CN110459481A - The packaging method of semiconductor element and its to position mould - Google Patents
The packaging method of semiconductor element and its to position mould Download PDFInfo
- Publication number
- CN110459481A CN110459481A CN201810425683.3A CN201810425683A CN110459481A CN 110459481 A CN110459481 A CN 110459481A CN 201810425683 A CN201810425683 A CN 201810425683A CN 110459481 A CN110459481 A CN 110459481A
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- Prior art keywords
- mold
- substrate
- semiconductor element
- bit cell
- clamping jaw
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The present invention is for a kind of packaging method of semiconductor element and its to position mould, a plurality of semiconductor elements mainly are set on the surface of a substrate, and a mould release or a non-sticky adhesion coating are coated in a plurality of forming cavities of a mold, wherein the area of substrate is greater than the area of mold.Packaging plastic is set in the forming cavity of mold, and by the forming cavity of the semiconductor element alignment mold on substrate, so that the semiconductor element on packaging plastic cladding substrate.After glue hardened forming to be packaged, mold is separated with packaging plastic, to complete the encapsulation of semiconductor element.By the use of mould release or non-sticky adhesion coating, the molding size of packaging plastic and shape can be effectively controlled, and use the biggish substrate of active area, then can control the excessive glue of extra packaging plastic to flow to, packaging plastic is avoided to overflow to the encapsulation face of substrate.
Description
Technical field
It is molding big that packaging plastic can be effectively controlled for a kind of packaging method of semiconductor element and its to position mould in the present invention
Small and shape, and be conducive to improve the packaging structure of encapsulation quality.
Background technique
Light-emitting diode (LED；Light-Emitting Diode) due to have the service life is long, small in size, power consumption is few,
The characteristic and advantage that reaction speed is fast, radiationless and monochromaticjty is luminous, are therefore widely used in indicator light, advertisement plate, friendship
In every product such as logical red signal lamp used by rail workers, automobile lamp, display pannel, communication appliance, consumer electronics.
In the processing procedure of semiconductor element and light-emitting diode, encapsulation is to belong to the fabrication steps for comparing downstream.But only
Have after encapsulation, semiconductor element or light-emitting diode could practical applications.By taking light-emitting diode as an example, light-emitting diodes are coated
The packaging plastic of body crystal grain not only can be used to protect light-emitting diode crystal grain, more be improved the effect of luminous efficiency.In packaging plastic
It, can be through by the light source for issuing light-emitting diode crystal grain after the different phosphor powder or quantum dot (Quantum Dots) of middle doping
By the projection source for generating different colours or different wave length after the phosphor powder or quantum dot of encapsulated layer.
However if the shape of packaging plastic is not as expected or contraposition between packaging plastic and light-emitting diode crystal grain not
Precisely, it frequently can lead to the light source of light-emitting diode crystal grain output, can not export as expected via packaging plastic or derived
Light type or angle are different from preset value, and then influence the luminous efficiency and practicability of light-emitting diode device.Therefore light-emitting diodes
Body is more demanding to encapsulating, it is often necessary to using the contraposition equipment before having high-precision bonder and encapsulating, thus will
It will increase the setup cost of light-emitting diode.
Summary of the invention
The purpose of the present invention is to provide a kind of packaging methods of semiconductor element, mainly on the face of the die coating or
It sprays the mould release of a thinner thickness or is equipped with a non-sticky adhesion coating in mold, so that will not be sticky in mold after packaging plastic hardening
On, it not only contributes to mold and is separated with molding packaging plastic, the packaging body volume of hardened forming can also be increased, and be conducive to pass through
The export of light source caused by light-emitting diode crystal grain of the packaging body by cladding.
Another object of the present invention is to provide a kind of light-emitting diodes to position mould, passes through the first contraposition on mold
The second bit cell and clamping jaw device on unit, substrate to three bit cells, the forming cavity and base of mold can be rapidly completed
The alignment and positioning of semiconductor element on plate, to improve the efficiency of production and encapsulation.
Another object of the present invention is to provide a kind of light-emitting diode to position mould, the active area of substrate will be greater than
The active area of mold, and substrate is set to the vertical upper surface of mold, can control the excessive glue flow direction of packaging plastic, packaging plastic is avoided to overflow
The encapsulation face of substrate is flowed to, and by the control of amount of pressure under substrate, to improve the encapsulation quality of semiconductor element.
To achieve the goals above, the present invention proposes a kind of packaging method of semiconductor element, comprising: one or plural base
A plurality of semiconductor elements are set on one surface of plate；Prepare one or plural mold, mold includes a plurality of forming cavities；In mold
Forming cavity in coating one mould release or add a non-sticky adhesion coating in die surface；One encapsulation of filling in the forming cavity of mold
Glue；By the forming cavity of the semiconductor element alignment mold on substrate；Substrate is bonded mold, so that packaging plastic cladding is set to
Semiconductor element on substrate；And glue hardened forming to be packaged be a packaging body after, mold is separated with packaging body.
The present invention propose a kind of semiconductor element to position mould, comprising: one or a plurality of molds, including a plurality of moldings
Chamber and a plurality of first bit cells；One or a plurality of clamping jaw devices, including a plurality of third bit cells, wherein third aligns
Unit is corresponded to each other with the first bit cell, and clamping jaw device fixes one or a plurality of substrates to adsorb or clamp, substrate
A plurality of semiconductor elements are set on one surface, and the active area of substrate will be greater than the active area of mold, clamping jaw device can
Actuation and substrate is bonded with mold, to cause semiconductor element to be placed in corresponding forming cavity.
In an embodiment of the present invention, wherein mold is located at the lower section of substrate, and the active area of substrate will be greater than mold
Active area.
In an embodiment of the present invention, comprising the following steps: mold is equipped with a plurality of first bit cells, and substrate is opposite
A plurality of second bit cells should be equipped in the first bit cell position, the second bit cell of substrate will be directed at the first of mold
Bit cell and mutually plug together.
In an embodiment of the present invention, comprising the following steps: the substrate for being provided with semiconductor element is adsorbed or is clamped
It is fixed on a clamping jaw device, and moved with clamping jaw device, wherein mold has a plurality of first bit cells, substrate tool
There are a plurality of second bit cells, and clamping jaw device then has a plurality of third bit cells, the first bit cell, the second contraposition
Unit and third bit cell can be plugged together mutually.
In an embodiment of the present invention, wherein the first bit cell is a contraposition column, the second bit cell is that a contraposition is worn
Hole, and third bit cell is then a contraposition pothole or a contraposition perforation.
In an embodiment of the present invention, wherein clamping jaw device, mold are located in a chamber of a production board, produce board
Equipped with an at least chamber, and an at least clamping jaw device and an at least mold are equipped in chamber.
In an embodiment of the present invention, wherein the forming cavity surface of mold is coated with a mould release or to be equipped with one not sticky
Layer.
In an embodiment of the present invention, the lifters of clamping jaw device can be connected by one being equipped in middle chamber.
In an embodiment of the present invention, it is equipped with colloid delivery member in middle chamber, is movable to mould upper surface, and mention
For on a packaging plastic or a mould release to mold.
In an embodiment of the present invention, still include a gluing containing disk, contain the mold.
The beneficial effects of the present invention are:
The present invention provides a kind of packaging method of semiconductor element and its to position mould, by passing through mould release or not sticky
The molding size of packaging plastic and shape can be effectively controlled in the use of layer, and uses the biggish substrate of active area, then can control more
The excessive glue of remaining packaging plastic flows to, and packaging plastic is avoided to overflow to the encapsulation face of substrate.
Detailed description of the invention
Fig. 1 is the side view of one embodiment of packaging method of semiconductor element of the present invention.
Fig. 2 is the side view of one embodiment of packaging method of semiconductor element of the present invention.
Fig. 3 is the side view of one embodiment of packaging method of semiconductor element of the present invention.
Fig. 4 is the side view of one embodiment of packaging method of semiconductor element of the present invention.
Fig. 5 is the side view to one embodiment of position mould of semiconductor element of the present invention.
Fig. 6 is the side view to one embodiment of position mould of semiconductor element of the present invention.
Fig. 7 is the side view to the another embodiment of position mould of semiconductor element of the present invention.
Fig. 8 is the stereoscopic schematic diagram to the another embodiment of position mould of semiconductor element of the present invention.
Primary clustering symbol description:
11: substrate；113: the second bit cells；119: the second bit cells；13: semiconductor element；131: light-emitting diodes
Body crystal grain；15: mold；151: forming cavity；153: mould release；155: the first bit cells；159: mold wall；17: packaging plastic；
171: packaging body；173: protective layer；23: clamping jaw device；231: third bit cell；25: mold；251: forming cavity；253: no
Sticky layer；255: the first bit cells；30: production board；31: chamber；33: lifters；35: colloid delivery member；39: containing glue
Disk；A1: active area；A2: active area.
Specific embodiment
It is referring to FIG. 1 to FIG. 4, respectively the side of one embodiment of packaging method of semiconductor element of the present invention in each step
View.As shown, a plurality of semiconductor elements 13 are arranged on a surface of a substrate 11 first, and prepare a mold 15,
Mold 15 has a plurality of forming cavities 151, as shown in Figure 1.Substrate 11 can be silicon (Si) substrate, aluminium oxide (A2O3) substrate, nitridation
Aluminium (AlN) substrate, sapphire substrate, silicon carbide (SiC) substrate, GaAs (GaAs) substrate, glass substrate (Glass), circuit
Plate (PCB) or ceramic substrate.
Specifically, the semiconductor element 13 being arranged on 11 surface of substrate can be arranged with arbitrary form, such as with matrix
A surface of substrate 11 is arranged in mode.Semiconductor element 13 can be light-emitting diode crystal grain, semiconductor wafer etc., to shine
For diode crystal grain 131, the stacking of P-type material and n type material is generally included, and formed between P-type material and n type material
PN interface.
In an embodiment of the present invention, n type material can be formed on the substrate 11, and p-type material is then formed on n type material
Material finally completes the setting of n type material and P-type material, whereby in base by manufacture of semiconductor such as exposure, development and etchings again
A plurality of light-emitting diode crystal grain 131 are formed on plate.The production method of above-mentioned light-emitting diode crystal grain 131 is that field of the present invention is normal
The technology seen no longer herein to explain more.Furthermore for those skilled in the art, mode and step that can also be different
Rapid production light-emitting diode crystal grain 131, for example, the table of substrate 11 can be arranged in light-emitting diode crystal grain 131 in a manner of flip
Face.
The quantity of forming cavity 151 on mold 15 and the quantity of the light-emitting diode crystal grain 131 on substrate 11 are in principle
Identical, when being packaged, each light-emitting diode crystal grain 131 needs to be respectively aligned to corresponding forming cavity 151.In the present invention
In embodiment, mold 15 needs to be coated with a leafing type on the surface of mold 15 before the encapsulation for carrying out semiconductor volume elements part 13
Agent 153, to avoid the subsequent packaging plastic 17 used occurs sticky with mold 15 and/or forming cavity 151 and is difficult to fall off.
It, can be further by packaging plastic after completing the coating or sprinkling of setting and mould release 153 of semiconductor element 13
17 are filled in the forming cavity 151 of mold 15, as shown in Figure 2.Packaging plastic 17 can be silica gel, epoxy resin, acryl, light transmission
Colloid, nontransparent colloid, photoresist, optical material or protective layer material.
When packaging plastic 17 is filled in the forming cavity 151 of mold 15, an extraction foam program can be carried out again.Due to encapsulation
Glue 17 when being loaded on forming cavity 151, packaging plastic 17 also can covered section be present in the gas in forming cavity 151, therefore, it is necessary to
The foam extraction program being packaged in glue 17.In an embodiment of the present invention, foam program is extracted predominantly in packaging plastic 17
After filling up forming cavity 151, chamber is detached in the chamber (element number 31 of such as Fig. 8) that one is placed with the substrate 11 and mold 15
Room (31) interior gas is to eliminate foam.
In an embodiment of the present invention, a plurality of first bit cells are equipped in the peripheral position or lateral location of mold 15
155, contraposition column as shown in the figure.It is single to be equipped with one second contraposition in the peripheral position of substrate 11 for corresponding first bit cell 155
Member 113, such as the second bit cell 113 can be contraposition pothole.Substrate 11 is then directed at mold 15, specifically makes base
After semiconductor element 13 on plate 11 is respectively aligned to the forming cavity 151 on mold 15, pass through the first bit cell 155 of mold 15
It is inserted into the second bit cell 113 of substrate 11, to cause substrate 11 to be bonded mold 15, cladding is set to substrate 11 by packaging plastic 17
On semiconductor element 13, as shown in Figure 3.After substrate 11 is bonded mold 15, packaging plastic 17 will fill up forming cavity 151, and
The part of the surface of semiconductor element 13 and substrate 11 is coated, it, then can further progress encapsulation to complete the plastotype of packaging plastic 17
The heating of glue 17 or with special light sources (such as: ultraviolet light) curing molding program.It is irradiated via a heat effect or a special light sources
And after making 17 hardened forming of packaging plastic, one packaging body 171, then carry out one and cut off program, will overflow the packing colloid of mold 15 into
Row cut off, then allow substrate 11 once risen or repeatedly rise/fall act.Applying the position risen with strength is to make
171 break away from moulds 15 of packaging body of hardening.The position and strength for applying decline are then to avoid substrate 11 broken for releases its force
It splits.Body 171 to be packaged is separated with mold 15, the packaging body 171 of hardened forming can protective substrate 11 and semiconductor element 13, such as
Shown in Fig. 4.
In different embodiments, a settable transfer passage on mold 15 can first carry out the forming cavity 151 and base of mold 15
The contraposition of semiconductor element 13 on plate 11, and substrate 11 is bonded mold 15, then again via transfer passage by the envelope of liquid
Dress glue 17 is delivered between mold 15 and substrate 11.Due to the semiconductor element 13 on the forming cavity 151 and substrate 11 of mold 15
Contraposition is plugged together by the first bit cell 113, the completion of the second bit cell 155 in advance, and the shape between mold 15 and substrate 11
At a space.Therefore when the packaging plastic 17 of liquid to be delivered between mold 15 and substrate 11, the packaging plastic 17 of liquid can be filled out
Between full substrate 11 and mold 15, and uniformly coat semiconductor element 13.
Since the present invention is before packaging plastic 17 is filled in the forming cavity 151 of mold 15, in the forming cavity 151 of mold 15
One mould release 153 of surface coating or sprinkling, therefore after packaging plastic 17 hardens into packaging body 171, mold 15 can smoothly with
Packaging body 171 separates, the packaging body 171 without destroying hardening during separation.
Furthermore mould release 153 of the present invention be applied or be sprayed at 151 surface of forming cavity of mold 15 liquid or
Coccoid, thus be located at 15 surface of mold mould release 153 thickness it is relatively thin so that hardening post package body 171 shape and
Size can be very close to the form and dimension of forming cavity 151.
Also, the packaging plastic 17 being placed in mold forming cavity 151 is general in order to ensure the external form and construction of packaging body 171
It can be more than its capacity, and when semiconductor element 13 is pressed in forming cavity 151, the volume of semiconductor element 13 can also be squeezed
Partial encapsulation glue 17.In order to control the excessive glue flow direction of extra packaging plastic 17, it is non-that substrate 11 is adhered to avoid extra packaging plastic 17
Package surface, substrate 11 of the invention will be placed in the top position of mold 15, and substrate 11 faces the effect of forming cavity 151
Area A1 can also be greater than the active area A2 of mold 15, in this way, extra packaging plastic 17 will be naturally along around 15 side of mold
The mold wall 159 on side flows out, the encapsulation surface without adhering or influencing substrate 11, improves it and encapsulates quality.
The shape of forming cavity 151 of the present invention can be semicircle sphere, square body or polygonal body, and be formed in substrate
The packaging body 171 on 11 surfaces also semicircle sphere, square body or polygonal body having the same.
In an embodiment of the present invention, packaging plastic 17 can form an at least envelope on 11 surface of substrate after hardened forming
Body 171 and an at least protective layer 173 are filled, wherein packaging body 171 coats semiconductor element 13, and protective layer 173 is then formed in base
The surface of plate 11, such as it is formed in 11 surface of substrate of not set packaging body 171.Protective layer 173 can be semicircle sphere, rectangular
The different geometry such as body or polygonal body.
When semiconductor element 13 is light-emitting diode crystal grain 131, packaging body 171 can be the semicircle sphere of light transmission, by
This packaging body 171 not only can be used to protect light-emitting diode crystal grain 131, also can be used to assemble light-emitting diode crystal grain 131 and is produced
Raw light source.Furthermore fluorescent material, phosphor material or quanta point material can be also mixed in packaging body 171 and/or packaging plastic 17,
The projection source of different colours or different wave length is generated whereby.
Due to being coated with or being sprayed at the very thin thickness of the mould release 153 on 151 surface of mold 15 and/or forming cavity, with
For the mold 15 of same size, the biggish packaging body 171 of volume can be formed using the mold 15 of mould release 153, and with body
The biggish packaging body 171 of product coats light-emitting diode crystal grain 131, and can so increase light-emitting diode 131 goes out light and optically focused effect
Fruit.In comparison, located by prior art then needs additionally to be arranged between forming cavity 151 and packaging plastic 17 release film of a fixed shape
Or a release sheet, the thickness of release film or release sheet are much larger than mould release 153 of the present invention, therefore made by located by prior art
Packaging body volume naturally can it is smaller, shine it is also relatively less desirable with spotlight effect.
When mold 15 is separated with packaging body 171, part mould release 153 will be with the disengaging of packaging body 171 and leave
151 surface of forming cavity, or even the part construction of packaging body 171 or protective layer 173 is formed, but due to 153 particle of mould release and thickness
Spend it is fairly small, packaging body 171 or protective layer 173 can't be caused essence or structure on influence.Also, working as 151 table of forming cavity
When 153 quantity of mould release in face is less than a critical value, then mould release 153 must be smeared once again or sprayed on 151 surface of forming cavity.
Please refer to Fig. 5 and Fig. 6, the side view to one embodiment of position mould of semiconductor element respectively of the present invention.Such as figure
It is shown, it is suitable for position mould the packaging method of above-mentioned semiconductor element described in the embodiment of the present invention, mold 25 includes plural number
A forming cavity 251 and a plurality of first bit cells 255, such as but it is not limited to a pair of of position column.The wherein forming cavity 251 of mold 25
Surface is then provided with a non-sticky glutinous layer 253, and non-sticky adhesion coating 253 is a fixture construction, acts on what similar preceding embodiment was mentioned
Mould release (153).And substrate 11 can be adsorbed or be gripped by a clamping jaw device 23, and as gripper device 23 is mobile, such as
It moves up and down, a plurality of semiconductor elements 13 is set on the surface of the substrate 11.
The first bit cell 255 that substrate 11 corresponds to mold 25 is equipped with a plurality of second bit cells 119, such as this
The contraposition of embodiment is perforated.Corresponded on clamping jaw device 23 mold 25 the first bit cell 255 and second pair of substrate 11
Bit location 119 is equipped with a plurality of third bit cells 231, such as but is not limited to a pair of of position pothole or a contraposition perforation.
The second bit cell in the first bit cell 255, substrate 11 on mold 25 described in the embodiment of the present invention
119, the third bit cell 231 on clamping jaw device 23 can be corresponded to each other or is mutually matched, specifically first on mold 25
Bit cell 255 can be contraposition column, and the second bit cell 119 on substrate 11 is contraposition perforation, and the third of clamping jaw device 23
Bit cell 231 is then contraposition pothole, and the first bit cell 255 may pass through the second bit cell 119, and it is single to be inserted into third contraposition
Member 231.
In an alternative embodiment of the invention, the first bit cell 255 on mold 25 can be contraposition pothole, and clamping jaw fills
The third bit cell 231 for setting 23 is then corresponding contraposition column, and third bit cell 231 may pass through the second bit cell
119 and be inserted into the first bit cell 255.
After substrate 11 is adsorbed and is fixed on clamping jaw device 23, it is only necessary to by the first bit cell on mold 25
255, after the second bit cell 119 on substrate 11, the third bit cell 231 on clamping jaw device 23 are mutually aligned and plug together,
The forming cavity 251 of mold 25 can make to be directed at the semiconductor element 13 on substrate 11.For this purpose, the mold described in through the invention
25 the first bit cell 255, the second bit cell 119 on substrate 11 and the third bit cell 231 on clamping jaw device 23,
Can greatly it simplify in semiconductor packing process, the forming cavity 151/251 and the semiconductor element on substrate 11 of mold 15/25
The difficulty that part 13 aligns, can be improved the efficiency of production and encapsulation.
Similarly, in order to ensure the quality of encapsulation and the excessive glue flow direction of the extra packaging plastic 17 of control, to avoid extra packaging plastic
17 are adhered to the encapsulation surface of substrate 11, and clamping jaw device 23 of the invention, substrate 11 will be placed in the top of mold 15, and base
The active area A1 that plate 11 faces forming cavity 151 can be greater than the active area A2 of mold 15, in this way, extra packaging plastic 17 will
Meeting nature flows out outside mold 25 along the mold wall 159 around 15 side of mold, without influencing whether substrate 11, improves its envelope
The quality of dress.
In still another embodiment of the process, it as shown in fig. 7, a gluing containing disk 39 can be equipped in the periphery of mold 25, can carry
Mold 25 and after injecting glue, dispensing, pressing, it is extra and flow out the packaging plastic 17 outside mold 25, to facilitate semiconductor packages program
Cleaning procedure.
Finally, referring to Fig. 8, being the stereoscopic schematic diagram to the another embodiment of position mould of semiconductor element of the present invention.Such as
Shown in figure, clamping jaw device 23 and mold 25 of the present invention can be placed in a production board 30, production board 30 be equipped with one or
Multiple chambers 31, and one or more groups of clamping jaw devices 23, mold 25 can be equipped in each chamber 31.Clamping jaw device 23 connects
One lifters 33, with the lifting action of lifters 33, the substrate 11, the light-emitting diodes that are adsorbed and are fixed on clamping jaw device 23
Body crystal grain 131 also can with change between mold 25 or forming cavity 251 at a distance from.It is clear that completion foam can be connected in chamber 31
It removes, cure package glue, packaging body are detached from the semiconductor component packings programs such as forming cavity.
In an embodiment of the present invention, packaging plastic 17 and/or mould release 153 all manually can be sprayed or be applied by the producer
Cloth, can also via one be located at 35 automatic spraying of colloid delivery member in chamber 31 or supply packaging plastic 17 and/or mould release 153 in
In forming cavity 251.Colloid delivery member 35 is a removable or telescopic fluid delivery tube, when needs spray or supply packaging plastic
17 and/or when mould release 153, colloid delivery member 35 can be moved to forming cavity 251 and extend vertically upper surface location, and for every
One forming cavity 251 provides its packaging plastic 17 and/or mould release 153 for needing, can increase the life of semiconductor encapsulated element whereby
Yield.
The above, a preferred embodiment only of the invention are not used to limit the scope of implementation of the present invention, i.e.,
Equivalent changes and modifications carried out by all shapes according to the scope of claims of the present invention, construction, feature and spirit should all include
In scope of the presently claimed invention.
Claims (12)
1. a kind of packaging method of semiconductor element characterized by comprising
A plurality of semiconductor elements are set on a surface of a substrate；
Prepare a mold, which includes a plurality of forming cavities；
It is coated with a mould release in the forming cavity of the mold or is installed with a non-sticky adhesion coating；
A packaging plastic is inserted in the forming cavity of the mold；
Semiconductor element on the substrate is aligned to the forming cavity of the mold；
The substrate is bonded the mold, so that the packaging plastic coats the semiconductor element being set on the substrate；And
After the packaging plastic hardened forming is a packaging body, which is separated with the packaging body.
2. packaging method according to claim 1, which is characterized in that wherein the mold is located at the lower section of the substrate, and base
The active area of plate is greater than the active area of the mold.
3. packaging method according to claim 2, which comprises the following steps: the mold has a plurality of the
One bit cell, and the substrate have corresponding second bit cell, the second bit cell of substrate is aligned and plug together in
First bit cell of mold.
4. packaging method according to claim 3, which comprises the following steps: clamping jaw device absorption or folder
The substrate is held, and moves the substrate with the clamping jaw device, clamping jaw device has a plurality of third bit cells, the mold
First bit cell is aligned and plugs together the third bit cell of the second bit cell and the clamping jaw device in the substrate.
5. packaging method according to claim 4, which is characterized in that wherein the clamping jaw device, the mold are located at a production
In one chamber of board, which is equipped with an at least chamber, and the chamber is equipped with an at least clamping jaw device and an at least mould
Tool.
6. a kind of semiconductor element to position mould characterized by comprising
One mold, including a plurality of forming cavities and a plurality of first bit cells；And
A plurality of semiconductor elements are arranged on one surface of the substrate to adsorb or grip a substrate in one clamping jaw device
And a plurality of the second bit cells mutually to be plugged together with first bit cell, and the active area of the substrate is greater than the mould
The active area of tool, clamping jaw device are bonded to actuation and by the substrate with the mold, to cause semiconductor element to be placed in
In corresponding forming cavity.
7. according to claim 6 to position mould, which is characterized in that wherein the clamping jaw device is equipped with a plurality of thirds pair
Bit location, third bit cell are mutually plugged together with the second bit cell of the substrate, the first bit cell of the mold.
8. according to claim 6 to position mould, which is characterized in that wherein coating one is release in the forming cavity of the mold
Agent or a fixed non-sticky adhesion coating.
9. according to claim 6 to position mould, which is characterized in that still include a production board, in the production board
Equipped with one or more chambers, and each chamber is equipped with one or more groups of molds and the clamping jaw device.
10. according to claim 9 to position mould, which is characterized in that be wherein equipped with colloid delivery member in the chamber, use
To be moved to the mould upper surface, and on one packaging plastic of offer, a mould release to the mold.
11. according to claim 6 to position mould, which is characterized in that still include a gluing containing disk, carry the mold.
12. according to claim 6 to position mould, which is characterized in that wherein the mold periphery is equipped with a mold wall.
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| CN201810425683.3A CN110459481A (en) | 2018-05-07 | 2018-05-07 | The packaging method of semiconductor element and its to position mould |
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| CN201810425683.3A CN110459481A (en) | 2018-05-07 | 2018-05-07 | The packaging method of semiconductor element and its to position mould |
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| CN110459481A true CN110459481A (en) | 2019-11-15 |
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| CN111697117A (en) * | 2020-06-23 | 2020-09-22 | 深圳市聚飞光电股份有限公司 | Chip-scale packaging method and LED packaging device |
| CN113130720A (en) * | 2021-04-14 | 2021-07-16 | 苏州茂立光电科技有限公司 | Sub-millimeter light emitting diode crystal grain sealing method with optical effect |
| CN113451485A (en) * | 2021-06-29 | 2021-09-28 | 顺德职业技术学院 | Molding device for packaging adhesive for preventing LED display from light crosstalk |
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Application publication date: 20191115 |