CN209000902U - A kind of encapsulating structure of frame clsss product enhancing heat dissipation - Google Patents
A kind of encapsulating structure of frame clsss product enhancing heat dissipation Download PDFInfo
- Publication number
- CN209000902U CN209000902U CN201821827801.5U CN201821827801U CN209000902U CN 209000902 U CN209000902 U CN 209000902U CN 201821827801 U CN201821827801 U CN 201821827801U CN 209000902 U CN209000902 U CN 209000902U
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- Prior art keywords
- frame
- cooling fin
- heat dissipation
- encapsulating structure
- chip
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Abstract
The utility model discloses a kind of encapsulating structures of frame clsss product enhancing heat dissipation, the structure is by being fixedly installed cooling fin in the lower surface of the upper surface of frame fixed setting chip, frame, the lower surface of cooling fin is exposed, when encapsulating structure is applied, it can directly be contacted with pcb board, the heat of chip in use is adequately shed by frame and exposed cooling fin, heat dissipation area is increased, improves radiating efficiency.Because the encapsulating structure is simple, so that can once be encapsulated in manufacturing process, simplify existing packaging technology, saved investment.
Description
[technical field]
The utility model relates to package cooling fields, and in particular to a kind of encapsulating structure of frame clsss product enhancing heat dissipation.
[background technique]
Existing enhancing packaging body heat dissipation technology generally directly mounts cooling fin in chip surface, or in encapsulation body surface
Face paste fills cooling fin, cooling fin or in the upper surface of chip or around chip；Which kind of either above method, all
There are following disadvantages: (1) increasing encapsulation body thickness；(2) production efficiency of encapsulation process is lower.
[utility model content]
The shortcomings that the purpose of the utility model is to overcome the above-mentioned prior arts provides a kind of frame clsss product enhancing heat dissipation
Encapsulating structure.Cooling fin is arranged in frame lower surface the device, and the lower surface of cooling fin is exposed, improves the heat dissipation of the structure
Efficiency.
In order to achieve the above objectives, the utility model is achieved using following technical scheme:
A kind of encapsulating structure of frame clsss product enhancing heat dissipation, including frame, the lower surface of frame are fixedly installed heat dissipation
Piece；In the corresponding region of cooling fin, the upper surface of frame is fixedly installed chip；Frame, chip and cooling fin are by resin
Package；The lower surface of cooling fin is exposed.
Further improvement of the utility model is:
Preferably, chip is fixedly connected by glue film with frame；Cooling fin is fixedly connected by glue film with frame.
Preferably, frame is made of several pins.
Preferably, cooling fin is fixedly connected with each pin by glue film.
Preferably, cooling fin selects silicon or graphite.
Preferably, chip is electrically connected by core on wire bonding or upside-down mounting with frame.
Compared with prior art, the utility model has the following beneficial effects:
The utility model discloses a kind of encapsulating structure of frame clsss product enhancing heat dissipation, which passes through in the upper of frame
Chip is fixedly installed in surface, cooling fin is fixedly installed in the lower surface of frame, and the lower surface of cooling fin is exposed, can directly and PCB
Plate contact, enables the heat of chip in use adequately to shed by frame and exposed cooling fin, increases and dissipates
Heat area improves radiating efficiency.
Further, chip passes through glue film with cooling fin and connects with frame, while there is secured connection relationship, glue film
It can effectively radiate.
Further, frame is made of several pins, and cooling fin is fixedly connected by glue film with each pin；Make
It obtains frame itself to connect by cooling fin, enhances bonding strength.
[Detailed description of the invention]
Fig. 1 is the top view of the encapsulating structure of the utility model；
Fig. 2 is the Section A-A sectional view of the encapsulating structure of the utility model；
Fig. 3 is the structural schematic diagram of finished product heat sink in the utility model；
Fig. 4 is schematic diagram after the chip of the utility model, cooling fin attachment.
Wherein: 1 is frame, and 2 be glue film, and 3 be chip, and 4 be resin, and 5 be cooling fin；6 be pin.
[specific embodiment]
The utility model is described in further detail with reference to the accompanying drawing:
Referring to Fig. 1 and Fig. 2, the utility model discloses a kind of encapsulating structures of frame clsss product enhancing heat dissipation；Structure packet
Include frame 1, glue film 2, chip 3, resin 4, cooling fin 5 and pin 6.Frame 1 is made of several pins 6, the arrangement side of pin 6
Formula no requirement (NR), does not contact.The upper surface of frame 1 is bonded with chip 3 by the fixation of glue film 2, and the lower surface of frame 1 passes through glue
The fixation of film 2 is bonded with cooling fin 5；Chip 3 and cooling fin 5 are corresponding, i.e., in 5 corresponding region of cooling fin, chip 3 is fixedly connected on
On the upper surface of frame 1.Resin 4 wraps up the surrounding and frame 1 of chip 3, cooling fin 5；I.e. resin 4 is filled with the encapsulating structure
Each gap, the size of chip 3 need to guarantee that the lower surface of chip 3 is contacted with each of frame 1 pin 6, each pin 6
It is fixedly connected by glue film 2 with the lower surface of chip 3, enhances the fastness of encapsulating structure.
Referring to fig. 2, the upper surface of cooling fin 5 is fixedly connected with glue film 2, surrounding and is encapsulated by resin 4, and lower surface is exposed,
It when finally assembling, is directly contacted with pcb board, convenient for the heat dissipation of entire encapsulating structure.
The manufacturing method of the encapsulating structure the following steps are included:
Step 1, as shown in figure 3, Prefabricated heat sink, the material of heat sink can be easy processings and the tools such as silicon, graphite
There is the material of high heat conductance；
Step 2, heat sink is cut into the cooling fin 5 of separate unit, by heat sink be processed into wafer shape and cut draw be thinned
To 5 design size of cooling fin；
Step 3, cooling fin 5 is mounted, cooling fin 5 is adhered to 1 lower surface of frame by glue film 2；
Step 4, as shown in figure 4, chip 3 mounts, in the corresponding region of cooling fin 5, chip 3 is adhered to frame by glue film 2
1 upper surface of frame；Chip 3 can be electrically connected by lead key closing process with frame 1 or pass through core technique and frame 1 in upside-down mounting
Electrical connection；
Step 5, plastic packaging.Using conventional plastic package method, between the pin 6 of frame 1,3 top of chip and surrounding, cooling fin
Resin 4 is perfused in 5 surroundings, so that resin 4 is wrapped chip 3, cooling fin 5 and frame 1, but 5 lower surface of cooling fin is exposed.
Above-mentioned manufacturing method enables entire technique once to encapsulate, simplify existing envelope because the encapsulating structure is simple
Dress technique has saved investment.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (6)
1. a kind of encapsulating structure of frame clsss product enhancing heat dissipation, which is characterized in that including frame (1), the lower surface of frame (1)
It is fixedly installed cooling fin (5)；In the corresponding region of cooling fin (5), the upper surface of frame (1) is fixedly installed chip (3)；
Frame (1), chip (3) and cooling fin (5) are wrapped up by resin (4)；The lower surface of cooling fin (5) is exposed.
2. a kind of encapsulating structure of frame clsss product enhancing heat dissipation according to claim 1, which is characterized in that chip (3)
It is fixedly connected by glue film (2) with frame (1)；Cooling fin (5) is fixedly connected by glue film (2) with frame (1).
3. a kind of encapsulating structure of frame clsss product enhancing heat dissipation according to claim 2, which is characterized in that frame (1)
It is made of several pins (6).
4. a kind of encapsulating structure of frame clsss product enhancing heat dissipation according to claim 3, which is characterized in that cooling fin
(5) it is fixedly connected with each pin (6) by glue film (2).
5. a kind of encapsulating structure of frame clsss product enhancing heat dissipation according to claim 1, which is characterized in that cooling fin
(5) silicon or graphite are selected.
6. a kind of encapsulating structure of frame clsss product enhancing heat dissipation, feature described in -5 any one exist according to claim 1
In chip (3) is electrically connected by core on wire bonding or upside-down mounting with frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821827801.5U CN209000902U (en) | 2018-11-07 | 2018-11-07 | A kind of encapsulating structure of frame clsss product enhancing heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821827801.5U CN209000902U (en) | 2018-11-07 | 2018-11-07 | A kind of encapsulating structure of frame clsss product enhancing heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209000902U true CN209000902U (en) | 2019-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821827801.5U Active CN209000902U (en) | 2018-11-07 | 2018-11-07 | A kind of encapsulating structure of frame clsss product enhancing heat dissipation |
Country Status (1)
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| CN (1) | CN209000902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
-
2018
- 2018-11-07 CN CN201821827801.5U patent/CN209000902U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
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