KR20050035638A - Manufacturing method and product of high power type led - Google Patents

Abstract

The present invention relates to a method for manufacturing a high output LED package and a high output LED package using the same, and more specifically, to shorten the production process by using a multi-layer substrate including a thermal conductive layer and an electrically conductive layer without using a conventional lead frame and conductive wire. The present invention relates to a high output LED package manufacturing method and a high output LED package using the same, which can improve product reliability and productivity by improving heat dissipation and electrical characteristics.

In the method of manufacturing a high output LED package according to the present invention, the conductive layer is patterned so as to be spaced apart at regular intervals from a center on a multi-layer substrate including a heat conductive layer, a first insulating layer, an electrically conductive layer, and a second insulating layer. A multi-layer substrate forming process, a thermally conductive silicone adhesive between the formed electrically conductive layers, a coating process of applying solder paste to the electrically conductive layer at the center portion, and bonding a submount with the applied thermally conductive silicone adhesive and solder paste A submount bonding step, a solder bumping step of bonding an LED chip on the bonded submount, and a reflective cup having a predetermined inclination on an inner side in a cylindrical shape, and being adhered to the multilayer substrate to form the submount. A main body mounting step of mounting a main body to be protected, and a fluorescent substance applied to the LED chip, and a transparent chamber inside the main body. Transparent silicon filling process to fill the cone, characterized in that it comprises a lens bonding process of bonding the lens material is a synthetic resin on the upper surface of the transparent silkon.

Description

MANUFACTURING METHOD AND PRODUCT OF HIGH POWER TYPE LED}

The present invention relates to a method for manufacturing a high output LED package and a high output LED package using the same, and more specifically, to shorten the production process by using a multi-layer substrate including a thermal conductive layer and an electrically conductive layer without using a conventional lead frame and conductive wire. The present invention relates to a high output LED package manufacturing method and a high output LED package using the same, which can improve product reliability and productivity by improving heat dissipation and electrical characteristics.

An LED chip is a photoelectric conversion semiconductor device having a structure in which an N-type and a P-type semiconductor are joined.

The LED chip emits red, green, blue, and white light, and is packaged and used as a high output light emitting device having a front emission or side emission in the wavelength range of 250 nm to 700 nm.

8A and 8B are cross-sectional views of a conventional general high power LED package, and FIG. 9 is a flowchart of a conventional general high power LED package manufacturing method.

As shown in FIG. 8A, the conventional LED package forms an anode lead and a cathode lead on an upper surface of a main body 81 of a predetermined shape, and then on the lead frame 82. The LED chip 50 is seated on the wire, and is connected to the lead frame 80 through a ball bonding or wire bonding process using a conductive wire 80 such as copper, gold, and aluminum. It is produced by solidifying the upper surface with a transparent silicone molding (11). In addition, as shown in FIG. 8B, the main body may be manufactured by integrating the transparent silicon molding 11.

Figure 9 is a flow chart of a conventional high output LED package manufacturing method of the prior art, sawing to a certain size to form the LED chip (sawing). Thereafter, an adhesive is applied to a lead frame of a metal material made of an alloy material such as nickel (Ni), iron (Fe), and cobalt (Co), and the bonded LED chip is seated and bonded (T10). At this time, the lead frame is formed of a synthetic resin material is used in advance bonded to the package forming the main body. Thereafter, the lead wires and the lead wires formed on the upper surface of the LED chip are electrically connected using conductive wires (T20). This is commonly referred to as wire bonding or ball bonding, and the wire may be copper, lead, gold, or the like, depending on the characteristics of the product. As the wire bonding and ball bonding are well known, the wire crimp forms a ball at the end of the wire and presses the ball to the electric lead terminal of the LED chip, and the other end of the wire is led by lifting and moving the crimp. It is the most commonly used method by adhesive bonding to the pad portion of the frame.

Thereafter, a predetermined phosphor is coated on the upper surface of the LED chip (T30), and transparent silicon is molded. The molding is to insert a main body equipped with an LED chip in a predetermined mold, and a synthetic resin molding solution such as epoxy molding compound (EMC) or engineering plastic (PA: Polyamide) gelled (Gel: semi-solid) Inject into the mold and seal. In addition, by mounting a lens formed of a synthetic resin material on the upper surface of the transparent silicon to make a main body of the appearance to protect from corrosion and external impact of the internal material (T40).

The mold has a transfer mold and a casting mold method. In the manufacture of an LED package, a casting mold (usually called a malt cup) is mainly used.

Thereafter, a trimming process (T50) for separating the lead frame and the package element is performed, and a forming process for bending the lead frame of the separated LED package to have a predetermined shape is performed (T60). The forming is usually made in a Gull form or J-form shape.

On the other hand, the step (T10) of mounting the LED chip on the lead frame is also referred to as die bonding (Die attach), the position, angle, parallelism, impact, etc. to seat the LED chip affects the reliability of the product, and also Precision of equipment and molds is required according to leadframe manufacturing, and there is a problem in that cost and time are required for regular replacement work for wear due to continuous use of molds.

In addition, during the wire bonding (T20) process, instantaneous ultrasonic waves (3000 to 5000V) are generated to melt and bond the ends of the conductive wires. At this time, heat of about 240 ° C. is instantaneously generated, and the high temperature is scratched on the LED chip. (scratch) and cracks (crack) can be generated, and the plastic deformation, such as the main body of the surrounding body may cause a phenomenon such as thermal deformation, wire tension reduction and wire breakage. This phenomenon reduces the reliability and productivity of the product has a problem that affects the quality and price of the product.

In addition, in the molding process (T40), the mold liquid is forcibly injected into the mold by a predetermined pressure. At this time, the shape of the conductive wire is oriented in one direction, the unfilled phenomenon of the mold liquid, and the separation of the product in the mold mold after filling. Since it does not become a physical force to the product causes problems such as deformation of the product. In the trimming process and the forming process, when the work of the product injected once in each process is performed in an unstable state, defective products are produced as much as the input quantity, and different equipment and molds are required for each process, and the mold is continuously There is a problem in that it takes a lot of cost and time by regular replacement work by wear due to use.

The present invention is to solve the above problems, an object of the present invention is to perform the wire bonding process and the forming process using a multi-layer substrate consisting of a heat conductive layer, a first insulating layer, an electrically conductive layer, a second insulating layer. Without improving the thermal and electrical properties, to minimize the failure rate according to the process and to provide a high output LED package manufacturing method and a high output LED package using the same that can improve the product reliability and productivity.

In the method of manufacturing a high output LED package according to the present invention, the conductive layer is patterned so as to be spaced apart at regular intervals from a center on a multi-layer substrate including a heat conductive layer, a first insulating layer, an electrically conductive layer, and a second insulating layer. A multi-layer substrate forming process, a thermally conductive silicone adhesive between the formed electrically conductive layers, a coating process of applying solder paste to the electrically conductive layer at the center portion, and bonding a submount with the applied thermally conductive silicone adhesive and solder paste A submount bonding step, a solder bumping step of bonding an LED chip on the bonded submount, and a reflective cup having a predetermined inclination on an inner side in a cylindrical shape, and being adhered to the multilayer substrate to form the submount. A main body mounting step of mounting a main body to be protected, and a fluorescent substance applied to the LED chip, and a transparent chamber inside the main body. Transparent silicon filling process to fill the cone, characterized in that it comprises a lens bonding process of bonding the lens material is a synthetic resin on the upper surface of the transparent silkon.

In addition, the high output LED package manufacturing method according to the present invention is characterized in that the multilayer substrate forming process forms a plurality of the patterns.

In addition, the method of manufacturing a high output LED package according to the present invention is characterized in that the submount bonding step bonds the via mount by forming a via hole.

In addition, the high output LED package manufacturing method according to the present invention is characterized in that it further comprises a heat sink attaching step of attaching a heat sink to the bottom surface of the multilayer substrate after the lens bonding step.

On the other hand, the high-power LED package according to the present invention is composed of a heat conductive layer, a first insulating layer, an electrically conductive layer, a second insulating layer and the conductive layer is patterned so as to be spaced at regular intervals based on an arbitrary center point of the upper surface. The formed multi-layer substrate, a sub-mount incorporating an electrostatic discharge circuit bonded to the conductive layer, an LED chip bonded with the sub-mount, and a reflective cup is formed on the inner side in a cylindrical shape with a predetermined inclination. And a body of a protective resin bonded to the multilayer substrate, a phosphor coated on the LED chip, transparent silicon filled inside the main body, and a lens of a synthetic resin material adhered to the upper surface of the transparent silicon. It is characterized by.

In addition, the high output LED package according to the present invention is characterized in that the multilayer substrate is provided with a plurality of patterns.

In addition, the high-output LED package according to the present invention is characterized in that it further comprises a heat sink adhered in close contact with the bottom of the multilayer substrate.

In addition, the high output LED package according to the present invention, the electrically conductive layer and the submount is bonded with solder paste, the multi-layer substrate and the submount is bonded with a thermally conductive adhesive silicon, the submount and the LED chip is solder bumped It is characterized by.

Hereinafter, a high output LED package manufacturing method and a high output LED package using the same will be described in detail with reference to the accompanying drawings.

Figure 1 is a perspective view of a high power LED package according to an embodiment of the present invention, Figure 2 is a schematic diagram of the configuration of the LED chip portion of the high power LED package according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention 4 is a plan view of a multi-layer substrate on which a pattern is formed according to an example, FIG. 4 is a plan view and a partial cross-sectional view of a multilayer board on which an LED chip is mounted according to an embodiment of the present invention, and FIG. 5 is a high output LED according to an embodiment of the present invention. 6A is a side view of a high power LED package mounted with a heat sink according to an embodiment of the present invention, and FIG. 6B is a cross-sectional view of the AA line of FIG. 6A.

The high output LED package of the preferred embodiment of the present invention, as shown in Figures 1 to 6B, the multi-layer substrate 30, the LED chip 50 and the submount 40 is mounted, and the multi-layer substrate 30 It includes a main body 20 to be mounted, the transparent silicon 11 and the lens 10 for protecting and fixing the LED chip 50 and the submount 40 mounted inside the main body 20.

As shown in FIG. 2, the multilayer substrate 30 is formed of a thermal conductive layer 32, a first insulating layer 33, an electrically conductive layer 34, and a second insulating layer 35. In this case, it is preferable that the thermal conductive layer 32 is formed of aluminum having good thermal conductivity, the first insulating layer 33 is formed of glass-epoxy, and the electrical conductive layer 34 is formed of copper. The second insulating layer 35 is preferably formed of a general insulating coating.

The multi-layer substrate 30 is preferably produced by forming a pattern on the multi-layer substrate in 1 column 5 to 5 column 10 columns of LED package. In other words, the thermal conductive layer 32 and the first insulating layer 33 are formed in a circle so as to be connected to the multilayer board 30 and the plurality of fixing pieces 61, and the conductive layer 34 thereon is formed in the circular shape. Submount connection pads 64 are formed at both sides with respect to the center point, and a power line connection pad 66 is formed to be connected to a power source to the outside with the second insulating layer 35 interposed therebetween, and the second insulating layer ( 35 is formed so that the submount seating portion 65, which is a circular center portion, and the power line connecting pad 66 are insulated from each other, and the wires can be easily fixed to the power line connecting pad 66 and an external power line. The fixing part 31 is formed through. In addition, through-holes are formed in the edge portion of the multilayer substrate 30 at a predetermined distance so as to facilitate feeding and clamping of the substrate during the manufacturing process. At this time, the submount connection pad 64 forms an anode pad on one side of the submount seating portion 65 and a cathode pad on the other side thereof.

The submount 40 may have a rectangular or polygonal shape using silicon (Si) or a ceramic-based material. The submount 40 may include the submount connection pad 64 and the LED chip. It is preferable that a circuit pattern, a circuit of an electrostatic discharge (ESD) diode, and a varistor are formed to be electrically connected to 50. Meanwhile, a plurality of LED chips 50 may be mounted on the submount 40, and the submount seating portions 65 of the multilayer board 30 may be bonded to each other by the thermally conductive adhesive silicon 46. The submount connection pad 64 is adhered by solder paste 45.

The LED chip 50 is solder pumped by the upper surface of the submount 40 and the solder bumper 55, and the LED chip 50 uses one or more known chips.

The main body 20 is seated on the main body fixture 63 formed on the multi-layer substrate 30, and is fixed to the multi-layer substrate 30 by an adhesive such as silicone 21 to improve sealing force and adhesion. The reflective cup 12 is inclined at a predetermined angle in the same way as the conventional LED package.

In addition, the transparent silicon 11 is molded inside the main body 20 as in the related art, and the lens 10 of the synthetic resin material is adhered to the upper portion of the transparent silicon 11 in close contact.

6A and 6B, the heat sink 70 may be mounted on the bottom of the multilayer board 30. In order to maximize the surface area of the heat sink 70, a plurality of heat sinks may be formed radially with respect to a central axis. The heat sink 70 may be a heat sink fixture 62 with the multilayer substrate 30. It is preferable to fasten through the screw coupling method.

Figure 7 is a flow chart of a high power LED package manufacturing method according to the present invention.

1 to 7, the manufacturing method and effect of the present invention will be described. First, a pattern as shown in FIG. 3 is formed on the multilayer board 30 having an appropriate size. It is preferable that the pattern uses a known etching and printing technique.

Subsequently, a solder paste is applied to bond the submount 40 to the anode pad and the cathode pad, which are the submount connection pads 64 formed on the submount seating portion 65 of the formed pattern, and the submount 40 at the center thereof. In order to bond the multi-layer substrate 30 and the thermal conductive adhesive silicone 46 is applied (S10). In addition, bonding with the submount connection pad 64 may be bonded by forming a via hole in the submount 40 (S20).

The bonded submount 40 has the cathode and the anode electrode on the same plane, so the LED chip 50 is reversed and the electrode surface of the LED chip 50 is mounted downward as opposed to the conventional manufacturing method. do. This method is generally referred to as flip chip bonding. In order to bond the LED chip to the upper surface of the submount 40, the power supply of the submount 40 is connected to the LED chip 50 using gold solder or other conductive adhesive material. Dotting or solder bumper (Solder Bump) to be applied to (S30).

As shown in FIG. 5, the thermal conductive adhesive silicone 21 is coated on the upper surface of the multilayer board 30 on which the main body 20 is mounted, and the main body fixture 20 of the multilayer board 30 is applied to the main body 20. 63 to be mounted on the main body 20 to be sealed to the outside to prevent oxidation and discoloration of each part (S40). At this time, the reflection cup 12 formed on the inner surface of the main body 20 is coated with silver (Ag) to control the angle of the emitted light emitted from the LED chip 50 and to minimize the amount of loss due to light scattering It is preferable to

Thereafter, the phosphors expressing various colors are applied to the upper surface of the LED chip 50 in the same manner as in the conventional process, and the transparent silicon 11 is injected into the upper body of the upper portion 20 to mold them (S50). The upper surface of the molded transparent silicon 11 is adhered in close contact with the lens 10 of the synthetic resin material (S60), trimming the fixing piece 61 formed on the multilayer board 30 is completed by separating the high power LED package ( S70).

In addition, the trimming fixes the multilayer board 30 on the basis of the through-holes formed at the edges of the multilayer board 30, and minimizes defects of the product by trimming by vertical movement of the mold.

In addition, in order to maximize the heat dissipation effect, the radial heat sink (heat sink) 70 is assembled on the bottom of the multilayer board 30 to minimize thermal stress generated during operation.

An embodiment of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

As described above, according to the present invention, since it is manufactured using a multi-layer substrate composed of a thermal conductive layer, a first insulating layer, an electrical conductive layer, and a second insulating layer, defects and wire bondings according to the conventional lead frame production process and wire bonding process are performed. It is effective in improving productivity by eliminating waste of material and time required for the process.

In addition, since the wire bonding process and the forming process of bending the lead frame are not performed, not only the execution time and cost of the process may be reduced, but also the structural and thermal and electrical characteristics may be improved to improve product reliability and productivity.

1 is a perspective view of a high power LED package according to an embodiment of the present invention,

2 is a diagram illustrating the configuration of an LED chip of a high power LED package according to an embodiment of the present invention;

3 is a plan view of a multi-layer substrate having a pattern according to an embodiment of the present invention;

4 is a plan view and a partial cross-sectional view of a multilayer board equipped with an LED chip according to an embodiment of the present invention;

5 is a plan view and a partial cross-sectional view of a high power LED package according to an embodiment of the present invention;

Figure 6a is a side view of a high power LED package equipped with a heat sink according to an embodiment of the present invention,

6B is a cross-sectional view taken along the line A-A of FIG. 6A;

7 is a flow chart of a high output LED package manufacturing method according to the present invention,

8A and 8B are cross-sectional views of a conventional general high power LED package,

9 is a flow chart of a conventional general high output LED package manufacturing method.

<Description of Symbols for Main Parts of Drawings>

10: lens 11: transparent silicone

12: reflection cup 20: main body

30: multilayer board 31: wiring fixing

32: heat conductive layer 33: first insulating layer

34: conductive layer 35: second insulating layer

40: submount 45: solder paste

46: silicon for thermal conductive bonding 50: LED chip

55: solder bump 61: fixing piece

62: heat sink fixture 63: body fixture

64: submount connection pad 65: submount seat

66: power line connection pad 70: heat sink

Claims (8)

Forming a multi-layer substrate on the multi-layer substrate including a heat conductive layer, a first insulating layer, an electrically conductive layer, and a second insulating layer so as to be spaced at regular intervals from the center thereof; An application process for applying a solder paste to the electrically conductive layer at the center and a thermally conductive silicone adhesive between the formed electrically conductive layers; A submount bonding process of bonding the submount with the applied thermally conductive silicone adhesive and solder paste; A solder bumping process of bonding an LED chip on the bonded submount; A main body mounting process in which a reflective cup is formed in a cylindrical shape with a predetermined inclination on the inner side, and the main body is attached to the multilayer board to protect the submount; A transparent silicon filling process of coating a phosphor on the LED chip and filling transparent silicon inside the main body; And a lens bonding process for adhering the lens of the synthetic resin material to the upper surface of the transparent silicon cone. The method of claim 1, The multi-layer substrate forming process, a plurality of the output pattern LED package manufacturing method characterized in that to form a plurality. The method of claim 1, The submount bonding process is a high output LED package manufacturing method, characterized in that by forming a via hole in the submount bonding. The method according to any one of claims 1 to 3, And a heat sink attaching step of attaching a heat sink to the bottom surface of the multilayer board after the lens bonding step. A multi-layer substrate composed of a thermally conductive layer, a first insulating layer, an electrically conductive layer, and a second insulating layer, wherein the electrically conductive layer is patterned so as to be spaced at regular intervals based on an arbitrary center point of the upper surface; A sub-mount having a built-in electrostatic discharge circuit, an LED chip bonded with the sub-mount, a reflection cup formed at a predetermined slope on an inner side in a cylindrical shape, protecting the sub-mount, and being bonded to the multilayer board; A high power LED package, characterized in that it comprises a phosphor coated on the LED chip, a transparent silicon filled in the inside of the main body, and a lens of a synthetic resin material in close contact with the upper surface of the transparent silicon. The method of claim 5, The multi-layer substrate, the high output LED package, characterized in that a plurality of patterns formed. The method of claim 5, The high power LED package further comprises a heat sink adhered in close contact with the bottom of the multi-layer substrate. The method according to any one of claims 5 to 7, The electrically conductive layer and the submount is bonded with solder paste, the multi-layer substrate and the submount is bonded with thermally conductive adhesive silicon, the submount and the LED chip is a high output LED package, characterized in that the solder bump.