JP5554691B2 - LED chip mounting substrate mold, and LED chip mounting substrate manufacturing method - Google Patents

Description

  The present invention relates to an LED chip mounting substrate on which a plurality of LED chips can be mounted.

  Conventionally, there is an LED package including an LED chip that emits light of a predetermined wavelength. In such an LED package, a lead frame is resin-sealed to form an LED chip mounting substrate, and a plurality of LED chips are mounted and sealed on the LED chip mounting substrate. Is manufactured by cutting the substrate into pieces.

  In Patent Document 1, a lead frame is clamped using a first mold and a second mold in a state where a film material is interposed between the lead frame and the first mold. A method of injecting is disclosed.

JP 2008-244143 A

  However, as disclosed in Patent Document 1, when a film material is interposed between the lead frame and the first mold and clamped, the film material is removed from the mounting area of the lead frame during resin sealing. In some cases, the resin may not enter the hole and be completely filled with the resin, and a step may be formed by the hole in the lead frame mounting region. On the other hand, when resin sealing is performed without using a film, there is a risk that the resin may enter the lead frame mounting region from between the first mold and the second mold (resin flash). In such a case, the insulation between the electrodes (holes) may be incomplete, and the electrical contact of the LED chip may be incomplete, making it difficult to manufacture a high-quality LED chip mounting substrate. Become.

  Accordingly, the present invention provides an LED chip mounting substrate in which the resin chip is effectively prevented by forming the LED chip mounting region by coining, and the insulating properties of the punched holes are reliably ensured.

A mold as one aspect of the present invention is a mold for an LED chip mounting substrate, an upper mold for pressing a lead frame having a die pad and leads from the upper surface side, and a lower mold for pressing the lead frame from the lower surface side. includes a die, wherein the upper die includes a first member having a parting plane is composed of the first member and another member, have a protrusion that protrudes by a predetermined amount from said parting plane A second member that clamps the LED chip mounting region of the lead frame by the protruding portion, and the mold is formed by the upper mold and the lower mold when the lead frame is resin-sealed. by clamping the leadframe to ulcer from the surface by a predetermined depth of the lead frame the LED chip mounting area, and wherein the.
According to another aspect of the present invention, there is provided a method for manufacturing an LED chip mounting substrate, the method for manufacturing an LED chip mounting substrate configured to be capable of mounting a plurality of LED chips, the first electrode of the LED chip being a first electrode. A lead frame having a die pad for electrical connection and a lead for electrical connection to the second electrode of the LED chip is formed, and the lead frame is clamped using an upper mold and a lower mold and, the LED chip mounting area of the lead frame and ulcers from the surface by a predetermined depth of the lead frame, a resin is filled into vent hole between the die pad and the leads of the lead frame, the upper mold Is composed of a first member having a parting surface and a member separate from the first member, and has a protrusion protruding from the parting surface by a predetermined amount. Comprising a second member for clamping the LED chip mounting area, and wherein the.

  Other objects and features of the present invention are illustrated in the following examples.

  ADVANTAGE OF THE INVENTION According to this invention, the LED chip mounting area | region can be provided by coining, and the LED chip mounting board | substrate which prevented the resin flash effectively and ensured the insulation of the punching hole reliably can be provided.

3 is a plan view showing a part of the lead frame in Embodiment 1. FIG. It is a schematic sectional drawing of the metal mold | die in Example 1, (A) Before the lead frame is clamped, (B) The state after the lead frame is clamped. FIG. 3 is a plan view of an upper mold that constitutes the mold in Example 1; It is the expanded sectional view of the metal mold | die in Example 1, (A) The figure which expanded a part of FIG. 2 (A), (B) The figure which expanded a part of FIG. 2 (B). It is a state that the resin is filled using the mold in Example 1, (A) a state in which the lead frame is clamped and the resin is filled, (B) the upper mold is released after the resin is filled. It is in the state. In Example 1, it is a top view of the lead frame (substrate for LED chip mounting) after resin sealing. 3 is an enlarged cross-sectional view showing a lead frame (LED chip mounting substrate) after resin sealing in Example 1. FIG. It is a figure which shows the process after manufacturing the board | substrate for LED chip mounting in Example 1 (after resin sealing). In Example 2, it is a top view of (A) lead frame and (B) LED chip mounting substrate. It is a schematic sectional drawing of the metal mold | die in Example 2, and is the state after (A) resin sealing and (B) resin sealing. It is a schematic block diagram of the board | substrate for LED chip mounting in Example 2, (A) Whole side view of a board | substrate for LED chip mounting, (B) Whole sectional drawing, (C) It is an expanded sectional view. It is a schematic sectional drawing of the metal mold | die in Example 3, (A) Before the clamp of a lead frame, (B) The state after the clamp of a lead frame. It is a schematic block diagram of the board | substrate for LED chip mounting in Example 3, (A) Top view, (B) It is sectional drawing. It is a schematic sectional drawing of the metal mold | die in Example 4, and is the state after (A) resin sealing and (B) resin sealing. It is an enlarged view which shows the lead frame (board | substrate for LED chip mounting) after resin sealing in Example 4, (A), (B) sectional drawing, (C) It is a side view. It is a block diagram of the front-end | tip of the cavity pin in Example 5, (A) The side view of the front-end | tip, (B) It is a top view. It is explanatory drawing of resin sealing in Example 5, FIG. 17 (A) is the state before clamping, FIG. 17 (B) is the state before resin sealing after clamping, and 17 (C) is after resin sealing. State. It is an enlarged view of the board | substrate for LED chip mounting in Example 5, FIG. 18 (A) shows a top view, FIG.18 (B) shows sectional drawing. It is a block diagram of the front-end | tip of the cavity pin in Example 6, (A) The side view of the front-end | tip, (B) It is a top view.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

  First, Embodiment 1 of the present invention will be described with reference to FIGS. The lead frame of the present embodiment is a lead frame 10 used for manufacturing an LED chip mounting substrate and a final product LED package on which a plurality of LED chips can be mounted. FIG. 1 is a plan view showing a part of the lead frame 10. The lead frame 10 is configured, for example, by forming a plating layer (for example, Ni-Ag plating) made of nickel, palladium, silver, gold, or the like on the surface of a copper-based frame material. The plate thickness of the lead frame 10 is, for example, 0.5 mm, and a lead frame having a plate thickness of about 0.2 mm or 0.3 mm may be used. A plurality of LED chips are mounted on the lead frame 10, and a plurality of LED packages are completed by dicing (cutting) the lead frame 10 after resin sealing.

  The lead frame 10 includes a die pad 12 (base-side lead frame) configured to be electrically connected to a first electrode (anode electrode) of an LED chip described later. The lead frame 10 includes a lead 13 (terminal-side lead frame) configured to be electrically connected to a second electrode (cathode electrode) different from the first electrode of the LED chip. The LED chip is mounted on the die pad 12. A punching hole 16 is provided around the die pad 12 and the lead 13 (between the die pad 12 and the lead 13), and the die pad 12 and the lead 13 are separated from each other. A pad portion 14 is constituted by the die pad 12 and the lead 13. Note that the present embodiment is not limited to this, and conversely to the above configuration, the cathode electrode of the LED chip may be connected to the die pad 12 and the anode electrode may be connected to the lead 13. . As shown in FIG. 1, the lead frame 10 of this embodiment is composed of a plurality of pad portions 14 (unit elements), and within the range of the lead frame 10 shown in FIG. A total of 15 LED packages are manufactured. In a typical lead frame, ten or more rows are formed in the horizontal direction in the figure, and 50 to 100 or more (taken) LED packages are manufactured for each lead frame.

  Next, a mold used for resin-sealing the lead frame 10 in this embodiment will be described. 2A and 2B are schematic cross-sectional views of the mold according to the present embodiment. FIG. 2A shows a state before the lead frame is clamped, and FIG. 2B shows a state after the lead frame is clamped. . FIG. 5 shows a state in which the resin is filled using a mold. FIG. 5A shows a state in which the lead frame is clamped and the resin is filled, and FIG. The upper die is released from the lead frame after filling. In these drawings, the same structure is arranged on the left side of the alternate long and short dash line, so that the two lead frames 10 are resin-sealed by one molding.

  As shown in FIGS. 2A and 2B, in this embodiment, the mold is configured to include an upper mold 50 and a lower mold 60. The upper mold 50 includes an upper mold insert 51, and a plurality of cavity pins 52 (hollow pins) are inserted into the upper mold insert 51. The upper mold 50 further includes a center insert 53, and the upper mold insert 51, the cavity pin 52, and the center insert 53 are held by a chase 54. With such a configuration, the upper mold 50 determines the shape of the resin filled in the lead frame 10.

  A cavity 57 is formed in the upper mold insert 51 so as to surround each cavity pin 52. The cavity 57 is filled with resin when the lead frame 10 is resin-sealed by transfer molding, and forms a reflector that reflects light from an LED chip described later. In addition, the upper die 51 is formed with a through gate 58 that allows communication between adjacent cavities 57. The center insert 53 is formed with a cull 55 a and a runner 55 b and is in communication with a runner 55 b formed on the upper mold insert 51 and a gate 56. In the upper mold insert 51, an air vent 59 is formed so as to communicate with a cavity 57 located farthest from the center insert 53. The upper mold 50 presses the lead frame 10 from the upper surface side so that the pad portion 14 (the die pad 12 and the lead 13) and the cavity 57 overlap each other at the time of resin sealing.

  FIG. 3 is a plan view of an upper mold constituting the mold in the present embodiment, and a II-II cross section in FIG. 3 corresponds to FIG. In FIG. 3, the lead frame 10 is drawn with a dotted line at a position corresponding to the upper mold. As shown in FIG. 3, a cavity 57, a through gate 58, a cull 55a, a runner 55b, a gate 56, and an air vent 59 are formed in the upper mold 50 in a concave shape having respective shapes and sizes. Has been. In the upper mold 50, the cavity pin 52 inserted so as to protrude toward the lower mold 60 at the center of the cavity 57 having a rectangular outer shape is a clamp that clamps the pad portion 14 of the lead frame 10. It becomes a surface (LED chip mounting area 18 described later). With this clamping surface, as shown in FIG. 5B, the LED chip mounting region in the lead frame 10 is clamped.

4A and 4B are enlarged views of parts of FIGS. 2A and 2B, respectively. As shown in FIG. 4A, the cavity pin 52 is set so that the tip thereof protrudes by a distance d ₁ with reference to the parting surface of the upper mold insert 51. Specifically, for the lead frame 10 having a plate thickness of 0.5 mm, a value in the range of, for example, 10 to 30 μm (2 to 6% of the plate thickness) is set as the distance d ₁ . More preferably, the distance _{d 1} is set to a value in the range of 15 to 25 [mu] m (3 to 5% of the thickness). A plurality of cavities pins 52 are inserted into the upper mold insert 51, individually distance d ₁ is set. Thus, since the plurality of cavity pins 52 protrude from the upper mold insert 51 by the distance d ₁ , when the lead frame 10 is clamped using the parting surface of the upper mold insert 51 and the lower mold 60. A portion (LED chip mounting region) on the die pad 12 sandwiched between the cavity pin 52 and the lower mold insert 61 is recessed by a distance d ₁ (see FIG. 4B). Thus, the LED chip mounting area is formed by being crushed by a predetermined depth by coining.

  The cavity pin 52 is made of, for example, iron or stainless steel material. Further, the tip of the cavity pin 52 is mirror-finished, and the surface roughness (surface roughness) of the tip of the cavity pin 52 is different (fine) compared to other parts of the upper mold 50. For this reason, when the lead frame 10 is clamped, a cavity pin 52 with a fine surface roughness forms a recess (LED chip mounting area) in the die pad 12, and therefore the surface roughness of the recess is the other area of the lead frame 10. It becomes finer than the surface roughness at (flatness is improved). Moreover, the effect of preventing flash described later can be improved by crushing fine irregularities.

  The lower mold 60 includes a lower mold insert 61, and the lead frame 10 is disposed on the planar lower mold insert 61. The lower mold 60 presses the lead frame 10 from the lower surface side during resin sealing.

  As described above, the mold of this embodiment is mainly composed of the upper mold 50 and the lower mold 60. At the time of resin sealing (at the time of resin molding), the lead frame 10 is clamped (sandwiched) by the upper mold 50 and the lower mold 60, and the resin 71 (reflector) is placed inside the plurality of cavities 57 and the plurality of holes 16. Resin).

  Reference numeral 70 denotes a resin tablet obtained by molding a thermosetting resin or the like into a tablet (column) shape. At the time of resin sealing, as shown in FIG. 2 (B), the pot 63 inserted in the pot insert 62 of the lower mold 60 is preheated, and the resin tablet 70 is put therein and melted. Then, a molten resin 71 is pumped by moving a plunger 64 configured to be slidable up and down along the pot 63 by a transfer mechanism (not shown), as shown in FIG. The space between the upper mold 50 and the lower mold 60 is filled with the resin 71. Instead of the resin tablet 70, a liquid thermosetting resin can be supplied by a dispenser (not shown). Further, granular, granular or gel resins can be used.

  As the resin 71 is pumped by the plunger 64, the molten resin 71 is supplied to the punch hole 16 and the cavity 57 via the cull 55 a, the runner 55 b, and the gate 56. Specifically, since each of the cavities 57 and the hole 16 communicates with each other through the through gate 58, the resin 71 is also supplied to the hole 16 communicated with the cavity 57. Therefore, the resin 71 is sequentially supplied from the hole 16 and the cavity 57 close to the gate 56 toward the hole 16 and the cavity 57 far from (distant from) the gate 56. In this way, the resin tablet 70 is melted to become the resin 71 and is injected into the space formed by the upper mold 50 and the lower mold 60. As a result, as shown in FIG. 5A, the space between the upper mold 50 and the lower mold 60 (specifically, the cavity 57 and the punched hole 16) is filled with the resin 71. Become.

  After the resin 71 is filled, the apparatus waits for a predetermined time to cure the resin 71, and the upper mold 50 and the lower mold 60 are opened as shown in FIG. 5B. Next, after the resin-molded LED chip mounting substrate is unloaded, the parting surface of the mold is cleaned, and one resin molding process is completed.

  After the above steps, the LED chip mounting substrate of this example is formed. FIG. 6 is a plan view of the lead frame (LED chip mounting substrate) after being filled with resin. In addition, the broken line shown as 150 in FIG. 6 shows one LED package (light emitting device) which is the final product.

  The resin 71 is a primary molding resin, for example, an epoxy or silicone resin containing silica as a filler and titanium oxide as a white colorant. As described above, the upper package is integrally formed on the lead frame 10 by pouring and curing the resin 71 by transfer molding. Since the LED chip is mounted, the LED chip is exposed without being covered with the resin 71. As described above, the LED chip mounting substrate in the present embodiment has a matrix structure with a plurality of rows and a plurality of columns, which are collectively molded with the resin 71.

  Further, the resin 71 forms a reflector 72 that reflects upward light emitted from an LED chip described later. The resin 71 also has a function of improving the strength of the LED package. The resin 71 is not formed in a predetermined region (LED chip mounting region 18) on the lead frame 10 on which the LED chip is to be mounted. This area is an area where the surface of the lead frame 10 is exposed after the primary molding.

  FIG. 7 is an enlarged cross-sectional view showing the lead frame (LED mounting substrate) after resin sealing in the present embodiment. 7A and 7B show cross sections when viewed from different directions.

As shown in FIGS. 7A and 7B, the resin 71 (71 a) cured in the cavity 57 on the upper surface side of the lead frame 10 constitutes a reflector 72 on the outer periphery of the LED chip mounting region 18. The LED chip mounting region 18 is recessed by the distance d ₂ (d ₁ > d ₂ ) from the surface of the original lead frame 10 by clamping using the cavity pin 52 protruding by the distance d ₁ as described above. . Thus, the amount of depression (distance d ₂ ) due to coining of the LED chip mounting region 18 is smaller than the amount of protrusion (distance d ₁ ) of the cavity pin 52. The recess of the lead frame 10 when coined by the cavity pin 52 protruding from the parting surface is formed including both plastic deformation and elastic deformation. Of these, the dent due to elastic deformation returns to the original when the mold is released, so the dent amount (distance d ₂ ) finally formed in the LED chip mounting region 18 is the amount of protrusion of the cavity pin 52 ( It becomes smaller than the distance d ₁ ). Specifically, when the lead frame 10 having a plate thickness of 0.5 mm is used, the distance d ₂ is _{2 to} 10 μm (plate by adopting the setting of the protruding amount of the cavity pin 52 as described above, for example. (0.4 to 2.0% of the thickness). More preferably, the distance _{d 2} is set to be 3 to 5 [mu] m (0.6 to 1.0% of the thickness).

  As a result of the inventor's extensive research, by setting such values, deviations such as minute unevenness due to the material of the lead frame 10 and the thickness of the plating and variations in the length of each of the cavity pins 52 can be reliably ensured. As a result, it was found that uniform coining can be achieved and flashing in all the pad portions 14 of the lead frame 10 can be prevented. Further, at the time of this resin sealing, the lead frame 10 must be clamped to such an extent that the resin 71 does not flow out from the outer periphery of the cavity 57 or the like. For this reason, in order to prevent the resin from flowing out from the outer periphery of the cavity 57 while preventing the pad portion 14 from flashing, it is necessary to set the dent amount formed in the LED chip mounting region 18 to at least the above-described range. Although the above-mentioned problems can be solved by increasing both the amount of coining in the pad portion 14 and the clamping force on the outer periphery of the cavity 57, a larger press capability is required, and the number of picks cannot be increased. On the other hand, by forming the dent amount formed in the LED chip mounting area 18 to be in the above-described range, it is possible to prevent flashing and to form a high quality and increase the number of pieces to be taken. A quality and inexpensive substrate for mounting an LED chip can be provided.

Further, as shown in FIG. 7B, the resin 71 (71b) is made of a hole 16 provided in order to insulate a pair of electrodes (anode electrode-cathode electrode) of the LED chip (in other words, It is filled also between the die pad 12 and the lead 13. In this case, by molding without using the release film, the hole 16 can be completely filled with the resin. As a result, the electrodes can be reliably insulated from each other, and the LED chip mounting region 18 can be formed smoothly to maintain good optical characteristics. As described above, when filling the resin hole 71 with the resin 71, the LED chip mounting region 18 clamps the lead frame 10 using a mold, and has a predetermined depth (distance d ₂₎ from the surface of the lead frame 10. ) Only crushed and recessed.

  FIG. 8 is a diagram showing a process after manufacturing the LED chip mounting substrate in this example (after resin sealing). 8A to 8C each show a cross section of a single piece of LED chip mounting substrate. After the LED chip mounting substrate is manufactured, the LED chip 80 is mounted on the die pad 12 in the LED chip mounting area 18 as shown in FIG. The LED chip 80 is an element that includes a pair of electrodes of an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light by applying a predetermined voltage with a forward bias between these electrodes. As described above, the lead frame 10 is separated into the die pad 12 (anode electrode) and the lead 13 (cathode electrode), and is electrically connected to each electrode. The LED chip 80 and each electrode are connected by a bonding wire (not shown) such as a gold wire.

  As shown in FIG. 8A, the reflector 72 formed of the resin 71 (71a) is formed in an annular shape on the lead frame 10 so as to surround the LED chip mounting region 18 (LED chip 80). ing. In addition, the reflector 72 has a mortar shape in which the inner diameter increases as the distance from the lead frame 10 increases. By having such a shape, the reflector 72 can efficiently reflect the light emitted from the LED chip 80 upward.

  Subsequently, as shown in FIG. 8B, a transparent resin 91 as a secondary molding resin is filled so as to seal the LED chip 80. As the transparent resin 91, a translucent silicone resin (translucent resin) is preferably used. Silicone resin is resistant to discoloration and deterioration due to light and heat when the emission wavelength of LED chip 80 is a short wavelength such as blue light or when LED chip 80 is a high-intensity LED and generates a large amount of heat. Excellent in properties. However, the transparent resin 91 of the present embodiment is not limited to a silicone resin, and for example, a modified silicone resin, an epoxy resin, a urethane resin, an oxetane resin, or the like may be used.

  For example, the transparent resin 91 is integrally formed on the LED chip mounting region 18 by clamping the LED chip mounting substrate from both sides using a mold (not shown) and pouring and curing the resin by transfer molding. It is formed. However, the present embodiment is not limited to this, and the transparent resin 91 may be formed using other methods such as potting and compression molding.

  Subsequently, as shown in FIG. 8C, the LED chip mounting substrate is cut by a dicing process to be separated into LED packages as final products. The portions of the lead frame 10 that are exposed without being covered with the resin 71 constitute external terminals of the anode and the cathode. The transparent resin 91 can also be formed after cutting the LED chip mounting substrate.

  Next, the lead frame and LED chip mounting substrate in the second embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a plan view of the lead frame (FIG. 9A) and the LED chip mounting substrate (FIG. 9B) in this example.

  As shown in FIG. 9A, the lead frame 10a of the present embodiment is provided with a plurality of holes 16a. Further, a pad portion 14a composed of a die pad 12a and a lead 13a is formed by the plurality of holes 16a. As shown in FIG. 9B, a rectangular package that collectively seals the hole 16a that forms the pad portion 14a is formed by transfer molding using a resin 71 as a primary molding resin. The resin 71 forms the reflector 72a so as to surround the periphery of the LED chip mounting region 18a. As described above, in this embodiment, a map type LED chip mounting substrate in which the reflectors 72a of all the LED chip mounting regions 18a in the lead frame 10a are integrally formed of the resin 71 is manufactured. This is different from Example 1 in which a chip mounting substrate is manufactured.

  Subsequently, the mold in the present embodiment will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view of a map type mold, and is a cross-section corresponding to the XX plane in FIG. 10 shows a state in which the lead frame 10a is clamped by the upper mold 50a and the lower mold 60. FIG. 10 (A) shows a state before resin sealing, and FIG. 10 (B) shows a state after resin sealing. Each is shown.

  As shown in FIG. 10 (A), the upper mold 50a has an upper mold insert in which a plurality of protruding portions 52a are provided in a rectangular cavity 57a so as to protrude at the same interval as the pad portion 14a. 51a. The upper mold insert 51a is held by other upper mold inserts 51b and 51c. Similar to the cavity pin 52 of the first embodiment, the protruding portion 52a has a tip protruding from the parting surface of the upper mold 50a (specifically, the lower surface of the upper mold insert 51b) by a predetermined amount. Therefore, the resin 71 is filled into the cavity 57a while coining the lead frame 10a with the tip of the convex portion 52a. The upper mold insert 51b includes a rectangular insertion hole into which the upper mold insert 51a and the upper mold insert 51c can be inserted, and constitutes a cavity 57a together with the upper mold insert 51a. The upper mold insert 51b clamps the lead frame 10a together with the lower mold 60 when sealing with resin. The upper mold insert 51c is formed in a simple rectangular block shape, and is disposed on the back surface (upper surface) of the upper mold insert 51a in the insertion hole in the upper mold insert 51b. This upper mold insert 51c is provided in order to adjust the protrusion amount of the convex part 52a by changing the thickness. Thereby, not only can the amount of coining be adjusted by simply increasing or decreasing the amount of protrusion of the convex portion 52a, but also the pressure can be uniformly applied according to various parameters such as temperature and pressure in the mold. For example, the amount of protrusion of the convex portion 52a can be inclined so that a predetermined side (for example, the pot side) can be greatly coined. Moreover, uniform pressurization can also be achieved by making the thickness partially uneven according to the arrangement load distribution of a pressurizing spring (not shown) or a support pillar (not shown).

Since the upper mold insert 51c has a simple shape, it is easier and preferable than processing the upper mold insert 51a and other members. Thus, it can be set to protrude a distance d ₁ described above the convex portion 52a relative to the parting face of the upper mold insert 51b, the same effects as the above-described embodiments. As in the first embodiment, the lower mold 60 is one in which the mounting area of the lead frame 10a is flat so that the lead frame 10a can be mounted.

  Next, the LED chip mounting substrate in the present embodiment will be described with reference to FIG. FIG. 11 is a schematic configuration diagram of an LED chip mounting substrate, and FIGS. 11A to 11C are an overall side view, an entire cross-sectional view, and an enlarged cross-sectional view of the LED chip mounting substrate, respectively.

As shown in FIG. 11A, since the LED chip mounting substrate of this embodiment is a map type LED chip mounting substrate, the upper surface of the lead frame 10a is integrally covered with a resin 71. Further, as shown in FIGS. 11B and 11C, the periphery of the LED chip mounting region 18a is surrounded by a reflector 72a formed of a resin 71 (71a). Further, the inside of the hole 16a in the LED chip mounting area 18a is filled with resin 71 (71b). As shown in FIG. 11C, the distance d ₂ is between the original surface position of the lead frame 10a and the surface position of the LED chip mounting region 18a formed by coining, as in the first embodiment. There is a difference. Thereby, even in the map type sealing form as in the present embodiment, it is possible to prevent flashing in the pad portion 14a. Subsequently, the process after manufacture of the board | substrate for LED chip mounting is performed similarly to the above-mentioned Example. In this case, the LED package is completed by cutting along a line as shown by a broken line in FIG. 9B in the dicing process. According to such a method of manufacturing a map type LED package, the number of resin can be increased and the amount of discarded resin can be reduced. Therefore, the LED package can be manufactured at low cost.

  It is also possible to adopt a configuration in which a plurality of sealing regions are formed on the lead frame 10a separately in a plurality of (for example, two) cavities 57a of the plurality of pad portions 14a. Also in the manufacturing method of the map type LED package, the upper mold 50 having the cavity pins 52 can be used as in the first embodiment. In this case, it is possible to adopt a configuration in which insertion holes having the same arrangement as the plurality of pad portions 14a are provided in a rectangular recess forming the cavity, and the cavity pin 52 is inserted into the insertion hole.

  Next, with reference to FIG. 12 and FIG. 13, the lead frame and LED chip mounting substrate in Example 3 of the present invention will be described. FIGS. 12A and 12B are schematic cross-sectional views of a mold according to the present embodiment. FIG. 12A shows a state before the lead frame is clamped, and FIG. 12B shows a state after the lead frame is clamped.

  In the present embodiment, the same lead frame 10 as in the first embodiment is used. In this embodiment, a flat mold is used. As shown in FIG. 12A, the upper mold 50b includes a plurality of cavity pins 52 as in the first embodiment, and these cavity pins 52 are inserted and held in the upper mold insert 51b. The upper mold insert 51b is not provided with a cavity (concave portion) to be filled with resin. Thus, the tip of the upper mold insert 51b of this embodiment is planar, and is different from the upper mold insert 51 of the first embodiment in which the cavity 57 and the through gate 58 are formed.

  As in the first embodiment, the cavity pin 52 protrudes from the parting surface of the upper mold 50b by a predetermined amount. For this reason, the resin 71 is filled inside the punching hole 16 while coining the lead frame 10 with the tip of the cavity pin 52 (FIG. 12B). The lower mold 60 is the same as that of the first embodiment.

  FIG. 13 is a configuration diagram of an LED chip mounting substrate in this example, FIG. 13A shows a plan view, and FIG. 13B shows a cross-sectional view. As shown in FIGS. 13A and 13B, the portion that is coined and crushed by the cavity pin 52 becomes the LED chip mounting region 18a. The hole 16 of the lead frame 10 is filled with resin 71 (71b). However, unlike the above embodiment, there is no reflector made of resin, and the LED chip mounting substrate is planar, so that a thin package can be formed.

  Further, a step is formed at the position of the outer periphery of the cavity pin 52, and in the step of sealing the LED chip 80, the transparent resin 91 can be fastened around the portion where the LED chip 80 is mounted, which is preferable. For example, when the LED chip mounting substrate is clamped with the upper and lower molds to seal the LED chip 80 and the wire, resin leakage is reliably prevented by this step. Further, when the LED chip 80 and the wire are sealed by potting, the step is prevented from spreading, so that the potted resin is prevented from unnecessarily spreading even if a low viscosity resin is used. Can do.

  Next, with reference to FIG. 14 and FIG. 15, the lead frame and LED chip mounting substrate in Example 4 of the present invention will be described. FIG. 14 is a schematic cross-sectional view of a mold in the present embodiment. FIG. 14 shows a state in which the lead frame 10 is clamped by an upper mold 50 and a lower mold 500, and FIG. Before stopping, FIG. 14B shows the state after resin sealing.

  As shown in FIG. 14A, the upper mold 50 includes an upper mold insert 51 having a plurality of cavities 57 and through gates 58, as in the first embodiment, and the plurality of cavity pins 52 include the upper mold. It is inserted and held in the insert 51. The tip of the cavity pin 52 protrudes from the parting surface of the upper mold 50 by a predetermined amount. Therefore, the resin 71 fills the cavities 57, the through gates 58, and the through holes 16 in the same manner as in the first embodiment while coining the top surface of the lead frame 10 with the tips of the cavity pins 52. (FIG. 14B).

  In this embodiment, a lower mold 500 having a structure basically the same as that of the upper mold 50 is used as the lower mold. 14A and 14B, the lower mold 500 includes a lower mold insert 510 having a plurality of cavities 570 and through gates 580, and a plurality of cavity pins 520 are provided on the lower mold insert 510. Inserted and held. The tip of the cavity pin 520 protrudes from the parting surface of the lower mold 500 by a predetermined amount. Therefore, the resin 71 is filled into the plurality of cavities 570, the through gates 580, and the punched holes 16 while coining the lower surface of the lead frame 10 with the tips of the cavity pins 520. Thereby, an upper package and a lower package are formed above and below the lead frame 10.

  FIG. 15 is an enlarged view showing a lead frame (LED chip mounting substrate) after resin sealing in this embodiment, FIGS. 15A and 15B are cross-sectional views, and FIG. A side view is shown. 15A and 15B are cross-sectional views when viewed from different directions. FIG. 15C is a side view when viewed from the same direction as FIG.

As shown in FIGS. 15A and 15B, the resin 71 a cured in the cavity 57 on the upper surface side of the lead frame 10 forms a reflector 72 on the outer periphery of the LED chip mounting region 18. The LED chip mounting area 18 is coined by clamping with a cavity pin 52 protruding a predetermined distance from the parting surface of the upper mold 50, and the LED chip mounting area 18 is coined, and the surface (upper surface) of the original lead frame 10. It is recessed by a distance _{d 3} from). Similarly, on the lower surface side of the lead frame 10, the resin 710 a cured in the cavity 570 forms a package recess 720 on the outer periphery of the LED chip mounting region 180. The LED chip mounting area 180 is clamped by using a cavity pin 520 protruding by a predetermined distance from the parting surface of the lower mold 500, whereby the LED chip mounting area 180 is coined, and the surface of the original lead frame 10 ( It is recessed from the lower surface) by a distance _{d 3.}

  As shown in FIGS. 15A to 15C, according to this embodiment, an LED chip mounting substrate in which packages are formed on both the upper surface and the lower surface of the lead frame can be manufactured. After the dicing, the outer lead of the lead frame 10 can be bent to the height of the surface of the lower package so that it can be mounted on the external substrate. In this embodiment, the package is formed on both sides, but the present invention is not limited to this. For example, only the coining may be performed on the lower surface of the lead frame, and the package may not be formed.

  The package recess 720 can be provided with bumps or heat dissipation members as connection terminals, or can be mounted with a protective element such as a Zener diode. Note that an LED chip 80 may be provided in the package recess 720 so that both sides emit light. In this case, it can be used as a side view package.

  Next, Embodiment 5 of the present invention will be described with reference to FIGS. FIGS. 16A and 16B are configuration diagrams of the tip of the cavity pin 52b in this embodiment, FIG. 16A shows the side surface, and FIG. 16B shows the end surface (plane). A dotted line in FIG. 16B indicates an LED chip (semiconductor chip) mounted on the lead frame. As shown in FIGS. 16 (A) and 16 (B), the cavity pin 52b in the present embodiment is formed on the protrusion 52ba formed on the outer periphery of the tip surface and above the punch hole 16 (between the die pad and the lead). And a projecting portion 52bb formed at a position located at the top.

FIG. 17 is an explanatory diagram of resin sealing when the cavity pin 52b of the present embodiment is used. FIG. 17A shows a state before clamping, FIG. 17B shows a state after clamping and before resin sealing, and FIG. 17C shows a state after resin sealing. As shown in FIG. 17 (A) ~ (C) , the protruding portions 52ba, 52bb of the cavity pin 52b protrudes from the upper mold parting surface 51d by a distance _{d 4.} For this reason, when clamped, the periphery of the LED chip mounting area of the lead frame 10 is crushed by the protrusion 52ba, and the end of the punch hole 16 in the lead frame 10 is crushed by the protrusion 52bb. On the other hand, as shown in FIGS. 17B and 17C, the die pad side recess 52bc and the lead side recess 52bd formed by the protrusions 52ba and 52bb at the tip of the cavity pin 52b are the protrusions of the cavity pin 52b. The parts 52ba and 52bb are formed at a distance d ₅ (depth) larger than the protruding distance (distance d ₄ ) from the upper mold parting surface 51d. That is, the depth (distance d ₅ ) of the recesses 52 bc and 52 bd of the cavity pin 52 b is larger than the distance d ₄ . For this reason, it does not contact the lead frame 10 during clamping. Thus, the outer periphery of the cavity pin 52b where the resin 71 may enter the pad portion and the space between the die pad and the lead are strongly clamped by the protruding portions 52ba and 52bb. By performing resin sealing in this state, flashing is reliably prevented.

  18A and 18B are enlarged views of the LED chip mounting substrate in this example, FIG. 18A shows a plan view, and FIG. 18B shows a cross-sectional view. As shown in FIGS. 18A and 18B, the LED chip mounting substrate of the present embodiment includes a recess 19a formed by the protrusion 52ba of the cavity pin 52b and a protrusion 52bb of the cavity pin 52b. A recess 19b formed by the above is formed. In the LED chip mounting region 18a, the surfaces other than the recesses 19a and 19b are not crushed.

  Thus, according to the present embodiment, since the surface to be crushed by the protrusions 52ba and 52bb is small, the lead frame 10 can be crushed with a small force. Further, since most of the LED chip mounting area 18a is not crushed (the surface shape does not change), it can be used without changing the surface properties of the plating on the surface of the lead frame 10. Even with such a configuration, it is possible to effectively prevent resin flushing, and it is possible to reliably ensure insulation in the punched hole 16.

  In addition, the shape of the front end surface of the convex part 52a standingly arranged by the upper mold | type insert 51a of Example 2 can also be comprised similarly to the shape of the cavity pin 52b.

  Next, with reference to FIG. 19, the cavity pin in Example 6 of this invention is demonstrated. FIG. 19 is a configuration diagram of the tip of the cavity pin 52c in the present embodiment, FIG. 19 (A) shows its side surface, and FIG. 19 (B) shows its end surface (plane). As shown in FIGS. 19A and 19B, the cavity pin 52c in the present embodiment is integrally formed at the outer periphery of the front end surface and the portion located above the punch hole (between the die pad and the lead). Provided with a protruding portion 52ca. A recess is formed at the same position as the recess 52bc on the die pad side in the previous embodiment. Also in the present embodiment, the lead frame can be crushed with a small force since the surface crushed by the protruding portion 52ca is small as in the fifth embodiment. Further, since most of the LED chip mounting area is not crushed (the surface shape does not change), it can be used without changing the surface properties of the plating on the surface of the lead frame. Even with such a configuration, resin flash can be effectively prevented, and insulation in the hole can be reliably ensured.

  In this embodiment, as shown in FIGS. 19A and 19B, the protruding portion 52ca is formed on the right side of the tip, but the present invention is not limited to this. On the contrary, the protrusion may be formed on the left side of the tip as long as the outer periphery of the tip surface and the end of the punch hole can be pressed. A recess can be formed only at the same position as the recess 52bd on the lead side.

  According to each of the above-described embodiments, it is possible to effectively prevent resin flash by forming an LED chip mounting region by coining, and to provide an LED chip mounting substrate and a method for manufacturing the same that ensured insulation of a hole. Can do. Moreover, the LED package as a final product manufactured from such an LED chip mounting substrate can be provided. Furthermore, the metal mold | die for manufacturing the board | substrate for LED chip mounting can be provided.

  The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described as the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

10 Lead frame 12 Die pad 13 Lead 16 Hole 18 LED chip mounting area 51 Upper mold insert 52 Cavity pin 61 Lower mold insert 71 Resin 80 LED chip 91 Transparent resin

Claims (5)

A mold for an LED chip mounting substrate,
An upper mold for holding a lead frame including a die pad and leads from the upper surface side;
A lower mold for pressing the lead frame from the lower surface side,
The upper mold is
A first member having a parting surface;
Wherein is composed of a first member and another member, wherein a predetermined amount from the parting plane have a protrusion protruding comprises a second member for clamping the LED chip mounting area of the lead frame by the protruding portion,
When the lead frame is resin-sealed, the mold clamps the lead frame with the upper mold and the lower mold, so that the LED chip mounting region is separated from the surface of the lead frame by a predetermined depth. to ulcers only the mold, characterized in that. 2. The mold according to claim 1, wherein the second member has a plurality of cavity pins provided so as to correspond to a plurality of LED chip mounting regions of the lead frame. The second member includes a first insert having a plurality of the protruding portions provided to correspond to a plurality of LED chip mounting regions of the lead frame, and a second insert disposed on an upper surface of the first insert. The mold according to claim 1, wherein The second member has the protrusion and a recess formed by being surrounded by the protrusion, and the protrusion is formed on the outer periphery of the clamp surface of the LED chip mounting region. The mold according to any one of claims 1 to 4, wherein the mold is formed on the inner side of the outer periphery. A method of manufacturing an LED chip mounting substrate configured to mount a plurality of LED chips,
Forming a lead frame having a die pad for electrical connection to the first electrode of the LED chip and a lead for electrical connection to the second electrode of the LED chip;
And clamping the lead frame using the upper and lower dies, and ulcers of the LED chip mounting area of the lead frame only the surface from a predetermined depth of the lead frame,
Fill the hole between the die pad and the lead of the lead frame with resin ,
The upper mold is
A first member having a parting surface;
A second member configured by a member separated from the first member and having a protrusion protruding from the parting surface by a predetermined amount, and clamping the LED chip mounting region by the protrusion;
A method of manufacturing an LED chip mounting board, comprising: