CN102593321A - LED (light emitting diode) packaging method, LED packaging structure and display screen - Google Patents
LED (light emitting diode) packaging method, LED packaging structure and display screen Download PDFInfo
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- CN102593321A CN102593321A CN201210038438XA CN201210038438A CN102593321A CN 102593321 A CN102593321 A CN 102593321A CN 201210038438X A CN201210038438X A CN 201210038438XA CN 201210038438 A CN201210038438 A CN 201210038438A CN 102593321 A CN102593321 A CN 102593321A
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- lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention is suitable for the technical field of LEDs (light emitting diode) and discloses an LED packaging method, an LED packaging structure and a display screen. The packaging method comprises the steps of arranging a lead frame, respectively arranging an upper packaging shell and a lower packaging shell on the upper surface and the lower surface of the lead frame, filling lower packaging glue in the lower packaging shell, placing an LED chip in the upper packaging shell, connecting the LED chip on the lead frame, and filling upper packaging glue in the upper packaging shell. The packaging structure comprises the lead frame and the LED chip, wherein the upper side and the lower side of the lead frame are respectively provided with the upper packaging shell and the lower packaging shell, the LED chip is arranged in the upper packaging shell and is fixedly connected on the lead frame, the upper packaging shell is internally provided with the upper packaging glue which covers on the LED chip, and the lower packaging shell is internally provided with the lower packaging glue. The display screen is provided with the LED packaging structure. According to LED packaging method, the LED packaging structure and the display screen, the LED packaging structure adopts a double-layer packaging design, so that the product performance is high.
Description
Technical field
The invention belongs to the LED technical field, relate in particular to a kind of method for packing, LED encapsulating structure of adopting surface mounted LED and comprise the display screen of this LED encapsulating structure.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor device, and it can directly be converted into light to electricity.It has changed the luminous and luminous principle of electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.The characteristics of LED are very obvious: the life-span is long, light efficiency is high, radiationless and low-power consumption.
The spectrum of LED almost all concentrates on visible light frequency band; The led light source red, green, blue principle of three primary colours capable of using; Under computer technology control, make three kinds of colors have 256 grades of gray scales and mixing arbitrarily; Can produce 256 * 256 * 256=16777216 kind color, form different photochromic combination and variation multiterminal, realize colourful dynamic change effect and various image.
In view of the intrinsic advantage of LED, widely apply on products such as display screen, light fixture at present.In the prior art, paster LED can't be broken through the packaging technology technology of outdoor water-proof protection against the tide and antiultraviolet always, so still adopt Lamp conventional package structure to be used for outdoor display screen market.At present, the patch-type material all is to adopt PLCC 6, PLCC 4 structures, and wherein the moisture-absorption characteristics of the PPA plastics of PLCC employing itself causes the waterproof and dampproof weak effect of product, and LED is applied to outdoor display screen regular meeting and bad phenomenon such as dead lamp occur, and product reliability is poor.
Summary of the invention
The objective of the invention is to overcome the deficiency of above-mentioned prior art, method for packing, LED encapsulating structure and the display screen of a kind of LED is provided, its LED product waterproof moisture-proof effect is good, and product reliability is high.
Technical scheme of the present invention is: the method for packing of a kind of LED; May further comprise the steps, lead frame is set, the upper and lower surface in said lead frame is provided with encapsulating housing and following encapsulating housing respectively then; And packaging plastic under in said encapsulating housing down, filling; Place led chip in said going up in the encapsulating housing, and led chip is connected on the lead frame, fill upward packaging plastic in the encapsulating housing in said going up.
Particularly, said lead frame adopts the mode moulding of punching press, and said lead frame comprises conductive pin, is formed with line layer on the said lead frame, and behind the packaging plastic, the mode that adopts bending and molding is with said conductive pin bending and molding under in said encapsulating housing down, filling.
Particularly, the said encapsulating housing of going up all is fixed in said lead frame through the mode of injection mo(u)lding with following encapsulating housing, said encapsulating housing and the following encapsulating housing integrated injection molding gone up.
Particularly, the said packaging plastic of going up comprises one deck epoxy glue layer and one deck silica gel layer at least at least.
Particularly, said packaging plastic down comprises one deck epoxy glue layer and one deck silica gel layer at least at least.
The present invention also provides a kind of LED encapsulating structure; Comprise lead frame and led chip; The both sides up and down of said lead frame are respectively arranged with encapsulating housing and following encapsulating housing; Said led chip is arranged in the said last encapsulating housing and is fixedly connected on the said lead frame, and said going up in the encapsulating housing also is provided with the last packaging plastic that is covered on the said led chip, is provided with down packaging plastic in the said following encapsulating housing.
Particularly, said upward encapsulating housing and following encapsulating housing all have the cavity of a bowl cup-shaped; Said upward encapsulating housing and following encapsulating housing integrated injection molding are in the upper and lower surface of said lead frame.
Particularly; Said led chip comprises at least one group of chipset; Said chipset comprises a red LED chips, a green chip and a blue chip, and the red LED chips in the same said chipset, green chip and blue chip are " one " font and arrange.
Particularly, said lead frame comprises line layer and conductive pin, and said led chip is welded on the said line layer.
The present invention also provides a kind of display screen, and said display screen has above-mentioned LED encapsulating structure.
The method for packing of a kind of LED provided by the invention, LED encapsulating structure and display screen; Its LED encapsulating structure adopts the design of two-layer equation encapsulation; Overturned the encapsulation mode of traditional adopting surface mounted LED; The upper and lower surface of lead frame all is formed with the encapsulating housing that is used for ccontaining packaging plastic, and the upper and lower surface of lead frame is provided with packaging plastic, and packaging plastic can play waterproof and dampproof effect; The pattern of double-deck encapsulation has improved the waterproof and dampproof ability of product greatly, can avoid the influence of plastic material moisture absorption to patch-type led chip and bonding wire fully; Even product is used for environment such as open air, product can not make moist or intake yet, and has fundamentally avoided the hidden danger of dead lamp, and product reliability is high.
Description of drawings
Fig. 1 is the generalized section of the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 2 is the front view of the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 3 is the left view of the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 4 is the end view of the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 5 is the upward view of the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 6 is the stereogram of lead frame in the LED encapsulating structure that provides of the embodiment of the invention;
Fig. 7 is the sketch map of LED encapsulating structure when clicking and entering packaging plastic that the embodiment of the invention provides;
Fig. 8 is the sketch map of LED encapsulating structure when led chip is installed that the embodiment of the invention provides;
Fig. 9 is the LED encapsulating structure that provides of embodiment of the invention sketch map during packaging plastic on clicking and entering.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Like Fig. 1～shown in Figure 5, the method for packing of a kind of LED that the embodiment of the invention provides can be used in the encapsulation of adopting surface mounted LED.Above-mentioned method for packing may further comprise the steps; The lead frame 100 that metal material is processed is set; Upper and lower surface in lead frame 100 is provided with encapsulating housing 210 and following encapsulating housing 220 respectively then, and the position of last encapsulating housing 210 and following encapsulating housing 220 is corresponding to the same area on the lead frame 100.Last encapsulating housing 210 can adopt plastic material to be formed on the upper and lower surface of lead frame 100 through the mode of the injection mo(u)lding of maturation with following encapsulating housing 220.With reference to figure 7～Fig. 9, during encapsulation, can make down earlier encapsulating housing 220 up, and in the following encapsulation cavity of following encapsulating housing 220 the following packaging plastic 320 of filling liquid, then packaging plastic 320 is down carried out baking-curing, get into to prevent that water from dividing.Lead frame 100 again overturns; Make encapsulating housing 210 up; Place led chip 410 in going up in the encapsulation cavity of last encapsulating housing 210, and led chip 410 is connected on the lead frame 100 through gold thread 420, in last encapsulating housing 210, fill again and go up packaging plastic 310; Again last packaging plastic 310 is carried out baking-curing, last packaging plastic 310 can be covered on the led chip 410.Design through this employing two-layer equation encapsulation; Overturned the encapsulation mode of traditional adopting surface mounted LED; The upper and lower surface of lead frame 100 all is formed with the encapsulating housing that is used for ccontaining packaging plastic; The upper and lower surface of lead frame 100 is provided with packaging plastic, and packaging plastic can play waterproof and dampproof effect, and the pattern of double-deck encapsulation has improved the waterproof and dampproof ability of product greatly; Extraneous moisture, moisture are difficult to arrive core position places such as led chip 410 and gold thread 420, can avoid the influence of plastic material moisture absorption to patch-type led chip 410 and bonding wire fully; Even product is used for environment such as open air, product can not make moist or intake yet, and has fundamentally avoided the hidden danger of dead lamp, and product reliability is high.
Perhaps, also can connect led chip 410 earlier and in last encapsulating housing 210, click and enter packaging plastic 310, last packaging plastic 310 is cured, and then upset lead frame 100 and in down clicking and entering down packaging plastic 320 in the encapsulating housing 220.Clicking and entering order and can exchanging of last packaging plastic 310 and following packaging plastic 320 all belongs to protection scope of the present invention.
Particularly; Like Fig. 1 and shown in Figure 6, lead frame 100 adopts the mode moulding of metal sheet through punching press, and lead frame 100 comprises conductive pin 110; Be formed with line layer 120 on the lead frame 100; Conductive pin 110 is connected with line layer 120, and conductive pin 110 can be used for product is welded on the circuit board, and line layer 120 can be used for connecting led chip 410.Behind the packaging plastic 320, the mode that adopts bending and molding is with conductive pin 110 bending and moldings under in following encapsulating housing 220, filling.In concrete the application; But a plurality of lead frame 100 integrated punching moulding, encapsulating housing 210 and following encapsulating housing 220 in injection mo(u)lding synchronously on a plurality of lead frames 100 then are to enhance productivity; Pass through bending equipment then with conductive pin 110 bendings to required shape; Obtain single LED encapsulating structure follow-up can each lead frame 100 separation, is beneficial to and enhances productivity and reduce production costs.
Particularly, last encapsulating housing 210 and following encapsulating housing 220 integrated injection moldings only need an injection moulding just can obtain encapsulating housing 210 and following encapsulating housing 220, and production efficiency is high.
Particularly, last packaging plastic 310 comprises one deck epoxy glue layer and one deck silica gel layer at least at least, to reach the effect of waterproof and dampproof and antiultraviolet.In concrete the application, be connected in led chip 410 on the lead frame 100 after, in last encapsulating housing 210, put the layer of epoxy glue layer earlier; To cover led chip 410; In last encapsulating housing 210, put one deck silica gel layer again, silica gel layer is covered on the epoxy glue layer, to improve reliability of products; Product light evenly distributes, and waterproof moistureproof antiultraviolet.Certainly, be appreciated that ground, as alternative, also can in last encapsulating housing 210, click and enter single packing colloid, for example vaporific translucent diffusion colloid like epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
Particularly, following packaging plastic 320 comprises one deck epoxy glue layer and one deck silica gel layer at least at least, to reach the effect of waterproof and dampproof and antiultraviolet.In specifically using, can put the layer of epoxy glue layer in the encapsulating housing 220 down earlier, put one deck silica gel layer in the encapsulating housing 220 down again, silica gel layer is covered on the epoxy glue layer, to improve reliability of products.More specifically, the volume of following packaging plastic 320 is less than the volume of following encapsulating housing 220 upper cavities, and the following encapsulation cavity of encapsulating housing 220 under following packaging plastic 320 underfills prevents down that packaging plastic 320 protrudes from down the end face of encapsulating housing 220 and causes mounting bad.Perhaps, also can single colloid be set at following encapsulating housing 220, for example vaporific translucent diffusion colloid such as epoxide-resin glue or silica gel all belongs to protection scope of the present invention.
Like Fig. 1～shown in Figure 5; The embodiment of the invention also provides a kind of LED encapsulating structure; Comprise lead frame 100 and led chip 410, the both sides up and down of lead frame 100 are respectively arranged with encapsulating housing 210 and following encapsulating housing 220, and last encapsulating housing 210 is used to hold led chip 410 and last packaging plastic 310; Following encapsulating housing 220 is used to hold packaging plastic 320 down, and the position of last encapsulating housing 210 and following encapsulating housing 220 is corresponding to the same area on the lead frame 100.Led chip 410 is arranged at going up in the encapsulation cavity and being fixedly connected on the lead frame 100 of encapsulating housing 210, and particularly, led chip 410 is connected on the lead frame 100 through gold thread 420.Going up in the encapsulation cavity of last encapsulating housing 210 also is provided with the last packaging plastic 310 that is covered on the led chip 410, is provided with down packaging plastic 320 in the following encapsulation cavity of following encapsulating housing 220.Design through this employing two-layer equation encapsulation; Overturned the encapsulation mode of traditional adopting surface mounted LED; The upper and lower surface of lead frame 100 all is formed with the encapsulating housing that is used for ccontaining packaging plastic; The upper and lower surface of lead frame 100 is provided with packaging plastic, and packaging plastic can play waterproof and dampproof effect, and the pattern of double-deck encapsulation has improved the waterproof and dampproof ability of product greatly; Extraneous moisture, moisture are difficult to arrive core position places such as led chip 410 and gold thread 420, can avoid the influence of plastic material moisture absorption to patch-type led chip 410 and bonding wire fully; Even product is used for environment such as open air, product can not make moist or intake yet, and has fundamentally avoided the hidden danger of dead lamp, and product reliability is high.
Particularly, as shown in Figure 1, last encapsulating housing 210 and following encapsulating housing 220 all have the cavity of a bowl cup-shaped, promptly go up packaging plastic 310 and encapsulate cavity down, to be used to hold packing colloid; Last encapsulating housing 210 and following encapsulating housing 220 integrated injection moldings are in the upper and lower surface of lead frame 100; Last encapsulating housing 210 can be connected in lead frame 100 reliably with following encapsulating housing 220; Lead frame 100 will " be inlayed " up and down between the encapsulating housing 220 and following encapsulating housing 220, and structural reliability is high.And last encapsulating housing 210 can adopt ripe Shooting Technique single injection-molded with following encapsulating housing 220, and its production efficiency is high, is beneficial to reduce production costs.
Particularly, as depicted in figs. 1 and 2, led chip 410 comprises at least one group of chipset; Every group of chipset comprises a red LED chips 410, a green chip and a blue chip, under the control of driver module, can make three kinds of colors have 256 grades of gray scales and mixes arbitrarily, can produce 256 * 256 * 256=16777216 kind color; Form different photochromic combinations; The change color multiterminal to realize colourful dynamic change effect and various image, can be used as full-color light-emitting diode.Red LED chips 410 in the same chipset, green chip and blue chip are " one " font and arrange; The led chip 410 that " one " font is arranged; It can reach the video display effect of homogeneous and the color fidelity of discussing; This be because: in products such as display screen, the user is in the front of product, when left and right sides is watched display screen, each chip that " one " font is arranged can be equably to the user side to penetrating light; Avoid the led chip 410 of certain color to be stopped, thereby improved display effect.In concrete the application, the quantity of led chip 410 and color can be decided according to actual conditions, all belong to protection scope of the present invention.
Particularly, like Fig. 1 and shown in Figure 6, lead frame 100 comprises line layer 120 and conductive pin 110, and led chip 410 is welded on the line layer 120, to realize electric connection.During installation, conductive pin 110 is welded on the carriers such as circuit board.
Particularly, last packaging plastic 310 comprises one deck epoxy glue layer and one deck silica gel layer at least at least, to reach the effect of waterproof and dampproof and antiultraviolet.In concrete the application, be connected in led chip 410 on the lead frame 100 after, in last encapsulating housing 210, put the layer of epoxy glue layer earlier; To cover led chip 410; In last encapsulating housing 210, put one deck silica gel layer again, silica gel layer is covered on the epoxy glue layer, to improve reliability of products; Product light evenly distributes, and waterproof moistureproof antiultraviolet.Certainly, be appreciated that ground, as alternative, also can in last encapsulating housing 210, click and enter single packing colloid, for example vaporific translucent diffusion colloid like epoxide-resin glue or silica gel etc., all belongs to protection scope of the present invention.
Particularly, following packaging plastic 320 comprises one deck epoxy glue layer and one deck silica gel layer at least at least, to reach the effect of waterproof and dampproof and antiultraviolet.In specifically using, can put the layer of epoxy glue layer in the encapsulating housing 220 down earlier, put one deck silica gel layer in the encapsulating housing 220 down again, silica gel layer is covered on the epoxy glue layer, to improve reliability of products.More specifically, the volume of following packaging plastic 320 is less than the volume of following encapsulating housing 220 upper cavities, and the following encapsulation cavity of encapsulating housing 220 under following packaging plastic 320 underfills prevents down that packaging plastic 320 protrudes from down the end face of encapsulating housing 220 and causes mounting bad.Perhaps, also can single colloid be set at following encapsulating housing 220, for example vaporific translucent diffusion colloid such as epoxide-resin glue or silica gel all belongs to protection scope of the present invention.
Particularly, like Fig. 1 and shown in Figure 6, also offer through hole 101 on the lead frame 100; Through through hole 101 is set; The plastic material of encapsulating housing can flow through this through hole 101, encapsulating housing 210, following encapsulating housing 220 and lead frame 100 can be fixed together reliably, on the other hand; When bending conductive pin 110, can avoid line layer 120 to produce bad phenomenon such as distortion.
The embodiment of the invention also provides a kind of display screen, and display screen has above-mentioned LED encapsulating structure, and above-mentioned LED encapsulating structure adopts the structure of double-deck encapsulation, and its waterproof moisture-proof effect is good, can display screen be used for environment such as open air, and product reliability is high.
More than be merely preferred embodiment of the present invention,, all any modifications of within spirit of the present invention and principle, being done, be equal to and replace or improvement etc., all should be included within protection scope of the present invention not in order to restriction the present invention.
Claims (10)
1. the method for packing of a LED is characterized in that, may further comprise the steps; Lead frame is set; Upper and lower surface in said lead frame is provided with encapsulating housing and following encapsulating housing respectively then, and in said encapsulating housing down, fills packaging plastic down, places led chip in said going up in the encapsulating housing; And led chip is connected on the lead frame, again in said go up to fill in the encapsulating housing go up packaging plastic.
2. the method for packing of LED as claimed in claim 1; It is characterized in that; Said lead frame adopts the mode moulding of punching press, and said lead frame comprises conductive pin, is formed with line layer on the said lead frame; Behind the packaging plastic, the mode that adopts bending and molding is with said conductive pin bending and molding under in said encapsulating housing down, filling.
3. the method for packing of LED as claimed in claim 1 is characterized in that, the said encapsulating housing of going up all is fixed in said lead frame through the mode of injection mo(u)lding with following encapsulating housing, said encapsulating housing and the following encapsulating housing integrated injection molding gone up.
4. the method for packing of LED as claimed in claim 1 is characterized in that, the said packaging plastic of going up comprises one deck epoxy glue layer and one deck silica gel layer at least at least.
5. the method for packing of LED as claimed in claim 1 is characterized in that, said packaging plastic down comprises one deck epoxy glue layer and one deck silica gel layer at least at least.
6. LED encapsulating structure; Comprise lead frame and led chip; It is characterized in that the both sides up and down of said lead frame are respectively arranged with encapsulating housing and following encapsulating housing, said led chip is arranged in the said upward encapsulating housing and is fixedly connected on the said lead frame; Also be provided with the last packaging plastic that is covered on the said led chip in the said last encapsulating housing, be provided with down packaging plastic in the said following encapsulating housing.
7. LED encapsulating structure as claimed in claim 6 is characterized in that, said upward encapsulating housing and following encapsulating housing all have the cavity of a bowl cup-shaped; Said upward encapsulating housing and following encapsulating housing integrated injection molding are in the upper and lower surface of said lead frame.
8. LED encapsulating structure as claimed in claim 6; It is characterized in that; Said led chip comprises at least one group of chipset; Said chipset comprises a red LED chips, a green chip and a blue chip, and the red LED chips in the same said chipset, green chip and blue chip are " one " font and arrange.
9. LED encapsulating structure as claimed in claim 6 is characterized in that said lead frame comprises line layer and conductive pin, and said led chip is welded on the said line layer.
10. a display screen is characterized in that, said display screen has like each described LED encapsulating structure in the claim 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210038438.XA CN102593321B (en) | 2012-02-20 | 2012-02-20 | The method for packing of LED, LED encapsulation structure and display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210038438.XA CN102593321B (en) | 2012-02-20 | 2012-02-20 | The method for packing of LED, LED encapsulation structure and display screen |
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| Publication Number | Publication Date |
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| CN102593321A true CN102593321A (en) | 2012-07-18 |
| CN102593321B CN102593321B (en) | 2015-11-25 |
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| CN111430343A (en) * | 2020-03-31 | 2020-07-17 | 深圳市唯亮光电科技有限公司 | Vertical integrated packaging assembly and packaging method thereof |
| CN114464097A (en) * | 2022-04-07 | 2022-05-10 | 武汉芯享光电科技有限公司 | Display structure, manufacturing method of display structure and display |
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| US20020079837A1 (en) * | 2000-12-19 | 2002-06-27 | Jun Okazaki | Chip-type LED and process of manufacturing the same |
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| CN111430343A (en) * | 2020-03-31 | 2020-07-17 | 深圳市唯亮光电科技有限公司 | Vertical integrated packaging assembly and packaging method thereof |
| CN114464097A (en) * | 2022-04-07 | 2022-05-10 | 武汉芯享光电科技有限公司 | Display structure, manufacturing method of display structure and display |
| CN114464097B (en) * | 2022-04-07 | 2022-08-02 | 武汉芯享光电科技有限公司 | Display structure, manufacturing method of display structure and display |
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