is a cutout cylindrical member having a main opening in which a part of a long cylinder is cut out in a longitudinal direction, and the base is configured to close the main opening. A light cover may be held.
  • a groove may be formed in the base for slidably holding the translucent cover.
  • the light transmitting cover may be made of glass or resin and diffuse light emitted from the light emitting element.
  • a lighting device includes the above lamp.
  • FIG. 1 is a perspective view of a lamp according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the lamp according to the first embodiment of the present invention.
  • FIG. 3A is an enlarged perspective view of a part of the lamp according to the first embodiment of the present invention.
  • FIG. 3B is a perspective view showing the configuration of a modified example of the translucent cover of the lamp according to the first embodiment of the present invention.
  • FIG. 4A is a plan view of the LED module according to the first embodiment of the present invention.
  • FIG. 4B is a cross-sectional view of the LED module according to the first embodiment of the present invention.
  • FIG. 5 is an enlarged perspective view of a part of Modification 1 of the lamp according to the first embodiment of the present invention.
  • FIG. 1 is a perspective view of a lamp according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the lamp according to the first embodiment of the present invention.
  • FIG. 3A is an
  • FIG. 6 is an enlarged perspective view of a part of Modification 2 of the lamp according to the first embodiment of the present invention.
  • FIG. 7 is an enlarged perspective view of a part of Modification 3 of the lamp according to the first embodiment of the present invention.
  • FIG. 8 is a perspective view of Modification 4 of the lamp according to the first embodiment of the present invention.
  • FIG. 9 is an exploded perspective view of Modification 4 of the lamp according to the first embodiment of the present invention.
  • FIG. 10 is an enlarged perspective view of a part of Modification 4 of the lamp according to the first embodiment of the present invention.
  • FIG. 11 is a perspective view of modification 5 of the lamp according to the first embodiment of the present invention.
  • FIG. 12 is an exploded perspective view of Modification 5 of the lamp according to the first embodiment of the present invention.
  • FIG. 12 is an exploded perspective view of Modification 5 of the lamp according to the first embodiment of the present invention.
  • FIG. 13 is an enlarged perspective view of a part of Modification 5 of the lamp according to the first embodiment of the present invention.
  • FIG. 14 is an enlarged perspective view of a portion of a modification 6 of the lamp according to the first embodiment of the present invention.
  • FIG. 15 is a perspective view enlarging a part of modified example 7 of the lamp according to the first embodiment of the present invention.
  • FIG. 16 is a perspective view of a lighting device according to a second embodiment of the present invention.
  • FIGS. 1 to 3A First Embodiment First, a lamp 10 according to a first embodiment of the present invention will be described using FIGS. 1 to 3A.
  • FIG. 1 is a perspective view showing the configuration of the lamp 10 according to the present embodiment with the translucent cover 20 up.
  • 2 is an exploded perspective view of the lamp 10 with the base 60 removed
  • FIG. 3A is a portion of the lamp 10 with the base 60 removed (the end of the lamp 10 in the tube axial direction Part) is an enlarged perspective view.
  • the lamp 10 is, as shown in FIGS. 1 to 3A, a long straight tube LED lamp used as an alternative illumination of a conventional straight tube fluorescent lamp (straight tube fluorescent lamp) , A base 30, a diffusion member 40, an LED module 50, a base 60, and a lighting circuit (not shown).
  • the base 60, the translucent cover 20, and the base 30 constitute a long lamp casing (outer envelope).
  • the translucent cover 20 is a long cover member that constitutes the outer surface of the lamp housing, and protects the members provided on the base 30, that is, the LED module 50, the lighting circuit, and the like.
  • the translucent cover 20 is formed of a cutout cylindrical member having a main opening 20a formed by cutting out a part of an elongated cylinder along the longitudinal direction (tube axis direction), for example, a substantially semi-cylindrical member Be done.
  • the translucent cover 20 is made of a material that transmits the light emitted by the LED module 50 to the outside of the lamp.
  • the translucent cover 20 is made of, for example, a transparent resin material or glass made of acrylic or the like, and can be formed by resin molding a desired transparent resin material.
  • the translucent cover 20 is, for example, a straight pipe (glass pipe) made of soda lime glass of 70 to 72 [%] of silica (SiO 2 ), or a straight pipe (plastic) made of a resin material such as polycarbonate Tube) can be used.
  • the translucent cover 20 includes a light diffusion portion having a light diffusion function for diffusing the light from the LED module 50. Thereby, the light emitted from the LED module 50 can be diffused when passing through the translucent cover 20.
  • the light diffusion portion include a light diffusion sheet or a light diffusion film formed on at least one of the inner surface and the outer surface of the translucent cover 20.
  • a milky white light diffusing film formed by adhering a resin or a white pigment containing a light diffusing material (fine particles) such as silica or calcium carbonate to at least one of the inner surface and the outer surface of the light transmitting cover 20 There is.
  • a lens structure provided at least either inside or outside of the translucent cover 20, or a recess or a convex formed at least one of the inner surface and the outer surface of the translucent cover 20
  • a light diffusing function light
  • the translucent cover 20 can be provided with a light diffusing function (light diffusing portion) by molding the translucent cover 20 itself using a resin material or the like in which a light diffusing material is dispersed.
  • the translucent cover 20 whose cross-sectional shape is a polygon.
  • the cross-sectional shape of the translucent cover 20A By making the cross-sectional shape of the translucent cover 20A into a polygonal shape, it is possible to further provide a diffusion function. Thereby, wide light distribution can be realized.
  • the base 30 is a long rectangular plate-like support base for holding (supporting) the LED module 50 and is configured to cover the main opening 20 a of the light-transmissive cover 20 so as to cover the light-transmissive cover 20.
  • the base 30 has substantially the same length as the entire length of the light transmitting cover 20 in the longitudinal direction (tube axis direction).
  • the translucent cover 20 may be fixed to the base 30 by an adhesive or the like.
  • one surface is a mounting surface for mounting the LED module 50, and is covered with the light transmitting cover 20.
  • the other surface (rear surface) of the base 30 is exposed to the outside of the lamp, and constitutes the outer surface of the lamp housing.
  • a recess 31 extending in the longitudinal direction of the base 30 is formed on the surface of the base 30, and the opening of the recess 31 is covered by the diffusion member 40.
  • the LED module 50 is provided in the recess 31 covered by the diffusion member 40, specifically, on the flat bottom surface of the recess 31.
  • a step portion 33 extending in the longitudinal direction of the base 30 is formed on side walls on both sides of the recess 31 sandwiching the LED module 50, and the diffusion member 40 is provided on the step portion 33.
  • the translucent cover 20 is slidably attached to the base 30 by inserting the circumferential end 21 into the groove 32. Therefore, the translucent cover 20 covers not only the surface of the base 30 but also a part of the end surface of the base 30 in the short direction.
  • the groove 32 of the base 30 may be configured to fit with the circumferential end 21 of the translucent cover 20.
  • the base 30 also functions as a heat sink (heat sink) for radiating the heat generated in the LED module 50. Therefore, the base 30 is preferably made of a high thermal conductivity material such as metal, and a long aluminum substrate made of aluminum can be used as the base 30.
  • the base 30 may be made of resin.
  • the inner surface of the recess 31 of the base 30 may be coated with a reflective film material.
  • the reflecting surface can be formed by coating the entire surface of the base 30 with a white resin and a metal film. Other surface finishes can also form the reflective surface.
  • a reflection surface on the inner surface of the recess 31 of the base 30, the light emitted from the LED module 50 can be reflected to the translucent cover 20 side by the reflection surface, and the light of the lamp 10 is taken out. Efficiency can be improved.
  • the recess 31 is formed continuously on the surface of the base 30 in the longitudinal direction of the base 30, it may be provided intermittently.
  • the recess 31 may not be provided in a portion where the diffusion member 40 is not provided.
  • the diffusion member 40 is a long rectangular diffusion plate for diffusing light from the LED module 50, and is provided in the recess 31 of the base 30 so as to cover the upper side of the LED module 50.
  • a translucent cover 20 covers the upper side of the surface (front surface) opposite to the surface (back surface) of the diffusion member 40 facing the LED module 50.
  • the diffusion member 40 is configured to have uniform values along the longitudinal direction and the short direction of the base 30 with respect to the diffusion coefficient of the LED module 50 with respect to light.
  • the diffusion member 40 is formed of a translucent material that transmits the light from the LED module 50 to the translucent cover 20.
  • the diffusion member 40 may be configured to include a light diffusion portion having a light diffusion function for diffusing light from the LED module 50 using, for example, a transparent resin material or glass made of acrylic or the like as a base material. it can.
  • the light diffusion portion include a light diffusion sheet or a light diffusion film formed on at least one of the front surface and the back surface of the base material (the diffusion member 40).
  • a milky white light diffusion film formed by attaching a resin containing a light diffusion material (fine particles) such as silica or calcium carbonate or a white pigment to at least one of the front surface and the back surface of the substrate.
  • the substrate can also have a light diffusion function (light diffusion portion).
  • the base material can also have a light diffusing function (light diffusing portion).
  • the diffusion member 40 can also be made of the same material as the translucent cover 20.
  • the plurality of LED modules 50 are light sources of the lamp 10, and are mounted side by side in the longitudinal direction of the base 30 in the recess 31 of the base 30 so as to be overlapped and covered by the translucent cover 20 and the diffusion member 40. It is done.
  • Each of the plurality of LED modules 50 is fixed to the base 30 by an adhesive, a screw or the like. The detailed configuration of the LED module 50 will be described later.
  • the pair of caps 60 have a substantially bottomed cylindrical shape, and form the outer surface of the lamp housing, and both ends of the integrated translucent cover 20 and the base 30 (both ends in the tube axial direction Section). And a pair of nozzle
  • die 60 is covering the opening of the both ends (both-ends of the tube axial direction) of the cylindrical member formed by integrating the translucent cover 20 and the base 30.
  • the base 60 on one side of the cylindrical member is provided with a pair of power reception pins 61, and the base 60 on the other side is provided with an earth pin 62.
  • the pair of power receiving pins 61 is a conductive pin made of a rod-like metal material.
  • the pair of power receiving pins 61 is configured to be attached to the lighting fixture, and receives power for lighting the LED 53 of the LED module 50 from a power supply device (lighting fixture) outside the lamp.
  • DC power is supplied to the lighting circuit in the lamp through the pair of power receiving pins 61.
  • the lighting circuit rectifies the input DC power and outputs a desired voltage for energizing the LED 53.
  • the earth pin 62 is a conductive pin made of a rod-like metal material. Similarly to the power receiving pin 61, the earth pin 62 is configured to be attached to the lighting apparatus. Therefore, if the connection portion (connection portion in the socket) with the ground pin 62 in the lighting apparatus is a ground terminal, the grounding pin 62 is at the ground potential when the lamp 10 is mounted on the lighting apparatus.
  • the lamp and the ground pin 62 are not connected to ground, and the ground pin 62 is a mounting for attaching the lamp 10 to the lamp. Act as a pin. Therefore, the ground pin 62 does not have to be made of metal. Further, the number of earth pins 62 is not limited to one, and may be two.
  • the lamp 10 adopts the one-side power feeding system, and the power for lighting the LED module 50 is fed from the pair of power receiving pins 61 provided only at one end of the lamp 10 Is configured.
  • FIG. 4A is a plan view (top view) showing the configuration of the LED module 50
  • FIG. 4B is a cross-sectional view of the LED module 50 taken along the line A-A 'of FIG. 4A.
  • the LED module 50 is a COB (Chip On Board) type light emitting module as shown in FIGS. 4A and 4B, and is a linear light source that emits light in a linear manner.
  • the LED module 50 includes a mounting substrate 52, a plurality of LEDs 53 arranged on the mounting substrate 52, a sealing member 51 for sealing the LEDs 53, a wire 54, an electrostatic protection element 55, and an electrode terminal 56. And a wire 57 such as a gold wire.
  • the mounting substrate 52 is an LED mounting substrate for mounting the LED 53, and is, for example, a long rectangular substrate.
  • the mounting substrate 52 is made of, for example, a glass composite substrate (CEM-3 or the like), a glass epoxy substrate (FR-4 or the like), a substrate (FR-1 or the like) made of paper phenol or paper epoxy, or polyimide or the like.
  • Flexible substrate can be used.
  • As a metal base substrate, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, etc. can be used, for example.
  • Each of the plurality of LEDs 53 is an example of a light emitting element, and is directly mounted on the mounting substrate 52.
  • the plurality of LEDs 53 are arranged in a line (in a straight line) in a line along the longitudinal direction of the mounting substrate 52.
  • Each LED 53 is a bare chip that emits monochromatic visible light, and is die-bonded onto the mounting substrate 52 by a die attach material (die bonding material).
  • a blue LED chip that emits blue light can be used.
  • the blue LED chip for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
  • a p-side electrode and an n-side electrode for supplying current are formed on the top surface of the chip, and the p-side electrode and the n-side electrode are wire-bonded to the wiring 54 by the wire 57. .
  • the sealing member 51 is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and wavelength-converts the light from the LEDs 53, and collectively seals all the LEDs 53 on the mounting substrate 52.
  • the sealing member 51 has a substantially semicircular dome shape with an upward convex cross section, and is formed linearly along the arrangement direction of the LEDs 53 so as to cover all the LEDs 53 on the mounting substrate 52.
  • the linear (striped) sealing member 51 is formed closer to one long side than a straight line passing the center of the mounting substrate 52 in the short direction. Furthermore, the sealing member 51 is formed without interruption from the end face of one short side of the mounting substrate 52 to the end face of the opposite short side.
  • the sealing member 51 for example, when the LED 53 is a blue LED, it is possible to use a phosphor-containing resin in which yellow phosphor particles of YAG (yttrium aluminum garnet) type are dispersed in a silicone resin. In this case, since the yellow phosphor particles are excited by the blue light of the blue LED to emit yellow light, white light is emitted from the sealing member 51 by the excited yellow light and the blue light of the blue LED. .
  • the sealing member 51 may also contain a light diffusing material such as silica.
  • the wiring 54 is a metal wiring made of tungsten (W) or copper (Cu) or the like, and is pattern-formed in a predetermined shape in order to electrically connect the plurality of LEDs 53 to each other. Further, the wiring 54 is formed so as to electrically connect the plurality of LEDs 53 and the electrostatic protection element 55 and to be electrically connected also to the electrode terminal 56.
  • the electrostatic protection element 55 is, for example, a zener diode, and prevents the LED 53 having a low reverse withstand voltage from being destroyed by static electricity of the reverse polarity generated on the mounting substrate 52.
  • the electrode terminal 56 is a power supply / reception unit (external connection terminal) that receives DC power from the outside and supplies DC power to the LED 53, and is electrically connected to the wiring 54.
  • the direct current voltage received by the electrode terminal 56 is supplied to the LED 53, whereby the LED 53 emits light, and the LED 53 emits desired light.
  • the two electrode terminals 56 are offset to one long side of the mounting substrate 52 with reference to the sealing member 51.
  • the element row of the LED 53 and the sealing member 51 are provided to pass through the center of the mounting substrate 52 in the width direction, and two electrode terminals 56 are provided on the opposite long side of the mounting substrate 52 via the sealing member 51. You may form in each.
  • connection wiring (not shown).
  • LEDs 53 LEDs 53
  • the connection wiring that connects the electrode terminals 56 to each other can be made of, for example, a conductive member such as a lead wire made of a conductive wire coated with an insulating film.
  • the LED module 50 is disposed on the surface of the base 30, and then the diffusion member 40 is disposed.
  • the translucent cover 20 is inserted in the grooves 32.
  • the translucent cover 20 is attached to the base 30 by sliding in the tube axis direction.
  • die 60 is attached to the both ends of the pipe axis direction of the base 30 and the translucent cover 20 which were integrated.
  • the translucent cover 20 may be fitted on the base 30 so as to be pushed from above the base 30 without sliding.
  • the lamp 10 of the present embodiment is a long lamp, and the LED module 50 including the LED 53 and the mounting substrate 52 on which the LED 53 is provided, and the recess 31 in which the LED module 50 is provided. And a long base 30 formed on the surface.
  • the lamp 10 further includes an elongated translucent cover 20 configured to cover the LED module 50, and the LED module 50 and the translucent cover 20 so as to be positioned inside the recess 31.
  • a diffusion member 40 provided to diffuse the light emitted from the LED 53.
  • the diffusion member 40 can be disposed in the vicinity of the LED module 50, and much of the light emitted from the LED module 50 can be diffused and guided to the light transmitting cover 20, so that unevenness in luminance can be suppressed. Can. Moreover, since the LED module 50 is provided in the recessed part 31 of the base 30, size reduction of the lamp
  • the step 33 is formed on the side wall of the recess 31 of the base 30, and the diffusion member 40 is plate-like and covers at least a part of the opening of the recess 31 of the base 30. Is mounted on the step portion 33 in the same manner.
  • the diffusion member 40 can be disposed on the base 30 simply by placing the plate-like diffusion member 40 on the step portion 33, installation of the diffusion member 40 can be facilitated. Can. Further, since the diffusion member 40 is plate-like, processing for giving the diffusion function to the diffusion member 40 is easy, so that the diffusion member 40 can have a desired diffusion function.
  • the base 30 is made of metal, and the diffusion member 40 is in contact with the base 30.
  • the translucent cover 20 is a cutaway cylindrical member having a main opening 20a obtained by cutting out a part of a long cylinder along the long direction, and the base 30 is The translucent cover 20 is held so as to close the main opening 20a.
  • the base 30 is formed with a groove 32 for slidably holding the translucent cover 20.
  • the light-transmissive cover 20 can be easily attached to the base 30, so that the manufacture of the lamp 10 can be facilitated.
  • the translucent cover 20 is comprised from glass or resin, and diffuses the light emitted from LED53. That is, the light transmitting function is given to the light transmitting cover 20.
  • the light of the LED module 50 can be diffused not only by the diffusion member 40 but also by the light-transmissive cover 20, so that unevenness in luminance can be further suppressed.
  • the diffusion member 40 is configured to have different values for the light diffusion rate of the LED module 50 along at least one of the longitudinal direction and the lateral direction of the base 30.
  • the diffusion member 40 has a high diffusion rate above the portion where the LED 53 of the mounting substrate 52 is provided (the LED upper portion), and above the portion where the LED 53 is not provided of the mounting substrate 52 (the LED non-upper portion)
  • the diffusion rate may be low.
  • the base material has a light diffusing function only in the upper part of the LED, or the upper part of the LED contains more light diffusion material in the base than the non-upper part of the LED, etc. It can be realized.
  • diffusion member 40 may be partially provided only in LED upper part, and may not be provided above LED non-upper part.
  • the translucent cover 20 may not include the light diffusing portion.
  • FIG. 5 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10A of the present modification with the base 60 removed.
  • the lamp 10A of this modification is, as shown in FIG. 5, first in that the diffusion member 40 is provided on the base 30 so as to be located above the recess 31 instead of inside the recess 31. It differs from the lamp 10 of the embodiment. Specifically, the lamp 10A of the present modification differs from the lamp 10 of the first embodiment in that the diffusion member 40 is provided on the surface of the base 30 so as to cover the opening of the recess 31. .
  • FIG. 6 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10B of the present modification with the base 60 removed.
  • the recess 31 of the base 30 has a tapered shape that spreads toward the opening, and the side surface of the recess 31 of the base 30 is inclined with respect to the bottom of the recess 31. And the lamp 10 of the first embodiment.
  • the light of the LED module 50 can be reflected toward the opening of the recess 31 by the side surface of the recess 31 of the base 30, so that the light extraction efficiency of the lamp 10B can be improved.
  • the light distribution of the light of the LED module 50 can also be controlled by adjusting the inclination angle of the side surface of the recess 31 of the base 30.
  • FIG. 7 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10C of the present modification with the base 60 removed.
  • the lamp 10 ⁇ / b> C of this modification is a resin according to the first embodiment in that the diffusion member 40 is a resin and is provided in the recess 31 of the base 30 so as to contact the LED 53. It is different.
  • the diffusion member 40 can be provided so as to surround the entire circumference of the LED 53. Therefore, most of the light of the LED 53 can be diffused and guided to the light transmitting cover 20, so that the uneven brightness can be further suppressed.
  • FIG. 8 is a perspective view showing the configuration of the lamp 10D of this modification with the translucent cover up.
  • 9 is an exploded perspective view of the lamp 10D in a state where the base 60 is removed, and
  • FIG. 10 is a part of the lamp 10D (end in the tube axial direction) in a state where the base 60 is removed. It is a perspective view which expanded.
  • a groove 32 extending in the longitudinal direction of the base 30 is formed not on the back surface of the base 30, but on the end face of the base 30 in the short direction. And the lamp 10 of the first embodiment.
  • the entire rear surface of the base 30 can be exposed to the outer surface as a lamp housing, so the heat of the LED module 50 can be dissipated to the outside of the lamp with high efficiency through the base 30. .
  • FIG. 11 is a perspective view showing the configuration of the lamp 10E of the present modification with the translucent cover up.
  • 12 is an exploded perspective view of the lamp 10E in a state where the base 60 is removed, and
  • FIG. 13 is a part of the lamp 10E (end in the tube axial direction) in a state where the base 60 is removed. It is a perspective view which expanded.
  • a groove 32 extending in the longitudinal direction of the base 30 is formed not on the back surface of the base 30 but on the surface of the base 30. It differs from the lamp 10 of the first embodiment.
  • FIG. 14 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10F of this modification with the base 60 removed.
  • the lamp 10F of the present modification includes a diffusion member 40F in place of the sealing member 51 and a phosphor layer 70 in place of the diffusion member 40 in the lamp 10 shown in FIG. 3A.
  • the diffusion member 40F is made of, for example, a translucent resin, and is formed to seal the LED 53.
  • the diffusion member 40F has a light diffusion function.
  • the diffusing member 40F can be made to have a diffusing function by containing light diffusing fine particles in the light transmitting resin, or by providing fine asperities on the surface of the light transmitting resin.
  • the phosphor layer 70 is a remote phosphor and is provided at a distance from the LED 53.
  • the phosphor layer 70 is, for example, a phosphor plate including a phosphor that performs wavelength conversion of the light of the LED 53.
  • LED53 the surface mounting (SMD: Surface Mount Device) type LED element which does not have fluorescent substance containing resin (phosphor layer) as LED53.
  • SMD Surface Mount Device
  • FIG. 15 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10G of this modification with the base 60 removed.
  • the lamp 10G of this modification is provided with a phosphor layer 70G in place of the diffusion member 40 and the sealing member 51, and in place of the translucent cover 20.
  • a translucent cover 20G is provided.
  • the phosphor layer 70G is configured such that a part of the long elliptical cylinder is cut out along the long direction (the tube axis direction), and for example, the cross-sectional shape is a half long vertical ellipse. Be done.
  • the phosphor layer 70 ⁇ / b> G is provided to cover the LEDs 53 so as to be separated from the LEDs 53.
  • the phosphor layer 70 ⁇ / b> G includes a phosphor that performs wavelength conversion of the light of the LED 53.
  • the light distribution angle can be expanded by making the cross-sectional shape of the phosphor layer 70G into a vertically long semi-elliptic shape.
  • the translucent cover 20G is configured such that a part of the long elliptical cylinder is cut out along the long direction (the tube axis direction), and for example, the cross-sectional shape is a half long vertical ellipse. It is configured.
  • the cross-sectional shape of the translucent cover 20G and the cross-sectional shape of the phosphor layer 70G can be similar. Thus, a light distribution angle can be expanded by making the cross-sectional shape of translucent cover 20G into a longitudinally long semi-elliptic.
  • the translucent cover 20G can be made of the same material as the translucent cover 20.
  • a lamp with a wide light distribution angle can be realized by making the cross-sectional shape of each of the phosphor layer 70G and the translucent cover 20G into a vertically long semi-elliptic shape.
  • this space area may be filled with a translucent material such as a transparent resin.
  • At least one of the translucent cover 20G and the phosphor layer 70G functions as a diffusion member.
  • the diffusion function is made to the translucent cover 20G by containing the light diffusion material, performing asperity processing as described above, or making the cross-sectional shape polygonal.
  • the light diffusion material may be contained in the phosphor layer 70G.
  • the fluorescent layer 70G can also have a diffusion function by forming an uneven shape on the inner surface or the outer surface of the fluorescent layer 70G.
  • FIG. 16 is a perspective view showing a configuration of a lighting device according to a second embodiment of the present invention.
  • the illuminating device 100 which concerns on this embodiment is equipped with the lamp 10 which concerns on the said 1st Embodiment, and the lighting fixture 110, as shown in FIG.
  • a lighting device 100 is mounted on a ceiling or the like via a fixture.
  • the lighting fixture 110 is electrically connected to the lamp 10, and includes a pair of sockets 120 for holding the lamp 10, a fixture body 130 to which the socket 120 is attached, and a circuit box (not shown).
  • the inner surface of the instrument body 130 is a reflective surface 131 that reflects the light emitted from the lamp 10 in a predetermined direction (downward in FIG. 16).
  • the circuit box accommodates therein a lighting circuit that supplies power to the lamp 10 when the switch outside the figure is on, and does not supply power when the switch is off.
  • the lighting device 100 according to the present embodiment uses the lamp 10 according to the first embodiment, it is possible to suppress uneven brightness. In addition, you may use the lamp
  • an LED is exemplified as a light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting elements You may use.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting elements You may use.
  • the feeding method is the one-sided feeding method.
  • the both ends of the base may be the power feeding pins.
  • the power receiving pin on one side and the power receiving pin on the other side may be set to one pin, and the power receiving pin on one side and the power receiving pin on the other side both receive AC power from both sides as a pair of power receiving pins.
  • Any configuration may be used.
  • the pair of power receiving pins and the ground pins are not limited to rod-like metal, and may be made of flat plate metal or the like.
  • the one-pin-two-pin base structure in which one of the two bases 60 is one pin (one pin) and the other is two pins (two pins) is used.
  • a two-pin / two-pin base structure may be employed in which each of the two bases 60 has two pins (two pins).
  • a G13 base can be used as a two-pin base.
  • the base 60 it is also possible to use an L-shaped pin base of a straight tube type LED lamp conforming to JEL 801 standardized by the Japan Light Bulb Industry Association.
  • the lighting circuit built in the lamp 10 includes a circuit for converting AC power to DC power.
  • the LED module set it as the structure of the COB type which mounted LED on a board
  • the SMD type LED element in which an LED chip is mounted in a cavity (concave portion) of a resin-molded container and the phosphor-containing resin is sealed in the cavity, the SMD type LED element is used as a light emitting element You may use the LED module comprised by mounting two or more on a board
  • ramp it does not restrict to this.
  • one LED module may be provided.
  • the length and the shape of the mounting substrate of the LED module, or the number of LEDs to be mounted may be appropriately changed.
  • the translucent cover was comprised by substantially semi-cylindrical shape, it does not restrict to this.
  • the translucent cover may have a cylindrical shape in which the main opening is not formed.
  • at least one end of the translucent cover needs to be an open end opening.
  • the base is mounted with a diffusion member, an LED module, a lighting circuit, etc., and electrical connection is also completed. Then, it is inserted from the end opening of the translucent cover and accommodated in the translucent cover.
  • the sealing member carried out package sealing of all LED on a mounted substrate, it does not restrict to this.
  • a plurality of sealing members may be provided in an island shape on one mounting substrate, and each of the plurality of sealing members may individually seal one or more LEDs. In this case, since the luminance unevenness is likely to occur, the effect of the luminance unevenness suppression by the diffusion member becomes remarkable.
  • the present invention is useful as a lamp using a light emitting element such as an LED, for example, a straight tube lamp, and can be widely used in a lighting apparatus and the like provided with the lamp.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A lamp (10), i.e., a long lamp, is provided with: an LED module (50), which has LEDs (53) and a mounting board (52) having the LEDs (53) provided thereon; a long base (30), which has a recessed section (31) formed in the surface thereof, said recessed section having the LED module (50) provided therein; a long light transmitting cover (20) configured to cover the LED module (50); and a diffusion member (40), which is provided between the LED module (50) and the light transmitting cover (20) such that the diffusion member is positioned inside of the recessed section (31), and which diffuses light emitted from the LEDs (53).

Description

ランプ及び照明装置Lamp and lighting device
 本発明は、ランプ及び照明装置に関し、例えば、発光ダイオード(LED:Light Emitting Diode)を用いた直管形のLEDランプ及びこれを備えた照明装置に関する。 The present invention relates to a lamp and a lighting device, for example, a straight tube type LED lamp using a light emitting diode (LED) and a lighting device including the same.
 LEDは、高効率及び長寿命であることから、従来から知られる蛍光灯や白熱電球等の各種ランプにおける新しい光源として期待されており、LEDを用いたランプ(LEDランプ)の研究開発が進められている。 LED is expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps known from the viewpoint of high efficiency and long life, and research and development of lamps using LEDs (LED lamps) is promoted ing.
 LEDランプとしては、両端部に電極コイルを有する直管形蛍光灯に代替する直管形のLEDランプ(直管形LEDランプ)、あるいは、電球形蛍光灯や白熱電球に代替する電球形のLEDランプ(電球形LEDランプ)等がある。例えば、特許文献1には、従来の直管形LEDランプが開示されている。 As an LED lamp, a straight tube type LED lamp (straight tube type LED lamp) replacing a straight tube fluorescent lamp having an electrode coil at both ends, or a bulb shape LED replacing a bulb fluorescent lamp or an incandescent lamp There is a lamp (bulb-shaped LED lamp) etc. For example, Patent Document 1 discloses a conventional straight tube LED lamp.
特開2009-43447号公報JP, 2009-43447, A
 ところで、直管形LEDランプにおいては、実装基板と、実装基板上に実装された複数のLEDとを備えるLEDモジュールが光源として用いられる。そして、このようなLEDモジュールにおいては、実装基板上で発光部(LEDの存在する領域)とそれ以外の非発光部(LEDの存在しない領域)とが存在する。従って、直管形LEDランプでは、つぶつぶ感を与えたり(外見表示性の低下)、輝度ムラが発生したりするという問題がある。特に、直管形LEDランプの低コスト化等を目的として、LEDモジュールのLEDの実装点数を減らした場合、隣り合うLEDの間隔は広くなるため、このような輝度ムラの問題が発生し易くなる。 By the way, in the straight tube type LED lamp, an LED module including a mounting substrate and a plurality of LEDs mounted on the mounting substrate is used as a light source. And in such an LED module, the light emission part (area | region where LED exists) and the other non-light-emission part (area | region where LED does not exist) exist on a mounting substrate. Therefore, in the straight tube type LED lamp, there is a problem that a crush feeling is given (the appearance display property is lowered) or the luminance unevenness occurs. In particular, when the number of mounted LEDs of the LED module is reduced for the purpose of cost reduction of the straight tube type LED lamp, etc., the distance between adjacent LEDs becomes wide, so the problem of such uneven brightness tends to occur. .
 そこで、本発明は、かかる問題点に鑑み、輝度ムラを抑制することができるランプ及び照明装置を提供することを目的とする。 Then, an object of this invention is to provide the lamp | ramp and illuminating device which can suppress a brightness nonuniformity in view of this problem.
 上記目的を達成するために、本発明の一態様に係るランプは、長尺状のランプであって、発光素子と、前記発光素子が設けられた基板とを有する発光モジュールと、前記発光モジュールが設けられた凹部が表面に形成された長尺状の基台と、前記発光モジュールを覆うように構成された長尺状の透光性カバーと、前記凹部の内部又は前記凹部の上方に位置するように、前記発光モジュールと前記透光性カバーとの間に設けられ、前記発光素子から発せられる光を拡散する拡散部材とを備えることを特徴とする。 In order to achieve the above object, a lamp according to one aspect of the present invention is a long lamp, and a light emitting module having a light emitting element and a substrate provided with the light emitting element, and the light emitting module An elongated base provided with a recess is formed on the surface, an elongated translucent cover configured to cover the light emitting module, and the inside of the recess or above the recess As described above, it is characterized in that it comprises: a diffusion member provided between the light emitting module and the light transmitting cover, for diffusing light emitted from the light emitting element.
 ここで、前記基台の凹部の側壁には、段差部が形成されており、前記拡散部材は、板状であり、前記基台の凹部の開口の少なくとも一部を覆うように前記段差部上に載置されていてもよい。 Here, a step is formed on the side wall of the recess of the base, and the diffusion member has a plate shape, and the step is formed on the step so as to cover at least a part of the opening of the recess of the base. It may be placed on the
 また、前記拡散部材は、樹脂であり、前記発光素子と接するように前記凹部内に設けられていてもよい。 The diffusion member may be a resin, and may be provided in the recess so as to be in contact with the light emitting element.
 また、前記拡散部材は、前記基板の前記発光素子が設けられた部分の上方で拡散率が高く、前記基板の前記発光素子が設けられていない部分の上方で拡散率が低くてもよい。 The diffusion member may have a high diffusion rate above the portion of the substrate on which the light emitting element is provided and a low diffusion rate above the portion of the substrate on which the light emitting element is not provided.
 また、前記基台の凹部の側面は、前記発光素子から発せられる光を前記凹部の開口に向けて反射してもよい。 In addition, the side surface of the recess of the base may reflect light emitted from the light emitting element toward the opening of the recess.
 また、前記基台は、金属から構成され、前記拡散部材は、前記基台と接してもよい。 The base may be made of metal, and the diffusion member may be in contact with the base.
 また、前記透光性カバーは、長尺円筒の一部を長尺方向に沿って切り欠いた主開口を有する切り欠き円筒部材であり、前記基台は、前記主開口を塞ぐように前記透光性カバーを保持してもよい。 Further, the light transmitting cover is a cutout cylindrical member having a main opening in which a part of a long cylinder is cut out in a longitudinal direction, and the base is configured to close the main opening. A light cover may be held.
 また、前記基台には、前記透光性カバーをスライド可能に保持する溝が形成されていてもよい。 Further, a groove may be formed in the base for slidably holding the translucent cover.
 また、前記透光性カバーは、ガラス又は樹脂から構成され、前記発光素子から発せられる光を拡散してもよい。 In addition, the light transmitting cover may be made of glass or resin and diffuse light emitted from the light emitting element.
 また、本発明の一態様に係る照明装置は、上記ランプを備えることを特徴とする。 Further, a lighting device according to one aspect of the present invention includes the above lamp.
 本発明によれば、輝度ムラを抑制することができるランプ及び照明装置を実現することができる。 According to the present invention, it is possible to realize a lamp and a lighting device capable of suppressing luminance unevenness.
図1は、本発明の第1の実施形態に係るランプの斜視図である。FIG. 1 is a perspective view of a lamp according to a first embodiment of the present invention. 図2は、本発明の第1の実施形態に係るランプの分解斜視図である。FIG. 2 is an exploded perspective view of the lamp according to the first embodiment of the present invention. 図3Aは、本発明の第1の実施形態に係るランプの一部を拡大した斜視図である。FIG. 3A is an enlarged perspective view of a part of the lamp according to the first embodiment of the present invention. 図3Bは、本発明の第1の実施形態に係るランプにおける透光性カバーの変形例の構成を示す斜視図である。FIG. 3B is a perspective view showing the configuration of a modified example of the translucent cover of the lamp according to the first embodiment of the present invention. 図4Aは、本発明の第1の実施形態に係るLEDモジュールの平面図である。FIG. 4A is a plan view of the LED module according to the first embodiment of the present invention. 図4Bは、本発明の第1の実施形態に係るLEDモジュールの断面図である。FIG. 4B is a cross-sectional view of the LED module according to the first embodiment of the present invention. 図5は、本発明の第1の実施形態に係るランプの変形例1の一部を拡大した斜視図である。FIG. 5 is an enlarged perspective view of a part of Modification 1 of the lamp according to the first embodiment of the present invention. 図6は、本発明の第1の実施形態に係るランプの変形例2の一部を拡大した斜視図である。FIG. 6 is an enlarged perspective view of a part of Modification 2 of the lamp according to the first embodiment of the present invention. 図7は、本発明の第1の実施形態に係るランプの変形例3の一部を拡大した斜視図である。FIG. 7 is an enlarged perspective view of a part of Modification 3 of the lamp according to the first embodiment of the present invention. 図8は、本発明の第1の実施形態に係るランプの変形例4の斜視図である。FIG. 8 is a perspective view of Modification 4 of the lamp according to the first embodiment of the present invention. 図9は、本発明の第1の実施形態に係るランプの変形例4の分解斜視図である。FIG. 9 is an exploded perspective view of Modification 4 of the lamp according to the first embodiment of the present invention. 図10は、本発明の第1の実施形態に係るランプの変形例4の一部を拡大した斜視図である。FIG. 10 is an enlarged perspective view of a part of Modification 4 of the lamp according to the first embodiment of the present invention. 図11は、本発明の第1の実施形態に係るランプの変形例5の斜視図である。FIG. 11 is a perspective view of modification 5 of the lamp according to the first embodiment of the present invention. 図12は、本発明の第1の実施形態に係るランプの変形例5の分解斜視図である。FIG. 12 is an exploded perspective view of Modification 5 of the lamp according to the first embodiment of the present invention. 図13は、本発明の第1の実施形態に係るランプの変形例5の一部を拡大した斜視図である。FIG. 13 is an enlarged perspective view of a part of Modification 5 of the lamp according to the first embodiment of the present invention. 図14は、本発明の第1の実施形態に係るランプの変形例6の一部を拡大した斜視図である。FIG. 14 is an enlarged perspective view of a portion of a modification 6 of the lamp according to the first embodiment of the present invention. 図15は、本発明の第1の実施形態に係るランプの変形例7の一部を拡大した斜視図である。FIG. 15 is a perspective view enlarging a part of modified example 7 of the lamp according to the first embodiment of the present invention. 図16は、本発明の第2の実施形態に係る照明装置の斜視図である。FIG. 16 is a perspective view of a lighting device according to a second embodiment of the present invention.
 以下、本発明の実施形態について、図面を用いて詳細に説明する。なお、以下で説明する実施形態は、いずれも本発明の好ましい一具体例を示すものである。以下の実施形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、ステップ、ステップの順序などは、一例であり、本発明を限定する主旨ではない。よって、以下の実施形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、本発明の課題を達成するのに必ずしも必要ではないが、より好ましい形態を構成するものとして説明される。また、図面において、実質的に同一の構成、動作、及び効果を表す要素については、同一の符号を付す。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below each show a preferable specific example of the present invention. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components not described in the independent claim showing the highest concept of the present invention are not necessarily required to achieve the object of the present invention, but are more preferable. It is described as constituting a form. Further, in the drawings, elements that represent substantially the same configuration, operation, and effect are denoted by the same reference numerals.
 (第1の実施形態)
 まず、本発明の第1の実施形態に係るランプ10について、図1~図3Aを用いて説明する。
First Embodiment
First, a lamp 10 according to a first embodiment of the present invention will be described using FIGS. 1 to 3A.
 図1は、本実施形態に係るランプ10において、透光性カバー20を上にした状態の構成を示す斜視図である。また、図2は、口金60を除いた状態での同ランプ10の分解斜視図であり、図3Aは、口金60を除いた状態で同ランプ10の一部(ランプ10の管軸方向の端部)を拡大した斜視図である。 FIG. 1 is a perspective view showing the configuration of the lamp 10 according to the present embodiment with the translucent cover 20 up. 2 is an exploded perspective view of the lamp 10 with the base 60 removed, and FIG. 3A is a portion of the lamp 10 with the base 60 removed (the end of the lamp 10 in the tube axial direction Part) is an enlarged perspective view.
 ランプ10は、図1~図3Aに示すように、従来の直管形蛍光灯(直管型蛍光ランプ)の代替照明として使用される長尺状の直管形LEDランプであって、透光性カバー20と、基台30と、拡散部材40と、LEDモジュール50と、口金60と、点灯回路(図外)とを備えている。そして、ランプ10では、口金60、透光性カバー20及び基台30によって長尺状のランプ筐体(外囲器)が構成されている。 The lamp 10 is, as shown in FIGS. 1 to 3A, a long straight tube LED lamp used as an alternative illumination of a conventional straight tube fluorescent lamp (straight tube fluorescent lamp) , A base 30, a diffusion member 40, an LED module 50, a base 60, and a lighting circuit (not shown). In the lamp 10, the base 60, the translucent cover 20, and the base 30 constitute a long lamp casing (outer envelope).
 [透光性カバー]
 透光性カバー20は、ランプ筐体の外面を構成する長尺状のカバー部材であって、基台30に設けられた部材、つまりLEDモジュール50及び点灯回路等を保護している。透光性カバー20は、長尺円筒の一部を長尺方向(管軸方向)に沿って切り欠いて形成された主開口20aを有する切り欠き円筒部材、例えば略半円筒形状の部材から構成される。
[Transparent cover]
The translucent cover 20 is a long cover member that constitutes the outer surface of the lamp housing, and protects the members provided on the base 30, that is, the LED module 50, the lighting circuit, and the like. The translucent cover 20 is formed of a cutout cylindrical member having a main opening 20a formed by cutting out a part of an elongated cylinder along the longitudinal direction (tube axis direction), for example, a substantially semi-cylindrical member Be done.
 透光性カバー20は、LEDモジュール50が発する光をランプ外部に透光する材料で構成されている。透光性カバー20は、例えばアクリル等からなる透明樹脂材料又はガラスによって構成されており、所望の透明樹脂材料を樹脂成型することによって形成することができる。 The translucent cover 20 is made of a material that transmits the light emitted by the LED module 50 to the outside of the lamp. The translucent cover 20 is made of, for example, a transparent resin material or glass made of acrylic or the like, and can be formed by resin molding a desired transparent resin material.
 透光性カバー20としては、例えばシリカ(SiO)が70~72[%]のソーダ石灰ガラスによって構成された直管(ガラス管)、又はポリカーボネート等の樹脂材料から構成された直管(プラスチック管)を用いることができる。 The translucent cover 20 is, for example, a straight pipe (glass pipe) made of soda lime glass of 70 to 72 [%] of silica (SiO 2 ), or a straight pipe (plastic) made of a resin material such as polycarbonate Tube) can be used.
 透光性カバー20は、LEDモジュール50からの光を拡散させるための光拡散機能を有する光拡散部を備える。これにより、LEDモジュール50から発せられた光を、透光性カバー20を通過する際に拡散させることができる。光拡散部としては、例えば、透光性カバー20の内面及び外面の少なくともいずれかに形成された光拡散シート又は光拡散膜等がある。具体的には、シリカや炭酸カルシウム等の光拡散材(微粒子)を含有する樹脂や白色顔料を透光性カバー20の内面及び外面の少なくともいずれかに付着させて形成された乳白色の光拡散膜がある。その他の光拡散部としては、透光性カバー20の内部及び外部の少なくともいずれかに設けられたレンズ構造物、又は透光性カバー20の内面及び外面の少なくともいずれかに形成された凹部又は凸部がある。例えば、透光性カバー20の内面及び外面の少なくともいずれかにドットパターンを印刷したり、透光性カバー20の一部を加工したりすることで、透光性カバー20に光拡散機能(光拡散部)を持たせることもできる。また、透光性カバー20そのものを、光拡散材が分散された樹脂材料等を用いて成形することで、透光性カバー20に光拡散機能(光拡散部)を持たせることもできる。また、図3Bに示すように、断面形状が多角形の透光性カバー20を用いてもよい。透光性カバー20Aの断面形状を多角形形状にすることで、拡散機能をさらに持たせることが可能となる。これにより、さらに広配光を実現できる。 The translucent cover 20 includes a light diffusion portion having a light diffusion function for diffusing the light from the LED module 50. Thereby, the light emitted from the LED module 50 can be diffused when passing through the translucent cover 20. Examples of the light diffusion portion include a light diffusion sheet or a light diffusion film formed on at least one of the inner surface and the outer surface of the translucent cover 20. Specifically, a milky white light diffusing film formed by adhering a resin or a white pigment containing a light diffusing material (fine particles) such as silica or calcium carbonate to at least one of the inner surface and the outer surface of the light transmitting cover 20 There is. As the other light diffusion portion, a lens structure provided at least either inside or outside of the translucent cover 20, or a recess or a convex formed at least one of the inner surface and the outer surface of the translucent cover 20 There is a department. For example, by printing a dot pattern on at least one of the inner surface and the outer surface of the translucent cover 20 or processing a part of the translucent cover 20, a light diffusing function (light It is also possible to have a diffusion section). In addition, the translucent cover 20 can be provided with a light diffusing function (light diffusing portion) by molding the translucent cover 20 itself using a resin material or the like in which a light diffusing material is dispersed. Moreover, as shown to FIG. 3B, you may use the translucent cover 20 whose cross-sectional shape is a polygon. By making the cross-sectional shape of the translucent cover 20A into a polygonal shape, it is possible to further provide a diffusion function. Thereby, wide light distribution can be realized.
 [基台]
 基台30は、LEDモジュール50を保持(支持)するための長尺矩形状で板状の支持基台であって、透光性カバー20の主開口20aを塞ぐようにして透光性カバー20と一体化されている。基台30は、その長手方向(管軸方向)において、透光性カバー20の全長とほぼ同じ長さを有する。なお、接着剤等により、基台30に透光性カバー20が固定されていてもよい。
[Base]
The base 30 is a long rectangular plate-like support base for holding (supporting) the LED module 50 and is configured to cover the main opening 20 a of the light-transmissive cover 20 so as to cover the light-transmissive cover 20. Integrated with The base 30 has substantially the same length as the entire length of the light transmitting cover 20 in the longitudinal direction (tube axis direction). The translucent cover 20 may be fixed to the base 30 by an adhesive or the like.
 基台30において、一方の面(表面)は、LEDモジュール50を載置するための載置面であり、透光性カバー20で覆われている。そして、基台30の他方の面(裏面)は、ランプ外部に露出しており、ランプ筐体の外面を構成している。 In the base 30, one surface (surface) is a mounting surface for mounting the LED module 50, and is covered with the light transmitting cover 20. The other surface (rear surface) of the base 30 is exposed to the outside of the lamp, and constitutes the outer surface of the lamp housing.
 基台30の表面には、基台30の長手方向に延びる凹部31が形成されており、この凹部31の開口は拡散部材40により覆われている。そして、LEDモジュール50は、この拡散部材40で覆われた凹部31内、具体的には凹部31の平坦な底面上に設けられている。LEDモジュール50を挟み込む凹部31の両側の側壁には、基台30の長手方向に延びる段差部33が形成されており、拡散部材40は、この段差部33上に設けられている。 A recess 31 extending in the longitudinal direction of the base 30 is formed on the surface of the base 30, and the opening of the recess 31 is covered by the diffusion member 40. The LED module 50 is provided in the recess 31 covered by the diffusion member 40, specifically, on the flat bottom surface of the recess 31. A step portion 33 extending in the longitudinal direction of the base 30 is formed on side walls on both sides of the recess 31 sandwiching the LED module 50, and the diffusion member 40 is provided on the step portion 33.
 基台30の裏面において、基台30の短手方向の端部(基台30の表面において管軸方向と略直交する方向の端部)には、基台30の長手方向に延びる溝(スライドレール)32が形成されている。透光性カバー20は、溝32にその周方向の端部21を挿入することにより、基台30に対してスライド可能な状態で取り付けられる。従って、透光性カバー20は、基台30の表面だけでなく、基台30の短手方向の端面の一部も覆っている。なお、基台30の溝32は、透光性カバー20の周方向の端部21と嵌合するように構成されても構わない。 A groove (slide) extending in the longitudinal direction of the base 30 at the end in the width direction of the base 30 (the end of the surface of the base 30 in the direction substantially orthogonal to the tube axis) on the back surface of the base 30 Rails 32 are formed. The translucent cover 20 is slidably attached to the base 30 by inserting the circumferential end 21 into the groove 32. Therefore, the translucent cover 20 covers not only the surface of the base 30 but also a part of the end surface of the base 30 in the short direction. The groove 32 of the base 30 may be configured to fit with the circumferential end 21 of the translucent cover 20.
 基台30は、LEDモジュール50で発生した熱を放熱するための放熱体(ヒートシンク)としても機能する。従って、基台30は金属等の高熱伝導性材料によって構成することが好ましく、アルミニウムから構成される長尺状のアルミニウム基板を基台30として用いることができる。なお、基台30は、樹脂によって構成してもよい。 The base 30 also functions as a heat sink (heat sink) for radiating the heat generated in the LED module 50. Therefore, the base 30 is preferably made of a high thermal conductivity material such as metal, and a long aluminum substrate made of aluminum can be used as the base 30. The base 30 may be made of resin.
 また、基台30の凹部31の内面に反射膜材料をコーティングしても構わない。例えば、基台30の表面全面を白色樹脂及び金属膜でコーティングすることによって反射面を形成することができる。また、その他の表面仕上げによって反射面を形成することもできる。このように、基台30の凹部31の内面に反射面を形成することにより、LEDモジュール50が発する光を反射面によって透光性カバー20側に反射させることができ、ランプ10の光の取り出し効率を向上させることができる。 In addition, the inner surface of the recess 31 of the base 30 may be coated with a reflective film material. For example, the reflecting surface can be formed by coating the entire surface of the base 30 with a white resin and a metal film. Other surface finishes can also form the reflective surface. As described above, by forming a reflection surface on the inner surface of the recess 31 of the base 30, the light emitted from the LED module 50 can be reflected to the translucent cover 20 side by the reflection surface, and the light of the lamp 10 is taken out. Efficiency can be improved.
 また、基台30の表面において、凹部31が基台30の長手方向に連続して形成されるとしたが、断続して設けられてもよい。例えば、拡散部材40が設けられていない部分には凹部31が設けられなくてもよい。 In addition, although the recess 31 is formed continuously on the surface of the base 30 in the longitudinal direction of the base 30, it may be provided intermittently. For example, the recess 31 may not be provided in a portion where the diffusion member 40 is not provided.
 [拡散部材]
 拡散部材40は、LEDモジュール50からの光を拡散させるための長尺矩形状の拡散板であって、基台30の凹部31内にLEDモジュール50の上方を覆う形で設けられている。拡散部材40のLEDモジュール50と対向する一方の面(裏面)に対して反対側の面(表面)の上方は、透光性カバー20で覆われている。拡散部材40は、LEDモジュール50の光に対する拡散率について、基台30の長手方向及び短手方向に沿って一様な値を持つように構成されている。
[Diffusion member]
The diffusion member 40 is a long rectangular diffusion plate for diffusing light from the LED module 50, and is provided in the recess 31 of the base 30 so as to cover the upper side of the LED module 50. A translucent cover 20 covers the upper side of the surface (front surface) opposite to the surface (back surface) of the diffusion member 40 facing the LED module 50. The diffusion member 40 is configured to have uniform values along the longitudinal direction and the short direction of the base 30 with respect to the diffusion coefficient of the LED module 50 with respect to light.
 拡散部材40は、LEDモジュール50からの光を透光性カバー20に透光する透光性材料で形成されている。拡散部材40は、例えば、アクリル等からなる透明樹脂材料又はガラス等を基材として、LEDモジュール50からの光を拡散させるための光拡散機能を有する光拡散部を備えるようにして構成することができる。光拡散部としては、例えば基材(拡散部材40)の表面及び裏面の少なくともいずれかに形成された光拡散シート又は光拡散膜等がある。具体的には、シリカや炭酸カルシウム等の光拡散材(微粒子)を含有する樹脂や白色顔料を基材の表面及び裏面の少なくともいずれかに付着させて形成された乳白色の光拡散膜がある。その他の光拡散部として、基材の内部及び外部の少なくともいずれかに設けられたレンズ構造物、又は基材の表面及び裏面の少なくともいずれかに形成された凹部又は凸部がある。例えば、基材の表面及び裏面の少なくともいずれかにドットパターンを印刷したり、基材の一部を加工したりすることで、基材に光拡散機能(光拡散部)を持たせることもできる。また、基材そのものを、光拡散材が分散された樹脂材料等を用いて成形することで、基材に光拡散機能(光拡散部)を持たせることもできる。なお、拡散部材40は、透光性カバー20と同じ材料から構成することもできる。 The diffusion member 40 is formed of a translucent material that transmits the light from the LED module 50 to the translucent cover 20. The diffusion member 40 may be configured to include a light diffusion portion having a light diffusion function for diffusing light from the LED module 50 using, for example, a transparent resin material or glass made of acrylic or the like as a base material. it can. Examples of the light diffusion portion include a light diffusion sheet or a light diffusion film formed on at least one of the front surface and the back surface of the base material (the diffusion member 40). Specifically, there is a milky white light diffusion film formed by attaching a resin containing a light diffusion material (fine particles) such as silica or calcium carbonate or a white pigment to at least one of the front surface and the back surface of the substrate. As other light diffusion parts, there are a lens structure provided on at least one of the inside and the outside of the base, or a concave or a convex formed on at least one of the front and back sides of the base. For example, by printing a dot pattern on at least one of the front surface and the back surface of the substrate or processing a part of the substrate, the substrate can also have a light diffusion function (light diffusion portion). . In addition, by forming the base material itself using a resin material or the like in which a light diffusing material is dispersed, the base material can also have a light diffusing function (light diffusing portion). The diffusion member 40 can also be made of the same material as the translucent cover 20.
 [LEDモジュール]
 複数のLEDモジュール50は、ランプ10の光源であり、透光性カバー20及び拡散部材40によって重ねて覆われる形で、基台30の凹部31内に基台30の長手方向に並んで載置されている。複数のLEDモジュール50のそれぞれは、接着剤やネジ等により基台30に固定されている。LEDモジュール50の詳細な構成については後述する。
[LED module]
The plurality of LED modules 50 are light sources of the lamp 10, and are mounted side by side in the longitudinal direction of the base 30 in the recess 31 of the base 30 so as to be overlapped and covered by the translucent cover 20 and the diffusion member 40. It is done. Each of the plurality of LED modules 50 is fixed to the base 30 by an adhesive, a screw or the like. The detailed configuration of the LED module 50 will be described later.
 [口金]
 一対の口金60は、略有底円筒形状に構成されており、ランプ筐体の外面を構成する形で、一体化された透光性カバー20及び基台30の両端部(管軸方向の両端部)に設けられている。そして、一対の口金60は、透光性カバー20及び基台30を一体化することにより形成される円筒部材の両端部(管軸方向の両端部)の開口を蓋している。この円筒部材の一方の側の口金60には、一対の受電ピン61が設けられており、他方の側の口金60には、アースピン62が設けられている。
[Cap]
The pair of caps 60 have a substantially bottomed cylindrical shape, and form the outer surface of the lamp housing, and both ends of the integrated translucent cover 20 and the base 30 (both ends in the tube axial direction Section). And a pair of nozzle | cap | die 60 is covering the opening of the both ends (both-ends of the tube axial direction) of the cylindrical member formed by integrating the translucent cover 20 and the base 30. As shown in FIG. The base 60 on one side of the cylindrical member is provided with a pair of power reception pins 61, and the base 60 on the other side is provided with an earth pin 62.
 一対の受電ピン61は、棒状の金属材料で構成された導電性のピンである。一対の受電ピン61は、照明器具に装着されるように構成されており、LEDモジュール50のLED53を点灯させるための電力を、ランプ外部の電源装置(照明器具)から受電する。この一対の受電ピン61を介して、直流電力がランプ内の点灯回路に供給される。点灯回路は、入力された直流電力を整流等してLED53に通電するための所望の電圧を出力する。 The pair of power receiving pins 61 is a conductive pin made of a rod-like metal material. The pair of power receiving pins 61 is configured to be attached to the lighting fixture, and receives power for lighting the LED 53 of the LED module 50 from a power supply device (lighting fixture) outside the lamp. DC power is supplied to the lighting circuit in the lamp through the pair of power receiving pins 61. The lighting circuit rectifies the input DC power and outputs a desired voltage for energizing the LED 53.
 アースピン62は、1本の棒状の金属材料によって構成された導電性のピンである。アースピン62も受電ピン61と同様に照明器具に装着されるように構成されている。従って、照明器具におけるアースピン62との接続部分(ソケット内の接続部)がアース端子となっていれば、ランプ10が当該照明器具に装着されたときに、アースピン62は接地電位となる。 The earth pin 62 is a conductive pin made of a rod-like metal material. Similarly to the power receiving pin 61, the earth pin 62 is configured to be attached to the lighting apparatus. Therefore, if the connection portion (connection portion in the socket) with the ground pin 62 in the lighting apparatus is a ground terminal, the grounding pin 62 is at the ground potential when the lamp 10 is mounted on the lighting apparatus.
 なお、ランプ10が、既存の蛍光灯用の照明器具に装着されるような場合は、当該照明器具とアースピン62とはアース接続されず、アースピン62は、ランプ10を照明器具に取り付けるための取り付けピンとして機能する。従って、アースピン62は必ずしも金属で構成する必要はない。また、アースピン62は、1本に限らず、2本としても構わない。 In the case where the lamp 10 is attached to the existing fluorescent lamp, the lamp and the ground pin 62 are not connected to ground, and the ground pin 62 is a mounting for attaching the lamp 10 to the lamp. Act as a pin. Therefore, the ground pin 62 does not have to be made of metal. Further, the number of earth pins 62 is not limited to one, and may be two.
 このように、ランプ10は、片側給電方式を採用しており、LEDモジュール50を点灯させるための電力は、ランプ10の一方の端部のみに設けられた一対の受電ピン61から給電されるように構成されている。 As described above, the lamp 10 adopts the one-side power feeding system, and the power for lighting the LED module 50 is fed from the pair of power receiving pins 61 provided only at one end of the lamp 10 Is configured.
 次に、LEDモジュール50の構成について、図4A及び図4Bを用いて説明する。 Next, the configuration of the LED module 50 will be described using FIGS. 4A and 4B.
 図4Aは、LEDモジュール50の構成を示す平面図(上面図)であり、図4Bは、図4AのA-A’線に沿って切断した同LEDモジュール50の断面図である。 FIG. 4A is a plan view (top view) showing the configuration of the LED module 50, and FIG. 4B is a cross-sectional view of the LED module 50 taken along the line A-A 'of FIG. 4A.
 LEDモジュール50は、図4A及び図4Bに示すように、COB(Chip On Board)型の発光モジュールであって、ライン状に光を発するライン状光源である。LEDモジュール50は、実装基板52と、実装基板52上に配列された複数のLED53と、LED53を封止する封止部材51と、配線54と、静電保護素子55と、電極端子56と、金ワイヤ等のワイヤ57とを備える。 The LED module 50 is a COB (Chip On Board) type light emitting module as shown in FIGS. 4A and 4B, and is a linear light source that emits light in a linear manner. The LED module 50 includes a mounting substrate 52, a plurality of LEDs 53 arranged on the mounting substrate 52, a sealing member 51 for sealing the LEDs 53, a wire 54, an electrostatic protection element 55, and an electrode terminal 56. And a wire 57 such as a gold wire.
 実装基板52は、LED53を実装するためのLED実装用基板であって、例えば長尺矩形状の基板である。実装基板52としては、例えば、ガラスコンポジット基板(CEM-3等)、ガラスエポキシ基板(FR-4等)、紙フェノールや紙エポキシからなる基板(FR-1等)、又は、ポリイミド等から構成される可撓性を有するフレキシブル基板を用いることができる。メタルベース基板としては、例えば、アルミニウム合金基板、鉄合金基板又は銅合金基板等を用いることができる。 The mounting substrate 52 is an LED mounting substrate for mounting the LED 53, and is, for example, a long rectangular substrate. The mounting substrate 52 is made of, for example, a glass composite substrate (CEM-3 or the like), a glass epoxy substrate (FR-4 or the like), a substrate (FR-1 or the like) made of paper phenol or paper epoxy, or polyimide or the like. Flexible substrate can be used. As a metal base substrate, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, etc. can be used, for example.
 実装基板52の長手方向の長さ(長辺の長さ)をL1(mm)とし、短手方向の長さ(短辺の長さ)をL2(mm)とすると、実装基板52として、例えばL1=580mm、L2=16mmで、厚みが1.0(mm)の基板を用いることができる。 Assuming that the length in the longitudinal direction (long side length) of the mounting substrate 52 is L1 (mm) and the length in the short side direction (length of the short side) is L2 (mm), for example, as the mounting substrate 52 A substrate having a thickness of 1.0 (mm) can be used with L1 = 580 mm, L2 = 16 mm.
 複数のLED53は、それぞれ発光素子の一例であって、実装基板52上に直接実装されている。複数のLED53は、実装基板52の長手方向に沿ってライン状(一直線状)に一列に配列されている。各LED53は、単色の可視光を発するベアチップであり、ダイアタッチ材(ダイボンド材)によって実装基板52上にダイボンディングされている。各LED53としては、例えば青色光を発光する青色LEDチップを用いることができる。青色LEDチップとしては、例えばInGaN系の材料によって構成された、中心波長が440nm~470nmの窒化ガリウム系の半導体発光素子を用いることができる。 Each of the plurality of LEDs 53 is an example of a light emitting element, and is directly mounted on the mounting substrate 52. The plurality of LEDs 53 are arranged in a line (in a straight line) in a line along the longitudinal direction of the mounting substrate 52. Each LED 53 is a bare chip that emits monochromatic visible light, and is die-bonded onto the mounting substrate 52 by a die attach material (die bonding material). As each LED 53, for example, a blue LED chip that emits blue light can be used. As the blue LED chip, for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
 複数のLED53において、チップ上面には電流を供給するためのp側電極及びn側電極が形成されており、p側電極及びn側電極のそれぞれと配線54とがワイヤ57によってワイヤボンディングされている。 In the plurality of LEDs 53, a p-side electrode and an n-side electrode for supplying current are formed on the top surface of the chip, and the p-side electrode and the n-side electrode are wire-bonded to the wiring 54 by the wire 57. .
 封止部材51は、光波長変換体である蛍光体を含む蛍光体含有樹脂であって、LED53からの光を波長変換すると共に、実装基板52上の全てのLED53を一括封止してLED53を保護する。封止部材51は、断面形状が上に凸の略半円状のドーム形状であり、実装基板52上の全てのLED53を覆うようにLED53の配列方向に沿って直線状に形成されている。 The sealing member 51 is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and wavelength-converts the light from the LEDs 53, and collectively seals all the LEDs 53 on the mounting substrate 52. Protect. The sealing member 51 has a substantially semicircular dome shape with an upward convex cross section, and is formed linearly along the arrangement direction of the LEDs 53 so as to cover all the LEDs 53 on the mounting substrate 52.
 なお、直線状(ストライプ状)の封止部材51は、実装基板52の短手方向の中心を通る直線よりも一方の長辺側に寄って形成されている。さらに、封止部材51は、実装基板52の一方の短辺の端面から対向する他方の短辺の端面まで途切れることなく形成されている。封止部材51としては、例えば、LED53が青色LEDである場合、YAG(イットリウム・アルミニウム・ガーネット)系の黄色蛍光体粒子をシリコーン樹脂に分散させた蛍光体含有樹脂を用いることができる。この場合、黄色蛍光体粒子は青色LEDの青色光によって励起されて黄色光を放出するので、封止部材51からは、励起された黄色光と青色LEDの青色光とによって白色光が放出される。なお、封止部材51に、シリカ等の光拡散材も含有させても構わない。 The linear (striped) sealing member 51 is formed closer to one long side than a straight line passing the center of the mounting substrate 52 in the short direction. Furthermore, the sealing member 51 is formed without interruption from the end face of one short side of the mounting substrate 52 to the end face of the opposite short side. As the sealing member 51, for example, when the LED 53 is a blue LED, it is possible to use a phosphor-containing resin in which yellow phosphor particles of YAG (yttrium aluminum garnet) type are dispersed in a silicone resin. In this case, since the yellow phosphor particles are excited by the blue light of the blue LED to emit yellow light, white light is emitted from the sealing member 51 by the excited yellow light and the blue light of the blue LED. . The sealing member 51 may also contain a light diffusing material such as silica.
 配線54は、タングステン(W)又は銅(Cu)等からなる金属配線であり、複数のLED53同士を電気的に接続するために所定形状にパターン形成されている。さらに、配線54は、複数のLED53と静電保護素子55とを電気的に接続するともに、電極端子56とも電気的に接続されるようにパターン形成されている。 The wiring 54 is a metal wiring made of tungsten (W) or copper (Cu) or the like, and is pattern-formed in a predetermined shape in order to electrically connect the plurality of LEDs 53 to each other. Further, the wiring 54 is formed so as to electrically connect the plurality of LEDs 53 and the electrostatic protection element 55 and to be electrically connected also to the electrode terminal 56.
 静電保護素子55は、例えばツェナーダイオードであり、逆耐圧が低いLED53が実装基板52上に生じる逆方向極性の静電気によって破壊されることを防止する。 The electrostatic protection element 55 is, for example, a zener diode, and prevents the LED 53 having a low reverse withstand voltage from being destroyed by static electricity of the reverse polarity generated on the mounting substrate 52.
 電極端子56は、外部から直流電力を受電すると共にLED53に直流電力を給電する受給電部(外部接続端子)であり、配線54に電気的に接続されている。電極端子56が受電した直流電圧がLED53に供給されることにより、LED53が発光し、LED53から所望の光が放出される。2つの電極端子56は、封止部材51を基準として実装基板52の一方の長辺側に片寄せられている。なお、LED53の素子列及び封止部材51を実装基板52の幅方向の中心を通るように設けて、2つの電極端子56を封止部材51を介して実装基板52の対向する長辺側の各々に形成してもよい。 The electrode terminal 56 is a power supply / reception unit (external connection terminal) that receives DC power from the outside and supplies DC power to the LED 53, and is electrically connected to the wiring 54. The direct current voltage received by the electrode terminal 56 is supplied to the LED 53, whereby the LED 53 emits light, and the LED 53 emits desired light. The two electrode terminals 56 are offset to one long side of the mounting substrate 52 with reference to the sealing member 51. The element row of the LED 53 and the sealing member 51 are provided to pass through the center of the mounting substrate 52 in the width direction, and two electrode terminals 56 are provided on the opposite long side of the mounting substrate 52 via the sealing member 51. You may form in each.
 隣り合うLEDモジュール50は、電極端子56同士が接続配線(不図示)によって電気的に接続されている。これにより、複数のLEDモジュール50(LED53)が直列接続される。電極端子56同士を接続する接続配線は、例えば、絶縁被膜された導線からなるリード線等の導電部材によって構成することができる。 In the LED modules 50 adjacent to each other, the electrode terminals 56 are electrically connected by connection wiring (not shown). Thereby, a plurality of LED modules 50 (LEDs 53) are connected in series. The connection wiring that connects the electrode terminals 56 to each other can be made of, for example, a conductive member such as a lead wire made of a conductive wire coated with an insulating film.
 上記構成を有するランプ10の製造においては、まず、基台30の表面にLEDモジュール50が配設された後、拡散部材40が配設される。そして、基台30の短手方向の両端面の溝32に、透光性カバー20の周方向の端部21の両方が挿入されて引っ掛けられた後、溝32内で透光性カバー20を管軸方向にスライドさせて基台30に透光性カバー20を取り付ける。そして、一体化された基台30及び透光性カバー20の管軸方向の両端部に口金60が取り付けられる。なお、透光性カバー20をスライドさせずに基台30の上から押し込むようにして基台30に嵌めてもよい。 In the manufacture of the lamp 10 having the above configuration, first, the LED module 50 is disposed on the surface of the base 30, and then the diffusion member 40 is disposed. After both end portions 21 of the translucent cover 20 in the circumferential direction are inserted into and hooked in the grooves 32 on both end surfaces of the base 30 in the lateral direction, the translucent cover 20 is inserted in the grooves 32. The translucent cover 20 is attached to the base 30 by sliding in the tube axis direction. And the nozzle | cap | die 60 is attached to the both ends of the pipe axis direction of the base 30 and the translucent cover 20 which were integrated. The translucent cover 20 may be fitted on the base 30 so as to be pushed from above the base 30 without sliding.
 以上のように、本実施形態のランプ10は、長尺状のランプであって、LED53と、LED53が設けられた実装基板52とを有するLEDモジュール50と、LEDモジュール50が設けられた凹部31が表面に形成された長尺状の基台30とを備える。そして、ランプ10は、さらに、LEDモジュール50を覆うように構成された長尺状の透光性カバー20と、凹部31の内部に位置するように、LEDモジュール50と透光性カバー20との間に設けられ、LED53から発せられる光を拡散する拡散部材40とを備える。 As described above, the lamp 10 of the present embodiment is a long lamp, and the LED module 50 including the LED 53 and the mounting substrate 52 on which the LED 53 is provided, and the recess 31 in which the LED module 50 is provided. And a long base 30 formed on the surface. The lamp 10 further includes an elongated translucent cover 20 configured to cover the LED module 50, and the LED module 50 and the translucent cover 20 so as to be positioned inside the recess 31. And a diffusion member 40 provided to diffuse the light emitted from the LED 53.
 このような構成により、LEDモジュール50の近傍に拡散部材40を配置し、LEDモジュール50から発せられる光の多くを拡散して透光性カバー20に導くことができるので、輝度ムラを抑制することができる。また、基台30の凹部31内にLEDモジュール50が設けられるため、ランプ10の小型化を実現することもできる。 With such a configuration, the diffusion member 40 can be disposed in the vicinity of the LED module 50, and much of the light emitted from the LED module 50 can be diffused and guided to the light transmitting cover 20, so that unevenness in luminance can be suppressed. Can. Moreover, since the LED module 50 is provided in the recessed part 31 of the base 30, size reduction of the lamp | ramp 10 can also be implement | achieved.
 また、本実施形態のランプ10では、基台30の凹部31の側壁に段差部33が形成され、拡散部材40は、板状であり、基台30の凹部31の開口の少なくとも一部を覆うように段差部33上に載置されている。 Further, in the lamp 10 of the present embodiment, the step 33 is formed on the side wall of the recess 31 of the base 30, and the diffusion member 40 is plate-like and covers at least a part of the opening of the recess 31 of the base 30. Is mounted on the step portion 33 in the same manner.
 このような構成により、板状の拡散部材40を段差部33上に載置するだけで、拡散部材40を基台30に配設することができるので、拡散部材40の設置を容易にすることができる。また、拡散部材40は板状であるため、拡散部材40に拡散機能を持たせるための加工等が容易になるため、拡散部材40に所望な拡散機能を持たせることができる。 With such a configuration, since the diffusion member 40 can be disposed on the base 30 simply by placing the plate-like diffusion member 40 on the step portion 33, installation of the diffusion member 40 can be facilitated. Can. Further, since the diffusion member 40 is plate-like, processing for giving the diffusion function to the diffusion member 40 is easy, so that the diffusion member 40 can have a desired diffusion function.
 また、本実施形態のランプ10では、基台30は金属から構成され、拡散部材40は基台30と接する。 Further, in the lamp 10 of the present embodiment, the base 30 is made of metal, and the diffusion member 40 is in contact with the base 30.
 このような構成により、LEDモジュール50の熱が拡散部材40に伝わって拡散部材40の温度が上昇した場合でも、拡散部材40の熱を基台30に放熱することができるので、熱による拡散部材40の反りを抑えることができる。 With such a configuration, even when the heat of the LED module 50 is transmitted to the diffusion member 40 and the temperature of the diffusion member 40 rises, the heat of the diffusion member 40 can be dissipated to the base 30, so the heat diffusion member Warpage of 40 can be suppressed.
 また、本実施形態のランプ10では、透光性カバー20は、長尺円筒の一部を長尺方向に沿って切り欠いた主開口20aを有する切り欠き円筒部材であり、基台30は、主開口20aを塞ぐように透光性カバー20を保持する。 Further, in the lamp 10 of the present embodiment, the translucent cover 20 is a cutaway cylindrical member having a main opening 20a obtained by cutting out a part of a long cylinder along the long direction, and the base 30 is The translucent cover 20 is held so as to close the main opening 20a.
 このような構成により、基台30の一部がランプ筐体の一部として外面に露出するため、基台30を介してLEDモジュール50の熱を効率良くランプ外部に放熱することができる。 With such a configuration, a part of the base 30 is exposed to the outer surface as a part of the lamp casing, so the heat of the LED module 50 can be efficiently dissipated to the outside of the lamp through the base 30.
 また、本実施形態のランプ10では、基台30には、透光性カバー20をスライド可能に保持する溝32が形成されている。 Further, in the lamp 10 of the present embodiment, the base 30 is formed with a groove 32 for slidably holding the translucent cover 20.
 このような構成により、透光性カバー20の基台30への取り付けが容易になるため、ランプ10の製造を容易にすることができる。 With such a configuration, the light-transmissive cover 20 can be easily attached to the base 30, so that the manufacture of the lamp 10 can be facilitated.
 また、本実施形態のランプ10では、透光性カバー20は、ガラス又は樹脂から構成され、LED53から発せられる光を拡散する。つまり、透光性カバー20に光拡散機能を持たせている。 Moreover, in the lamp | ramp 10 of this embodiment, the translucent cover 20 is comprised from glass or resin, and diffuses the light emitted from LED53. That is, the light transmitting function is given to the light transmitting cover 20.
 このような構成により、拡散部材40だけでなく、透光性カバー20によってもLEDモジュール50の光を拡散させることができるので、輝度ムラをさらに抑制することができる。 With such a configuration, the light of the LED module 50 can be diffused not only by the diffusion member 40 but also by the light-transmissive cover 20, so that unevenness in luminance can be further suppressed.
 なお、本実施形態のランプ10において、拡散部材40は、LEDモジュール50の光に対する拡散率について、基台30の長手方向及び短手方向の少なくともいずれかに沿って異なる値を持つように構成されてもよい。例えば、拡散部材40は、実装基板52のLED53が設けられた部分の上方(LED上方部分)で拡散率が高く、実装基板52のLED53が設けられていない部分の上方(LED非上方部分)で拡散率が低くてもよい。このような構成は、拡散部材40において、LED上方部分のみで基材に光拡散機能を持たせる、又はLED上方部分でLED非上方部分より多くの光拡散材を基材に含有させること等で実現することができる。 In the lamp 10 of the present embodiment, the diffusion member 40 is configured to have different values for the light diffusion rate of the LED module 50 along at least one of the longitudinal direction and the lateral direction of the base 30. May be For example, the diffusion member 40 has a high diffusion rate above the portion where the LED 53 of the mounting substrate 52 is provided (the LED upper portion), and above the portion where the LED 53 is not provided of the mounting substrate 52 (the LED non-upper portion) The diffusion rate may be low. In such a configuration, in the diffusion member 40, the base material has a light diffusing function only in the upper part of the LED, or the upper part of the LED contains more light diffusion material in the base than the non-upper part of the LED, etc. It can be realized.
 また、本実施形態のランプ10において、拡散部材40は、LED上方部分のみに部分的に設けられ、LED非上方部分の上方に設けられなくてもよい。 Moreover, in the lamp | ramp 10 of this embodiment, the spreading | diffusion member 40 may be partially provided only in LED upper part, and may not be provided above LED non-upper part.
 また、本実施形態のランプ10において、LEDモジュール50の光の拡散機能について拡散部材40により十分な効果が得られる場合、透光性カバー20は、光拡散部を備えなくてもよい。 Moreover, in the lamp 10 of the present embodiment, when the diffusing member 40 can obtain a sufficient effect on the light diffusing function of the LED module 50, the translucent cover 20 may not include the light diffusing portion.
 (変形例1)
 次に、本発明の第1の実施形態に係るランプの変形例1について、図5を用いて説明する。
(Modification 1)
Next, a first modification of the lamp according to the first embodiment of the present invention will be described with reference to FIG.
 図5は、口金60を除いた状態で本変形例のランプ10Aの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 5 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10A of the present modification with the base 60 removed.
 本変形例のランプ10Aは、図5に示すように、拡散部材40が、凹部31の内部でなく、凹部31の上方に位置するように基台30に設けられているという点で第1の実施形態のランプ10と異なる。具体的に、本変形例のランプ10Aは、拡散部材40が、凹部31の開口を覆うように、基台30の表面上に設けられているという点で第1の実施形態のランプ10と異なる。 The lamp 10A of this modification is, as shown in FIG. 5, first in that the diffusion member 40 is provided on the base 30 so as to be located above the recess 31 instead of inside the recess 31. It differs from the lamp 10 of the embodiment. Specifically, the lamp 10A of the present modification differs from the lamp 10 of the first embodiment in that the diffusion member 40 is provided on the surface of the base 30 so as to cover the opening of the recess 31. .
 このような構成により、基台30の凹部31の側壁に、拡散部材40を載置するための段差部を設ける必要がなくなるので、基台30の加工を容易にすることができる。従って、ランプ10Aの製造を容易にすることができる。 With such a configuration, there is no need to provide a step portion for mounting the diffusion member 40 on the side wall of the recess 31 of the base 30, so processing of the base 30 can be facilitated. Therefore, the manufacture of the lamp 10A can be facilitated.
 (変形例2)
 次に、本発明の第1の実施形態に係るランプの変形例2について、図6を用いて説明する。
(Modification 2)
Next, a second modification of the lamp according to the first embodiment of the present invention will be described with reference to FIG.
 図6は、口金60を除いた状態で本変形例のランプ10Bの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 6 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10B of the present modification with the base 60 removed.
 本変形例のランプ10Bは、図6に示すように、基台30の凹部31が開口に向けて広がるテーパー形状を有し、基台30の凹部31の側面が凹部31の底面に対して傾いているという点で第1の実施形態のランプ10と異なる。 In the lamp 10B of this modification, as shown in FIG. 6, the recess 31 of the base 30 has a tapered shape that spreads toward the opening, and the side surface of the recess 31 of the base 30 is inclined with respect to the bottom of the recess 31. And the lamp 10 of the first embodiment.
 このような構成により、基台30の凹部31の側面により、LEDモジュール50の光を凹部31の開口に向けて反射させることができるので、ランプ10Bの光の取り出し効率を向上させることができる。また、基台30の凹部31の側面の傾斜角を調整することによって、LEDモジュール50の光の配光を制御することもできる。 With such a configuration, the light of the LED module 50 can be reflected toward the opening of the recess 31 by the side surface of the recess 31 of the base 30, so that the light extraction efficiency of the lamp 10B can be improved. The light distribution of the light of the LED module 50 can also be controlled by adjusting the inclination angle of the side surface of the recess 31 of the base 30.
 (変形例3)
 次に、本発明の第1の実施形態に係るランプの変形例3について、図7を用いて説明する。
(Modification 3)
Next, a third modification of the lamp according to the first embodiment of the present invention will be described with reference to FIG.
 図7は、口金60を除いた状態で本変形例のランプ10Cの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 7 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10C of the present modification with the base 60 removed.
 本変形例のランプ10Cは、図7に示すように、拡散部材40が樹脂であり、LED53と接するように基台30の凹部31内に設けられるという点で第1の実施形態のランプ10と異なる。 As shown in FIG. 7, the lamp 10 </ b> C of this modification is a resin according to the first embodiment in that the diffusion member 40 is a resin and is provided in the recess 31 of the base 30 so as to contact the LED 53. It is different.
 このような構成により、拡散部材40をLED53の全周を囲むように設けることができる。従って、LED53の光の多くを拡散して透光性カバー20に導くことができるので、輝度ムラをさらに抑制することができる。 With such a configuration, the diffusion member 40 can be provided so as to surround the entire circumference of the LED 53. Therefore, most of the light of the LED 53 can be diffused and guided to the light transmitting cover 20, so that the uneven brightness can be further suppressed.
 また、基台30の凹部31の側壁に、拡散部材40を載置するための段差部を設ける必要がなくなるので、基台30の加工を容易にすることができる。従って、ランプ10Cの製造を容易にすることができる。 In addition, since it is not necessary to provide the side wall of the recess 31 of the base 30 with the step for mounting the diffusion member 40, processing of the base 30 can be facilitated. Therefore, the manufacture of the lamp 10C can be facilitated.
 (変形例4)
 次に、本発明の第1の実施形態に係るランプの変形例4について、図8~10を用いて説明する。
(Modification 4)
Next, a fourth modification of the lamp according to the first embodiment of the present invention will be described with reference to FIGS.
 図8は、本変形例のランプ10Dにおいて、透光性カバーを上にした状態の構成を示す斜視図である。また、図9は、口金60を除いた状態での同ランプ10Dの分解斜視図であり、図10は、口金60を除いた状態で同ランプ10Dの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 8 is a perspective view showing the configuration of the lamp 10D of this modification with the translucent cover up. 9 is an exploded perspective view of the lamp 10D in a state where the base 60 is removed, and FIG. 10 is a part of the lamp 10D (end in the tube axial direction) in a state where the base 60 is removed. It is a perspective view which expanded.
 本変形例のランプ10Dは、図8~10に示すように、基台30の裏面ではなく、基台30の短手方向の端面に、基台30の長手方向に延びる溝32が形成されているという点で第1の実施形態のランプ10と異なる。 In the lamp 10D of this modification, as shown in FIGS. 8 to 10, a groove 32 extending in the longitudinal direction of the base 30 is formed not on the back surface of the base 30, but on the end face of the base 30 in the short direction. And the lamp 10 of the first embodiment.
 このような構成により、基台30の裏面の全面をランプ筐体として外面に露出させることができるため、基台30を介してLEDモジュール50の熱を高効率でランプ外部に放熱することができる。 With such a configuration, the entire rear surface of the base 30 can be exposed to the outer surface as a lamp housing, so the heat of the LED module 50 can be dissipated to the outside of the lamp with high efficiency through the base 30. .
 (変形例5)
 次に、本発明の第1の実施形態に係るランプの変形例5について、図11~13を用いて説明する。
(Modification 5)
Next, a fifth modification of the lamp according to the first embodiment of the present invention will be described with reference to FIGS.
 図11は、本変形例のランプ10Eにおいて、透光性カバーを上にした状態の構成を示す斜視図である。また、図12は、口金60を除いた状態での同ランプ10Eの分解斜視図であり、図13は、口金60を除いた状態で同ランプ10Eの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 11 is a perspective view showing the configuration of the lamp 10E of the present modification with the translucent cover up. 12 is an exploded perspective view of the lamp 10E in a state where the base 60 is removed, and FIG. 13 is a part of the lamp 10E (end in the tube axial direction) in a state where the base 60 is removed. It is a perspective view which expanded.
 本変形例のランプ10Eは、図11~13に示すように、基台30の裏面ではなく、基台30の表面に、基台30の長手方向に延びる溝32が形成されているという点で第1の実施形態のランプ10と異なる。 In the lamp 10E of this modification, as shown in FIGS. 11 to 13, a groove 32 extending in the longitudinal direction of the base 30 is formed not on the back surface of the base 30 but on the surface of the base 30. It differs from the lamp 10 of the first embodiment.
 このような構成により、基台30の短手方向の端面及び裏面の全面をランプ筐体として外面に露出させることができるため、基台30を介してLEDモジュール50の熱を高効率でランプ外部に放熱することができる。 With such a configuration, it is possible to expose the entire end surface and back surface of the base 30 in the short direction to the outer surface as a lamp housing, so that the heat of the LED module 50 is efficiently transferred to the outside of the lamp through the base 30. Can dissipate heat.
 (変形例6)
 次に、本発明の第1の実施形態に係るランプの変形例6について、図14を用いて説明する。
(Modification 6)
Next, a sixth modification of the lamp according to the first embodiment of the present invention will be described with reference to FIG.
 図14は、口金60を除いた状態で本変形例のランプ10Fの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 14 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10F of this modification with the base 60 removed.
 本変形例のランプ10Fは、図14に示すように、図3Aに示すランプ10において、封止部材51に代えて拡散部材40Fを備えるとともに、拡散部材40に代えて蛍光体層70を備える。 In the lamp 10 shown in FIG. 3A, the lamp 10F of the present modification includes a diffusion member 40F in place of the sealing member 51 and a phosphor layer 70 in place of the diffusion member 40 in the lamp 10 shown in FIG. 3A.
 拡散部材40Fは、例えば透光性樹脂によって構成されており、LED53を封止するように形成される。拡散部材40Fは、光拡散機能を有する。例えば、透光性樹脂に光拡散微粒子を含有させたり、透光性樹脂の表面に微小凹凸を設けたりすることによって、拡散部材40Fに拡散機能を持たせることができる。 The diffusion member 40F is made of, for example, a translucent resin, and is formed to seal the LED 53. The diffusion member 40F has a light diffusion function. For example, the diffusing member 40F can be made to have a diffusing function by containing light diffusing fine particles in the light transmitting resin, or by providing fine asperities on the surface of the light transmitting resin.
 蛍光体層70は、リモートフォスファーであって、LED53と離れた位置に設けられている。蛍光体層70は、例えば、LED53の光を波長変換する蛍光体を含む蛍光体板である。 The phosphor layer 70 is a remote phosphor and is provided at a distance from the LED 53. The phosphor layer 70 is, for example, a phosphor plate including a phosphor that performs wavelength conversion of the light of the LED 53.
 このように、蛍光体層70をLED53(発光部)から離すことによって、温度上昇による蛍光体の変換効率の低下を抑制することができる。 As described above, by separating the phosphor layer 70 from the LED 53 (light emitting unit), it is possible to suppress a decrease in conversion efficiency of the phosphor due to a temperature rise.
 なお、本変形例において、LED53として、蛍光体含有樹脂(蛍光体層)を有しない表面実装(SMD:Surface Mount Device)型のLED素子を用いてもよい。 In addition, in this modification, you may use the surface mounting (SMD: Surface Mount Device) type LED element which does not have fluorescent substance containing resin (phosphor layer) as LED53.
 (変形例7)
 次に、本発明の第1の実施形態に係るランプの変形例7について、図15を用いて説明する。
(Modification 7)
Next, a seventh modification of the lamp according to the first embodiment of the present invention will be described with reference to FIG.
 図15は、口金60を除いた状態で本変形例のランプ10Gの一部(管軸方向の端部)を拡大した斜視図である。 FIG. 15 is an enlarged perspective view of a part (an end in the tube axis direction) of the lamp 10G of this modification with the base 60 removed.
 本変形例のランプ10Gは、図15に示すように、図3Aに示すランプ10において、拡散部材40及び封止部材51に代えて蛍光体層70Gを備えるとともに、透光性カバー20に代えて透光性カバー20Gを備える。 In the lamp 10 shown in FIG. 3A, as shown in FIG. 15, the lamp 10G of this modification is provided with a phosphor layer 70G in place of the diffusion member 40 and the sealing member 51, and in place of the translucent cover 20. A translucent cover 20G is provided.
 蛍光体層70Gは、長尺楕円筒の一部を長尺方向(管軸方向)に沿って切り欠くように構成されており、例えば断面形状が縦長楕円を半分にした形状となるように構成される。蛍光体層70Gは、LED53と離間するようにしてLED53を覆うように設けられる。蛍光体層70Gには、LED53の光を波長変換する蛍光体が含まれる。このように、蛍光体層70Gの断面形状を縦長半楕円とすることによって配光角を広げることができる。 The phosphor layer 70G is configured such that a part of the long elliptical cylinder is cut out along the long direction (the tube axis direction), and for example, the cross-sectional shape is a half long vertical ellipse. Be done. The phosphor layer 70 </ b> G is provided to cover the LEDs 53 so as to be separated from the LEDs 53. The phosphor layer 70 </ b> G includes a phosphor that performs wavelength conversion of the light of the LED 53. Thus, the light distribution angle can be expanded by making the cross-sectional shape of the phosphor layer 70G into a vertically long semi-elliptic shape.
 透光性カバー20Gは、長尺楕円筒の一部を長尺方向(管軸方向)に沿って切り欠くように構成されており、例えば断面形状が縦長楕円を半分にした形状となるように構成されている。透光性カバー20Gの断面形状と蛍光体層70Gの断面形状とは相似形状にすることができる。このように、透光性カバー20Gの断面形状を縦長半楕円とすることによって配光角を広げることができる。なお、透光性カバー20Gは、透光性カバー20と同様の材料を用いることができる。 The translucent cover 20G is configured such that a part of the long elliptical cylinder is cut out along the long direction (the tube axis direction), and for example, the cross-sectional shape is a half long vertical ellipse. It is configured. The cross-sectional shape of the translucent cover 20G and the cross-sectional shape of the phosphor layer 70G can be similar. Thus, a light distribution angle can be expanded by making the cross-sectional shape of translucent cover 20G into a longitudinally long semi-elliptic. The translucent cover 20G can be made of the same material as the translucent cover 20.
 このように、蛍光体層70G及び透光性カバー20Gの各々の断面形状を縦長半楕円とすることによって、広い配光角のランプを実現することができる。 Thus, a lamp with a wide light distribution angle can be realized by making the cross-sectional shape of each of the phosphor layer 70G and the translucent cover 20G into a vertically long semi-elliptic shape.
 なお、図15において、蛍光体層70GとLED53との間には空間領域が存在するが、この空間領域に透明樹脂等の透光性材料を充填させてもよい。 Although in FIG. 15 there is a space area between the phosphor layer 70G and the LED 53, this space area may be filled with a translucent material such as a transparent resin.
 また、本変形例では、透光性カバー20G及びは蛍光体層70Gの少なくとも一方が拡散部材として機能する。 Further, in the present modification, at least one of the translucent cover 20G and the phosphor layer 70G functions as a diffusion member.
 例えば、透光性カバー20Gを拡散部材として機能させる場合、上述のように光拡散材を含有させたり凹凸加工を施したり断面形状を多角形状にしたり等することによって透光性カバー20Gに拡散機能を持たせることができる。 For example, when the translucent cover 20G is made to function as a diffusion member, the diffusion function is made to the translucent cover 20G by containing the light diffusion material, performing asperity processing as described above, or making the cross-sectional shape polygonal. Can be
 また、蛍光体層70Gを拡散部材として機能させる場合は、例えば、蛍光体層70Gに光拡散材を含有すればよい。なお、蛍光体層70Gの内面又は外面に凹凸形状を形成することでも蛍光体層70Gに拡散機能を持たせることができる。 In addition, in the case of causing the phosphor layer 70G to function as a diffusion member, for example, the light diffusion material may be contained in the phosphor layer 70G. The fluorescent layer 70G can also have a diffusion function by forming an uneven shape on the inner surface or the outer surface of the fluorescent layer 70G.
 (第2の実施形態)
 次に、本発明の第1の実施形態に係るランプを、照明装置に適用した例について、図16を用いて説明する。
Second Embodiment
Next, an example in which the lamp according to the first embodiment of the present invention is applied to a lighting device will be described using FIG.
 図16は、本発明の第2の実施形態に係る照明装置の構成を示す斜視図である。 FIG. 16 is a perspective view showing a configuration of a lighting device according to a second embodiment of the present invention.
 本実施形態に係る照明装置100は、図16に示すように、上記第1の実施形態に係るランプ10と、照明器具110とを備える。このような照明装置100は、天井等に固定具を介して装着される。 The illuminating device 100 which concerns on this embodiment is equipped with the lamp 10 which concerns on the said 1st Embodiment, and the lighting fixture 110, as shown in FIG. Such a lighting device 100 is mounted on a ceiling or the like via a fixture.
 照明器具110は、ランプ10と電気的に接続され、かつ、ランプ10を保持する一対のソケット120と、ソケット120が取り付けられた器具本体130と、回路ボックス(図外)とを備える。器具本体130の内面は、ランプ10から発せられた光を所定方向(図16では下方)に反射させる反射面131となっている。なお、回路ボックスは、その内部に、図外のスイッチがオン状態ではランプ10に給電し、オフ状態では給電しない点灯回路を収納している。 The lighting fixture 110 is electrically connected to the lamp 10, and includes a pair of sockets 120 for holding the lamp 10, a fixture body 130 to which the socket 120 is attached, and a circuit box (not shown). The inner surface of the instrument body 130 is a reflective surface 131 that reflects the light emitted from the lamp 10 in a predetermined direction (downward in FIG. 16). Note that the circuit box accommodates therein a lighting circuit that supplies power to the lamp 10 when the switch outside the figure is on, and does not supply power when the switch is off.
 以上のように、本実施形態に係る照明装置100は、第1の実施形態に係るランプ10を用いているので、輝度ムラを抑制することができる。なお、第1の実施形態の各変形例のランプを用いてもよい。 As described above, since the lighting device 100 according to the present embodiment uses the lamp 10 according to the first embodiment, it is possible to suppress uneven brightness. In addition, you may use the lamp | ramp of each modification of 1st Embodiment.
 以上、本発明に係るランプ及び照明装置について、実施形態に基づいて説明したが、本発明は、これらの実施形態に限定されるものではない。本発明の要旨を逸脱しない範囲内で当業者が思いつく各種変形を施したものも本発明の範囲内に含まれる。また、発明の趣旨を逸脱しない範囲で、複数の実施の形態における各構成要素を任意に組み合わせてもよい。 As mentioned above, although the lamp | ramp and illuminating device which concern on this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. It is within the scope of the present invention to apply various modifications that those skilled in the art would think within the scope of the present invention. In addition, the components in the plurality of embodiments may be arbitrarily combined without departing from the spirit of the invention.
 例えば、上記の実施形態及び変形例において、発光素子としてLEDを例示したが、半導体レーザ等の半導体発光素子、又は、有機EL(Electro Luminescence)や無機EL等のEL素子、その他の固体発光素子を用いてもよい。 For example, in the above embodiment and modification, an LED is exemplified as a light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting elements You may use.
 また、上記実施形態及び変形例において、給電方式は片側給電方式であるとしたが、両方の側の口金とも受電ピンとする両側給電方式としても構わない。この場合、一方側の受電ピンも他方側の受電ピンも1ピンとするような構成でも構わないし、一方側の受電ピンも他方側の受電ピンも一対の受電ピンとして両側から交流電源を受電するような構成でも構わない。また、一対の受電ピンやアースピンは、棒状金属に限らず、平板金属等によって構成されても構わない。 In the embodiment and the modification, the feeding method is the one-sided feeding method. However, the both ends of the base may be the power feeding pins. In this case, the power receiving pin on one side and the power receiving pin on the other side may be set to one pin, and the power receiving pin on one side and the power receiving pin on the other side both receive AC power from both sides as a pair of power receiving pins. Any configuration may be used. Further, the pair of power receiving pins and the ground pins are not limited to rod-like metal, and may be made of flat plate metal or the like.
 また、上記実施形態及び変形例において、2つの口金60のうち一方を1本ピン(1ピン)とし、他方を2本ピン(2ピン)とする1ピン-2ピンの口金構造としたが、2つの口金60をいずれも2本ピン(2ピン)とする2ピン-2ピンの口金構造としてもよい。また、2ピンの口金としては、G13口金を用いることができる。また、口金60として、日本電球工業会によって規格化されたJEL801に準拠した直管形LEDランプのL形ピン口金を用いることもできる。 Further, in the above embodiment and the modification, the one-pin-two-pin base structure in which one of the two bases 60 is one pin (one pin) and the other is two pins (two pins) is used. A two-pin / two-pin base structure may be employed in which each of the two bases 60 has two pins (two pins). In addition, a G13 base can be used as a two-pin base. Further, as the base 60, it is also possible to use an L-shaped pin base of a straight tube type LED lamp conforming to JEL 801 standardized by the Japan Light Bulb Industry Association.
 また、上記実施形態及び変形例において、口金60は、直流電力を受電するように構成したが、交流電力を受電するように構成しても構わない。なお、口金60が交流電力を受電する場合、ランプ10に内蔵された点灯回路には、交流電力を直流電力に変換する回路が含まれる。 Moreover, in the said embodiment and modification, although the nozzle | cap | die 60 was comprised so that direct current power might be received, you may comprise so that alternating current power may be received. When the base 60 receives AC power, the lighting circuit built in the lamp 10 includes a circuit for converting AC power to DC power.
 また、上記の実施形態及び変形例において、LEDモジュールは基板上にLEDを直接実装したCOB型の構成としたが、これに限らない。例えば、樹脂成形された容器のキャビティ(凹部)の中にLEDチップを実装して当該キャビティ内に蛍光体含有樹脂を封入したSMD型のLED素子を発光素子として用いて、このSMD型のLED素子を基板上に複数個実装することで構成したLEDモジュールを用いても構わない。 Moreover, in said embodiment and modification, although the LED module set it as the structure of the COB type which mounted LED on a board | substrate directly, it does not restrict to this. For example, using an SMD type LED element in which an LED chip is mounted in a cavity (concave portion) of a resin-molded container and the phosphor-containing resin is sealed in the cavity, the SMD type LED element is used as a light emitting element You may use the LED module comprised by mounting two or more on a board | substrate.
 また、上記実施形態及び変形例において、ランプに3つのLEDモジュールが設けられているが、これに限らない。例えば、1つのLEDモジュールが設けられても構わない。また、LEDモジュールの実装基板の長さや形状、又は、実装するLEDの個数等は、適宜変更されても構わない。 Moreover, in the said embodiment and modification, although three LED modules are provided in the lamp | ramp, it does not restrict to this. For example, one LED module may be provided. In addition, the length and the shape of the mounting substrate of the LED module, or the number of LEDs to be mounted may be appropriately changed.
 また、上記実施形態及び変形例において、透光性カバーは、略半円筒形状によって構成したが、これに限らない。例えば、透光性カバーを、主開口が形成されていない円筒形状としても構わない。この場合、透光性カバーの少なくとも一方の端部は開放された端部開口とする必要があり、例えば、基台は、拡散部材、LEDモジュール及び点灯回路等が実装されて電気的接続も完了した後に、透光性カバーの端部開口から挿入されて透光性カバーに収容される。 Moreover, in the said embodiment and modification, although the translucent cover was comprised by substantially semi-cylindrical shape, it does not restrict to this. For example, the translucent cover may have a cylindrical shape in which the main opening is not formed. In this case, at least one end of the translucent cover needs to be an open end opening. For example, the base is mounted with a diffusion member, an LED module, a lighting circuit, etc., and electrical connection is also completed. Then, it is inserted from the end opening of the translucent cover and accommodated in the translucent cover.
 また、上記実施形態及び変形例において、封止部材は実装基板上の全てのLEDを一括封止するとしたが、これに限らない。例えば、1つの実装基板上に複数の封止部材が島状に設けられ、複数の封止部材のそれぞれが1又は複数のLEDを個別に封止してもよい。この場合、輝度ムラが発生し易くなるので、拡散部材による輝度ムラ抑制の効果が顕著になる。 Moreover, in the said embodiment and modification, although the sealing member carried out package sealing of all LED on a mounted substrate, it does not restrict to this. For example, a plurality of sealing members may be provided in an island shape on one mounting substrate, and each of the plurality of sealing members may individually seal one or more LEDs. In this case, since the luminance unevenness is likely to occur, the effect of the luminance unevenness suppression by the diffusion member becomes remarkable.
 本発明は、LED等の発光素子を用いたランプ、例えば直管形ランプとして有用であり、ランプを備える照明装置等において広く利用することができる。 INDUSTRIAL APPLICABILITY The present invention is useful as a lamp using a light emitting element such as an LED, for example, a straight tube lamp, and can be widely used in a lighting apparatus and the like provided with the lamp.
  10、10A、10B、10C、10D、10E、10F、10G  ランプ
  20、20A、20G  透光性カバー
  21  端部
  30  基台
  31  凹部
  32  溝
  33  段差部
  40、40F  拡散部材
  50  LEDモジュール
  51  封止部材
  52  実装基板
  53  LED
  54  配線
  55  静電保護素子
  56  電極端子
  57  ワイヤ
  60  口金
  61  受電ピン
  62  アースピン
  70、70G  蛍光体層
  100  照明装置
  110  照明器具
  120  ソケット
  130  器具本体
  131  反射面
10, 10A, 10B, 10C, 10D, 10E, 10G, lamps 20, 20A, 20G translucent cover 21 end 30 base 31 recess 32 groove 33 step 40, 40F diffusion member 50 LED module 51 sealing member 52 Mounting board 53 LED
54 Wiring 55 Electrostatic Protection Element 56 Electrode Terminal 57 Wire 60 Base 61 Power Receiving Pin 62 Arspin 70, 70G Phosphor Layer 100 Lighting Device 110 Lighting Fixture 120 Socket 130 Device Body 131 Reflective Surface

Claims (10)

  1.  長尺状のランプであって、
     発光素子と、前記発光素子が設けられた基板とを有する発光モジュールと、
     前記発光モジュールが設けられた凹部が表面に形成された長尺状の基台と、
     前記発光モジュールを覆うように構成された長尺状の透光性カバーと、
     前記凹部の内部又は前記凹部の上方に位置するように、前記発光モジュールと前記透光性カバーとの間に設けられ、前記発光素子から発せられる光を拡散する拡散部材とを備える
     ランプ。
    It is a long lamp,
    A light emitting module having a light emitting element and a substrate provided with the light emitting element;
    An elongated base on which a concave portion provided with the light emitting module is formed;
    An elongated translucent cover configured to cover the light emitting module;
    A lamp comprising: a diffusion member provided between the light emitting module and the light transmitting cover so as to be located inside the recess or above the recess, and diffusing the light emitted from the light emitting element.
  2.  前記基台の凹部の側壁には、段差部が形成されており、
     前記拡散部材は、板状であり、前記基台の凹部の開口の少なくとも一部を覆うように前記段差部上に載置されている
     請求項1に記載のランプ。
    A stepped portion is formed on the side wall of the recess of the base,
    The lamp according to claim 1, wherein the diffusion member has a plate shape and is placed on the stepped portion so as to cover at least a part of the opening of the recess of the base.
  3.  前記拡散部材は、樹脂であり、前記発光素子と接するように前記凹部内に設けられている
     請求項1に記載のランプ。
    The lamp according to claim 1, wherein the diffusion member is a resin, and is provided in the recess so as to be in contact with the light emitting element.
  4.  前記拡散部材は、前記基板の前記発光素子が設けられた部分の上方で拡散率が高く、前記基板の前記発光素子が設けられていない部分の上方で拡散率が低い
     請求項1~3のいずれか1項に記載のランプ。
    The diffusion member has a high diffusivity above the portion of the substrate provided with the light emitting element, and has a low diffusivity above the portion of the substrate where the light emitting element is not provided. Or the lamp described in paragraph 1.
  5.  前記基台の凹部の側面は、前記発光素子から発せられる光を前記凹部の開口に向けて反射する
     請求項1~4のいずれか1項に記載のランプ。
    The lamp according to any one of claims 1 to 4, wherein the side surface of the recess of the base reflects light emitted from the light emitting element toward the opening of the recess.
  6.  前記基台は、金属から構成され、
     前記拡散部材は、前記基台と接する
     請求項1~5のいずれか1項に記載のランプ。
    The base is made of metal,
    The lamp according to any one of claims 1 to 5, wherein the diffusion member is in contact with the base.
  7.  前記透光性カバーは、長尺円筒の一部を長尺方向に沿って切り欠いた主開口を有する切り欠き円筒部材であり、
     前記基台は、前記主開口を塞ぐように前記透光性カバーを保持する
     請求項1~6のいずれか1項に記載のランプ。
    The translucent cover is a cutout cylindrical member having a main opening in which a part of an elongated cylinder is cut out in a longitudinal direction,
    The lamp according to any one of claims 1 to 6, wherein the base holds the translucent cover so as to close the main opening.
  8.  前記基台には、前記透光性カバーをスライド可能に保持する溝が形成されている
     請求項7に記載のランプ。
    The lamp according to claim 7, wherein a groove for slidably holding the light transmitting cover is formed on the base.
  9.  前記透光性カバーは、ガラス又は樹脂から構成され、前記発光素子から発せられる光を拡散する
     請求項1~8のいずれか1項に記載のランプ。
    The lamp according to any one of claims 1 to 8, wherein the light transmitting cover is made of glass or resin and diffuses light emitted from the light emitting element.
  10.  請求項1~9のいずれか1項に記載のランプを備える
     照明装置。
    A lighting device comprising the lamp according to any one of claims 1 to 9.
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JPWO2014006901A1 (en) 2016-06-02

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