JP2012009794A - Light emitting device, back light unit, liquid crystal display, and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which can improve a light extraction efficiency and suppresses unevenness of color and unevenness of luminance due to re-excitation.SOLUTION: The light emitting device includes a substrate 10, an LED chip 21 mounted on the substrate 10, a light wavelength converter, a fluorescent substance containing resin 22 covering the LED chip 21, a light guidance member placed in the vicinity of the LED chip 21. The light guidance member is covered with a white resin 30 which does not contain a light wavelength converter.

Description

  The present invention relates to a light emitting device, a backlight unit, a liquid crystal display device, and an illumination device, and more particularly to a light emitting device using a semiconductor light emitting element.

  2. Description of the Related Art In recent years, semiconductor light emitting devices such as light emitting diodes (LEDs) have been widely used as high-efficiency and space-saving light sources as backlight light sources in liquid crystal display devices such as liquid crystal televisions or illumination light sources in illumination devices. It's being used.

  The LED in the backlight light source or the illumination light source is configured as a light emitting device (light emitting module). This light-emitting device is configured by sealing an LED disposed on a substrate with a resin. For example, in an edge light type backlight unit, a light-emitting device configured by one-dimensionally arranging a plurality of LEDs on a substrate is used.

  Such a light-emitting device is often used as a white light source. For example, Patent Document 1 discloses a light-emitting device that emits white light by exciting a yellow phosphor using a blue LED.

JP 2007-142152 A

  By the way, in recent years, development of an LED light source that mounts a light emitting device using an LED on a substrate and substitutes for a conventional light source such as a straight tube fluorescent lamp or a backlight has been studied.

  As an LED in a light emitting device mounted on such a light source, there are a surface mount type (SMD), a COB type (Chip On Board), and the like.

  The SMD type light emitting device is a package type light emitting device in which an LED chip is mounted in a cavity formed of resin or the like, and the inside of the cavity is sealed with a phosphor-containing resin.

  On the other hand, a COB type light emitting device is a device in which an LED itself (bare chip) is directly mounted on a substrate, the bare chip and a wiring pattern on the substrate are wire-bonded, and the bare chip is sealed with a phosphor-containing resin. is there.

  Compared to the SMD type, the COB type light emitting device is superior in cost and light rate, and there is a high demand for the development of an alternative light source employing the COB type light emitting device.

  An example of this COB type light emitting device will be described with reference to FIGS. 14A is an external perspective view of an example of a COB type light emitting device, FIG. 14B is a partially enlarged plan view of the example of the light emitting device shown in FIG. 14A, and FIG. 14C is an XX ′ line in FIG. 14B. It is a partially expanded sectional view in an example of the light-emitting device cut | disconnected along the line.

  As shown in FIG. 14A, the light emitting device 700 includes a substrate 710 and a plurality of light emitting units 720 provided linearly on the substrate 710. 14B and 14C, the light emitting unit 720 in the light emitting device 700 includes a plurality of LED chips 721 mounted on a substrate 710, and a dome-shaped phosphor for sealing each LED chip 721. Containing resin 722 (phosphor layer). Furthermore, the light emitting device 700 includes a metal wiring 740 patterned on the substrate 710 and a wire 760 that connects the metal wiring 740 and the electrode of the LED chip 721.

  Predetermined phosphor particles are dispersed in the phosphor-containing resin 722, and the emitted light of the LED chip 721 is color-converted by the phosphor particles, and light of a desired color is emitted from the light emitting device. For example, by using a blue LED chip that emits blue light as the LED chip 721 and using yellow phosphor particles as the phosphor particles, the yellow phosphor particles are excited by the blue light of the blue LED chip and emit yellow light. The white light is emitted by the yellow light and the blue light of the blue LED chip.

  However, in the light emitting device 700 illustrated in FIGS. 14A to 14C, white light emitted from one light emitting unit 720 may be incident on the other light emitting unit 720 in two different light emitting units 720. In this case, the white light of one light emitting unit 720 incident on the other light emitting unit 720 is excited again by the phosphor particles of the phosphor-containing resin 722 in the other light emitting unit 720. For example, when the phosphor particles are yellow phosphor particles, white light incident on the other light emitting unit 720 is re-excited to yellow light.

  Further, since the LED chip 721 is generally vulnerable to static electricity, an electrostatic protection element 750 such as a Zener diode is mounted on the substrate 710 of the light emitting device 700 as shown in FIG. 14B. The electrostatic protection element 750 is sealed with a resin, and the same resin as the phosphor-containing resin 722 that seals the LED chip 721 is used as the resin for sealing the electrostatic protection element 750. In this case, white light from the light emitting unit 720 is also incident on the phosphor-containing resin 722 that seals the electrostatic protection element 750, and the incident white light is the fluorescence of the phosphor-containing resin 722 in the electrostatic protection element 750. There is a problem of being re-excited by body particles.

  When reexcitation occurs in the light emitting device 700 as described above, there is a problem in that the amount of light emitted from the light emitting device 700 to the front surface (light extraction surface) is reduced and the light extraction efficiency is reduced. Further, when re-excitation occurs, there is a problem that chromaticity shift occurs and color unevenness and brightness unevenness occur.

  Further, since the electrostatic protection element 750 is made of silicon or the like, the light absorption rate is relatively high, and the reflectance with respect to the light from the light emitting unit 720 is low. In addition, white light emitted from the light emitting unit 720 may be reflected by the metal wiring 740 in the vicinity of the LED chip 721 or the like other than the light extraction surface. Furthermore, there is a case where the wire 760 is exposed from the phosphor-containing resin 722 by reducing the phosphor-containing resin 722 to reduce the light loss due to the phosphor-containing resin 722. In this case, the wire 760 is emitted from the light emitting unit 720. White light is reflected by the exposed wire. There is also a problem that light loss occurs due to light absorption and light reflection in such a non-light emitting portion, and the light extraction efficiency decreases.

  The present invention has been made to solve such problems, and provides a light emitting device that can improve light extraction efficiency and can suppress color unevenness and brightness unevenness due to re-excitation. The purpose is to do.

  In order to solve the above problems, an aspect of the light emitting device according to the present invention includes a substrate, a semiconductor light emitting element mounted on the substrate, a light wavelength converter, and a first envelope that covers the semiconductor light emitting element. A stop member and a light guide member disposed in the vicinity of the semiconductor light emitting element are provided, and the light guide member is covered with a second sealing member made of a resin not including a light wavelength converter.

  As described above, since the light guiding member in the vicinity of the semiconductor light emitting element is covered with the second sealing member that does not include the light wavelength conversion body, it is possible to suppress light loss of light emission of the semiconductor light emitting element by the light guiding member. it can.

  Furthermore, in one aspect of the light emitting device according to the present invention, a plurality of the semiconductor light emitting elements are mounted in a straight line, and the second sealing member is formed at least between the adjacent semiconductor light emitting elements. It is preferable.

  Thus, since the 2nd sealing member which does not contain an optical wavelength converter between the adjacent semiconductor light emitting elements is formed, the light of one light emission part injects into the other light emission part in an adjacent light emission part It is possible to suppress the occurrence of re-excitation caused by this. As a result, light loss due to re-excitation can be reduced, so that light extraction efficiency can be improved and chromaticity deviation can be suppressed, so that occurrence of color unevenness and brightness unevenness can be reduced. it can.

  Furthermore, in one aspect of the light emitting device according to the present invention, the light guiding member is a metal wiring formed on the substrate, or a wire connecting the semiconductor light emitting element and the metal wiring. preferable.

Thereby, the optical loss by reflection of a metal wiring or a wire can be reduced.
Furthermore, in one embodiment of the light emitting device according to the present invention, it is preferable that the second sealing member is a white resin containing white particles.

  Thereby, since the 2nd sealing member has a reflective function, the light from a semiconductor light emitting element can be reflected by the 2nd sealing member. Therefore, in the adjacent light emitting units, it is possible to suppress the occurrence of re-excitation caused by the light of one light emitting unit entering the other light emitting unit.

  Furthermore, in one aspect of the light emitting device according to the present invention, it is preferable that a reflective member is formed on the second sealing member.

  Thereby, the light from the semiconductor light emitting element can be reflected by the reflecting member formed on the second sealing member. Therefore, in the adjacent light emitting units, it is possible to suppress the occurrence of re-excitation caused by the light of one light emitting unit entering the other light emitting unit.

  Furthermore, in one aspect of the light emitting device according to the present invention, the second sealing member is preferably made of a transparent resin.

Thereby, a 2nd sealing member can be comprised with transparent resin.
Furthermore, in one aspect of the light emitting device according to the present invention, it is preferable that the first sealing member is formed so as to cover at least a part of the second sealing member.

  Thereby, the light from the semiconductor light emitting element can be reflected by the second sealing member before being emitted from the first sealing member. Therefore, in the adjacent light emitting units, it is possible to further suppress the occurrence of re-excitation caused by the light of one light emitting unit entering the other light emitting unit.

  Furthermore, in one embodiment of the light emitting device according to the present invention, it is preferable that n1> n2 where n1 is a refractive index of the first sealing member and n2 is a refractive index of the second sealing member.

  Thereby, the light from the semiconductor light emitting element can be totally reflected at the interface between the first sealing member and the second sealing member.

  Furthermore, in one aspect of the light emitting device according to the present invention, if the width of the lower portion of the first sealing member is W1 and the width of the lower portion of the second sealing member is W2, 0.04 ≦ W2 / W1 ≦ 40 is preferred.

  Thereby, since the area which covers a light guide member by the 2nd sealing member can be enlarged, the light loss of light emission of the semiconductor light-emitting device by a light guide member can be reduced further.

  Furthermore, in one aspect of the light emitting device according to the present invention, it is preferable that the light guide member is an electrostatic protection element mounted on the substrate for electrostatic protection of the semiconductor light emitting element.

  Thereby, since the electrostatic protection element is covered with the 2nd sealing member which does not contain a light wavelength converter, the light loss of light emission of the semiconductor light emitting element by an electrostatic protection element can be reduced. Therefore, the light extraction efficiency can be improved. In addition, when the electrostatic protection element is covered with the phosphor-containing resin, light from the light emitting portion is incident and re-excitation occurs. In this aspect, the second sealing member that covers the electrostatic protection element has a wavelength converter. Such re-excitation does not occur.

  Furthermore, in one embodiment of the light emitting device according to the present invention, it is preferable that the second sealing member is a white resin containing white particles.

  Thereby, since the 2nd sealing member has a reflective function, the light from a semiconductor light emitting element can be reflected by the 2nd sealing member. Therefore, it is possible to prevent light from the light emitting unit from entering the electrostatic protection element.

  Furthermore, in one aspect of the light emitting device according to the present invention, it is preferable that a reflective member is formed on the second sealing member.

  Thereby, the light from the semiconductor light emitting element can be reflected by the reflecting member formed on the second sealing member. Therefore, it is possible to prevent light from the light emitting unit from entering the electrostatic protection element.

  Furthermore, in one aspect of the light emitting device according to the present invention, the second sealing member is preferably made of a transparent resin.

Thereby, a 2nd sealing member can be comprised with transparent resin.
Furthermore, in one embodiment of the light emitting device according to the present invention, it is preferable that a distance between the semiconductor light emitting element and the second sealing member is 20 mm or less.

  Thereby, the optical loss of light emission of the semiconductor light emitting element can be effectively suppressed by the second sealing member.

  Furthermore, in one embodiment of the light emitting device according to the present invention, it is preferable that the first sealing member has a dome shape.

Thereby, a light emission part with high photo-alignment property can be comprised.
Moreover, one aspect of the light emitting device according to the present invention includes a substrate, a plurality of semiconductor light emitting elements mounted on the substrate, and a light wavelength converter, and a first sealing that covers the semiconductor light emitting element in a dome shape. A member and a resin formed between adjacent semiconductor light emitting elements and containing reflective particles are provided.

  Thereby, since the resin containing reflective particles is formed between the adjacent semiconductor light emitting elements, the light emitted from one of the light emitting portions is different in the different first sealing member (light emitting portion) on the substrate. Since it is reflected by the resin containing the reflective particles in the vicinity of one light emitting portion, it is possible to suppress the light emitted from the one light emitting portion from entering the other light emitting portion.

  Furthermore, in one aspect of the light emitting device according to the present invention, the substrate is elongated, and when the length of the long side of the substrate is L1, and the length of the short side of the substrate is L2, It is preferable that 10 ≦ L1 / L2.

Thereby, it can be set as the elongate light-emitting device with a large aspect-ratio.
Moreover, the one aspect | mode of the backlight unit which concerns on this invention is provided with at least any one of the one aspect | mode of the said light-emitting device which concerns on this invention.

  An aspect of the liquid crystal display device according to the present invention includes the aspect of the backlight according to the present invention and a liquid crystal panel disposed on the optical path of the light emitted from the backlight unit. is there.

  Moreover, the one aspect | mode of the illuminating device which concerns on this invention is equipped with at least any one of the one aspect | mode of the light-emitting device which concerns on the said invention.

  According to the light emitting device of the present invention, light extraction efficiency can be improved, and color unevenness and luminance unevenness due to re-excitation can be suppressed.

1 is an external perspective view of a light emitting device according to a first embodiment of the present invention. 1 is a plan view of a light emitting device according to a first embodiment of the present invention. It is sectional drawing (X-X 'sectional view taken on the line of FIG. 1B) of the light-emitting device which concerns on the 1st Embodiment of this invention. It is a partial expanded sectional view (enlarged view of the area | region Z of FIG. 1C) of the light-emitting device which concerns on the 1st Embodiment of this invention. FIG. 3 is a partially enlarged cross-sectional view (a cross-sectional view taken along line Y-Y ′ in FIG. 1B) of the light-emitting device according to the first embodiment of the present invention. It is a partial expanded sectional view of the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a figure which shows the relationship between the chromaticity and the light beam in the light-emitting device which concerns on the 1st and 2nd embodiment of this invention, and the light-emitting device which concerns on the comparative example 1 and the comparative example 2. FIG. 6 is a partially enlarged cross-sectional view of a light emitting device according to Comparative Example 2. FIG. It is a partial expanded sectional view of the light-emitting device which concerns on the 3rd Embodiment of this invention. It is a figure which shows the relationship between the chromaticity in the light-emitting device which concerns on the 1st and 3rd embodiment of this invention, and the light-emitting device which concerns on the comparative example 1, and a light beam. It is a disassembled perspective view of the backlight unit which concerns on the 4th Embodiment of this invention. It is sectional drawing of the liquid crystal display device which concerns on the 5th Embodiment of this invention. It is sectional drawing of the illuminating device which concerns on the 6th Embodiment of this invention. It is a partially expanded sectional view in the periphery of the light emission part of the light-emitting device which concerns on the modification 1 of this invention. It is a partially expanded sectional view in the periphery of the electrostatic protection element of the light-emitting device which concerns on the modification 1 of this invention. It is a top view of the light-emitting device which concerns on the modification 2 of this invention. It is sectional drawing (X-X 'line sectional drawing of FIG. 11A) of the light-emitting device which concerns on the modification 2 of this invention. It is a top view of the light-emitting device which concerns on the modification 3 of this invention. It is sectional drawing (X-X 'line sectional drawing of FIG. 12A) of the light-emitting device which concerns on the modification 3 of this invention. It is a top view of the light-emitting device which concerns on the modification 4 of this invention. It is sectional drawing (X-X 'line sectional drawing of FIG. 13A) of the light-emitting device which concerns on the modification 4 of this invention. It is an external appearance perspective view which shows an example (comparative example 1) of a light-emitting device. It is a top view which shows an example (comparative example 1) of a light-emitting device. It is sectional drawing (X-X 'line sectional drawing of FIG. 14B) which shows an example (comparative example 1) of a light-emitting device.

  Hereinafter, a light emitting device, a backlight unit, a liquid crystal display device, and an illumination device according to embodiments of the present invention will be described with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the configurations exemplified in the present embodiment are appropriately changed depending on the configuration of the apparatus to which the present invention is applied and various conditions. It is not limited to the illustration. In each figure, dimensions and the like do not exactly match.

(First embodiment)
First, a light emitting device 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1A to 1C. FIG. 1A is a schematic perspective view of a light emitting device according to a first embodiment of the present invention. FIG. 1B is a plan view of the light emitting device according to the first embodiment of the present invention shown in FIG. 1A. FIG. 1C is a cross-sectional view of the light-emitting device according to the first embodiment of the present invention cut along the line XX ′ shown in FIG. 1B.

  As shown in FIG. 1A, a light emitting device 100 according to the first embodiment of the present invention includes a long rectangular substrate 10 and a plurality of light emitting units 20 provided on the substrate 10 in an island shape. With. The plurality of light emitting units 20 are provided in a row of straight lines (one-dimensionally) along the longitudinal direction of the substrate 10. Further, a white resin 30 (second sealing member) is provided in a non-light emitting portion between adjacent light emitting portions 20, and the light emitting portions 20 and the white resin 30 are alternately arranged along the longitudinal direction of the substrate 10. Is arranged.

  When the length in the longitudinal direction (long side length) is L1, and the length in the short side direction (short side length) is L2, the substrate 10 satisfies 10 ≦ L1 / L2 ≦. A rectangular elongated substrate. In the light emitting device 100 shown in the present embodiment, for example, the length of the long side of the substrate 10 is 360 mm, and about 70 LED chips 21 are mounted on the substrate 10 at intervals of 5 mm. Here, for example, L1 is 100 mm or more, and L2 is 20 mm or less.

  As shown in FIGS. 1B and 1C, the light emitting unit 20 in the light emitting device 100 according to the first embodiment of the present invention includes an LED chip 21 (semiconductor light emitting element) directly mounted on one surface of the substrate 10, and It consists of phosphor-containing resin 22 (first sealing member) that covers LED chip 21. In the present embodiment, the phosphor-containing resin 22 has a substantially hemispherical dome shape that is convex upward. Accordingly, the dome-shaped light emitting portions 20 are linearly arranged on the substrate 10.

  Further, the non-light-emitting portion in the light-emitting device 100 is a region other than the light-emitting portion 20, and the metal wiring 40, the electrostatic protection element 50, and the like exist in the non-light-emitting portion. The metal wiring 40 is a wiring pattern formed on the insulating film 11 formed on the substrate 10 so that a plurality of LED chips 21 can be connected in series. Although not shown, a metal wiring for connecting the electrostatic protection element 50 and the plurality of LED chips 21 in parallel is also formed on the substrate 10 in a pattern. One or a plurality of electrostatic protection elements 50 are mounted on the substrate 10 to electrostatically protect the LED chip 21. As the electrostatic protection element 50, for example, a Zener diode is used.

  The metal wiring 40 and the LED chip 21 are electrically connected by a wire 60, and thereby the plurality of LED chips 21 are connected in series. In the present embodiment, the wire 60 is embedded in the phosphor-containing resin 22, but when the phosphor-containing resin 22 is reduced in order to improve the light extraction efficiency, a part of the wire 60 contains the phosphor. In some cases, the resin 22 may be exposed. In this case, a part of the exposed wire 60 exists in the non-light emitting portion.

  Although not shown in the figure, the substrate 10 is provided with a power supply terminal for supplying power to the metal wiring 40. When power is supplied from an external power supply to the power supply terminal, the metal wiring 40 and the wire 60 are connected. Power is supplied to the LED chip 21 via the power supply. Thereby, the active layer of the LED chip 21 emits light, and desired light is emitted.

  The metal wiring 40, the electrostatic protection element 50, the wire 60, and the like existing in these non-light emitting portions are light guiding members. In the present embodiment, the light guiding member is a member that reflects, changes the traveling direction of light, converts the wavelength, or absorbs light from the light emitting portion, and is a non-light emitting portion in the vicinity of the LED chip 21. Also formed. Here, the vicinity of the LED chip 21 is a distance range in which the distance from the LED chip 21 is 20 mm or less.

  As described above, in the present embodiment, the white resin 30 is formed in a non-light emitting portion such as between adjacent light emitting portions 20. The light guiding member in the vicinity of the light emitting unit 20 is covered with the white resin 30. The white resin 30 is a silicone resin containing white fine particles. The white resin 30 does not include phosphor fine particles for exciting light as contained in the phosphor-containing resin 22. As shown in FIGS. 1B and 1C, the white resin 30 has a substantially hemispherical shape in which the cross-sectional shape in the longitudinal direction of the substrate is convex upward and extends linearly in the lateral direction of the substrate. It is.

  Next, the light emitting device 100 according to the present embodiment will be described in more detail with reference to FIGS. 2A and 2B. 2A is an enlarged view of a region Z surrounded by a broken line in FIG. 1C, and is a partially enlarged cross-sectional view of the light emitting device according to the first embodiment of the present invention. FIG. 2B is a partially enlarged cross-sectional view of the electrostatic protection element of the light emitting device according to the first embodiment of the present invention cut along the line Y-Y ′ of FIG. 1B.

  As shown in FIG. 2A, the light emitting device 100 according to this embodiment is a light emitting device having a COB structure in which the LED chip 21 (bare chip) itself is directly mounted on the substrate 10.

  The LED chip 21 is mounted on the end portion of the metal wiring 40 on the substrate 10. The LED chip 21 is a semiconductor light emitting element according to the present invention, and in this embodiment, is a bare chip that emits monochromatic visible light. The LED chip 21 is die-bonded by a die attach material 70 (die bond material) formed on the metal wiring 40.

  In the present embodiment, the LED chip 21 is a blue LED chip that emits blue light. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting element made of an InGaN based material and having a center wavelength of 450 nm to 470 nm can be used. The LED chip 21 in the present embodiment is a chip that emits light in all directions, that is, sideward, upward, and downward. For example, 20% of the total amount of light is emitted laterally, and 60% of the total amount of light is upward. It emits 20% of the total amount of light downward.

  Further, the p-side electrode 21 a and the n-side electrode 21 b of the LED chip 21 in this embodiment are both formed on the upper side of the LED chip 21. The p-side electrode 21a and the n-side electrode 21b are electrically connected to the wire 60 by wire bonding with the metal wiring 40. As the wire 60, for example, a gold wire can be used.

  The phosphor-containing resin 22 is formed so as to cover the LED chip 21 corresponding to each of the plurality of LED chips 21. The phosphor-containing resin 22 in each light emitting unit 20 is formed separately on the substrate 10 in an island shape so as to cover the corresponding LED chip 21. The phosphor-containing resin 22 is an example of a wavelength conversion layer that converts the wavelength of light incident on the inside and emits the light to the outside. The wavelength conversion layer includes an optical wavelength converter for converting the wavelength of light. In the present embodiment, the phosphor-containing resin 22 that is the wavelength conversion layer uses a phosphor as the optical wavelength converter. Prepare. Therefore, the phosphor-containing resin 22 in the present embodiment is a phosphor layer containing phosphor fine particles that excite the light of the LED chip 21. In the present embodiment, yellow phosphor fine particles are used as the phosphor fine particles, and the phosphor-containing resin 22 is configured by dispersing this in a silicone resin. As the yellow phosphor particles, YAG (yttrium / aluminum / garnet) phosphor materials can be used.

  In addition, as a sealing member (wavelength conversion layer) for coat | covering LED chip 21, it is not limited to resin. For example, the sealing member may be configured using a transparent member such as glass, which is known for chip sealing, and the LED chip 21 may be sealed with the sealing member.

  The phosphor-containing resin 22 has a substantially hemispherical dome shape that is convex upward. By making the phosphor-containing resin 22 into a dome shape in this way, light emitted from the LED chip 21 is not restricted, and thus a high optical orientation of 90 degrees can be realized. Thus, in the case of a substantially hemispherical dome shape, the radius of curvature R (mm) at the outermost periphery of the phosphor-containing resin 22 is 0.2 [1 / mm] ≦ from the viewpoint of improving the photoalignment property. It is preferable that the relationship 1 / R ≦ 2.0 [1 / mm] is satisfied. In the present embodiment, the curvature radius R refers to a value defined by a cross section in the short direction of the substrate 10 on which the LED chip 21 is mounted. However, in the present invention, the shape of the phosphor-containing resin 22 is not particularly limited, and the outermost shape may be a parabolic shape. In the case of the SMD type, since the surface of the phosphor-containing resin (phosphor layer) is planar, the photo-alignment property is not so high, for example, about 80 degrees.

  As described above, the phosphor-containing resin 22 in the present embodiment converts the wavelength of light from the LED chip 21 and seals the LED chip 21. The phosphor-containing resin 22 is preferably made of a highly thixotropic material, whereby the dome-shaped phosphor-containing resin 22 can be easily formed by potting using surface tension.

  As described above, the light emitting unit 20 of the light emitting device 100 according to the present embodiment includes the LED chip 21 made of a blue LED chip and the phosphor-containing resin 22 containing yellow phosphor particles. It is excited by the blue light of the blue LED chip to emit yellow light. Thereby, white light is emitted from the light emitting unit 20 by the excited yellow light and the blue light of the blue LED chip.

  And as shown to FIG. 2A, white resin 30a, 30b is formed in the both sides of the light emission part 20 in the longitudinal direction of the board | substrate 10. As shown in FIG. In the present embodiment, the white resins 30 a and 30 b are formed on the metal wiring 40 and on the resist 80. That is, the metal wiring 40 which is a light guide member is covered with the white resins 30a and 30b.

  The white resins 30a and 30b are made of a resin containing reflective particles that reflect white light. In the present embodiment, as described above, white fine particles are contained in a silicone resin or the like. As the white fine particles, metal oxide fine particles such as titanium oxide, zirconia oxide, aluminum oxide or zinc oxide can be used. Thereby, the light from the light emitting unit 20 that reaches the white resins 30a and 30b is reflected by the white resins 30a and 30b. The white resins 30a and 30b are preferably made of a highly thixotropic material, whereby the dome-shaped white resins 30a and 30b can be easily formed by potting.

  Further, in the present embodiment, if the height of the phosphor-containing resin 22 (light emitting portion) is h1, and the height of the white resin 30a (30b) is h2, 0.05 ≦ h2 / h1 ≦ 50 may be satisfied. preferable. Thereby, since the light radiate | emitted from LED chip 21 is fully shielded by white resin 30a, 30b, the re-excitation resulting from the wire 60 etc. which are arrange | positioned in proximity to LED chip 21 as a result is suppressed. However, as h1 / h2 is less than 0.05 and is smaller, the shielding effect with the white resin 30 cannot be obtained, and it becomes difficult to suppress reexcitation. On the other hand, if the value of h1 / h2 exceeds 50, the light emitting unit 20 is separated by the white resin 30. Therefore, in the linear light source arranged in the longitudinal direction of the substrate, the light emitting unit 20 seems to be continuously connected. It becomes difficult to obtain a light source with uniform light emission.

  In the present embodiment, a metal base substrate made of an aluminum substrate is used as the substrate 10. As the insulating film 11, an insulating film made of an organic material such as polyimide was used. The resist 80 is formed on the substrate 10 in order to reflect light to the upper surface (light extraction surface) side, and is made of white resin. The metal wiring 40 is made of thin film copper (Cu), and the surface thereof is plated. In the present embodiment, the surface of the metal wiring 40 is covered with a plating 41 made of silver (Ag) or gold (Au).

  Next, as shown in FIG. 2B, the electrostatic protection element 50 is mounted on the metal wiring 40 on the substrate 10 by die bonding. The electrostatic protection element 50 is covered with a white resin 51. In the present embodiment, the white resin 51 that covers the electrostatic protection element 50 is the same as the white resin 30 (30a, 30b) formed between the light emitting units 20. Thereby, formation of the white resin 30 between the light emission parts 20 and the white resin 51 which coat | covers the electrostatic protection element 50 can be formed in the same manufacturing process. In addition, when forming white resin in a non-light-emitting part, it can form in the same process as this.

  As described above, according to the light emitting device 100 according to the first embodiment of the present invention, the white resin 30 (30a, 30b) is formed between the adjacent light emitting units 20. Thereby, in two different light emitting units on the substrate 10, the white light emitted from one light emitting unit 20 is reflected by the white resin 30 in the vicinity of the one light emitting unit 20, and thus from the one light emitting unit 20. It can suppress that the emitted white light injects into the other light emission part 20. FIG.

  Therefore, it is possible to suppress the occurrence of re-excitation caused by the light from one light emitting unit 20 entering the other light emitting unit 20. As a result, light loss due to re-excitation can be reduced, so that light extraction efficiency can be improved. Furthermore, since the chromaticity shift can be suppressed by suppressing the occurrence of re-excitation, the occurrence of color unevenness and brightness unevenness can be reduced.

  Further, since the white resin 30 covers the light guide member such as the metal wiring 40 and the electrostatic protection element 50 in the vicinity of the light emitting unit 20, the white light emitted from the light emitting unit 20 is other than the light extraction surface by the light guide member. Or being absorbed by the light guiding member.

  Therefore, the light loss due to the light guiding member can be reduced, so that the light extraction efficiency can be further improved.

  In the present embodiment, the distance between the light emitting unit 20 and the white resin 30 is preferably 20 mm or less. Thereby, the light traveling from one light emitting unit 20 toward the other light emitting unit 20 can be efficiently reflected by the white resin 30. Therefore, it is possible to further suppress the light of one light emitting unit 20 that is incident on the other light emitting unit 20.

(Second Embodiment)
Next, a light emitting device 200 according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a partially enlarged cross-sectional view of a light emitting device according to the second embodiment of the present invention.

  The light emitting device 200 according to the second embodiment of the present invention has the same basic configuration as the light emitting device 100 according to the first embodiment of the present invention, and FIG. 3 corresponds to FIG. 2A. In FIG. 3, the same components as those shown in FIG. 2A are denoted by the same reference numerals, and detailed description thereof is omitted.

  The light emitting device 200 according to the second embodiment of the present invention shown in FIG. 3 is different from the light emitting device 100 according to the first embodiment of the present invention shown in FIG. 2A in the configuration of white resin and phosphor-containing resin. It is.

  As shown in FIG. 3, the white resin 230 in the light emitting device 200 according to the second embodiment of the present invention is compared with the white resin 30 in the light emitting device 100 according to the first embodiment of the present invention. The phosphor-containing resin 222 is formed so as to cover a part of the white resin 230. Thus, in this embodiment, the phosphor-containing resin 222 is formed so as to cover the side surface of the white resin 230 on the LED chip 21 side.

  With this configuration, the light emitted from the LED chip 21 in the light emitting unit 220 is reflected by the white resin 230 before being emitted from the phosphor-containing resin 222.

  The curved surface forming the boundary between the phosphor-containing resin 222 and the white resin 230 totally reflects the light from the LED chip 21 and the reflected light travels to the upper surface side (light extraction surface side) of the substrate 10. Such a shape is preferable. Further, when the refractive index of the phosphor-containing resin 222 is n1, and the refractive index of the white resin 230 is n2, it is preferable that n1> n2. Thereby, the light from the LED chip 21 can be easily totally reflected at the interface between the phosphor-containing resin 222 and the white resin 230. The refractive index n1 is preferably larger, while the refractive index n2 is preferably smaller.

  As described above, according to the light emitting device 200 according to the second embodiment of the present invention, the light from the LED chip 21 can be reflected by the white resin 230 before being emitted from the phosphor-containing resin 222. Thereby, in two different light emitting units 220, it is possible to further suppress the white light emitted from one light emitting unit 220 from entering the other light emitting unit 220, so compared with the first embodiment, The occurrence of reexcitation can be further suppressed. Therefore, the light extraction efficiency can be further improved, and color unevenness and brightness unevenness can be further suppressed.

  Moreover, since the light of the LED chip 21 can be efficiently reflected by the contact surface of the white resin 230 with the phosphor-containing resin 222, the light extraction efficiency can be further improved. This point will be described with reference to FIGS. 4A and 4B. FIG. 4A is a diagram illustrating a relationship between chromaticity and light flux in the light emitting devices according to the first and second embodiments of the present invention and the light emitting devices according to Comparative Example 1 and Comparative Example 2. 4B is a partially enlarged cross-sectional view of the light emitting device according to Comparative Example 2. FIG.

  In FIG. 4A, “♦” indicates data (Comparative Example 1) of the light emitting device 700 according to Comparative Example 1 shown in FIGS. 14A to 14C. Further, “■” indicates data (present invention 1) of the light emitting device 100 according to the first embodiment of the present invention. Further, “*” indicates data (Comparative Example 2) of the light emitting device 800 according to Comparative Example 2 illustrated in FIG. 4B. Further, “●” indicates data (present invention 2) of the light emitting device 200 according to the second embodiment of the present invention. In FIG. 4A, the horizontal axis represents the chromaticity coordinate x, and the vertical axis represents the luminous flux (lm).

  Here, the light emitting device 800 according to Comparative Example 2 shown in FIG. 4B is an SMD type light emitting device, and is filled with one LED chip 821 mounted in a resin-molded cavity and the cavity. A package type light emitting module 830 made of a phosphor-containing resin 822 is mounted on a substrate 810 with solder 801 on a metal wiring 840.

  As shown in FIG. 4A, it can be seen that the present invention 1 and the present invention 2 are improved in luminous flux as compared with the first and second comparative examples. As described above, the light emitting devices 100 and 200 according to the first and second embodiments of the present invention can realize a light emitting device with high light extraction efficiency.

(Third embodiment)
Next, a light emitting device 300 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a partially enlarged cross-sectional view of a light emitting device according to the third embodiment of the present invention.

  The light emitting device 300 according to the third embodiment of the present invention has the same basic configuration as the light emitting device according to the first embodiment of the present invention, and FIG. 5 corresponds to FIG. 2A. In FIG. 5, the same components as those shown in FIG. 2A are denoted by the same reference numerals, and detailed description thereof is omitted.

  The light emitting device 300 according to the third embodiment of the present invention shown in FIG. 5 is different from the light emitting device 200 according to the first embodiment of the present invention shown in FIG. 2A in the configuration of white resin.

  As shown in FIG. 5, the white resin 330 in the light emitting device 300 according to the third embodiment of the present invention is longer than the white resin 30 in the light emitting device 100 according to the first embodiment of the present invention. The length of the is increased to a wide shape.

  Here, the length (width) in the longitudinal direction of the substrate in the lower part of the phosphor-containing resin 22 is W1 (maximum width of the phosphor-containing resin), and the length in the longitudinal direction of the substrate in the lower part of the white resin 330 (the boundary portion with the resist). When the length (width) is W2 (the maximum width of the white resin), 0.04 ≦ W2 / W1 ≦ 40.

  With this configuration, since the area where the light guide member such as the metal wiring 40 is covered with the white resin can be increased, the white light emitted from the light emitting unit 20 is reflected by the light guide member other than the light extraction surface. Absorption by the light guide member can be suppressed. Therefore, as compared with the first embodiment, the light loss due to the light guiding member can be further reduced, so that the light extraction efficiency can be further improved.

  This point will be described with reference to FIG. FIG. 6 is a diagram illustrating a relationship between chromaticity and light flux in the light emitting devices according to the first and third embodiments of the present invention and the light emitting device according to Comparative Example 1.

  In FIG. 6, “♦” indicates data (Comparative Example 1) of the light emitting device 700 according to Comparative Example 1 of FIGS. 14A to 14C. Further, “■” indicates data (present invention 1) of the light emitting device 100 according to the first embodiment of the present invention. Further, “▲” indicates data (present invention 3) of the light emitting device 300 according to the third embodiment of the present invention. In FIG. 6, the horizontal axis represents the chromaticity coordinate x, and the vertical axis represents the luminous flux (lm).

  As shown in FIG. 6, it can be seen that the light beam of the present invention 3 is improved as compared with the first invention and the first comparative example. Thus, according to the light emitting device 300 according to the third embodiment of the present invention, a light emitting device with higher light extraction efficiency can be realized.

  Further, as shown in FIG. 6, it can be seen that in the third aspect of the present invention, blue can be realized. As a result, a light emitting device free from color unevenness and brightness unevenness can be realized.

(Fourth embodiment)
Hereinafter, application examples of the light emitting devices according to the first to third embodiments of the present invention will be described based on the fourth to sixth embodiments.

  First, an example in which the light emitting device according to the first to third embodiments of the present invention is applied to a backlight unit for a liquid crystal display device will be described with reference to FIG. FIG. 7 is an exploded perspective view of a backlight unit according to the fourth embodiment of the present invention.

  As shown in FIG. 7, a backlight unit 400 according to the fourth embodiment of the present invention is an edge light type backlight unit in which a light source is arranged on the side of a light guide plate, and includes a housing 410, a reflection sheet. 420, a light guide plate 430, a light emitting device 440, an optical sheet group 450, and a front frame 460.

  The housing 410 has a flat box shape and is formed by pressing a steel plate made of stainless steel or the like. The housing 410 has an opening 411 on the bottom surface, and a flange portion 412 is formed on the periphery of the opening of the housing 410. A screw hole 413 for fastening the front frame 460 is formed in the flange portion 412.

  The reflection sheet 420 is a sheet made of, for example, polyethylene terephthalate (PET), and propagates the white light into the light guide plate 430 while reflecting the white light from the light emitting device.

  The light guide plate 430 is a sheet made of, for example, polycarbonate (PC) or acrylic, and diffuses light incident on the light guide plate 430 on the main surface (rear surface) on the reflective sheet 420 side facing the light emission surface (front surface). A dot pattern, which is a daylighting element for emitting light from the light emission surface, is printed. As the daylighting element, a light scattering element such as a light scattering structure formed on the rear surface of the light guide plate 430 by printing, molding, or the like and a prism shape, a light scattering element formed inside the light guide plate 430, or the like is used.

  The optical sheet group 450 includes a diffusion sheet 451, a prism sheet 452, and a polarizing sheet 453 having the same size and the same planar shape (rectangular shape). The diffusion sheet 451 is, for example, a film made of PET, a film made of PC, or the like. The prism sheet 452 is a sheet made of polyester, for example, and a regular prism pattern is formed on one side with an acrylic resin. As the polarizing sheet 453, for example, a film made of polyethylene naphthalate is used.

  Front frame 460 is fixed to flange portion 412 of housing 410 by screwing screw 461 into screw hole 413 of housing 410. The front frame 460 holds the light guide plate 430 and the optical sheet group 450 together with the housing 410.

  The light emitting device 440 is a light emitting device according to the first to third embodiments of the present invention described above. In the present embodiment, four light emitting devices are used, and each is provided on the heat sink 470. The light emitting device 440 provided in the heat sink 470 is disposed such that the light emission surface faces the side surface of the light guide plate 430.

  The heat sink 470 holds the light emitting device 440 and is made of a drawing material (angle material) made of, for example, L-shaped aluminum. The heat sink 470 is fixed to the housing 410 with screws or the like.

  As described above, since the backlight unit 400 according to the fourth embodiment of the present invention uses the light emitting devices according to the first to third embodiments of the present invention, there is no color unevenness and brightness unevenness, and light A backlight unit with high extraction efficiency can be realized.

(Fifth embodiment)
Next, an example in which the light emitting device according to the first to third embodiments of the present invention is applied to a liquid crystal display device will be described with reference to FIG. FIG. 8 is a cross-sectional view of a liquid crystal display device according to the fifth embodiment of the present invention.

  As shown in FIG. 8, a liquid crystal display device 500 according to the fifth embodiment of the present invention is, for example, a liquid crystal television or a liquid crystal monitor, and includes a liquid crystal display panel 510 and a back disposed on the back surface of the liquid crystal display panel 510. The light unit 520 includes a liquid crystal display panel 510 and a housing 530 in which the backlight unit 520 is accommodated.

  In the present embodiment, the backlight unit 520 uses the backlight unit according to the above-described fourth embodiment of the present invention. The backlight unit 520 is provided with a light emitting device 521 including an LED. The light emitting device 521 uses the light emitting device according to the first to third embodiments of the present invention.

  As described above, the liquid crystal display device 500 according to the fifth embodiment of the present invention uses the backlight unit 520 that has no color unevenness and brightness unevenness and high light extraction efficiency, and thus has a high contrast and high brightness. Can be realized.

(Sixth embodiment)
Next, an example in which the light emitting device according to the first to third embodiments of the present invention is applied to a lighting device will be described with reference to FIG. FIG. 9 is a cross-sectional view of a lighting device according to the sixth embodiment of the present invention.

  The illumination device 600 according to the sixth embodiment of the present invention is an LED lamp including the light emitting devices according to the first to third embodiments of the present invention, and as shown in FIG. 9, a straight tube for general illumination. This is a fluorescent lamp.

  The lighting device 600 according to the present embodiment includes a long glass tube 610, a light emitting device 620 disposed in the glass tube 610, and a pair of cap pins 630, and is attached to both ends of the glass tube 610. A base 640, an adhesive (not shown) for bonding (fixing) the light emitting device 620 to the glass tube 610 in a contact state, and a lighting circuit that receives power through the base 640 and causes the LED chip 621 of the light emitting device 620 to emit light. (Not shown).

  As mentioned above, since the illuminating device 600 which concerns on the 6th Embodiment of this invention uses the light-emitting device which concerns on the 1st-3rd embodiment of this invention, it can implement | achieve an illuminating device with high illumination intensity.

(Modification)
Next, four modifications of the light emitting device according to the embodiment of the present invention described above will be described with reference to FIGS. 10A to 13B.

(Modification 1)
First, a light emitting device 100A according to Modification 1 of the present invention will be described with reference to FIGS. 10A and 10B. FIG. 10A is a partially enlarged cross-sectional view around a light emitting unit of a light emitting device according to Modification 1 of the present invention. FIG. 10B is a partially enlarged cross-sectional view around the electrostatic protection element of the light-emitting device according to Modification 1 of the present invention.

  The light emitting device 100A according to the first modification of the present invention has the same basic configuration as the light emitting device 100 according to the first embodiment of the present invention, and FIGS. 10A and 10B are shown in FIGS. 2A and 2B, respectively. Correspond. 10A and 10B, the same components as those shown in FIGS. 2A and 2B are denoted by the same reference numerals, and detailed description thereof is omitted.

  The light emitting device 100A according to the first modification of the present invention shown in FIGS. 10A and 10B is different from the light emitting device 100 according to the first embodiment of the present invention shown in FIGS. It is.

  As shown in FIG. 10A, in the light emitting device 100 </ b> A according to the first modification of the present invention, the reflecting member 31 </ b> A is formed on the surface of the white resin 30.

  Thereby, the light from the light emitting unit 20 can be reflected by the reflecting member 31 </ b> A of the white resin 30. Thereby, in two adjacent light emitting units 20, it is possible to block the white light emitted from one light emitting unit 20 from entering the other light emitting unit 20, thereby preventing the occurrence of re-excitation. it can. Therefore, the light extraction efficiency can be improved and color unevenness and brightness unevenness of the light emitting device can be further suppressed.

  As the reflecting member 31A, silicone containing a filler such as alumina or titania, aromatic nylon, liquid crystal polymer, aromatic polyamide, aluminum material with alumite treatment on the surface, or silver or a highly reflective film is formed on the surface Resin or metal material can be used.

  In the present embodiment, since the light from the light emitting unit 20 can be reflected by the reflecting member 31A, the white resin 30 does not need to have a reflecting function. Therefore, various resins such as a colored resin or a transparent resin other than white can be used instead of the white resin 30.

  As shown in FIG. 10B, in the light emitting device 100 </ b> A according to the first modification of the present invention, the reflecting member 52 </ b> A is also formed on the surface of the white resin 51 that covers the electrostatic protection element 50. Thereby, since the light from the light emitting unit 20 is reflected by the reflecting member 52A, the light from the light emitting unit is not incident on the electrostatic protection element 50 and absorbed. Therefore, light loss in the electrostatic protection element 50 can be suppressed, and the light extraction efficiency can be improved.

(Modification 2)
Next, a light-emitting device 100B according to Modification 2 of the present invention will be described with reference to FIGS. 11A and 11B. FIG. 11A is a plan view of a light-emitting device according to Modification 2 of the present invention. FIG. 11B is a cross-sectional view of the light-emitting device according to Modification 2 of the present invention cut along the line XX ′ in FIG. 11A.

  The light emitting device 100B according to the second modification of the present invention has the same basic configuration as the light emitting device 100 according to the first embodiment of the present invention. FIGS. 11A and 11B are respectively illustrated in FIGS. 1B and 1C. Correspond. 11A and 11B, the same components as those shown in FIGS. 1B and 1C are denoted by the same reference numerals, and detailed description thereof is omitted.

  The light emitting device 100B according to the second modification of the present invention shown in FIGS. 11A and 11B is different from the light emitting device 100 according to the first embodiment of the present invention shown in FIGS. 1B and 1C in the configuration of white resin. is there.

  That is, as shown in FIGS. 11A and 11B, in the light emitting device 100B according to the second modification of the present invention, the white resin 30B is formed in a ladder shape. That is, the white resin 30B according to the present embodiment includes a long rectangular outer frame portion 31B and a plurality of partition portions 32B formed between opposing long sides of the outer frame portion 31B. . One light emitting unit 20 is disposed in each opening 33B configured by the partition 32B.

  In the present embodiment, the opening 33B is a through hole, but may be a recess.

(Modification 3)
Next, a light emitting device 100C according to Modification 3 of the present invention will be described with reference to FIGS. 12A and 12B. FIG. 12A is a plan view of a light-emitting device according to Modification 3 of the present invention. 12B is a cross-sectional view of the light-emitting device according to Modification 3 of the present invention cut along the line XX ′ in FIG. 12A.

  The light emitting device 100C according to the third modification of the present invention has the same basic configuration as the light emitting device 100B according to the second modification of the present invention, and FIGS. 12A and 12B correspond to FIGS. 11A and 11B, respectively. . 12A and 12B, the same components as those shown in FIGS. 11A and 11B are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 12A and 12B, in the light emitting device 100C according to the third modification of the present invention, the white resin 30C is formed in a comb shape. That is, the white resin 30 </ b> C according to the present embodiment includes one long side portion 31 </ b> C formed along the longitudinal direction of the substrate and a plurality of partition portions 32 </ b> C extending from the long side portion 31 </ b> C in the short direction of the substrate 10. It consists of and. Unlike the partition part 32B of the modification 2, the partition part 32C of this modification is open at one end. As in the second modification, one light emitting unit 20 is disposed in each opening 33C configured by the partition 32C.

(Modification 4)
Next, a light emitting device 100D according to Modification 4 of the present invention will be described with reference to FIGS. 13A and 13B. FIG. 13A is a plan view of a light-emitting device according to Modification 4 of the present invention. FIG. 13B is a cross-sectional view of the light-emitting device according to Modification 3 of the present invention cut along the line XX ′ in FIG. 13A.

  The light emitting device 100D according to the fourth modification of the present invention has the same basic configuration as the light emitting device 100A according to the second modification of the present invention, and FIGS. 13A and 13B correspond to FIGS. 11A and 11B, respectively. . 13A and 13B, the same components as those shown in FIGS. 11A and 11B are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 13A and 13B, in the light emitting device 100D according to Modification 4 of the present invention, the white resin 30D is formed in a circular ring shape, and each opening 33D of the circular ring white resin 30D has 1 each. Two light emitting units 20 are arranged.

  As described above, the light emitting device, the backlight unit, the liquid crystal display device, and the lighting device according to the present invention have been described based on the embodiment, but the present invention is not limited to this embodiment.

  For example, in the above-described embodiment, the second sealing member that covers the light guide member is a white resin, but is not limited thereto. As the second sealing member, various resins such as colored resin or transparent resin other than white resin can be used instead of white resin. However, the second sealing member is preferably provided with a reflecting function, and when a transparent resin is used, it is preferable that the second sealing member is configured so that light from the light emitting portion does not enter the transparent resin. For example, light can be reflected on the surface of the transparent resin by adjusting the refractive index and shape of the transparent resin. Moreover, it is preferable that the interface of a 1st sealing member is an open type with respect to a LED chip upper surface direction seeing from an LED chip. With this configuration, the light emitted in the horizontal direction of the substrate is efficiently reflected from the interface, whereby the direction of the light emitted from the LED chip can be changed to the upper direction of the LED chip. Therefore, the light emitted in the direction of the adjacent LED chip can be reduced, and as a result, the effect of further suppressing re-incident is obtained. Moreover, when using transparent resin, in order to expand a light emission area | region, you may comprise so that light may be actively guided in transparent resin. However, in this case, the light guided into the transparent resin is preferably emitted in the direction of the light extraction surface, and is configured to prevent the light emitted from the transparent resin from entering the light guiding member or the light emitting unit. There is a need.

  In the above-described embodiment, the material for covering the electrostatic protection element is the same material as the white resin formed between the light emitting portions, but is not limited thereto. As a material for covering the electrostatic protection element, a transparent resin that does not include a light wavelength converter may be used. In this case, the effect of reflecting the light by the transparent resin is poor, but since the light wavelength converter is not included, there is no problem that the incident white light is re-excited.

  Moreover, although this embodiment demonstrated centering on the case where a light guide member is covered with white resin, it is not restricted to this. That is, you may comprise so that white resin may not cover a light guide member. In this case, at least a reflective resin having reflectivity may be formed between adjacent light emitting portions. Thereby, in two different light emitting parts, the light emitted from one light emitting part is reflected by the reflective resin in the vicinity of the one light emitting part, so that the light emitted from the one light emitting part is emitted from the other light emitting part. It can suppress entering into a part. Therefore, it is possible to suppress the occurrence of re-excitation caused by the light of one light emitting unit entering the other light emitting unit. As a result, light loss due to re-excitation can be reduced, so that light extraction efficiency can be improved. Furthermore, since the chromaticity shift can be suppressed by suppressing the occurrence of re-excitation, the occurrence of color unevenness and brightness unevenness can be reduced.

  In the present embodiment, the LED chip 21 is an upper surface two-electrode type LED chip in which both the p-side electrode 21a and the n-side electrode 21b are formed on the upper surface side, but is not limited thereto. For example, an upper and lower electrode type LED chip in which a p-side electrode (or n-side electrode) is formed on the upper surface and an n-side electrode (or p-side electrode) is formed on the lower surface may be used. Further, the LED chip and the metal wiring may be connected by flip chip mounting in which a bump is provided between the LED chip and the metal wiring without using a wire. By adopting flip chip mounting, there is no reflection by the wire, so that the light extraction efficiency can be improved.

  Moreover, in this embodiment, although the light-emitting device was comprised so that white light might be emitted by blue LED and yellow fluorescent substance, it is not restricted to this. You may comprise so that white light may be emitted by using what contains red fluorescent substance and green fluorescent substance as fluorescent substance containing resin, and combining with blue LED.

In the present embodiment, a metal base substrate is used as the substrate 10, but is not limited thereto. For example, an insulating substrate such as a ceramic substrate made of AlO ₃ may be used. In this case, since the ceramic substrate has an insulating property, it is not necessary to form the insulating film 11 on the substrate surface.

  Further, in the present embodiment, the plurality of bare chips 21 are mounted in a line on the substrate 10, but are configured to be mounted in a plurality of lines of two (two-dimensional) or more. It doesn't matter.

  In the above-described embodiment, a groove may be formed on the substrate in order to regulate the positions of the white resin and the phosphor-containing resin. For example, a pair of opposed grooves can be formed so as to sandwich a region where the white resin and the phosphor-containing resin are formed. As a result, the edge of the white resin and the phosphor-containing resin is regulated by the edge of the groove due to the surface tension of the white resin and the phosphor-containing resin, so the width of the white resin and the phosphor-containing resin is controlled. can do. Further, the white resin and the phosphor-containing resin can be formed into a desired dome shape by regulating the end portions of the white resin and the phosphor-containing resin by the surface tension in this way.

  Moreover, although the said embodiment demonstrated the application example to a backlight unit, a liquid crystal display device, or an illuminating device as an application example of a light-emitting device, this is not restricted. In addition, the present invention can be applied to, for example, a lamp light source, a guide light, or a signboard device of a copying machine. Furthermore, it can also be used as a light source for industrial use such as an inspection line light source.

  In addition, the present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  The present invention is a light emitting device using a semiconductor light emitting element such as an LED as a light source, a backlight unit, a liquid crystal display device, an illumination device such as a straight fluorescent lamp, an electronic device such as a guide light, a signage device, or a copying machine, or It can be widely used in industrial applications such as inspection line light sources.

10, 710, 810 Substrate 11 Insulating film 20, 220, 720 Light emitting part 21, 621, 721, 821 LED chip 21a P-side electrode 21b N-side electrode 22, 222, 722, 822 Phosphor-containing resin 30, 30a, 30b, 30B, 30C, 30D, 51, 230, 330 White resin 31A, 52A Reflective member 31C Long side part 32C Partition part 33C, 33D Opening part 40, 740, 840 Metal wiring 41 Plating 50, 750 Electrostatic protective element 60, 760 Wire 70 Die attach material 80 Resist 100, 100A, 100B, 100C, 100D, 200, 300, 440, 521, 700, 800 Light emitting device 400, 520 Back light unit 410 Housing 411 Opening 412 Flange 413 Screw hole 420 Reflective sheet 430 Light guide 450 optical sheet group 451 diffusion sheet 452 prism sheet 453 polarizing sheet 460 front frame 461 screw 470 heatsink 500 liquid crystal display device 510 liquid crystal display panel 530 housing 600 illumination device 610 glass tube 620 emitting device 630 base pins 640 cap 830 light emitting module

Claims (20)

A substrate,
A semiconductor light emitting device mounted on the substrate;
A first sealing member that includes a light wavelength converter and covers the semiconductor light emitting element;
A light guide member disposed in the vicinity of the semiconductor light emitting element,
The light guide member is covered with a second sealing member made of a resin that does not include a light wavelength converter. A plurality of the semiconductor light emitting elements are mounted in a straight line,
The light emitting device according to claim 1, wherein the second sealing member is formed at least between the adjacent semiconductor light emitting elements. The light-emitting device according to claim 2, wherein the light guiding member is a metal wiring formed on the substrate, or a wire that connects the semiconductor light-emitting element and the metal wiring. The light emitting device according to claim 2, wherein the second sealing member is a white resin containing white particles. The light emitting device according to claim 2, wherein a reflective member is formed on the second sealing member. The light emitting device according to claim 2, wherein the second sealing member is made of a transparent resin. The light emitting device according to claim 1, wherein the first sealing member is formed so as to cover at least a part of the second sealing member. When the refractive index of the first sealing member is n1, and the refractive index of the second sealing member is n2,
The light emitting device according to claim 7, wherein n1> n2. When the width of the lower part of the first sealing member is W1, and the width of the lower part of the second sealing member is W2,
It is 0.04 <= W2 / W1 <= 40, The light-emitting device of any one of Claims 1-8. The light emitting device according to claim 1, wherein the light guiding member is an electrostatic protection element mounted on the substrate for electrostatic protection of the semiconductor light emitting element. The light emitting device according to claim 10, wherein the second sealing member is a white resin containing white particles. The light emitting device according to claim 10, wherein a reflective member is formed on the second sealing member. The light emitting device according to claim 10, wherein the second sealing member is made of a transparent resin. The light emitting device according to claim 1, wherein a distance between the semiconductor light emitting element and the second sealing member is 20 mm or less. The light emitting device according to claim 1, wherein the first sealing member has a dome shape. A substrate,
A plurality of semiconductor light emitting devices mounted on the substrate;
A first sealing member that includes a light wavelength converter and covers the semiconductor light emitting element in a dome shape;
And a resin formed between adjacent semiconductor light emitting elements and containing reflective particles. The substrate is elongate,
When the length of the long side of the substrate is L1, and the length of the short side of the substrate is L2,
It is 10 <= L1 / L2. The light-emitting device of any one of Claims 1-16. A backlight unit comprising the light emitting device according to claim 1. The backlight unit according to claim 18;
A liquid crystal panel disposed on an optical path of light emitted from the backlight unit. An illumination device comprising the light-emitting device according to claim 1.

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