CN107240636A - A kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure - Google Patents

Abstract

The invention discloses a kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure, including heat sink, ring-type insulating part, LED chip, water proof ring, lens, positive conductive circuit and negative conductive circuit.The direct die bond of LED chip of the present invention removes support and pcb board in radiating plate surface, reduces thermal resistance to one layer, greatly improves heat conduction efficiency；Packaged light source out of the invention directly band lens, drastically increase light extraction efficiency, simplify related light distribution requirements, eliminate the technique for installing lens additional above traditional light source, be conducive to substantially reducing relevant cost, production efficiency is improved, lens and LED chip realize integration, and luminous intensity distribution technology and light-source encapsulation technological perfectionism are combined；Light source realizes waterproof requirement more than IP65 grades by water proof ring, is adapted to different lamps field of employment and requires；Due to eliminating support and pcb board, the present invention can be made to accomplish ultra-thin, it is very useful attractive in appearance.

Description

A buckle-type ultra-thin series heat sink and chip integrated packaging light source structure

technical field

The invention relates to a snap-on type ultra-thin series radiator and a chip integrated packaging light source structure. It belongs to the field of LED light source packaging.

Background technique

The existing light source packaging process generally includes die bonding, wire bonding, phosphor spotting, resin sealing, long baking, punching, aging and life testing, and packaging. On the PCB board, this light source packaging process has the following defects:

1. Due to the installation steps of the bracket and the PCB board, the process is complicated;

2. Due to the existence of brackets and PCB boards, the structure cannot be ultra-thin;

3. Due to the existence of brackets and PCB boards, the number of thermal resistance layers increases and the heat conduction efficiency is low.

Contents of the invention

The purpose of the present invention is to overcome the above-mentioned defects, and provide a snap-on type ultra-thin series heat sink and chip integrated packaging light source structure.

In order to achieve the above object, the technical scheme adopted in the present invention is as follows:

A buckle-type ultra-thin series heat sink and chip integrated package light source structure, including a heat dissipation plate, a ring-shaped insulating part, an LED chip, a waterproof ring, a lens, a positive conductive line and a negative conductive line; the ring-shaped insulating part The bottom is fixed and sealed on the heat dissipation plate to form a cup cavity. The LED chip is solidified in the cup cavity and the positive and negative electrodes of the LED chip are respectively electrically connected to one end of the positive conductive line and one end of the negative conductive line, and the positive conductive line and the negative conductive line. Pass through the cup cavity and set the other end outside the cup cavity, the other ends of the positive and negative conductive lines are used for electrical conduction with the external circuit; the waterproof ring is arranged on the heat dissipation plate and surrounds the cup cavity , the outside of the positive conductive circuit and the negative conductive circuit; the lens is sealed and connected to the heat sink through the waterproof ring.

Specifically, the positive electrode conductive circuit includes a positive electrode pad arranged inside the cup cavity, a positive electrode pad arranged outside the cup cavity, and a first conductor that electrically connects the two and passes through the ring-shaped insulating member; The negative electrode conductive circuit includes a negative electrode pad arranged in the cup cavity and a negative electrode pad arranged outside the cup cavity, and a second conductor that electrically connects the two and passes through the ring-shaped insulating member; the positive electrode of the LED chip and The negative electrode is electrically connected to the positive electrode pad and the negative electrode pad arranged in the cup cavity respectively.

Further, both the positive conductive circuit and the negative conductive circuit also include a conductive needle/conductive sheet for communicating with an external circuit, and the conductive needle/conductive sheet is electrically conductive with the positive electrode pad and the negative electrode pad arranged outside the cup cavity respectively. Pass.

Furthermore, the positive electrode and the negative electrode of the LED chip are respectively welded to the positive electrode pad and the negative electrode pad provided inside the cup cavity through pins, and through holes are respectively provided at the positive electrode pad and the negative electrode pad of the heat dissipation plate. , the pins pass through the through holes and are insulated and fixed with the heat sink through the injection molding process.

When it is a conductive pin, the conductive pin passes from the reverse side of the heat sink to the front side and is respectively welded to the positive electrode pad and the negative electrode pad located outside the cup cavity. The cup cavity, the first conductor, the second conductor, the positive electrode solder The disc, the negative electrode pad, and the waterproof ring are all arranged on the front side of the cooling plate.

Further, the conductive pin is also fixed on the reverse side of the heat sink through the connecting flange, and the connecting flange is detachably connected to the reverse side of the heat sink through bolts and corresponds to the position of the positive electrode pad and the negative electrode pad arranged outside the cup cavity. Correspondingly, there are bolt holes corresponding to the positions on the connecting flange and the heat sink, and through holes for passing through the conductive pins are set on the connecting flange and the heat sink, and the conductive pins are respectively connected with the device after passing through the through holes. Weld the positive electrode pad and negative electrode pad outside the cup cavity.

When it is a conductive sheet, one end of the conductive sheet is respectively welded to the positive electrode pad and the negative electrode pad outside the cup cavity, and the other end extends from the front/rear side of the heat sink. The cup cavity, the first conductor, and the second conductor , the positive electrode pad, the negative electrode pad, and the waterproof ring are all arranged on the front of the cooling plate.

Furthermore, the cup cavity is filled with sealant to form a light-emitting cavity.

Furthermore, the annular insulating part is made of dam glue, the first conductor and the second conductor are both made of copper sheets, and the heat dissipation plate is made of high thermal conductivity material.

Furthermore, the lens is detachably connected to the heat sink, and more than one clamping groove is provided on the edge of the heat sink, and a matching clamping block is provided at a corresponding position of the lens.

Compared with the prior art, the present invention has the following beneficial effects:

(1) The present invention designs a snap-on type ultra-thin series heat sink and chip integrated packaging light source structure, the LED chip is directly solidified on the surface of the heat sink, and the bracket and PCB board are removed to reduce the thermal resistance to one layer, greatly Improve heat transfer efficiency.

(2) The light source packaged by the present invention is directly equipped with a lens, which greatly improves the light output efficiency, simplifies the relevant light distribution requirements, and saves the process of installing a lens above the traditional light source, which is conducive to greatly reducing related costs and improving Production efficiency, integration of lens and LED chip, perfect combination of light distribution technology and light source packaging technology.

(3) The light source of the present invention realizes the waterproof requirement above IP65 level through the waterproof ring, and is suitable for the requirements of different places where lamps are used.

(4) Since the bracket and the PCB board are removed in the present invention, the present invention can be made ultra-thin, very practical and beautiful, and especially suitable for large-scale popularization and use.

Description of drawings

Fig. 1 is a schematic structural diagram of the present invention-Example 1.

Fig. 2 is the structural representation of the present invention-embodiment 2

Among them, the names corresponding to the reference signs:

1-heat dissipation plate, 101-card slot, 2-ring insulating member, 3-LED chip, 4-waterproof ring, 501-conductive pin, 502-conductive sheet, 6-lens, 601-clamping block, 602-lens Frame body, 603-lens, 7-connecting flange.

detailed description

The present invention will be further described below with reference to the accompanying drawings and examples, and the embodiments of the present invention include but not limited to the following examples.

Glossary Explanation: Solid crystal is also called DieBond or chip loading. Die bonding is to bond the chip to the designated area of the bracket through colloid (for LEDs, it is generally conductive glue or insulating glue), forming a thermal path or an electrical path, and providing conditions for subsequent wiring connections.

Example 1

As shown in Figure 1, a buckle type ultra-thin series heat sink and chip integrated package light source structure, including heat sink 1, ring-shaped insulating part 2, LED chip 3, waterproof ring 4, conductive pin 501/conductive sheet 502 , Lens 6.

The mutual connection relationship of the above components is as follows: the bottom of the annular insulating part is fixed and sealed on the heat dissipation plate to form a cup cavity, and the positive electrode pad and the negative electrode pad are arranged in the cup cavity, and the positive electrode pad and the negative electrode pad are respectively connected and conducted. Pass through one end of the first conductor and the second conductor, the other end of the first conductor and the second conductor pass through the cup cavity and connect and electrically connect the corresponding positive electrode pad and negative electrode pad, the conductive pin/ There are two conductive sheets, which are respectively electrically connected to the other end of the first conductor and the second conductor through the positive electrode pad and the negative electrode pad arranged outside the cup cavity. The positive electrode pad outside the cup cavity and the corresponding conductive needle/conductive sheet form the positive electrode conductive line, the negative electrode pad inside the cup cavity, the negative electrode pad outside the cup cavity and the corresponding conductive needle/conductive sheet form the negative electrode conductive line. line. The LED chip is solidified in the cup cavity and welded to the positive electrode pad and the negative electrode pad inside the cup cavity through pins respectively. Through holes and pins are respectively provided at the positive electrode pad and the negative electrode pad of the heat dissipation plate. It passes through the through hole and is insulated and fixed with the heat dissipation plate through the injection molding process. The LED chip is electrically connected to the first electrical conductor and the second electrical conductor respectively, and then electrically connected to the positive conductive circuit and the negative conductive circuit, and then electrically connected to the external circuit.

The waterproof ring is fixedly arranged on the heat dissipation plate and surrounds the outside of the cup cavity, the first conductor, the second conductor, the positive electrode pad and the negative electrode pad, and the waterproof ring is used to meet the relevant waterproof requirements of the light source. Good waterproof effect, the cup cavity, the first conductor, the second conductor, and the waterproof ring are all arranged on the front of the heat sink, and the conductive needle/conductive sheet passes from the back of the heat sink to the front and connects with the outside of the cup cavity. The positive pad and the negative pad are soldered. The lens is sealed and connected with the cooling plate through the waterproof ring.

In this embodiment, the cup cavity is filled with sealant to form a light-emitting cavity.

In this embodiment, dam glue is used for the annular insulator, and copper sheets are used for both the first conductor and the second conductor.

In this embodiment, a conductive needle 501 is used, as shown in FIG. 1 .

In order to fix the conductive pin, the conductive pin is also fixed on the reverse side of the heat sink through the connecting flange 7, and the connecting flange is detachably connected to the reverse side of the heat sink through bolts and corresponds to the position of the positive electrode pad and the negative electrode pad located outside the cup cavity , correspondingly, bolt holes corresponding to positions are provided on the connecting flange and the cooling plate. In this embodiment, in order not to affect the sealing performance of the waterproof ring, bolt holes are provided on the cooling plate outside the waterproof ring, and preferably there are two bolt holes at one polarity end. The connection flange is provided with a through hole for passing through the conductive needle, and the conductive needle is respectively welded with the positive electrode pad and the negative electrode pad arranged outside the cup cavity after passing through the through hole.

The lens is detachably connected to the cooling plate. In this embodiment, the detachable connection is preferably made by buckle, which is simple and convenient. More than one clamping slot 101 is provided on the edge of the heat sink, and a matching clamping block 601 is provided at a corresponding position of the lens. The lens includes a lens frame 602 and a lens 603. The lens is arranged in the middle of the lens frame and is a convex lens. The lower surface of the lens frame is sealed and connected to the front of the heat sink through a waterproof ring, and forms a cavity. The clamping block is arranged on the The edge of the lens frame. The lens is made of PC, PMMA and other related high temperature resistant engineering plastic materials.

In this embodiment, the heat dissipation plate is a square plate, and more than one card slot is provided on each of the four edges. The cooling plate is made of special high thermal conductivity material. High thermal conductivity material is aluminum substrate, glass fiber board or ceramics.

Example 2

As shown in Figure 2, a buckle-type ultra-thin series radiator and chip integrated packaging light source structure, different from Embodiment 1, this embodiment uses a conductive sheet 502, and the conductive sheet is superior to the conductive sheet in some structures. For example, after one end of the conductive sheet in this embodiment is welded to the positive pad and the negative pad outside the cup cavity, the other end extends from the front/back of the heat sink.

In Figure 2, the conductive sheet is attached to the waterproof ring from the front of the heat sink and passes through to the outside. Since the conductive sheet is thin and its shape is easier to control, and the waterproof ring will not affect the sealing. On the other hand, the setting of the connecting flange is also omitted, and the structure is simpler than that of Embodiment 1.

According to the above-mentioned embodiments, the present invention can be well realized. It is worth noting that, based on the premise of the above-mentioned design principle, in order to solve the same technical problem, even if some insubstantial changes or modifications are made on the basis of the structure disclosed in the present invention, the essence of the adopted technical solution is still Like the present invention, it should also be within the protection scope of the present invention.

Claims (10)

1. a kind of ultra-thin radiator series of buckle-type and chip integrative packaging light-source structure, it is characterised in that including heat sink (1), ring-type insulating part (2), LED chip (3), water proof ring (4), lens (6), positive conductive circuit and negative conductive circuit；

The bottom fixed seal connection of the ring-type insulating part forms one glass of chamber on heat sink, and LED chip die bond is in this glass of chamber Interior and LED chip positive pole and negative pole conduct one end of positive conductive circuit and one end of negative conductive circuit, positive pole respectively Conducting wire and negative conductive are routed through glass chamber and by its other end outside this glass of chamber, the positive conductive circuit and negative pole The other end of conducting wire is used to conduct with external circuit；

The water proof ring is located on heat sink and is centered around the outside of a glass chamber, positive conductive circuit and negative conductive circuit；

The lens are tightly connected by water proof ring with heat sink.

2. the ultra-thin radiator series of a kind of buckle-type according to claim 1 and chip integrative packaging light-source structure, its It is characterised by, the positive conductive circuit includes the positive terminal pad and the positive terminal pad outside cup chamber located at cup intracavitary, and Conduct both this and pass through the first electric conductor of ring-type insulating part；

The negative conductive circuit includes the negative terminal pad and the negative terminal pad outside cup chamber located at cup intracavitary, and conducts Both this and through ring-type insulating part the second electric conductor；

The positive pole and negative pole of the LED chip are conducted with the positive terminal pad and negative terminal pad located at cup intracavitary respectively.

3. the ultra-thin radiator series of a kind of buckle-type according to claim 2 and chip integrative packaging light-source structure, its It is characterised by, the positive conductive circuit and negative conductive circuit also include the conductive pin for being used to connect with external circuit (501)/conducting strip (502), the conductive pin/conducting strip respectively with the positive terminal pad outside cup chamber and negative terminal pad conductance It is logical.

4. the ultra-thin radiator series of a kind of buckle-type according to claim 2 and chip integrative packaging light-source structure, its It is characterised by, the positive pole and negative pole of the LED chip are welded in located at the positive terminal pad in cup intracavitary portion and negative by contact pin respectively Pole pad, is respectively equipped with through hole, contact pin is through through hole and by being molded work at positive terminal pad and negative terminal pad of heat sink Skill is fixed with radiating plate insulation.

5. the ultra-thin radiator series of a kind of buckle-type according to claim 3 and chip integrative packaging light-source structure, its Be characterised by, when for conductive pin, conductive pin passed through from the reverse side of heat sink to front and respectively with outside cup chamber just Pole pad and negative terminal pad welding, cup chamber, the first electric conductor, the second electric conductor, positive terminal pad, negative terminal pad, water proof ring are all provided with Put in the front of heat sink.

6. the ultra-thin radiator series of a kind of buckle-type according to claim 5 and chip integrative packaging light-source structure, its It is characterised by, the conductive pin is also fixed on the reverse side of heat sink by adpting flange (7), adpting flange is detachable by bolt Ground is connected to heat sink reverse side and corresponding with the positive terminal pad outside cup chamber and negative terminal pad position, accordingly, in connection method Blue bolt hole corresponding with position is equipped with heat sink, was equipped with adpting flange and radiating for leading to through conductive pin Hole, conductive pin is passed through and welded respectively with the positive terminal pad outside cup chamber and negative terminal pad after the through hole.

7. the ultra-thin radiator series of a kind of buckle-type according to claim 3 and chip integrative packaging light-source structure, its It is characterised by, it is another after one end of conducting strip is welded with the positive terminal pad outside cup chamber and negative terminal pad respectively when for conducting strip Hold from front/reverse side of heat sink and extend, cup chamber, the first electric conductor, the second electric conductor, positive terminal pad, negative terminal pad, waterproof Circle is arranged at the front of heat sink.

8. a kind of ultra-thin radiator series of buckle-type and chip integrative packaging light according to claim 1-7 any one Source structure, it is characterised in that the cup intracavitary is inoculated with fluid sealant, forms lighting cavity.

9. a kind of ultra-thin radiator series of buckle-type and chip integrative packaging light according to claim 2-7 any one Source structure, it is characterised in that the ring-type insulating part uses box dam glue, first electric conductor and the second electric conductor use copper Piece, the heat sink is made of high conductivity material.

10. a kind of ultra-thin radiator series of buckle-type and chip integrative packaging according to claim 1-7 any one Light-source structure, it is characterised in that the lens are detachably connected with heat sink, more than one neck is provided with the edge of heat sink (101), in clamping block (601) of the relevant position of lens provided with matching.