JP2009206370A - Substrate for led package, method for manufacturing substrate for led package, molding metal mold for substrate for led package, led package and method for manufacturing led package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for an LED package which allows a lens portion of an LED to be easily molded. <P>SOLUTION: The substrate for the LED package is the one before a plurality of light emitting chips are mounted thereon, and includes a lead frame 10 for mounting the plurality of the light emitting chips and a resin 71 filled into a lead formation hole 20 of the lead frame 10 to insulate a pair of electrodes of each light emitting chip from each other. The resin 71 is a thermosetting resin, and contains a filler mainly made up of aluminum nitride. The lead frame 10 includes a reflector formed of a resin 71 on a mounting surface of the light emitting chip, and also provided with a lower package formed of a resin 71 on the surface of the light emitting chip on the opposite side from the mounting surface. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an LED package substrate and an LED package. The present invention also relates to an LED package substrate manufacturing method, an LED package manufacturing method, and an LED package substrate mold.

  Conventionally, a light emitting diode (LED) that emits light by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode is known.

  Japanese Unexamined Patent Application Publication No. 2006-253344 (Patent Document 1) describes an LED lead frame and an injection mold used for insert molding. This LED lead frame is formed by punching out a die pad portion, an inner lead portion, and the like, and a lead frame capable of mounting an LED is formed by insert molding in the vicinity of the die pad portion of the lead frame.

Japanese Patent Laid-Open No. 2006-351970 (Patent Document 2) discloses a liquid thermosetting resin formed by a transfer molding method in which an optical chip such as a light emitting diode element is disposed after a reflector is formed on a lead frame by injection molding. A method for manufacturing a resin-encapsulated optical chip is described in which a lens portion is used and a sealing portion that covers the element and the reflector is formed.
JP 2006-253344 A JP 2006-351970 A

    However, for example, in the case of the LED lead frame described in Patent Document 1, since the resin is insert-molded only in the vicinity of the die pad portion, the punched hole remains in the peripheral portion of the mold portion, and the outer A lead is formed. For this reason, when trying to mold a light emitting chip by using such LED lead frame, for example, by transfer molding, the resin flows out from the cavity through the hole to the periphery of the LED package, and an extra cleaning work is required. It becomes necessary.

    In the case of a silicone resin suitable for forming the lens portion of the LED package, since the viscosity is low, the silicone resin flows out through the gap and the hole between the mold and the lead frame clamped. It is easy to form a flash on the parting surface and the non-sealed part of the lead frame, and an extra work such as deburring is required, which is likely to reduce productivity.

    For example, in the injection molding in which the reflector is molded by the method for manufacturing a resin-encapsulated optical chip described in Patent Document 2, a thermoplastic resin is generally used. It is known that this thermoplastic resin is likely to deteriorate due to irradiation with ultraviolet rays and cause defects such as cracking and discoloration. For this reason, in the resin-encapsulated optical chip manufactured by such a manufacturing method, there is a possibility that the above-described problem may occur in the reflector due to ultraviolet rays emitted from the light emitting diode.

    Accordingly, an object of the present invention is to provide an LED package substrate and an LED package that can solve the above-described problems and can easily mold an LED lens. Another object of the present invention is to provide a method for manufacturing the LED package substrate, a method for manufacturing the LED package, and a mold for the LED package substrate.

    An LED package substrate according to an aspect of the present invention is an LED package substrate before mounting a plurality of light emitting chips, and includes a lead frame for mounting the plurality of light emitting chips and a pair of the light emitting chips. In order to insulate between the electrodes, a thermosetting resin filled in the holes of the lead frame is included.

    The LED package substrate manufacturing method according to another aspect of the present invention is a method for manufacturing an LED package substrate before mounting a plurality of light emitting chips, wherein the leads for mounting the plurality of light emitting chips are provided. Forming a plurality of holes in the frame; and filling the plurality of holes with a thermosetting resin by transfer molding.

  According to another aspect of the present invention, there is provided a mold for an LED package substrate, comprising: a plurality of first cavities for forming a reflector for reflecting light from a light emitting chip; and a lead having a plurality of holes formed therein. An upper mold that presses the frame from the upper surface side, and a lower mold that includes a plurality of second cavities for forming a lower package of the LED package, and presses the lead frame from the lower surface side. The mold is thermally cured to the first cavity, the second cavity, and the plurality of holes of the lead frame by clamping the lead frame with the upper mold and the lower mold and resin molding. The resin is filled.

    The LED package according to another aspect of the present invention includes a light emitting chip that emits light by applying a forward bias between a pair of electrodes, a lead frame on which the light emitting chip is mounted, and the pair of the light emitting chips. In order to insulate the electrodes, a thermosetting resin filled in the holes of the lead frame and a translucent resin that seals the light emitting chip to form a lens portion are included.

    According to another aspect of the present invention, there is provided a method of manufacturing an LED package, comprising: forming a plurality of holes in a lead frame; and filling the plurality of holes in the lead frame with a thermosetting resin by transfer molding; Forming a LED package substrate; mounting a plurality of light emitting chips on the LED package substrate; sealing the plurality of light emitting chips with a translucent resin; and forming a lens portion of the LED package. Steps.

    Other objects and advantages of the present invention are illustrated in the following examples.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate for LED package and LED package which can shape | mold the lens part of LED easily can be provided, solving the above problems.

  In addition, according to the present invention, it is possible to provide a method for manufacturing the LED package substrate, a method for manufacturing the LED package, and a mold for the LED package substrate that can solve the above-described problems. it can.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

    FIG. 1 is an overall structural diagram of a lead frame in the first embodiment. FIG. 1A is a plan view of the lead frame, and FIG. 1B is a side view thereof.

    Reference numeral 10 denotes a lead frame. The lead frame 10 is made of, for example, a copper alloy having a white plating layer of silver or silver alloy formed on the surface thereof, and is provided for mounting a plurality of light emitting chips. As will be described later, a plurality of light emitting chips are mounted on the lead frame 10 and resin molding is performed by transfer molding, and then dicing to complete a plurality of LED packages (light emitting devices).

    Reference numeral 20 denotes a lead forming hole (a punching hole). A plurality of lead formation holes 20 are formed by punching out the lead frame 10 by press working at each mounting position of a light emitting chip 90 (see FIGS. 7 and 8), which will be described later, to form an inner lead. The lead forming hole 20 is provided to insulate between a pair of electrodes of the light emitting chip, that is, to insulate between inner leads 13 and 14 (see FIG. 2) described later.

    As shown in FIG. 1A, each of the plurality of lead formation holes 20 formed in the lead frame 10 has the same size and shape. Each of these lead formation holes 20 is formed substantially the same as the size of the outer shape of one LED package in this embodiment, and constitutes a part of one LED package.

    However, as described later, a plurality of light emitting chips can be mounted on one LED package. In this case, for example, as in the region 150, one light emitting chip is mounted in each of the four lead forming holes 20 to constitute one LED package.

    Reference numeral 18 denotes a half edge. The half edge 18 functions as a part of the gate for allowing the resin injected from the gate of the mold during the transfer molding described later to pass through the lead forming hole 20. The half edge 18 is provided in order to prevent the resin filled in the lead formation hole 20 from falling off due to the gate break.

As shown in FIG. 1B, the lead frame 10 is formed in a flat plate shape.
FIG. 2 is an enlarged view of a main part of the lead frame according to the first embodiment. 2A is an enlarged plan view of the lead frame, FIG. 2B is a sectional view taken along the line BB, FIG. 2C is a sectional view taken along the line CC, and FIG. 2D is an enlarged bottom view of the lead frame. is there. In FIG. 2B, the left side of the drawing is the upper surface side of the lead frame, and the right side is the lower surface side of the lead frame.

    As shown in FIGS. 2A to 2D, a half edge 12 is formed at a part of the edge of each lead forming hole 20. Specifically, the half edge 12 is formed in a shape such that each lead forming hole 20 is convex toward the lower surface in the BB cross section of FIG. The half edge 12 is provided in order to ensure that the resin filled in the lead forming hole 20 is in close contact with the lead frame 10, that is, to improve the bondability between the resin and the lead frame.

    In this embodiment, the half edge 12 is formed only at a part of the end portion of the lead frame 10 constituting the lead forming hole 20. However, the present invention is not limited to this, and the half edge 12 can be formed in a portion other than the region shown in FIG. 2, or the half edge 12 can be formed in the entire circumference of the lead forming hole 20.

    In this embodiment, as shown in FIG. 2A, the half edge 12 is formed on the upper surface side of the lead frame 10, but the present invention is not limited to this. 10 may be formed on the lower surface side so that each lead forming hole 20 is convex toward the upper surface in the BB cross section of FIG. Further, instead of the half edge 12, the edge of the lead forming hole 20 is formed in a shape that is convex or concave toward the lead forming hole 20 in the AA cross section or the BB cross section of FIG. It is also possible to adopt a configuration that improves the bondability of the lead frame.

    Reference numerals 13 and 14 denote inner leads. The inner lead 13 is formed in a shape extending to the substantially central portion by the lead forming hole 20 and used as a die pad for mounting a light emitting chip. The other inner lead 14 is formed in a shape extending to a position where the inner lead 13 is sandwiched by each lead forming hole 20. A gold wire of the light emitting chip is bonded to the inner lead 14.

    The light-emitting chip is an LED element that includes a pair of electrodes, an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light by applying a predetermined voltage with a forward bias between these electrodes. For this reason, for example, when the inner lead 13 is connected to the cathode electrode of the light-emitting chip, the inner lead 14 and the anode-side electrode of the light-emitting chip are bonded with a gold wire or the like to emit light from the anode-side lead frame. Electrical connection is made between the anode electrode of the chip.

    In this embodiment, since two wires are connected to one electrode of the light emitting chip, two inner leads 14 are provided. However, the present invention is not limited to this, and the number of wires may be one or three or more. Although the lead frame on the inner lead 13 side is described as being on the cathode side, the present invention is not limited to this, and the inner lead 13 may be on the anode side depending on the type of light emitting chip. In this case, the lead frame on the side where the inner lead 14 is provided is the cathode side. Further, for example, the light-emitting chip to be mounted may be a flip-chip type. The light-emitting chip is disposed so as to straddle the lead forming hole 20, and the electrodes disposed on the lower surface of the chip are bonded to the inner lead 13 and the inner lead 14. And implement.

    FIG. 3 is a cross-sectional view showing a state of resin sealing in the present embodiment. The left side of FIG. 3 shows a state before resin sealing, and the right side of FIG. 3 shows a state after resin sealing. As shown in the figure, the lead frame 10 is resin-sealed by transfer molding.

    Reference numeral 50 denotes an upper mold as a first mold for determining the shape of the resin filled in the lead frame 10. In the upper mold 50, a plurality of cavities 60 (first cavities) for forming a reflector that reflects light from the light emitting chip are formed at the same interval as the plurality of lead forming holes 20 formed in the lead frame 10. Has been. The upper mold 50 presses the lead frame 10 from the upper surface side so that the plurality of lead formation holes 20 and the plurality of cavities 60 overlap during resin molding.

    Similarly, 51 is a lower mold as a second mold. In the lower mold 51, a plurality of cavities 61 (second cavities) for forming the lower package of the LED package are formed at the same intervals as the plurality of lead forming holes 20. The lower mold 51 presses the lead frame 10 from the lower surface side so that the plurality of lead forming holes 20 and the plurality of cavities 61 overlap during resin molding.

    The mold according to the present embodiment (hereinafter also simply referred to as “metal mold”) is mainly composed of an upper mold 50 and a lower mold 51. At the time of resin molding, the lead frame 10 is clamped (sandwiched) by the upper mold 50 and the lower mold 51, and the plurality of cavities 60, the plurality of cavities 61, and the plurality of lead forming holes 20 are overlapped to form a resin. 71 is filled to form a first molding portion to be described later.

    Reference numeral 70 denotes a resin tablet obtained by molding a thermosetting resin or the like into a tablet (column) shape. At the time of resin molding, as shown on the right side of FIG. 3, the resin tablet 70 is put into the pot 81 of the preheated lower mold 51 and melted, and the plunger 80 is moved upward to pump the melted resin 71. Thus, the space between the upper mold 50 and the lower mold 51 is filled with the resin 71. The plunger 80 is configured to be slidable up and down along the pot 81 by a transfer mechanism (not shown). In addition, it replaces with the resin tablet 70 and liquid thermosetting resin can also be supplied with a dispenser (not shown). Further, the parting surfaces of the upper mold 50 and the lower mold 51 are covered with a release film (not shown), and then resin is supplied, and the lead frame is formed by the upper mold 50 and the lower mold 51 via the release film. 10 can also be clamped.

    When the resin 71 is pumped by the plunger 80, the molten resin 71 passes through the cull 65, the runner 66, the gate 67, and the half edge 18, and the lead forming hole 20, the cavity 60 (first cavity), and the cavity 61 (second cavity). Specifically, since each lead forming hole 20 communicates with each other through the through gate 64, the resin 71 can be supplied also to each cavity 60, 61 communicated with the lead forming hole 20. For this reason, the resin 71 is sequentially supplied toward the lead forming hole 20 and the cavities 60 and 61 far from the lead forming hole 20 and the cavities 60 and 61 near the gate 67.

    In this way, the resin tablet 70 is melted to become the resin 71 and is injected into the space formed by the upper mold 50 and the lower mold 51. As a result, as shown on the right side of FIG. 3, the space between the upper mold 50 and the lower mold 51 is filled with the resin 71.

    As the resin 71 of the present embodiment, for example, an epoxy resin having a property of transmitting light (translucency) is used for reasons described later. However, it is not limited to this, The thermosetting resin which has translucency like a silicone resin, and another thermosetting resin can also be used.

    Further, unlike the translucent resin 75 described later, the resin 71 contains a filler. As this filler, for example, a material mainly composed of aluminum nitride (AlN) for light reflection and heat dissipation is used. When a filler mainly composed of aluminum nitride is contained, the color of the resin 71 in which the white filler is included in the translucent resin is white as a whole, and the light from the light emitting chip is effectively reflected. At the same time, since the thermal conductivity is high, the heat generated by the light emitting chip can be efficiently conducted to the outside and dissipated. The filler is not limited to aluminum nitride, and the resin 71 may contain other filler. Further, the color of the resin 71 is not limited to white, and may have other colors.

    In addition, the broken line shown as 160 in FIG. 3 of the LED package (light emitting device) of this embodiment formed by sealing a light transmitting chip (silicone resin) after mounting the light emitting chip, as will be described later. The sealing shape is shown.

    FIG. 4 is a structural diagram of the upper mold 50 used in this embodiment. 4A is a cross-sectional view of the upper mold 50, and FIG. 4B is a plan view of the upper mold 50 as viewed from below.

    In the upper mold 50, a cavity 60, a through gate 64, a cull 65, a runner 66, and a gate 67 are formed in a concave shape having respective shapes and sizes. In the upper mold 50, a region surrounded by a cavity 60 formed in an annular shape in plan view is a clamping surface for clamping the lead frame 10. With this clamping surface, as shown in FIG. 3, each mounting position of the light emitting chip in the lead frame 10 is clamped on the mounting surface (front surface) side.

    FIG. 5 is an enlarged view showing a state of resin sealing in the first embodiment. FIG. 5A shows a state before resin sealing, and FIG. 5B shows a state after resin sealing. Further, the range shown in FIG. 5 corresponds to a component part of one LED package which is the final product in this embodiment.

    In the lower mold 51, a region surrounded by the cavity 61 is a clamping surface for clamping the lead frame 10. By this clamping surface, each mounting position of the light emitting chip in the lead frame 10 is clamped on the back surface side (see FIG. 3). For this reason, the lead frame 10 is clamped from above and below by the clamp surfaces of the upper mold 50 and the lower mold 51, so that flashing at the mounting position of the light emitting chip is prevented, and defective mounting of the light emitting chip can be prevented. Become.

    When resin molding is performed using the upper mold 50 and the lower mold 51, the resin tablet 70 is supplied to the pot 81 and the lead frame 10 is mounted on the mounting portion. The die 51 is closed and the lead frame 10 is clamped.

  In this case, as shown in FIG. 5A, cavities 60 and 61 and a through gate 64 are formed between the upper mold 50 and the lower mold 51. In addition, a lead forming hole 20 is formed in the lead frame 10. For this reason, by operating the transfer mechanism as described above and pumping the resin 71, the through gate 64, the cavities 60 and 61, and the lead forming hole 20 that are in communication with each other are filled with the resin. To go.

    In this state, as shown in FIG. 3, since the resin 71 flows through the through gate 64 that directly communicates between the adjacent lead forming holes 20, the cavities 60, 61 and the lead forming holes 20 are resin-molded. The As a result, the resin 71 is filled in the lead forming hole 20, the through gate 64, and the cavities 60 and 61.

    FIG. 5B shows a state in which the resin 71 is filled in the cavities 60 and 61 and the lead forming hole 20. Since the through gate 64, the cavities 60 and 61, and the lead forming hole 20 are connected to each other and communicated with each other, all of these spaces are filled at once by the resin 71 flowing from the through gate 64, and the first molding is performed. Part is formed. Subsequently, in order to cure the filled resin 71, a predetermined time is waited to open the upper mold 50 and the lower mold 51 in the closed state. Next, after the resin-molded LED package substrate is carried out, the parting surface of the mold is cleaned, and one resin molding is completed. Thereby, an LED package substrate (hereinafter also simply referred to as “substrate”) having the first molded portion is formed.

    In the present embodiment, the first molding part is integrally formed with an inter-lead closing part that closes the lead forming hole 20, a reflector, and a lower package. The resin 71 cured in the cavity 60 on the upper surface side of the lead frame 10 constitutes a reflector. The reflector is formed on the mounting surface of the light emitting chip in the lead frame 10 and has a function of reflecting light from the light emitting chip upward. This reflector also has the effect of improving the strength of the LED package.

    The resin 71 cured in the cavity 61 on the lower surface side of the lead frame 10 constitutes the lower package of the LED package. The lower package is formed on the surface of the lead frame 10 opposite to the mounting surface of the light emitting chip. By forming this lower package, the strength of the LED package can be improved. Further, since the lead frame 10 is sandwiched between the lower package and the reflector, the inter-lead blocking portion formed integrally with the lower package and the reflector is securely joined to the lead frame 10.

    Note that the cavity 60 for forming the reflector and the cavity 61 for forming the lower package are both formed in an annular shape on the lead frame 10. In order to clarify this, the broken lines shown in FIGS. 5A and 5B indicate that the cavity 60 (reflector) and the cavity 61 (lower package) are annular.

    The lead forming hole 20 (in other words, between the inner leads 13 and 14) provided to insulate the pair of electrodes of the light emitting chip is filled with the resin 71 so that the lead forming hole 20 is closed in an insulated state. By forming the blocking portion, these electrodes can be reliably insulated from each other.

  FIG. 6 is an enlarged view of a main part of an LED package substrate formed by filling the lead frame of this embodiment with resin. 6A is an enlarged plan view of the LED package substrate, FIG. 6B is a BB sectional view, FIG. 6C is a CC sectional view, and FIG. 6D is an LED package substrate. It is an enlarged bottom view.

  As shown in FIG. 6A, the reflector made of the resin 71 is formed in an annular shape on the upper surface of the lead frame 10 so that the inside has a mortar shape. Although the reflector of a present Example is circular in both the inner periphery and outer periphery, it is not limited to this. Either the inner periphery or the outer periphery of the reflector may be rectangular. Moreover, both the inner periphery and outer periphery of a reflector can also be made into a rectangular shape.

    6B is a cross-sectional view showing a cut surface along the line BB in FIG. 6A, and shows the same direction as FIG. 5B. FIG. 6C is a cross-sectional view taken along the line CC in FIG. 6A and is perpendicular to the cross section of FIG.

    As shown in FIG. 6D, the lower package made of the resin 71 is formed in a rectangular shape on the lower surface of the lead frame 10. The lower package of this embodiment has a rectangular shape on both the inner periphery and the outer periphery, but is not limited to this. Either the inner periphery or the outer periphery of the lower package may be annular. Moreover, both the inner periphery and outer periphery of a lower package can also be made into a ring shape. Further, the lower package may have a shape other than the annular shape with the central portion removed. For example, the central portion may be filled with the resin 71 and may have a rectangular or circular shape in plan view.

    As described above, the reflector and the lower package can adopt various shapes. That is, the cavities 60 and 61 of the upper mold 50 and the lower mold 51 that form the reflector and the lower package can similarly adopt various shapes.

    FIG. 7 is an overall structural diagram of the LED package substrate in the present embodiment. FIG. 7A is a plan view of the LED package substrate, and FIG. 7B is a side view thereof.

  The LED package substrate shown in FIG. 7 is an LED package substrate before mounting a plurality of light emitting chips. In this LED package substrate, a plurality of lead forming holes 20 are filled with resin 71 to form an inter-lead blocking portion, and a plurality of reflectors and a lower package are formed from the resin 71 on the upper and lower surfaces of the lead frame 10. Has been. As described above, the LED package substrate has a structure in which a plurality of light emitting chips (LEDs) can be mounted at mounting positions provided inside the plurality of reflectors.

  The resin 71 cured by the through gate 64 remains on the LED package substrate shown in FIG. The resin 71 filled and cured in the through gate 64 may be removed by a gate break before the resin molding of the translucent resin in the next step, or the translucent property may be left as it is. A resin mold of resin can also be used. In this case, when the gate break is performed and the resin molding described later is performed, the through gate of the mold can be formed at the same position as the through gate 64. On the other hand, when the next resin molding is performed without gate break, the through gate of the mold needs to be larger than the through gate 64 so that the resin 71 cured with the through gate 64 can be molded with the resin.

  FIG. 8 is an explanatory diagram for explaining a cross-sectional shape of the LED package in the present embodiment. FIG. 8A shows a state before filling with the translucent resin, and FIG. 8B shows a state after filling with the translucent resin.

  As shown in FIG. 8A, the LED package substrate in which the inter-lead blocking portion, the reflector, and the first molded portion of the lower package are formed of the resin 71 before filling with the translucent resin, A light emitting chip 90 (LED: Light-Emitting Diode) is mounted on the inner lead 13.

    The light emitting chip 90 is a semiconductor chip that emits light of a specific color by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode. The emission color varies depending on the material used for the light emitting chip. For example, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, and the like are used.

    A cathode electrode is provided on the back surface (die pad mounting surface) of the light emitting chip 90. For this reason, the anode electrode provided on the surface of the light emitting chip 90 mounted on the inner lead 13 is electrically connected to the inner lead 14. Specifically, the anode electrode of the light emitting chip 90 and the inner lead 14 of the lead frame 10 are connected by a wire 92 such as gold.

    Thereafter, the LED package substrate on which the light emitting chip 90 is mounted is placed on the placement portion of the lower mold 53, and a liquid translucent resin 75 is supplied to the pot 81 by a dispenser (not shown). The upper mold 52 and the lower mold 53 are closed, and the substrate is clamped as shown in FIG. Although not shown in the figure, the parting surfaces of the upper mold 52 and the lower mold 53 are covered with a release film (not shown), and the upper mold 52 and the lower mold are interposed via the release film. The LED package substrate can also be clamped at 53. Subsequently, the plunger 80 is moved up to pump the translucent resin 75, and the translucent resin 75 is supplied into the cavity 68 and filled. Subsequently, the translucent resin 75 filled in the cavity 68 is cured to form a second molded part having a lens part, and the light emitting chip 90 is sealed therein.

    At this time, the translucent resin 75 may be filled only on the upper surface side of the LED package substrate. For this reason, the lower mold 53 is not formed with a cavity for filling the translucent resin 75, but is formed with a cavity for accommodating the lower package formed of the resin 71 as the previous process. The cavity and the lower package forming cavity 61 need only have substantially the same shape, but the lower cavity housing cavity is made slightly larger than the lower package forming cavity 61 for housing. It can also be made easier.

    As the translucent resin 75, a silicone resin having translucency and thermosetting is used. Further, unlike the resin 71, the translucent resin 75 is used without containing a filler such as aluminum nitride in order to transmit light of the light emitting chip. Note that silicone resin is suitable for sealing the light emitting chip 90 because it has a property that its translucency is less likely to be lowered by ultraviolet rays or heat than an epoxy resin, for example. The translucent resin 75 is not limited to a transparent color, and a resin colored with red or the like may be used as long as it has translucency.

    As shown in FIG. 8, the cavity 68 includes a lens cavity 68a for forming the lens portion of the LED package, and an upper package cavity 68b for forming a rectangular portion of the upper package that covers the entire surface of the reflector. Since the cavity 68 of this embodiment is formed so as to cover all the reflectors formed of the resin 71, when the light-transmitting resin 75 is filled in the cavity 68, the reflector and the The upper surface side of the LED package substrate including the light emitting chip 90 is sealed with a translucent resin 75. FIG. 8B shows a state where the inside of the cavity 68 is filled with a translucent resin 75.

    In the LED package substrate of this embodiment, the lead forming hole 20 is filled with the resin 71 to form the inter-lead blocking portion. Therefore, during the transfer molding of the translucent resin 75, the translucent resin 75 is the upper metal. It flows through the space between the mold 52 and the upper surface of the LED package substrate, and the translucent resin 75 does not touch the mounting portion of the lower mold 53. Therefore, the mounting portion of the lower mold 53 can be filled with the translucent resin 75 without being contaminated with the translucent resin 75 and resin molded.

    Subsequently, in order to harden the translucent resin 75 filled in the cavity 68, the mold is closed for a predetermined time, and the upper mold 52 and the lower mold 53 are opened. Next, the substrate on which the second molding portion is formed is carried out, the surfaces of the upper mold 52 and the lower mold 53 are cleaned, and one resin mold is completed.

    Thus, according to the manufacturing method of the substrate for LED package of the present embodiment, the space between the inner leads 13 and 14 is closed by the inter-lead blocking portion, so that the substrate mounting portion and the LED package in the lower mold 53 are Since the non-sealing portion used as the external terminal in the substrate for the substrate can be filled with the translucent resin 75 without being contaminated by the translucent resin 75, the steps such as mold cleaning and deburring of the substrate are simplified. Can be

  FIG. 9 is an enlarged view of the LED package in this embodiment. 9A is a plan view of the LED package, FIG. 9B is a BB cross-sectional view, and FIG. 9C is a CC cross-sectional view.

  As shown in FIG. 9A, when viewed from above, the LED package is covered with a second molded portion made of a translucent resin 75.

    FIG. 9B is a cross-sectional view showing a cut surface along the line BB in FIG. 9A, and shows the same direction as FIG. 8B. FIG. 9C is a cross-sectional view taken along the line CC in FIG. 9A and is perpendicular to the cross section of FIG. 9B. As shown in FIG. 9C, after the lead frame 10 is cut and divided, the both ends of the lead frame 10 are bent downward to form the terminal portion of the LED package. Details of the terminal portion will be described later.

  FIG. 10 is an overall structural diagram of the LED package before division in the present embodiment. FIG. 10A is a plan view of the LED package before division, and FIG. 10B is a side view thereof.

  As shown in FIG. 10, the lead frame 10 is formed with an LED package composed of a plurality of upper packages (translucent resin 75) and lower packages (resin 71). In this state, as illustrated in FIG. 10, the LED packages in the lead frame 10 are cut and diced along a broken line extending in the left-right direction and a broken line extending in the up-down direction, and a plurality of LEDs are diced. Make packages one by one.

  FIG. 11 is an enlarged cross-sectional view showing the LED package in this embodiment. FIG. 11A is an operation explanatory diagram of the LED package (light emitting device), and FIG. 11B is a diagram showing a modification of the lead shape.

  As shown in FIG. 11A, when a forward bias is applied to the light emitting chip 90, the light emitting chip 90 emits light (upward arrow in the figure). The light emitted from the light emitting chip 90 is mainly emitted directly to the outside through the translucent resin 75 (lens portion). However, a part of the light emitted from the light emitting chip 90 is emitted toward the resin 71 (reflector) containing the filler, reflected by the resin 71 (reflector), and emitted outside. Thus, by providing the reflector, the light emission efficiency of the light emitting chip 90 can be improved. Further, as in this embodiment, the light emitting efficiency of the light emitting chip 90 can be further improved by forming the reflector with the resin 71 containing a white filler.

  Further, as shown in FIG. 11A, after the lead frame 10 is diced, the terminal portion of the LED package is formed by a J-bend that is bent downward. The distal end side of the terminal portion is bent so as to be positioned under the lower package (resin 71). The tip of the terminal portion serves as an electrode for electrical connection between the LED package and the external substrate. In the present embodiment, the terminal portion of the LED package is mounted on the printed circuit board 180 via the solder 95. However, the present invention is not limited to this, and the LED package of this embodiment can be mounted on a surface other than the printed board.

  At this time, since aluminum nitride is contained as the filler, the resin 71 has good heat dissipation. Therefore, the heat inside the LED package is efficiently transferred to the external printed circuit board 180 via the reflector (resin 71), the inter-lead blocking part (resin 71), the lower package (resin 71), the terminal part, and the solder 95. Heat is released. By providing the terminal structure shown in FIG. 11A, a temperature rise due to the light emitting chip 90 can be effectively suppressed. Further, since the terminal portion is formed by J-bending, the mounting area of the LED package can be reduced.

  FIG. 11B shows a modification of the shape of the terminal portion (lead shape) in the LED package. The terminal shape shown in FIG. 11B is called a gull wing. In this case, the outer lead portion of the lead frame 10 is extended outward in a stepped manner, and the LED package is mounted on the printed board 180 via the solder 95. According to such a configuration, repair or replacement in the event of a failure or the like of the light emitting chip 90 is facilitated.

    As described above, according to the manufacturing method of the LED package of the present embodiment, the plurality of inter-lead blocking portions provided in the lead frame, the reflector, and the first molded portion of the lower package are integrally formed by transfer molding, Since the second molding part having the lens part is also formed by transfer molding, the first molding part and the second molding part can be formed by exchanging the upper mold and the lower mold. Therefore, it is possible to efficiently manufacture a high-quality LED package having a reflector and a lens portion made of a thermosetting resin.

  Next, a second embodiment of the present invention will be described. In the embodiments after this embodiment, portions different from the above-described embodiments will be mainly described while being compared as necessary, and description of the same portions will be omitted.

    FIG. 12A is a cross-sectional view of a mold in Example 2 of the present invention. The second embodiment differs from the first embodiment in that a cavity 61 for forming a lower package is not provided in place of the lower mold 51, and the lower mold 51a in which the mounting portion of the lead frame 10 is flat. It is a point using. In the present embodiment, an LED package substrate is manufactured by the above-described LED package substrate manufacturing method using the lower mold 51a.

    FIG. 13 is an overall structural diagram of the LED package substrate in the second embodiment. FIG. 13A is a plan view of the LED package substrate, and FIG. 13B is a side view thereof.

    In the LED package substrate shown in FIG. 13, an inter-lead blocking portion and a plurality of reflectors are integrally formed of resin 71 as a first molding portion. The lower package of the first embodiment is not formed on the LED package substrate of the present embodiment, but has a structure capable of mounting a plurality of light emitting devices (LEDs). In this embodiment, an LED package is manufactured by the above-described LED package manufacturing method using this LED package substrate. In this case, since the cavity for housing the lower package is not necessary, the flat lower mold 51a is used as in the manufacture of the LED package substrate of this embodiment.

    FIG. 14 is an external configuration diagram of an LED package according to the second embodiment. 14A is a side view when viewed from one side of the LED package (A direction in FIG. 14B), FIG. 14B is a bottom view of the LED package, and FIG. 14C is FIG. It is a side view when it sees from the C direction (perpendicular to the A direction).

  In the LED package of this embodiment, the second molded portion is formed on the upper surface side of the lead frame 10 so as to cover the reflector, but the lower package is not formed. For this reason, as shown in FIGS. 14A to 14C, a plane constituted by the planar inner leads 13 and 14 and the resin 71 filled in the lead formation holes 20 is the bottom surface of the LED package. Become. As shown in FIG. 14B, each of the inner leads 13 and 14 divided into two parts by the resin 71 becomes an external connection terminal connected to the anode electrode or the cathode electrode, and is directly soldered to a printed board (not shown). Is done. For this reason, unlike the above embodiment, the process of processing the lead for forming the terminal can be omitted.

    A broken line in FIG. 14B indicates a half edge 12 a formed on the lead frame 10. In the case of the LED package in which the lower package is not formed as in this embodiment, the half lead 12a is formed on the lower surface side of the lead frame 10, and the inner lead 13 is formed by the resin 71 and the reflector that wraps around the half edge. , 14 is more preferable. This is to prevent the lead frame 10 serving as the anode electrode or the cathode electrode from dropping from the resin 71. However, the half edge 12 a may be formed on the upper surface side of the lead frame 10 as long as the bondability between the lead frame 10 and the resin 71 is sufficient.

  According to the present embodiment, the same object as that of the above-described embodiment can be achieved, and further, an LED package having a smaller volume than that of the LED package of Embodiment 1 can be configured.

    Next, Embodiment 3 of the present invention will be described.

  FIG. 12B is a cross-sectional view of a mold in Example 3 of the present invention. The third embodiment is different from the second embodiment in that the upper mold 50a is not provided with a cavity 60 for forming a reflector. In the present embodiment, an LED package substrate is manufactured by the above-described LED package substrate manufacturing method using the upper mold 50a and the lower mold 51a.

    In the LED package substrate of the present embodiment, only the inter-lead blocking portion is formed of the resin 71 as the first molding portion. In this case, the molten resin is supplied to the lead forming hole 20 through the runner 66 and the gate 67. Resin 71 is supplied to the lead formation holes 20 other than the lead formation hole 20 directly connected to the gate 67 through a through gate 64 that communicates with each other.

    Although the reflector and lower package of the said Example are not formed in the board | substrate for LED packages of a present Example, it is equipped with the structure which can mount a some light emitting device (LED). In the present embodiment, an LED package is manufactured by the same LED package manufacturing method as in the second embodiment, using the LED package substrate. In this case, since the reflector is not formed on the upper surface of the LED package substrate, the height of the upper package cavity 68b can be designed freely. For this reason, for example, the upper package part excluding the lens part in the LED package shown in FIG. 14 can be formed extremely thin.

    According to the present embodiment, the same object as that of the above-described embodiment can be achieved, and it is possible to configure an LED package having a smaller volume than the LED package of the second embodiment.

    Next, a fourth embodiment of the present invention will be described.

  FIG. 15 is an overall configuration diagram of the lead frame in the present embodiment. FIG. 15A is a plan view of the lead frame, and FIG. 15B is a side view thereof. As shown in FIG. 15, the lead frame 10a of this embodiment is different from the lead frame 10 of the above-described embodiment in that a through gate 21a is provided.

  FIG. 16A is a cross-sectional view showing a state of resin sealing in this example. This figure has shown the state just before resin sealing. For this reason, the resin tablet 70 is supplied in the pot 81.

    The lead frame 10a of this embodiment is clamped by an upper mold 50b and a lower mold 51a and resin molded. Neither the upper die 50b nor the lower die 51a is formed with a cavity and a through gate as in the above embodiment. Instead, as shown in the figure, a through gate 21a composed of half edges connecting adjacent lead formation holes 20 to which resin 71 is supplied from one gate 67 is formed as a lead frame 10a. Is formed in a substantially upper half region. For this reason, the resin 71 supplied to the lead forming hole 20 directly connected to the gate 67 through the cal 65, the runner 66, and the gate 67 passes through the through gate 21a formed in the lead frame 10a. All the lead forming holes 20 of the lead frame 10a are filled.

    According to such a configuration, the same object as that of the above-described embodiment can be achieved. Further, since the resin 71 as the through gate 21a is filled in the plate thickness of the lead frame 10a to form a flat plate, the gate break of the through gate 64 is not necessary, and the manufacturing process of the LED package substrate is simplified. It becomes possible.

    In this embodiment, the through gate 21a is formed in the upper half of the lead frame 10a. Alternatively, the through gate 21a may be formed in the lower half of the lead frame 10a.

  FIG. 17 is an overall structural diagram of the LED package substrate in the present embodiment. FIG. 17A is a plan view of the LED package substrate, and FIG. 17B is a side view thereof. In the LED package substrate of this embodiment, as shown in FIG. 17A, the through gate 21a is also filled with the resin 71. In this embodiment, the reflector and the lower package as in the above embodiment are not formed. For this reason, as shown in FIG. 17B, when the LED package substrate is viewed from the side, the entire surface is the same as the thickness of the lead frame 10a and has a flat plate shape.

  As described above, according to the present embodiment, since the through gate 21a is provided in the lead frame 10a, it is not necessary to form a through gate in the mold, and a mold for manufacturing an LED package substrate can be provided at low cost. can do.

    Next, Embodiment 5 of the present invention will be described with reference to FIG.

  FIG. 16B is a cross-sectional view showing a state of resin sealing in this example. This figure has shown the state just before resin sealing. The present embodiment is the same as the structure of the fourth embodiment in that a through gate is provided in the lead frame. However, the lead frame 10b of the present embodiment is different from the fourth embodiment in that the lead frame 10b of the present embodiment is provided with a through gate 21b having a through hole penetrating between the upper surface and the lower surface of the lead frame instead of a half edge.

    In the present embodiment, as in the fourth embodiment, the lead frame 10b is clamped by the flat upper mold 50b and the lower mold 51a, and the cavity and the through gate are formed in both the upper mold 50b and the lower mold 51a. It has not been.

    Similar to the lead formation hole 20, the through gate 21b formed in the lead frame 10b penetrates between the upper surface (the surface that contacts the upper mold 50b) and the lower surface (the surface that contacts the lower mold 51a). Yes.

  According to the present embodiment, the same object as that of the above-described embodiment can be achieved. Furthermore, since the through gate is provided in the lead frame similarly to the fourth embodiment, the through gate is formed in the mold. There is no need, and a mold for manufacturing an LED package substrate can be easily provided. Further, since the cross-sectional area of the through gate of this embodiment is relatively large, the resin 71 can be easily poured into all the lead formation holes 20.

    Next, Embodiment 6 of the present invention will be described with reference to FIGS. The LED package of the present embodiment is a map type LED package having a plurality of light emitting chips, and is different from the first to fifth embodiments in that there are a plurality of light emitting chips included in one LED package.

  FIG. 18 is a cross-sectional view showing a state of resin sealing in this example. This figure has shown the state just before resin sealing.

    A region 150 surrounded by a broken line in FIG. 18 is a cross-sectional region corresponding to the region 150 shown in FIG. In the LED package of this embodiment, four light emitting chips are mounted. However, the number of light emitting chips included in one LED package is not limited to this, and an arbitrary number of light emitting chips of two or more can also be included. Alternatively, all the light emitting chips 90 mounted on the LED package substrate can be collectively resin-molded so that all the light emitting chips 90 are included in one LED package.

  Reference numeral 54 denotes an upper mold used for forming a reflector in this embodiment. In the upper mold 54, a cavity 60a is formed instead of the cavity 60 of the upper mold 52 of the first embodiment. As shown in FIGS. 18 and 19, the cavity 60 a is formed in a shape that forms a space in which two adjacent cavities 60 communicate with each other in a rectangular shape. The cavity 60a separates a plurality of light emitting chips arranged inside the region 150, and the resin 71 filled in the cavity 60a constitutes a reflector of the plurality of light emitting chips. Thus, the upper mold 54 of the present embodiment is different from the upper mold 52 of the first embodiment in that the cavity 60a is formed.

  55 is a lower mold used in this embodiment. The lower mold 55 is formed with a cavity 61 a instead of the cavity 61. The cavity 61a has the same planar shape as the cavity 60a shown in FIGS. The resin 71 filled in the cavity 61a constitutes a lower package capable of integrally supporting the mounting positions of the plurality of light emitting chips from the back surface side. Thus, the lower mold 55 of the present embodiment is different from the lower mold 53 of the first embodiment in that the cavity 61a is formed.

    In the present embodiment, an LED package substrate is manufactured by the above-described LED package substrate manufacturing method using the upper mold 54 and the lower mold 55. At this time, the resin 71 is supplied to the lead forming hole 20, the cavity 60 a, and the cavity 61 a through the gate 67. Since each lead forming hole 20 and the cavities 60a and 61a communicate with each other via the through gate 64, the resin 71 is sequentially supplied from the side closer to the gate 67 to all the lead forming holes 20 and the cavities 60a and 61a. Filled.

    In the mold of this embodiment, unlike the above embodiment, the adjacent lead forming holes 20 included in one LED package are communicated with each other by cavities 60a and 61a. Resin 71 is supplied through 60a and 61a. As a result, an LED package substrate whose main part is shown in FIG. 19 is formed.

    FIG. 19 is an enlarged view of the LED package substrate in the present embodiment. 19A is a plan view of the LED package substrate in the region 150, and FIG. 19B is a cross-sectional view taken along the line BB in FIG. 19A.

  Four lead formation holes 20 provided in the lead frame 10 are filled with resin 71.

    In addition, the resin 71 is also filled in the cavity 60 a formed in the upper mold 54. The resin 71 filled in the cavity 60a forms a mortar-shaped mounting position of the four light emitting chips 90 and constitutes a reflector that reflects light from the light emitting chip 90, respectively. Similar to the above embodiment, the reflector of the present embodiment is formed in a circular shape on the inner peripheral surface thereof, but is not limited thereto, and may be formed in a rectangular shape, for example.

    The resin 61 is also filled in the cavity 61 a formed in the lower mold 55. The resin 71 filled in the cavity 61a constitutes the lower package. Inside the region 150, the light emitting chip 90 is mounted at each mounting position. Although this figure shows a state in which only one light emitting chip 90 is mounted, actually, the light emitting chips 90 are mounted at all mounting positions.

  FIG. 20 is a cross-sectional view showing a state when a translucent resin is sealed in this example. FIG. 20 shows a state in which the light emitting chip 90 is mounted on the LED package substrate in which the lead forming holes 20 and the cavities 60a and 61a are sealed with the resin 71 and clamped with the mold for forming the second molding portion. .

    In this figure, reference numeral 56 denotes an upper mold used when the light emitting chip 90 is sealed with a translucent resin 75. A cavity 68 having four lens portions is formed in the upper mold 56 in this embodiment. The cavity 68 includes four lens cavities 68a constituting the lens portion of the LED package, and an upper package cavity 68b for forming a rectangular portion of the upper package that covers the entire surface of the reflector. The cavities 68 formed in the upper mold 56 are connected in a communication state via the gate 67 and the through gate 64. For this reason, as described later, the upper surface of the LED package substrate is covered with a translucent resin 75.

    Reference numeral 57 denotes a lower mold used when the light emitting chip 90 is sealed with the translucent resin 75. Since the translucent resin 75 is not sealed on the lower surface of the LED package substrate, the lower mold 57 having substantially the same shape as the lower mold 55 is used as in the above embodiment. In this embodiment, an LED package is manufactured using the upper mold 56 and the lower mold 57 by the same LED package manufacturing method as in the above embodiment.

    At this time, the LED package substrate is clamped by the upper mold 56 and the lower mold 57, and the light-transmitting resin 75 is filled in the cavity 68 and cured, whereby the plurality of light emitting chips 90 are collectively molded into the resin mold. In addition, a second molded part having a plurality of lens parts is formed. Note that a region 150 indicated by a broken line indicates a component part of one LED package including the four light emitting chips 90.

  FIG. 21 is an enlarged view of the LED package in this embodiment. This figure has shown the state when the board | substrate for LED packages is diced and isolate | separated separately. FIG. 21A is a plan view of the LED package, and FIG. 21B is a cross-sectional view showing a cut surface taken along line BB in FIG. 21A.

  As shown in FIG. 21, the upper surface of the LED package of this example is covered with a translucent resin 75. The translucent resin 75 includes a resin lens portion 75a that protrudes upward in a spherical shape and forms a hemispherical lens portion in the LED package.

  This embodiment is suitably implemented when an LED package including a plurality of light emitting chips is used. According to the present embodiment, the same object as that of the above-described embodiment can be achieved, and an LED package including a plurality of light emitting chips can be manufactured easily and with high reliability.

    In addition, the LED package of a present Example is an LED package provided with four light emitting chips, and is mounted in a printed circuit board etc. in this state. However, the final form of the LED package of the present embodiment is not limited to this. After carrying out the method of this embodiment, the LED package including four light emitting chips can be divided and mounted on a printed circuit board or the like as an LED package including only one light emitting chip.

    Next, a seventh embodiment of the present invention will be described.

  FIG. 22 is an enlarged view of a main part of the LED package of this example. FIG. 22A is a cross-sectional view of the LED package, and FIG. 22B is a side view thereof. As shown in FIG. 22, this embodiment differs from the mold of the above embodiment in that it does not have the hemispherical lens cavity 68a of the present embodiment. For this reason, the LED package of this embodiment does not have the hemispherical lens portion as in the above-described embodiments, and the upper flat surface of the upper package portion functions as a flat lens portion.

    According to the configuration of the present embodiment, the upper package portion functions as a flat lens portion instead of the hemispherical lens portion. Therefore, in an LED package that does not diffuse or converge light like a hemispherical lens. Can suppress the height of the LED package. As a result, the LED package can be mounted in a narrower space. Further, although an example in which a hemispherical lens or a flat lens is formed on the upper package has been described, a lens cavity 68a that can form other lenses such as a Fresnel lens, a cylindrical lens, or a lenticular lens may be used.

    According to the first to seventh embodiments, it is possible to provide an LED package substrate and an LED package in which an LED lens portion can be easily formed by transfer molding. Moreover, according to the said Example 1 thru | or 7, the manufacturing method of the said LED package board | substrate, the manufacturing method of the said LED package, and the metal mold | die of the said LED package board | substrate can be provided.

  In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

    For example, in the above embodiment, the configuration in which the through gate 64 is formed in the upper mold has been described. However, the present invention is not limited to this, and the through gate 64 can be formed in the lower mold. In the above embodiment, the cavities 60 and 60a for forming the reflector and the cavity 68 for forming the lens portion are formed in the upper mold, and the cavities 61 and 61a for forming the lower package are formed in the lower mold. Although the structure formed in a metal mold | die was demonstrated, this invention is not limited to this. For example, these cavities 60, 60a, 61, 61a, and 68 can be formed in a mold that is upside down from the above embodiment.

  In addition, an example in which the first molding part is formed on the lead frame 10 by transfer molding and the second molding part is formed on the LED package substrate to mold the light emitting chip 90 with resin has been described. However, the present invention is limited to this. Not. For example, the first molded portion and the second molded portion can be formed by compression molding instead of the transfer mold. Furthermore, only one of the molded parts can be formed by transfer molding, and the other molded part can be formed by compression molding.

1 is an overall structure diagram of a lead frame in Embodiment 1. FIG. FIG. 3 is an enlarged view of a main part of the lead frame in Example 1. It is sectional drawing which shows the state of the resin sealing in Example 1. FIG. 2 is a structural diagram of an upper mold used in Example 1. FIG. It is an enlarged view which shows the state of resin sealing in Example 1. FIG. FIG. 3 is an enlarged view of a main part of an LED package substrate formed by filling the lead frame of Example 1 with resin. 1 is an overall structure diagram of an LED package substrate in Example 1. FIG. 6 is an explanatory diagram for explaining a cross-sectional shape of an LED package in Example 1. FIG. 2 is an enlarged view of an LED package in Example 1. FIG. 1 is an overall structure diagram of an LED package before division in Example 1. FIG. 3 is an enlarged cross-sectional view illustrating an LED package in Example 1. FIG. (A) It is sectional drawing of the metal mold | die in Example 2, (B) It is sectional drawing of the metal mold | die in Example 3. FIG. 6 is an overall structural diagram of an LED package substrate in Example 2. FIG. 6 is an external configuration diagram of an LED package in Example 2. FIG. FIG. 6 is an overall structure diagram of a lead frame in Example 4. (A) It is sectional drawing which shows the state of the resin sealing in Example 4, and the state of the resin sealing in (B) Example 5, respectively. 6 is an overall structural diagram of an LED package substrate in Example 4. FIG. It is sectional drawing which shows the state of the resin sealing in Example 6. FIG. 10 is an enlarged view of an LED package substrate in Example 6. FIG. In Example 6, it is sectional drawing which shows a state when sealing a translucent resin. 10 is an enlarged view of an LED package in Example 6. FIG. FIG. 11 is an enlarged view of a main part of an LED package in Example 7.

Explanation of symbols

10, 10a, 10b ... lead frames 12, 12a ... half edges 13, 14 ... inner leads 20 ... lead forming holes 21a, 64 ... through gates 50, 50a, 50b, 52, 54, 56 ... upper molds 51, 51a, 53, 55, 57 ... Lower mold 60, 60a, 61, 68 ... Cavity 65 ... Cull 66 ... Runner 70 ... Resin tablet 71 ... Resin 75 ... Translucent resin 80 ... Plunger 81 ... Pot 90 ... Light emitting chip 92 ... Wire 150 ... area 180 ... printed circuit board

Claims (10)

An LED package substrate before mounting a plurality of light emitting chips,
A lead frame for mounting the plurality of light emitting chips;
An LED package substrate comprising: a thermosetting resin filled in a hole of the lead frame to insulate a pair of electrodes of the light emitting chip.     The reflector made of the thermosetting resin is formed on the surface of the lead frame on which the light emitting chip is mounted to reflect light from the light emitting chip. LED package substrate.     3. The LED according to claim 1, wherein a lower package made of the thermosetting resin is formed on a surface of the lead frame opposite to a surface on which the light emitting chip is mounted. Package substrate. The thermosetting resin includes a filler,
4. The LED package substrate according to claim 1, wherein a main component of the filler is aluminum nitride. 5. A method for manufacturing an LED package substrate before mounting a plurality of light emitting chips,
Forming a plurality of holes in a lead frame for mounting the plurality of light emitting chips; and
Filling the plurality of holes with a thermosetting resin by transfer molding, and a method of manufacturing an LED package substrate. A mold mold for an LED package substrate,
An upper mold comprising a plurality of first cavities for forming a reflector for reflecting light from the light emitting chip, and pressing a lead frame formed with a plurality of holes from the upper surface side;
A plurality of second cavities for forming a lower package of the LED package, and a lower mold for pressing the lead frame from the lower surface side,
The mold mold is formed by clamping the lead frame using the upper mold and the lower mold and resin-molding the first cavity, the second cavity, and the plurality of lead frames. A mold mold for a substrate for an LED package, wherein the hole is filled with a thermosetting resin. An LED package,
A light-emitting chip that emits light by applying a forward bias between a pair of electrodes;
A lead frame on which the light emitting chip is mounted;
In order to insulate between the pair of electrodes of the light emitting chip, a thermosetting resin filled in the hole of the lead frame;
An LED package comprising: a light-transmitting resin that seals the light-emitting chip to form a lens portion.     8. The LED package according to claim 7, wherein the translucent resin is a silicone resin. An LED package manufacturing method comprising:
Forming a plurality of holes in the lead frame;
Filling the plurality of holes of the lead frame with a thermosetting resin by transfer molding to form an LED package substrate; and
Mounting a plurality of light emitting chips on the LED package substrate;
Sealing the plurality of light emitting chips with a light-transmitting resin to form a lens portion of the LED package. The LED package manufacturing method according to claim 9, further comprising a step of dicing the LED package substrate on which the lens portion is formed.