CN204257706U

CN204257706U - A kind of LED light source encapsulating structure

Info

Publication number: CN204257706U
Application number: CN201420632721.XU
Authority: CN
Inventors: 王文娟
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-10-29
Filing date: 2014-10-29
Publication date: 2015-04-08
Anticipated expiration: 2024-10-29

Abstract

A kind of LED light source encapsulating structure, comprise stent substrate, circuit layer, flip-chip and transparent adhesive tape water layer, flip-chip is provided with positive and negative two electrodes, and circuit layer is provided with input electrode and output electrode; Many flip-chips are connected in series composition flip-chip string, in region between the series-parallel access input electrode of many groups flip-chip and output electrode, the positive pole of flip-chip string is connected with input electrode, the negative pole of flip-chip string is connected with output electrode, and flip-chip is fixed on circuit layer upper surface by the metal of high thermal conductivity coefficient; The upper surface spraying layer of fluorescent powder layer of flip-chip.The utility model improves heat dispersion, prevent the flip-chip temperature that is enclosed in transparent adhesive tape water layer too high, effectively reduce the temperature of flip-chip, prevent from damaging flip-chip, improve the stability of product, between flip-chip, become matrix to arrange, improve the luminous flux of light source, increase the propagation distance of light source, reduce costs.

Description

A kind of LED light source encapsulating structure

Technical field

The utility model relates to field of LED illumination, particularly relates to a kind of LED light source encapsulating structure.

Background technology

LED light source in the market, it is nearly all the conventional point electrode chip adopted that encapsulating structure comprises SMD and integrated COB, then the mode by gold thread makes chip and chip, chip and substrate carry out circuit and link the light source encapsulated, this traditional packaged type is because use more fragile gold thread, make the dead lamp of product, short-circuit risks improves greatly, and the chip of this product uses and fixes compared with the elargol of low thermal conductivity or insulating cement, make the thermal diffusivity of product poor, and it is high to make cost.Simultaneously chip in the course of the work easy because of chip heating excessive, heat can not distribute in time, and causes chip cisco unity malfunction.

Summary of the invention

In view of this, the utility model provides the LED light source encapsulating structure that a kind of light stability, heat-sinking capability are strong, cost is low.

The design that the utility model is taked is: a kind of LED light source encapsulating structure, comprise stent substrate, be laid on the circuit layer of substrate upper surface, be welded on the flip-chip of circuit layer upper surface and be coated on the circuit layer of substrate upper surface for base plate for packaging upper surface and the transparent adhesive tape water layer of flip-chip, flip-chip is provided with positive and negative two electrodes, and described circuit layer is provided with input electrode and output electrode; Many flip-chips are connected in series composition flip-chip string, in region between the series-parallel access input electrode of many groups flip-chip and output electrode, the positive pole of flip-chip string is connected with input electrode, the negative pole of flip-chip string is connected with output electrode, and flip-chip is fixed on circuit layer upper surface by the metal of high thermal conductivity coefficient; The upper surface spraying layer of fluorescent powder layer of flip-chip.

As improvement of the present utility model, described input electrode and output electrode arcuation symmetrically.

As improvement of the present utility model, described substrate is with alumina ceramic plate or aluminium sheet or copper coin.

As improvement of the present utility model, the metal of described high thermal conductivity coefficient is tin cream or elargol.

As further improvement of the utility model, described tin cream or elargol adopt bonder or steel mesh printing to be placed on stent substrate.

As further improvement of the utility model, the surface of described transparent adhesive tape water layer is arcuation convex surface.

Compared with prior art, the metal of flip-chip high thermal conductivity coefficient of the present utility model is connected with circuit layer, the heat energy that flip-chip can be distributed passes to in stent substrate by metal in time, by stent substrate, heat energy is distributed, improve heat dispersion, prevent the flip-chip temperature that is enclosed in transparent adhesive tape water layer too high, effectively reduce the temperature of flip-chip, prevent from damaging flip-chip, improve the stability of product, matrix is become to arrange between flip-chip, improve the luminous flux of light source, make light source more stable, surface adopts convex design can increase the propagation distance of light source, silver and tin is utilized to be connected between flip-chip and between flip-chip with circuit layer, reduce costs.

Accompanying drawing explanation

Fig. 1 is three-dimensional structure diagram of the present utility model.

Fig. 2 is the A-A face cutaway view in Fig. 1.

Embodiment

In order to allow those skilled in the art understand the technical solution of the utility model better, below in conjunction with accompanying drawing, the utility model is further elaborated.

As depicted in figs. 1 and 2, a kind of LED light source encapsulating structure, comprises stent substrate 1, circuit layer, flip-chip 3 and transparent adhesive tape water layer 4.In order to the heat distributed by chip better, more timely, improve heat dispersion, prevent the chip excessive then flip-chip that generates heat from burning, the stent substrate that uses adopts the alumina ceramic plate of perfect heat-dissipating or aluminium sheet or copper coin.The laying that circuit layer 2 is smooth is also fixed on substrate 1 upper surface.In order to better fix the position of flip-chip at circuit layer, prevent from misplacing during welding, last layer white welding resistance oil is coated with at circuit welding region, flip-chip 3 is fixed on circuit layer 2 by the metal 5 of high thermal conductivity coefficient and is communicated with circuit layer 2, make the metal 5 of this high thermal conductivity coefficient both can be communicated with flip-chip 3, thermal energy conduction flip-chip 3 can distributed again, to stent substrate 1, improves heat dispersion, reduces the temperature of flip-chip.The metal 5 of this high thermal conductivity coefficient is adopted as tin cream or elargol, and is printed on circuit layer 2 by bonder or steel mesh.Circuit layer is provided with the input electrode 21 and output electrode 22 that are communicated with flip-chip.Input electrode 21 and output electrode 22 and flip-chip coupling part arcuation symmetrically, make to form certain region between input electrode 21 and output electrode 22.In order to improve luminous flux, adopt between many flip-chips 3 and be mutually composed in series flip-chip string, then by organize more flip-chip connection in series-parallel access input electrode 21 and output electrode 22 between region in, the positive pole of flip-chip string is connected with input electrode 21, the negative pole of flip-chip string is connected with output electrode 22, forms a circuit be communicated with.The arrangement in matrix between flip-chip in region between input electrode 21 and output electrode 22, this arrangement can improve the luminous flux of LED.At the upper surface of flip-chip spraying layer of fluorescent powder layer, it is made to form the light source of different color.The upper surface coating layer of transparent glue layer of stent substrate, circuit layer and flip-chip to be encapsulated in stent substrate 1 by this transparent adhesive tape water layer completely, form LED lamp source.In order to make light source better to spread, the outer surface of transparent adhesive tape water layer being encapsulated into arcuation convex surface, utilizing convex surface principle to increase the propagation distance of light source.

The glue that the glue that in above embodiment, transparent adhesive tape water layer uses can be commonly used for LED light source encapsulation rooms such as polyurethane pouring sealant, PU polyurethane adhesive, polyurethane adhesive glue, does not enumerate explanation again.

It is more than the utility model preferably implementation; it should be noted that; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change and are out of shape the protection range that all should belong to the claim appended by the utility model.

Claims

1. a LED light source encapsulating structure, it is characterized in that, comprise stent substrate (1), be laid on the circuit layer (2) of substrate upper surface, be welded on the flip-chip (3) of circuit layer (2) upper surface and be coated on the circuit layer of substrate upper surface for base plate for packaging upper surface and the transparent adhesive tape water layer (4) of flip-chip, flip-chip (2) is provided with positive and negative two electrodes, and described circuit layer (2) is provided with input electrode (21) and output electrode (22); Many flip-chips are connected in series composition flip-chip string, in region between the series-parallel access input electrode (21) of many groups flip-chip and output electrode (22), the positive pole of flip-chip string is connected with input electrode (21), the negative pole of flip-chip string is connected with output electrode (22), and flip-chip (3) is fixed on circuit layer (2) upper surface by the metal (5) of high thermal conductivity coefficient; Upper surface spraying layer of fluorescent powder layer (6) of flip-chip (3).

2. LED light source encapsulating structure according to claim 1, is characterized in that, described input electrode (21) and output electrode (22) arcuation symmetrically.

3. LED light source encapsulating structure according to claim 1, is characterized in that, described substrate (1) is with alumina ceramic plate or aluminium sheet or copper coin.

4. LED light source encapsulating structure according to claim 1, is characterized in that, the metal (5) of described high thermal conductivity coefficient is tin cream or elargol.

5. LED light source encapsulating structure according to claim 4, is characterized in that, described tin cream or elargol adopt bonder or steel mesh printing to be placed on stent substrate (1).

6. LED light source encapsulating structure according to claim 1, is characterized in that, the surface of described transparent adhesive tape water layer (4) is arcuation convex surface.