CN204375722U - A kind of semiconductor package - Google Patents

Abstract

The utility model discloses a kind of semiconductor package, a chip; One lead frame, described lead frame comprises metal base and metal pin; Described metal pin is connected by wire with described chip; One adhesive layer, described chip is bonded in one of metal base in described lead frame on the surface by described adhesive layer; One heat conductive insulating glue-line, is attached at another surface of metal base in described lead frame; One heating panel, is attached at heat conductive insulating glue-line; And a plastic packaging colloid, the non-radiating surface region of coating chip, adhesive layer, heat conductive insulating glue-line, lead frame and heating panel.The beneficial effects of the utility model are by using heat conductive insulating glue-line between heating panel and lead frame; heating panel can be combined with lead frame; the insulation of chip carrier and heating panel can be ensured; heat can be taken away by heating panel fast that simultaneously expose; simultaneously heating panel can absorb the heat that chip produces instantaneously and serves as heat sink, thus protect IC.

Description

A semiconductor packaging structure

technical field

The utility model relates to the technical field of semiconductors, in particular to a semiconductor packaging structure.

Background technique

Semiconductor products are mainly used in the high-voltage field. Due to the restriction that the product must comply with the UL standard (to ensure that the gate and drain do not break down under high voltage and have sufficient creepage distance), the metal base of the product lead frame must be The whole is encapsulated with insulating resin material to achieve the purpose of insulation.

Lead frame is the basic material of semiconductor product packaging. As the chip carrier of integrated circuits, it acts as a bridge connecting with external wires, while taking into account the functions of heat dissipation and mechanical support. In order to meet the insulation requirements, the method of fully encapsulating the metal base of the lead frame with insulating resin material is used. Since the thermal conductivity of the insulating resin material is only 1/150 of the lead frame, it will affect the heat dissipation performance of the lead frame, resulting in the heat dissipation performance of semiconductor products. Poor performance will directly affect the service life of chips in semiconductor products.

Utility model content

In view of this, the embodiments of the present invention provide a semiconductor packaging structure to solve the technical problems in the prior art.

The utility model provides a semiconductor package structure, comprising

a chip;

A lead frame, the lead frame includes a metal base and metal pins; the metal pins and the chip are connected by wires;

an adhesive layer, the chip is bonded on a surface of the metal base in the lead frame through the adhesive layer;

A heat-conducting insulating adhesive layer, attached to the other surface of the metal base in the lead frame;

a heat dissipation plate attached to the thermally conductive and insulating adhesive layer; and

A plastic encapsulant, covering the chip, the adhesive layer, the heat-conducting and insulating adhesive layer, the lead frame and the non-heat-dissipating surface area of the heat-dissipating plate.

Further, the chip has an opposite active surface and a non-active surface, and the non-active surface of the chip is bonded to the surface of the metal base through an adhesive layer.

Further, the heat dissipation surface of the heat dissipation plate is exposed to the air.

Further, the surface area of the heat dissipation surface of the heat dissipation plate is larger than the surface area of the thermally conductive and insulating adhesive layer.

Further, the heat-conducting and insulating glue layer adopts a thermosetting resin glue.

The beneficial effects of the utility model are: the heat-conducting insulating adhesive layer is used between the heat-dissipating plate and the lead frame to combine the heat-dissipating plate and the lead frame, which can ensure the insulation between the chip holder and the heat-dissipating plate, and the exposed heat-dissipating plate can quickly take away the heat, At the same time, the cooling plate can absorb the instantaneous heat generated by the chip and act as a heat sink to protect the chip.

Description of drawings

Other characteristics, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

Fig. 1 is the structural representation of the utility model semiconductor packaging structure;

In the picture:

1. Chip 2. Lead frame 3. Metal base 4. Metal pin 5. Wire

6. Adhesive layer 7. Thermally conductive and insulating adhesive layer 8. Heat dissipation plate 9. Plastic sealant

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described in further detail. It can be understood that the specific embodiments described here are only used to explain the utility model, rather than limit the utility model. In addition, it should be noted that, for the convenience of description, only the part related to the present utility model is shown in the drawings but not the whole content.

As shown in Figure 1, the utility model provides a semiconductor packaging structure, including

a chip 1;

A lead frame 2, the lead frame 2 includes a metal base 3 and a metal pin 4; the metal pin 4 is connected to the chip 1 through a wire 5;

An adhesive layer 6, the chip 1 is bonded on a surface of the metal base 3 in the lead frame 2 through the adhesive layer 6;

A thermally conductive and insulating adhesive layer 7, attached to the other surface of the metal base 3 in the lead frame 2;

a heat dissipation plate 8 attached to the thermally conductive and insulating adhesive layer 7; and

A plastic encapsulant 9 covering the chip 1, the adhesive layer 6, the thermally conductive insulating adhesive layer 7, the lead frame 2 and the non-radiating surface area of the heat dissipation plate 8, wherein the encapsulant 9 is made of epoxy resin; The heat dissipation surface is the surface of the heat dissipation plate 8 exposed in the air, and the heat dissipation surface of the heat dissipation plate 8 is not covered by the plastic encapsulant 9, so it can exchange heat with the outside in time to dissipate heat.

Specifically, the chip 1 has an opposite active surface and a non-active surface, and the non-active surface of the chip 1 is bonded to one surface of the metal base 3 through the adhesive layer 6, wherein the active surface of the chip 1 is provided with Electronic components, the active surface of the chip is not provided with electronic components; in this way, the chip 1 is fixed on the lead frame 2 .

The heat-conducting insulating adhesive layer 7 adopts a thermosetting resin glue, so that the thermosetting resin glue can combine the heat dissipation plate 8 and the lead frame 2, on the one hand, the heat generated by the chip 1 can be quickly transferred to the heat dissipation plate 8; on the other hand, since the lead frame 2 has the function of heat dissipation, the combination of the heat dissipation plate 8 and the lead frame 2 enables the lead frame 2 and the heat dissipation plate 8 to dissipate heat at the same time, thereby protecting the chip 1 .

The surface area of the heat dissipation surface of the heat dissipation plate 8 is greater than the surface area of the thermally conductive insulating adhesive layer 7; the heat dissipation surface of the heat dissipation plate 8 is exposed in the air, and the exposed heat dissipation plate 8 can quickly bring heat to the air during use. At the same time, the cooling plate 8 can absorb the heat generated by the chip 1 and act as a heat sink, thereby protecting the chip 1 . Because the surface area of the heat dissipation surface of the heat dissipation plate 8 is larger than the surface area of the thermally conductive insulating adhesive layer 7, the area for heat dissipation is increased, so the heat dissipation rate of the heat dissipation plate 8 is faster, and the heat is quickly taken away to protect the chip 1.

Note that the above are only preferred embodiments of the present invention and the applied technical principles. Those skilled in the art will understand that the utility model is not limited to the specific embodiments described here, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the utility model. Therefore, although the utility model has been described in detail through the above embodiments, the utility model is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the utility model. The scope of the present invention is determined by the appended claims.

Claims (5)

1. a semiconductor package, is characterized in that, comprises

One chip;

One lead frame, described lead frame comprises metal base and metal pin; Described metal pin is connected by wire with described chip;

One adhesive layer, described chip is bonded in one of metal base in described lead frame on the surface by described adhesive layer;

One heat conductive insulating glue-line, is attached at another surface of metal base in described lead frame;

One heating panel, is attached at heat conductive insulating glue-line; And

One plastic packaging colloid, the non-radiating surface region of coating chip, adhesive layer, heat conductive insulating glue-line, lead frame and heating panel.

2. semiconductor package according to claim 1, is characterized in that, described chip has relative acting surface and non-active face, and the non-active face of chip is bonded on the surface of metal base by adhesive layer.

3. semiconductor package according to claim 1, is characterized in that, the radiating surface of described heating panel exposes in air.

4. semiconductor package according to claim 1, is characterized in that, the surface area of the radiating surface of described heating panel is greater than the surface area of heat conductive insulating glue-line.

5. semiconductor package according to claim 1, is characterized in that, described heat conductive insulating glue-line have employed the resin glue of heat curing-type.