CN210535661U

CN210535661U - Independent base island packaging structure

Info

Publication number: CN210535661U
Application number: CN201921845045.3U
Authority: CN
Inventors: 李国琪
Original assignee: Hubei Fangjing Electronic Technology Co ltd
Current assignee: Hubei Fangjing Electronic Technology Co ltd
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-05-15
Anticipated expiration: 2029-10-30

Abstract

The utility model relates to an independent foundation island packaging structure, including insulating medium base, solid brilliant foundation island, chip and a plurality of pin, solid brilliant foundation island and pin bonding are fixed on insulating medium base, and the pin is located the solid brilliant foundation island outside, and on the solid brilliant foundation island was arranged in to the chip, chip and pin passed through the lead wire intercommunication, and insulating medium base, solid brilliant foundation island, pin and lead wire encapsulation are inside epoxy plastic envelope material piece, and insulating medium base one end is kept away from to the pin is located epoxy plastic envelope material piece outside. The utility model discloses an insulating medium base will be independent solid brilliant base island and pin bond together, form the independent base island of electrical insulation, adopt this kind of independent base island, and solid brilliant base island need not realize absolute electrical insulation with the direct two poles of the earth of pin, has also increased the figure of independent pin.

Description

Independent base island packaging structure

Technical Field

The utility model relates to a semiconductor power device technical field, in particular to independent base island packaging structure.

Background

The existing semiconductor power device packaging mechanism comprises a metal lead frame, a chip, a conductive metal wire and an epoxy plastic packaging material block, wherein the metal lead frame is provided with a part with a larger area as a die bonding pad as a die bonding area of the semiconductor chip. The structure that the die bonding area part is connected with the pins ensures that the pins cannot be completely and electrically isolated from the die bonding area, and the number of independent pins is reduced.

Disclosure of Invention

In order to solve the technical problem, the utility model provides an independent base island packaging structure has reduced the use of metal lead, and the manufacturing process need not expensive bonding wire equipment.

The utility model discloses a scheme:

an independent substrate packaging structure comprises an insulating medium base, a die bond substrate, a chip and a plurality of pins, wherein the die bond substrate and the pins are fixedly bonded on the insulating medium base, the pins are positioned on the outer side of the die bond substrate, the chip is arranged on the die bond substrate, the chip is communicated with the pins through leads, the insulating medium base, the die bond substrate, the chip and the leads are packaged in an epoxy plastic package material block, and one end, far away from the insulating medium base, of the pins is positioned on the outer side of the epoxy plastic package material block.

Preferably, the bottom of the insulating medium base is provided with a plurality of first grooves, and the first grooves are in strip shapes and are distributed at the bottom of the insulating medium base in parallel.

Further preferably, a heat dissipation mechanism is arranged below the first groove, the heat dissipation mechanism comprises a boss matched with the first groove, and the bottom of the boss is located on the heat dissipation plate.

Still further preferably, the bottom of the heat dissipation plate is provided with a plurality of second grooves.

Still further preferably, the heat dissipation plate is disposed on the base.

Further preferably, the heat dissipation mechanism is made of diamond or aluminum.

Preferably, the insulating medium base is made of epoxy resin molding compound or ceramic.

The utility model discloses beneficial effect:

1. the independent die bonding base island and the pins are bonded together through the insulating medium base to form the electrically insulated independent base island.

2. The bottom of the insulating medium base is provided with a plurality of first grooves which can be used for heat dissipation of chips, so that heat can be rapidly discharged from the first grooves, and the heat exchange efficiency is improved.

3. The heat dissipation mechanism comprises a boss matched with the first groove, the bottom of the boss is located on the heat dissipation plate, and the bottom of the heat dissipation plate is provided with a plurality of second grooves, so that heat exchange can be carried out with the outside in time, and the heat dissipation performance of the device is improved.

4. The heat dissipation plate is arranged on the base, so that the stability of the packaging structure is improved.

The heat dissipation mechanism is made of diamond or aluminum, heat generated by the chip is transferred to the insulating medium base through a good heat conduction effect of the diamond or the aluminum, and then the heat transferred is dissipated through the heat dissipation mechanism.

Drawings

FIG. 1 illustrates a prior art package structure;

fig. 2 is a schematic view of a package structure according to embodiment 1 of the present invention;

fig. 3 is a schematic front view of a package structure according to embodiment 1 of the present invention;

fig. 4 is a schematic view of a package structure in embodiment 2 of the present invention;

fig. 5 is a schematic view of a first groove of a package structure according to embodiment 2 of the present invention;

fig. 6 is a schematic view of a package structure according to embodiment 3 of the present invention;

fig. 7 is a side view of a package structure according to embodiment 3 of the present invention;

wherein: the chip packaging structure comprises an insulating medium base 1, a first groove 101, a die bonding pad 2, a chip 3, pins 4, leads 5, an epoxy plastic package material block 6, a heat dissipation mechanism 7, a boss 701, a heat dissipation plate 702, a second groove 703 and a base 8.

Detailed Description

The invention is further described with reference to the following examples, but the scope of the invention as claimed is not limited to the scope of the examples.

Example 1

Referring to fig. 2-3, an independent substrate packaging structure includes an insulating medium base 1, a die bond substrate 2, a chip 3 and a plurality of pins 4, the die bond substrate 2 and the pins 4 are fixed on the insulating medium base 1 in a bonding manner, the pins 4 are located outside the die bond substrate 2, the chip 3 is placed on the die bond substrate 2, the chip 3 and the pins 4 are communicated through leads 5, the insulating medium base 1, the die bond substrate 2, the chip 3 and the leads 5 are packaged inside an epoxy plastic package block 6, and one end of the pins 4, which is far away from the insulating medium base 1, is located outside the epoxy plastic package block 6.

Example 2

Referring to fig. 4-5, an independent substrate packaging structure includes an insulating medium base 1, a die bond substrate 2, a chip 3 and a plurality of pins 4, the die bond substrate 2 and the pins 4 are fixed on the insulating medium base 1 in an adhering manner, the pins 4 are located outside the die bond substrate 2, the chip 3 is placed on the die bond substrate 2, the chip 3 and the pins 4 are communicated with each other through leads 5, the insulating medium base 1, the die bond substrate 2, the chip 3 and the leads 5 are packaged in an epoxy plastic package block 6, and the pins 4 are far away from one end of the insulating medium base 1

Is positioned outside the epoxy plastic sealing material block 6. Preferably, the bottom of the insulating medium base 1 is provided with a plurality of first grooves 101, and the first grooves 101 are in a strip shape and are distributed at the bottom of the insulating medium base 1 in parallel. The heat can be rapidly discharged from the first groove, and the heat exchange efficiency is increased.

Further preferably, a heat dissipation mechanism 7 is arranged below the first groove 101, the heat dissipation mechanism 7 includes a boss 701 matched with the first groove 101, and the bottom of the boss 701 is located on the heat dissipation plate 702. The heat exchange can be carried out with the outside in time, and the heat dispersion performance of the device is improved.

Still more preferably, the bottom of the heat dissipation plate 702 is provided with a plurality of second grooves 703.

Further preferably, the heat dissipation mechanism 7 is made of diamond or aluminum.

Preferably, the material of the insulating medium base 1 is epoxy resin molding compound or ceramic.

Example 3

Referring to fig. 6-7, an independent substrate packaging structure includes an insulating medium base 1, a die bond substrate 2, a chip 3 and a plurality of pins 4, the die bond substrate 2 and the pins 4 are fixed on the insulating medium base 1 in an adhering manner, the pins 4 are located outside the die bond substrate 2, the chip 3 is placed on the die bond substrate 2, the chip 3 and the pins 4 are communicated with each other through leads 5, the insulating medium base 1, the die bond substrate 2, the chip 3 and the leads 5 are packaged in an epoxy plastic package block 6, and the pins 4 are far away from one end of the insulating medium base 1

Is positioned outside the epoxy plastic sealing material block 6. Preferably, the bottom of the insulating medium base 1 is provided with a plurality of first grooves 101, and the first grooves 101 are in a strip shape and are distributed at the bottom of the insulating medium base 1 in parallel.

Further preferably, a heat dissipation mechanism 7 is arranged below the first groove 101, the heat dissipation mechanism 7 includes a boss 701 matched with the first groove 101, and the bottom of the boss 701 is located on the heat dissipation plate 702.

Still further preferably, the heat dissipation plate 702 is disposed on the base 8. The stability of the packaging structure is increased.

The preparation process of the packaging structure comprises the following steps:

1. preparing a base 8;

2. the base 8 is sequentially connected with the heat dissipation mechanism 7, the die bond pad 2, the chip 3 and the pins 4 through connecting solders;

3. the lead 5 is used for communicating the chip 3 and the pin 4;

4. and (5) performing rib cutting and molding after epoxy plastic packaging.

The utility model discloses the theory of operation: the independent die bond pad 2 and the pin 4 are bonded together through the insulating medium base 1 (epoxy plastic package material, ceramic, other insulating materials which can be bonded with plasticity conveniently) to form an electrically insulated independent pad, and by adopting the independent pad, the die bond pad 2 does not need to be directly polarized with the pin 4, so that absolute electrical insulation can be realized, and the number of the independent pins is increased.

Claims

1. An independent base island packaging structure is characterized in that: the die bonding structure comprises an insulating medium base (1), a die bonding base island (2), a chip (3) and a plurality of pins (4), wherein the die bonding base island (2) and the pins (4) are fixedly bonded on the insulating medium base (1), the pins (4) are positioned on the outer side of the die bonding base island (2), the chip (3) is arranged on the die bonding base island (2), the chip (3) and the pins (4) are communicated through leads (5), the insulating medium base (1), the die bonding base island (2), the chip (3) and the leads (5) are packaged in an epoxy plastic packaging material block (6), and one end, far away from the insulating medium base (1), of the pins (4) is positioned outside the epoxy plastic packaging material block (6).

2. The isolated island packaging structure of claim 1, wherein: the bottom of the insulating medium base (1) is provided with a plurality of first grooves (101), and the first grooves (101) are in strip shapes and are distributed at the bottom of the insulating medium base (1) in parallel.

3. The isolated island packaging structure of claim 2, wherein: a heat dissipation mechanism (7) is arranged below the first groove (101), the heat dissipation mechanism (7) comprises a boss (701) matched with the first groove (101), and the bottom of the boss (701) is located on the heat dissipation plate (702).

4. The isolated island packaging structure of claim 3, wherein: the bottom of the heat dissipation plate (702) is provided with a plurality of second grooves (703).

5. The isolated island packaging structure of claim 3, wherein: the heat dissipation plate (702) is arranged on the base (8).

6. The isolated island packaging structure of claim 3, wherein: the heat dissipation mechanism (7) is made of diamond or aluminum.

7. The isolated island packaging structure of claim 1, wherein: the insulating medium base (1) is made of epoxy resin molding compound or ceramic.