CN107833866A - The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding - Google Patents
The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding Download PDFInfo
- Publication number
- CN107833866A CN107833866A CN201711224782.7A CN201711224782A CN107833866A CN 107833866 A CN107833866 A CN 107833866A CN 201711224782 A CN201711224782 A CN 201711224782A CN 107833866 A CN107833866 A CN 107833866A
- Authority
- CN
- China
- Prior art keywords
- fin
- chip
- encapsulating structure
- substrate
- encapsulated moulding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000000465 moulding Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000012528 membrane Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses the encapsulating structure and manufacture method of the enhancing radiating of an encapsulated moulding, including substrate, chip is set in the middle part of the upper surface of base plate, the chip circumference sets fin, the fin is multiple, the upper surface of base plate, chip and fin parcel set resin, and the chip, fin are bonded in upper surface of base plate by glued membrane.The encapsulating structure and manufacture method of the enhancing radiating of an encapsulated moulding provided by the invention, fin and are once encapsulated in chip perimeter attachment, on the basis of encapsulation body thickness is not added, can simplify technique raising production efficiency, cost-effective.
Description
Technical field
The present invention relates to package cooling field, the encapsulating structure of the enhancing radiating of specifically one time encapsulated moulding and manufacturer
Method.
Background technology
Existing enhancing packaging body heat dissipation technology typically mounts fin using in chip bottom or chip surface, or is sealing
Body surface mount fin is filled, either which kind of method of the above, all had the disadvantage that：1st, encapsulation body thickness is added；2nd, it is raw
Produce less efficient.
The content of the invention
It is an object of the invention to provide the encapsulating structure and manufacture method of the enhancing radiating of an encapsulated moulding, to solve
The problem of being proposed in above-mentioned background technology.
To achieve the above object, the present invention provides following technical scheme：The encapsulation knot of the enhancing radiating of encapsulated moulding
Structure, including substrate, the upper surface of base plate middle part set chip, and the chip circumference sets fin, and the fin is more
Individual, the upper surface of base plate, chip and fin parcel set resin, and the chip, fin are bonded in base by glued membrane
Plate upper surface is preferable, and the material of the fin is silicon and graphite or other high thermal conductivity material.
Preferably, the fin is at least one that fin is evenly distributed on around chip.
The manufacture method of the encapsulating structure of the enhancing radiating of encapsulated moulding, comprises the following steps：
The first step, Prefabricated heat sink：The material of heat sink can be the easy processings such as silicon, graphite and have high heat conductance
Material.
Second step, heat sink is cut into the fin of separate unit：Heat sink is processed into wafer shape and cuts to draw and is thinned
To heat sink design size.
3rd step, chip attachment：Chip is adhered to upper surface of base plate by glued membrane, and chip can pass through lead key closing process
Electrically connect with substrate or electrically connected by core technique in upside-down mounting with substrate.
4th step, mount fin：Fin is adhered to upper surface of base plate by glued membrane.
5th step, plastic packaging：, can be exposed by heatsink upper surface using conventional plastic package method, can also be complete by fin
Resin is wrapped in entirely, resin can be polished as needed, until heatsink upper surface is exposed.
Compared with prior art, beneficial effects of the present invention are as follows：
The present invention provides the encapsulating structure of the enhancing radiating of an encapsulated moulding, in chip perimeter attachment fin and once
Encapsulation, on the basis of encapsulation body thickness is not added, technique can be simplified and improve production efficiency, cost-effective.
Brief description of the drawings
Fig. 1 is that heat sink is cut into dissipating for separate unit by the encapsulating structure of the enhancing radiating of encapsulated moulding of the present invention
Backing schematic diagram；
Fig. 2 is schematic diagram after the chip of the encapsulating structure of the enhancing radiating of encapsulated moulding of the present invention, fin attachment；
Fig. 3 is schematic diagram after the plastic packaging of the encapsulating structure of the enhancing radiating of encapsulated moulding of the present invention.
In figure：1st, substrate；2nd, glued membrane；3rd, chip；4th, resin；5th, fin.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1-3 are referred to, the present invention provides a kind of technical scheme：The encapsulating structure of the enhancing radiating of encapsulated moulding,
Including substrate 1, the upper surface middle part of substrate 1 sets chip 3, and the surrounding of chip 3 sets fin 5, and the fin 5 is
Multiple, the upper surface of substrate 1, chip 3 and the parcel of fin 5 set resin 4, and the chip 3, fin 5 are viscous by glued membrane 2
It is connected on the upper surface of substrate 1.
Embodiment：The manufacture method of the enhancing heat-dissipation packaging structure of encapsulated moulding, is specifically carried out in accordance with the following steps：
The first step, Prefabricated heat sink：The material of heat sink can be the easy processings such as silicon, graphite and have high heat conductance
Material.Heat sink is processed into wafer shape and cuts to draw and is thinned to the design size of fin 5
Second step, heat sink is cut into the fin 5 of separate unit.
3rd step, chip 3 mount：Chip 3 can electrically connect or pass through upside-down mounting by lead key closing process with substrate 1
Upper core technique electrically connects with substrate 1.
4th step, mount fin 5：Fin 5 is adhered to the upper surface of substrate 1 by glued membrane 2.
5th step, plastic packaging：, can be exposed by the upper surface of fin 5 using conventional plastic package method, can also be by fin 5
It is fully wrapped around in resin 4.
In step 5, plastic packaging：Can be exposed by the upper surface of fin 5, can also be fully wrapped around in resin 4 by fin 5.
Resin 4 can be polished, until the upper surface of fin 5 is exposed.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. the encapsulating structure of the enhancing radiating of encapsulated moulding, including substrate (1), glued membrane (2), chip (3), resin (4), dissipate
Backing (5), it is characterised in that substrate (1) upper surface sets chip (3), and fin (5) is set around the chip (3),
Substrate (1) upper surface, chip (3) and the fin (5) are wrapped up by resin (4).
2. the encapsulating structure of the enhancing radiating of an encapsulated moulding according to claim 1, it is characterised in that the radiating
The material of piece (5) is silicon, graphite or other high thermal conductivity material.
3. the encapsulating structure of the enhancing radiating of an encapsulated moulding according to claim 1, it is characterised in that the chip
(3), fin (5) is bonded in substrate (1) upper surface by glued membrane (2).
4. the encapsulating structure of the enhancing radiating of an encapsulated moulding according to claim 1, it is characterised in that the radiating
Piece (5) is at least one, and fin (5) is evenly distributed on around chip (3).
5. the manufacture method of the encapsulating structure of the enhancing radiating of an encapsulated moulding, it is characterised in that comprise the following steps：
The first step, Prefabricated heat sink：The material of heat sink can be the material of silicon, graphite or other high heat conductance；
Second step, heat sink is cut into the fin (5) of separate unit；
3rd step, chip (3) attachment：Chip (3) can be electrically connected with substrate (1) by lead key closing process or by falling
Core technique is loaded onto to electrically connect with substrate (1)；
4th step, attachment fin (5)：Fin (5) is adhered to substrate (1) upper surface by glued membrane (2)；
5th step, plastic packaging：Can be exposed by fin (5) upper surface, can also be fully wrapped around in resin (4) by fin (5).
6. the manufacture method of the encapsulating structure of the enhancing radiating of an encapsulated moulding according to claim 5, its feature exist
In resin (4) being polished in step 5, until fin (5) upper surface is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224782.7A CN107833866A (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224782.7A CN107833866A (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107833866A true CN107833866A (en) | 2018-03-23 |
Family
ID=61646597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711224782.7A Pending CN107833866A (en) | 2017-11-29 | 2017-11-29 | The encapsulating structure and manufacture method of the enhancing radiating of encapsulated moulding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107833866A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
| CN111785698A (en) * | 2020-07-13 | 2020-10-16 | 杭州很美网络科技有限公司 | Integrated circuit packaging process |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936276A (en) * | 1995-07-17 | 1997-02-07 | Ibiden Co Ltd | Substrate for semiconductor package |
| CN1190797A (en) * | 1996-12-13 | 1998-08-19 | 国际商业机器公司 | Radiation sheet for doing over again and replacing of lead-wire bonding chip and package structure thereof |
| CN1372317A (en) * | 2002-03-11 | 2002-10-02 | 威盛电子股份有限公司 | Chip heat sink package structure and making method thereof |
| CN104134633A (en) * | 2014-08-07 | 2014-11-05 | 华进半导体封装先导技术研发中心有限公司 | High-power chip flexible substrate packaging structure and packaging process |
| CN104241218A (en) * | 2014-06-25 | 2014-12-24 | 中国科学院微电子研究所 | Flip chip plastic package structure with heat dissipation structure and manufacturing method |
| CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
| CN207503960U (en) * | 2017-11-29 | 2018-06-15 | 华天科技（西安）有限公司 | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding |
-
2017
- 2017-11-29 CN CN201711224782.7A patent/CN107833866A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936276A (en) * | 1995-07-17 | 1997-02-07 | Ibiden Co Ltd | Substrate for semiconductor package |
| CN1190797A (en) * | 1996-12-13 | 1998-08-19 | 国际商业机器公司 | Radiation sheet for doing over again and replacing of lead-wire bonding chip and package structure thereof |
| CN1372317A (en) * | 2002-03-11 | 2002-10-02 | 威盛电子股份有限公司 | Chip heat sink package structure and making method thereof |
| CN104241218A (en) * | 2014-06-25 | 2014-12-24 | 中国科学院微电子研究所 | Flip chip plastic package structure with heat dissipation structure and manufacturing method |
| CN104134633A (en) * | 2014-08-07 | 2014-11-05 | 华进半导体封装先导技术研发中心有限公司 | High-power chip flexible substrate packaging structure and packaging process |
| CN105977366A (en) * | 2016-06-29 | 2016-09-28 | 山东浪潮华光光电子股份有限公司 | Heat-dissipation type LED packaging structure and method |
| CN207503960U (en) * | 2017-11-29 | 2018-06-15 | 华天科技（西安）有限公司 | The encapsulating structure of the enhancing heat dissipation of encapsulated moulding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
| CN111785698A (en) * | 2020-07-13 | 2020-10-16 | 杭州很美网络科技有限公司 | Integrated circuit packaging process |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180323 |