CN209087897U - The LED of heat curing type package support and embedded communication IC integration packaging - Google Patents
The LED of heat curing type package support and embedded communication IC integration packaging Download PDFInfo
- Publication number
- CN209087897U CN209087897U CN201821280573.4U CN201821280573U CN209087897U CN 209087897 U CN209087897 U CN 209087897U CN 201821280573 U CN201821280573 U CN 201821280573U CN 209087897 U CN209087897 U CN 209087897U
- Authority
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- China
- Prior art keywords
- led
- epoxy resin
- pin
- tabular
- resin frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000004891 communication Methods 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000013007 heat curing Methods 0.000 title claims abstract description 11
- 230000010354 integration Effects 0.000 title claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims abstract description 49
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 49
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 5
- 230000003760 hair shine Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 101100238659 Arabidopsis thaliana MSL4 gene Proteins 0.000 description 2
- 101100185017 Arabidopsis thaliana MSL6 gene Proteins 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 101100297763 Mycobacterium tuberculosis (strain ATCC 25618 / H37Rv) pks12 gene Proteins 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses the LED of a kind of heat curing type package support and embedded communication IC integration packaging, includes metal plate, thermosetting epoxy resin frame, LED luminescent wafer, integrated communication IC and epoxy resin encapsulation glue portion；LED metal plate has several tabular pins, and LED heat curable type epoxy resin frame is that molding takes shape on metal plate, and the bottom surface of tabular pin is exposed to the bottom surface of thermosetting epoxy resin frame；The top of LED heat curable type epoxy resin frame is recessed with downwards accommodating chamber, and the top surface of tabular pin is exposed in accommodating chamber；LED epoxy resin encapsulation glue portion is through hot setting molded package in accommodating chamber, and LED luminescent wafer, integrated communication IC, tabular pin are sealed in epoxy resin encapsulation glue portion.Whereby, product humidity resistance is improved, meanwhile, realize that product is lightening, without excessive passive device, product is more energy saving.
Description
Technical field
The utility model relates to LED field technologies, refer in particular to a kind of heat curing type package support and embedded communication IC collection
At the LED of encapsulation.
Background technique
In traditional technology, when making LED, usually using the pad bottom plate that material copper strips is struck out to design, electricity is carried out
Then PPA material is carried out injection molding (thermoplastics type) by injection molding machine by depositing process；The material strip that injection molding is completed is rolled over again
It is curved and according to requiring to carry out cutting packaging.
Metal framework used by existing is that the materials such as thermoplastics type PPA, PCT carry out injection molding, such encapsulating material
Because frame belongs to humidity-sensitive material, easily moisture absorption is made moist, stringenter to use environment and preservation requirement, and pipe is not easy at terminal client
Control, and the material after making moist carries out SMT technique, easily damage product electrical connection, causes to fail；Meanwhile thermoplasticity metal frame
Frame is not easy to reduce product height, if reducing product height, easily occurs that structural strength is bad or easy fracture etc. is bad.In addition,
Existing scheme uses metal folding, and the pin for conductive and heat-conductive is limited to metal pins size and structure qualification, and heat can not
Effectively export；It only limiting and uses small-power product, existing product encapsulation power is too low (usually < 0.2W), if power is excessively high,
It will affect product service life.
Therefore, it is necessary to develop the new technical solution of one kind to solve the above problems.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of heat curing type
The LED of package support and embedded communication IC integration packaging, which raises product humidity resistances, meanwhile, realize that product is lightening,
Without excessive passive device, product is more energy saving.
To achieve the above object, the utility model is using following technical solution:
A kind of LED of heat curing type package support and embedded communication IC integration packaging, includes metal plate, heat cured epoxy
Resinous framework, LED luminescent wafer, integrated communication IC and epoxy resin encapsulate glue portion；Wherein:
The metal plate has several tabular pins, and the thermosetting epoxy resin frame is that molding takes shape in gold
Belong on plate, the bottom surface of tabular pin is exposed to the bottom surface of thermosetting epoxy resin frame；The thermosetting epoxy resin frame
Top is recessed with downwards accommodating chamber, and the top surface of tabular pin is exposed in accommodating chamber, and LED luminescent wafer, integrated communication IC are located at
In accommodating chamber and the top surface for being fixed on corresponding tabular pin is respectively welded, LED luminescent wafer, integrated communication IC, tabular are drawn
It is electrically connected between foot；Epoxy resin encapsulation glue portion is through hot setting molded package in accommodating chamber, and LED is sent out
Light chip, integrated communication IC, tabular pin are sealed in epoxy resin encapsulation glue portion.
As a preferred embodiment, the tabular pin of the metal plate has Copper base material layer, from the top surface of Copper base material layer
The upside nickel coating set, upside silver coating are plated upwards in turn, and, successively plate the downside plating set downwards from the bottom surface of Copper base material layer
Nickel layer, downside silver coating.
As a preferred embodiment, several tabular pins are respectively defined as signal input pin, signal output is drawn
Foot, GND pin, VDD pin；LED luminescent wafer includes red LED chip, BLUE LED emissions chip, green LED hair
Light chip；
Aforementioned integrated communication IC is fixedly welded on GND pin, and BLUE LED emissions chip is fixedly welded on signal output and draws
On foot, red LED chip, green LEDs chip, which are then respectively welded, to be fixed on VDD pin.
The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology
Known to scheme:
One, it solves the problem of that existing product wet sensitive grade is excessively high and is not easy terminal applies；Using the technical side of the utility model
Case, wet sensitive grade can at least promote MSL4 grades by original MSL6 grade；Thermoset material has higher compared with thermoplastic material
The wet sensitive grade of air-tightness, product then can be lower, is easier to be received by terminal；Thermosetting epoxy resin frame and epoxy resin seal
Glue subordinate is filled in same system material, for adjacent system material when by cold and hot rush, the internal stress reacted is then close, more can be effective
It protects internal illumination crystal and bonding material from impact, enhances the reliability of product；
Two, it is excessively high to solve existing product packaging height, it is not easy to use in small spacing and the limited product of height space；With
And existing product encapsulation power too low (< 0.2W) is solved the problems, such as using thermosetting framework, product power can be used for 0.5W or more,
With more high-termal conductivity, small spacing high brightness problem is solved；To realize that product is lightening, without excessive passive device, the energy of product
It is more efficient to imitate ratio, reduces electric energy loss on passive device, product is more energy saving；In the utility model, product has higher
Conductive and heat-conductive characteristic.
For the structure feature and effect for more clearly illustrating the utility model, come with reference to the accompanying drawing with specific embodiment pair
The utility model is described in detail.
Detailed description of the invention
Fig. 1 is the top view of the embodiment of the utility model；
Fig. 2 is the bottom view of the embodiment of the utility model；
Fig. 3 is the side view of the embodiment of the utility model.
Description of drawing identification:
1, thermosetting epoxy resin frame 2, integrated communication IC
3, signal input pin 4, signal output pin
5, GND pin 6, VDD pin
7, red LED chip 8, BLUE LED emissions chip
9, green LEDs chip 10, fool proof recess.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 3, that show the specific structures of the embodiment of the utility model.
A kind of LED of heat curing type package support and embedded communication IC integration packaging, includes metal plate, heat cured epoxy
Resinous framework 1, LED luminescent wafer, integrated communication IC2 and epoxy resin encapsulate glue portion；Wherein:
The metal plate has several tabular pins, and the thermosetting epoxy resin frame 1 is that molding takes shape in gold
Belong on plate, the bottom surface of tabular pin is exposed to the bottom surface of thermosetting epoxy resin frame 1；In general, the bottom of the tabular pin
Face and the bottom surface of thermosetting epoxy resin frame 1 keep substantially flush.The top of the thermosetting epoxy resin frame 1 is to recessed
Equipped with accommodating chamber, the top surface of tabular pin is exposed in accommodating chamber, LED luminescent wafer, integrated communication IC be located in accommodating chamber and
It is respectively welded the top surface for being fixed on corresponding tabular pin, LED luminescent wafer, integrated communication IC, is formed between tabular pin
It is electrically connected；Epoxy resin encapsulation glue portion is through hot setting molded package in accommodating chamber, and LED luminescent wafer collects
It is sealed in epoxy resin encapsulation glue portion at communication IC, tabular pin.The epoxy resin encapsulation glue portion and receiving
The interior sidewall surface of chamber forms sealed connection.
In the present embodiment, the tabular pin of the metal plate have Copper base material layer, from the top surface of Copper base material layer successively to
It is upper to plate the upside nickel coating, the upside silver coating that set, and, successively plated downwards from the bottom surface of Copper base material layer the downside nickel coating set,
Downside silver coating.
Several tabular pins are respectively defined as signal input pin 3, signal output pin 4, GND pin 5, VDD
Pin 6；LED luminescent wafer includes red LED chip 7, BLUE LED emissions chip 8, green LEDs chip 9；
Aforementioned integrated communication IC2 is fixedly welded on GND pin 5, and it is defeated that BLUE LED emissions chip 8 is fixedly welded on signal
Out on pin 4, red LED chip 7, green LEDs chip 9, which are then respectively welded, to be fixed on VDD pin 6.
Next, the LED manufacture craft of a kind of heat curing type package support and embedded communication IC integration packaging is introduced, including
Following steps:
Flat sheet metal is first obtained several tabular pins by etch process by step 1；It is right in the step 1
The sheet metal that several tabular pins are obtained after etch process carries out electroplating technology again.Preferably, the sheet metal is copper
Plate, the electroplating technology, which refers to, first carries out nickel plating technology in the outer surface of copper sheet material, then carries out silver plating process, in copper sheet material
Top surface plate upwards in turn be equipped with upside nickel coating, upside silver coating, and, the bottom surface of copper sheet material successively downwards plating be equipped with
Downside nickel coating, downside silver coating；
Thermosetting epoxy resin material is carried out molding molding by step 2 on the sheet metal that step 1 obtains, to obtain
Obtain thermosetting epoxy resin frame 1；Wherein: the bottom surface of tabular pin is exposed to the bottom surface of thermosetting epoxy resin frame 1；It is described
The top of thermosetting epoxy resin frame 1 is recessed with downwards accommodating chamber, and the top surface of tabular pin is exposed in accommodating chamber；Accommodating chamber
Whole is in up big and down small bowl structure, and there are four arc-shaped corners positions for accommodating chamber tool；Correspondence is following to be provided with fool proof recess
Arc-shaped corners at 10 that angle position, arc radius is bigger than the arc radius of the other three arc-shaped corners, the other three circle
The arc radius of curved corners be usually designed as it is identical, in this way, facilitating differentiation.Comparison diagram 1 and Fig. 2, it is known that, tabular pin
When being exposed in accommodating chamber, the spacing of adjacent flat plate pin is smaller；And tabular pin is exposed to thermosetting epoxy resin frame 1
When bottom surface, the spacing of adjacent flat plate pin is larger, that is to say, that the bottom of thermosetting epoxy resin frame 1 is to tabular pin
Bottom surface carried out partial occlusion formula cladding, thermosetting epoxy resin frame 1 can fill up the gap of adjacent flat plate pin, thermosetting
The bottom of type epoxy resin frame 1 coats the periphery of each tabular pin, only draws in side to each tabular
The narrow position that foot leaves the bottom sides for extending to thermosetting epoxy resin frame 1 does not cover；Thermosetting epoxy resin frame 1
Top domain formula cladding is carried out to the periphery of entire sheet metal；Therefore, under the premise of ensuring product slimming, effectively add
Strong sound construction degree between thermosetting epoxy resin frame 1 and sheet metal, tightness, improve product quality.And
Herein, in the generally rectangular shaped structure of thermosetting epoxy resin frame 1, at an angle at the top of thermosetting epoxy resin frame 1
Fool proof recess 10 is provided at position；
Step 3, by LED luminescent wafer, integrated communication IC2 respectively at being fixedly welded on corresponding tabular pin in accommodating chamber
Top surface, and will be electrically connected between LED luminescent wafer, integrated communication IC2, tabular pin；
Step 4 instills epoxy resin packaging plastic water in accommodating chamber, carries out curing molding, epoxy resin envelope by high temperature
Dress glue is solidified into epoxy resin encapsulation glue portion in accommodating chamber, to draw to LED luminescent wafer, integrated communication IC2, tabular
Foot carries out closed encapsulation；
Step 5 is cut, and single formula LED is obtained；It is cut using water knife along design Cutting Road, gradation, it is most laggard
The photochromic electricity sorting braid of row, vacuum packaging storage.
The design focal point of the utility model is, it is excessively high mainly to solve existing product wet sensitive grade, is not easy terminal
Using the problem of；Using the technical solution of the utility model, wet sensitive grade can at least promote MSL4 by original MSL6 grade
Grade；Thermoset material has more high-air-tightness compared with thermoplastic material, and the wet sensitive grade of product then can be lower, is easier to be connect by terminal
By；Thermosetting epoxy resin frame and epoxy resin encapsulation glue subordinate are in same system material, and adjacent system material is by cold and hot
When rushing, the internal stress reacted is then close, more can effective protection internal illumination crystal and bonding material from impact, enhance product
Reliability；
And solution existing product packaging height is excessively high, it is not easy to use in small spacing and the limited product of height space；
And solve the problems, such as existing product encapsulation power too low (< 0.2W) using thermosetting framework, product power can be used for 0.5W with
On, there is more high-termal conductivity, solve small spacing high brightness problem；To realize that product is lightening, without excessive passive device, product it
Energy Efficiency Ratio is more efficient, reduces electric energy loss on passive device, product is more energy saving；In the utility model, product have compared with
Electric-conductivity heat-conductivity high characteristic；
In addition, under the premise of ensuring product slimming, effectively strengthening thermosetting type ring in the utility model patent application
Sound construction degree between oxygen resinous framework and sheet metal, tightness, improve product quality.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (3)
1. a kind of heat curing type package support and it is embedded communication IC integration packaging LED, it is characterised in that: include metal plate,
Thermosetting epoxy resin frame, LED luminescent wafer, integrated communication IC and epoxy resin encapsulate glue portion；Wherein:
The metal plate has several tabular pins, and the thermosetting epoxy resin frame is that molding takes shape in metal plate
On, the bottom surface of tabular pin is exposed to the bottom surface of thermosetting epoxy resin frame；The top of the thermosetting epoxy resin frame
It is recessed with accommodating chamber downwards, the top surface of tabular pin is exposed in accommodating chamber, and LED luminescent wafer, integrated communication IC, which are located at, to be accommodated
It is intracavitary and the top surface for being fixed on corresponding tabular pin is respectively welded, LED luminescent wafer, integrated communication IC, tabular pin it
Between be electrically connected；Epoxy resin encapsulation glue portion is through hot setting molded package in accommodating chamber, and LED shines brilliant
Piece, integrated communication IC, tabular pin are sealed in epoxy resin encapsulation glue portion.
2. the LED of heat curing type package support according to claim 1 and embedded communication IC integration packaging, feature exist
There is Copper base material layer in: the tabular pin of the metal plate, plate the upside nickel plating set upwards in turn from the top surface of Copper base material layer
Layer, upside silver coating, and, successively plate the downside nickel coating set, downside silver coating downwards from the bottom surface of Copper base material layer.
3. the LED of heat curing type package support according to claim 1 and embedded communication IC integration packaging, feature exist
In: several tabular pins are respectively defined as signal input pin, signal output pin, GND pin, VDD pin；LED
Luminescent wafer includes red LED chip, BLUE LED emissions chip, green LEDs chip；
Aforementioned integrated communication IC is fixedly welded on GND pin, and BLUE LED emissions chip is fixedly welded on signal output pin
On, red LED chip, green LEDs chip, which are then respectively welded, to be fixed on VDD pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821280573.4U CN209087897U (en) | 2018-08-09 | 2018-08-09 | The LED of heat curing type package support and embedded communication IC integration packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821280573.4U CN209087897U (en) | 2018-08-09 | 2018-08-09 | The LED of heat curing type package support and embedded communication IC integration packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209087897U true CN209087897U (en) | 2019-07-09 |
Family
ID=67114579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821280573.4U Withdrawn - After Issue CN209087897U (en) | 2018-08-09 | 2018-08-09 | The LED of heat curing type package support and embedded communication IC integration packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209087897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735874A (en) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | The LED and its technique of heat curing type package support and embedded communication IC integration packagings |
-
2018
- 2018-08-09 CN CN201821280573.4U patent/CN209087897U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735874A (en) * | 2018-08-09 | 2018-11-02 | 东莞市欧思科光电科技有限公司 | The LED and its technique of heat curing type package support and embedded communication IC integration packagings |
| CN108735874B (en) * | 2018-08-09 | 2024-02-13 | 东莞市欧思科光电科技有限公司 | LED (light-emitting diode) integrally packaged by thermosetting packaging bracket and embedded communication IC (integrated circuit) and process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 3 Shangmei Road, Qishi Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 523000 Lianxing Industrial Zone, Jiuwei Village, Qishi Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190709 Effective date of abandoning: 20240213 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20190709 Effective date of abandoning: 20240213 |