JP2010109119A - Light emitting module, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that it is difficult to make a conventional light emitting module compact and thin because of a structure of a reflector. <P>SOLUTION: In the light emitting module 1, a reflector 2 is composed of, for example, an aluminum plate 10 and a white resin 11. Then the reflector 2 is stuck on an upper surface of an insulating layer 6, and the reflector 2 has a reflecting function, a dam function of reserving a fluorescent resin body, and a supporting function as a frame. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting module having a reflector and a method for manufacturing the same.

  As conventional examples, the following light emitting modules 31 and 41 are known.

  As shown in FIG. 8, wiring patterns 33 are formed on the front and back surfaces and side surfaces of an insulating printed board 32 made of glass epoxy resin or the like. The LED chip 34 is fixed to the upper surface of the wiring pattern 33, and the electrode of the LED chip 34 is electrically connected to the wiring pattern 33 through the metal thin wire 35. The LED chip 34 and the fine metal wire 35 are sealed with a transparent sealing resin 36, and a reflector 37 is disposed on the upper surface of the printed board 32 so as to surround the transparent sealing resin 36 (see, for example, Patent Document 1). ).

As shown in FIG. 9, an insulating resin 43 is coated on the upper surface of a metal substrate 42 made of aluminum, and a conductive pattern 44 is formed on the upper surface of the insulating resin 43. A plurality of light emitting elements 45 (LED elements) are respectively fixed to the upper surface of the conductive pattern 44, and the electrodes of the light emitting elements 45 are electrically connected to the conductive pattern 44 through the fine metal wires 46. For each unit, the light emitting element 45 and the fine metal wire 46 are covered with a light transmissive resin 47. A connection portion 48 is disposed around the metal substrate 42, and a transparent substrate 49 is disposed on the upper surface of the connection portion 48. A gas is sealed in a space formed by the metal substrate 42, the connection portion 48, and the transparent substrate 49, and deterioration of the light emitting element 45 is prevented (see, for example, Patent Document 1).
JP 2006-310505 A (page 4-5, FIG. 1-2) JP 2006-100773 (page 4-5, FIG. 1)

  As shown in FIG. 8, in the conventional light emitting module 31, a reflector 37 is disposed around the transparent sealing resin 36. In the light emitting module 31, the transparent sealing resin 36 is arranged independently without being bonded to the reflector 37. Specifically, a gap W3 is formed between the side surface of the transparent sealing resin 36 and the reflector 37, and the reflector 37 is not used as a dam part for storing the transparent sealing resin 36. Further, the reflector 37 is higher than the transparent sealing resin 36 by a height T4. With this structure, it is difficult to narrow the formation area of each unit, and there is a problem that it is difficult to reduce the size and thickness of the light emitting module 31 itself.

  Furthermore, in the light emitting module 31, the main material which comprises the printed circuit board 32, and the main material which comprises the reflector 37 differ, and those linear expansion coefficients are also different. And the printed circuit board 32 and the reflector 37 each repeat expansion and contraction by the heat released from the LED chip 34. As a result, the expansion and contraction amounts of the printed circuit board 32 and the reflector 37 differ depending on the difference in linear expansion coefficient, and there is a problem that the printed circuit board 32 and the reflector 37 are separated.

  In addition, when a conventional light emitting module is used in a lighting device such as a backlight of a TV, the brightness of one LED element is insufficient, and thus a large number of LED elements are mounted on the lighting device. And LED element discharge | releases a lot of heat at the time of irradiation, and when the heat | fever is not discharge | released outside a light emitting module, there exists a problem that the performance of an LED element falls early.

  For example, as shown in FIG. 9, even when a metal substrate 42 is used, the upper surface of the metal substrate 42 is covered with an insulating resin 43 so that the heat emitted from the light emitting element 45 (LED element) can be efficiently converted to metal. It is difficult for the light to be transmitted to the substrate 42, and a decrease in luminance of the light emitting element 45 becomes a problem. Similarly, there is a problem that the resin 47 deteriorates due to the released heat.

In the light emitting module of the present invention, an insulating layer, a wiring layer formed on the upper surface of the insulating layer,
A reflector bonded on one main surface of the metal substrate; a light emitting element electrically connected to the wiring layer exposed from the opening of the reflector; and a resin body that embeds the opening. The surface of the reflector is higher than the surface of the light emitting element, and the resin body is bonded to the reflector exposed in the opening. Therefore, in the present invention, the reflector has a reflection function of reflecting light from the light emitting element, a function as a dam part for storing a resin body, and a support function as a frame body, so that the light emitting module is thin. Is realized.

  In the method for manufacturing a light emitting module of the present invention, an insulating layer is formed on the upper surface of the metal substrate, a wiring layer is formed on the insulating layer, and then a reflector having a plurality of openings is attached to the upper surface of the insulating layer. And a step of electrically connecting a light emitting element on the wiring layer exposed from the opening, forming a resin body in the opening so as to embed the light emitting element, and then peeling the metal substrate The metal substrate is made of the same metal as the metal part constituting the reflector. Therefore, in the present invention, the linear expansion coefficient between the metal substrate and the reflector is approximated, so that the reflector can be prevented from warping.

  In the present invention, the reflector has not only a reflection function but also a support function as a frame. With this structure, the light emitting module can be thinned.

  In the present invention, the light emitting element is fixed in the opening of the reflector and filled with the fluorescent resin body. With this structure, the reflector also has a function as a dam portion, and the light emitting module can be reduced in size and thickness.

  Moreover, in this invention, the opposing area | region of the wiring layer as a land area | region and the metal part of a reflector increases. With this structure, heat can be radiated through the reflector, and the heat dissipation of the light emitting module is improved.

  In the present invention, an insulating sheet is bonded to the back side of the insulating layer. With this structure, moisture resistance and the like are improved, and the product quality of the light emitting module is improved.

  In the present invention, a curved surface is formed around the end of the opening on the bonding surface side of the reflector. With this structure, the fluorescent resin body bites into the reflector side of the opening side surface, whereby an anchor effect is obtained.

  Moreover, in this invention, a burr | flash is formed in the reflection surface side of a reflector around the edge part of an opening part. With this structure, variation in the opening area of the opening of each unit is suppressed, and variation in the amount of light in the entire light emitting module is prevented.

  Moreover, in this invention, the material of the metal part which the metal substrate used for a manufacturing process and a reflector comprise is the same material. By this manufacturing method, the linear expansion coefficients of both members are approximated, and the reflector is prevented from warping.

  Below, the light emitting module which is the 1st Embodiment of this invention is demonstrated with reference to FIGS. 1-3. FIG. 1A is a perspective view for explaining a light emitting module. FIG. 1B is a cross-sectional view taken along line AA shown in FIG. FIG. 2A is a plan view for explaining a wiring pattern. FIG. 2B is a cross-sectional view for explaining the light emitting module. FIG. 3A is a cross-sectional view for explaining a reflector used in a light emitting module. 3B and 3C are cross-sectional views for explaining the light emitting module.

  First, as shown in FIG. 1 (A), the light emitting module 1 is mainly configured by a reflector 2 to form a thin frame, thereby realizing a reduction in thickness. Moreover, in the light emitting module 1, it can suppress that the peeling phenomenon of a frame arises at the time of high temperature because a frame consists of the reflector 2. FIG. And the light emitting element 4 is arrange | positioned in the some opening part 3 opened by the reflector 2, respectively. The plurality of openings 3 are arranged at regular intervals in the longitudinal direction of the single plate-like reflector 2. The plurality of light emitting elements 4 are connected in series in the longitudinal direction to ensure a predetermined amount of light, and are used for general lighting fixtures, TV backlights, and the like.

  An insulating sheet 5 and an insulating layer 6 are disposed on the lower surface of the reflector 2 to constitute the light emitting module 1. For example, the light emitting module 1 has a thickness T1 of about 0.5 mm to 2.0 mm, a width W1 of about 5 mm to 20 mm, and a length L1 of about 10 cm to 50 cm.

  Note that external connection terminals connected to an external power source are formed at both ends of the reflector 2 in the longitudinal direction. This terminal may be a plug-in type connector, may be one in which wiring is soldered to a conductive pattern, or may be a flexible sheet (TAB sheet) on which electrodes and wiring are formed.

  Next, as shown in FIG. 1B, an insulating layer 6 such as an epoxy resin is disposed on the insulating sheet 5. The insulating sheet 5 is a film material having excellent heat resistance, and is made of, for example, polyethylene naphthalate, polycarbonate, polyethylene terephthalate, polyvinyl petital, or the like. The insulating sheet 5 prevents moisture from entering the insulating layer 6, and prevents corrosion of the wiring layers 7 </ b> A to 7 </ b> C on the insulating layer 6 and deterioration of the light emitting element 4. The insulating sheet 5 is not necessarily an essential constituent member. For example, the insulating sheet 5 can be omitted depending on the use state of the light emitting module 1 as in the case where the light emitting module 1 itself is directly disposed on a metal substrate such as an aluminum substrate.

Next, the insulating layer 6 is made of a resin mixed with a filler such as Al ₂ O _{3 and} has a film thickness of about 50 μm. And a lot of fillers are mixed in the insulating layer 6, and the thermal resistance of the insulating layer 6 is reduced. The insulating layer 6 includes, for example, about 70% to 80% by volume of filler.

  Next, the wiring layers 7 </ b> A to 7 </ b> C are formed on the upper surface of the insulating layer 6. The wiring layers 7A to 7C are patterned by selectively wet-etching a conductive foil such as a copper foil, for example. In each opening 3, wiring layers 7A (land regions) for fixing at least the light emitting elements 4 and wiring layers 7B and 7C connected to the thin metal wires 8 are formed. As described above, the light emitting elements 4 arranged in the individual openings 3 are connected in series via the wiring layers 7B and 7C below the reflector 2. The wiring layers 7A to 7C include a land to which the light emitting element is fixed and an electrode portion to which a thin metal wire is connected.

  Next, the reflector 2 is bonded onto the insulating layer 6 via a bonding sheet (adhesive sheet) 9. The reflector 2 is configured by applying a white resin 11 on the upper surface of the aluminum plate 10. And the white resin 11 is arrange | positioned at the reflective surface side of the reflector 2, the light irradiated from the light emitting element 4 is reflected efficiently, and the brightness | luminance of irradiated light is improved further. Moreover, the brightness | luminance fall accompanying the temperature rise of the light emitting element 4 and the brightness | luminance fall by the performance fall of the light emitting element 4 are suppressed by the said reflection efficiency being raised.

  For example, the aluminum plate 10 is prepared in a wound state, and when extending from the state, the front and back surfaces are roughened. Thereafter, the white resin 11 is applied to the surface side of the aluminum plate 10 to improve the adhesion between them. The bonding sheet 9 is a sheet using an insulating adhesive resin such as an epoxy resin or a polyimide resin, and the back side of the aluminum plate 10 is also roughened to improve the adhesion between them.

  Next, the opening 3 is formed in a circular shape, for example, with respect to the reflector 2 and the bonding sheet 9. The width W2 (diameter) of the opening 3 is slightly larger than the light emitting element 4 to be fixed. For example, if the width of the light emitting element 4 is about 3 mm, the width W2 of the opening 3 is about 4 mm. Set to Moreover, it is necessary to completely embed the light emitting element 4 and the thin metal wire 8 to be fixed, and the depth of the opening 3 is set to about 0.8 to 1.0 mm, for example.

  With this structure, the opening 3 formed in the reflector 2 also has a function as a dam portion of the fluorescent resin body 12 in which the light emitting element 4 and the like are embedded. Further, the aluminum plate 10 of the reflector 2 is exposed from the side surface of the opening 3, so that the heat released from the light emitting element 4 is also radiated through the aluminum plate 10. The deterioration of the fluorescent resin body 12 due to the heat released from the light emitting element 4 is suppressed. Note that the bonding sheet 9 is processed in advance such as an opening in accordance with the shape of the reflector 2.

  Next, the light emitting element 4 is an element having two electrodes (an anode electrode and a cathode electrode) on the upper surface and irradiating light of a predetermined color. The structure of the light emitting element 4 is that an N-type semiconductor layer and a P-type semiconductor layer are stacked on the upper surface of a semiconductor substrate made of gallium arsenide (GaAs) or the like. Then, light of a predetermined color is irradiated from the upper part and the upper surface of the light emitting element 4 to the surroundings.

  Specifically, the size of the light emitting element 4 is, for example, about vertical × horizontal × thickness = 0.3 mm × 0.3 mm × 0.1 to 0.3 mm. The thickness of the light emitting element 4 varies depending on the color of the light to be irradiated. For example, the thickness of the light emitting element 4 that emits red light is about 0.15 mm, and the thickness of the light emitting element 4 that emits green light is The thickness of the light emitting element 4 that emits blue light is about 0.28 mm, and is about 0.15 μm. Then, the anode electrode and the cathode electrode arranged on the upper surface of the light emitting element 4 are connected to the wiring layers 7B and 7C by the thin metal wires 8, respectively. With this structure, when the thickness of the light emitting element 4 in the opening 3 and the loop height of the thin metal wire 8 are combined, the total height is 0.6 to 0.8 mm.

  Next, the fluorescent resin body 12 is filled for each opening 3 and the light emitting element 4 and the fine metal wire 8 are covered. As described above, the depth of the opening 3 is equal to or greater than the total height of the light emitting element 4 and the fine metal wire 8, and the fine metal wire 8 is completely embedded in the fluorescent resin body 12.

  Specifically, the fluorescent resin body 12 has a configuration in which a fluorescent material is mixed in a silicone resin having excellent heat resistance. The light irradiated from the upper side and the upper surface of the light emitting element 4 is irradiated outside the fluorescent resin body 12 while being irregularly reflected by the fluorescent substance in the fluorescent resin body 12. For example, when blue light is irradiated from the light emitting element 4, the light transmitted through the fluorescent resin body 12 becomes white by mixing a yellow fluorescent substance into the fluorescent resin body 12. Therefore, the light emitting module 1 emits various kinds of light depending on the combination of the emission color of the light emitting element 4 and the mixed phosphor. And it can utilize as a lighting fixture by irradiating white light by the said combination. Note that a structure in which a transparent silicone resin is disposed above and below the fluorescent resin body 12 and the fluorescent resin body 12 and the transparent silicone resin are laminated in the opening 3 may be employed.

  Next, as shown in FIG. 2A, wiring layers 7 </ b> A to 7 </ b> C are formed on the upper surface of the insulating layer 6. A region indicated by a dotted circle indicates the opening 3 of the reflector 2. Since the back surface of the light emitting element 4 is insulated, the wiring layer 7A used as the land region is formed integrally on the top surface of the insulating layer 6. With this structure, the heat released from the light emitting element 4 is transmitted to the wiring layer 7A having excellent thermal conductivity. The aluminum plate 10 of the reflector 2 is disposed on the hatched area of the wiring layer 7 </ b> A, and heat is radiated through the aluminum plate 10. That is, the wiring layer 7A directly connected to the light emitting element 4 is arranged on the upper surface of the insulating layer 6 as a wide area, and the area facing the aluminum plate 10 is increased, so that the light emitting module 1 having excellent heat dissipation is obtained.

  This will be specifically described. First, as described with reference to FIG. 1, the reflector 2 has the same size as the entire module, that is, a rectangular outer shape when viewed in plan. However, the size of the reflector 2 may be slightly smaller or slightly larger than the size of the entire module. And the opening part 3 is penetrated in the reflector 2. On the other hand, in the conductive foil constituting the wiring layers 7A to 7C, a region indicated by hatching is a part of a region used as a land region for element mounting. And the area | region arrange | positioned at island shape so that it may be enclosed by the land area | region is patterned so that it may become a cathode electrode and an anode electrode. That is, a slit is formed around both electrode regions. The outer shape of the entire conductive foil is a rectangular shape slightly smaller than the rectangular shape of the reflector 2. With this structure, the conductive foil and the reflector 2 that are the land regions are mainly arranged so as to overlap each other in the region other than the opening 2 as indicated by hatching. Then, the heat released from the light emitting element 4 is transferred to the lower layer of the reflector 2 by the conductive foil having excellent thermal conductivity, and then is radiated to the outside of the module through the reflector 2, thereby improving the heat dissipation. Is done. The land region is a region that is slightly larger than the size of the light emitting element 4, and the same effect as described above can be obtained in a structure in which a part of the land region is expanded and extended to increase the overlapping region with the reflector 2. Obtainable.

  Next, as shown in FIG. 2B, an opening region 13 may be formed in the insulating sheet 5 and the insulating layer 6 below the wiring layer 7A, and a bump electrode 14 connected to the wiring layer 7A may be formed. In this structure, the heat released from the light emitting element 4 is directly radiated to the outside of the light emitting module 1 through the wiring layer 7A and the bump electrode 14 having excellent thermal conductivity. In particular, in this structure, since the heat released from the light emitting element 4 is radiated to the outside of the light emitting module 1 through the shortest path, the quality deterioration of the light emitting element 4 and the fluorescent resin body 12 can be further prevented. When the light emitting module 1 itself is directly disposed on a metal substrate such as an aluminum substrate, the bump electrode 14 may be used as a connection region. Further, the bump electrode 14 may be used as a heat radiating member in its shape instead of the connection region.

  Next, as shown in FIG. 3A, the reflector 2 is configured by applying a white resin 11 on the upper surface of the aluminum plate 10. Then, for example, the thickness T2 of the aluminum plate 10 is set to 0.5 mm and the thickness T3 of the white resin 11 is set to 0.3 mm according to the thickness of the light emitting element 4 to be fixed and the loop height of the thin metal wire 8. Set to

  The reflector 2 is punched from the aluminum plate 10 side to the white resin 11 side by a punch (not shown), for example, and the opening 3 is formed. As indicated by circles 15 and 16, a curved surface 17 is formed around the end of the opening 3 on the punching start point side (bonding surface side) of the aluminum plate 10. The curved surface 17 is formed in accordance with the circular shape of the opening 3, and the surface thereof is a shear surface. The curved surface 17 becomes a recess with respect to the bonding surface side of the reflector 2.

  On the other hand, as indicated by circles 18 and 19, burrs 20 are formed on the punching end side of the aluminum plate 10. The burr 20 is formed in accordance with the circular shape of the opening 3, and the surface thereof is a fracture surface. Similarly, burrs 23 are formed on the punching end side of the white resin 11 as indicated by circles 21 and 22. The burr 23 is formed in accordance with the circular shape of the opening 3, and the surface thereof has a broken surface. And the burr | flash 23 becomes a convex part with respect to the reflective surface side of the reflector 2. FIG.

  As described above, light is also irradiated from the upper part of the side surface of the light-emitting element 4. However, the irradiation surface is formed by arranging the shear plane and the fracture surface of the aluminum plate 10 and the white resin 11 on the side surface of the opening 3. The light is efficiently diffused and the brightness of the irradiated light is improved. The reflection area is enlarged due to the presence of the burr 23.

  As shown in FIG. 3B, the opening 3 is filled with a fluorescent resin body 12. The fluorescent resin body 12 embeds the light emitting element 4 and the fine metal wire 8 and adheres to the side surface of the opening 3 of the reflector 2. In the regions indicated by the circles 18 and 21, the side surfaces of the respective burrs 20 and 23 are broken surfaces, and the adhesion between the reflector 2 and the fluorescent resin body 12 is further improved. And the burr | flashes 20 and 23 become a structure excellent in the said adhesion | attachment state by being formed in a ring around the edge part of the opening part 3. FIG. With this structure, moisture intrusion into the opening 3 is prevented, corrosion of the thin metal wires 8 and deterioration of the light emitting element 4 are prevented, and product quality is improved.

  Further, in the region indicated by the circle 15, the curved surface 17 of the aluminum plate 10 is disposed, so that the curved surface 17 is a concave portion with respect to the side surface of the opening 3. The curved surface 17 is formed in an annular shape at the end of the opening 3, so that the recess is also formed in an annular shape with respect to the opening 3. With this structure, the fluorescent resin body 12 is cured so as to bite into the side surface of the opening 3 using the concave portion, and an anchor effect is obtained. And it is prevented that the fluorescent resin body 12 falls out from the opening part 3, and product quality is improved. In addition, even when moisture enters from the boundary surface between the reflector 2 and the fluorescent resin body 12, the moisture intrusion path is lengthened by the concave portion, and deterioration of the light emitting element 4 can be delayed.

  Further, the burr 23 is generated in a direction substantially parallel to the punching direction when the opening 3 is formed. Also in the area where the burr 23 is formed, the width W2 (diameter) of the opening 3 is substantially the same. And the circular area of each opening part 3 seen from the white resin 11 surface side becomes substantially equivalent throughout the reflector 2 whole. With this structure, the amount of light emitted from each opening 3 of the light emitting module 1 is unified. And the dispersion | variation in light quantity as the whole light emitting module 1 is prevented. Furthermore, even if the amount of the fluorescent resin body 12 filled in each opening 3 varies slightly due to the structure of the opening 3, the variation in the amount of light is prevented and workability is improved.

  As described above, the reflector 2 has not only a reflection function but also a function as a dam part for storing the fluorescent resin body 14 and a function as a support member as a frame, thereby reducing the thickness of the light emitting module 1 itself. Can do.

  When the punching direction of the reflector 2 is changed from the white resin 11 side to the aluminum plate 10 side, burrs are generated on the aluminum plate 10 side of the opening 3 and a curved surface is formed on the white resin 11 side. In this case, on the aluminum plate 10 side, there is a problem that the wiring layer is disconnected by the burr or the burr is crushed. Further, on the white resin 11 side, the circular area of the opening varies depending on the curved surface portion, and the amount of light in each opening 3 varies depending on the amount of the fluorescent resin body 12 filled in the opening. Will occur.

  As shown in FIG. 3C, lenses 24 are formed in the openings 3 on the upper surface of the reflector 2. The lens 24 is formed of, for example, a thermosetting resin such as a thermoplastic resin or a silicone resin. Then, by forming the lens 24 on the upper surface of the reflector 2, the burrs 23 in the regions indicated by the circles 21 and 22 are arranged in the lens 24. With this structure, the burr 23 is protected by the lens 24, the burr 23 is not exposed to the outside of the light emitting module 1, and the burr 23 is prevented from being broken. Further, when a resin is potted on the upper surface of the reflector 2 to form the lens 24, the burr 23 functions also as a dam portion, and the spread of the resin can be prevented. Alternatively, the lens 24 may be disposed after the burr 23 is hit and crushed. 1A, 1B, and 2B, the lens 24 is omitted, but the lens 24 is formed on the upper surface of the reflector 2 as shown in FIG. 3C. May be.

  As described above, in the present embodiment, the reflector 2 has been described as a structure in which the white resin 11 is formed on the upper surface of the aluminum plate 10, but the present invention is not limited to this case. For example, a white acrylic plate can be used as the reflector. Even in this case, the reflector has a function as a dam part of the fluorescent resin body and a function as a support member of the frame body by forming the opening in the acrylic plate having a desired thickness. In addition, various modifications can be made without departing from the scope of the present invention.

  Next, the light emitting module which is the 2nd Embodiment of this invention is demonstrated with reference to FIG. FIG. 4A is a cross-sectional view for explaining the light emitting module. FIG. 4B is a plan view for explaining the wiring pattern. The second embodiment is different from the first embodiment described with reference to FIGS. 1 to 3 in that the electrode structure of the light emitting element is different. 1 to 3 will be referred to. The same constituent members as those in the first embodiment are denoted by the same reference numerals.

  As shown in FIG. 4A, the light emitting element 25 has an anode electrode formed on the upper surface thereof and a cathode electrode disposed on the lower surface thereof. A predetermined color of light is emitted from the upper and upper side surfaces of the light emitting element 25 to the surroundings. The anode electrode disposed on the upper surface of the light emitting element 25 and the wiring layer 7 </ b> D are electrically connected by the metal thin wire 8. On the other hand, the cathode electrode on the lower surface of the light emitting element 25 and the wiring layer 7E (including the land region) are electrically connected by a conductive bonding material. With this structure, when the thickness of the light emitting element 25 in the opening 3 and the loop height of the thin metal wire 8 are combined, the total height is 0.6 to 0.8 mm. The other structure of the light emitting element 25 is the same as that of the light emitting element 4. The wiring layers 7D and 7E include a land to which the light emitting element is fixed and an electrode portion to which a thin metal wire is connected.

  As illustrated, an opening region 26 is formed in the insulating sheet 5 and the insulating layer 6 below the wiring layer 7E, and a bump electrode 27 connected to the wiring layer 7E is formed. With this structure, the heat released from the light emitting element 25 is directly radiated to the outside of the light emitting module 1 through the wiring layer 7E and the bump electrode 27 excellent in thermal conductivity. In particular, in this structure, since the heat released from the light emitting element 25 is radiated to the outside of the light emitting module 1 through the shortest path, the quality deterioration of the light emitting element 25 and the fluorescent resin body 12 can be further prevented. The bump electrode 27 is also used as a cathode electrode. When the light emitting module 1 itself is fixed on a wiring pattern of a metal substrate such as an aluminum substrate, the bump electrode 27 is used as a connection region.

  As shown in FIG. 4B, also in the second embodiment, the heat released from the light emitting element 25 is transmitted to the wiring layer 7E having excellent thermal conductivity. The aluminum plate 10 of the reflector 2 is disposed on the hatched area of the wiring layer 7E, and heat is radiated through the aluminum plate 10. With this structure, the wiring layer 7E directly connected to the light emitting element 25 is disposed as a wide area, and the area facing the aluminum plate 10 is increased, so that the light emitting module 1 having excellent heat dissipation is obtained. The wiring layer 7E is used as a land region, and is also used as a wiring layer connected to the cathode electrode, and it is important to have heat dissipation.

  4A and 4B, the lens 24 is omitted, but in the second embodiment as well, the lens 24 is formed on the upper surface of the reflector 2 as shown in FIG. 3C. May be formed. In addition, various modifications can be made without departing from the scope of the present invention.

  Next, the manufacturing method of the light emitting module which is the 3rd Embodiment of this invention is demonstrated with reference to FIGS. 5-7 is sectional drawing for demonstrating the manufacturing method of a light emitting module. In the third embodiment, in order to describe the manufacturing method of the light emitting module shown in FIG. 1 of the first embodiment, the same configuration as that of the first embodiment is referred to as appropriate with reference to the description of FIG. The same reference numerals are given to the members.

As shown in FIG. 5, a metal substrate 28 is prepared. The metal substrate 28 is used as a support substrate when forming the wiring layers 7A to 7C. Therefore, as the metal substrate 28, any material such as copper (Cu) or aluminum (Al) can be used. Next, an insulating layer 6 such as an epoxy resin is formed on the upper surface of the metal substrate 28. When the metal substrate 28 is made of aluminum, an oxide film (anodized film: Al ₂ (SO ₄ ) ₃ ) obtained by anodizing aluminum is formed on the upper and lower surfaces of the metal substrate 28, and then the oxide film is formed on the oxide film. The insulating layer 6 may be formed.

  Next, a conductive foil made of copper having a thickness of 50 μm, for example, is formed on the upper surface of the insulating layer 6 over substantially the entire surface. Then, the conductive foil is selectively wet etched to form wiring layers 7 </ b> A to 7 </ b> C on the insulating layer 6. The wiring layers 7A to 7C include a land to which the light emitting element is fixed and an electrode portion to which a thin metal wire is connected.

  As shown in FIG. 6, the reflector 2 is prepared. The reflector 2 has a configuration in which a white resin 11 is applied to the upper surface of the aluminum plate 10, and the openings 3 are formed at regular intervals in the longitudinal direction. And the opening part 3 is formed by punching by the punch from the aluminum plate 10 side of the reflector 2 to the white resin 11 side, for example. Next, the reflector 2 is bonded onto the metal substrate 2 via a bonding sheet (adhesive sheet) 9 (see FIG. 1B). The effect of the punching direction when forming the opening 3 is as described with reference to FIG. 3 in the first embodiment.

  At this time, when the metal portion of the reflector 2 is made of aluminum, aluminum is used as the metal substrate 28. When the metal portion is made of copper, copper is used as the metal substrate 28. That is, by approximating the linear expansion coefficient between the reflector 2 and the metal substrate 28, it is possible to prevent the reflector 2 from warping after the bonding step, after the metal substrate 28 and the like are returned to a normal temperature state. In addition, when using the reflector which consists of a copper plate, since copper is easy to oxidize, oxidation treatments, such as a plating process, are given to the surface of a copper plate.

  Thereafter, the light emitting element 4 is fixed to the upper surface of the wiring layer 7A through a bonding material. Then, the anode electrode and the cathode electrode on the upper surface of the light emitting element 4 are connected to the wiring layers 7B and 7C by the thin metal wires 8, respectively.

  As shown in FIG. 7, the fluorescent resin body 12 is filled in the opening 3 of the reflector 2. The light emitting element 4 and the fine metal wire 8 are completely embedded by the fluorescent resin body 12. Thereafter, the metal substrate 28 (see FIG. 6) is peeled from the light emitting module 1 using a peeling solvent. At this time, the wiring layers 7 </ b> A to 7 </ b> C can be integrally supported on the insulating layer 6 by peeling the metal substrate 28 from the interface between the metal substrate 28 and the insulating layer 6. Next, the insulating sheet 5 is prepared and bonded to substantially the entire back surface of the insulating layer 6. In the light emitting module 1, the reflector 2 functions as an outer frame and is integrally supported. However, the insulating layer 5 can be prevented from being lost by bonding the insulating sheet 5 together. Note that the insulating sheet 1 may be omitted depending on the usage state of the light emitting module 1.

It is (A) perspective view for demonstrating the structure of the light emitting module in the 1st Embodiment of this invention, (B) It is sectional drawing. It is (A) top view for demonstrating the structure of the light emitting module in the 1st Embodiment of this invention, (B) It is sectional drawing. It is (A) sectional drawing (B) sectional drawing for demonstrating the structure of the light emitting module in the 1st Embodiment of this invention, (C) It is sectional drawing. It is (A) sectional drawing and (B) top view for demonstrating the structure of the light emitting module in the 2nd Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the light emitting module in the 3rd Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the light emitting module in the 3rd Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the light emitting module in the 3rd Embodiment of this invention. It is sectional drawing for demonstrating the structure of the light emitting module in conventional embodiment. It is sectional drawing for demonstrating the structure of the light emitting module in conventional embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting module 2 Reflector 3 Opening part 4 Light emitting element 12 Fluorescent resin body

Claims (8)

An insulating layer;
A wiring layer formed on the upper surface of the insulating layer;
A reflector bonded on one main surface of the metal substrate;
A light emitting element electrically connected to the wiring layer exposed from the opening of the reflector;
A resin body that embeds the opening,
The reflector surface is higher than the surface of the light emitting element, and the resin body adheres to the reflector exposed to the opening. The wiring layer has a land region to which the light emitting element is fixed,
The light emitting module according to claim 1, wherein the land region is disposed from the opening to a position below the reflector. An insulating sheet is bonded to the lower surface of the insulating layer, a plurality of opening regions are formed in the insulating layer and the insulating sheet, and a heat dissipation member is disposed in the land region exposed from the opening region. The light emitting module according to claim 2, wherein the light emitting module is formed. The reflector has an adhesive surface that adheres onto the metal substrate, and a reflective surface that faces the adhesive surface,
4. The light emitting module according to claim 2, wherein a curved surface that is a concave portion with respect to the bonding surface is formed around an end of the opening on the bonding surface of the reflector. The light emitting module according to claim 4, wherein a burr that is a convex portion with respect to the reflection surface is formed around the end of the opening on the reflection surface of the reflector. The reflector is configured by coating a white resin on one main surface of an aluminum plate,
The light emitting module according to claim 5, wherein the curved surface is formed on the aluminum plate, and the burr is formed on the white resin. Forming an insulating layer on the upper surface of the metal substrate, forming a wiring layer on the insulating layer, and then bonding a reflector provided with a plurality of openings to the upper surface of the insulating layer;
Electrically connecting a light emitting element on the wiring layer exposed from the opening, forming a resin body in the opening so as to embed the light emitting element, and then peeling the metal substrate. ,
The method of manufacturing a light emitting module, wherein the metal substrate is made of the same metal as a metal portion constituting the reflector. The reflector includes the metal portion and a resin portion formed on the upper surface of the metal portion, and the opening is formed by punching the reflector from the metal portion side to the resin portion side. The method for manufacturing a light emitting module according to claim 7, wherein the side is disposed on the upper surface of the wiring layer.

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