JP2014063777A - Method of manufacturing light-emitting diode package and structure thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting diode package structure exhibiting excellent heat resistance and heat dissipation.SOLUTION: A metal cup frame, an insulation layer and a lead frame are bonded in order from top to bottom. The metal cup can withstand high temperature of a light-emitting diode for a long term, and provides very good heat conduction and heat dissipation effect, thus prolonging the use-life of the light-emitting diode. Furthermore, when providing an insulation layer withstanding high temperature, the pre-process structure of a light-emitting diode package can withstand heat and is less likely to crack or deteriorate, thus reducing the damage rate and use cost of the pre-process structure of the light-emitting diode package.

Description

The present invention relates to a pre-process structure of a light emitting diode package manufactured by applying manufacturing techniques such as stamping, roughening, die bonding, bonding, and electroplating.

With the advancement of science and technology and civilization, the manufacturing technology of light emitting diodes is in a maturity trend, its application field is considerably wide, and the market demand is relatively high.

  As shown in FIG. 1, the light emitting diode package structure 6 of the prior art is composed of a reflective base 60 and a lead frame 61 that are bonded to each other vertically, and a light emitting diode chip 62 is disposed on the lead frame 61 inside the reflective base 60. The upper surface and inner wall of the reflective base 60 are electrically plated with the metal reflective layer 63, and the light emitted from the light emitting diode chip 62 is appropriately reflected by the metal reflective layer 63, thereby improving the light emitting efficiency of the light emitting diode. Let

  However, since most of the reflection bases 60 of the prior art are formed of a thermosetting resin material, the high temperature generated during the long-term operation of the light emitting diode chip can be efficiently conducted and radiated by the reflection base 60. Accordingly, the reflective base 60 is liable to cause a deterioration phenomenon, not only reducing the light emission efficiency, but also causing damage to the light emitting diode package structure and increasing the manufacturing cost.

JP 2011-34892 A JP 2007-324046 A

An object of the present invention is to provide a pre-process structure of a light emitting diode package manufactured in response to manufacturing techniques such as stamping, roughening, die bonding, bonding, and electroplating.

  Another object of the present invention is to provide a structure manufactured in a pre-process of a light emitting diode package in which a metal cup frame, an insulating layer, and a lead frame are bonded in order from top to bottom. An object of the present invention is to be able to withstand the high temperatures that are generated, to provide extremely good heat conduction and heat dissipation effects, and to extend the service life of the light emitting diode.

  Yet another object of the present invention is to provide an insulating layer that can withstand high temperatures, the pre-process structure of the light emitting diode package can withstand heat, and is less prone to cracking and degradation. The purpose is to reduce the damage rate and use cost of the structure.

  Based on the above object, the pre-process of the light emitting diode package disclosed by the present invention includes steps such as stamping, roughening, die bonding, bonding, and electroplating, and includes a metal cup base material, an insulating material, and a conductive material. Used, performing a stamping action, and opening, through-holes and conductive portions of a rectangular matrix array for accommodating and mounting the light-emitting diode chips on the metal cup base material, the insulating material, and the conductive material, respectively. The conductive portions correspond to each other, and the conductive portions are composed of pads and leads that are insulated and separated from each other, and the insulating material is composed of a soft base material in which a thermosetting resin material is bonded to each of the upper and lower sides, The surface of the thermosetting resin material adheres a protective film, and the insulating material has a structure of an insulating layer after a stamping operation.

  Subsequently, a metal cup frame of the metal cup is formed by mechanically roughening the bottom surface of the metal cup base material, wherein the metal cup base material has a plurality of apertures for accommodating light emitting diode chips to form a plurality of rectangular matrix arrays. After forming and mechanically roughening the corresponding surfaces of the upper surface of the conductive material and the bottom surface of the metal cup base material, a thermosetting resin material or a thermoplastic resin material is filled between the pad and the lead, and the A conductive material is formed as a lead frame structure.

  Subsequently, after peeling off the protective film of the insulating material, the metal cup frame, the insulating material, and the lead frame are bonded in order from the top to the bottom, and the roughened metal cup base material bottom surface and the top surface of the conductive material metal cup base material bottom surface The surfaces corresponding to each other are bonded to the thermosetting resin material on the top and bottom surfaces of the insulating layer, respectively, and finally, the metal reflective layer is plated on the metal cup top and inner surfaces, the pads and the contact surfaces of the leads and air.

  As can be seen from the preprocess of the light emitting diode package, the preprocess structure of the light emitting diode package described in the present invention includes a metal cup frame, an insulating layer, a lead frame, and a metal reflective layer. A plurality of rectangular matrix array openings are formed on the metal cup frame, and a plurality of rectangular matrix array metal cups are formed on the metal cup frame. The insulating layer is composed of a soft base material to which a thermosetting resin material is bonded up and down, and the insulating layer penetrates through holes of a plurality of rectangular matrix arrangements, of which the upper surface of the insulating layer is The plurality of through holes bonded to the bottom surface of the metal cup frame correspond to each of the plurality of openings. The lead frame is provided with a plurality of conductive portions corresponding to a plurality of openings and a plurality of through holes, and the conductive portions are composed of pads and leads that are insulated from each other, and between the pads and leads, It is filled with a thermosetting resin material or a thermoplastic resin material, and the pad and the top surface of the lead are bonded to the bottom surface of the insulating layer. The metal reflection layer is plated on the upper and lower surfaces of the metal cup, the upper and lower sides of the pads and leads, and the contact surface with air to form a pre-process structure of the light emitting diode package.

Providing a pre-process structure of a light-emitting diode package manufactured by applying manufacturing techniques such as stamping, roughening, die bonding, bonding, and electroplating. The pre-process structure of the light-emitting diode package includes a metal cup frame, insulation The layers and lead frame are bonded in order from top to bottom, and the metal cup can withstand the high temperatures that light emitting diodes generate for a long time, and provides extremely good thermal conductivity, heat dissipation effect, Extend the service life. Also, by providing an insulating layer that can withstand high temperatures, the pre-process structure of the light-emitting diode package can withstand heat and is less likely to crack and deteriorate, and the damage rate and use of the pre-process structure of the light-emitting diode package Reduce costs.

It is explanatory drawing of the package structure of the light emitting diode of a prior art. It is explanatory drawing of the pre-process stamping of the package of the light emitting diode of this invention. It is explanatory drawing of the pre-process roughening of the package of the light emitting diode of this invention. It is explanatory drawing of the pre-process die bonding of the package of the light emitting diode of this invention. It is explanatory drawing of the pre-process bonding of the package of the light emitting diode of this invention. It is explanatory drawing of the pre-process electroplating of the package of the light emitting diode of this invention. It is explanatory drawing of the structure of the front process of the package of the light emitting diode of this invention.

  Those skilled in the art will be able to understand and implement the technical contents of the present invention, and based on the contents disclosed in the present specification, claims and drawings, those skilled in the art will easily understand the related objects and advantages of the present invention. The detailed features and advantages of the present invention will now be described in detail by way of examples.

Please refer to FIG. 2, FIG. 3, FIG. 4, and FIG. The pre-process 1 of the light emitting diode package of the present invention includes the following for copper foil metal cup base material 200 (see FIG. 2), insulating material 210 (see FIG. 3) and conductive material 220 (see FIG. 4). Perform pre-process work:
As shown in FIG. 2, a plurality of openings 210 for accommodating light emitting diode chips in the metal cup base material 200 are formed in a rectangular matrix array by stamping 10 processing on the copper foil metal cup base material 200. The cross-sectional shape of the opening is a cylindrical shape or a shape narrowed downward.
Subsequently, mechanical roughening 11 is performed on the bottom surface of the metal cup base material 200 to form a rough surface 202 on the bottom surface of the metal cup base material 200 to increase the contact area. When the roughening effect formed by the mechanical roughening 11 method is not good, a chemical roughening 11 ′ operation is performed on the rough surface 202 (polishing with a chemical polishing liquid and blacking with an oxidizing agent). And roughening the brown surface 202 to roughen the rough surface 202) to form a rough surface 202 'with a very good roughening effect.
The metal cup base material 200 that has undergone the stamping 10, the mechanical roughening 11 or the further chemical roughening 11 ′ becomes the metal cup frame 20 of the metal cup 203 having a plurality of rectangular matrix array openings.

As shown in FIG. 3, the insulating material 210 pre-process operation is a rectangular matrix in which a plurality of openings 210 corresponding to the openings of the metal cup base material are accommodated in the insulating material 210 by stamping 10 processing. Form in an array. The cross-sectional shape of the opening is a cylindrical shape or a shape narrowed downward.
The insulating material 210 is composed of a flexible base material 2100 bonded with a thermosetting resin material 2101 on the upper and lower sides, and a protective film 2102 is bonded to the outer surface of the thermosetting material 2101. The structure of the insulating layer 21 is obtained through the work process of the stamping 10.

As shown in FIG. 4 (see also FIG. 2), stamping 10 work is performed on the conductive material, and the conductive material 220 corresponds to the place where the light-emitting diode chip is mounted.

A conductive portion 221 having a plurality of matrix arrangements is formed, and the conductive portion 221 includes pads 2210 and leads 2211 that are electrically insulated from each other. Subsequently, a mechanical roughening 11 operation is performed on the corresponding surfaces of the upper surface of the conductive material 220 and the bottom surface of the metal cup frame 20 to form a rough surface 222 to increase the contact area. When the roughening effect formed by the mechanical roughening 11 method is not good, the chemical roughening 11 ′ operation is further performed on the roughened surface 222, and the roughened surface 222 ′ having a good roughening effect is obtained. Form.
Subsequently, the die bonding 12 operation is performed between the pad 2210 and the lead 2211, and the thermosetting or thermoplastic resin material 3 (the thermosetting material is an epoxy resin or a silica resin, and the thermoplastic material is polyphthalate). An amide (Polyphthalamide, PPA) or polyamide (Polyamide, PA) is filled between the pad 2210 and the lead 2211 to insulate the pad 2210 and the lead 2211 from each other. Among them, the conductive material 220 that has undergone the stamping 10, mechanical roughening 11 or further chemical roughening 11 ′, and die bonding 12 has the structure of the lead frame 22.

As shown in FIG. 5 (refer to FIG. 3 together), the bonding 13 operation is performed on the metal cup frame 20, the insulating layer 21, and the lead frame 22.
Before the bonding 13 work, first, after peeling off the protective film 2102 on the surface of the thermosetting resin material 2101 of the insulating layer 21, the metal cup frame 20, the insulating layer 21, and the lead frame 22 are adhered in order from top to bottom. The thermosetting material 2101 firmly meshes the corresponding surfaces of the bottom surface of the metal cup frame 20 that has been roughened and the bottom surface of the metal cup frame 20 on the top surface of the lead frame 22 with each other.

  Next, refer to FIG. As can be seen from the figure, the metal cup frame 20, the insulating layer 21, and the lead frame 22 are bonded to each other, and then the electric plating 14 is further performed, and the upper and inner surfaces of the metal cup 203, the pads 2210 and the leads 2211, the air One metal reflective layer 4 is plated on the contact surface. The metal reflective layer 4 is a structural layer composed of a single layer or multiple layers of copper, silver, nickel, palladium, gold, or chromium, and improves the reflection degree of light emitted from the light emitting diode, thereby improving the luminous efficiency of the light emitting diode. improves.

  Therefore, as can be seen based on the preprocess 1 of the light emitting diode package, the preprocess structure 2 of the light emitting diode package of the present invention is composed of the following:

  In the metal cup frame 20, a plurality of openings 201 for receiving light emitting diodes are formed in a rectangular matrix arrangement in the metal cup frame 20. A plurality of metal cups 203 having a cylindrical cross-section or a shape narrowed downward are formed in the opening.

The insulating layer 21 is composed of a flexible base material 2100 bonded with a thermosetting resin material 2101 on the upper and lower sides. The insulating layer 21 has a rectangular matrix arrangement corresponding to the opening of the metal cup frame and a hollow cylindrical shape. Alternatively, the plurality of through holes 211 having a cross-sectional shape narrowed downward are penetrated, the upper surface of the insulating layer 21 is bonded to the bottom surface of the metal cup frame 20, and the plurality of through holes 211 are formed in the plurality of metal cup frames 20. The openings 201 correspond to each other.

A plurality of conductive portions 221 corresponding to the plurality of openings 201 and the plurality of through holes 211 of the metal frame and the insulating layer are installed on the lead frame 22, and the conductive portions 221 are mutually connected. The pad 2210 and the lead 2211 are electrically insulated from each other, and between the pad 2210 and the lead 2211, there is a thermosetting or thermoplastic resin material 3 (the thermosetting material is an epoxy resin). Alternatively, silica resin, the thermoplastic material is filled with polyphthalamide (PPA) or polyamide (Polyamide, PA), and the top surfaces of the pad 2210 and the lead 2211 are bonded to the bottom surface of the insulating layer 21. Is done.

  The metal reflection layer 4 is plated on the upper and inner surfaces of the metal cup 203, the pads 2210 and the upper and lower sides of the leads, and the contact surface with air, and constitutes the pre-process structure 2 of the light emitting diode package.

  Finally, refer to FIG. FIG. 7 illustrates an example in which the pre-process structure 2 of the light emitting diode package packages the light emitting diode chip 5. As can be seen from the figure, during the long-term operation of the light-emitting diode chip 5, a high temperature is generated. At this time, the copper foil metal cup 203 has a high heat resistance characteristic, which facilitates the pre-process structure 2 of the light-emitting diode package. The manufacturing cost is reduced and the operating rate is improved. At the same time, the heat conduction coefficient of copper provides a very good heat conducting and radiating transmission medium, extending the service life of the light emitting diode chip 5.

  Further, the insulating layer 21 has high temperature resistance so that the pre-process structure 2 of the light emitting diode package is not easily cracked or deteriorated, and the damage rate is reduced.

  In the present invention, the preferred embodiments have been disclosed as described above, but these are not intended to limit the present invention in any way, and anyone who is familiar with the technology can make an equivalent scope without departing from the spirit and scope of the present invention. Of course, various fluctuations and hydration colors can be added.

DESCRIPTION OF SYMBOLS 1 Pre-process of a light emitting diode package 10 Stamping 11 Mechanical roughening 11 'Chemical roughening 12 Die bonding 13 Bonding 14 Electroplating 2 Structure of the pre-process of a light emitting diode package 20 Metal cup frame 200 Metal cup base material 201 Opening 202 Rough surface 202 ′ Rough surface 203 Metal cup 21 Insulating layer 210 Insulating material 2100 Soft substrate 2101 Thermosetting material 2102 Protective film 211 Through hole 22 Lead frame 220 Conductive material 221 Conducting portion 2210 Pad 2211 Lead 222 Rough surface 222 ′ Rough Surface 3 Thermosetting or thermoplastic material 4 Metal reflective layer 5 Light emitting diode chip 6 Light emitting diode package structure 60 Reflective base 61 Lead frame 62 Light emitting diode chip 63 Metal reflective layer

Claims (15)

The following steps:
Stamping processing is performed on the metal cup base material, the insulating material, and the conductive material, which are base materials for mounting the light emitting diode,
Forming a plurality of openings in the rectangular matrix arrangement to accommodate the light-emitting material odd chip with respect to the metal cup base material and the insulating material,
The insulating material is composed of a soft base material to which a thermosetting material is bonded up and down, and has a protective film on the outer surface of the thermosetting material,
For the conductive material, a conductive portion composed of pads and leads for the light emitting orod chip is electrically separated from each other.
After the stamping process,
The metal cup base material is mechanically roughened on the bottom surface, and the metal cup base material is a metal cup frame of a metal cup in which a plurality of openings form a plurality of rectangular matrix arrays,
Roughening is performed to mechanically roughen the corresponding surfaces of the conductive material upper surface and the metal cup base material,
A die bonding step in which a thermosetting material or a thermoplastic material is filled between the pad and the lead of the conductive portion to make the conductive material a lead frame structure; and
After the protective film on the surface of the thermosetting material of the insulating layer is peeled off, the metal cup frame, the insulating layer, and the lead frame are bonded in order from top to bottom, and the metal cup substrate bottom surface and the metal cup on the top surface of the conductive material are subjected to roughening. A bonding step in which the bottom surface of the base material and the surface corresponding to each other are respectively bonded to the top surface of the insulating layer and the thermosetting material on the bottom surface,
After the metal cup frame, the insulating layer, and the lead frame are bonded in order, the metal plating layer is plated on the upper and lower surfaces of the metal cup, the pads and the leads, and the contact surface with the air;
A method for manufacturing a light emitting diode package comprising:   The method of manufacturing a light emitting diode package according to claim 1, wherein the metal cup base material is a copper foil.   The method of manufacturing a light emitting diode package according to claim 1, wherein the flexible substrate is polyimide (PI). The thermosetting material is an epoxy resin or a silica resin, and the thermoplastic material is polyamide (Polyamide, PA) or polyphthalamide (Polyphthalamide,
2. The method of manufacturing a light emitting diode package according to claim 1, wherein the light emitting diode package is PPA. After performing mechanical surface roughening on the metal cup base material bottom surface and the surface corresponding to the metal cup base material bottom surface of the conductive material upper surface, chemical roughening work is performed,
The method of manufacturing a light-emitting diode package according to claim 1, wherein the chemical roughening operation is performed by polishing using a chemical polishing liquid and then performing blackening and browning steps using an oxidizing agent. 2. The method of manufacturing a light emitting diode package according to claim 1, wherein the metal reflective layer is a structural layer made of a single layer or multiple layers of copper, silver, nickel, palladium, gold, or chromium. 2. The method of manufacturing a light emitting diode package according to claim 1, wherein a cross-sectional shape of the plurality of openings formed in the metal cup base material by a stamping step is a columnar shape or a shape in which a lower portion is narrowed. 2. The method of manufacturing a light emitting diode package according to claim 1, wherein a plurality of through-hole cross-sectional shapes formed on the insulating material by a stamping step are a columnar shape or a shape in which a lower portion is narrowed. A metal cup frame, wherein a plurality of openings for accommodating light emitting diodes are formed in a rectangular matrix arrangement in the metal cup frame;
It is an insulating layer composed of a base material bonded with a thermosetting material on the upper and lower sides, and in the insulating layer, a plurality of through holes for accommodating light emitting diodes are formed in a rectangular matrix arrangement,
The top surface of the insulating layer is bonded to the bottom surface of the metal cup frame, and the plurality of through holes are insulating layers corresponding to the plurality of openings of the metal cup frame,
A lead frame having a plurality of conductive portions corresponding to the plurality of openings and the plurality of through holes on the lead frame, wherein the conductive portions are pads for mounting light-emitting diode chips separated and insulated from each other; And a lead frame that is composed of a lead, and is filled with a thermosetting material or thermoplastic between the pad and the lead, and the upper surface of the pad and the lead is bonded to the bottom surface of the insulating layer;
A metal reflective layer on which a contact surface with air is plated, and upper and lower surfaces of the metal cup, pads and leads;
A light emitting diode package structure comprising: The light emitting diode package structure according to claim 9, wherein the metal cup base material is a copper foil. The structure of a light emitting diode package according to claim 9, wherein the flexible substrate is polyimide (PI). The thermosetting material is an epoxy resin or a silica resin, and the thermoplastic material is polyamide (Polyamide, PA) or polyphthalamide (Polyphthalamide,
The structure of a light emitting diode package according to claim 9, which is PPA). The light emitting diode package structure according to claim 9, wherein the metal reflective layer is a structural layer made of a single layer or multiple layers of copper, silver, nickel, palladium, gold, or chromium. 10. The light emitting diode package structure according to claim 9, wherein a cross-sectional shape of the plurality of openings on the metal cup frame is a circular shape or a shape in which a lower portion is narrowed. The structure of the light emitting diode package according to claim 9, wherein a cross-sectional shape of the plurality of through holes formed by the insulating layer is a circular shape or a shape in which a lower portion is narrowed.

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