CN208970500U - Novel more frame composite semiconductor encapsulating structures - Google Patents
Novel more frame composite semiconductor encapsulating structures Download PDFInfo
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- CN208970500U CN208970500U CN201821856884.0U CN201821856884U CN208970500U CN 208970500 U CN208970500 U CN 208970500U CN 201821856884 U CN201821856884 U CN 201821856884U CN 208970500 U CN208970500 U CN 208970500U
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Abstract
The utility model discloses a kind of novel more frame composite semiconductor encapsulating structures, including shell, the main outer framework of metal, pin, the main outer framework of metal is arranged in shell or part is exposed at outside shell, at least one inner frame is provided on the main outer framework of metal, electronic component is provided on the inner frame, semiconductor crystal wafer is additionally provided on the main outer framework of the metal, the inner frame and semiconductor crystal wafer on the main outer framework of metal are disposed on the same plane.The utility model lies in that providing a kind of more frames, novel more frame composite semiconductor encapsulating structures of more elements or semiconductor crystal wafer can be placed in semiconductor packages confined space area.
Description
Technical field
The utility model relates to technical field of semiconductor encapsulation more particularly to novel more frame composite semiconductor encapsulation knots
Structure.
Background technique
Traditional semiconductor packages is substantially single frame, or with package substrate, or with metal framework, faces Ji Dao
Limited area, it is very difficult to polycrystalline circle, or wafer and device composite package product are loaded, in particular for power loading semiconductor die
Circle on the main outer framework of metal, while also the driving with multicomponent or control circuit again composite package wherein when, electricity
Gas connection and isolation, the limited of spatial area all allows traditional encapsulating structure to be unable to complete.
But with the function of product and require it is more and more, user product is required again it is light and short, it is this traditional
Encapsulating structure cannot place enough wafer and circuit product, it is therefore desirable to research and develop a kind of compound more framework encapsulation knots
Structure, to meet the needs of following novel especially high-power composite semiconductor.
Chinese Patent Application No. is 201820017640.7, the applying date: on 01 05th, 2018, publication date: 2018 07
The moon 24, patent name is: semiconductor package body and lead frame item, the utility model are related to semiconductor package body and lead frame
Frame item.According to the lead frame item of an embodiment of the present invention comprising carrying tablet, cooling fin and several pins.Wherein,
The carrying tablet has first thickness, and has the supporting region being set on first surface and the heat dissipation being set on second surface
Area, first surface are opposite with second surface；The cooling fin has second thickness, and connect with the first side of the carrying tablet；It is several
Pin has third thickness, and extends outwardly from second side of carrying tablet, and the first side is opposite with second side.In addition, radiating area with
Several pins are not directly contacted with, and first thickness is greater than second thickness and third thickness.Semiconductor provided by the utility model
Packaging body and lead frame item have thickness compared with the carrying tablet of pin thickness, and the heat that can effectively generate high-power die passes
It leads to the external world, improves the heat dissipation performance of semiconductor package body.
Although above patent document discloses a kind of semiconductor package body and lead frame item, although the semiconductor package body
Heat dissipation performance is improved, but can not more place electronic component and semiconductor crystal wafer on encapsulating structure, is not able to satisfy
The demand of market development.
Utility model content
In view of this, the present invention provides a kind of more frames, can place in semiconductor packages confined space area
Novel more frame composite semiconductor encapsulating structures of more elements or semiconductor crystal wafer.
In order to realize the utility model aim, following technical scheme can be taken:
A kind of novel more frame composite semiconductor encapsulating structures, including the main outer framework of shell, metal, pin, the metal
Main outer framework is arranged in shell, is provided at least one inner frame on the main outer framework of metal, is arranged on the inner frame
There is electronic component, semiconductor crystal wafer is additionally provided on the main outer framework of the metal, the inner frame on the main outer framework of metal and half
Semiconductor wafer is disposed on the same plane.
The shell is made of colloidal materials.
Described main outer framework a part of metal extends the shell.
The main outer framework of metal is aluminum outer framework.
The inner frame is 2 or 3 or 5.
There is electrical connection between element and semiconductor crystal wafer on the inner frame.
The beneficial effects of the utility model are: 1) multiple inner frames are arranged in the utility model, semiconductor package body is increased
Inner space area can place more semiconductor crystal wafers or electronic component, meet market development demand；2) this is practical new
Type inner frame can provide electrical connection, reduces wire routing amount, reduces technology difficulty and complexity；3) the utility model
Space utilization rate is improved, the placement quantity of electronic component is increased, meets the needs of semiconductor packages future development, is suitable for wide
General popularization.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the novel more frame composite semiconductor encapsulating structures of the utility model embodiment；
Fig. 2 is the side sectional view of the novel more frame composite semiconductor encapsulating structures of the utility model embodiment；
Fig. 3 is the positive internal perspective view of the novel more frame composite semiconductor encapsulating structures of the utility model embodiment.
Specific embodiment
With reference to the accompanying drawing and the embodiments of the present invention are described in further detail utility model.
Embodiment 1
Referring to Fig. 1, Fig. 2, Fig. 3, novel more frame composite semiconductor encapsulating structures, including the main outer framework of shell 1, metal
2, pin 3, the main outer framework 2 of metal are arranged in shell 1, are provided at least one inside casing on the main outer framework 2 of metal
Frame 3 is provided with electronic component 4 on the inner frame 3, is additionally provided with semiconductor crystal wafer 5, the gold on the main outer framework 2 of the metal
Inner frame 3 and semiconductor crystal wafer 5 on owner's outer framework 2 are disposed on the same plane, no superposition.
The selection of 3 material of inner frame can allow electrical isolation between partial circuit and the semiconductor crystal wafer 5 of outer framework 2.
Preferably, through-hole 11 is equipped on the top of the shell 1.
Preferably, the shell 1 is made of colloidal materials.Due to being that colloid not only guarantees outside the utility model shell 1
The hardness of the utility model and protective effect is played to all parts inside shell 1.
Preferably, the main outer framework 2 of the metal is copper outer framework, and the main outer framework 2 of the metal is that copper frame is not only light
Just, and it is low in cost, meet the demand of semiconductor packages material.
Described main 2 a part of outer framework of metal extends the shell 1.The main outer framework 2 of the metal extends shell 1
Point, so that the utility model is improved heat dissipation performance, semiconductor package body is allow preferably to radiate.Gold described in the utility model
Owner's outer framework 2 not only can be with device semiconductor crystal wafer, while also playing the effect of heat dissipation, certain occasions can also play and
External electric appliance connection function.
In the present embodiment, the inner frame 3 can be set to 2 or 3 or 5, even more.Due to increasing
The quantity of inner frame 3, meanwhile, the electronic component or wafer being placed on inner frame 3 can also increase, in this way, being exactly partly to lead
More electronic components or wafer are increased in body encapsulating structure in limited space, semiconductor function or effect can be made significantly
It improves.
In the present embodiment, control circuit can be loaded in the upper surface of the inner frame 3, can also loading member or wafer,
And provide the electrical connection effect of subelement on the inner frame 3.According to actual needs, it is also used as providing inner frame 3 electricity
Electrical connection effect between road and the main outer framework 2 of metal, reduces wire routing amount, reduces technology difficulty and complexity.
The material of the inner frame 3 is printed circuit board.
Embodiment 2
Referring to Fig. 1, Fig. 2, Fig. 3, with above-described embodiment the difference is that, element and semiconductor on the inner frame 3
There is electrical connection between wafer 5.There is connecting line 6 between the inner frame 3 and semiconductor crystal wafer 5.Make inside casing by the connecting line 6
It is electrical connection between frame 3 and semiconductor crystal wafer 5.
The utility model encapsulating structure can be with device multicomponent, polycrystalline circle, and needs to design using the main outer framework 2 of metal
Hybrid power semiconductor variable obtain simple possible, while reducing packaging and routing, insulation among elements processing also reduces multicomponent
The technology difficulty of dense pack.
The above, the only preferred embodiment of the utility model, are not intended to limit the protection of the utility model
Range.
Claims (6)
1. a kind of novel more frame composite semiconductor encapsulating structures, including the main outer framework of shell, metal, pin, the metal master
Outer framework is arranged in shell, it is characterised in that: at least one inner frame is provided on the main outer framework of metal, in the inside casing
It is provided with electronic component on frame, semiconductor crystal wafer is additionally provided on the main outer framework of the metal, it is interior on the main outer framework of metal
Frame and semiconductor crystal wafer are disposed on the same plane.
2. novel more frame composite semiconductor encapsulating structures according to claim 1, it is characterised in that: the shell is glue
Body material is made.
3. novel more frame composite semiconductor encapsulating structures according to claim 1, it is characterised in that: outside the metal master
Frame a part extends the shell.
4. novel more frame composite semiconductor encapsulating structures according to claim 1, it is characterised in that: outside the metal master
Frame is aluminum outer framework.
5. novel more frame composite semiconductor encapsulating structures according to claim 1, it is characterised in that: the inner frame is
2 or 3 or 5.
6. -5 any novel more frame composite semiconductor encapsulating structures according to claim 1, it is characterised in that: in described
There is electrical connection on frame between element and semiconductor crystal wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821856884.0U CN208970500U (en) | 2018-11-12 | 2018-11-12 | Novel more frame composite semiconductor encapsulating structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821856884.0U CN208970500U (en) | 2018-11-12 | 2018-11-12 | Novel more frame composite semiconductor encapsulating structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208970500U true CN208970500U (en) | 2019-06-11 |
Family
ID=66765216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821856884.0U Active CN208970500U (en) | 2018-11-12 | 2018-11-12 | Novel more frame composite semiconductor encapsulating structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208970500U (en) |
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2018
- 2018-11-12 CN CN201821856884.0U patent/CN208970500U/en active Active
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