CN104167483A - LED packaging structure and manufacturing method thereof - Google Patents
LED packaging structure and manufacturing method thereof Download PDFInfo
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- CN104167483A CN104167483A CN201410413483.8A CN201410413483A CN104167483A CN 104167483 A CN104167483 A CN 104167483A CN 201410413483 A CN201410413483 A CN 201410413483A CN 104167483 A CN104167483 A CN 104167483A
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- led
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- epoxy molding
- encapsulating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses an LED packaging structure and a manufacturing method thereof. The manufacturing method comprises the steps of (1) preparing an LED support which comprises a shell and metal pins connected to the shell, wherein a bowl-shaped inner cavity is formed in the shell; (2) fixing LED chips to the bottom of the bowl-shaped inner cavity; (3) binding the LED chips; (4) installing the LED support in an inner cavity of a heating and heat preserving die, and pressing the die to achieve sealing; (5) injecting epoxy molding compounds into the die through a glue injection hole of the die to enable the inside and outside of the bowl-shaped inner cavity of the shell to be filled with the epoxy molding compounds, and solidifying the epoxy molding compounds; (6) opening the die, taking out the LED support, processing the metal pins of the LED support to enable the metal pins to make contact with the epoxy molding compounds outside the shell, and obtaining the LED packaging structure. By the adoption of the LED packaging structure and the manufacturing method thereof, LED packaging structures with multiple shapes, structures and sizes can be produced conveniently and flexibly, electric leakage and lighting failures of the LED packaging structure obtained are avoided, and product consistency is high.
Description
[technical field]
The present invention relates to light-emitting diode, particularly relate to a kind of LED encapsulating structure and preparation method thereof.
[background technology]
Existing LED encapsulating structure is mainly adopting surface mounted LED (SMD-LED).The packaged type of adopting surface mounted LED has support embedding type.The LED encapsulating structure of support embedding type comprises support, as shown in Figure 1, is the structural representation of support, and support comprises shell 100 and copper sheet pin 200.Shell 100 materials are PPA plastic cement material, are provided with plastic bowl cup cavity, and in bowl cup cavity, die bond is installed LED chip, after some liquid-state epoxy resin curing molding, obtain LED encapsulating structure.This kind of LED encapsulating structure, easily produces the fatal hidden danger such as electric leakage, dead lamp.In addition, in bowl cup cavity point glue plane can because of glue amount number occur that " recessed cup " " protruding cup " is bad, product lighting angle, brightness are affected, and cannot accomplish consistent.And time prepared by this kind of LED encapsulating structure, by an adhesive curing moulding, make the construction profile of product compared with fixed single, cannot be applicable to flexibly multiple application scenarios.And when existing preparation LED encapsulating structure, as prepared the LED encapsulating structure of sizes, can only prepare the support of sizes size, and the development cost of support is large especially, while causing producing the LED encapsulating structure of sizes structure, production cost is very high.
[summary of the invention]
Technical problem to be solved by this invention is: make up above-mentioned the deficiencies in the prior art, a kind of LED encapsulating structure and preparation method thereof is proposed, be convenient to produce flexibly the LED encapsulating structure of various shapes structure and sizes, and the LED encapsulating structure making electric leakage, dead lamp condition improved, and homogeneity of product is better.
Technical problem of the present invention is solved by following technical scheme:
A preparation method for LED encapsulating structure, comprises the following steps: 1) prepare LED support, described LED support comprises shell and is connected to the metal pins on described shell, is provided with bowl-shape inner chamber on described shell; 2) LED chip is fixed on to described bowl-shape intracavity bottom; 3) the fixed described LED chip of nation, makes described LED chip be electrically connected with described metal pins; 4) described LED support is packed in the inner chamber of mould of heating and thermal insulation, compress described mould and realize sealing; 5) inject epoxy molding plastic by the hole for injecting glue of described mould, make the interior and peripheral all filling bags of bowl-shape inner chamber of described shell be wrapped with epoxy molding plastic, solidify described epoxy molding plastic; 6) open mould, take out described LED support, process the metal pins of described LED support, the epoxy molding plastic of described metal pins and described shell periphery is contacted, make LED encapsulating structure.
A kind of LED encapsulating structure, comprises LED support and LED chip, and described LED support comprises shell and is connected to the metal pins on described shell; Bowl-shape inner chamber is set on described shell, described LED chip is arranged on described bowl-shape intracavity bottom, described LED chip is electrically connected with described metal pins, in the bowl-shape inner chamber of described shell and periphery all filling bag is wrapped with epoxy molding plastic, and described metal pins bending contacts with the epoxy molding plastic of described shell periphery.
The beneficial effect that the present invention is compared with the prior art is:
LED encapsulating structure of the present invention and preparation method thereof, adopt mould injecting glue curing molding to obtain, control the packing space of injecting glue, make the interior and peripheral all filling bags of bowl-shape inner chamber of the housing parts of LED support be wrapped with epoxy molding plastic, the metal pins bending of LED support and the epoxy molding plastic of shell periphery contact.Like this, the humidity resistance that experimental verification obtains LED encapsulating structure of the present invention is better than existing LED encapsulating structure, can effectively stop moisture, moisture to infiltrate the work of the internal influence shell 100 interior LED chips of LED encapsulating structure by assembly junction, thereby effectively improve electric leakage, dead lamp situation.The LED encapsulating structure making by preparation method of the present invention, by mould injecting glue, product shape high conformity, thereby luminous consistency is better, and by adjusting mold cavity structure shape, can realize flexibly the production of the LED encapsulating structure of various shapes, and bed die can share, economical flexibly.And LED encapsulating structure of the present invention, share a kind of LED support, change the size of mould, can make the LED encapsulating structure of sizes structure, although need the development cost of mould, but mould development cost, well below LED support development cost, reduces the production cost of the LED encapsulating structure of preparing sizes greatly.
[brief description of the drawings]
Fig. 1 is the structural representation of the support in embedding type LED encapsulating structure in prior art;
Fig. 2 to Fig. 8 is preparation technology's flow chart of the LED encapsulating structure of the specific embodiment of the invention one;
Fig. 9 is a kind of structural representation improving after profile of the LED encapsulating structure of the specific embodiment of the invention one;
Figure 10 is that the another kind of the LED encapsulating structure of the specific embodiment of the invention one improves the structural representation after profile
Figure 11 is the view that while preparing LED encapsulating structure in the specific embodiment of the invention two, LED support is put into mould;
Figure 12 is the structural representation of the LED encapsulating structure that makes in the specific embodiment of the invention two.
[embodiment]
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further details.
As shown in Fig. 2～8, be preparation technology's flow chart of the LED encapsulating structure of this embodiment, comprise the following steps:
1) prepare LED support, described LED support comprises shell and is connected to the metal pins on described shell, is provided with bowl-shape inner chamber on described shell.
As shown in Figure 2, be the structural representation of LED support of preparing, top figure a is plan structure schematic diagram, below figure b is vertical direction cross-sectional schematic.LED support comprises shell 1 and is connected to the metal pins 2 on shell 1, is provided with bowl-shape inner chamber 10 on shell 1.The material of shell 1 can be PPA plastic cement material.The material of metal pins 2 can be copper product.
2) LED chip is fixed on to described bowl-shape intracavity bottom.As shown in Figure 3, top figure a is plan structure schematic diagram, and below figure b is vertical direction cross-sectional schematic.R, G, tri-kinds of LED chips 3 of B being fixed on to the bottom of the bowl-shape inner chamber 10 of LED support, thereby in 1 bowl of cup of LED support, completing the fixing of R, G, tri-kinds of LED chips of B, is also die bond.
3) nation fixed (bonding) LED chip, makes LED chip be electrically connected with metal pins.As shown in Figure 4, top figure a is plan structure schematic diagram, and below figure b is vertical direction cross-sectional schematic.For LED chip 3 welding leads 4, complete the nation fixed (bonding) of LED chip 3, realize being electrically connected between LED chip 3 electrodes and metal pins.
4) by step 3) LED support that obtains packs in the inner chamber of mould of heating and thermal insulation, compresses described mould and realize sealing.
5) inject epoxy molding plastic by the hole for injecting glue of described mould, make the interior and peripheral all filling bags of bowl-shape inner chamber of described shell be wrapped with epoxy molding plastic, solidify described epoxy molding plastic.
6) open mould, take out described LED support, process the metal pins of described LED support, the epoxy molding plastic of described metal pins and described shell periphery is contacted, make LED encapsulating structure
In this embodiment, step 1) in the metal pins of the LED support prepared be level, carry out step 4) to step 6) time, as shown in Fig. 5 to 8.LED support solid, that weld is packed in the molding dies cavity of insulation, while packing LED support into, keep metal pins 2 for level.Molding mould comprises mold 5 and bed die 6, and mold 5 and bed die 6 are clamped the end of the metal pins 2 in level, makes shell 1 unsettled in the inner chamber of mould, and the upper/lower die that closes compresses realizes sealing.On mould, offer respectively 2 hole for injecting glue k1, k2, inject epoxy molding plastic 7 by 2 hole for injecting glue, fill full dies cavity room, thereby in the bowl-shape inner chamber of shell 1 and periphery all filling bag is wrapped with epoxy molding plastic 7, be stressed that in the bowl cup inner chamber of shell 1 not only herein and be filled with epoxy molding plastic, and the periphery of shell 1 is also all enclosed with epoxy molding plastic.Epoxy molding plastic 7 (Epoxy Molding Compound, be called for short EMC) is to be matrix resin by epoxy resin, and taking High Performance Phenolic Resins as curing agent, adding silicon powder etc. is filler, and adds the powdery moulding compound that multiple additive mixture forms.Under epoxy molding plastic normal temperature, in solid-state, before injecting, at 130-160 DEG C, the pre-heat treatment is heated to form liquid state, then injects mould, after injection, through overcuring processing, after general 3-5min, gets final product curing molding.Open mould, take out semi-finished product support, complete external pin bending and threshing, metal pins 2 is contacted with the epoxy molding plastic of shell 1 bottom periphery parcel towards the direction bending at shell 1 place, make the surface welded LED encapsulating structure of single.If batch production plurality of LEDs encapsulating structure, connects together by connecting portion between multiple LED supports before injecting glue.When mould injecting glue, mould is clamped connecting portion.After injecting glue completes, cut off connecting portion, remove connecting portion, then bend metal pins, obtain the surface welded LED encapsulating structure of single.
Fig. 8 is the schematic diagram of the LED encapsulating structure making in the specific embodiment of the invention, comprises LED support and LED chip, and LED support comprises shell 1 and is connected to the metal pins 2 on shell 1.The material of shell 1 can be polyphthalamide resin PPA.Metal pins 2 can be silver-plated copper sheet.Bowl-shape inner chamber is set on shell 1, and LED chip is arranged on bowl-shape intracavity bottom, particularly, can be fixed on bowl-shape intracavity bottom by conductive silver glue.LED chip is electrically connected with metal pins 2, and in the bowl-shape inner chamber of shell 1 and periphery all filling bag is wrapped with epoxy molding plastic 7, and metal pins 2 bendings contact with the epoxy molding plastic 7 of shell 1 periphery.In this embodiment, metal pins 2 contacts with the epoxy molding plastic 7 of shell 1 bottom periphery parcel towards the direction bending of shell 1.
The cyclic test of " pressure cook red ink+thermal shock " is set, verifies the humidity resistance of the LED encapsulating structure of this embodiment.Experiment condition is: use high pressure accelerated testing cabinet, and red ink and water ratio 1:1, pressure is 1Kg/cm
2, time 60min; Cold shock testing condition: use low temperature impact test box,-40 DEG C ± 2 DEG C (30min) ← → 100 DEG C ± 2 DEG C (30min), the LED encapsulating structure that records this embodiment can tolerate the loop test of 35～40 bouts, and traditional LED encapsulating structure only can tolerate the loop test of 12～16 bouts left and right, show that the humidity resistance of LED encapsulating structure of this embodiment is more excellent.
LED encapsulating structure in this embodiment, for existing LED encapsulating structure, existing LED encapsulating structure, resin glue is only potted in bowl cup inner chamber by a glue mode, metal pins contacts combination with the PPA plastic cement of shell, and in this embodiment, the integrated epoxy molding plastic of the peripheral full parcel one deck of shell, metal pins contacts with peripheral epoxy molding plastic, may be because the combination stability of metal pins and plastic cement is poor, and the combination stability of metal pins and peripheral epoxy molding plastic is higher, so humidity resistance is better than the LED encapsulating structure of existing structure, thereby can effectively stop moisture, moisture infiltrates the inside of LED encapsulating structure by the junction of metal pins and shell, affect the work of LED chip in shell, thereby effectively improve electric leakage, dead lamp situation.The LED encapsulating structure making by preparation method of the present invention, by mould injecting glue, product shape high conformity, thereby luminous consistency is better, and by adjusting mold cavity structure shape, can realize flexibly the production of the LED encapsulating structure of various shapes, and bed die can share, economical flexibly.In addition,, when the preparation method of this embodiment prepares sizes structure, during such as 3.0 × 3.0,3.5 × 2.8,3.5 × 3.5 and 4.0 × 4.0 4 kinds of sizes of standard, only need the mould of a kind of LED support and four kinds of sizes to make.During with respect to four kinds of sizes of existing preparation, need to develop four kinds of corresponding LED supports of size, and the development cost of support is far away higher than the development cost of mould, therefore, the preparation method of this embodiment is being prepared aspect the LED encapsulating structure of sizes, cost effectively reduces, and is particularly suitable for actual applying.
Preferably, adjust after the shape of mold cavity structure, can make two kinds of improved LED encapsulating structures as shown in Figure 9 and Figure 10.These two kinds improved LED encapsulating structures, epoxy molding plastic top is protruding arc convex lens structures 9.Arc convex lens structures 9 shown in Fig. 9, can utilize optically focused principle, realizes optically focused, thereby promotes the luminosity of LED encapsulating structure.And the contour structures of Figure 10, except the arc convex lens structures 9 at top make luminosity better, whole contour structures is close to the profile of direct insertion LED encapsulating structure, be exactly straight cutting LED profile and LED outdoor display screen is the most widely used now, therefore the replaceable straight cutting LED of product outline packages structure, more easily promote the use of, be easier to be accepted by LED distributors.
Further preferably, as shown in Figure 2, the region of the corresponding bowl-shape inner chamber 10 in shell 1 bottom offers pod apertures 11, like this, step 5) after injecting glue, the epoxy molding plastic of bowl-shape inner chamber 10 interior fillings is communicated with by pod apertures 11 with the epoxy molding plastic of the periphery of shell 1 parcel, epoxy molding plastic is all connected inside and outside LED support like this, can more effectively protect the LED chip of LED encapsulating structure inside, and pod apertures 11 be arranged so that injecting glue time epoxy molding plastic packing space be communicated with, so also can effectively solve interior the lacking in injecting glue process, cavity, air bubble problem.
LED chip 3 comprises red LED chip, green light LED chip and blue-light LED chip, and preferably, red LED chip, green light LED chip and blue-light LED chip are arranged in a row at bowl cup intracavity bottom successively.Still more preferably, as shown in Figures 2 to 4, the metal pins 2 of LED support distributes and arranges by five pins, wherein, two pins are connected with positive pole, the negative electricity of red LED chip respectively, a pin is electrically connected with the positive pole of green light LED chip and blue-light LED chip simultaneously, and two other pin is connected with the negative pole of green light LED chip, the negative electricity of blue-light LED chip respectively.Also be, in Fig. 4, set gradually from top to bottom red, green, blue LED chip, upper left pin and upper right pin be the negative pole R-of corresponding red LED chip respectively, anodal R+, the anodal G+ of the corresponding green light LED chip of left pin, the B+ of blue-light LED chip, the negative pole B-of the corresponding blue-light LED chip of lower-left pin, the negative pole G-of the corresponding green light LED chip of bottom right pin.Like this, distribute and arrange with respect to existing positive three negative four pins, when power supply, positive pole all provides the voltage of 2.8～3.4V, and can a resistance step-down of series connection in circuit corresponding to red light negative pole, make red light cathode voltage at 1.9～2.3V, thereby red light is normally worked.But, although control conveniently, due to lossy on resistance, cause the energy consumption of LED encapsulating structure higher.And during this preferably arranges, R+ positive pole is made a distinction, G+ and B+ still supply the voltage of 2.8～3.4V simultaneously, and R+ controls separately, and 1.9～2.3V voltage is provided, and can directly meet application requirements without resistance step-down is set, and can reduce the overall power consumption of LED.
Distribute while arranging by five pins, the described metal pins being connected with the negative electricity of described green light LED chip, is also the area that the area of bottom right pin is greater than other metal pins.In the concrete application of LED encapsulating structure, the luminosity ratio of R, G, tri-LED chips of B is generally 3:6:1, i.e. the luminosity of green light LED chip requirement is the highest, electric current maximum, and heating is maximum.When five pin configuration arrange metal pins, the area of metal pins corresponding green light LED chip negative pole is arranged greatlyr, can increase thermolysis, thereby make power consumption lower.
Embodiment two
This embodiment is with the difference of execution mode one: the metal pins of the LED support of preparation is bending state, correspondingly, and mould holding state difference when preparation is processed.
In the preparation method of this embodiment LED encapsulating structure, preparation process is identical with embodiment one, just step 1) in the metal pins of the LED support prepared be bending state, correspondingly step 4) in the concrete state of LED support in mould cavity slightly different, step 6) in processing slightly different.Only be elaborated for this difference part as follows.
In this embodiment, carry out step 4) time, as shown in figure 11.LED support solid, that weld is packed in the molding dies cavity of insulation, and while packing LED support into, metal pins 21 is bending state, and metal pins 2, towards the direction bending away from shell 1 place, forms the relative L shaped structure in left and right.Molding mould comprises mold 51 and bed die 61, and mold 51 and bed die 61 are clamped the horizontal end that metal pins 21 bends, and makes shell 1 unsettled in the inner chamber of mould, and the upper/lower die that closes compresses realizes sealing.When injecting glue, similarly, on mould, offer respectively 2 hole for injecting glue, inject epoxy molding plastic by 2 hole for injecting glue, fill full dies cavity room, thereby be wrapped with epoxy molding plastic with peripheral all filling bags in the bowl-shape inner chamber of shell 1.Inject after epoxy molding plastic, solidify and process, make epoxy molding plastic curing molding.Open mould, take out semi-finished product support, remove in metal pins 21 part not contacting with epoxy molding plastic, threshing, make the SMD-LED encapsulating structure of single, as shown in figure 12, in LED encapsulating structure, metal pins 21 is to contact towards the direction bending away from shell 1 and the epoxy molding plastic 7 of the peripheral parcel in shell 1 top.
The LED encapsulating structure of this embodiment, the peripheral full parcel one deck epoxy molding plastic of shell equally, metal pins contacts with peripheral epoxy molding plastic, the combination stability of metal pins and peripheral epoxy molding plastic is higher, so humidity resistance is better than the LED encapsulating structure of existing structure, thereby can effectively stop moisture, moisture to infiltrate the inside of LED encapsulating structure by the junction of metal pins and shell, affect the work of LED chip in shell, thereby effectively improvement is leaked electricity, dead lamp situation.The LED encapsulating structure making by preparation method of the present invention, by mould injecting glue, product shape high conformity, thereby luminous consistency is better, and by adjusting mold cavity structure shape, can realize flexibly the production of the LED encapsulating structure of various shapes, and bed die can share, economical flexibly.And preparing aspect the LED encapsulating structure of sizes, saved main LED support development cost, cost effectively reduces.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, make without departing from the inventive concept of the premise some substituting or obvious modification, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a preparation method for LED encapsulating structure, is characterized in that: comprise the following steps: 1) prepare LED support, described LED support comprises shell and is connected to the metal pins on described shell, is provided with bowl-shape inner chamber on described shell; 2) LED chip is fixed on to described bowl-shape intracavity bottom; 3) the fixed described LED chip of nation, makes described LED chip be electrically connected with described metal pins; 4) described LED support is packed in the inner chamber of mould of heating and thermal insulation, compress described mould and realize sealing; 5) inject epoxy molding plastic by the hole for injecting glue of described mould, make the interior and peripheral all filling bags of bowl-shape inner chamber of described shell be wrapped with epoxy molding plastic, solidify described epoxy molding plastic; 6) open mould, take out described LED support, process the metal pins of described LED support, the epoxy molding plastic of described metal pins and described shell periphery is contacted, make LED encapsulating structure.
2. the preparation method of LED encapsulating structure according to claim 1, it is characterized in that: described step 4) in, described mould comprises mold and bed die, and described mold and bed die are clamped described metal pins, makes described shell unsettled in the inner chamber of described mould; Described step 5) in, inject described epoxy molding plastic and fill described dies cavity room, thereby make the interior and peripheral all filling bags of bowl-shape inner chamber of described shell be wrapped with epoxy molding plastic.
3. the preparation method of LED encapsulating structure according to claim 2, is characterized in that: described step 1) described in the metal pins of LED support be level; Described step 4) in, described mold and bed die are clamped the end of described metal pins; Described step 6) in process described metal pins for the described metal pins of bending, described metal pins is contacted with the epoxy molding plastic of the peripheral parcel of described outer casing bottom towards the direction bending of described shell.
4. the preparation method of LED encapsulating structure according to claim 2, is characterized in that: described step 1) described in the metal pins of LED support be bending state; Described step 4) in, described mold and bed die are clamped the horizontal end of described metal pins bending; Described step 6) in to process described metal pins be to remove in described metal pins the part not contacting with epoxy molding plastic.
5. a LED encapsulating structure, is characterized in that: comprise LED support and LED chip, described LED support comprises shell and is connected to the metal pins on described shell; Bowl-shape inner chamber is set on described shell, described LED chip is arranged on described bowl-shape intracavity bottom, described LED chip is electrically connected with described metal pins, in the bowl-shape inner chamber of described shell and periphery all filling bag is wrapped with epoxy molding plastic, and described metal pins bending contacts with the epoxy molding plastic of described shell periphery.
6. LED encapsulating structure according to claim 5, it is characterized in that: described metal pins contacts with the epoxy molding plastic of the peripheral parcel of described outer casing bottom towards the direction bending of described shell, or described metal pins contacts towards the direction bending away from described shell and the epoxy molding plastic of the peripheral parcel of described shell upper.
7. LED encapsulating structure according to claim 5, it is characterized in that: the region of the corresponding described bowl-shape inner chamber of described outer casing bottom offers pod apertures, the epoxy molding plastic of filling in described bowl-shape inner chamber is communicated with by described pod apertures with the epoxy molding plastic of the periphery of described shell parcel.
8. LED encapsulating structure according to claim 5, is characterized in that: the epoxy molding plastic top of the peripheral parcel of described shell is protruding arc convex lens structures.
9. LED encapsulating structure according to claim 5, is characterized in that: described LED chip comprises red LED chip green light LED chip and blue-light LED chip; Described metal pins distributes and arranges by five pins, wherein two pins are connected with positive pole, the negative electricity of described red LED chip respectively, a pin is electrically connected with the positive pole of described green light LED chip and described blue-light LED chip simultaneously, and two other pin is connected with the negative pole of described green light LED chip, the negative electricity of described blue-light LED chip respectively.
10. LED encapsulating structure according to claim 9, is characterized in that: the area of the described metal pins being connected with the negative electricity of described green light LED chip is greater than the area of other metal pins.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252486A (en) * | 2016-08-03 | 2016-12-21 | 中山市雄纳五金照明科技有限公司 | A kind of manufacture method of Surface-mount LED lamp |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | The luminous PLC technology LED in side with IC |
| WO2018133189A1 (en) * | 2017-01-18 | 2018-07-26 | 中山市雄纳五金照明科技有限公司 | Surface-mounted led lamp and manufacturing method therefor |
| CN109030159A (en) * | 2018-07-28 | 2018-12-18 | 中国石油天然气集团有限公司 | A kind of test button grind away clamping device and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2346075Y (en) * | 1998-11-09 | 1999-10-27 | 陈兴 | Light-emitting diode |
| CN102593115A (en) * | 2012-03-15 | 2012-07-18 | 深圳市丽晶光电科技股份有限公司 | LED surface-mounted device and manufacturing method thereof |
| CN204118116U (en) * | 2014-08-19 | 2015-01-21 | 深圳市丽晶光电科技股份有限公司 | A kind of LED encapsulation structure |
-
2014
- 2014-08-19 CN CN201410413483.8A patent/CN104167483B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252486A (en) * | 2016-08-03 | 2016-12-21 | 中山市雄纳五金照明科技有限公司 | A kind of manufacture method of Surface-mount LED lamp |
| WO2018133189A1 (en) * | 2017-01-18 | 2018-07-26 | 中山市雄纳五金照明科技有限公司 | Surface-mounted led lamp and manufacturing method therefor |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | The luminous PLC technology LED in side with IC |
| CN110137168A (en) * | 2017-06-27 | 2019-08-16 | 东莞市欧思科光电科技有限公司 | Side with IC shines PLC technology LED |
| CN109030159A (en) * | 2018-07-28 | 2018-12-18 | 中国石油天然气集团有限公司 | A kind of test button grind away clamping device and preparation method thereof |
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| Publication number | Publication date |
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| CN104167483B (en) | 2017-07-28 |
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Address after: 518103 Guangdong, Shenzhen City, Guangdong Province, Baoan District Fuyong street oyyip road Xu Yuchang Industrial Park, B2 Patentee after: Shenzhen Lightking Technology Co., Ltd. Address before: 518103 Shenzhen, Guangdong, Fuyong street and the Far East Industrial Zone, the new building of the third Baoan District Patentee before: Shenzhen Lightking Technology Co., Ltd. |