CN113130720A - Sub-millimeter light emitting diode crystal grain sealing method with optical effect - Google Patents
Sub-millimeter light emitting diode crystal grain sealing method with optical effect Download PDFInfo
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- CN113130720A CN113130720A CN202110397789.9A CN202110397789A CN113130720A CN 113130720 A CN113130720 A CN 113130720A CN 202110397789 A CN202110397789 A CN 202110397789A CN 113130720 A CN113130720 A CN 113130720A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention provides a sub-millimeter light emitting diode crystal grain sealing method with optical effect, which comprises providing a transparent template with a plurality of optical recess structures; filling the optical cavity structure with light-cured colloid; aligning and pressing the transparent template and the substrate bearing the crystal grains mutually to ensure that the optical cavity structures correspond to the sub-millimeter light-emitting diode crystal grains respectively, and the optical curing colloid coats the sub-millimeter light-emitting diode crystal grains; irradiating UV light to solidify the light-cured colloid, and packaging the light-cured colloid and the sub-millimeter light-emitting diode crystal grains into a whole; and separating and removing the transparent template from top to bottom. Therefore, the effect of packaging the colloid with optical effect on each crystal grain at one time is achieved, the high efficiency is achieved, the optical structure with the required shape can be formed on each crystal grain, and the light emitting effect of the subsequent application is in line with the expectation.
Description
Technical Field
The invention relates to the field of sub-millimeter light emitting diodes, in particular to a sub-millimeter light emitting diode crystal grain sealing method with an optical effect and a reflective display device thereof.
Background
The sub-millimeter light emitting diode (referred to as Mini LED) means an LED with a die size of 100 to 250 μm, and is an optical product between the conventional LED and the Micro LED.
Because the Mini LED has a small size, the method of packaging the die is often omitted, and the packaging operation for blocking the external moisture is usually performed by dispensing. In addition, in practical applications, the number of particles used by the Mini LED at one time is large, and similarly, many Mini LED dies are arranged to fill the whole panel-shaped carrier, so there is also a process of performing glue coating on all the Mini LED dies after the Mini LED dies are arranged.
However, no matter the dispensing or glue coating technique, there are still many defects when the micro-sized LED is implemented to block the external moisture. The biggest problem is that the colloid is only covered outside the Mini LED die, and cannot be molded, so the colloid has only a pure protection function and does not have any optical effect. Therefore, in the current process technology, secondary optical components such as lamp cups are often required to be arranged to achieve the effect of adjusting the light emitting state of each Mini LED. On the other hand, the colloid setting technology is not easy to control the thickness and the covering state of the colloid, and brings great inconvenience to the subsequent secondary optical design.
In summary, the conventional Mini LED product still needs to be packaged to block water and oxygen, and a secondary lamp cup or a lamp panel is additionally added to complement the secondary optical design, so that the actual application architecture of the Mini LED is complicated and the efficiency is low. Therefore, the inventor integrates the abundant experience of the related industries for many years, conceives and provides a sub-millimeter light emitting diode crystal grain sealing method with an optical effect so as to solve the defects of the prior art.
Disclosure of Invention
The invention aims to overcome the defect that the existing sub-millimeter light emitting diode sealing method cannot mold colloid, so that the colloid has only a simple protection function and does not have any optical effect, and provides the sub-millimeter light emitting diode crystal grain sealing method which can achieve the optical structure effect with the optical effect formed by packaging a large number of sub-millimeter light emitting diode crystal grains at one time.
The invention solves the technical problems through the following technical scheme:
a sub-millimeter light emitting diode crystal grain sealing method with optical effect is used for sealing a plurality of sub-millimeter light emitting diode crystal grains, wherein the sub-millimeter light emitting diode crystal grains are arranged on a substrate at intervals, and is characterized by comprising the following steps: providing a transparent template, wherein the transparent template is provided with a plurality of optical cavity structures; filling a photo-curing colloid in each optical recess structure; aligning and pressing the transparent template and the substrate to each other, so that each optical cavity structure corresponds to each sub-millimeter light-emitting diode crystal grain, and the optical curing colloid in each optical cavity structure covers each sub-millimeter light-emitting diode crystal grain; irradiating UV light to solidify the light-cured colloid, and packaging the light-cured colloid and the sub-millimeter light-emitting diode crystal grains into a whole; and separating up and down to remove the transparent template. Therefore, the sealing method can achieve the effect of forming an optical structure with an optical effect by packaging a large number of sub-millimeter light-emitting diode crystal grains at one time, and remove components outside the curing colloid in a demoulding step, so that only the solidified light-curing colloid is arranged outside the sub-millimeter light-emitting diode crystal grains, and the one-time optical structure not only can improve the process efficiency, but also can enable the light-emitting effect of the manufactured product to be more easily expected.
Preferably, the bottom surfaces of the optical cavity structures are respectively provided with a convex part, so that the top side of the light-cured colloid coated on the sub-millimeter light-emitting diode crystal grain is provided with a concave structure after curing, and thus a concave primary optical colloid can be formed on the sub-millimeter light-emitting diode crystal grain, and the light spreading efficiency is further achieved.
Preferably, the protrusion of each optical cavity structure is a cone with an inner concave surface, so that the colloid coated on the outer side of the sub-millimeter light emitting diode crystal grain has a better optical adjustment effect.
Preferably, the optical cavity structure is formed on the transparent template by means of extrusion or injection molding, so as to have better structural dimensional accuracy and production speed.
In addition, in order to make the light-cured adhesive coated on the sub-millimeter light-emitting diode die have a more precise structural shape, preferably, the transparent template has a material extruding inclined plane on the periphery of the optical cavity structure, and each material extruding inclined plane is formed by extending the edge of each optical cavity structure outwards so as to guide the material extruding inclined plane to the periphery of the die when the glue overflow condition is generated.
In addition, in order to make the sub-millimeter light emitting diode die more easily form a perfect required light emitting state through the light curing adhesive after being coated by the light curing adhesive, preferably, the bottom surfaces of the optical cavity structures are respectively provided with a protruding part, the top ends of the protruding parts are planes, and when the cross-sectional length of the sub-millimeter light emitting diode die is L, the length L of the top ends of the cross-sections of the protruding parts is 1/4L-1/3L. Therefore, the photo-curing colloid has larger alignment margin, and is beneficial to production and manufacture.
The positive progress effects of the invention are as follows: the sub-millimeter light emitting diode crystal grain sealing method with the optical effect provided by the invention provides a processing method with better processing efficiency and better optical adjustment efficiency for the sub-millimeter light emitting diode. By the sealing method, a large number of sub-millimeter light emitting diode crystal grains can be sealed at one time, and a primary optical colloid with an optical effect and coated on the crystal grains is directly formed, so that the method is different from the prior art of combining the traditional LED at one time and is equivalent to a light guide material with a plurality of secondary lamp cups. The invention utilizes the transparent template to be filled with the light-cured colloid with high refractive index, and then the colloid is coated outside the crystal grains by irradiating UV light to be solidified, so that the transparent template can be removed, and the primary optical structure with optical effect is sealed for a large number of sub-millimeter light-emitting diode crystal grains at one time, thereby being a brand-new application technology which is not seen in the related fields at present. Furthermore, in order to make the method more convenient to implement and to make the colloid prepared by the method have better optical adjustment effect on the sub-millimeter light emitting diode crystal grain, the invention also provides detailed technical characteristics, such as detailed structural mode of optical cavity structure and other implementation states of the manufacturing mode of transparent mold, and the like, and the contents are described in the above paragraphs.
Drawings
FIG. 1 is a flow chart of a method according to a preferred embodiment of the present invention.
Fig. 2 is a schematic perspective view illustrating a step of filling a light curable adhesive into a transparent template according to a preferred embodiment of the present invention.
Fig. 3 is a partial cross-sectional view of the transparent template filled with the light-curable adhesive according to the preferred embodiment of the invention.
FIG. 4 is a schematic diagram of the application of the transparent template and the substrate to each other according to the preferred embodiment of the present invention.
Fig. 5 is a partial cross-sectional view illustrating a transparent template and a substrate after being laminated according to a preferred embodiment of the invention.
FIG. 6 is a partial cross-sectional view of the mold release application after the transparent template and the substrate are separated from each other in a vertical direction according to the preferred embodiment of the present invention.
Fig. 7 is a partial cross-sectional view of a transparent template and a substrate after being bonded according to another embodiment of the present invention.
Detailed Description
The invention will be more clearly and completely described by way of example in the following with reference to the accompanying drawings.
Before the advent of sub-millimeter light emitting diodes, a combined application technique of a small-sized LED point light source and a light guide plate is to use a light-taking structure corresponding to a conventional LED point light source on the light guide plate, align and assemble the light guide plate and the conventional LED point light source, and adjust the light-emitting state of the point light source by using the light-taking structure of the light guide plate as a secondary optical lamp cup or lens structure. When the sub-millimeter light emitting diode appears, the related optical products are only dispensed or coated with glue one by one, so that a colloid structure for blocking moisture is formed on the sub-millimeter light emitting diode. If the optical effect of the sub-millimeter light emitting diode needs to be adjusted, because the colloid cannot be molded in the above manner, the conventional technical concept of the small-sized conventional LED is still adopted at present, and secondary optical structures such as a lamp cup are arranged, so that light penetrates through the protective colloid and then is adjusted by the lamp cup to form a required light emitting state. Some secondary optical components with special appearance design can be manufactured only by cutting with a cutting die and the like. Therefore, most of the conventional technologies only use the light guide plate body as the secondary optical structure, and the design of some optical structures is suggested without the possibility of demolding.
Based on the increasing demand of sub-millimeter light emitting diodes in recent years by manufacturers, the inventors of the present invention have devised how to rapidly and easily manufacture a light providing product using sub-millimeter light emitting diode dies, and at the same time, avoid the design and process inconvenience of the secondary optical components and the high cost disadvantage, and thus, provide a more excellent optical product. The present inventors have proposed a method for molding a sub-millimeter light emitting diode die with optical effect, so as to directly and once package a sub-millimeter light emitting diode die with an optical structure, which will be described in detail below with the following text in conjunction with the drawings, wherein the dimensions, ratios, shapes, etc. of the structures illustrated in the drawings are only for the purpose of schematically illustrating the technical features of the present invention, and do not represent actual dimensional ratios.
Please refer to fig. 1, which is a flowchart illustrating a method according to the present embodiment. The sub-millimeter light emitting diode grain sealing method with optical effect is used for sealing a plurality of sub-millimeter light emitting diode grains 9, wherein the sub-millimeter light emitting diode grains 9 are arranged on a substrate P at intervals. The molding method includes the steps of providing a transparent template 1, wherein the transparent template has a plurality of optical cavity structures 10 (step S10). Each optical cavity structure 10 of the transparent template 1 is disposed corresponding to the arrangement state of the sub-millimeter light emitting diode die 9, and is exemplified by a matrix arrangement in the present embodiment. The shape of the optical cavity structure 10 can be designed according to various dimming requirements, and only the shape condition for demolding is required.
Next, a light-curing adhesive 2 is filled into each optical cavity structure 10 (step S11), please refer to fig. 2 to 3, which are a schematic perspective view of the transparent template of the present embodiment and a schematic partial cross-sectional view of the transparent template after the light-curing adhesive is filled therein. In fig. 2, a part of the optical cavity structures 10 is filled with the photo-curing adhesive 2, in the operation step, the photo-curing adhesive 2 is filled into each optical cavity structure 10 until each optical cavity structure 10 has the photo-curing adhesive 2, and fig. 3 is also referred to fig. 3, which shows a state after the optical cavity structures 10 are filled with the photo-curing adhesive 2. After the optical cavity structures 10 are filled with the light-curing adhesive 2, the transparent template 1 and the substrate P are aligned and pressed together, so that the optical cavity structures 10 correspond to the sub-millimeter light-emitting diode dies 9, respectively, and the light-curing adhesive 2 in the optical cavity structures 10 covers the sub-millimeter light-emitting diode dies 9 (step S12). Please refer to fig. 4-5, which are schematic views of an application of the embodiment of aligning the transparent template and the substrate and a schematic view of a partial cross section of pressing the transparent template and the substrate, in which, in the implementation, the substrate P may be covered from top to bottom on the transparent template 1 for pressing, or the transparent template 1 may be covered from bottom to top on the substrate P for pressing, wherein the photo-curing adhesive 2 has viscosity in nature, so that the dripping problem is not generated.
After the substrate P and the transparent template 1 are aligned and pressed, the light-cured encapsulant 2 is solidified by irradiating UV light, and the light-cured encapsulant 2 and the sub-millimeter light-emitting diode die 9 are encapsulated as a whole (step S13). Referring to fig. 5, after the transparent template 1 and the substrate P are pressed together to make the light-cured adhesive 2 respectively cover the sub-millimeter light-emitting diode die 9, the transparent substrate 1 can be irradiated with UV light to make the light-cured adhesive 2 and the sub-millimeter light-emitting diode die 9 be packaged into a whole. Particularly, the material characteristics of the conventional materials for manufacturing the secondary optical elements such as the light guide plate, the lamp cup, the lens and the like are light-guiding, but yellowing occurs when the transparent substrate 1 is irradiated by UV light, so that the transparent substrate of the present invention is different from the aforementioned light-guiding optical materials in that the transparent substrate is used for supporting the light-curing colloid 2 and the role of being irradiated by UV light to solidify the colloid, and the transparent light-guiding material cannot be selected. Therefore, the sealing method provided by the invention is quite different from the concept and technology of adding a secondary optical component on a packaged sub-millimeter light-emitting diode in the prior art.
After the photo-curable resin 2 is cured, the transparent template 1 is separated from the substrate P up and down to remove the transparent template 1 (step S14). Please refer to fig. 6, which is a partial cross-sectional view illustrating the mold release application after the transparent template and the substrate are separated from each other in the embodiment, based on the above, the transparent template 1 is used to load the photo-curing glue 2 and let the UV light pass through, therefore, after the photo-curing glue 2 is solidified, the transparent template 1 needs to be removed by mold release in a manner of separating from each other in the up direction, and only the photo-curing glue 2 is left on the substrate P to avoid affecting the light emitting performance, and the light of the sub-millimeter led die 9 directly passes through the primary optical component having the optical effect, such as the photo-curing glue 2, to adjust the light emitting state. In addition, since the sealing method of the present invention is used to perform a large number of sub-millimeter light emitting diode dies 9 arranged at intervals at a time, the transparent template 1 needs to be removed by a vertical separation method.
By the above-mentioned sealing method, a large number of sub-millimeter light emitting diode crystal grains 9 can be made into a primary optical colloid with optical adjustment efficiency at one time. Different from the secondary optical design in the prior art and the simple processes of dispensing and coating glue, the glue sealing method of the invention can directly form the packaging colloid which is coated on the sub-millimeter light-emitting diode crystal grain 9 and has the light-adjusting efficiency. The specific implementation steps are as described above, the transparent template 1 with the optical cavity structure 10 is used to carry the photo-curing colloid 2, and then the transparent template 3 and the substrate P are aligned and pressed, so that the photo-curing colloid 2 is coated on the sub-millimeter led die 9 and is solidified by UV light irradiation to form a primary optical sealing adhesive with a dimming effect, so that the light source product with the sub-millimeter led die 9 has the advantages of lower cost and simplified structure.
Referring to fig. 2, 3 and 6, in the present embodiment, the bottom surfaces of the optical cavity structures 10 are respectively provided with a protrusion 101, so that the top side of the light-cured encapsulant 2 covering the sub-millimeter light-emitting diode die 9 is provided with a concave structure 30 after curing. Similarly, through the structural design of the convex part 101, after the light-cured colloid 2 is filled in the optical recess structure 10, the corresponding shape can be molded according to the structure of the convex part 101, when the transparent template 1 and the substrate P are aligned and pressed, and the UV light is irradiated to solidify the light-cured colloid 2 and remove the transparent template 1, the light-cured colloid 2 coated on the sub-millimeter light-emitting diode crystal grain 9 can form the concave structure 30 corresponding to the convex part at the top side position, so that the light emitted by the sub-millimeter light-emitting diode crystal grain 9 can be adjusted to achieve the light splitting effect.
Further, in order to make the light-cured encapsulant 2 have better light-splitting and light-spreading effects on the light emitted from the sub-millimeter led die 9, in an implementation state, the protrusion 101 of the optical cavity structure 10 is a cone with an inner concave surface, so that the inner surface of the concave structure 30 correspondingly formed by the light-cured encapsulant 2 is convex, so as to achieve the light-splitting and light-spreading effects, as shown in fig. 2, 3 and 6.
In addition, in order to make the size and shape of the optical cavity structure 10 more precise and avoid the deviation of light adjustment caused by the appearance inconsistency of the light-cured colloid 2 coating and solidifying on the sub-millimeter light-emitting diode grain 9, the optical cavity structure 10 can be formed on the transparent template 1 by extrusion or injection molding.
Referring to fig. 1 and 7, fig. 7 is a partial cross-sectional view illustrating a transparent template and a substrate being pressed together according to another embodiment of the present invention. In this embodiment, the steps of the molding method are the same as those described above, but the difference is that the transparent template 1 has a material-extruding slope 102 on the periphery of the optical cavity structure 10, and each material-extruding slope 102 is formed by extending the edge of the optical cavity structure 10 outward. When the alignment and pressing operation of the transparent template 1 and the substrate P is performed, a phenomenon that the light-cured colloid 2 slightly overflows to the side due to the extrusion of the sub-millimeter light-emitting diode crystal grain 9 may occur, and the colloid overflowing to the outside when the transparent template 1 and the substrate P are pressed together with each other may be guided by the structure of the material extruding slope 102, so that the colloid is concentrated on the side of the sub-millimeter light-emitting diode crystal grain 9 adjacent to the substrate P and is in a state of being almost flatly laid on the surface of the substrate P, so as to prevent the structural shape of the cured light-cured colloid 2 from being affected, and since the light-emitting of the sub-millimeter light-emitting diode crystal grain 9 has directivity, the colloid at the position adjacent to the substrate P does not affect the light-emitting.
In addition, in the present embodiment, the bottom surface of the optical cavity structure 10 further has a protrusion 101, and the top of the protrusion 101 is a plane, and when the cross-sectional length of the sub-millimeter led die 9 is L, the cross-sectional top length L of the protrusion 101 is 1/4L to 1/3L. Therefore, the light-curing colloid 2 is coated on the sub-millimeter light-emitting diode crystal grain 9 and solidified, and a planar concave structure is correspondingly formed at the top end, so that the light-splitting and light-spreading effect can be achieved, the colloid and the crystal grain can be aligned to have larger margin, and under the structural state, the effect of greatly reducing the influence caused by alignment can be achieved under the condition that the light-dimming effect is not excessively influenced.
In summary, the method for encapsulating sub-millimeter light emitting diode dies with optical effect provided by the present invention can form a colloid with optical effect for encapsulating a large number of sub-millimeter light emitting diode dies at one time, and provides a technology different from the existing secondary optical structure technology, or a technology of dispensing and coating glue equal to a technology of manufacturing a protective colloid outside the dies which cannot be molded. The specific steps of the present invention are as described in the previous paragraphs, filling the photo-curing adhesive into the optical cavity structure of the transparent template, pressing the photo-curing adhesive to the sub-millimeter light emitting diode die to be coated, and finally irradiating and removing the transparent template through UV light to coat the sub-millimeter light emitting diode die with the adhesive having the optical adjustment efficiency, thereby adjusting the light emitting performance. The sealing method of the invention has the advantages of simple and rapid process, brings a new technical means for the sub-millimeter light emitting diode component which is gradually emphasized in recent years, breaks through the difficulties of the prior art, can produce light supply products with excellent light emitting efficiency and low component cost and production cost, and is expected to enable the application of the sub-millimeter light emitting diode to be wider.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (6)
1. A sub-millimeter light emitting diode crystal grain sealing method with optical effect is used for sealing a plurality of sub-millimeter light emitting diode crystal grains, wherein the sub-millimeter light emitting diode crystal grains are arranged on a substrate at intervals, and is characterized by comprising the following steps:
providing a transparent template, wherein the transparent template is provided with a plurality of optical cavity structures;
filling a photo-curing colloid in each optical recess structure;
aligning and pressing the transparent template and the substrate to each other, so that each optical cavity structure corresponds to each sub-millimeter light-emitting diode crystal grain, and the optical curing colloid in each optical cavity structure covers each sub-millimeter light-emitting diode crystal grain;
irradiating UV light to solidify the light-cured colloid, and packaging the light-cured colloid and the sub-millimeter light-emitting diode crystal grains into a whole; and
and separating up and down to remove the transparent template.
2. The method as claimed in claim 1, wherein the step of molding the sub-millimeter LED die with optical effect comprises molding the die with a molding compound,
the bottom surfaces of the optical recess structures are respectively provided with a convex part, so that the top sides of the light-cured colloid coated on the sub-millimeter light-emitting diode crystal grains are provided with a concave structure after curing.
3. The method as claimed in claim 2, wherein the step of molding the sub-millimeter LED die with optical effect comprises molding the die with a molding compound,
the convex part of each optical recess structure is a cone with an inner concave surface.
4. The method as claimed in claim 1, wherein the step of molding the sub-millimeter LED die with optical effect comprises molding the die with a molding compound,
the optical cavity structure is formed on the transparent template by means of extrusion or injection molding.
5. The method as claimed in claim 1, wherein the step of molding the sub-millimeter LED die with optical effect comprises molding the die with a molding compound,
the transparent template is provided with a material extruding inclined plane on the peripheral side of the optical recess structure, and each material extruding inclined plane is formed by outwards extending the edge of each optical recess structure.
6. The method as claimed in claim 1, wherein the step of molding the sub-millimeter LED die with optical effect comprises molding the die with a molding compound,
the bottom surface of the optical cavity structure is respectively provided with a convex part, the top end of each convex part is a plane, and when the cross-sectional length of the sub-millimeter light-emitting diode grain is L, the length L of the cross-sectional top end of each convex part is 1/4L-1/3L.
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| CN202110397789.9A CN113130720A (en) | 2021-04-14 | 2021-04-14 | Sub-millimeter light emitting diode crystal grain sealing method with optical effect |
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| CN202110397789.9A CN113130720A (en) | 2021-04-14 | 2021-04-14 | Sub-millimeter light emitting diode crystal grain sealing method with optical effect |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101170154A (en) * | 2006-10-26 | 2008-04-30 | 宁波安迪光电科技有限公司 | High power LED encapsulation method |
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| CN204189825U (en) * | 2014-11-04 | 2015-03-04 | 陈天宇 | Surface welded LED encapsulation module |
| CN104471731A (en) * | 2012-07-09 | 2015-03-25 | 克利公司 | Light emitting diode primary optic for beam shaping |
| CN110459481A (en) * | 2018-05-07 | 2019-11-15 | 昱鑫制造股份有限公司 | The packaging method of semiconductor element and its to position mould |
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2021
- 2021-04-14 CN CN202110397789.9A patent/CN113130720A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170154A (en) * | 2006-10-26 | 2008-04-30 | 宁波安迪光电科技有限公司 | High power LED encapsulation method |
| CN102468411A (en) * | 2010-11-10 | 2012-05-23 | 台湾积体电路制造股份有限公司 | Batwing beam based led and backlight module using the same |
| CN104471731A (en) * | 2012-07-09 | 2015-03-25 | 克利公司 | Light emitting diode primary optic for beam shaping |
| CN204189825U (en) * | 2014-11-04 | 2015-03-04 | 陈天宇 | Surface welded LED encapsulation module |
| CN110459481A (en) * | 2018-05-07 | 2019-11-15 | 昱鑫制造股份有限公司 | The packaging method of semiconductor element and its to position mould |
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