CN102593321B - The method for packing of LED, LED encapsulation structure and display screen - Google Patents
The method for packing of LED, LED encapsulation structure and display screen Download PDFInfo
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- CN102593321B CN102593321B CN201210038438.XA CN201210038438A CN102593321B CN 102593321 B CN102593321 B CN 102593321B CN 201210038438 A CN201210038438 A CN 201210038438A CN 102593321 B CN102593321 B CN 102593321B
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- encapsulating housing
- lead frame
- led
- packaging plastic
- led chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention is applicable to LED technology field, discloses the method for packing of a kind of LED, LED encapsulation structure and display screen.Above-mentioned method for packing, comprise the following steps, lead frame is set, then the upper and lower surface in lead frame arranges upper encapsulating housing and lower encapsulating housing respectively, and in lower encapsulating housing, fill lower packaging plastic, in upper encapsulating housing, place LED chip, and LED chip is connected on lead frame, in upper encapsulating housing, fill upper packaging plastic.Above-mentioned encapsulating structure comprises lead frame and LED chip, the both sides up and down of lead frame are respectively arranged with encapsulating housing and lower encapsulating housing, LED chip to be arranged in encapsulating housing and to be fixedly connected on lead frame, also be provided with the upper packaging plastic be covered on LED chip in upper encapsulating housing, in lower encapsulating housing, be provided with lower packaging plastic.Above-mentioned display screen has above-mentioned LED encapsulation structure.The method for packing of LED provided by the invention, LED encapsulation structure and display screen, its LED encapsulation structure adopts two-layer equation package design, and product reliability is high.
Description
Technical field
The invention belongs to LED technology field, particularly relate to a kind of method for packing of adopting surface mounted LED, LED encapsulation structure and comprise the display screen of this LED encapsulation structure.
Background technology
LED (LightEmittingDiode) is a kind of solid-state semiconductor device, and it directly can be converted into light electricity.It changes the principle of the luminescence of incandescent lamp tungsten filament and the luminescence of electricity-saving lamp tricolor powder, and adopts electroluminescence.The feature of LED is clearly: the life-span is long, light efficiency is high, radiationless and low-power consumption.
The spectrum of LED almost all concentrates on visible light frequency band, LED light source can utilize the red, green, blue principle of three primary colours, under computer technology controls, three kinds of colors are made to have 256 grades of gray scales and mixing arbitrarily, 256 × 256 × 256=16777216 kind color can be produced, form different photochromic combination changeful, realize colourful dynamic change effect and various image.
In view of the intrinsic advantage of LED, widely apply on the product such as display screen, light fixture at present.In prior art, paster LED cannot break through the packaging technology technology of outdoor water-proof protection against the tide and antiultraviolet always, therefore or adopts Lamp conventional package to be used for outdoor display screen market.At present, patch-type material is all adopt PLCC6, PLCC4 structure, the weak effect that the moisture-absorption characteristics of PPA plastics itself that wherein PLCC adopts causes product waterproof and dampproof, and LED is applied to outdoor display screen and often there will be the bad phenomenon such as dead lamp, and product reliability is poor.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, provide the method for packing of a kind of LED, LED encapsulation structure and display screen, its LED product waterproof moisture-proof effect is good, and product reliability is high.
Technical scheme of the present invention is: the method for packing of a kind of LED, comprise the following steps, lead frame is set, then the upper and lower surface in described lead frame arranges upper encapsulating housing and lower encapsulating housing respectively, and in described lower encapsulating housing, fill lower packaging plastic, in described upper encapsulating housing, place LED chip, and LED chip is connected on lead frame, in described upper encapsulating housing, fill upper packaging plastic.
Particularly, described lead frame adopts the mode of punching press shaping, and described lead frame comprises conductive pin, and described lead frame is formed with line layer, after filling lower packaging plastic, adopts the mode of bending and molding by described conductive pin bending and molding in described lower encapsulating housing.
Particularly, described upper encapsulating housing and lower encapsulating housing are all fixed on described lead frame by the mode of injection mo(u)lding, described upper encapsulating housing and lower encapsulating housing integrated injection molding.
Particularly, described upper packaging plastic comprises at least one deck epoxy glue layer and at least one deck layer of silica gel.
Particularly, described lower packaging plastic comprises at least one deck epoxy glue layer and at least one deck layer of silica gel.
Present invention also offers a kind of LED encapsulation structure, comprise lead frame and LED chip, the both sides up and down of described lead frame are respectively arranged with encapsulating housing and lower encapsulating housing, described LED chip to be arranged in described upper encapsulating housing and to be fixedly connected on described lead frame, also be provided with the upper packaging plastic be covered on described LED chip in described upper encapsulating housing, in described lower encapsulating housing, be provided with lower packaging plastic.
Particularly, described upper encapsulating housing and lower encapsulating housing all have the cavity of a bowl cup-shaped; Described upper encapsulating housing and lower encapsulating housing integrated injection molding are in the upper and lower surface of described lead frame.
Particularly, described LED chip comprises at least one group of chipset, described chipset comprises a red LED chips, a Green Chip and a blue chip, and red LED chips, Green Chip and blue chip in same described chipset be arrangement in " one " font.
Particularly, described lead frame comprises line layer and conductive pin, and described LED chip is welded on described line layer.
Present invention also offers a kind of display screen, described display screen has above-mentioned LED encapsulation structure.
The method for packing of a kind of LED provided by the invention, LED encapsulation structure and display screen, its LED encapsulation structure adopts the design of two-layer equation encapsulation, overturn the encapsulation mode of conventional patch formula LED, the upper and lower surface of lead frame is all formed with the encapsulating housing for accommodating packaging plastic, the upper and lower surface of lead frame is provided with packaging plastic, packaging plastic can play waterproof and dampproof effect, the pattern of double-deck encapsulation substantially increases the waterproof and dampproof ability of product, and plastic material moisture absorption can be avoided completely on the impact of patch-type LED chip and bonding wire; Even if product to be used for outdoor grade in environment, product also can not make moist or intake, and fundamentally avoids the hidden danger of dead lamp, and product reliability is high.
Accompanying drawing explanation
Fig. 1 is the generalized section of the LED encapsulation structure that the embodiment of the present invention provides;
Fig. 2 is the front view of the LED encapsulation structure that the embodiment of the present invention provides;
Fig. 3 is the left view of the LED encapsulation structure that the embodiment of the present invention provides;
Fig. 4 is the end view of the LED encapsulation structure that the embodiment of the present invention provides;
Fig. 5 is the upward view of the LED encapsulation structure that the embodiment of the present invention provides;
Fig. 6 is the stereogram of lead frame in the LED encapsulation structure that provides of the embodiment of the present invention;
Fig. 7 is the schematic diagram of LED encapsulation structure when clicking and entering lower packaging plastic that the embodiment of the present invention provides;
Fig. 8 is the schematic diagram of LED encapsulation structure when installing LED chip that the embodiment of the present invention provides;
Fig. 9 is the schematic diagram of LED encapsulation structure on clicking and entering during packaging plastic that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
As shown in Fig. 1 ~ Fig. 5, the method for packing of a kind of LED that the embodiment of the present invention provides, can be used in the encapsulation of adopting surface mounted LED.Above-mentioned method for packing comprises the following steps, the lead frame 100 that metal material is made is set, then the upper and lower surface in lead frame 100 arranges upper encapsulating housing 210 and lower encapsulating housing 220 respectively, and the position of upper encapsulating housing 210 and lower encapsulating housing 220 corresponds to the same area on lead frame 100.Upper encapsulating housing 210 and lower encapsulating housing 220 can adopt plastic material to be formed on the upper and lower surface of lead frame 100 by the mode of ripe injection mo(u)lding.With reference to figure 7 ~ Fig. 9, during encapsulation, first can make lower encapsulating housing 220 upward, and in the lower encapsulation cavity of lower encapsulating housing 220 the lower packaging plastic 320 of filling liquid, then baking-curing is carried out to lower packaging plastic 320, divides to prevent water and enter.Overturn lead frame 100 again, make encapsulating housing 210 upward, LED chip 410 is placed in the upper encapsulation cavity of upper encapsulating housing 210, and LED chip 410 is connected on lead frame 100 by gold thread 420, upper packaging plastic 310 is filled again in upper encapsulating housing 210, carry out baking-curing to upper packaging plastic 310 again, upper packaging plastic 310 can be covered on LED chip 410.By the design of this employing two-layer equation encapsulation, overturn the encapsulation mode of conventional patch formula LED, the upper and lower surface of lead frame 100 is all formed with the encapsulating housing for accommodating packaging plastic, the upper and lower surface of lead frame 100 is provided with packaging plastic, packaging plastic can play waterproof and dampproof effect, the pattern of double-deck encapsulation substantially increases the waterproof and dampproof ability of product, extraneous moisture, moisture are difficult to arrive the core position place such as LED chip 410 and gold thread 420, and plastic material moisture absorption can be avoided completely on the impact of patch-type LED chip 410 and bonding wire; Even if product to be used for outdoor grade in environment, product also can not make moist or intake, and fundamentally avoids the hidden danger of dead lamp, and product reliability is high.
Or, also can first connect LED chip 410 and click and enter packaging plastic 310 in upper encapsulating housing 210, upper packaging plastic 310 is cured, and then overturn lead frame 100 and click and enter lower packaging plastic 320 in lower encapsulating housing 220.Clicking and entering order and can exchanging of upper packaging plastic 310 and lower packaging plastic 320, all belongs to protection scope of the present invention.
Particularly, as shown in figures 1 to 6, it is shaping that lead frame 100 adopts metal sheet to pass through the mode of punching press, lead frame 100 comprises conductive pin 110, lead frame 100 is formed with line layer 120, conductive pin 110 is connected with line layer 120, and conductive pin 110 can be used for by Product jointing on circuit board, and line layer 120 can be used for connecting LED chip 410.Fill lower packaging plastic 320 in lower encapsulating housing 220 after, adopt the mode of bending and molding by conductive pin 110 bending and molding.In embody rule, multiple lead frame 100 can integrated punching shaping, then encapsulating housing 210 and lower encapsulating housing 220 in synchronous injection mo(u)lding on multiple lead frame 100, to enhance productivity, then by bending equipment by conductive pin 110 bending to required shape, follow-uply each lead frame 100 can be separated, to obtain single LED encapsulation structure, be beneficial to and enhance productivity and reduce production cost.
Particularly, upper encapsulating housing 210 and lower encapsulating housing 220 integrated injection molding, only need an injection moulding just can obtain encapsulating housing 210 and lower encapsulating housing 220, production efficiency is high.
Particularly, upper packaging plastic 310 comprises at least one deck epoxy glue layer and at least one deck layer of silica gel, to reach waterproof and dampproof and the effect of antiultraviolet.In embody rule, LED chip 410 is connected to after on lead frame 100, first in upper encapsulating housing 210, put one deck epoxy glue layer, to cover LED chip 410, in upper encapsulating housing 210, put one deck layer of silica gel again, layer of silica gel is covered in epoxy glue layer, to improve the reliability of product, product uniform light distributes, and waterproof moistureproof antiultraviolet.Certainly, understandably, alternatively, also can click and enter single packing colloid in upper encapsulating housing 210, such as vaporific translucent diffusion colloid, as epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
Particularly, lower packaging plastic 320 comprises at least one deck epoxy glue layer and at least one deck layer of silica gel, to reach waterproof and dampproof and the effect of antiultraviolet.In embody rule, first can put one deck epoxy glue layer in lower encapsulating housing 220, then put one deck layer of silica gel in lower encapsulating housing 220, layer of silica gel is covered in epoxy glue layer, to improve the reliability of product.More specifically, the volume of lower packaging plastic 320 is less than the volume of lower encapsulating housing 220 upper cavity, the lower encapsulation cavity of encapsulating housing 220 under the underfill of lower packaging plastic 320, prevents lower packaging plastic 320 from protruding from the end face of lower encapsulating housing 220 and causing attachment bad.Such as, or also can arrange single colloid at lower encapsulating housing 220, vaporific translucent diffusion colloid such as epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
As shown in Fig. 1 ~ Fig. 5, the embodiment of the present invention additionally provides a kind of LED encapsulation structure, comprise lead frame 100 and LED chip 410, the both sides up and down of lead frame 100 are respectively arranged with encapsulating housing 210 and lower encapsulating housing 220, upper encapsulating housing 210 is for holding LED chip 410 and upper packaging plastic 310, lower encapsulating housing 220 is for holding lower packaging plastic 320, and the position of upper encapsulating housing 210 and lower encapsulating housing 220 corresponds to the same area on lead frame 100.Be fixedly connected on lead frame 100 in the upper encapsulation cavity that LED chip 410 is arranged at encapsulating housing 210, particularly, LED chip 410 is connected on lead frame 100 by gold thread 420.Also be provided with the upper packaging plastic 310 be covered on LED chip 410 in the upper encapsulation cavity of upper encapsulating housing 210, in the lower encapsulation cavity of lower encapsulating housing 220, be provided with lower packaging plastic 320.By the design of this employing two-layer equation encapsulation, overturn the encapsulation mode of conventional patch formula LED, the upper and lower surface of lead frame 100 is all formed with the encapsulating housing for accommodating packaging plastic, the upper and lower surface of lead frame 100 is provided with packaging plastic, packaging plastic can play waterproof and dampproof effect, the pattern of double-deck encapsulation substantially increases the waterproof and dampproof ability of product, extraneous moisture, moisture are difficult to arrive the core position place such as LED chip 410 and gold thread 420, and plastic material moisture absorption can be avoided completely on the impact of patch-type LED chip 410 and bonding wire; Even if product to be used for outdoor grade in environment, product also can not make moist or intake, and fundamentally avoids the hidden danger of dead lamp, and product reliability is high.
Particularly, as shown in Figure 1, upper encapsulating housing 210 and lower encapsulating housing 220 all have the cavity of a bowl cup-shaped, namely go up packaging plastic 310 and lower encapsulation cavity, for accommodation packing colloid; Upper encapsulating housing 210 and lower encapsulating housing 220 integrated injection molding are in the upper and lower surface of lead frame 100, upper encapsulating housing 210 and lower encapsulating housing 220 can reliably be connected to lead frame 100, lead frame 100 will " be inlayed " up and down between encapsulating housing 220 and lower encapsulating housing 220, and structural reliability is high.And upper encapsulating housing 210 and lower encapsulating housing 220 can adopt ripe Shooting Technique single injection-molded, its production efficiency is high, is beneficial to reduction production cost.
Particularly, as depicted in figs. 1 and 2, LED chip 410 comprises at least one group of chipset, often organize chipset and comprise a red LED chips 410, Green Chip and a blue chip, three kinds of colors can be made under the control of driver module to have 256 grades of gray scales and mixing arbitrarily, 256 × 256 × 256=16777216 kind color can be produced, form different photochromic combination, color is changeful, to realize colourful dynamic change effect and various image, can be used as full-color light-emitting diode.Red LED chips 410, Green Chip and blue chip in same chipset be arrangement in " one " font, the LED chip 410 of " one " font arrangement, it can reach the video display effect of homogeneous and the color fidelity compared with business, this is because: in the products such as display screen, user in the front of product, left and right sides viewing display screen time, each chip of " one " font arrangement can equably to user side to injection light, avoid the LED chip 410 of certain color to be stopped, thus improve display effect.In embody rule, the quantity of LED chip 410 and color can be determined according to actual conditions, all belong to protection scope of the present invention.
Particularly, as shown in figures 1 to 6, lead frame 100 comprises line layer 120 and conductive pin 110, and LED chip 410 is welded on line layer 120, to realize being electrically connected.During installation, conductive pin 110 is welded on the carriers such as circuit board.
Particularly, upper packaging plastic 310 comprises at least one deck epoxy glue layer and at least one deck layer of silica gel, to reach waterproof and dampproof and the effect of antiultraviolet.In embody rule, LED chip 410 is connected to after on lead frame 100, first in upper encapsulating housing 210, put one deck epoxy glue layer, to cover LED chip 410, in upper encapsulating housing 210, put one deck layer of silica gel again, layer of silica gel is covered in epoxy glue layer, to improve the reliability of product, product uniform light distributes, and waterproof moistureproof antiultraviolet.Certainly, understandably, alternatively, also can click and enter single packing colloid in upper encapsulating housing 210, such as vaporific translucent diffusion colloid, as epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
Particularly, lower packaging plastic 320 comprises at least one deck epoxy glue layer and at least one deck layer of silica gel, to reach waterproof and dampproof and the effect of antiultraviolet.In embody rule, first can put one deck epoxy glue layer in lower encapsulating housing 220, then put one deck layer of silica gel in lower encapsulating housing 220, layer of silica gel is covered in epoxy glue layer, to improve the reliability of product.More specifically, the volume of lower packaging plastic 320 is less than the volume of lower encapsulating housing 220 upper cavity, the lower encapsulation cavity of encapsulating housing 220 under the underfill of lower packaging plastic 320, prevents lower packaging plastic 320 from protruding from the end face of lower encapsulating housing 220 and causing attachment bad.Such as, or also can arrange single colloid at lower encapsulating housing 220, vaporific translucent diffusion colloid such as epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
Particularly, as shown in figures 1 to 6, lead frame 100 also offers through hole 101, by arranging through hole 101, the plastic material of encapsulating housing can flow through this through hole 101, on the one hand encapsulating housing 210, lower encapsulating housing 220 and lead frame 100 can be reliably fixed together, on the other hand, when bending conductive pin 110, line layer 120 can be avoided to produce the bad phenomenon such as distortion.
The embodiment of the present invention additionally provides a kind of display screen, and display screen has above-mentioned LED encapsulation structure, and above-mentioned LED encapsulation structure adopts the structure of double-deck encapsulation, and its waterproof moisture-proof effect is good, and display screen can be used for outdoor grade in environment, product reliability is high.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement or improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a method for packing of LED, is characterized in that, comprises the following steps, and arranges lead frame, and the quantity of described lead frame is one, and the upper and lower surface then in described lead frame arranges upper encapsulating housing and lower encapsulating housing respectively; Described lower encapsulating housing is arranged upward, and first in described lower encapsulating housing, click and enter at least one deck epoxide-resin glue, at least one deck silica gel is clicked and entered again in described lower encapsulating housing, to form lower packaging plastic, LED chip is placed in described upper encapsulating housing, and LED chip is connected on lead frame, again described upper encapsulating housing is arranged upward, at least one deck epoxide-resin glue is clicked and entered in described upper encapsulating housing, at least one deck silica gel is clicked and entered again, to form upper packaging plastic in described upper encapsulating housing.
2. the method for packing of LED as claimed in claim 1, it is characterized in that, described lead frame adopts the mode of punching press shaping, described lead frame comprises conductive pin, described lead frame is formed with line layer, fill lower packaging plastic in described lower encapsulating housing after, adopt the mode of bending and molding by described conductive pin bending and molding.
3. the method for packing of LED as claimed in claim 1, it is characterized in that, described upper encapsulating housing and lower encapsulating housing are all fixed on described lead frame by the mode of injection mo(u)lding, described upper encapsulating housing and lower encapsulating housing integrated injection molding.
4. a LED encapsulation structure, comprise lead frame and LED chip, the quantity of described lead frame is one, it is characterized in that, the both sides up and down of described lead frame are respectively arranged with encapsulating housing and lower encapsulating housing, and described LED chip to be arranged in described upper encapsulating housing and to be fixedly connected on described lead frame; At least one deck epoxy glue layer click and enter at least one deck layer of silica gel in this epoxy glue layer, to form the upper packaging plastic be covered on described LED chip been has also has been clicked and entered in described upper encapsulating housing; At least one deck epoxy glue layer click and enter at least one deck layer of silica gel in this epoxy glue layer, to form lower packaging plastic has been clicked and entered in described lower encapsulating housing.
5. LED encapsulation structure as claimed in claim 4, it is characterized in that, described upper encapsulating housing and lower encapsulating housing all have the cavity of a bowl cup-shaped; Described upper encapsulating housing and lower encapsulating housing integrated injection molding are in the upper and lower surface of described lead frame.
6. LED encapsulation structure as claimed in claim 4, it is characterized in that, described LED chip comprises at least one group of chipset, described chipset comprises a red LED chips, a Green Chip and a blue chip, and red LED chips, Green Chip and blue chip in same described chipset be arrangement in " one " font.
7. LED encapsulation structure as claimed in claim 4, it is characterized in that, described lead frame comprises line layer and conductive pin, and described LED chip is welded on described line layer.
8. a display screen, is characterized in that, described display screen has the LED encapsulation structure according to any one of claim 4 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210038438.XA CN102593321B (en) | 2012-02-20 | 2012-02-20 | The method for packing of LED, LED encapsulation structure and display screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210038438.XA CN102593321B (en) | 2012-02-20 | 2012-02-20 | The method for packing of LED, LED encapsulation structure and display screen |
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| CN102593321A CN102593321A (en) | 2012-07-18 |
| CN102593321B true CN102593321B (en) | 2015-11-25 |
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| CN111430343A (en) * | 2020-03-31 | 2020-07-17 | 深圳市唯亮光电科技有限公司 | Vertical integrated packaging assembly and packaging method thereof |
| CN114005820A (en) * | 2021-11-24 | 2022-02-01 | 深圳市唯亮光电科技有限公司 | Vertical packaging structure with upper cup and lower cup |
| CN114464097B (en) * | 2022-04-07 | 2022-08-02 | 武汉芯享光电科技有限公司 | Display structure, manufacturing method of display structure and display |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1381906A (en) * | 2001-04-09 | 2002-11-27 | 株式会社东芝 | light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3614776B2 (en) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | Chip component type LED and its manufacturing method |
| US7868343B2 (en) * | 2004-04-06 | 2011-01-11 | Cree, Inc. | Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same |
| JP2006156668A (en) * | 2004-11-29 | 2006-06-15 | Nichia Chem Ind Ltd | Light emitting device and its manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1381906A (en) * | 2001-04-09 | 2002-11-27 | 株式会社东芝 | light emitting device |
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