CN207503960U - The encapsulating structure of the enhancing heat dissipation of encapsulated moulding - Google Patents
The encapsulating structure of the enhancing heat dissipation of encapsulated moulding Download PDFInfo
- Publication number
- CN207503960U CN207503960U CN201721660813.9U CN201721660813U CN207503960U CN 207503960 U CN207503960 U CN 207503960U CN 201721660813 U CN201721660813 U CN 201721660813U CN 207503960 U CN207503960 U CN 207503960U
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- Prior art keywords
- cooling fin
- chip
- heat dissipation
- encapsulated moulding
- encapsulating structure
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Abstract
The utility model discloses the encapsulating structures of the enhancing heat dissipation of an encapsulated moulding, including substrate, setting chip in the middle part of the upper surface of base plate, cooling fin is set around the chip, the cooling fin is multiple, the upper surface of base plate, chip and cooling fin package setting resin, the chip, cooling fin are bonded in upper surface of base plate by glued membrane.The encapsulating structure of the enhancing heat dissipation of an encapsulated moulding provided by the utility model, cooling fin and once encapsulates in chip perimeter attachment, on the basis of encapsulation body thickness is not increased, can simplify technique raising production efficiency, cost-effective.
Description
Technical field
The utility model is related to package cooling field, the encapsulating structures of the enhancing heat dissipation of specifically one time encapsulated moulding.
Background technology
Existing enhancing packaging body heat dissipation technology is generally used in chip bottom or chip surface attachment cooling fin or is being sealed
Body surface mount cooling fin is filled, which kind of either above method all has the disadvantage that：1st, encapsulation body thickness is increased；2nd, it is raw
It produces less efficient.
Utility model content
The purpose of this utility model is to provide the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding, to solve the above-mentioned back of the body
The problem of being proposed in scape technology.
To achieve the above object, the utility model provides following technical solution：The envelope of the enhancing heat dissipation of encapsulated moulding
Assembling structure including substrate, sets chip, cooling fin, the cooling fin is set around the chip in the middle part of the upper surface of base plate
To be multiple, the upper surface of base plate, chip and cooling fin package setting resin, the chip, cooling fin are bonded by glued membrane
Preferred in upper surface of base plate, the material of the cooling fin is silicon and graphite or other high thermal conductivity material.
Preferably, the cooling fin is at least one, and cooling fin is evenly distributed on around chip.
The manufacturing method of the encapsulating structure of the enhancing heat dissipation of encapsulated moulding, includes the following steps：
The first step, Prefabricated heat sink：The material of heat sink can be the easy processings such as silicon, graphite and have high heat conductance
Material.
Heat sink is cut into the cooling fin of separate unit by second step：Heat sink is processed into wafer shape and cuts to draw and is thinned
To heat sink design size.
Third walks, chip attachment：Chip is adhered to upper surface of base plate by glued membrane, and chip can pass through lead key closing process
It is electrically connected with substrate or is electrically connected by core technique in upside-down mounting with substrate.
4th step mounts cooling fin：Cooling fin is adhered to upper surface of base plate by glued membrane.
5th step, plastic packaging：, can be exposed by heatsink upper surface using conventional plastic package method, it can also be complete by cooling fin
Resin is wrapped in entirely, resin can be polished as needed, until heatsink upper surface is exposed.
Compared with prior art, the beneficial effects of the utility model are as follows：
The utility model provides the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding, in chip perimeter attachment cooling fin simultaneously
Primary encapsulation on the basis of encapsulation body thickness is not increased, can simplify technique and improve production efficiency, cost-effective.
Description of the drawings
Fig. 1 is that heat sink is cut into separate unit by the encapsulating structure of the enhancing heat dissipation of encapsulated moulding of the utility model
Cooling fin schematic diagram；
Fig. 2 is that chip, the cooling fin of the encapsulating structure of the enhancing heat dissipation of encapsulated moulding of the utility model show after mounting
It is intended to；
Fig. 3 is schematic diagram after the plastic packaging of encapsulating structure that the enhancing of encapsulated moulding of the utility model is radiated.
In figure：1st, substrate；2nd, glued membrane；3rd, chip；4th, resin；5th, cooling fin.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Embodiment：- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：The enhancing heat dissipation of encapsulated moulding
Encapsulating structure, including substrate 1,1 upper surface middle part of substrate sets chip 3, and 3 surrounding of chip sets cooling fin 5, institute
It is multiple to state cooling fin 5, and 1 upper surface of substrate, chip 3 and the package of cooling fin 5 set resin 4, the chip 3, cooling fin 5
1 upper surface of substrate is bonded in by glued membrane 2.
The manufacturing method of the enhancing heat-dissipation packaging structure of encapsulated moulding, specifically carries out in accordance with the following steps：
The first step, Prefabricated heat sink：The material of heat sink can be the easy processings such as silicon, graphite and have high heat conductance
Material.Heat sink is processed into wafer shape and cuts to draw and is thinned to 5 design size of cooling fin
Heat sink is cut into the cooling fin 5 of separate unit by second step.
Third walks, and chip 3 mounts：Chip 3 by lead key closing process with substrate 1 can be electrically connected or pass through upside-down mounting
Upper core technique is electrically connected with substrate 1.
4th step mounts cooling fin 5：Cooling fin 5 is adhered to 1 upper surface of substrate by glued membrane 2.
5th step, plastic packaging：, can be exposed by 5 upper surface of cooling fin using conventional plastic package method, it can also be by cooling fin 5
It is fully wrapped around in resin 4.
In step 5, plastic packaging：Can be exposed by 5 upper surface of cooling fin, it can also be fully wrapped around in resin 4 by cooling fin 5.
Resin 4 can be polished, until 5 upper surface of cooling fin is exposed.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding including substrate (1), glued membrane (2), chip (3), resin (4), dissipates
Backing (5), which is characterized in that substrate (1) the upper surface setting chip (3), chip (3) the surrounding setting cooling fin (5),
Substrate (1) upper surface, chip (3) and cooling fin (5) are wrapped up by resin (4).
2. the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding according to claim 1, which is characterized in that the heat dissipation
The material of piece (5) is silicon, graphite or other high thermal conductivity material.
3. the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding according to claim 1, which is characterized in that the chip
(3), cooling fin (5) is bonded in substrate (1) upper surface by glued membrane (2).
4. the encapsulating structure of the enhancing heat dissipation of an encapsulated moulding according to claim 1, which is characterized in that the heat dissipation
Piece (5) is at least one, and cooling fin (5) is evenly distributed on around chip (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721660813.9U CN207503960U (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721660813.9U CN207503960U (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503960U true CN207503960U (en) | 2018-06-15 |
Family
ID=62508664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721660813.9U Active CN207503960U (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503960U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107833866A (en) * | 2017-11-29 | 2018-03-23 | 华天科技（西安）有限公司 | The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding |
-
2017
- 2017-11-29 CN CN201721660813.9U patent/CN207503960U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107833866A (en) * | 2017-11-29 | 2018-03-23 | 华天科技（西安）有限公司 | The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding |
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