CN209199909U - A kind of novel TO-220 type semiconductor package - Google Patents
A kind of novel TO-220 type semiconductor package Download PDFInfo
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- CN209199909U CN209199909U CN201821855901.9U CN201821855901U CN209199909U CN 209199909 U CN209199909 U CN 209199909U CN 201821855901 U CN201821855901 U CN 201821855901U CN 209199909 U CN209199909 U CN 209199909U
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Abstract
The utility model discloses a kind of novel TO-220 type semiconductor packages, including shell, base island frame, pin, through-hole is provided on the shell, the upper end of shell is arranged in the through-hole, the shell includes colloid encapsulation, the colloid encapsulation of the shell is at least above the encapsulation of colloid described in the through hole center point and the positive surface of shell in the same plane, and base island frame is arranged in shell, and the back side of the base island frame has radiating surface exposed.The utility model provides a kind of frame using tradition TO-220 iron envelope, increase base island frame plastic packaging material colloidal volume by packing colloid, a kind of novel TO-220 type semiconductor package of heat dissipation performance is kept while more elements or semiconductor crystal wafer can be placed in semiconductor packages confined space area.
Description
Technical field
The utility model relates to TO-220 type technical field of semiconductor encapsulation more particularly to a kind of novel TO-220 type partly to lead
Body encapsulating structure.
Background technique
Traditional TO-220 encapsulates Full-plastics sealed, because being enclosed in adhesive body in installation Ji Dao all wholes of cooling fin and wafer,
And packaging body front sealing shell surface is cascaded surface, causes base island volume available limited, cannot install more circuits or wafer
In being encapsulated in, while heat dissipation performance is bad；And the product frame of To-220 iron envelope is exposed, perfect heat-dissipating, but because packaging plastic
Body finite volume can place the base island limited area of circuit or wafer, cannot install more circuits or wafer, cause this two
Kind encapsulation is commonly used in traditional semiconductor product encapsulation.
But with the function of product and require it is more and more, user product is required again it is light and short, it is this traditional
Encapsulating structure cannot place enough wafer and circuit product, and use higher volume of framework encapsulation product instead, and nothing
Method allows new product to be compatible with traditional old product market or meet cooling requirements.Therefore, it is necessary to a kind of encapsulation of novel semi-conductor, come
Meets the needs of following novel especially high-power composite semiconductor, area can be used in the Ji Dao for expanding encapsulation, also not significant
Heat dissipation performance is reduced, while meeting and old conventional package frame is continued to use, reduces cost.
Chinese Patent Application No. is 201621032074.4, the applying date: on 08 21st, 2016, publication date: 2017 05
The moon 21, patent name is: the TO-220 type lead frame of minor insulation, the utility model belong to field of semiconductor package, especially
It is related to a kind of TO-220 type lead frame of minor insulation, including heat sink, the terminal pin connecting with heat sink, heat sink packet
The radiating area for including plastic packaging area, being arranged in above plastic packaging area, the front in plastic packaging area is covered with plastic packaging material and plastic packaging material extends coated to
The back side in plastic packaging area, front, the back side and the top of radiating area are coated with plastic packaging material, heat sink with a thickness of 1.0mm, radiating area
The thickness of the plastic packaging material in front, the back side and top is respectively 0.15mm, 0.15mm, 0.40mm, and the utility model is by radiating
The head of plate, that is, radiating area coat the copper frame of script with plastic packaging material, are formed on its surface a minor insulation knot
Structure makes subsequent product in practical applications, eliminate producer installation insulation sleeve cost, production efficiency also available promotion,
Also it need not be insulated using edge adhesive plaster, such product greatly improves casing insulation effect, improves safety.
Although above patent document discloses a kind of TO-220 type lead frame of minor insulation, though the semiconductor package body
So reduce costs, improve safety, but this be encapsulated in TO-220 Full-plastics sealed product practical and traditional in structure except
Because replacing TO-220 plastic packaging frame with the iron of traditional TO-220 envelope frame, inner frame slightly has size difference outer, structure and makes
Type and functionally substantially similar, only merely TO-220 iron envelope conventional frame all with plastic packaging material encapsulating solution tradition TO-220
Iron seals the Insulation Problems of shell frame products, and the positive surface of shell of sealing shell is still not contour cascaded surface, in structure
On can not more place electronic component and semiconductor crystal wafer, for help realize encapsulation more circuits function do not help,
And base island portion divides back metal to be encapsulated entirely by colloid, and heat dissipation performance is bad, is not able to satisfy the demand of market development.
Utility model content
In view of this, the present invention provides a kind of frames using tradition TO-220 iron envelope, are increased by packing colloid
Base island frame plastic packaging material colloidal volume, can place more elements or semiconductor die in semiconductor packages confined space area
A kind of novel TO-220 type semiconductor package of heat dissipation performance is kept while circle.
In order to realize the utility model aim, following technical scheme can be taken:
A kind of novel TO-220 type semiconductor package, including shell, base island frame, pin are arranged on the shell
There is through-hole, which is arranged in the upper end of shell, and the shell includes colloid encapsulation, and the colloid encapsulation of the shell is at least high
In the through hole center point, in the same plane with the positive surface of shell, frame setting in the base island exists for the colloid encapsulation
In shell, the back side of the base island frame has radiating surface exposed.
It is provided at least one inner frame on the frame of the Metal Substrate island, is provided with electronic component on the inner frame,
Semiconductor crystal wafer is additionally provided on the Metal Substrate island frame, the inner frame and semiconductor crystal wafer on the frame of the base island are arranged in metal
On the same plane of base island frame.
The colloid encapsulates entire shell front.
Described base island frame a part extends the shell.
The pin size is the pin size of TO-220 type semiconductor packages.
Gap representative value between the pin is 2.54mm.
Base island frame is metal framework.
The inner frame is 2 or 3 or 5.
There is connecting line between the inner frame and semiconductor crystal wafer.
The beneficial effects of the utility model are: 1) the utility model utilizes the packaging frame of traditional TO-220, envelope is increased
Glue surface product, increases encapsulation volume, and the encapsulation utilization rate of frame can be improved using Ji Dao by achieving the purpose that increase；2) this reality
With novel installation more multicomponent, component or chip die retain the good of traditional TO-220 iron envelope exposed metal in inside
Thermal diffusivity；3) since the frame of traditional To-220 is utilized, so the pin and fixed hole position of product can be compatible with old tradition TO-
220 fixed hole position positioning and pin mounting means；4) the utility model improves space utilization rate, increases electronic component
Quantity is placed, meets the needs of semiconductor packages future development, suitable for being widely popularized.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of novel TO-220 type semiconductor package of the utility model embodiment；
Fig. 2 is a kind of side sectional view of novel TO-220 type semiconductor package of the utility model embodiment；
Fig. 3 is a kind of structure schematic diagram of novel TO-220 type semiconductor package of the utility model embodiment.
Specific embodiment
With reference to the accompanying drawing and the embodiments of the present invention are described in further detail utility model.
Embodiment 1
Referring to Fig. 1, Fig. 2, Fig. 3, a kind of novel TO-220 type semiconductor package, including shell 1, base island frame 2,
Pin 12 is provided with through-hole 11 on the shell 1, which is arranged in the upper end of shell 1, and the shell 1 includes colloid
The colloid encapsulation of encapsulation, the shell 1 is at least above 11 central point of through-hole；The colloid encapsulation and the positive table of shell 1
Face is not cascaded surface in the same plane, and base island frame is arranged in shell, the backside radiator face (figure of the base island frame 2
Do not show) it is exposed.
Base island frame 2 is arranged in shell；At least one inner frame 3 is provided on base island frame 2, it is interior at this
It is provided with electronic component 4 on frame 3, semiconductor crystal wafer 5, the inside casing on base island frame 2 are additionally provided on the base island frame 2
Frame 3 and semiconductor crystal wafer 5 are disposed on the same plane, no superposition.
Multiple semiconductor crystal wafers 5 can be directly placed on base island frame 2, may also set up at least one inner frame,
It is placed with electronic component again on the inner frame.
The selection of 3 material of inner frame can allow electrical isolation between partial circuit and the semiconductor crystal wafer 5 of outer framework 2.
Preferably, the colloid encapsulates entire 1 front of shell, can also encapsulate the side of the shell 1.
The plastic packaging shell 1 can only cover a front surface and a side surface of the base island frame 2, outside the back side of base island frame 2
Dew, part are encapsulated, and are not total incapsulation
The positive plastic packaging colloid shell of base island frame 2 keeps a planar design.
Since traditional TO-220 type semiconductor alloy frame is because of exposed metal, user plays screw and heat dissipation by the through-hole 11
Piece must install insulation micelle additional in centre when fixed and carry out electric insulation, increase installation and material cost.
And by also carrying out sealing around through-hole 11 described in the utility model, the colloid encapsulation of the shell 1 is at least above
11 central point of through-hole.The diameter of the through-hole 11 of the shell 1 is less than the metal throuth hole diameter of frame；If through-hole 11 is polygon
Shape hole then refers to that catercorner length is less than the metal throuth hole catercorner length of frame, and the following contents etc. herewith defines.
Further, it is preferable that the colloid is encapsulated into entire shell 1.Base island frame 2 is not only further increased in this way
It can be used for disposing outside the volume including more potted elements, while can reach 11 interior metal of through-hole of base island frame 2 not
It is exposed, achieve the effect that electric insulation, again plus insulation micelle, not reduced when user uses user installation and material at
This.
Preferably, base island frame 2 is metal framework, it is further preferred that the metal framework is copper frame.
The base island frame 2 is that metal framework is not only light but also low in cost, meets the demand of semiconductor packages material.
Frame 2 a part in the base island extends the shell 1.The base island frame 2 extends 1 part of shell, makes this reality
Heat dissipation performance is improved with novel, semiconductor package body is allow preferably to radiate.Base island described in the utility model frame 2 is not
Only can be with device semiconductor crystal wafer, while the effect of heat dissipation is also played, certain occasions can also be played to be connected with external electric appliance
Effect.
Embodiment 2
Referring to Fig. 1, Fig. 2, Fig. 3, the difference is that, pin size described in the utility model is with above-described embodiment
The pin size of TO-220 type semiconductor packages.Since the frame of traditional To-220 is utilized in the utility model, so product
Pin and fixed hole position can be compatible with old tradition TO-220 fixed hole position positioning and pin mounting means, greatly reduce user
Cost.
Preferably, the gap representative value between the pin is 2.54mm.
Embodiment 3
Referring to Fig. 1, Fig. 2, Fig. 3, with above-described embodiment the difference is that, in the present embodiment, the inner frame 3
It can be set to 2 or 3 or 5, it is even more.Due to increasing the quantity of inner frame 3, meanwhile, it is placed on inner frame 3
On electronic component or wafer can also increase, in this way, be exactly increased in limited space in semiconductor package it is more
Electronic component or wafer, can make semiconductor function or effect greatly improve.
In the present embodiment, control circuit can be loaded in the upper surface of the inner frame 3, can also loading member or wafer,
And provide the electrical connection effect of subelement on the inner frame 3.According to actual needs, it is also used as providing inner frame 3 electricity
Electrical connection effect between road and base island frame 2, reduces metal bonding line routing amount, reduces technology difficulty and complexity.
The material of the inner frame 3 can be printed circuit board.
Embodiment 4
Referring to Fig. 1, Fig. 2, Fig. 3, with above-described embodiment the difference is that, the inner frame 3 and semiconductor crystal wafer 5 it
Between have connecting line 6.Made between inner frame 3 and semiconductor crystal wafer 5 by the connecting line 6 for electrical connection.
The utility model encapsulating structure is on the basis of the encapsulation of traditional To-220 type semiconductor iron envelope frame to former exposed
Part increase the adhesive body area coverage of encapsulation upwards, it is basic to cover base island most areas, cover the top of colloid extremely
Less higher than the central point of the through-hole 11 of base island frame 2, and through-hole 11 central point of the packing colloid on base island frame 2 is following
It is partially all whole coverings below edge.It can be part covering or all coverings in the 11 lower edge above section of through-hole.
The utility model increases 1 sealing area of shell, while increasing encapsulation volume, and reaching to increase can utilize Ji Dao's
Purpose improves the encapsulation utilization rate of base island frame 2, can install more multicomponent, component or chip die in inside, protect simultaneously
Hand down to posterity the excellent radiating effect of system TO-220 iron envelope exposed metal.
The above, the only preferred embodiment of the utility model, are not intended to limit the protection of the utility model
Range.
Claims (9)
1. a kind of novel TO-220 type semiconductor package, including shell, base island frame, pin, it is provided on the shell
The upper end of shell is arranged in through-hole, the through-hole, and the shell includes colloid encapsulation, it is characterised in that: the colloid of the shell
Encapsulation is at least above the through hole center point, and the colloid is encapsulated with the positive surface of shell in the same plane, the Ji Dao
Frame is arranged in shell, and the back side of the base island frame has radiating surface exposed.
2. a kind of novel TO-220 type semiconductor package according to claim 1, it is characterised in that: base island frame
It is provided at least one inner frame on frame, is provided with electronic component on the inner frame, is additionally provided on the Metal Substrate island frame
Semiconductor crystal wafer, inner frame and semiconductor crystal wafer on the frame of the base island are arranged on the same plane of Metal Substrate island frame.
3. a kind of novel TO-220 type semiconductor package according to claim 1, it is characterised in that: the colloid envelope
Fill entire shell front.
4. a kind of novel TO-220 type semiconductor package according to claim 1, it is characterised in that: base island frame
Frame a part extends the shell.
5. a kind of novel TO-220 type semiconductor package according to claim 1, it is characterised in that: the pin ruler
The very little pin size for TO-220 type semiconductor packages.
6. a kind of novel TO-220 type semiconductor package according to claim 4, it is characterised in that: the pin it
Between gap representative value be 2.54mm.
7. a kind of novel TO-220 type semiconductor package according to claim 1, it is characterised in that: base island frame
Frame is metal framework.
8. a kind of novel TO-220 type semiconductor package according to claim 2, it is characterised in that: the inner frame
For 2 or 3 or 5.
9. a kind of novel TO-220 type semiconductor package according to claim 2, it is characterised in that: the inner frame
There is connecting line between semiconductor crystal wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821855901.9U CN209199909U (en) | 2018-11-12 | 2018-11-12 | A kind of novel TO-220 type semiconductor package |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821855901.9U CN209199909U (en) | 2018-11-12 | 2018-11-12 | A kind of novel TO-220 type semiconductor package |
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| CN209199909U true CN209199909U (en) | 2019-08-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326572A (en) * | 2018-11-12 | 2019-02-12 | 鑫金微半导体(深圳)有限公司 | A kind of novel TO-220 type semiconductor package |
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2018
- 2018-11-12 CN CN201821855901.9U patent/CN209199909U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326572A (en) * | 2018-11-12 | 2019-02-12 | 鑫金微半导体(深圳)有限公司 | A kind of novel TO-220 type semiconductor package |
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