CN103682030B - LED, LED matrix and LED manufacture crafts - Google Patents
LED, LED matrix and LED manufacture crafts Download PDFInfo
- Publication number
- CN103682030B CN103682030B CN201210330103.5A CN201210330103A CN103682030B CN 103682030 B CN103682030 B CN 103682030B CN 201210330103 A CN201210330103 A CN 201210330103A CN 103682030 B CN103682030 B CN 103682030B
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- Prior art keywords
- right support
- internal layer
- colloid
- chip
- left socle
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
The invention provides a kind of LED, including chip, the left side being oppositely arranged, right support, internal layer packing colloid and outer envelope colloid, the chip is placed in pedestal upper end face, it is just, the moon of negative pin and support, pass through metal wire bonding between positive electrode, the left side, right support sets up three regions separately, internal layer packing colloid coating chip, metal wire and a left side, the upper surface of right support first area, and it is left from two, the lower surface of the first area is extended between right support and the region is coated, outer envelope colloid coats internal layer packing colloid and the left side stretched out outside internal layer packing colloid, right support second area, 3rd region is extended outside outer envelope colloid.Present invention also offers the device with above-mentioned LED and the technique for making the LED.The present invention will not produce the mutual stripping between internal layer packing colloid and outer envelope colloid in product and circuit board welding processing assembling, effectively reduce destruction of the stress to chip and metal wire, improve the combination property of product.
Description
Technical field
The present invention relates to LED encapsulation fields, more particularly to a kind of LED and LED matrix.
Background technology
LED（Light Emitting Diode light emitting diodes）It is a kind of partly leading for solid-state that can convert electrical energy into light
Body equipment, at present, the existing LED includes being used for conductive and support support, shell, the chip being fixed on support and use
To protect the sealing of the chip.The manufacture of the LED is that shell is first formed on support, is then encapsulated with sealing again,
Shell is typically using epoxy resin, anhydrides, light diffusing filler high and thermostability plastics composition；Sealing typically uses silica gel
Or epoxy resin filling, farther out, relaxation shrinkage is different for both material properties difference, causes to hold when processing and assembling with circuit board welding
Easily cause the shell to be peeled off with the sealing, and therefore cause product to produce mistake chip and the larger stress of metal wire generation
Effect is abnormal；Simultaneously as the characteristic of the retraction that the defect and sealing in structure design have, after machining and follow-up
Use during, the incomplete coating chip of sealing of the chip is protected, so that chip can be under rugged environment
（Such as rainwater）Cause to damage, influence product quality.
The content of the invention
Defect it is an object of the invention to overcome prior art, there is provided a kind of LED and LED matrix, it can effectively be reduced
Destruction of the stress to chip and metal wire, is not likely to produce stripping, while can ensure when product and circuit board welding process assembling
Product stable performance in the presence of a harsh environment, moisture resistant grade is high.
The present invention provides a kind of LED, including chip, the left socle that is oppositely arranged and right support, protects the chip and can
The internal layer packing colloid of printing opacity and the outer envelope colloid located at internal layer packing colloid periphery, the chip are placed in the left side
Support and right support upper surface, lead between the positive and negative electrode pin and the left socle and the yin, yang electrode of right support of the chip
Cross metal wire bonding, the left socle and right support set up three regions separately, the internal layer packing colloid coats the chip, described
Metal wire and the left socle and right support first area upper surface, and from extended between two left socles and right support this
The lower surface in one region simultaneously coats the first area lower surface, and the outer envelope colloid coats the internal layer packing colloid and stretches
Prolong in 3rd region of the left socle and right support second area gone out outside the internal layer packing colloid, the left socle and right support
Stretch in outside the outer envelope colloid.
Present invention also offers a kind of LED matrix, including above-mentioned LED structure.
A kind of LED provided by the present invention and its LED matrix, it is by the outer layer located at internal layer packing colloid periphery
Packing colloid, the internal layer packing colloid coats the chip and the metal wire, compared with prior art, in product and circuit
The mutual stripping between internal layer packing colloid and outer envelope colloid will not be produced during plate reflow processing assembling, can effectively reduce should
Destruction of the power to chip and metal wire, improves the performance of product；The bottom surface of internal layer packing colloid is shelved less than support simultaneously
Plane where the chip, it is ensured that protection of the internal layer packing colloid to die bottom surface, under extraneous rugged environment（Such as rain
Water）Do not result in and chip burn into is damaged, it is ensured that properties of product stabilization, long lifespan, moisture resistant grade are high yet.
Present invention also offers a kind of LED manufacture crafts, comprise the steps：
1）Punching press：Using stamping mold by left socle and right support punch forming；
2）Plating：The left socle and right support upper surface are used into chip locally to be plated with the functional areas of metal linear contact lay
Silver-colored, gold-plated or other metals；
3）Section：It is long that the left socle and right support after by plating cut out standard with mould；
4）Packaging：The left socle that will be cut and right support waterproof paper packing；
5）Die bond：After the base point elargol or insulating cement of the left socle and right support, using bonder by the core
Piece is fixed in the point elargol of the left socle and right support or insulating cement region；
6）Baking：The left socle and right support that the chip will be fixed are put into oven cooking cycle solidification, and the time is 1-
30 minutes, 130 ~ 180 ° of temperature；
7）Bonding wire：The chip and the left socle and right support that completion will be toasted are put into bonding equipment, will with metal wire
The positive and negative electrode pin of the chip is connected with the positive and negative electrode of the left socle and right support；
8）Prepare adhesive material：The internal layer packing colloid uses transparent adhesive tape with epoxy resin or silica gel as raw material or regards
The coloured printing opacity glue of demand allotment；The outer envelope colloid uses the impermeable gelatin that epoxy resin or silica gel are prepared for raw material；
9）Molding：Above-mentioned left socle and right support are placed in prefabricated molding die A, the internal layer packing colloid is injected
After be molded；
10) it is long roasting：Product after above-mentioned molding is put into baking box, temperature is 140 DEG C -180 DEG C, the time is 1-3 hours,
Adhesive material is allowed fully to solidify, while carrying out heat ageing；
11）Molding：The left socle of internal layer packing colloid will be molded with again and right support has been placed in molding die B, pressed
Note the outer envelope colloid；
12）It is long roasting：Product after above-mentioned molding is put into baking box, temperature is 140 DEG C -180 DEG C, the time is 1-8 hours,
Adhesive material is allowed fully to solidify, while carrying out heat ageing；
13）Cutting：Company's muscle of left socle and right support is cut off using cutter.
Using above-mentioned technique, chip, metal wire, support, internal layer packing colloid, outer envelope colloid can preferably be merged
In one, be conducive to improving LED qualities.
Brief description of the drawings
The front view structure figure of LED structure one that Figure 1A is provided by the embodiment of the present invention；
The front view structure figure of LED structure two that Figure 1B is provided by the embodiment of the present invention；
The front view structure figure of LED structure three that Fig. 1 C are provided by the embodiment of the present invention；
The front view structure figure of LED structure four that Fig. 1 D are provided by the embodiment of the present invention；
The overlooking structure figure of the LED that Fig. 2 is provided by the embodiment of the present invention；
The assembling flow path structural representation of the LED that Fig. 3 is provided by the embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Referring to Fig. 1, Fig. 2, a kind of LED1 is the embodiment of the invention provides, the LED1 is oppositely arranged and has including one
The left socle 121 and right support 122 of spacing, the chip 11, the protection that are placed in the left socle 121 or/and the upper surface of right support 122
The chip and the internal layer packing colloid 13 of light-permeable and the outer envelope colloid 14 located at the periphery of internal layer packing colloid 13,
The left socle 121 and the combination of right support 122 constitute the support 12 for fixing LED1, and the chip 11 draws with positive and negative electrode
It is welded to connect by a metal wire 15 between pin, with left socle 121 and the yin, yang electrode of right support 122, the left socle 121
Set up three regions separately with right support 122, wherein first area is provided with the chip 11, and the internal layer packing colloid 13 coats institute
Chip 11, metal wire 15 and the left socle 121 stated and the upper surface of the first area of right support 122, and from left socle 121 and right branch
Spacing between frame 122 extends to the lower surface of the first area of the left socle 121 and right support 122, and coats under the region
End face, the outer envelope colloid 14 coats the lateral parts 133 of the internal layer packing colloid 13, bottom surface 132, and will stretch out described
The second area cladding of left socle 121 and right support 122 outside internal layer packing colloid 13, left socle 121 and right support 122 the
Three regions are placed in outside outer envelope colloid 14.
In the structure design of the above-mentioned LED1 of the present invention, the bottom surface 132 of the internal layer packing colloid 13 is less than left socle and the right side
Support left socle 121 and right support 122 are shelved with the lower surface of the first area of the chip 11, it is ensured that the internal layer packaging plastic
13 pairs of protections of the bottom surface of the chip 11 of body, even if internal layer packing colloid 13 has larger retraction, under extraneous rugged environment
（Such as rainwater）Do not result in and the burn into of the chip 11 is damaged, it is ensured that properties of product stabilization, long lifespan yet.And, by described
Outer envelope colloid 14 coats the side 133 and bottom surface 132 of the internal layer packing colloid 13, and then protects the internal layer packaging plastic
Body 13, moisture resistant grade is high.So, will not be produced when product and circuit board welding process assembling the internal layer packing colloid 13 and
Mutual stripping between the outer envelope colloid 14, can effectively reduce destruction of the stress to the chip 11 and metal wire 15,
Improve the performance of product.
Referring to Fig. 1, the outer layer packing colloid 14 of LED1 of the present invention is concave structure, and internal layer packing colloid 13 is placed in the outer layer
In the concave cavity of packing colloid 14, the top surface 131 of the internal layer packing colloid 13 can be with the top of the outer envelope colloid 14
Face 141 is concordant, or the top surface 131 of internal layer packing colloid 13 is cambered surface, its cambered surface initiating terminal and the outer envelope colloid 14
Top surface 141 is concordant, and arc top is higher or lower than the top surface 141 of outer envelope colloid 14, and the top surface 131 of internal layer packing colloid 13 may be used also
Being that can form irreflexive male and fomale(M＆F).Said structure is set both had been easy to the chip 11 to launch and receive signal, also can be preferable
The guarantee chip 11 luminescent properties.
Specifically, referring to Fig. 1, Fig. 2, the internal layer packing colloid 13 is covered with press moulding mode by molding press and mould
In the chip 11 and the periphery of the metal wire 15, the outer envelope colloid 14 is with press moulding mode by molding press and mould
It is covered in the side 133 and bottom surface 132 of the internal layer packing colloid 13.
For easy to process, the internal layer packing colloid 13 and the periphery of outer envelope colloid 14 can be in regular polygon, this reality
Apply internal layer packing colloid described in example 13, outer envelope colloid 14 and be tetragonal body structure, be easy to compression molding, it is certainly, described
Internal layer packing colloid 13, outer envelope colloid 14 can also be arbitrary shape, as long as the internal layer packing colloid 13 is wrapped in principle
The whole chip 11, the metal wire 15 and left socle 121 and the lower surface of right support 122 are covered, in addition, the internal layer is sealed
The structure for filling colloid 13 will also set according to the lighting angle of the chip 11 and window size；The knot of outer envelope colloid 14
Structure can coordinate the profile of the internal layer packing colloid 13 to be molded, can sweetly disposition.Above-mentioned internal layer packing colloid 13 can use with
Epoxy resin or silica gel are the transparent adhesive tape or the coloring agent with translucency of raw material；The outer envelope colloid 14 can be used with epoxy
Resin or silica gel are the impermeable gelatin of raw material.
Specifically, as shown in figure 1, the LED is made up of two chips 11, one of them described chip 11 has can
The transmitting terminal of transmission signal, another described chip 11 has the receiving terminal that can receive signal, and the transmitting terminal upper surface also sets
There is a surface of emission, the receiving terminal upper surface is provided with a receiving plane.The surface of emission is not sealed with the receiving plane by the outer layer
Dress colloid 14 is covered, it is ensured that normal transmitting and reception signal.Two chips 11 are located on the support 12 side by side
And with a gap, can be individually insulated open for the two chips 11 by the outer envelope colloid 14, it is ensured that transmission or
Will not be interfered when receiving signal.
With further reference to Figure 1A, the left socle 121 and right support 122 are the metal framework knot for being mirrored into being oppositely arranged
Structure, its first, second region wears in the outer envelope colloid 14 and internal layer packing colloid 13 successively in horizontal, for carrying
And fixed chip 11, the 3rd region is attached at the side of outer envelope colloid 14 with respect to its first, second region bending
Face, and it is relative in its top after the bottom end of outer envelope colloid 14 again bending and be placed in the bottom surface of outer envelope colloid 14,
So as to form the frame structure being oppositely arranged.The advantage of this structure design is both to have can effectively ensure that the layer encapsulation outside of its upper end
Fixation in colloid 14 and internal layer packing colloid 13, while the fixation between LED1 and other components is easy in the setting of its lower end,
And also there is certain heat-dissipating space between two relative bottoms.
Certainly, LED1 left socles 121 of the present invention and right support 122 can also be mirrored into being oppositely arranged, its first, secondth area
Domain wears in the outer envelope colloid 14 and internal layer packing colloid 13 successively in horizontal, for carrying and fixed chip 11, the
Three regions are extended outside outer envelope colloid 14（Such as Figure 1B）, it is solid that its extension can install LED1 as fixing base
It is fixed;Or, first, second region is used in laterally wearing successively in the outer envelope colloid 14 and internal layer packing colloid 13
Carry and fixed chip 11, the 3rd region with respect to its first, second region bending, and in outer envelope colloid 14 side again
Bending, and stretched out with the opposite direction in its top（See Fig. 1 C, Fig. 1 D), its extension can make LED1 as fixing base
Install and fix.
Further, the first area upper surface of said frame structure is provided with heat sink (not shown), the core
Piece 11 is located on the heat sink.The heat sink is conductive metallic plate, and the metallic plate includes being arranged on the left branch
The anode metal plate or cathodic metal plate of frame 121 and right support 122 a wherein support first area and it is correspondingly arranged another support
The cathodic metal plate or anode metal plate of first area（That is the setting of anode metal plate or cathodic metal plate on support is any
, as long as being correspondingly arranged）, and further, the metallic plate of other polarity being can also be, the setting of the metallic plate is favourable
In the radiating of chip 11.The end of the anode metal plate is provided with anodization layer electrode, and the end of the cathodic metal plate sets
There is negative electrode electrodeposited coating electrode.Lead between positive and negative electrode pin and negative electrode electrodeposited coating electrode, the anodization layer electrode of the chip 11
Cross metal wire 15 to weld, be electrically connected.
Present invention also offers LED matrix, for illuminace component in, the illuminace component has the structure of above-mentioned LED1,
And can be set using arrangement mode is multiple.
Fig. 3 is referred to, LED manufacture crafts provided by the present invention are as follows：
Step 1：Punching press：The support 12 uses stamping mold outward appearance electrode moulding, can volume production, make simple, convenient.
Step 2：Plating：By the first area of the support 12 is silver-plated, gold-plated or other metals, the region is the left socle
121 and right support 122 on the region that is contacted with metal wire 15 for chip 11, silver-plated, gold-plated or other metals may be such that chip
With the easy die bond of metal wire 15 and bonding wire, it is not easy to take off.
Step 3：Section：The left socle 121 and right support 122 after by plating is long with mould sanction standard, after facilitating
Continuous die bond bonding wire is used.
Step 4：Packaging：The left socle 121 and right support 122 that will be cut use waterproof paper packing, silver-plated to prevent
The left socle 121 afterwards and the surface oxidation of right support 122, corrosion.
Step 5：Die bond：Elargol or insulating cement on the first area upper table millet cake of the left socle 121 and right support 122
Afterwards, using bonder（It is not shown）The chip 11 is fixed on point elargol or the insulation of the left socle 121 and right support 122
In glue region；Point elargol or insulating cement are conducive to the chip 11 hard through baking on the left socle 121 and right support 122
Change fixation.
Step 6：Baking：The support 12 that the chip 11 will be fixed is put into oven cooking cycle solidification, and the time is 1-30
Minute, 130 ~ 180 ° of temperature, may be such that the chip 11 it is firm be fixed on the support 12.
Step 7：Bonding wire：The support 12 of the admittedly good chip 11 is put into bonding equipment, will be described using metal wire 15
The positive and negative electrode pin of chip 11（It is not shown）With the positive and negative electrode of the support 12（It is not shown）Connection.
Step 8：Prepare adhesive material：Adhesive material has two kinds, a kind of internal layer packing colloid 13, a kind of outer envelope colloid
14, two kinds of packing colloids can be using the same or like material of performance, to ensure to have identical contracting property.It is of the present invention
Wei transparent adhesive tape or have coloring agent depending on demand allotment that internal layer packing colloid 13 is preferably prepared with epoxy resin or silica gel as raw material,
With translucency, one is conducive to the diverging of the light of the chip 11, second, being easy to the signal of the chip 11 to penetrate reception.
The preferred epoxy of outer envelope colloid 14 or silica gel are the impermeable gelatin that raw material is prepared, and both raw material are all extremely normal
See, be very easy to allotment, and price is low.
Step 9：Molding：The good support 12 of die bond bonding wire is inserted into molding die A（It is not shown）In, described in first pressure injection
Internal layer packing colloid 13.First by the molding die hydraulic press matched moulds and can specifically vacuumize, then by the internal layer packaging plastic
Body 13 be put into injecting glue road entrance heating, then with push rod by heating after the internal layer packing colloid 13 be pressed into the injecting glue road
In, the internal layer packing colloid 13 enters in each forming tank along the injecting glue road；
Step 10:It is long roasting：Product after above-mentioned molding is put into baking box, temperature is 140 DEG C -180 DEG C, and the time is 1-3
Hour, allow adhesive material fully to solidify, while carrying out heat ageing；
Step 11:Molding：The support 12 that internal layer packing colloid 13 will be molded inserts molding die B（It is not shown）
In, outer envelope colloid 14 described in pressure injection.The support 12 that can will be specifically molded internal layer packing colloid 13 enters molding
Matched moulds and vacuumized in mould B, then the pressure injection of outer envelope colloid 14 is entered the surrounding solidification of the internal layer packing colloid 13；
Step 12:It is long roasting：Product after above-mentioned molding is put into baking box, and vice-minister bakes again, and temperature is 140 DEG C -180 DEG C, time
It is 1-8 hours, primarily to allow the adhesive material fully to solidify, while carrying out heat ageing；Long baking is conducive to improving above-mentioned
The adhesive strength of adhesive material and the support 12.Step 13：Cutting：Because the support 12 connects together aborning
（It is not single）, company's muscle of the support 12 is cut off using cutter.
Step 14：Test and sorting：The product of forming is estimated, chooses deformation, defective, qualified products are inserted
Light-splitting color-separating machine carries out photoelectricity test, it is ensured that the uniformity of product.
Step 15：Tape package：The product after color-division is packaged into disk using braider encapsulation carrier band to be put in storage.
Using above-mentioned technique, can be by chip 11, metal wire 15, support 12, internal layer packing colloid 13, outer envelope colloid 14
One is blended in, compared to dispensing mode, the difficult control of colloid during dispensing is not appeared in, is difficult to determine lacking for dispensing position
Fall into, be not easy to cause colloid to leak outside, may be such that product appearance quality is good, production efficiency is high, and be conducive to improving LED qualities.
The foregoing is only preferred embodiments of the present invention, its structure is not limited to the above-mentioned shape enumerated, it is all
Any modification, equivalent and improvement for being made within the spirit and principles in the present invention etc., should be included in protection of the invention
Within the scope of.
Claims (2)
1. a kind of LED manufacture crafts, it is characterised in that comprise the steps：
1) punching press：Using stamping mold by left socle and right support punch forming；
2) electroplate：The left socle and right support upper surface are used for functional areas local silver-plating of the chip with metal linear contact lay, plating
Gold or other metals；
3) cut into slices：It is long that the left socle and right support after by plating cut out standard with mould；
4) pack：The left socle that will be cut and right support waterproof paper packing；
5) die bond：After the base point elargol or insulating cement of the left socle and right support, the chip is consolidated using bonder
It is scheduled in the point elargol of the left socle and right support or insulating cement region；
6) toast：The left socle and right support that the chip will be fixed are put into oven cooking cycle solidification, and the time is 1-30 points
Clock, 130~180 ° of temperature；
7) bonding wire：The chip and the left socle and right support that completion will be toasted are put into bonding equipment, will be described with metal wire
The positive and negative electrode pin of chip is connected with the positive and negative electrode of the left socle and right support；
8) adhesive material is prepared：Internal layer packing colloid uses transparent adhesive tape with epoxy resin or silica gel as raw material or is allocated regarding demand
Coloured printing opacity glue；Outer envelope colloid uses the impermeable gelatin that epoxy resin or silica gel are prepared for raw material；
9) it is molded：Above-mentioned left socle and right support are placed in prefabricated molding die A, the internal layer packing colloid rear mold is injected
Pressure；
10) it is long roasting：Product after above-mentioned molding is put into baking box, temperature is 140 DEG C -180 DEG C, and the time is 1-3 hours, is allowed
Adhesive material fully solidifies, while carrying out heat ageing；
11) it is molded：The left socle of internal layer packing colloid will be molded with again and right support has been placed in molding die B, pressure injection institute
State outer envelope colloid；
12) it is long roasting：Product after above-mentioned molding is put into baking box, temperature is 140 DEG C -180 DEG C, and the time is 1-8 hours, is allowed
Adhesive material fully solidifies, while carrying out heat ageing；
13) cutting：Company's muscle of left socle and right support is cut off using cutter.
2. LED manufacture crafts as claimed in claim 1, it is characterised in that：The step 9) concretely comprise the following steps：First will be described
Molding die A hydraulic presses matched moulds is simultaneously vacuumized, then internal layer packing colloid is put into the entrance heating in injecting glue road, then uses a liquid
Above-mentioned internal layer packing colloid after bar bear down on one by heating is pressed into the injecting glue road, makes the internal layer packing colloid along the note
Jiao Dao enters solidify afterwards in each forming tank；The step 11) concretely comprise the following steps：Internal layer packing colloid will be molded with
Left and right support is inserted in molding die B matched moulds and is vacuumized, then by outer envelope colloid pressure injection in the internal layer packing colloid
Periphery solidifies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210330103.5A CN103682030B (en) | 2012-09-07 | 2012-09-07 | LED, LED matrix and LED manufacture crafts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210330103.5A CN103682030B (en) | 2012-09-07 | 2012-09-07 | LED, LED matrix and LED manufacture crafts |
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| CN103682030A CN103682030A (en) | 2014-03-26 |
| CN103682030B true CN103682030B (en) | 2017-05-31 |
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| CN105127722B (en) * | 2015-08-27 | 2018-01-19 | 江苏翠钻照明有限公司 | A kind of LED lamp assembles equipment |
| CN106132086A (en) * | 2016-07-08 | 2016-11-16 | 广东小天才科技有限公司 | A kind of board structure of circuit and electronic component soldering method |
| CN106206756B (en) * | 2016-09-30 | 2018-03-02 | 深圳成光兴光电技术股份有限公司 | A kind of photosensitive tube combines encapsulating structure and its processing technology with optical filter |
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| CN108470814A (en) * | 2018-02-09 | 2018-08-31 | 永林电子有限公司 | A kind of LED component of molding type lateral emitting |
| CN110265529A (en) * | 2019-06-26 | 2019-09-20 | 深圳市汇大光电科技股份有限公司 | Pin lamp manufacturing process and gold thread detection system |
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