JP2017117901A - Light-emitting device, and package and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a resin burr from being generated when forming a resin package.SOLUTION: A manufacturing method of a package for a side emission type light-emitting device includes the steps of: preparing a first heat frame 10 comprising a first upper face and a first lower face at an opposite side of the first upper face and a second lead frame 20 comprising a second upper face and juxtaposed in a lateral direction while being spaced apart from the first lead frame; forming a mold chamber by holding the first lead frame and the second lead frame between a first metal mold comprising a projection and a second metal mold comprising a gate in such a manner that the first upper face and the second upper face oppose a top face of the projection; and injecting a resin material from the gate into the mold chamber and hardening or solidifying the resin material. The first lead frame extends closer to the second lead frame than a center of the top face of the projection in the lateral direction, and the gate is located oppositely to the first lower face and farther from the second lead frame than the center of the top face of the projection in the lateral direction.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a light-emitting device, a package, and a manufacturing method thereof, for example, a light-emitting device such as a light-emitting diode, and a package used in such a light-emitting device and a manufacturing method thereof.

  In recent years, light emitting diodes (hereinafter referred to as “LEDs”) with lower power consumption have been used in place of conventional incandescent bulbs in general lighting fixtures and the like. It is expanding to various fields such as light use, lighting, and in-vehicle use.

  In such an LED, for example, an LED element is mounted on a lead frame exposed on the bottom surface of the opening of the package. This package is formed by molding a resin on a lead frame using a mold (see, for example, Patent Document 1).

  However, when the package is formed, resin burrs are generated, which may hinder the mounting of the light emitting element.

JP 2012-028743 A

  One embodiment of the present invention has been made in view of such conventional problems. An object of one embodiment of the present invention is to provide a light emitting device that suppresses the generation of resin burrs when forming a package, a package, and a method for manufacturing the same.

  A manufacturing method of a package according to an embodiment of the present invention includes a first lead frame having a first upper surface and a first lower surface opposite to the first upper surface, a second upper surface, and spaced apart from the first lead frame. A step of preparing a second lead frame juxtaposed in the lateral direction, a first mold having a convex portion, and a second mold having a gate, the first lead frame and the second lead frame, Forming the molding chamber by sandwiching the first upper surface and the second upper surface so as to face the top surface of the convex portion, and injecting a resin material from the gate into the molding chamber to cure the resin material; The first lead frame extends to the second lead frame side from the lateral center of the top surface of the convex portion, and the gate faces the first lower surface. And the lateral direction of the convex portion Than the central surface located farther from the second lead frame, a method of manufacturing a package for a side-emitting light-emitting device.

  A package according to an embodiment of the present invention includes a first lead frame having a first upper surface and a first lower surface on the opposite side, a second upper surface and a second lower surface on the opposite side, A second lead frame spaced apart from one lead frame and juxtaposed in the lateral direction; and a first element mounting recess in which the first upper surface and the second upper surface are exposed on the bottom surface; A resin molded body covering the second lower surface, wherein the first lead frame extends toward the second lead frame side from the lateral center of the bottom surface of the element mounting recess, and the resin molding The body covers a region directly below the first lower surface and is located farther from the second lead frame than the lateral center, and covers a region directly below the first lower surface and from the first region. A second region on the side close to the second lead frame And the lower surface of the first region has a recess including a protrusion inside, and the average thickness of the second region is larger than the average thickness of the first region. It is a package.

  Moreover, the light-emitting device which concerns on one Embodiment of this invention is a side light emission type light-emitting device provided with the package which concerns on one Embodiment of this invention, and the light emitting element mounted in the bottom face of the said element mounting recessed part.

  According to the above configuration, at the time of resin molding of the package, the front end side of the first lead frame is made to reach the front end side of the first lead frame with a relaxed pressure and the injection pressure of the resin material injected from the gate. It can suppress the side flapping. For this reason, it can suppress that a clearance gap arises between the convex part of a 1st metal mold | die, and a 1st lead frame, a resin material enters, and a resin burr | flash is formed. Further, since the gate is also away from the tip of the second lead frame, the resin material can be prevented from entering between the convex portion of the first mold and the second lead frame, and a resin burr can be formed. Can be suppressed.

It is the perspective view which looked at the light-emitting device which concerns on one Embodiment of this invention from diagonally upward. It is a bottom perspective view of the light emitting device shown in FIG. It is a back perspective view of the light-emitting device shown in FIG. It is the IV-IV sectional view taken on the line of the light-emitting device shown in FIG. It is sectional drawing of the injection mold which shape | molds the resin molding of the package of the light-emitting device shown in FIG. It is a schematic cross section which shows the process of shape | molding the resin molding of the package of the light-emitting device shown in FIG. 4 with the injection die. It is sectional drawing of the package manufactured at the process shown in FIG. FIG. 8 is a plan view of the package shown in FIG. 7. It is the IX-IX sectional view taken on the line of the package shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below is an example for embodying the technical idea of the present invention, and the present invention is not limited to the following unless there is a specific description. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

(Embodiment 1)
FIG. 1 is a perspective view of the light emitting device 100 according to Embodiment 1 of the present invention as viewed obliquely from above, FIG. 2 is a perspective view as viewed from obliquely below, FIG. 3 is a perspective view as viewed from the back, and FIG. Cross-sectional views of the light emitting device 100 are shown in FIG. The light emitting device 100 shown in these drawings includes a light emitting element 1 and a package 2 for mounting the light emitting element 1. Further, FIG. 5 shows an injection mold 60 at the time of resin molding of the package 2, FIG. 6 shows a process of injecting a resin material into the injection mold 60 and molding the resin, and FIG. 7 is a sectional view, FIG. 8 is a plan view of the package shown in FIG. 7, and FIG. 9 is a sectional view taken along line IX-IX in FIG.

(Package 2)
As shown in FIG. 4, the package 2 includes a first lead frame 10, a second lead frame 20, and a resin molded body 30 that holds the first lead frame 10 and the second lead frame 20. The light emitting device shown in FIG. 1 to FIG. 3 has a package 2 in a flat, substantially rectangular parallelepiped shape, and emits light by using a narrow surface disposed on the side instead of a large surface of the package 2 as a light extraction surface 2A. The light-emitting device is referred to as a so-called side view type. The side-emitting light emitting device 100 has an external connection surface 2X for externally connecting a surface intersecting the light extraction surface 2A (one of the large surfaces in the drawing).

  In the present specification, the vertical direction is specified in FIG. That is, the light extraction surface 2A of the light-emitting device 100 is referred to as an upper surface, and the surface adjacent to or intersecting with the light extraction surface 2A is referred to as a side surface 2B, which is one of the side surfaces 2B and is the lower surface in FIGS. Is referred to as an external connection surface 2X of the light emitting device. The light emitting device 100 shown in FIGS. 1 and 2 shows a state in which the light extraction surface 2A that is the upper surface in FIG. 4 is located on the front side.

(Lead frame)
The package 2 includes a first lead frame 10 and a second lead frame 20 as lead frames held by the resin molded body 30. The first lead frame 10 and the second lead frame 20 are extended in this first direction, with the length direction of the package 2 (lateral (left and right) direction in FIG. 4) as the first direction. Further, the first lead frame 10 and the second lead frame 20 are juxtaposed apart from each other in the first direction. The first lead frame 10 and the second lead frame 20 are insulated from each other via a resin that fills a separation region 19 that is a gap between them.

  The first lead frame 10 has a first upper surface 11 serving as a mounting surface on which the light emitting element 1 is mounted, and a first lower surface 12 serving as an opposite surface. In the first lead frame 10, the first upper surface 11 is partially exposed from the resin molded body 30, and the other part is embedded and fixed in the resin molded body 30. The first upper surface 11 of the first lead frame 10 includes a first exposed region 11 </ b> A exposed on the bottom surface of the element mounting recess 33 formed in the resin molded body 30 and a first coated region 11 </ b> B covered by the resin molded body 30. The first exposed region 11A is used as a mounting region where the light emitting element 1 is mounted.

  The second lead frame 20 has a second upper surface 21 that is a connection surface for electrical connection with the light emitting element 1, and a second lower surface 22 that is the opposite surface. The second lead frame 20 has the second upper surface 21 partially exposed from the resin molded body 30, and the other part is embedded and fixed in the resin molded body 30. The second upper surface 21 of the second lead frame 20 includes a second exposed region 21 </ b> A exposed on the bottom surface of the element mounting recess 33 formed in the resin molded body 30 and a second covered region 21 </ b> B covered by the resin molded body 30. The second exposed region is a connection region that is electrically connected to the light emitting element 1.

  Further, the first lead frame 10 and the second lead frame 20 extend from the inner lead portions 10A and 20A covered by the resin molded body 30 and the inner lead portions 10A and 20A and are formed on the side surface 2B of the resin molded body 30. Outer lead portions 10B and 20B are provided in the vicinity. The first lead frame 10 and the second lead frame 20 shown in FIGS. 8 and 9 are bent in an L shape at the end opposite to the separation region 19 so that the outer lead portions 10B and 20B are in the first direction. Is drawn out in a direction intersecting with respect to each other, in a direction perpendicular to the figure. In the package 2 shown in the figure, the outer lead portions 10B and 20B are both drawn out to the external connection surface 2X side, and the drawn outer lead portions 10B and 20B are further formed on the surface of the package 2 as shown in FIG. A terminal region for connection to the outside is formed by bending along the line. However, although the package is not shown, the outer lead portions of the first lead frame and the second lead frame can be drawn out in the first direction and disposed near the opposing side surfaces of the package.

  The first lead frame 10 and the second lead frame 20 are held by the resin molded body 30 so that the first upper surface 11 and the second upper surface 21 are located on the same plane. The first lead frame 10 is configured to be longer than the second lead frame 20 in the first direction that is the length direction of the package 2, that is, in the direction in which the first lead frame 10 and the second lead frame 20 face each other. ing. In other words, in the lead frame, as shown in FIG. 9, the length (L2) of the inner lead portion 20A of the second lead frame 20 is shorter than the length (L1) of the inner lead portion 10A of the first lead frame 10. doing. In the package 2 shown in the drawing, the separation region 19 between the first lead frame 10 and the second lead frame 20 is set to a center line m (in the drawing, in the first direction) of the bottom surface of the element mounting recess 33 of the package 2. It is arranged in a state of being unevenly distributed from the left and right center lines). In the package 2 shown in FIG. 4, the separation region 19 between the first lead frame 10 and the second lead frame 20 is unevenly distributed on the second lead frame 20 side (right side in the drawing). In the central region of the mounting recess 33, the light emitting element 1 is disposed in the first exposed region 11 </ b> A of the first lead frame 10.

  Further, the first lead frame 10 and the second lead frame 20 have the same structure in the outer lead portions 10B and 20B drawn out from the package 2 to the outside. The outer lead portions 10B and 20B shown in FIG. 9 include a lead portion that extends linearly from the inner lead portions 10A and 20A, and an extension portion that is connected in the middle of the lead portion and extends outward. Yes. The outer lead portions 10B and 20B shown in FIG. 9 have the lead portion cut (position indicated by a one-dot chain line in the drawing) outside the connecting portion between the lead portion and the extension portion, and as shown in FIG. Is bent along the external connection surface 2X of the package, and the extended portion is bent along the side surfaces 2B on both sides of the package so as to be externally connected. The outer lead portions 10B and 20B constitute a pair of terminal regions. In addition, a recess is formed in the resin molded body 30 so that most of the outer lead portions 10B and 20B can be accommodated inside the maximum outer shape of the resin molded body 30.

  The first lead frame 10 and the second lead frame 20 described above are made of a metal material having high electrical conductivity, such as Cu or Fe. In particular, an alloy of Cu and Fe is preferable from the viewpoint of thermal conductivity and mechanical strength. Moreover, it is preferable to coat the surface with a metal film in order to increase the reflectance. As the metal film, for example, Ag (including an Ag alloy) can be suitably used. In more detail, from the viewpoint of atomic diffusion and corrosion inhibition, it is preferable that at least Ni is contained as an underlayer of Ag, and particularly Ni is contained in the first layer (the deepest layer of the underlayer), preferably Ni / Pd or Ni / Au or Ni / Pd / Au (the order is that the Ni side is a deep layer) may be formed. As a method for forming the metal film, for example, plating is preferable.

(Resin molding 30)
The resin molded body 30 is a support body that holds the first lead frame 10 and the second lead frame 20. The base material of the resin molded body 30 is made of a resin material. The resin molded body 30 is formed in a flat, substantially rectangular parallelepiped shape. In the present specification, the “flat-shaped” resin formed body or package means a thickness that is larger than the total length (L) and depth (D) of the resin formed body 30 to the package 2 as shown in FIG. (D) indicates a dimensionally small shape.

  The resin molded body 30 includes a first molded portion 31 formed to face the first upper surface 11 of the first lead frame 10 and the second upper surface 21 of the second lead frame 20, and the first upper surface of the first lead frame 10. 11 and a second lower surface 22 opposite to the second upper surface 21 of the second lead frame 20 and a second molding portion 32 formed opposite to the second lower surface 22 of the second lead frame 20.

  In the resin molded body 30, an element mounting recess 33 for mounting the light emitting element 1 is formed in the first molding portion 31, and the element mounting recess 33 constitutes a light emitting region. The element mounting recess 33 exposes the first upper surface 11 of the first lead frame 10 and the second upper surface 21 of the second lead frame 20 on the bottom surface. It is preferable that the side wall surface of the element mounting recess 33 has a shape in which the light of the light emitting element 1 mounted on the bottom surface of the element mounting recess 33 is easily emitted to the light extraction surface 2A side of the resin molded body 30. For example, as illustrated in FIG. The inclined surface gradually expands toward the light extraction surface 2A. In addition, the resin molded body 30 supports the first lead frame 10 and the second lead frame 20 by the second molding portion 32 so as to cover the first lower surface 12 and the second lower surface 22.

(Injection mold 60)
The above resin molded body 30 is injection-molded in the process shown in FIG. 6 using the injection mold 60 shown in FIG. The injection mold 60 for molding the resin molded body 30 is divided into a first mold 61 and a second mold 62 as shown in FIGS. The injection mold 60 divided into the first mold 61 and the second mold 62 injects a resin material 68 for injection molding into a molding chamber 65 formed inside, and the resin material 68 is injected into the mold chamber 65 formed inside. The resin molded body 30 is molded by curing or solidifying.

  The first mold 61 is disposed to face the first upper surface 11 of the first lead frame 10 and the second upper surface 21 of the second lead frame 20 to form the first molded portion 31 of the resin molded body 30. The first mold 61 has a convex portion 63 that forms the element mounting concave portion 33 in the first molding portion 31. The first mold 61 is disposed in a state where the top surface of the convex portion 63 is in contact with the first upper surface 11 of the first lead frame 10 and the second upper surface 21 of the second lead frame 20. The first upper surface 11 and the second upper surface 21 of the second lead frame 20 are exposed to the bottom surface of the element mounting recess 33. This exposed portion becomes the first exposed region 11A and the second exposed region 21A.

  The second mold 62 is arranged to face the first lower surface 12 of the first lead frame 10 and the second lower surface 22 of the second lead frame 20 to form the second molded portion 32 of the resin molded body 30. Further, the second mold 62 has a gate 64 for injecting a resin material 68 so as to be continuous with the inner surface of the molding chamber 65. In the present embodiment, one gate 64 is provided for one package.

  Here, when a resin material is injected into a molding chamber of an injection mold and a resin molded body is molded, generally, the lead frame is not directly sandwiched between upper and lower molds, in other words, above and below the lead frame. In a structure with resin, resin burrs are likely to occur on the upper surface of the lead frame, in particular, on the first upper surface side of the first lead frame serving as a mounting surface. The first lead frame and the second lead frame arranged in the molding chamber are configured so that the first lead frame is longer than the second lead frame, so that the resin is injected when the resin is injected into the molding chamber. This is because the front end side of the first lead frame is likely to flutter due to the pressure. This is particularly noticeable in thermosetting resins having a low melt viscosity. For example, if a large amount of resin burrs are generated on the bottom surface of the element mounting recess, there is a problem that labor for removing the resin burrs increases. Although removal of resin burrs is generally indispensable, the larger the resin burr area, and the thicker the resin burr, the larger the removal operation proportionally, thus minimizing the generation of resin burrs. It is preferable.

  Therefore, in the manufacturing method according to the present embodiment, the position at which the resin material 68 is injected into the molding chamber 65 of the injection mold 60 during the resin injection is defined as a separation region between the first lead frame 10 and the second lead frame 20. By setting the position away from 19, the tip side of the first lead frame 10 is prevented from fluttering due to the injection pressure of the injected resin material 68.

  In order to realize this, in the present embodiment, the first lead frame 10 extends to the second lead frame 20 side from the center of the top surface of the convex portion 63 in the first direction, and the gate 64 Is on the side facing the first lower surface 12 and farther from the second lead frame 20 than the center of the top surface of the convex portion 63 in the first direction. More specifically, in the injection mold 60 shown in FIG. 5, the position of the gate 64 provided in the second mold 62 is unevenly arranged from the center line m in the first direction of the molding chamber 65. The second mold 62 shown in the figure is a position facing the first lower surface 11 of the first lead frame 10 set in the injection mold 60 and is the second mold chamber 65 of the injection mold 60. The resin material 68 is injected into the molding chamber 65 from a position that is unevenly distributed in the direction away from the separation region 19 of the first lead frame 10 and the second lead frame 20 with respect to the center line m in one direction (left and right direction in the figure). A gate 64 is provided so that it can be used. By disposing the gate 64 at this position, as shown in the schematic cross-sectional view of FIG. 6B, when the resin molded body 30 is injection-molded, the resin material 68 injected into the injection mold 60 is transferred to the first lead frame. 10 is injected to the rear end side, which is a position away from the front end side, and the front end side of the first lead frame 10 is prevented from fluttering due to the injection force of the resin material 68. The distance between the center of the gate 64 and the center line m in the first direction can be set as appropriate, and is, for example, 5% to 70% of the length (L1) of the inner lead portion 10A of the first lead frame 10. L1 is preferably 10% to 60%, more preferably 15% to 50% of L1.

  Further, as shown in FIG. 6C, the resin material 68 injected into the molding chamber 65 is gradually filled from the vicinity of the gate 64 and then filled into the entire molding chamber 65. Therefore, on the first lower surface 12 side of the first lead frame 10, first, the resin material 68 is filled on the rear end side facing the gate 64, and then the front end side (separation region 19 side) of the first lead frame 10. To spread. For this reason, when the resin material 68 reaches the vicinity of the front end portion of the first lead frame 10, the rear end side of the first lead frame 10 is filled with the resin material 68. The resin material 68 filled on the side presses the first lead frame 10 toward the convex portion 63 of the first mold 61, thereby preventing the resin material 68 from entering the upper surface side of the first lead frame 10. There is also an effect.

  As described above, the occurrence of resin burrs is suppressed on the upper surface side of the first lead frame 10. Further, since this injection position is located away from the tip of the second lead frame 20, the generation of resin burrs is also suppressed on the upper surface side of the second lead frame 20.

  Furthermore, the injection position of the resin material at the time of resin injection, that is, the position of the gate 64 is the top surface of the convex portion 63 of the first mold 61 and the first lead frame 10 in the plan view of the package 2 or the second mold 62. It is set as the position which overlaps the 1st exposed surface 11A which is the opposing area | region which opposes the 1st upper surface 11, ie, the area | region which comprises the bottom face of the element mounting recessed part 33. FIG. As a result, in the resin injection step, the pressing force acting on the first lead frame 10 in the state where the resin material 68 injected toward the first lower surface 12 of the first lead frame 10 hits the first lower surface 12 is reduced to the first pressure. It can be received by the top surface of the convex portion 63 of the first mold 61 that contacts on the upper surface 11 side. For this reason, it is suppressed that the front end side of the first lead frame 10 moves in a direction away from the convex portion 63 due to the reaction of the pressing force acting on the first lead frame 10, and a gap is formed between the convex portion 63, Generation of resin burrs can be suppressed. Further, the gate 64 may be located at a position overlapping the edge of the top surface of the convex portion 63 in the plan view of the second mold 62.

  The resin molded body 30 thus molded can have a gate mark 34 that is a mark of the gate 64 into which the resin material 68 is injected at a position where the resin material 68 is injected. The resin molded body 30 shown in FIGS. 3 and 4 has a gate mark 34 formed in the step of injecting resin into the bottom surface 2C opposite to the light extraction surface 2A. This gate mark 34 is a mark of the gate 64 for injecting a resin material into the injection mold 60 during resin molding. The “gate trace” is a concavo-convex shape formed on the resin molded body 30 as a trace of the gate 64 that is an injection port of the resin material into the injection mold 60. The shape of the gate mark 34 varies depending on the shape of the gate 64 provided in the injection molding die 60, but the injection molding die 60 shown in FIG. 5 has a cylindrical tube portion 66 connected to the molding chamber 65. 64. Therefore, the gate mark 34 formed on the resin molded body 30 in FIGS. 3 and 4 is a protrusion formed on the outer surface of the resin molded body 30 and formed inside the depression. In the package 2 according to the present embodiment, the gate mark 34 is formed on one side of the bottom surface 2C (back surface) of the resin molded body 30 and at a position unevenly distributed from the center of the bottom surface 2C.

  In this package 2, the resin molded body 30 has a gate mark 34 at the injection position of the resin material, so that the resin molded body 30 moves away from the separation region 19 between the first lead frame 10 and the second lead frame 20. It can be visually recognized that the resin material 68 has been injected from the unevenly located position and has been molded. Therefore, the light emitting device 100 can easily determine which side of the resin molded body 30 the first lead frame 10 is embedded with the gate mark 34 as a mark. Therefore, even if the outer shape and appearance of the package 2 are symmetrical left and right and up and down, the side where the first lead frame 10 and the second lead frame 20 are embedded can be easily determined from the position of the gate mark 34.

  In the package 2, a gate mark with a depression is not formed at the center of the bottom surface 2 </ b> C of the resin molded body 30. For this reason, this resin molding 30 has a high strength as a thick structure in which no depression is formed on the bottom surface side of the central portion. That is, the region of the resin molded body 30 (second molded portion 32) that covers the region directly below the first lower surface 12 and is further away from the second lead frame than the center in the first direction is the first region, the first When a region that covers the region directly below the lower surface and is closer to the second lead frame than the first region is defined as the second region, a gate mark 34 (a depression including a protrusion inside) is formed on the lower surface (bottom surface) of the first region. Therefore, the average thickness of the second region is larger than the average thickness of the first region. As shown in FIGS. 1 to 3, in the side-view type light emitting device in which the package 2 has a flat and substantially rectangular parallelepiped shape, the thickness (d) is smaller than the total length (L) of the package 2. The stress tends to concentrate at the central portion of the resin molded body 30, and if the central portion is thin, there is a possibility that a crack or the like may occur at this portion. On the other hand, in the package 2 according to the present embodiment, the gate mark 34 with the depression is disposed at a position away from the central portion of the resin molded body 30, so that the central portion can be made thick and high strength can be obtained. it can.

  Further, as shown in FIG. 3, in the structure in which the gate mark 34 remaining in the resin molded body 30 is disposed in the recess formed on the outer surface, the gate mark 34 protrudes greatly from the outer surface of the resin molded body 30. The appearance of the package can be cleaned by avoiding the above. In addition, when the resin molded body 30 is molded, the light emitting device 100 is disposed in a state in which the tip of the gate 64 provided in the second mold 62 is brought closer to the first lead frame 10 as shown in FIG. Therefore, the resin material 68 injected from the gate 64 can be more accurately injected toward a predetermined position on the first lower surface 12 of the first lead frame 10.

  The shape of the gate 64, that is, the cross-sectional shape of the resin injection port (the same applies to the gate mark 34) can be selected as appropriate, but a circular shape is preferable from the viewpoint of obtaining a large cross-sectional area with a small diameter. Further, when the space for arranging the gate 64 is limited, such as a thin package for a side-emitting type light emitting device, a flat shape, for example, an oval shape or an oval shape (semicircle on both sides of a rectangle), as in the package. Are also preferred.

(Resin material)
As the resin material constituting the resin molded body 30, for example, a resin material for injection molding is used. As such a resin material, besides a thermoplastic resin, a thermosetting resin excellent in light resistance and heat resistance can be suitably used. In particular, unsaturated polyester resins are preferred. Specific examples thereof include resins described in JP2013-153144A, JP2014-207304A, JP2014-123672A, and the like. When trying to form a resin molded body of a package by injection molding using a thermosetting resin, since the thermosetting resin has a low melt viscosity, in a configuration in which the lead frame is not directly sandwiched from above and below by an injection mold, Resin burrs are very likely to occur on the top surface of the lead frame. On the other hand, in the manufacturing method according to the present embodiment, when the resin molded body is injection-molded, the injection position of the resin material supplied to the injection mold is made a unique position, thereby generating resin burrs. Suppress. In this method, as shown in FIG. 5, the first lead frame 10 is located at a position facing the first lower surface 12 of the first lead frame 10 and with respect to the center line m of the molding chamber 65 in the first direction. The resin material is injected from a position away from the separation region 19 of the second lead frame 20. Thereby, it can suppress that the front end side of a 1st lead frame flutters by the injection pressure of a resin material, and can suppress generation | occurrence | production of a resin burr | flash. The thermoplastic resin is one of aliphatic polyamide resin, semi-aromatic polyamide resin, aromatic polyphthalamide resin, polycyclohexylenedimethylene terephthalate, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, and polycarbonate resin. One is preferred.

Moreover, the resin molding 30 can reflect the light from the light emitting element 1 efficiently, and can take out outside by raising a reflectance. For this reason, it is set as a color with high reflectance, such as white. For example, it is preferable to mix a white pigment such as titanium oxide (TiO ₂ ) or zinc oxide (ZnO) in the resin molded body 30. In particular, titanium oxide is preferable because of its excellent light hiding property. In addition, reinforcing agents or fillers such as silica, aluminum oxide, glass, potassium titanate, and calcium silicate (wollastonite) may be mixed in the resin molded body 30.

(Light emitting element 1)
The light emitting element 1 is provided with a pair of electrodes on the same surface side, and is a so-called face-up type light emitting element 1. The positive and negative electrodes of the light emitting element 1 are connected to the first lead frame 10 and the second lead frame 20, respectively. The light emitting element 1 is mounted on the first upper surface 11 of the first lead frame 10 by wire bonding or the like via the wire 3. Alternatively, flip chip (face down) mounting is also possible. The light-emitting element 1 is a semiconductor element that emits light by applying a voltage, and a known semiconductor light-emitting element made of a nitride semiconductor or the like can be applied. In addition, a light emitting element having an arbitrary wavelength may be selected in order to obtain a desired emission color. Specifically, as a light-emitting element that emits blue light (wavelength 430 nm to 490 nm) or green light (wavelength 500 nm to 570 nm), In _x Al _Y Ga _1-xy N (0 ≦ X, 0 ≦ Y, As a light emitting element that emits red light (wavelength: 610 nm to 750 nm) using a nitride semiconductor represented by X + Y ≦ 1), an arsenic compound or a phosphorous compound semiconductor represented by GaAlAs, AlInGaP, or the like is used. Further, a light-emitting element in which the emission color is changed depending on the mixed crystal ratio can be used. Further, a hexagonal substrate such as sapphire or GaN is used as a growth substrate for the semiconductor element.

  The light emitting element 1 is housed in the package 2 and mounted on the first upper surface 11 of the first lead frame 10 exposed at the bottom surface of the element mounting recess 33 of the package 2. In addition to mounting only one light emitting element 1, a plurality of light emitting elements can be mounted on the first lead frame. Alternatively, one or more light emitting elements can be mounted on each of the first lead frame and the second lead frame. When one or more light emitting elements are flip-chip mounted, they are mounted across the first lead frame and the second lead frame.

  As the light emitting element 1, light emitting diodes having various emission wavelengths can be used. In particular, in order to obtain white light emission, a nitride semiconductor light emitting element that emits blue light, a phosphor that absorbs blue light and emits yellow light, or a phosphor that absorbs blue light and emits green light and red light A method of combining with a phosphor emitting light is preferable.

(Sealing member 50)
In the light emitting device 100 shown in FIG. 4, the element mounting recess 33 is filled with the sealing member 50, and the light emitting element 1 mounted on the bottom of the element mounting recess 33 is sealed. The sealing member 50 is a member for sealing the light emitting element 1, the wire 3, and the like and protecting them from dust, smoke, moisture, external force, and the like. The sealing member 50 is filled in the element mounting recess 33 by potting, for example, and seals the element mounting recess 33. Moreover, this resin sealing can also be performed by injection molding or transfer molding.

  The material of the sealing member 50 is preferably a material that has insulating properties and can transmit light emitted from the semiconductor light emitting element. Specifically, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a hybrid resin containing one or more of these resins can be given. Among these, a silicone resin or a modified silicone resin is preferable, and a methyl-phenyl silicone resin is particularly preferable. Furthermore, the sealing member is not limited to an organic material, and an inorganic material having excellent light resistance such as glass and silica gel can also be used.

(Wavelength conversion member 40)
Further, the sealing member 50 can also include the wavelength conversion member 40. The wavelength conversion member 40 is a member that converts light having a first peak wavelength emitted from the light emitting element 1 into light having a second peak wavelength that is different from the first peak wavelength. As such a wavelength conversion member 40, a phosphor is preferably used. As such a wavelength conversion member 40, a phosphor that can be excited by light emission of the light emitting element 1 can be suitably used. Examples thereof include nitride-based phosphors and oxynitride-based phosphors mainly activated by lanthanoid elements such as europium and cerium. In particular, a YAG (Yttrium Aluminum Garnet) phosphor that emits white light when combined with a blue light emitting element is preferably used. Further, sialon that is a green phosphor, KSF that is a red phosphor, and the like can also be used. In addition, phosphors having similar performance and effects can be used as appropriate.

  With such a configuration, the light emitting device 100 can output mixed color light in which the first wavelength light emitted from the light emitting element 1 and the second wavelength light emitted from the wavelength conversion member 40 are mixed. For example, if a blue LED is used for the light emitting element and a phosphor such as YAG is used for the wavelength conversion member, the blue light of the blue LED and the yellow light fluorescence emitted from the phosphor when excited by the blue light are mixed. Thus, a light emitting device that outputs the white light can be configured.

(Side-emitting type light-emitting device)
In the above example, the example applied to the side emission type (side view type) light emitting device has been described. In this type of light emitting device, since the thickness (d) of the package 2 is small and thin, resin burrs are likely to occur during resin molding of the package 2, and the present invention can be suitably used to suppress this. For example, the present invention can be applied to a very thin light emitting device in which the thickness (d) of the package 2 is 0.25 mm to 1.50 mm, preferably 0.25 mm to 1.00 mm, more preferably 0.25 mm to 0.60 mm. . However, the present invention is not limited to a thin device such as a side-emitting type light-emitting device, and can be applied to a large-sized device such as a top-emitting type (top-view type) light-emitting device. .

(Method for manufacturing light emitting device)
Next, the manufacturing method of the above light-emitting device will be described in detail based on the cross-sectional view of the injection mold shown in FIG. 5 and the schematic cross-sectional views shown in FIGS. 6A to 6E.

(1) Setting process First, the first lead frame 10 and the second lead frame 20 cut into a predetermined shape are prepared. The first lead frame 10 and the second lead frame 20 are provided as a sheet-like lead frame sheet obtained by punching one metal flat plate. The lead frame sheet is produced, for example, by punching a metal flat plate and then applying an Ag film by plating, for example. The lead frame has a first lead frame 10 and a second lead frame 20 that form a pair of lead electrodes, and their tip portions 16 and 26 face each other with a gap. Usually, a large number of first lead frames 10 and second lead frames 20 are formed on a single metal flat plate.

  Next, the first lead frame 10 and the second lead frame 20 are set in an injection mold 60. The lead frame is disposed and sandwiched between the first mold 61 and the second mold 62 of the injection mold 60 divided into upper and lower parts. At this time, the first upper surface 11 and the second upper surface 21 are set so as to contact the top surface of the convex portion 63 of the first mold 61.

(2) Resin Injection Step In this step, a resin material 68 is injected into the molding chamber 65 of the injection mold 60 from the gate 64 of the second mold 62 as shown in FIG. 6B. As shown in FIG. 5, the resin material is located at a position facing the first lower surface 12 of the first lead frame 10 and the first lead frame 10 with respect to the center line m of the molding chamber 65 in the first direction. The second lead frame 20 is injected from a position away from the separation region 19 and overlapping the first exposed surface 11A of the first upper surface 11 in plan view. The first mold 61 has a convex portion 63 corresponding to the element mounting concave portion 33, and the top surface of the convex portion 63 is in contact with the upper surfaces of the first lead frame 10 and the second lead frame 20. The resin material 68 is injected in a state of being placed on the surface. Thereby, the 1st upper surface 11 and the 2nd upper surface 21 can be exposed to the bottom face of the element mounting recessed part 33 of the obtained resin molding 30. FIG.

  In this example, the tips of the first lead frame 10 and the second lead frame 20 are completely exposed on the bottom surface of the element mounting recess 33 of the resin molded body 30, but are not necessarily completely exposed. There is no need to be. That is, part of the first lead frame and the second lead frame may be embedded in the resin molded body on the bottom surface of the element mounting recess.

(3) Resin Molding Step As shown in FIG. 6D, the resin material 68 filled in the molding chamber 65 of the injection mold 60 is cured or solidified to form the resin molded body 30.
Thereafter, as shown in FIG. 6E, the first mold 61 and the second mold 62 are removed.

  If necessary, the resin burrs may be removed from the resin molded body 30 thus obtained. The resin burrs are applied to the bonding region when performing the wire bonding and the region for mounting the light emitting device 1 at least on the bottom surface of the element mounting recess 33 of the package 2. In other words, it is sufficient to secure a region for mounting the light emitting element 1 and obtaining an electrical connection, and it is not necessary to darely remove the resin burr in other regions. For example, the first lead frame and the second lead frame may deteriorate over time, and the reflectance may decrease. For example, when Ag is used for the metal material covering the surfaces of the first lead frame and the second lead frame, the reflectance may be lowered due to discoloration due to sulfuration. Therefore, by intentionally leaving the resin burr on the bottom surface of the recess, the area of the region exposed from the Ag resin molded body 30 is relatively reduced, thereby reducing the area where such aged deterioration occurs. In addition, the effect of suppressing the decrease in output due to aging can be expected.

(4) Mounting process The light emitting element 1 is mounted on the obtained package 2. Specifically, the light emitting element 1 is mounted using the first upper surface 11 of the first lead frame 10 as a mounting surface. As a mounting method, after bonding the light emitting element to the first upper surface 11 with an adhesive, wire bonding via the wire 3 is used. Then, the element mounting recess 33 is filled with a sealing member 50 such as a translucent resin to seal the light emitting element 1.

  In this way, after mounting and sealing the light emitting element 1 on the package 2, as shown in FIG. 9, the lead frame sheet is cut (position indicated by a one-dot chain line in the drawing), and the package 2 separated into pieces is obtained. Can be obtained.

  As described above, the light-emitting device, the package, and the manufacturing method thereof according to the embodiment of the present invention are used for a device that uses a device that requires extremely thin light-emitting components, such as a backlight of a liquid crystal display. Is available. Moreover, it can utilize for a large sized television, a billboard, an advertisement, traffic information, a three-dimensional display, a lighting fixture etc. as an LED display. Particularly, it is suitable for downsizing, cost reduction, automation, and design flexibility of the apparatus.

DESCRIPTION OF SYMBOLS 100 ... Light-emitting device 1 ... Light emitting element 2 ... Package 2A ... Light extraction surface 2B ... Side surface 2C ... Bottom surface 2X ... External connection surface 3 ... Wire 10 ... First lead frame 10A ... Inner lead part 10B ... Outer lead part 11 ... First Upper surface 11A ... first exposed region 11B ... first covered region 12 ... first lower surface 19 ... spaced region 20 ... second lead frame 20A ... inner lead portion 20B ... outer lead portion 21 ... second upper surface 21A ... second exposed region 21B Second covering region 22 Second lower surface 30 Molded resin 31 First molded portion 32 Second molded portion 33 Element mounting recess 34 Gate mark 40 Wavelength converting member 50 Sealing member 60 Injection Mold for molding 61 ... First mold 62 ... Second mold 63 ... Projection 64 ... Gate 65 ... Molding chamber 66 ... Tube portion 68 ... Resin material

Claims (16)

Preparing a first lead frame having a first upper surface and a first lower surface opposite to the first upper surface; and a second lead frame having a second upper surface and laterally juxtaposed away from the first lead frame. When,
By means of a first mold having a convex part and a second mold having a gate, the first lead frame and the second lead frame are connected to the top surface of the convex part. Forming a molding chamber sandwiched to face each other;
Injecting a resin material from the gate into the molding chamber to cure or solidify the resin material,
The first lead frame extends to the second lead frame side from the lateral center of the top surface of the convex portion,
The method for manufacturing a package for a side-emitting light-emitting device, wherein the gate is opposed to the first lower surface and is located farther from the second lead frame than the center of the lateral top surface of the convex portion. A method of manufacturing a package according to claim 1,
The package manufacturing method in which the said gate exists in the position which overlaps with the opposing area | region where the top surface of the said convex part and said 1st upper surface oppose in planar view of said 2nd metal mold | die. A manufacturing method of the package according to claim 1 or 2,
The package manufacturing method in which the said gate exists in the position which overlaps with the edge of the top surface of the said convex part in planar view of a said 2nd metal mold | die. It is a manufacturing method of the package according to any one of claims 1 to 3,
A method for manufacturing a package, wherein the first mold and the second mold are injection molds. It is a manufacturing method of the package according to any one of claims 1 to 4,
The manufacturing method of the package whose resin of the said resin material is a thermosetting resin. It is a manufacturing method of the package according to claim 5,
The manufacturing method of the package whose resin of the said resin material is unsaturated polyester-type resin. It is a manufacturing method of the package according to any one of claims 1 to 6,
The manufacturing method of the package in which the said resin material contains a titanium oxide. It is a manufacturing method of the package according to any one of claims 1 to 7,
The package manufacturing method whose thickness of the said package is 0.25 mm-1.50 mm. A first lead frame having a first upper surface and a first lower surface opposite to the first upper surface;
A second lead frame having a second upper surface and a second lower surface opposite to the second upper surface, and spaced laterally from the first lead frame;
The first upper surface and the second upper surface have one element mounting concave portion exposed on the bottom surface, the first lower surface and a resin molded body covering the second lower surface,
The first lead frame extends to the second lead frame side from the lateral center of the bottom surface of the element mounting recess,
The resin-molded body covers a region directly below the first lower surface and covers a first region located farther from the second lead frame than the center in the lateral direction, and a region directly below the first lower surface and the first surface. A second region on the side closer to the second lead frame than the one region, and a lower surface of the first region has a recess including a protrusion inside,
The package for a side-emitting light-emitting device, wherein the average thickness of the second region is larger than the average thickness of the first region. The package according to claim 9, wherein
The package is a package in a position overlapping with a region constituting a bottom surface of the element mounting recess on the first upper surface in a plan view of the package. The package according to claim 9 or 10, wherein
The protrusion in the recess is a package that is a trace of a gate for injecting a resin material during molding of the resin molded body. The package according to any one of claims 9 to 11,
The package whose resin which comprises the said resin molding is a thermosetting resin. The package according to claim 12, wherein
The package whose resin which comprises the said resin molding is unsaturated polyester resin. The package according to any one of claims 9 to 13,
The package in which the said resin molding contains a titanium oxide. The package according to any one of claims 9 to 14,
A package having a thickness of 0.25 mm to 1.50 mm; The package according to any one of claims 9 to 15,
A side-emitting light-emitting device comprising: a light-emitting element placed on the bottom surface of the element placement recess.

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