CN207852729U - A kind of double-colored temperature LED light sources of upside-down mounting COB - Google Patents
A kind of double-colored temperature LED light sources of upside-down mounting COB Download PDFInfo
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- CN207852729U CN207852729U CN201820048085.4U CN201820048085U CN207852729U CN 207852729 U CN207852729 U CN 207852729U CN 201820048085 U CN201820048085 U CN 201820048085U CN 207852729 U CN207852729 U CN 207852729U
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- upside
- down mounting
- fluorescent glue
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Abstract
The utility model discloses a kind of double-colored temperature LED light sources of upside-down mounting COB, including flip-chip substrate, it sets there are two and more than two upside-down mounting blue chips and is connect with upside-down mounting blue chip on flip-chip substrate, the first fluorescent glue is coated with by the first mask plate respectively on adjacent upside-down mounting blue chip and the second fluorescent glue is coated with by the second mask plate, spacing between adjacent flip-chip blue chip is 0.1~1mm, the thickness of first fluorescent glue is 0.1~0.5mm, and the thickness of the second fluorescent glue is 0.1~0.5mm.Adjacent upside-down mounting blue chip sprays the first fluorescent glue and the second fluorescent glue respectively in the utility model, and then realizes double-colored temperature light extraction in the same area, reduces the dosage of fluorescent glue, reduces production cost, and simple to operate, improve product efficiency；First fluorescent glue, the thickness of the second fluorescent glue are very thin, improve the heat sinking function of LED light source, extend service life；Spacing between adjacent flip-chip blue chip is extremely narrow, and then realizes high density light-out effect.
Description
Technical field
The utility model is related to a kind of double-colored temperature LED light sources of upside-down mounting COB.
Background technology
Chip in light source luminescent area is separated into two or more areas by existing double-colored temperature LED light source by box dam glue
Then just white or warm white fluorescent glue is filled out in domain by dispensing in different zones respectively, and chip is usually formal dress blue chip,
Need bonding wire, colloid thickness is thicker, and heat dissipation performance is poor, affects the service life of LED light source, and the spacing between chip and chip compared with
Greatly, it cannot achieve small size high density light extraction.
The above deficiency, has much room for improvement.
Utility model content
In order to overcome the shortcomings of that existing technology, the utility model provide a kind of double-colored temperature LED light sources of upside-down mounting COB.
Technical solutions of the utility model are as described below：
A kind of double-colored temperature LED light sources of upside-down mounting COB, including flip-chip substrate, set on the flip-chip substrate there are two and two with
On upside-down mounting blue chip and connect with the upside-down mounting blue chip, pass through first respectively on the adjacent upside-down mounting blue chip
Mask plate is coated with the first fluorescent glue and is coated with the second fluorescent glue by the second mask plate, the adjacent upside-down mounting blue chip
Between spacing be 0.1~1mm, the thickness of first fluorescent glue is 0.1~0.5mm, and the thickness of second fluorescent glue is
0.1~0.5mm.
Further, the spacing between the adjacent upside-down mounting blue chip is 0.1~0.3mm.
Further, the thickness of first fluorescent glue is 0.1~0.2mm, the thickness of second fluorescent glue is 0.1~
0.2mm。
Further, the colour temperature after the first fluorescent glue light extraction is 5000~6500K.
Further, the colour temperature after the second fluorescent glue light extraction is 2700~4000K.
Further, the copper foil circuit of two-way control, the bottom of the upside-down mounting blue chip are distributed on the flip-chip substrate
Portion is equipped with metal electrode, and the upside-down mounting blue chip is connected to by tin cream on the flip-chip substrate, the metal electrode and institute
State copper foil circuit connection.
Further, the material of the flip-chip substrate is superconduction aluminium, and the thermal coefficient of the superconduction aluminium is 6~8W/ (m
K)。
According to the utility model of said program, advantage is：
(1) two different mask plates covering upside-down mounting blue chips are respectively adopted, then spray the first fluorescent glue, second glimmering
Optical cement realizes double-colored temperature light extraction on upside-down mounting blue chip in the same area, reduces the dosage of fluorescent glue, reduces
Production cost, and it is simple to operate, improve product efficiency；
(2) first fluorescent glues, the thickness of the second fluorescent glue are very thin, improve the heat sinking function of LED light source, extend use
Service life；
(3) spacing between adjacent flip-chip blue chip is extremely narrow, and then realizes high density light-out effect.
Description of the drawings
Fig. 1 is the vertical view of the utility model.
Fig. 2 is the side view of the utility model.
Fig. 3 is the part A enlarged drawing in Fig. 2.
Fig. 4 is the first mask plate structure schematic diagram of the utility model.
Fig. 5 is the second mask plate structure schematic diagram of the utility model.
Reference numeral is as follows in the figure：
1- flip-chip substrates；2- upside-down mounting blue chips；The first fluorescent glues of 3-；The second fluorescent glues of 4-；The first mask plates of 5-；6-
Two mask plates.
Specific implementation mode
Below in conjunction with the accompanying drawings and the utility model is further described in embodiment：
Term " first ", " second " are used for description purposes only, be not understood to indicate or imply relative importance or
Implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or imply
Ground includes one or more this feature.
It please refers to Fig.1 to Fig. 5, a kind of double-colored temperature LED light sources of upside-down mounting COB, including flip-chip substrate 1, flip-chip substrate 1 are equipped with
Two and more than two upside-down mounting blue chips 2 are simultaneously connect with upside-down mounting blue chip 2, on adjacent upside-down mounting blue chip 2 respectively
It is coated with the first fluorescent glue 3 by the first mask plate 5 and the second fluorescent glue 4 is coated with by the second mask plate 6, adjacent flip-chip is blue
Spacing between optical chip 2 is 0.1~1mm, and the thickness of the first fluorescent glue 3 is 0.1~0.5mm, the thickness of the second fluorescent glue 4
For 0.1~0.5mm.
The operation principle of the double-colored temperature LED light sources of upside-down mounting COB provided in this embodiment is：Set on flip-chip substrate 1 there are two and
Two different mask plates covering upside-down mounting blue chips 2 are respectively adopted in more than two upside-down mounting blue chips 2, then spray the
One fluorescent glue 3, the second fluorescent glue 4 realize double-colored temperature light extraction on upside-down mounting blue chip 2 in the same area；Due to
One fluorescent glue 3, the thickness of the second fluorescent glue 4 are very thin, are 0.1~0.5mm, and then improve the heat sinking function of LED light source；By
Spacing between adjacent flip-chip blue chip 2 is extremely narrow, is 0.1~1mm, and then improve out optical density.
The double-colored temperature LED light sources of upside-down mounting COB provided in this embodiment have the beneficial effect that：
(1) two different mask plate covering upside-down mounting blue chips 2 are respectively adopted, then spray the first fluorescent glue 3, second
Fluorescent glue 4 realizes double-colored temperature light extraction on upside-down mounting blue chip 2 in the same area, reduces the dosage of fluorescent glue, drops
Low production cost, and it is simple to operate, improve product efficiency；
(2) first fluorescent glues 3, the thickness of the second fluorescent glue 4 are very thin, improve the heat sinking function of LED light source, extending makes
Use the service life；
(3) spacing between adjacent flip-chip blue chip 2 is extremely narrow, and then realizes high density light-out effect.
Preferably, the spacing between adjacent flip-chip blue chip 2 is 0.1~0.3mm.Adjacent flip-chip blue chip it
Between spacing be 0.1~0.3mm, further improve the light extraction density effect of LED light source.
Preferably, the thickness of the first fluorescent glue 3 is 0.1~0.2mm, and the thickness of the second fluorescent glue 4 is 0.1~0.2mm.The
One fluorescent glue 3, the second fluorescent glue 4 thickness be 0.1~0.2mm, the heat sinking function of LED light source is further improved, into one
Step extends service life.
Preferably, the colour temperature after 3 light extraction of the first fluorescent glue is 5000~6500K.
Preferably, the colour temperature after 4 light extraction of the second fluorescent glue is 2700~4000K.
Preferably, the copper foil circuit of two-way control is distributed on flip-chip substrate 1, the bottom of upside-down mounting blue chip 2 is equipped with gold
Belong to electrode, upside-down mounting blue chip 2 is connected to by tin cream on flip-chip substrate 1, and metal electrode is connect with copper foil circuit.In upside-down mounting base
It is logical after 2 rule of upside-down mounting blue chip is placed on tin cream by bonder later by silk-screen printing high temperature tin cream on plate 1
It crosses Reflow Soldering and melts tin and fix, and the metal electrode of 2 bottom of upside-down mounting blue chip is connect with copper foil circuit.Using tin cream by upside-down mounting
Blue chip 2 is fixed on flip-chip substrate 1, eliminates bonding wire link and box dam rubber ring section, saves a large amount of talent's machine cost,
And it is simple to operate.
Preferably, the material of flip-chip substrate 1 is superconduction aluminium, and the thermal coefficient of superconduction aluminium is 6~8W/ (mK).With excellent
Different heat conductivility.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Illustrative description is carried out to the utility model patent above in conjunction with attached drawing, it is clear that the reality of the utility model patent
Now be not subject to the restrictions described above, if use the utility model patent methodology and technical solution carry out it is various
Improve, or it is not improved the design of the utility model patent and technical solution are directly applied into other occasions, in this reality
With in novel protection domain.
Claims (7)
1. a kind of double-colored temperature LED light sources of upside-down mounting COB, it is characterised in that：Including flip-chip substrate, set on the flip-chip substrate there are two
And more than two upside-down mounting blue chips and connect with the upside-down mounting blue chip, on the adjacent upside-down mounting blue chip respectively
It is coated with the first fluorescent glue by the first mask plate and the second fluorescent glue is coated with by the second mask plate, the adjacent upside-down mounting is blue
Spacing between optical chip is 0.1~1mm, and the thickness of first fluorescent glue is 0.1~0.5mm, second fluorescent glue
Thickness be 0.1~0.5mm.
2. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：The adjacent upside-down mounting blue chip
Between spacing be 0.1~0.3mm.
3. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：The thickness of first fluorescent glue is
The thickness of 0.1~0.2mm, second fluorescent glue are 0.1~0.2mm.
4. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：After the first fluorescent glue light extraction
Colour temperature is 5000~6500K.
5. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：After the second fluorescent glue light extraction
Colour temperature is 2700~4000K.
6. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：It is distributed on the flip-chip substrate double
The bottom of the copper foil circuit of road control, the upside-down mounting blue chip is equipped with metal electrode, and the upside-down mounting blue chip passes through tin cream
It is connected on the flip-chip substrate, the metal electrode is connect with the copper foil circuit.
7. the double-colored temperature LED light sources of upside-down mounting COB as described in claim 1, it is characterised in that：The material of the flip-chip substrate is super
Aluminium is led, the thermal coefficient of the superconduction aluminium is 6~8W/ (mK).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048085.4U CN207852729U (en) | 2018-01-12 | 2018-01-12 | A kind of double-colored temperature LED light sources of upside-down mounting COB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820048085.4U CN207852729U (en) | 2018-01-12 | 2018-01-12 | A kind of double-colored temperature LED light sources of upside-down mounting COB |
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| Publication Number | Publication Date |
|---|---|
| CN207852729U true CN207852729U (en) | 2018-09-11 |
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ID=63418066
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820048085.4U Active CN207852729U (en) | 2018-01-12 | 2018-01-12 | A kind of double-colored temperature LED light sources of upside-down mounting COB |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047824A (en) * | 2019-04-04 | 2019-07-23 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and its manufacturing method |
| CN110137163A (en) * | 2019-04-04 | 2019-08-16 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and manufacturing method |
| CN110473866A (en) * | 2019-08-27 | 2019-11-19 | 谷麦光电科技股份有限公司 | Double-colored temperature auto lamp illuminating source packaging structure of one kind and preparation method thereof |
| WO2023201929A1 (en) * | 2022-04-21 | 2023-10-26 | 深圳市同一方光电技术有限公司 | Glue spraying method for dual-color dimmable light source |
-
2018
- 2018-01-12 CN CN201820048085.4U patent/CN207852729U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047824A (en) * | 2019-04-04 | 2019-07-23 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and its manufacturing method |
| CN110137163A (en) * | 2019-04-04 | 2019-08-16 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and manufacturing method |
| CN110473866A (en) * | 2019-08-27 | 2019-11-19 | 谷麦光电科技股份有限公司 | Double-colored temperature auto lamp illuminating source packaging structure of one kind and preparation method thereof |
| WO2023201929A1 (en) * | 2022-04-21 | 2023-10-26 | 深圳市同一方光电技术有限公司 | Glue spraying method for dual-color dimmable light source |
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