CN204809259U - CSP packaging structure and LED device based on injection molding - Google Patents
CSP packaging structure and LED device based on injection molding Download PDFInfo
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- CN204809259U CN204809259U CN201520548247.7U CN201520548247U CN204809259U CN 204809259 U CN204809259 U CN 204809259U CN 201520548247 U CN201520548247 U CN 201520548247U CN 204809259 U CN204809259 U CN 204809259U
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Abstract
The utility model discloses a CSP packaging structure and LED device based on injection molding. Packaging structure includes through injection moulding's injection molding body, is equipped with the through -hole on the injection molding body, is equipped with the LED chip in the through -hole, and the LED chip is equipped with the lower surface of electrode, the lower surface of electrode and the lower surface parallel and level of injection molding body or protrusion injection molding body, the fluorescent glue that cover LED chip side and top surface is filled with in the through -hole intussuseption. The LED device includes above -mentioned CSP packaging structure and base plate. The utility model discloses can let shape, the thickness uniformity of fluorescent glue good, make CSP packaging structure's uniformity good, the high heat dissipating ability can be put forward to the better protection fluorescent glue of ability.
Description
Technical field
The utility model relates to CSP encapsulating structure based on moulding and LED component.
Background technology
Based on the novel wafer-level package LED(CSPLED of flip chip; ChipScale
PackageLED) be provided with electrode in die bottom surface, directly at upper surface and the side package on package colloid of chip, the electrode of bottom surface exposed, because this encapsulating structure there is no support, can packaging cost be reduced, reduce volume, improve electrical contact performance.
Existing wafer-level package LED normally takes five luminescences, namely the end face of LED and four sides all can be luminous, the packaging technology of this kind of LED is relatively simple, concrete process is: first on support plate, lay fixing film, then fixed L ED chip on fixing film, then on LED chip, fluorescent glue is encapsulated, in the process of encapsulation fluorescent glue, pressing plate is utilized to suppress fluorescent glue, fluorescent glue is allowed to be coated on reliably on LED chip, then the fluorescent glue of solidification is cut, be finally separated support plate and fixing film.Although this technique is simple, when encapsulating fluorescent glue, because fluorescent glue has certain mobility, therefore, be difficult to the shape and the consumption that control fluorescent glue, be also difficult to control fluorescent glue thickness evenness throughout, the difficult quality of wafer-level package LED is guaranteed.
Summary of the invention
In order to make the shape of fluorescent glue, consistency of thickness good, make the consistency of CSP encapsulating structure good, in order to better protect fluorescent glue, in order to improve heat dispersion, the utility model provides a kind of CSP encapsulating structure based on moulding.
In order to make the shape of fluorescent glue, consistency of thickness good, make the consistency of CSP encapsulating structure good, in order to better protect fluorescent glue, in order to improve heat dispersion, the utility model provides a kind of LED component based on moulding.
For reaching above-mentioned first object, a kind of CSP encapsulating structure based on moulding, comprise the moulding body by injection mo(u)lding, moulding body is provided with through hole, LED chip is provided with in through hole, LED chip is provided with electrode, and the lower surface of electrode is concordant with the lower surface of moulding body or protrude the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole.
Above-mentioned CSP encapsulating structure, the through hole of plastic part body provides containing cavity to LED chip and fluorescent glue, makes the shape of fluorescent glue, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body defines the rib of fluorescent glue, serves the effect of protection fluorescent glue.Meanwhile, be installed to after on substrate by above-mentioned CSP encapsulating structure, electrode directly contacts with substrate, and like this, the heat that LED chip produces can be delivered on substrate fast, and relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.If electrode protrudes the lower surface of moulding body, CSP encapsulating structure is being fixed in the process on substrate, fluorescent glue and form space between plastic part body lower surface and substrate, therefore, even if moulding body has downward burr, also the electrode of LED chip and the close contact of substrate can not be affected, in addition, if fluorescent glue expanded by heating, also the space that it expands is given below fluorescent glue, therefore, reduce the voidage that CSP encapsulating structure is connected with substrate, solving the electrode that there is burr and LED chip due to the cutting of moulding body with being heated in substrate welding process causes being electrically connected insecure problem between LED chip with substrate, make the connection of LED chip and substrate more firm.
Further, through hole is up big and down small taper type.This structure, through hole can allow fluorescent glue more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole of this structure contributes to the light of LED chip to reflect away, thus reaches the object improving light efficiency.
Further, moulding body is the moulding body that is in the light.Utilize this structure, the one side that can realize CSP encapsulating structure is luminous, and manufacturing process is simply too much relative to prior art.
Further, be provided with reflector on the inner walls of the via, make the reflecting properties of light better, improve light extraction efficiency.
For reaching above-mentioned second object, a kind of LED component based on moulding, comprises the CSP encapsulating structure based on moulding and substrate; CSP encapsulating structure based on moulding comprises the moulding body by injection mo(u)lding, and moulding body is provided with through hole, is provided with LED chip in through hole, and LED chip is provided with electrode, and the lower surface of electrode is concordant with the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole; Electrode is electrically connected on substrate.
Above-mentioned CSP encapsulating structure, the through hole of plastic part body provides containing cavity to LED chip and fluorescent glue, makes the shape of fluorescent glue, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body defines the rib of fluorescent glue, serves the effect of protection fluorescent glue.Meanwhile, be installed to after on substrate by above-mentioned CSP encapsulating structure, electrode directly contacts with substrate, and like this, the heat that LED chip produces can be delivered on substrate fast, and relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.
Further, through hole is up big and down small taper type.This structure, through hole can allow fluorescent glue more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole of this structure contributes to the light of LED chip to reflect away, thus reaches the object improving light efficiency.Be provided with reflector on the inner walls of the via, make the reflecting properties of light better, improve light extraction efficiency.
Further, moulding body is the moulding body that is in the light.Utilize this structure, the one side that can realize CSP encapsulating structure is luminous, and manufacturing process is simply too much relative to prior art.
For reaching above-mentioned second object, another technical scheme is: a kind of LED component based on moulding, comprises the CSP encapsulating structure based on moulding and substrate; CSP encapsulating structure based on moulding comprises the moulding body by injection mo(u)lding, and moulding body is provided with through hole, is provided with LED chip in through hole, and LED chip is provided with electrode, and the lower surface of electrode protrudes the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole; Electrode is electrically connected on substrate; Gap is had between the lower surface of plastic body and fluorescent glue and substrate.
Above-mentioned CSP encapsulating structure, the through hole of plastic part body provides containing cavity to LED chip and fluorescent glue, makes the shape of fluorescent glue, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body defines the rib of fluorescent glue, serves the effect of protection fluorescent glue.Meanwhile, be installed to after on substrate by above-mentioned CSP encapsulating structure, electrode directly contacts with substrate, and like this, the heat that LED chip produces can be delivered on substrate fast, and relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.Electrode protrudes the lower surface of moulding body, CSP encapsulating structure is being fixed in the process on substrate, fluorescent glue and form space between plastic part body lower surface and substrate, therefore, even if moulding body has downward burr, also the electrode of LED chip and the close contact of substrate can not be affected, in addition, if fluorescent glue expanded by heating, also the space that it expands is given below fluorescent glue, therefore, reduce the voidage that CSP encapsulating structure is connected with substrate, solving the electrode that there is burr and LED chip due to the cutting of moulding body with being heated in substrate welding process causes being electrically connected insecure problem between LED chip with substrate, make the connection of LED chip and substrate more firm.
Further, through hole is up big and down small taper type.This structure, through hole can allow fluorescent glue more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole of this structure contributes to the light of LED chip to reflect away, thus reaches the object improving light efficiency.Be provided with reflector on the inner walls of the via, make the reflecting properties of light better, improve light extraction efficiency.
Further, moulding body is the moulding body that is in the light.Utilize this structure, the one side that can realize CSP encapsulating structure is luminous, and manufacturing process is simply too much relative to prior art.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of embodiment 1 based on the CSP encapsulating structure of moulding.
Fig. 2 is the schematic diagram of embodiment 2 based on the CSP encapsulating structure of moulding.
Fig. 3 is the schematic diagram of embodiment 3 based on the LED component of moulding.
Fig. 4 is the schematic diagram of embodiment 4 based on the LED component of moulding.
Fig. 5 is the schematic diagram of moulding.
Fig. 6 is the schematic diagram that embodiment 5 arranges fixing film on support plate.
Fig. 7 is the schematic diagram that embodiment 5 arranges moulding on fixing film.
Fig. 8 is the schematic diagram of embodiment 5 fixed L ED chip.
Fig. 9 is the schematic diagram that embodiment 5 fills fluorescent glue.
Figure 10 is the schematic diagram that embodiment 5 is cut.
Figure 11 is the schematic diagram that embodiment 5 is separated support plate.
Figure 12 is the schematic diagram that embodiment 5 is separated fixing film.
Figure 13 is the schematic diagram that embodiment 6 arranges fixing film on support plate.
Figure 14 is the schematic diagram that embodiment 6 arranges moulding on fixing film.
Figure 15 is the schematic diagram of embodiment 6 fixed L ED chip.
Figure 16 is the schematic diagram that embodiment 6 fills fluorescent glue.
Figure 17 is the schematic diagram that embodiment 6 is cut.
Figure 18 is the schematic diagram that embodiment 6 is separated support plate.
Figure 19 is the schematic diagram that embodiment 6 is separated fixing film.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further elaborated.
Embodiment 1.
As shown in Figure 1, a kind of CSP encapsulating structure based on moulding comprises the moulding body 1 by injection mo(u)lding, moulding body is the moulding body that is in the light, the effect of blocking side light can be played, make the CSP encapsulating structure energy one side of moulding luminous, moulding body 1 is provided with through hole 11, and through hole 11 is up big and down small taper type, like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 is coated with one deck reflector, makes the reflecting properties of light better, improve light extraction efficiency.Be provided with LED chip 2 in through hole 11, LED chip 2 is provided with electrode 21, and the lower surface of electrode 21 is concordant with the lower surface of moulding body 1; The fluorescent glue 3 covering LED chip 2 side and end face is filled with in through hole 11.
The above-mentioned CSP encapsulating structure based on moulding, the through hole of plastic part body 1 provides containing cavity to LED chip 2 and fluorescent glue 3, makes the shape of fluorescent glue 3, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body 1 defines the rib of fluorescent glue 3, serves the effect of protection fluorescent glue 3.Meanwhile, as shown in Figure 3, above-mentioned CSP encapsulating structure is installed to after on substrate 4, electrode 21 directly contacts with substrate 4, and like this, the heat that LED chip 2 produces can be delivered on substrate 4 fast, relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.
Embodiment 2.
As shown in Figure 2, a kind of CSP encapsulating structure based on moulding comprises the moulding body 1 by injection mo(u)lding, moulding body is the moulding body that is in the light, the effect of blocking side light can be played, make the CSP encapsulating structure energy one side of moulding luminous, moulding body 1 is provided with through hole 11, and through hole 11 is up big and down small taper type, like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 is coated with one deck reflector, makes the reflecting properties of light better, improve light extraction efficiency.Be provided with LED chip 2 in through hole 11, LED chip 2 is provided with electrode 21, and the lower surface of electrode 21 protrudes the lower surface of moulding body 1; The fluorescent glue 3 covering LED chip 2 side and end face is filled with in through hole 11.
The above-mentioned CSP encapsulating structure based on moulding, the through hole of plastic part body 1 provides containing cavity to LED chip 2 and fluorescent glue 3, makes the shape of fluorescent glue 3, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body 1 forms the rib of fluorescent glue 3, plays the effect of protection fluorescent glue 3.Meanwhile, as shown in Figure 4, above-mentioned CSP encapsulating structure is installed to after on substrate 4, electrode 21 directly contacts with substrate 4, and like this, the heat that LED chip 2 produces can be delivered on substrate 4 fast, relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.
As shown in Figure 4, electrode 21 protrudes the lower surface of moulding body 1, CSP encapsulating structure is being fixed in the process on substrate 4, fluorescent glue 3 and form space between plastic parts body 1 lower surface and substrate 4, therefore, even if moulding body 1 has downward burr, also the electrode of LED chip 2 and the close contact of substrate 4 can not be affected, in addition, if fluorescent glue 3 expanded by heating, also the space that it expands is given below fluorescent glue 3, therefore, reduce the voidage that CSP encapsulating structure is connected with substrate 4, solving the electrode that there is burr and LED chip 2 due to moulding body 1 cutting with being heated in substrate 4 welding process causes being electrically connected insecure problem between LED chip 2 with substrate 4, make LED chip 2 more firm with the connection of substrate 4.
Embodiment 3.
As shown in Figure 3, CSP encapsulating structure based on moulding and substrate 4 is comprised based on the LED component of moulding.
As shown in Figure 1, CSP encapsulating structure based on moulding comprises the moulding body 1 by injection mo(u)lding, moulding body is the moulding body that is in the light, the effect of blocking side light can be played, make the CSP encapsulating structure energy one side of moulding luminous, moulding body 1 is provided with through hole 11, and through hole 11 is up big and down small taper type, like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 is coated with one deck reflector, makes the reflecting properties of light better, improve light extraction efficiency.Be provided with LED chip 2 in through hole 11, LED chip 2 is provided with electrode 21, and the lower surface of electrode 21 is concordant with the lower surface of moulding body 1; The fluorescent glue 3 covering LED chip 2 side and end face is filled with in through hole 11.
CSP encapsulating structure based on moulding is fixed on substrate 4.
The above-mentioned CSP encapsulating structure based on moulding, the through hole of moulding body 1 provides containing cavity to LED chip 2 and fluorescent glue 3, makes the shape of fluorescent glue 3, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body 1 defines the rib of fluorescent glue 3, serves the effect of protection fluorescent glue 3.Meanwhile, as shown in Figure 3, above-mentioned CSP encapsulating structure is installed to after on substrate 4, electrode 21 directly contacts with substrate 4, and like this, the heat that LED chip 2 produces can be delivered on substrate 4 fast, relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.
Embodiment 4.
As shown in Figure 4, CSP encapsulating structure based on moulding and substrate 4 is comprised based on the LED component of moulding.
As shown in Figure 2, a kind of CSP encapsulating structure based on moulding comprises the moulding body 1 by injection mo(u)lding, moulding body is the moulding body that is in the light, the effect of blocking side light can be played, make the CSP encapsulating structure energy one side of moulding luminous, moulding body 1 is provided with through hole 11, and through hole 11 is up big and down small taper type, like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 is coated with one deck reflector, makes the reflecting properties of light better, improve light extraction efficiency.Be provided with LED chip 2 in through hole 11, LED chip 2 is provided with electrode 21, and the lower surface of electrode 21 protrudes the lower surface of moulding body 1; The fluorescent glue 3 covering LED chip 2 side and end face is filled with in through hole 11.
CSP encapsulating structure based on moulding is fixed on substrate 4.
The above-mentioned CSP encapsulating structure based on moulding, the through hole of plastic part body 1 provides containing cavity to LED chip 2 and fluorescent glue 3, makes the shape of fluorescent glue 3, consistency of thickness good, and therefore, the consistency of CSP encapsulating structure is good.In addition, the surrounding of moulding body 1 defines the rib of fluorescent glue 3, serves the effect of protection fluorescent glue 3.Meanwhile, as shown in Figure 4, above-mentioned CSP encapsulating structure is installed to after on substrate 4, electrode 21 directly contacts with substrate 4, and like this, the heat that LED chip 2 produces can be delivered on substrate 4 fast, relative to traditional supporting structure LED, the path of heat trnasfer shortens, and heat dispersion is better.
As shown in Figure 4, electrode 21 protrudes the lower surface of moulding body 1, CSP encapsulating structure is being fixed in the process on substrate 4, fluorescent glue 3 and form space between plastic parts body 1 lower surface and substrate 4, therefore, even if moulding body 1 has downward burr, also the electrode of LED chip 2 and the close contact of substrate 4 can not be affected, in addition, if fluorescent glue 3 expanded by heating, also the space that it expands is given below fluorescent glue 3, therefore, reduce the voidage that CSP encapsulating structure is connected with substrate 4, solving the electrode that there is burr and LED chip 2 due to moulding body 1 cutting with being heated in substrate 4 welding process causes being electrically connected insecure problem between LED chip 2 with substrate 4, make LED chip 2 more firm with the connection of substrate 4.
Embodiment 5.
Above-described embodiment 1 based on the manufacture method of the CSP encapsulating structure of moulding is:
(1) as shown in Figure 5, injection mo(u)lding moulding 100, moulding is the moulding that is in the light, and described moulding 100 forms the through hole 11 of more than two, and through hole 11 is arrangement in array; Through hole 11 is up big and down small taper type, and like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 can be coated with one deck reflector, make the reflecting properties of light better, improve light extraction efficiency.
(2) as shown in Figure 6, support plate 5 is arranged the fixing film 6 of one deck for fixed L ED chip 2 position.Described fixing film 6 is UV two-sided tape film or thermal separation gel band film.
(3) as shown in Figure 7, the moulding 100 of forming is placed on fixing film 6, allows moulding 100 and fixing film 6 be affixed.
(4) as shown in Figure 8, in each through hole 11, arrange LED chip 2, the bottom surface of LED chip 2 is provided with electrode 21, and electrode and the fixing film 6 of LED chip 2 are affixed.
(5) as shown in Figure 9, in through hole 11, fill fluorescent glue 3, every LEDs chip 2 can cover by fluorescent glue 3 completely.In this step, pressing plate can be utilized to press fluorescent glue, fluorescent glue 3 can be filled into fully in through hole 11, in addition, fluorescent glue 3 also can be allowed to be that upper surface is concordant with the upper surface of moulding 100.
(6) as shown in Figure 10, after fluorescent glue 3 solidifies, can to polish, polishing to upper surface, then cut the moulding between adjacent LED chip, the degree of depth of cutting, to fixing film, enables moulding be cut off.
(7) as is illustrated by figs. 11 and 12, single CSP encapsulating structure is separated.Concrete step is:
(1a) as shown in figure 11, fixing film 6, LED chip 2, moulding 100 and fluorescent glue 3 are separated with support plate 5 for overall.
(2a) as shown in figure 12, LED chip 2, moulding 100 and fluorescent glue 3 are separated with fixing film 6 for overall.Finally obtain the CSP encapsulating structure based on moulding.
Above-mentioned manufacturing process, first shaping moulding 100, utilize the through hole of moulding 100 as the containing cavity of LED chip 2 and fluorescent glue 3, when filling fluorescent glue 3, utilize moulding 100 can have restriction to the flowing of fluorescent glue 3, like this, utilize through hole 11 to be easy to control shape and the consumption of fluorescent glue 3, also easily control the thickness of fluorescent glue 3, make the consistency of produced CSP encapsulating structure good; Therefore, make whole technique become more simple, reduce manufacturing cost and the requirement to operating personnel.
Embodiment 6.
Above-described embodiment 2 based on the manufacture method of the CSP encapsulating structure of moulding is:
(1) as shown in Figure 5, injection mo(u)lding moulding 100, moulding is the moulding that is in the light, and described moulding 100 forms the through hole 11 of more than two, and through hole 11 is arrangement in array; Through hole 11 is up big and down small taper type, and like this, through hole 11 can allow fluorescent glue 3 more easily flow downward thus reach the object allowing fluorescent glue fill full through hole; In addition, the through hole 11 of this structure contributes to the light of LED chip 2 to reflect away, thus reaches the object improving light efficiency; The inwall of through hole 11 can be coated with one deck reflector, make the reflecting properties of light better, improve light extraction efficiency.
(2) as shown in figure 13, there is provided a kind of support plate 5, support plate 5 is provided with depressed part 51, the area of the projection that the size of depressed part is downward with LED chip is consistent, support plate 5 arranges the fixing film 6 of one deck for fixed L ED chip 2 position, and fixing film 6 is at depressed part 51 place self-assembling formation sunk part.Described fixing film 6 is UV two-sided tape film or thermal separation gel band film.
(3) as shown in figure 14, the moulding 100 of forming is placed on fixing film 6, allows moulding 100 and fixing film 6 be affixed.
(4) as shown in figure 15, in each through hole 11, arrange LED chip 2, the bottom surface of LED chip 2 is provided with electrode 21, and the bottom of LED chip 2 is positioned at sunk part, allows electrode be positioned at sunk part, and electrode and the fixing film 6 of LED chip 2 are affixed.
(5) as shown in figure 16, in through hole 11, fill fluorescent glue 3, every LEDs chip 2 can cover by fluorescent glue 3 completely.In this step, pressing plate can be utilized to press fluorescent glue, fluorescent glue 3 can be filled into fully in through hole 11, in addition, fluorescent glue 3 also can be allowed to be that upper surface is concordant with the upper surface of moulding 100.
(6) as shown in figure 17, after fluorescent glue 3 solidifies, can to polish, polishing to upper surface, then cut the moulding between adjacent LED chip, the degree of depth of cutting, to fixing film, enables moulding be cut off.
(7) as shown in Figure 18 and Figure 19, single CSP encapsulating structure is separated.Concrete step is:
(1a) as shown in figure 18, fixing film 6, LED chip 2, moulding 100 and fluorescent glue 3 are separated with support plate 5 for overall.
(2a) as shown in figure 19, LED chip 2, moulding 100 and fluorescent glue 3 are separated with fixing film 6 for overall.Finally obtain the CSP encapsulating structure based on moulding.
Above-mentioned manufacturing process, first shaping moulding 100, utilize the through hole of moulding 100 as the containing cavity of LED chip 2 and fluorescent glue 3, when filling fluorescent glue 3, utilize moulding 100 can have restriction to the flowing of fluorescent glue 3, like this, utilize through hole 11 to be easy to control shape and the consumption of fluorescent glue 3, also easily control the thickness of fluorescent glue 3, make the consistency of produced CSP encapsulating structure good; Therefore, make whole technique become more simple, reduce manufacturing cost and the requirement to operating personnel.
As shown in Figure 4, electrode 21 protrudes the lower surface of moulding body 1, CSP encapsulating structure is being fixed in the process on substrate 4, fluorescent glue 3 and form space between plastic parts body 1 lower surface and substrate 4, therefore, even if moulding body 1 has downward burr, also the electrode of LED chip 2 and the close contact of substrate 4 can not be affected, in addition, if fluorescent glue 3 expanded by heating, also the space that it expands is given below fluorescent glue 3, therefore, reduce the voidage that CSP encapsulating structure is connected with substrate 4, solving the electrode that there is burr and LED chip 2 due to moulding body 1 cutting with being heated in substrate 4 welding process causes being electrically connected insecure problem between LED chip 2 with substrate 4, make LED chip 2 more firm with the connection of substrate 4.
Claims (10)
1. the CSP encapsulating structure based on moulding, it is characterized in that: comprise the moulding body by injection mo(u)lding, moulding body is provided with through hole, LED chip is provided with in through hole, LED chip is provided with electrode, and the lower surface of electrode is concordant with the lower surface of moulding body or protrude the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole.
2. the CSP encapsulating structure based on moulding according to claim 1, is characterized in that: through hole is up big and down small taper type.
3. the CSP encapsulating structure based on moulding according to claim 1, is characterized in that: moulding body is the moulding body that is in the light.
4. the CSP encapsulating structure based on moulding according to claim 1, is characterized in that: be provided with reflector on the inner walls of the via.
5. based on a LED component for moulding, it is characterized in that: comprise the CSP encapsulating structure based on moulding and substrate; CSP encapsulating structure based on moulding comprises the moulding body by injection mo(u)lding, and moulding body is provided with through hole, is provided with LED chip in through hole, and LED chip is provided with electrode, and the lower surface of electrode is concordant with the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole; Electrode is electrically connected on substrate.
6. the LED component based on moulding according to claim 5, is characterized in that: through hole is up big and down small taper type, is provided with reflector on the inner walls of the via.
7. the LED component based on moulding according to claim 5, is characterized in that: moulding body is the moulding body that is in the light.
8. based on a LED component for moulding, it is characterized in that: comprise the CSP encapsulating structure based on moulding and substrate; CSP encapsulating structure based on moulding comprises the moulding body by injection mo(u)lding, and moulding body is provided with through hole, is provided with LED chip in through hole, and LED chip is provided with electrode, and the lower surface of electrode protrudes the lower surface of moulding body; The fluorescent glue covering LED chip side and end face is filled with in through hole; Electrode is electrically connected on substrate; Gap is had between the lower surface of plastic body and fluorescent glue and substrate.
9. the LED component based on moulding according to claim 8, is characterized in that: through hole is up big and down small taper type, is provided with reflector on the inner walls of the via.
10. the LED component based on moulding according to claim 8, is characterized in that: moulding body is the moulding body that is in the light.
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| CN201520548247.7U CN204809259U (en) | 2015-07-27 | 2015-07-27 | CSP packaging structure and LED device based on injection molding |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN109075237A (en) * | 2016-04-13 | 2018-12-21 | 欧司朗光电半导体有限公司 | Device with reflector and the method for manufacturing device |
| AT16805U1 (en) * | 2016-09-21 | 2020-09-15 | Tridonic Jennersdorf Gmbh | Protective plate for CSP LED module |
| CN111952427A (en) * | 2020-08-24 | 2020-11-17 | 深圳雷曼光电科技股份有限公司 | Packaging method |
-
2015
- 2015-07-27 CN CN201520548247.7U patent/CN204809259U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN109075237A (en) * | 2016-04-13 | 2018-12-21 | 欧司朗光电半导体有限公司 | Device with reflector and the method for manufacturing device |
| CN109075237B (en) * | 2016-04-13 | 2022-03-22 | 欧司朗光电半导体有限公司 | Device with reflector and method for producing a device |
| AT16805U1 (en) * | 2016-09-21 | 2020-09-15 | Tridonic Jennersdorf Gmbh | Protective plate for CSP LED module |
| CN111952427A (en) * | 2020-08-24 | 2020-11-17 | 深圳雷曼光电科技股份有限公司 | Packaging method |
| CN111952427B (en) * | 2020-08-24 | 2022-05-06 | 深圳雷曼光电科技股份有限公司 | Packaging method |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee before: Guangzhou Hongli Tronic Co., Ltd. |