CN102479785A - Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof - Google Patents
Light emitting structure with deposited type fluorescence covering layer and manufacturing method thereof Download PDFInfo
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- CN102479785A CN102479785A CN2010105680709A CN201010568070A CN102479785A CN 102479785 A CN102479785 A CN 102479785A CN 2010105680709 A CN2010105680709 A CN 2010105680709A CN 201010568070 A CN201010568070 A CN 201010568070A CN 102479785 A CN102479785 A CN 102479785A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
The invention discloses a light emitting structure with a deposited type fluorescence covering layer and a manufacturing method thereof. The light emitting structure comprises a substrate unit, a light emitting unit and a packaging unit, wherein the substrate unit is provided with at least one circuit substrate. The light emitting unit is provided with a plurality of light emitting diode chips electrically connected and arranged on the circuit substrate. The packaging unit is provided with at least one packaging colloid formed through a die, wherein the packaging colloid is arranged on the circuit substrate and used for covering the light emitting diode chips, and the packaging colloid is internally provided with at least one continuous fluorescent layer deposited on the outer surfaces of the light emitting diode chips through centrifugal movement. Therefore, the light emitting effect of the light emitting structure can be effectively improved due to the adoption of the design of a plurality of continuous fluorescent layers formed through depositing fluorescent powder.
Description
Technical field
The present invention relates to a kind of ray structure and preparation method thereof, relate in particular to a kind of ray structure and preparation method thereof with sedimentation type fluorescence coating layer.
Background technology
See also shown in Figure 1ly, it is the generalized section of the known ray structure made from routing technology (wire-bonding process).By knowing that known ray structure comprises among the figure: a circuit substrate 1a, be arranged at the light-emitting diode chip for backlight unit 2a of this circuit substrate 1a upper end, two lead 3a, and one be mixed with fluorescent material 40a packing colloid 4a.
Wherein, This light-emitting diode chip for backlight unit 2a is with its light output surface 20a this circuit substrate 1a and being arranged on this circuit substrate 1a dorsad, and the positive and negative electrode zone (21a, 22a) of this light-emitting diode chip for backlight unit 2a upper end through above-mentioned two lead 3a to be electrically connected at the corresponding positive and negative electrode zone (11a, 12a) of this circuit substrate 1a.Moreover this packing colloid 4a that is mixed with fluorescent material 40a covers this light-emitting diode chip for backlight unit 2a and above-mentioned two lead 3a, to protect this light-emitting diode chip for backlight unit 2a.Therefore, when this light-emitting diode chip for backlight unit 2a was a blue LED (blue LED), the penetrable packing colloid 4a that this is mixed with fluorescent material 40a of the throw light that this blue LED produced was to produce white light source.
Yet; Owing to known fluorescent material 40a mixes the situation that in packing colloid 4a, presents a skewness; Therefore when throw light that blue LED produced penetrated this packing colloid 4a that is mixed with fluorescent material 40a, the white light source that known ray structure cast out was easy to generate optically focused property (condensing capability) and the inconsistent problem of color and luster (color and luster).
Summary of the invention
The object of the present invention is to provide a kind of ray structure and preparation method thereof, improve illumination effect effectively with the ray structure that has sedimentation type fluorescence coating layer through this with sedimentation type fluorescence coating layer.
A the present invention wherein embodiment proposes a kind of ray structure with sedimentation type fluorescence coating layer, and it comprises: a base board unit, a luminescence unit and an encapsulation unit.Wherein, base board unit has at least one circuit substrate.Luminescence unit has a plurality of electric connections and is arranged at the light-emitting diode chip for backlight unit on the circuit substrate.Encapsulation unit has at least one packing colloid that a mould structure is shaped that passes through; Wherein packing colloid is arranged on the circuit substrate and covers above-mentioned a plurality of light-emitting diode chip for backlight unit, and the inside of packing colloid has the continous way fluorescence coating at least one outer surface that is deposited on above-mentioned a plurality of light-emitting diode chip for backlight unit through centrifugal motion.
A the present invention wherein embodiment proposes a kind of manufacture method with ray structure of sedimentation type fluorescence coating layer; It comprises following several steps at least: at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit (a) is provided, and wherein above-mentioned a plurality of light-emitting diode chip for backlight unit electrically connect and are arranged on the circuit substrate; (b) mould structure is provided, it has a mold and one and mold cooperatively interacts and bed die separated from one another, and wherein the bottom of mold has one first storage tank, and the top of bed die has second storage tank corresponding to first storage tank; The liquid packing colloid that (c) will be mixed with a plurality of fluorescent material is covered on above-mentioned a plurality of light-emitting diode chip for backlight unit and is filled in second storage tank of bed die; (d) with circuit substrate upset and be arranged on the top of bed die, so that above-mentioned a plurality of light-emitting diode chip for backlight unit is placed in second storage tank of bed die; (e) mold is arranged on the bed die and with bed die cooperatively interacts, with the position of positioning circuit substrate with respect to bed die; (f) mould structure is carried out centrifugal motion, so that above-mentioned a plurality of fluorescent material is assembled and is deposited on the outer surface of above-mentioned a plurality of light-emitting diode chip for backlight unit and forms a continous way fluorescence coating; (g) mould structure is toasted, so that liquid packing colloid is cured to form the solid-state packing colloid of the above-mentioned a plurality of light-emitting diode chip for backlight unit of a covering; And (h) separate mold and bed die, so that circuit substrate is taken out from mould structure.
A the present invention wherein embodiment proposes a kind of manufacture method with ray structure of sedimentation type fluorescence coating layer; It comprises following several steps at least: at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit (a) is provided, and wherein above-mentioned a plurality of light-emitting diode chip for backlight unit electrically connect and are arranged on the circuit substrate; (b) mould structure is provided, it has a mold and one and mold cooperatively interacts and bed die separated from one another, and wherein the bottom of mold has one first storage tank, and the top of bed die has second storage tank corresponding to first storage tank; The liquid packing colloid that (c) will be mixed with a plurality of fluorescent material is covered on above-mentioned a plurality of light-emitting diode chip for backlight unit and is filled in second storage tank of bed die; (d) with circuit substrate upset and be arranged on the top of bed die, so that above-mentioned a plurality of light-emitting diode chip for backlight unit is placed in second storage tank of bed die; (e) mold is arranged on the bed die and with bed die cooperatively interacts, with the position of positioning circuit substrate with respect to bed die; (f) simultaneously mould structure is carried out centrifugal motion and baking; So that above-mentioned a plurality of fluorescent material assembles and is deposited on the outer surface of above-mentioned a plurality of light-emitting diode chip for backlight unit and forms a continous way fluorescence coating, and make liquid packing colloid be cured to form one cover above-mentioned a plurality of light-emitting diode chip for backlight unit solid-state packing colloid; And (g) separate mold and bed die, so that circuit substrate is taken out from mould structure.
In sum; Ray structure with sedimentation type fluorescence coating layer that the embodiment of the invention provided and preparation method thereof, it has the beneficial effect of " can make illumination effect promote through depositing formed continous way fluorescence coating by above-mentioned a plurality of fluorescent material " at least.
For enabling further to understand characteristic of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic reference and the explanation usefulness of only providing not is to be used for to the present invention's limitr in addition.
Description of drawings
Fig. 1 is the generalized section of the known ray structure made from the routing mode;
Fig. 2 has the flow chart of manufacture method of the ray structure of sedimentation type fluorescence coating layer for the present invention;
Fig. 2 A to Fig. 2 I has the making schematic flow sheet (wherein Fig. 2 D is the A-A generalized section of Fig. 2 C, and Fig. 2 G is the A part enlarged diagram of Fig. 2 F) of manufacture method of the ray structure of sedimentation type fluorescence coating layer in regular turn for the present invention;
Fig. 3 A has the schematic perspective view of the ray structure of sedimentation type fluorescence coating layer for the present invention; And
Fig. 3 B is the B-B generalized section of Fig. 3 A.
Wherein, description of reference numerals is following:
[known]
Circuit substrate 1a
Light-emitting diode chip for backlight unit 2a
[the present invention]
Ray structure Z
Light-emitting diode chip for backlight unit 20
Liquid packing colloid 30 '
Packing colloid 30
Continous way fluorescence coating 31
Mould structure M
Mold M1
The first storage tank M100
Annular bossy body M10
Conduction trough M11
The first location division M12
Bed die M2
The second storage tank M200
Lens recess M20
The second location division M22
Release agent A
Lock member S
Embodiment
See also shown in Fig. 2, Fig. 2 A to Fig. 2 I, the present invention provides a kind of manufacture method with ray structure Z of sedimentation type fluorescence coating layer, and it can comprise following several steps at least:
Step S100 is: please cooperate shown in Fig. 2 and Fig. 2 A, at least one circuit substrate 10 with a plurality of light-emitting diode chip for backlight unit 20 is provided, wherein above-mentioned a plurality of light-emitting diode chip for backlight unit 20 electrically connect and are arranged on the circuit substrate 10.For instance, the upper surface of circuit substrate 10 has a plurality of specific conducting wires, and above-mentioned a plurality of light-emitting diode chip for backlight unit 20 can be electrically connected at circuit substrate 10 through the mode of routing or flip-chip.
Step S102 is: please cooperate shown in Fig. 2 and Fig. 2 B; One mould structure M is provided; It has a mold M1 and one and mold M1 cooperatively interacts and bed die M2 separated from one another; Wherein the bottom of mold M1 has one first storage tank M100, and the top of bed die M2 has second a storage tank M200 corresponding to this first storage tank M100.For instance, mold M1 and bed die M2 can fit together through a plurality of lock member S (for example a plurality of screw).In addition; The bottom of mold M1 has an annular bossy body M10 and an a plurality of conduction trough M11 who forms on this annular bossy body M10 around shape; And the upper surface of should annular bossy body M10 being close to bed die M2 is so that mold M1 and bed die M2 can closely cooperatively interact together.Moreover the bottom of mold M1 has at least two first location division M12, and the top of the bed die M2 second location division M22 that has at least two corresponding respectively above-mentioned two first location division M12 and cooperatively interact with above-mentioned two first location division M12 respectively.
Step S104 is: please cooperate shown in Fig. 2, Fig. 2 B, Fig. 2 C and Fig. 2 D (Fig. 2 D for Fig. 2 C A-A generalized section), the liquid packing colloid 30 ' that is mixed with a plurality of fluorescent material 310 is covered on above-mentioned a plurality of light-emitting diode chip for backlight unit 20 and is filled in the second storage tank M200 of bed die M2.For instance, carry out before the step S104, method of the present invention can further comprise: clean mold M1, bed die M2 and above-mentioned circuit substrate 10 (S104 (a)) with a plurality of light-emitting diode chip for backlight unit 20; Spraying release agent (mold release agent) A (shown in Fig. 2 B) is in the surface of mold M1 and the surface of bed die M2 (S104 (b)); And mold M1, bed die M2 and above-mentioned circuit substrate 10 with a plurality of light-emitting diode chip for backlight unit 20 toasted (S104 (c)), to remove unnecessary moisture content.
Step S106 is: please cooperate shown in Fig. 2, Fig. 2 C and Fig. 2 E, with circuit substrate 10 upset and be arranged on the top of bed die M2, so that above-mentioned a plurality of light-emitting diode chip for backlight unit 20 is placed in the second storage tank M200 of bed die M2.For instance; Circuit substrate 10 has at least two first location holes 100 (shown in Fig. 2 C; It discloses four first location holes 100); And the top of bed die M2 have at least two respectively with above-mentioned two first location holes, 100 corresponding second location holes 200 (shown in Fig. 2 C, it discloses four second location holes 200).Therefore; When circuit substrate 10 is reversed and above-mentioned two first location holes 100 and above-mentioned two second location holes 200 respectively during mutual contraposition; Can apply a downward strength (shown in arrow downward Fig. 2 E) from the bottom of circuit substrate 10; This moment should liquid state packing colloid 30 ' with complete filling between foregoing circuit substrate 10 and bed die M2, and unnecessary liquid packing colloid 30 ' will be extruded out.
Step S108 is: please cooperate shown in Fig. 2, Fig. 2 F and Fig. 2 G (Fig. 2 G is the A part enlarged diagram of Fig. 2 F), mold M1 is arranged at bed die M2 upward and with bed die M2 cooperatively interact, with the position of positioning circuit substrate 10 with respect to bed die M2.For example: through above-mentioned a plurality of lock member S (for example a plurality of screw), so that mold M1 and bed die M2 are closely fitted together each other.
Step S110 is: please cooperate shown in Fig. 2, Fig. 2 G and Fig. 2 H, M carries out centrifugal motion with this mould structure, so that above-mentioned a plurality of fluorescent material 310 is assembled and is deposited on the outer surface of above-mentioned a plurality of light-emitting diode chip for backlight unit 20 and forms a continous way fluorescence coating 31.
Step S112 is: please cooperate shown in Fig. 2, Fig. 2 G and Fig. 2 H, M toasts with this mould structure so that should liquid state packing colloid 30 ' be cured to form one cover above-mentioned a plurality of light-emitting diode chip for backlight unit 20 solid-state packing colloid 30.For instance; This solid-state packing colloid 30 can be one by the printing opacity colloid of silica gel formed thereby or be a printing opacity colloid by the epoxy resin formed thereby, and continous way fluorescence coating 31 can be made up of a plurality of 310 in fluorescent material of sneaking in this solid-state packing colloid 30 (this printing opacity colloid).In addition; This solid-state packing colloid 30 has a layer glue body 301 and a plurality of lens glue body 302 that is arranged on this layer glue body 301 one-body moldedly, and each lens glue body 302 corresponding each light-emitting diode chip for backlight unit 20 and be positioned at the top of each light-emitting diode chip for backlight unit 20.Moreover; The bottom of circuit substrate 10 is close in the bottom of mold M1; The top of bed die M2 has the lens recess M20 of a plurality of corresponding above-mentioned a plurality of lens glue bodies 302, and the outer surface of each lens glue body 302 is close to the inner surface of each lens recess M20.
Step S114 is: please cooperate shown in Fig. 2 and Fig. 2 I, separate mold M1 and bed die M2, so that circuit substrate 10 is taken out from this mould structure M.
See also shown in Fig. 3 A and Fig. 3 B (Fig. 3 B for Fig. 3 A B-B generalized section), the present invention provides a kind of ray structure Z with sedimentation type fluorescence coating layer, and it comprises: a base board unit 1, a luminescence unit 2 and an encapsulation unit 3.
Wherein, this base board unit 1 has at least one circuit substrate 10, and this luminescence unit 2 has a plurality of electric connections and is arranged at the light-emitting diode chip for backlight unit 20 on the circuit substrate 10.For instance, the upper surface of circuit substrate 10 has a plurality of specific conducting wires, and above-mentioned a plurality of light-emitting diode chip for backlight unit 20 can be electrically connected at circuit substrate 10 through the mode of routing or flip-chip.
Moreover; This encapsulation unit 3 has at least one packing colloid 30 that a mould structure M (shown in Fig. 2 B) is shaped that passes through; Wherein packing colloid 30 is arranged on the circuit substrate 10 and covers above-mentioned a plurality of light-emitting diode chip for backlight unit 20, and the inside of packing colloid 30 has the continous way fluorescence coating 31 at least one outer surface that is deposited on above-mentioned a plurality of light-emitting diode chip for backlight unit 20 through centrifugal motion.
For instance, packing colloid 30 can be one by the printing opacity colloid of silica gel formed thereby or can be a printing opacity colloid by the epoxy resin formed thereby, and continous way fluorescence coating 31 is made up of a plurality of 310 in fluorescent material of sneaking in the packing colloid 30 (this printing opacity colloid).Moreover; Packing colloid 30 has a layer glue body 301 and a plurality of lens glue body 302 that is arranged on this layer glue body 301 one-body moldedly, and each lens glue body 302 corresponding each light-emitting diode chip for backlight unit 20 and be positioned at the top of each light-emitting diode chip for backlight unit 20.
Moreover; Shown in above-mentioned Fig. 2 B; This mould structure M comprises a mold M1 and one and the bed die M2 that cooperatively interacts of mold M1; The bottom of circuit substrate 10 is close in the bottom of mold M1, and the top of bed die M2 has the lens recess M20 of a plurality of corresponding above-mentioned a plurality of lens glue bodies 302, and the outer surface of each lens glue body 302 is close to the inner surface of each lens recess M20.In addition, the bottom of mold M1 has an annular bossy body M10 and an a plurality of conduction trough M11 who forms on this annular bossy body M10 around shape, and should annular bossy body M10 be close to the upper surface of bed die M2.In addition, the bottom of mold M1 has at least two first location division M12, and the top of the bed die M2 second location division M22 that has at least two corresponding respectively above-mentioned two first location division M12 and cooperatively interact with above-mentioned two first location division M12 respectively.
In sum; Because the design of the continous way fluorescence coating on above-mentioned at least one outer surface that is deposited on above-mentioned a plurality of light-emitting diode chip for backlight unit through centrifugal motion so that the present invention have the illumination effect of the ray structure of sedimentation type fluorescence coating layer can be by effective lifting.
The above is merely preferred possible embodiments of the present invention, is not so limits to claim of the present invention, so the equivalence techniques that uses specification of the present invention and graphic content to do such as changes, all is contained in the scope of the present invention.
Claims (20)
1. the ray structure with sedimentation type fluorescence coating layer is characterized in that, comprising:
One base board unit, it has at least one circuit substrate;
One luminescence unit, it has a plurality of electric connections and is arranged at the light-emitting diode chip for backlight unit on above-mentioned at least one circuit substrate; And
One encapsulation unit; It has at least one packing colloid that a mould structure is shaped that passes through; Wherein above-mentioned at least one packing colloid is arranged on above-mentioned at least one circuit substrate and covers above-mentioned a plurality of light-emitting diode chip for backlight unit, and the inside of above-mentioned at least one packing colloid has the continous way fluorescence coating at least one outer surface that is deposited on above-mentioned a plurality of light-emitting diode chip for backlight unit through centrifugal motion.
2. the ray structure with sedimentation type fluorescence coating layer according to claim 1; It is characterized in that; Above-mentioned at least one packing colloid is a printing opacity colloid by the silica gel formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
3. the ray structure with sedimentation type fluorescence coating layer according to claim 1; It is characterized in that; Above-mentioned at least one packing colloid is a printing opacity colloid by the epoxy resin formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
4. the ray structure with sedimentation type fluorescence coating layer according to claim 1; It is characterized in that; Above-mentioned at least one packing colloid has a layer glue body and a plurality of lens glue body that is arranged on this layer glue body one-body moldedly, and corresponding each light-emitting diode chip for backlight unit of each lens glue body and be positioned at the top of each light-emitting diode chip for backlight unit.
5. the ray structure with sedimentation type fluorescence coating layer according to claim 4; It is characterized in that; This mould structure comprises a mold and one and the bed die that cooperatively interacts of this mold; The bottom of above-mentioned at least one circuit substrate is close in the bottom of this mold, and the top of this bed die has the lens recess of a plurality of corresponding above-mentioned a plurality of lens glue bodies, and the outer surface of each lens glue body is close to the inner surface of each lens recess.
6. the ray structure with sedimentation type fluorescence coating layer according to claim 5; It is characterized in that; The bottom of this mold has at least two first location divisions, and second location division that has at least two corresponding respectively above-mentioned two first location divisions and cooperatively interact with above-mentioned two first location divisions respectively, the top of this bed die.
7. the ray structure with sedimentation type fluorescence coating layer according to claim 5; It is characterized in that; The bottom of this mold has an annular bossy body and an a plurality of conduction trough that forms on this annular bossy body around shape, and should the annular bossy body be close to the upper surface of this bed die.
8. the manufacture method with ray structure of sedimentation type fluorescence coating layer is characterized in that, comprises the following steps:
(a) at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit is provided, wherein above-mentioned a plurality of light-emitting diode chip for backlight unit electrically connect and are arranged on above-mentioned at least one circuit substrate;
(b) mould structure is provided; It has a mold and one and this mold cooperatively interacts and bed die separated from one another; Wherein the bottom of this mold has one first storage tank, and the top of this bed die has second storage tank corresponding to this first storage tank;
The liquid packing colloid that (c) will be mixed with a plurality of fluorescent material is covered on above-mentioned a plurality of light-emitting diode chip for backlight unit and is filled in second storage tank of this bed die;
(d) with above-mentioned at least one circuit substrate upset and be arranged on the top of this bed die, so that above-mentioned a plurality of light-emitting diode chip for backlight unit is placed in second storage tank of this bed die;
(e) this mold is arranged on this bed die and with this bed die cooperatively interacts, to locate the position of above-mentioned at least one circuit substrate with respect to this bed die;
(f) this mould structure is carried out centrifugal motion, so that above-mentioned a plurality of fluorescent material is assembled and is deposited on the outer surface of above-mentioned a plurality of light-emitting diode chip for backlight unit and forms a continous way fluorescence coating;
(g) this mould structure is toasted so that should the liquid state packing colloid be cured to form one cover above-mentioned a plurality of light-emitting diode chip for backlight unit solid-state packing colloid; And
(h) separate this mold and this bed die, so that above-mentioned at least one circuit substrate is taken out from this mould structure.
9. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 8 is characterized in that, in above-mentioned steps (c) before, further comprises:
Clean this mold, this bed die and above-mentioned at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit;
The spraying release agent is in the surface of this mold and the surface of this bed die; And
This mold, this bed die and above-mentioned at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit are toasted.
10. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 8; It is characterized in that; This solid-state packing colloid is a printing opacity colloid by the silica gel formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
11. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 8; It is characterized in that; This solid-state packing colloid is a printing opacity colloid by the epoxy resin formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
12. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 8; It is characterized in that; This solid-state packing colloid has a layer glue body and a plurality of lens glue body that is arranged on this layer glue body one-body moldedly, and corresponding each light-emitting diode chip for backlight unit of each lens glue body and be positioned at the top of each light-emitting diode chip for backlight unit.
13. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 12; It is characterized in that; The bottom of above-mentioned at least one circuit substrate is close in the bottom of this mold; The top of this bed die has the lens recess of a plurality of corresponding above-mentioned a plurality of lens glue bodies, and the outer surface of each lens glue body is close to the inner surface of each lens recess.
14. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 13; It is characterized in that; The bottom of this mold has at least two first location divisions, and second location division that has at least two corresponding respectively above-mentioned two first location divisions and cooperatively interact with above-mentioned two first location divisions respectively, the top of this bed die.
15. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 13; It is characterized in that; The bottom of this mold has an annular bossy body and an a plurality of conduction trough that forms on this annular bossy body around shape, and should the annular bossy body be close to the upper surface of this bed die.
16. the manufacture method with ray structure of sedimentation type fluorescence coating layer is characterized in that, comprises the following steps:
(a) at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit is provided, wherein above-mentioned a plurality of light-emitting diode chip for backlight unit electrically connect and are arranged on above-mentioned at least one circuit substrate;
(b) mould structure is provided; It has a mold and one and this mold cooperatively interacts and bed die separated from one another; Wherein the bottom of this mold has one first storage tank, and the top of this bed die has second storage tank corresponding to this first storage tank;
The liquid packing colloid that (c) will be mixed with a plurality of fluorescent material is covered on above-mentioned a plurality of light-emitting diode chip for backlight unit and is filled in second storage tank of this bed die;
(d) with above-mentioned at least one circuit substrate upset and be arranged on the top of this bed die, so that above-mentioned a plurality of light-emitting diode chip for backlight unit is placed in second storage tank of this bed die;
(e) this mold is arranged on this bed die and with this bed die cooperatively interacts, to locate the position of above-mentioned at least one circuit substrate with respect to this bed die;
(f) simultaneously this mould structure is carried out centrifugal motion and baking; So that above-mentioned a plurality of fluorescent material assembles and is deposited on the outer surface of above-mentioned a plurality of light-emitting diode chip for backlight unit and forms a continous way fluorescence coating, and make this liquid state packing colloid be cured to form one cover above-mentioned a plurality of light-emitting diode chip for backlight unit solid-state packing colloid; And
(g) separate this mold and this bed die, so that above-mentioned at least one circuit substrate is taken out from this mould structure.
17. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 16 is characterized in that, in above-mentioned steps (c) before, further comprises:
Clean this mold, this bed die and above-mentioned at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit;
The spraying release agent is in the surface of this mold and the surface of this bed die; And
This mold, this bed die and above-mentioned at least one circuit substrate with a plurality of light-emitting diode chip for backlight unit are toasted.
18. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 16; It is characterized in that; This solid-state packing colloid is a printing opacity colloid by the silica gel formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
19. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 16; It is characterized in that; This solid-state packing colloid is a printing opacity colloid by the epoxy resin formed thereby, and above-mentioned at least one continous way fluorescence coating is made up of a plurality of fluorescent material of sneaking in this printing opacity colloid.
20. the manufacture method with ray structure of sedimentation type fluorescence coating layer according to claim 16; It is characterized in that; This solid-state packing colloid has a layer glue body and a plurality of lens glue body that is arranged on this layer glue body one-body moldedly, and corresponding each light-emitting diode chip for backlight unit of each lens glue body and be positioned at the top of each light-emitting diode chip for backlight unit.
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Application publication date: 20120530 |