CN112951968B - Outdoor full-color display screen SMD LED device - Google Patents
Outdoor full-color display screen SMD LED device Download PDFInfo
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- CN112951968B CN112951968B CN202110117611.4A CN202110117611A CN112951968B CN 112951968 B CN112951968 B CN 112951968B CN 202110117611 A CN202110117611 A CN 202110117611A CN 112951968 B CN112951968 B CN 112951968B
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- 239000000084 colloidal system Substances 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 239000011324 bead Substances 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 23
- 238000004806 packaging method and process Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- HDSBZMRLPLPFLQ-UHFFFAOYSA-N Propylene glycol alginate Chemical compound OC1C(O)C(OC)OC(C(O)=O)C1OC1C(O)C(O)C(C)C(C(=O)OCC(C)O)O1 HDSBZMRLPLPFLQ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an outdoor full-color display SMD LED device, which comprises a base, wherein the base comprises a mounting seat and a supporting seat, an LED chip is arranged at one end of the mounting seat far away from the supporting seat, a pin is arranged at one end of the supporting seat far away from the mounting seat, the mounting seat and the supporting seat are matched to form a sealing part, the sectional area of the mounting seat is smaller than that of the supporting seat, an encapsulation colloid is encapsulated at the periphery of a lamp bead, and the encapsulation colloid covers the sealing part. The application can improve CHIP type SMD LED's gas tightness, and can increase the reliability of lamp pearl in humid environment at sealed glue of embedment all around of lamp pearl, reduces LED display screen's repair rate.
Description
Technical Field
The invention relates to the technical field of light emitting diodes, in particular to an outdoor full-color display SMD LED device.
Background
An outdoor Light Emitting Diode (LED) display screen is a novel information display medium which is rapidly developed in the late eighties in the world, and is a display screen formed by dot matrix modules or pixel units formed by LEDs. The defect of the prior magnetic turning plate, neon lights and other information publishing media effects is made up, and the magnetic turning plate and the neon lights are widely applied to railways, expressways, squares and superstores. Based on waterproof, dustproof lamp demand, need encapsulate in order to promote its adaptive capacity to environment to the lamp pearl. Traditional full-color LED device of Chip form encapsulation, it is highly less, because it is 0.6mm at least to irritate sealed glue height in the industry at present, the sealed glue of unable embedment all around of lamp pearl of above-mentioned device, inside steam permeates the lamp pearl from the lamp pearl edge easily, leads to Chip electrode metal migration inefficacy, electric leakage inefficacy, silver glue layering inefficacy, gold wire fracture inefficacy and colloid and base plate layering scheduling problem.
Chinese patent application No. CN201010247956.3 discloses an SMD type LED packaging method, including the following steps: 1) and electroplating: the method comprises the steps that a functional area on the surface of a support on an SMD tape winding is locally plated with silver, and the functional area is an area used for pressure injection encapsulation on the support; 2) and slicing: cutting the electroplated bracket into a standard length by using a mould; 3) and crystal solidification: after dispensing at the bottom of the support, fixing the corresponding SMD LED chip at the effective surface position of the support by using a die bonder; 4) and short baking: placing the support fixed with the SMD type LED chip after dispensing into an oven at 150 ℃ for baking for 90 minutes for curing; 5) and welding wires: putting the support with the SMD type LED chip fixed on the support into a bonding machine, and connecting the SMD type LED chip with positive and negative electrodes of the support by adopting a 99.99% phi 23 gold wire; 6) and pressure injection: the support welded with the SMD LED chip is discharged into an injection mold, epoxy resin is used for pressure injection and rapid encapsulation, and the pressure injection time is within 3 minutes; 7) removing residues: placing the support after the injection molding and encapsulation into a mold to automatically process burrs; 8) aging and baking: placing the injection-molded and encapsulated bracket 1 subjected to burr treatment into an oven at 120 ℃ for baking for 8 hours for epoxy long-time baking and curing; 9) and tinning: carrying out surface tin plating treatment on the support after the SMD type LED chip is encapsulated by pressure injection; 10) bending: and cutting off the electrode of the surface treatment tinned bracket by adopting a precision die, and bending and molding.
The technology can realize effective packaging of the SMD LED, and the tin plating process ensures the product to be antioxidant and antirust and improves the application processing weldability of the product; the packaging method has the problems that the technical problem that the air tightness of the SMD LED is poor cannot be solved, when the packaging method is used in an outdoor environment, water vapor easily permeates into the interior of the lamp bead to cause damage of the lamp bead, and the reliability of the lamp bead in a humid environment is poor.
Disclosure of Invention
The invention provides an outdoor full-color display SMD LED device, which aims to overcome the technical problems that in the prior art, sealant cannot be filled around a lamp bead, water vapor easily permeates into the lamp bead from the edge of the lamp bead to cause CHIP electrode metal migration failure, electric leakage failure, silver adhesive layering failure, gold wire fracture failure and colloid and substrate layering.
In order to achieve the above object, the present invention adopts the following technical solutions.
The utility model provides an outdoor full-color display screen SMD LED device, includes the base, and the base includes mount pad and supporting seat, and the one end that the supporting seat was kept away from to the mount pad is equipped with the LED chip, and the one end that the mount pad was kept away from to the supporting seat is equipped with the pin, and mount pad and supporting seat cooperation constitute the sealing, and the sectional area of mount pad is less than the sectional area of supporting seat, and the periphery embedment of lamp pearl has the colloid of encapsulation, and the colloid of encapsulation covers the sealing. Traditional LED device sealing performance is relatively poor, and this application provides a full-color display screen SMD LED device, can use in the open air. Specifically, the mounting seat and the supporting seat are matched to form a step structure, compared with a traditional structure, a dispersion path of water vapor is elongated when the water vapor seeps in the step structure, the dispersion path of the water vapor is bent from an original straight path to a broken line path, the path comprises a horizontal path constructed by the end face of the supporting seat and a vertical path constructed by the side face of the mounting seat, the water vapor needs to be firstly diffused to the bottom of the horizontal path and then ascends along the vertical path in the dispersion process, and the water vapor ascended along the vertical path and the heat energy released by the LED device are in opposite impact with each other due to the fact that the LED device releases the heat energy to the periphery in the working process, and the dispersion rate of the water vapor is further reduced; in addition, the periphery embedment of lamp pearl has the packaging colloid in this application, and the packaging colloid forms the cover to the sealing, has effectively increased the gas tightness of display screen, and the display screen can use in the open air.
Preferably, the LED chip includes a first chip, a second chip and a third chip, a first pole portion and a second pole portion are respectively disposed on two sides of the LED chip, and the LED chip is connected to the first pole portion and the second pole portion through wires. In the application, the LED chip selects an RGB (red, green and blue) tricolor chip, and the first chip, the second chip and the third chip are separately arranged and connected through a wire.
Preferably, the height of the sealing part is H, the height of the base is H, H is more than or equal to 0.6mm, and H is more than or equal to 0.2mm and less than 0.6 mm. The technical scheme limits the size of the base, the whole height of the base is more than 0.6mm, the height of a sealing part formed by matching the mounting seat and the supporting seat is 0.2mm-0.6mm, and the width is not limited.
Preferably, the supporting seat is in a cube shape, and the number of the pins is four and is respectively close to the corner points of the supporting seat. The pins are gold plated, gold plated or tin plated.
Preferably, the encapsulating compound is molded by compression molding.
Preferably, the packaging colloid comprises a colloid body and a circumferential colloid, the colloid body is positioned on one side of the supporting seat close to the mounting seat, and the circumferential colloid is arranged along the circumference of the supporting seat.
Preferably, the height of the circumferential colloid is greater than that of the supporting seat.
Preferably, the color of the base is black, gray or white, and the base is prepared by BT material or FR-4.
Preferably, the chip adopts a forward mounting process or a flip-chip process, the electric circuit is conducted through the lead welding when the forward mounting process is adopted, and the electric circuit is conducted through the solder paste welding when the flip-chip process is adopted.
Preferably, the encapsulant includes solid or liquid epoxy resin, silicone resin, or epoxy modified material. In the application, the packaging mode is molding (plastic packaging) or vacuum glue brushing.
In conclusion, the invention has the following beneficial effects: (1) according to the LED display screen, the sealing part is additionally arranged on the base, so that water vapor in an external environment is not easy to intrude into the lamp bead from the edge of the lamp bead, the reliability of the lamp bead in a humid environment is improved, and the repair rate of the LED display screen is reduced; (2) the sealing part is covered by the packaging colloid, so that the air tightness of the display screen is effectively improved, and the display screen can be used outdoors; (3) the dispersion path of steam when steam oozes in this application is lengthened, and the dispersion path of steam is zigzag for broken line path by the straight line path originally, further reduces steam to the inside diffusivity of lamp pearl.
Drawings
Fig. 1 is a schematic view of a susceptor in the present invention.
Fig. 2 is a front view of an SMD LED of the present invention.
Fig. 3 is a sectional view of fig. 1.
Fig. 4 is a sectional view of fig. 2.
Fig. 5 is a schematic view of the invention as a whole.
In the figure:
the LED packaging structure comprises a mounting seat 1, a supporting seat 2, an LED chip 3, a first chip 301, a second chip 302, a third chip 303, a pin 4, a sealing part 5, a packaging colloid 6, a colloid body 601, a circumferential colloid 602, a first pole part 7, a second pole part 8 and a lead 9.
Fig. 1 (a) is a plan view of the base, fig. 1 (b) is a bottom view of the base, and fig. 1 (c) is a side view of the base.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
as shown in fig. 1 to 5, an outdoor full-color display SMD LED device includes a base, the base includes a mounting seat 1 and a supporting seat 2, an LED chip 3 is disposed at an end of the mounting seat away from the supporting seat, a pin 4 is disposed at an end of the supporting seat away from the mounting seat, the mounting seat and the supporting seat cooperate to form a sealing portion 5, a sectional area of the mounting seat is smaller than a sectional area of the supporting seat, an encapsulant 6 is encapsulated around a bead, and the encapsulant covers the sealing portion; the LED chip comprises a first chip 301, a second chip 302 and a third chip 303, a first pole part 7 and a second pole part 8 are respectively arranged on two sides of the LED chip, and the LED chip is connected with the first pole part and the second pole part through wires 9; the height of the sealing part is H, the height of the base is H, the H is more than or equal to 0.6mm, and the H is more than or equal to 0.2mm and less than 0.6 mm; the supporting seat is cubic, the number of the pins is four, and the pins are respectively close to the angular points of the supporting seat; molding the packaging colloid by compression; the packaging colloid comprises a colloid body 601 and a circumferential colloid 602, wherein the colloid body is positioned on one side of the supporting seat close to the mounting seat, and the circumferential colloid is arranged along the circumference of the supporting seat; the height of the circumferential colloid is greater than that of the supporting seat; the color of the base is black, gray or white, and the base is prepared from BT material or FR-4; the chip adopts a forward mounting process or a reverse mounting process, the electric loop is conducted through the lead welding when the forward mounting process is adopted, and the electric loop is conducted through the solder paste welding when the reverse mounting process is adopted; and encapsulating solid or liquid epoxy resin, silicon resin or epoxy modified material and the like in the colloidal treasury.
As shown in fig. 1 (c), the base includes, from top to bottom, a mounting seat and a supporting seat, as can be seen from fig. 1 (a), the mounting seat and the supporting seat are both cube-shaped, the sectional area of the mounting seat is smaller than that of the supporting seat, an LED chip is disposed on the upper end face of the mounting seat, a first pole portion and a second pole portion are disposed on the left side and the right side of the LED chip respectively, pins are disposed on the lower end face of the supporting seat, and the number of the pins is four and is respectively close to four corner points of the supporting seat. The PCB of the base is black, gray or white, and is made of BT material or FR-4 material; the pins and the bonding pads are gold-plated or silver-plated or gold-plated or tin-plated, the overall height of the base is more than 0.6mm, the length and width dimensions are not limited, the height of the sealing part is 0.2mm-0.6mm, and the width is not limited.
As shown in fig. 2, the number of the LED chips is three, the three LED chips are arranged at intervals from top to bottom, the LED chips include a first chip, a second chip, and a third chip, which are r (red), g (green), and b (blue) chips, respectively, from top to bottom, when the chips adopt a normal mounting process, the LED chips are connected with the first pole portion and the second pole portion on the left and right sides through wires, the wires are gold wires, alloy wires, or copper wires, the electrical circuit is conducted by welding, and when the chips adopt a flip-chip process, the electrical circuit is conducted by solder paste welding.
As shown in fig. 3 and 4, the mounting seat and the supporting seat cooperate to form a sealing portion, a colloid body is encapsulated in the sealing portion, and as can be seen from fig. 5, a circumferential colloid is arranged in the circumferential direction of the supporting seat, the height of the circumferential colloid is greater than that of the supporting seat, and the colloid body and the circumferential colloid cooperate to form an encapsulation colloid. The packaging method is plastic packaging (molding) or vacuum glue brushing, and the packaging colloid comprises solid or liquid epoxy resin, silicon resin, epoxy modified materials and other traditional materials.
Claims (8)
1. An outdoor SMD LED device with a full-color display screen comprises a base and is characterized in that the base comprises a mounting seat and a supporting seat, an LED chip is arranged at one end, away from the supporting seat, of the mounting seat, a pin is arranged at one end, away from the mounting seat, of the supporting seat, the mounting seat and the supporting seat are matched to form a sealing part, an encapsulation colloid is filled and sealed on the periphery of a lamp bead, the sectional area of the mounting seat is smaller than that of the supporting seat, and the encapsulation colloid covers the sealing part; the packaging colloid comprises a colloid body and a circumferential colloid, the circumferential colloid is arranged along the circumferential direction of the supporting seat, and the colloid body is positioned on one side of the supporting seat close to the mounting seat.
2. The SMD LED device with full-color outdoor display screen of claim 1, wherein the LED chip includes a first chip, a second chip and a third chip, the first and second pole parts are respectively disposed on two sides of the LED chip, and the LED chip is connected to the first and second pole parts through wires.
3. The SMD LED device with the outdoor full-color display screen of claim 1, wherein the height of the sealing portion is H, the height of the base is H, H is greater than or equal to 0.6mm, and H is greater than or equal to 0.2mm and less than 0.6 mm.
4. The outdoor full-color display SMD LED device according to claim 1, characterized in that said support base is cube-shaped, and the number of said pins is four and close to the corner points of said support base.
5. The outdoor full-color display SMD LED device according to claim 1, characterized in that the height of the circumferential glue is greater than the height of the support base.
6. The outdoor full-color display SMD LED device of claim 1, 2, 3 or 4, characterized in that the color of the base is black, gray or white, and the base is made of BT material or FR-4.
7. The outdoor full-color display SMD LED device according to claim 2, characterized in that said chip is formed by a forward mounting process or a flip-chip process, said conducting wire is used for conducting said electrical circuit, and said conducting wire is used for conducting said electrical circuit by means of solder paste in said forward mounting process, and said conducting wire is used for conducting said electrical circuit by means of said solder paste in said flip-chip process.
8. The outdoor full-color display SMD LED device of claim 1, 2, 3 or 4, characterized in that the packaging colloid is a solid or liquid epoxy resin, silicone resin or epoxy modified material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110117611.4A CN112951968B (en) | 2021-01-28 | 2021-01-28 | Outdoor full-color display screen SMD LED device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110117611.4A CN112951968B (en) | 2021-01-28 | 2021-01-28 | Outdoor full-color display screen SMD LED device |
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| CN112951968A CN112951968A (en) | 2021-06-11 |
| CN112951968B true CN112951968B (en) | 2022-09-06 |
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| EP2113942A2 (en) * | 2008-04-30 | 2009-11-04 | Ledon Lighting Jennersdorf GmbH | LED module with frame and circuit board |
| CN101814558A (en) * | 2009-02-23 | 2010-08-25 | 亿光电子工业股份有限公司 | LED packaging structure |
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| US8079139B1 (en) * | 2010-08-27 | 2011-12-20 | I-Chiun Precision Industry Co., Ltd. | Method for producing electro-thermal separation type light emitting diode support structure |
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| JP4661147B2 (en) * | 2004-09-24 | 2011-03-30 | 日亜化学工業株式会社 | Semiconductor device |
| CN101958389A (en) * | 2010-07-30 | 2011-01-26 | 晶科电子（广州）有限公司 | LED surface mounting structure for silicon substrate integrated with functional circuits and packaging method thereof |
| CN209312793U (en) * | 2019-02-15 | 2019-08-27 | 连云港光鼎电子有限公司 | A kind of adopting surface mounted LED lamp bead |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP2113942A2 (en) * | 2008-04-30 | 2009-11-04 | Ledon Lighting Jennersdorf GmbH | LED module with frame and circuit board |
| CN101814558A (en) * | 2009-02-23 | 2010-08-25 | 亿光电子工业股份有限公司 | LED packaging structure |
| CN102005529A (en) * | 2010-05-11 | 2011-04-06 | 日月光半导体制造股份有限公司 | Encapsulation structure of a light emitting diode and encapsulation production technology |
| US8079139B1 (en) * | 2010-08-27 | 2011-12-20 | I-Chiun Precision Industry Co., Ltd. | Method for producing electro-thermal separation type light emitting diode support structure |
| WO2014200267A1 (en) * | 2013-06-11 | 2014-12-18 | 주식회사 세미콘라이트 | Semiconductor light-emitting device and method for manufacturing same |
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Denomination of invention: An outdoor full color display screen SMD LED device Effective date of registration: 20230512 Granted publication date: 20220906 Pledgee: Yiwu Branch of Agricultural Bank of China Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023330000837 |