JP2008166462A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
JP2008166462A
JP2008166462A JP2006353727A JP2006353727A JP2008166462A JP 2008166462 A JP2008166462 A JP 2008166462A JP 2006353727 A JP2006353727 A JP 2006353727A JP 2006353727 A JP2006353727 A JP 2006353727A JP 2008166462 A JP2008166462 A JP 2008166462A
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting element
reflecting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006353727A
Other languages
Japanese (ja)
Other versions
JP4826470B2 (en
Inventor
Morihito Kaneda
守人 金田
Junji Takechi
順司 武市
Hiroshi Ichikawa
博史 市川
Masaru Kato
勝 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2006353727A priority Critical patent/JP4826470B2/en
Publication of JP2008166462A publication Critical patent/JP2008166462A/en
Application granted granted Critical
Publication of JP4826470B2 publication Critical patent/JP4826470B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device of high reliability. <P>SOLUTION: The light-emitting device comprises a substrate, a light-emitting element arranged on the substrate, a reflecting member which reflects light of the light-emitting element, a bonding member for bonding the substrate and the reflecting member, and a sealing member which covers the light-emitting element and is arranged on the substrate separated from the reflecting member. The bonding member comprises a protruding part that protrudes from the lower end of the reflecting member to the light-emitting element side, with the protruding part covered with the sealing member. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光装置に関し、特に、発光素子を有する発光装置に関する。   The present invention relates to a light emitting device, and particularly to a light emitting device having a light emitting element.

発光素子を用いた発光装置は、小型で電力効率が良く色ムラのない発光をすることが要求されている。また、このような発光装置として、図１１に示すように、発光素子１１１に蛍光体を含有する樹脂１１２を塗布するものが知られている。蛍光体は発光素子１１１からの光の一部を吸収して波長変換することにより、発光素子１１１からの光と蛍光体からの光との混色光を得ることができる。   A light-emitting device using a light-emitting element is required to emit light with a small size, power efficiency, and no color unevenness. As such a light-emitting device, as shown in FIG. 11, a device in which a resin 112 containing a phosphor is applied to a light-emitting element 111 is known. The phosphor absorbs part of the light from the light emitting element 111 and converts the wavelength, whereby mixed light of the light from the light emitting element 111 and the light from the phosphor can be obtained.

例えば、従来の発光装置として以下の構成を有するものがある。図１０は、発光素子１０１を囲むように基板１０５に反射部材１０６が設けられている。発光素子１０１は、蛍光物質を含有する封止部材１０２により被覆されており、封止部材の側面１０２ｂは、反射部材の反射面１０６ｂから離間している。これにより、反射部材１０６の形状に影響されること無く、発光素子１０１の周囲に封止部材１０２を均一な厚さにて配置することができる。つまり、発光素子１０１からの光が、封止部材１０２を透過する距離を均一に近づけることができ、蛍光物質１０８の波長変換効率がばらつくのを有効に抑制して色ムラを非常に少なくすることができる（特許文献１）。
特開２００４−１７２５８６ For example, some conventional light emitting devices have the following configuration. In FIG. 10, the reflective member 106 is provided on the substrate 105 so as to surround the light emitting element 101. The light emitting element 101 is covered with a sealing member 102 containing a fluorescent material, and the side surface 102b of the sealing member is separated from the reflecting surface 106b of the reflecting member. Accordingly, the sealing member 102 can be disposed with a uniform thickness around the light emitting element 101 without being affected by the shape of the reflecting member 106. That is, the distance through which the light from the light emitting element 101 passes through the sealing member 102 can be made uniform, and the wavelength conversion efficiency of the fluorescent material 108 is effectively suppressed, and color unevenness is extremely reduced. (Patent Document 1).
JP2004-172586

しかしながら、特許文献１の発光装置のように、封止部材の側面１０２ｂと反射部材の反射面１０６ｂとが離間することにより、封止部材１０２は基板１０５のみと接している状態となる。このため、封止部材１０２は、他の部材と接する面積が発光装置（図１１）と比べて減少し、密着性が低下する。また、封止部材１０２と材質の異なる導電性部材１０３が基板１０５に設けられることにより、封止部材１０２と基板１０５との密着性はさらに低下し、剥離の問題が発生する。さらに、基板１０５は、その表面に設けられた導電性部材１０３により段差ができるため、反射部材１０６を設ける際に、基板１０５と反射部材１０６との間に隙間ができる。これにより、基板１０５と反射部材１０６との密着性の低下や、隙間から発光素子からの光が外部に漏れる等の問題が発生する。これらの問題は、発光装置が小型化することでさらに顕著となる。
そこで、本発明は、信頼性の高い発光装置を提供することを目的とする。 However, as in the light emitting device of Patent Document 1, the side surface 102b of the sealing member and the reflection surface 106b of the reflection member are separated from each other, so that the sealing member 102 is in contact with only the substrate 105. For this reason, as for the sealing member 102, the area which contacts another member reduces compared with a light-emitting device (FIG. 11), and adhesiveness falls. Further, when the conductive member 103 made of a material different from that of the sealing member 102 is provided on the substrate 105, the adhesion between the sealing member 102 and the substrate 105 is further lowered, and a problem of peeling occurs. Further, since the substrate 105 has a step due to the conductive member 103 provided on the surface thereof, a gap is formed between the substrate 105 and the reflection member 106 when the reflection member 106 is provided. As a result, problems such as a decrease in the adhesion between the substrate 105 and the reflecting member 106 and light from the light emitting element leaking to the outside through the gaps occur. These problems become more prominent when the light emitting device is downsized.
Therefore, an object of the present invention is to provide a highly reliable light-emitting device.

本発明によれば、前記課題は次の手段により解決される。   According to the present invention, the above problem is solved by the following means.

基板と、前記基板に配置された発光素子と、前記発光素子の光を反射させる反射部材と、前記基板および前記反射部材を接着する接着部材と、前記発光素子を被覆し、且つ、前記反射部材から離間して前記基板に配置された封止部材と、を有する発光装置であって、前記接着部材は、前記反射部材の下端から前記発光素子側に突出された突出部を有し、その突出部が前記封止部材により覆われていることを特徴とする。これにより、信頼性の高い発光装置を得ることができる。   A substrate, a light emitting element disposed on the substrate, a reflecting member that reflects light of the light emitting element, an adhesive member that bonds the substrate and the reflecting member, and the light emitting element is covered; and the reflecting member A sealing member disposed on the substrate and spaced apart from the light-emitting device, wherein the adhesive member has a protrusion protruding from the lower end of the reflecting member toward the light-emitting element, and the protrusion The portion is covered with the sealing member. Thereby, a highly reliable light-emitting device can be obtained.

前記反射部材は、第１の反射面および第２の反射面を少なくとも有し、前記第１の反射面の上端は前記反射部材の上面と接し、前記第１の反射面の下端は前記第２の反射面と接しており、前記第１の反射面および前記第２の反射面は、前記発光素子の載置面に対して角度が互いに異なることが好ましい。これにより、発光装置を小型化することができると共に、本発明の効果が特に有効に作用する。
前記第１の反射面および前記第２の反射面のうち一方が、前記発光素子の載置面に対して略垂直であることが好ましい。これにより、発光装置をさらに小型化することができる。
前記封止部材は、前記第１の反射面の下端より低くなるように設けられていることが好ましい。これにより、発光装置をさらに小型化することができると共に、封止部材から射出された発光素子からの光を反射部材で効率よく利用することができる。 The reflecting member has at least a first reflecting surface and a second reflecting surface, an upper end of the first reflecting surface is in contact with an upper surface of the reflecting member, and a lower end of the first reflecting surface is the second reflecting surface. Preferably, the first reflection surface and the second reflection surface are different in angle with respect to the mounting surface of the light emitting element. As a result, the light emitting device can be reduced in size, and the effects of the present invention are particularly effective.
One of the first reflecting surface and the second reflecting surface is preferably substantially perpendicular to the mounting surface of the light emitting element. Thereby, the light emitting device can be further reduced in size.
The sealing member is preferably provided so as to be lower than the lower end of the first reflecting surface. Accordingly, the light emitting device can be further reduced in size, and light from the light emitting element emitted from the sealing member can be efficiently used by the reflecting member.

前記発光装置において、さらに、レンズを有し、前記レンズの一部は、前記反射部材と前記封止部材との離間部にまで入り込み、かつ、前記封止部材を覆うように設けることができる。これにより、発光素子からの光を目的に応じた配光にすることができると共に、封止部材の密着性を向上することができ、信頼性の高い発光装置を得ることができる。   The light emitting device may further include a lens, and a part of the lens may be provided so as to enter a space between the reflecting member and the sealing member and cover the sealing member. Thereby, the light from the light emitting element can be distributed according to the purpose, the adhesion of the sealing member can be improved, and a highly reliable light emitting device can be obtained.

本発明によれば、信頼性の高い発光装置を提供することができる。   According to the present invention, a highly reliable light-emitting device can be provided.

本発明を実施するための最良の形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明は発光装置を以下に限定するものではない（実施例でも同様とする）。   The best mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies the light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the following (the same applies to the examples). .

また、本明細書は特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特に特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細な説明を適宜省略する。さらに、本発明を構成する各要素は、複数の要素を同一の部材で構成して一の部材で複数の要素を兼用する態様としてもよいし、逆に一の部材の機能を複数の部材で分担して実現することもできる。   Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

＜第１の実施の形態＞
第１の実施の形態に係る発光装置は、以下の構成を採る。図１乃至３は、第１の実施の形態に係る発光装置を示す概略図である。図１は、第１の実施の形態に係る発光装置の概略平面図（図２）におけるX−X′線にて切断した際に得られる概略断面図を示す。図２は、第１の実施の形態に係る発光装置の概略平面図を示す。図３は、第１の実施の形態に係る発光装置における反射部材１６と封止部材１２とが離間した部分の拡大断面図を示す。 <First Embodiment>
The light emitting device according to the first embodiment has the following configuration. 1 to 3 are schematic views showing the light emitting device according to the first embodiment. FIG. 1 is a schematic cross-sectional view obtained when the light-emitting device according to the first embodiment is cut along the XX ′ line in the schematic plan view (FIG. 2). FIG. 2 is a schematic plan view of the light emitting device according to the first embodiment. FIG. 3 is an enlarged cross-sectional view of a portion where the reflecting member 16 and the sealing member 12 are separated from each other in the light emitting device according to the first embodiment.

図１に示すように、第１の実施の形態に係る発光装置は、発光素子１１と封止部材１２と導電性部材１３とワイヤ１４と基板１５と反射部材１６と接着部材１７と蛍光物質１８とを備えて構成されている。
発光素子１１は、導電性部材１３を有する基板１５に載置されている。本例では、ダイボンド部材（図示しない）を介して導電性部材１３に固着されている。発光素子１１と導電性部材１３とはワイヤ１４により電気的に接続されている。反射部材１６は、発光素子１１を囲むように基板１５（発光素子１１の載置面側）に設けられており、接着部材１７により基板１５と接着されている。このとき、接着部材１７は、反射部材１６の下端から発光素子１１側に突出された突出部を有しており、その突出部は封止部材１２により覆われている。さらに、封止部材１２は、発光素子１１およびワイヤ１４を被覆し、かつ、反射部材１６から離間して基板１５に配置されている。また、封止部材１２には、蛍光物質１８を含有することができ、発光素子１１からの光を波長変換し外部へ放出することができる。 As shown in FIG. 1, the light emitting device according to the first embodiment includes a light emitting element 11, a sealing member 12, a conductive member 13, a wire 14, a substrate 15, a reflecting member 16, an adhesive member 17, and a fluorescent material 18. And is configured.
The light emitting element 11 is placed on a substrate 15 having a conductive member 13. In this example, it is fixed to the conductive member 13 via a die bond member (not shown). The light emitting element 11 and the conductive member 13 are electrically connected by a wire 14. The reflecting member 16 is provided on the substrate 15 (the mounting surface side of the light emitting element 11) so as to surround the light emitting element 11, and is bonded to the substrate 15 by the adhesive member 17. At this time, the adhesive member 17 has a protruding portion protruding from the lower end of the reflecting member 16 toward the light emitting element 11, and the protruding portion is covered with the sealing member 12. Further, the sealing member 12 covers the light emitting element 11 and the wire 14 and is disposed on the substrate 15 apart from the reflecting member 16. Further, the sealing member 12 can contain the fluorescent material 18, and the light from the light emitting element 11 can be wavelength-converted and emitted to the outside.

これにより、色ムラを抑制すると共に、封止部材が基板から剥離することを抑制することができる。
さらに、第１の実施の形態に係る発光装置は、基板１５と反射部材１６との間に発生する隙間など（基板１５および反射部材１６のそれぞれの接着面にある微細な凹凸や、導電性部材１３と基板１５による段差など）を、接着部材１７により埋めることができる。これにより、基板１５と反射部材１６との密着性の低下や、隙間から発光素子１１からの光が外部に漏れることを抑制することができる。 Thereby, while suppressing color nonuniformity, it can suppress that a sealing member peels from a board | substrate.
Furthermore, the light emitting device according to the first embodiment includes a gap generated between the substrate 15 and the reflecting member 16 (such as fine irregularities on the bonding surfaces of the substrate 15 and the reflecting member 16, or conductive members). 13 and the substrate 15 can be filled with the adhesive member 17. Thereby, it is possible to suppress a decrease in adhesion between the substrate 15 and the reflecting member 16 and leakage of light from the light emitting element 11 from the gap to the outside.

以下、本形態の各構成について詳述する。   Hereinafter, each structure of this form is explained in full detail.

（基板１５）
基板１５は、発光素子１１の載置面側（表面側）、および、載置面と対向する面側（裏面側）に、導電性部材１３がパターン形成されている。基板１５は貫通孔を有しており、その内部にまで導電性部材１３が形成されている。これにより、基板１５の表面側および裏面側に設けられた各導電性部材１３のパターンを電気的に接続することができる。
また、導電性部材１３には、発光素子１１を配置するための載置部（図示しない）を有することができる。これより、発光素子１１からの熱を効率的に外部へ放出できるため、ヒートシンクとしても用いることができ好ましい。
ただし、本明細書における載置部は、発光素子１１を配置することができる部位のことであり、導電性部材１３上に限定されることなく、導電性部材１３を絶縁して保持する基板１５などの絶縁体上でもよい。
また、導電性部材１３とは別に、発光素子１１と電気的に接続されていない放熱部材（図示しない）を載置部とすることもできる。これにより、ヒートシンクとして、さらに放熱性の高い材料を選択することができる。放熱部材の材料としては、熱伝導性に優れた金属を主原料とする金属材であれば特に限定されず、銅や鉄、アルミニウム、マグネシウム、などを好適に用いることができる。 (Substrate 15)
As for the board | substrate 15, the conductive member 13 is pattern-formed by the mounting surface side (front surface side) of the light emitting element 11, and the surface side (back surface side) facing a mounting surface. The board | substrate 15 has a through-hole and the electroconductive member 13 is formed in the inside. Thereby, the pattern of each conductive member 13 provided on the front surface side and the back surface side of the substrate 15 can be electrically connected.
Further, the conductive member 13 can have a placement portion (not shown) for placing the light emitting element 11. As a result, heat from the light emitting element 11 can be efficiently discharged to the outside, which is preferable because it can also be used as a heat sink.
However, the mounting portion in the present specification is a portion where the light emitting element 11 can be disposed, and is not limited to the conductive member 13, and the substrate 15 that insulates and holds the conductive member 13. It may be on an insulator.
In addition to the conductive member 13, a heat radiating member (not shown) that is not electrically connected to the light emitting element 11 can be used as the mounting portion. Thereby, a material with higher heat dissipation can be selected as the heat sink. The material of the heat radiating member is not particularly limited as long as it is a metal material mainly made of a metal having excellent thermal conductivity, and copper, iron, aluminum, magnesium, and the like can be suitably used.

このような基板１５の材料としては、エポキシ樹脂、液晶ポリマーなどの樹脂基板や、有機物に無機物が含有されているガラスエポキシ基板などのハイブリッド基板、セラミック基板などの無機物基板などを用いることができる。特に、高耐熱性、高耐候性が望まれる場合、ハイブリッド基板や無機物基板を用いることが好ましい。本形態に係る発光装置は、基板１５に他の部材を複数組み立て加工し発光装置の集合体を形成した後、個々に分割することで、複数の発光装置を低コストで得ることができる。また、高いコントラストが要求される発光装置を形成する場合は、絶縁性基板の母材自体にＣｒ２Ｏ３、ＭｎＯ２、ＴｉＯ２、Ｆｅ２Ｏ３などを含有させることにより、暗色系の絶縁性基板とすることが好ましい。 As the material of the substrate 15, a resin substrate such as an epoxy resin or a liquid crystal polymer, a hybrid substrate such as a glass epoxy substrate in which an inorganic substance is contained in an organic substance, an inorganic substrate such as a ceramic substrate, or the like can be used. In particular, when high heat resistance and high weather resistance are desired, it is preferable to use a hybrid substrate or an inorganic substrate. In the light emitting device according to this embodiment, a plurality of light emitting devices can be obtained at low cost by assembling a plurality of other members on the substrate 15 to form an assembly of the light emitting devices and then dividing them individually. Further, when forming a light emitting device that requires high contrast, dark-colored insulation can be achieved by including Cr 2 O 3 , MnO 2 , TiO 2 , Fe 2 O 3, etc. in the base material of the insulating substrate itself. It is preferable to use a conductive substrate.

（導電性部材１３）
導電性部材１３は、基板１５の表面側から裏面側まで連続的に形成されている。この導電性部材１３の配線パターンは、発光素子１１の個数、種類、大きさなどにより、適宜変更することができる。導電性部材１３の材料は、導電性を有していれば特に限定されず、高い熱伝導性を有していることが好ましい。このような材料として、銅、鉄、タングステン、クロム、チタン、コバルト、モリブデンやこれらの合金などが挙げられる。また、導電性部材１３の最表面は、載置する発光素子１０からの光に対して高い反射率を有する部材、例えば金、銀、アルミニウムなどで被覆されていることが好ましい。また、外部に露出している導電性部材には、酸化もしくは硫化防止膜が形成されていることが好ましい。 (Conductive member 13)
The conductive member 13 is continuously formed from the front surface side to the back surface side of the substrate 15. The wiring pattern of the conductive member 13 can be appropriately changed depending on the number, type, size, and the like of the light emitting elements 11. The material of the conductive member 13 is not particularly limited as long as it has conductivity, and preferably has high thermal conductivity. Examples of such materials include copper, iron, tungsten, chromium, titanium, cobalt, molybdenum, and alloys thereof. Moreover, it is preferable that the outermost surface of the conductive member 13 is covered with a member having a high reflectance with respect to light from the light emitting element 10 to be placed, for example, gold, silver, aluminum or the like. The conductive member exposed to the outside is preferably provided with an oxidation or sulfidation prevention film.

（発光素子１１）
発光素子１１は、好適には発光ダイオード（ＬＥＤ）やレーザーダイオード（ＬＤ）のような半導体発光素子を用いることができる。
発光素子１１は、所望に応じて適宜複数個用いることができ、載置部にダイボンド部材（図示しない）を用いて固定される。また、発光素子１１には、同一面側に正負の電極を有し、その電極と導電性部材１３とがワイヤ１４により電気的に接続されるものの他、表面と裏面とに電極を有するものも使用することができる。この場合、裏面側の電極と第１の導電性部材とは半田や銀ペースト等のダイボンド部材を用いて電気的に接続し、表面側の電極と第２の導電性部材とはワイヤ１４を介して電気的に接続されている。また、図には示さないが、発光素子１１はフリップチップ実装するものも用いることができる。
複数の発光素子１１を有する場合は、各発光素子１１を直列および並列的に接続することができる。また、それぞれの発光素子１１間をワイヤ１４により接続し、電気的導通を直接とることもできる。これにより、導電性部材１３を介してそれぞれの発光素子１１をワイヤ１４で接続する必要がなくなるため、ワイヤ１４を接続するための導電性部材１３の面積を減らすことができる。したがって、封止部材１２の密着性の向上や発光装置の小型化が可能となる。 (Light emitting element 11)
As the light emitting element 11, a semiconductor light emitting element such as a light emitting diode (LED) or a laser diode (LD) can be preferably used.
A plurality of the light emitting elements 11 can be used as appropriate, and are fixed to the mounting portion using a die bond member (not shown). In addition, the light emitting element 11 has positive and negative electrodes on the same surface side, and the electrode and the conductive member 13 are electrically connected by the wire 14, and the light emitting element 11 has electrodes on the front surface and the back surface. Can be used. In this case, the back-side electrode and the first conductive member are electrically connected using a die bond member such as solder or silver paste, and the front-side electrode and the second conductive member are connected via the wire 14. Are electrically connected. Although not shown in the drawing, the light emitting element 11 may be flip chip mounted.
When it has the some light emitting element 11, each light emitting element 11 can be connected in series and parallel. In addition, the respective light emitting elements 11 can be connected by wires 14 to directly establish electrical continuity. Thereby, since it becomes unnecessary to connect each light emitting element 11 with the wire 14 via the electroconductive member 13, the area of the electroconductive member 13 for connecting the wire 14 can be reduced. Therefore, the adhesion of the sealing member 12 can be improved and the light emitting device can be downsized.

このような発光素子１１としては、ＧａＡｌＮ、ＺｎＳ、ＺｎＳｅ、ＳｉＣ、ＧａＰ、ＧａＡｌＡｓ、ＡｌＮ、ＩｎＮ、ＡｌＩｎＧａＰ、ＩｎＧａＮ、ＧａＮ、ＡｌＩｎＧａＮ等の半導体を発光層として形成させたものが用いられる。半導体の構造としては、ＭＩＳ接合、ＰＩＮ接合やＰＮ接合を有したホモ構造、ヘテロ構造あるいはダブルへテロ構成などが挙げられる。半導体層の材料やその混晶度によって発光波長を紫外光から赤外光まで種々選択することができる。発光層は、量子効果が生ずる薄膜とした単一量子井戸構造や多重量子井戸構造としても良い。   As such a light-emitting element 11, a device in which a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN is formed as a light-emitting layer is used. Examples of the semiconductor structure include a homostructure having a MIS junction, a PIN junction, and a PN junction, a heterostructure, and a double hetero configuration. Various emission wavelengths can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal. The light emitting layer may have a single quantum well structure or a multiple quantum well structure which is a thin film in which a quantum effect is generated.

（ワイヤ１４）
ワイヤ１４は、通常、発光素子１１の表面に形成された電極と導電性部材１３との間を電気的に接続する（ワイヤボンディングする）ために用いられる部材である。そのため、ワイヤ１４は、発光素子１１の電極とのオーミック性が良好であるか、機械的接続性が良好であるか、電気伝導性及び熱伝導性が良好なものであることが好ましい。熱伝導率（１００℃時）としては、１０Ｗ・ｍ−１・Ｋ−１程度以上が好ましく、さらに１００Ｗ・ｍ−１・Ｋ−１程度以上がより好ましい。作業性などを考慮すると、ワイヤ１４の直径は、１０μｍ〜４５μｍ程度であることが好ましい。このようなワイヤ１４の材料としては、例えば、金、銅、白金、アルミニウム等の金属及びそれらの合金が挙げられる。なかでも、接合信頼性、接合後の応力緩和等の観点から、金が好ましい。 (Wire 14)
The wire 14 is a member that is usually used to electrically connect (wire bond) the electrode formed on the surface of the light emitting element 11 and the conductive member 13. Therefore, it is preferable that the wire 14 has good ohmic property with the electrode of the light emitting element 11, good mechanical connectivity, or good electrical conductivity and thermal conductivity. The thermal conductivity (at 100 ° C.) is preferably about 10 W · m −1 · K −1 or more, and more preferably about 100 W · m −1 · K −1 or more. Considering workability and the like, the diameter of the wire 14 is preferably about 10 μm to 45 μm. Examples of the material of the wire 14 include metals such as gold, copper, platinum, and aluminum, and alloys thereof. Among these, gold is preferable from the viewpoints of bonding reliability, stress relaxation after bonding, and the like.

（ダイボンド部材（図示しない））
ダイボンド部材は、発光素子１１を載置部に固定させるための部材であり、発光素子１１を接着可能な部材であれば特に限定されない。特に、熱引きを考慮すると、Ａｇペースト、カーボンペースト、ＩＴＯペーストあるいは金属バンプ等を用いることが好ましい。特に、発熱量の多いパワー系発光装置の場合、融点が高いことから高温下にて組織的構造が変化することが少なく力学特性の低下が少ないＡｕ−Ｓｎ系の共晶はんだを用いることが好ましい。さらに、載置部を導電性部材１３に有する場合、発光素子１１の下面と導電性部材１３とは、部分的に接合されていることが好ましい。これにより、発光素子１１の下面から放出される光が全反射されることによる発光素子１１内部の光閉じこめを抑制することができる。この光閉じこめの抑制は、発光素子１１の光取り出し効率を向上させることができるだけでなく、発光装置の温度上昇をも抑制することができる。 (Die bond member (not shown))
The die bond member is a member for fixing the light emitting element 11 to the mounting portion, and is not particularly limited as long as it is a member capable of bonding the light emitting element 11. In particular, considering heat pulling, it is preferable to use Ag paste, carbon paste, ITO paste, metal bump, or the like. In particular, in the case of a power-type light emitting device with a large calorific value, it is preferable to use an Au—Sn-based eutectic solder that has a high melting point so that the structural structure does not change at high temperatures and the deterioration of mechanical properties is small. . Furthermore, when the conductive member 13 has the placement portion, it is preferable that the lower surface of the light emitting element 11 and the conductive member 13 are partially joined. Thereby, light confinement inside the light emitting element 11 due to total reflection of light emitted from the lower surface of the light emitting element 11 can be suppressed. This suppression of light confinement can not only improve the light extraction efficiency of the light emitting element 11, but also suppress the temperature rise of the light emitting device.

（封止部材１２）
封止部材１２は、基板１５の表面側において、発光素子１１、導電性部材１３、ワイヤ１４、接着部材１７を被覆しており、外部環境からの外力や水分などから各部材を保護するものである。また、封止部材１２は、印刷などの成形方法により、発光素子１１の周囲に略均一な厚さで設けることができる。他には、封止部材１２を滴下（ポッティング）することにより表面張力が働き、半球状に設けることもできる（図示しない）。これにより、レンズ効果を得ることができ、発光素子１１からの光をより効率的に放出することができる。 (Sealing member 12)
The sealing member 12 covers the light emitting element 11, the conductive member 13, the wire 14, and the adhesive member 17 on the surface side of the substrate 15, and protects each member from external force or moisture from the external environment. is there. Further, the sealing member 12 can be provided with a substantially uniform thickness around the light emitting element 11 by a molding method such as printing. In addition, surface tension works by dropping (potting) the sealing member 12, and it can also be provided in a hemispherical shape (not shown). Thereby, a lens effect can be acquired and the light from the light emitting element 11 can be more efficiently emitted.

本実施の形態において、封止部材１２は、反射部材１６から離間して配置されている。離間する距離は、５０μｍ〜４００μｍが好ましく、さらに好ましくは５０μｍ〜２００μｍである。これにより、発光装置の小型化などによる反射部材１６の形状に影響されること無く、発光素子１１からの光が封止部材１２を透過する距離を均一に近づけることができる。このため、封止部材１２に蛍光物質１８が含有された場合、蛍光物質１８の波長変換効率がばらつくのを有効に抑制できる。また、蛍光物質１８によって波長変換された発光素子１１からの光を、一度、外部（空気）を介して反射部材１６で反射させることができるため、光の利用効率が向上する。
また、封止部材１２は、接着部材１７の突出部を被覆することにより、封止部材１２の密着性を向上することができる。封止部材１２は、少なくともその外周部分にて接着部材１７を被覆しており、基板１５の表面側において、導電性部材１３が外部に露出しないよう設けることが好ましい。これにより、導電性部材１３が酸化や硫化などにより劣化し、輝度が低下することを抑制することができる。 In the present embodiment, the sealing member 12 is disposed away from the reflecting member 16. The separation distance is preferably 50 μm to 400 μm, more preferably 50 μm to 200 μm. Thereby, the distance which the light from the light emitting element 11 permeate | transmits the sealing member 12 can be approached uniformly, without being influenced by the shape of the reflection member 16 by size reduction of a light-emitting device, etc. For this reason, when the fluorescent material 18 is contained in the sealing member 12, it can suppress effectively that the wavelength conversion efficiency of the fluorescent material 18 varies. Moreover, since the light from the light emitting element 11 wavelength-converted by the fluorescent material 18 can be reflected once by the reflecting member 16 via the outside (air), the light use efficiency is improved.
Moreover, the sealing member 12 can improve the adhesion of the sealing member 12 by covering the protruding portion of the adhesive member 17. The sealing member 12 covers the adhesive member 17 at least at the outer peripheral portion thereof, and is preferably provided on the surface side of the substrate 15 so that the conductive member 13 is not exposed to the outside. Thereby, it can suppress that the electroconductive member 13 deteriorates by oxidation, sulfuration, etc., and a brightness | luminance falls.

このような封止部材１２の材料としては、エポキシ樹脂、ユリア樹脂、シリコーン、変性エポキシ樹脂、変性シリコーン樹脂、ポリアミドなどの耐候性に優れた透明樹脂やガラスなどが好適に用いられる。高密度に発光素子１１を配置させた場合は、熱衝撃による各部材間の接合破壊を抑制するために、エポキシ樹脂、シリコーン樹脂やそれらを組み合わせたものなどを使用することがより好ましい。また、封止部材１２中には、視野角をさらに増やすために拡散剤を含有させても良い。具体的な拡散剤としては、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素等が好適に用いられる。また、所望外の波長をカットする目的で有機や無機の着色染料や着色顔料を含有させることもできる。   As a material for such a sealing member 12, transparent resin or glass having excellent weather resistance such as epoxy resin, urea resin, silicone, modified epoxy resin, modified silicone resin, and polyamide is preferably used. In the case where the light emitting elements 11 are arranged at a high density, it is more preferable to use an epoxy resin, a silicone resin, or a combination thereof in order to suppress joint breakage between members due to thermal shock. Further, the sealing member 12 may contain a diffusing agent in order to further increase the viewing angle. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide or the like is preferably used. Further, organic or inorganic coloring dyes or coloring pigments can be included for the purpose of cutting undesired wavelengths.

（蛍光物質１８）
蛍光物質１８は、発光素子１１からの光を吸収し異なる波長の光に波長変換するものであればよい。
本実施の形態において、蛍光物質１８は、封止部材１２中に均一に含有されているが、これに限定されず、発光素子１１の周辺に沈降させて配置することもできる。 (Fluorescent substance 18)
The fluorescent material 18 may be any material that absorbs light from the light emitting element 11 and converts the wavelength into light of a different wavelength.
In the present embodiment, the fluorescent material 18 is uniformly contained in the sealing member 12, but the present invention is not limited to this, and the fluorescent material 18 may be disposed around the light emitting element 11.

このような蛍光物質１８の材料としては、例えば、Ｅｕ、Ｃｅ等のランタノイド系元素で主に賦活される窒化物系蛍光体・酸窒化物系蛍光体・サイアロン系蛍光体、Ｅｕ等のランタノイド系、Ｍｎ等の遷移金属系の元素により主に付活されるアルカリ土類ハロゲンアパタイト蛍光体、アルカリ土類金属ホウ酸ハロゲン蛍光体、アルカリ土類金属アルミン酸塩蛍光体、アルカリ土類ケイ酸塩蛍光体、アルカリ土類硫化物蛍光体、アルカリ土類チオガレート蛍光体、アルカリ土類窒化ケイ素蛍光体、ゲルマン酸塩蛍光体、又は、Ｃｅ等のランタノイド系元素で主に付活される希土類アルミン酸塩蛍光体、希土類ケイ酸塩蛍光体又はＥｕ等のランタノイド系元素で主に賦活される有機及び有機錯体等から選ばれる少なくともいずれか１以上であることが好ましい。   Examples of the material of the fluorescent substance 18 include nitride phosphors / oxynitride phosphors / sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce, and lanthanoid substances such as Eu. Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate mainly activated by transition metal elements such as Mn Rare earth aluminate mainly activated by phosphors, alkaline earth sulfide phosphors, alkaline earth thiogallate phosphors, alkaline earth silicon nitride phosphors, germanate phosphors, or lanthanoid elements such as Ce It must be at least one selected from organic phosphors and organic complexes mainly activated with a salt phosphor, a rare earth silicate phosphor, or a lanthanoid element such as Eu. It is preferred.

（反射部材１６）
反射部材１６は、基板１５の表面側に、発光素子１１からの光を反射するように設けられる。例えば、反射部材１６は、載置部を囲むように基板１５の外周部に設けられることが好ましい。
また、反射部材１６は、その上面１６ａの下側に第１の反射面１６ｂを有しており、上面１６ａと第１の反射面１６ｂの上端とは接している。さらに、反射部材１６は、第１の反射面１６ｂの下端と接するように第２の反射面１６ｃを有している。また、第２の反射面の下側にはさらに新たな反射面を有することができ、その反射面は複数有することもできる（図示しない）。
第１の反射面１６ｂと第２の反射面１６ｃとは、発光素子１１の載置面に対する角度が互いに異なる。これにより、色ムラを抑制するために封止部材１２と反射部材１６とを離間させたとしても発光装置を小型化することができる。さらに、発光素子１１が設けられる載置部を十分確保できるため、発光素子１１を複数設けることができる。通常、発光装置の小型化や、複数の発光素子１１を設ける場合は、発光素子１１からの熱がこもりやすくなるため、封止部材１２の剥離や導電性部材１３の劣化などがさらに発生し易くなる。このため、本発明の効果が有効に作用する。
また、反射部材１６は、第１の反射面１６ｂおよび第２の反射面１６ｃのうち一方が、発光素子１１の載置面に対して略垂直であることが好ましい。これにより、発光装置をさらに小型化することができ、本発明の効果がさらに有効に作用する。
また、第１の反射面１６ｂの下端より低くなるよう、封止部材１２を設けることが好ましい。これにより、発光装置を小型化できると共に、封止部材１２の上面１２ａから射出される光を、第１の反射面１６ｂにさらに効率よく照射することができる。
また、反射部材１６の反射面には、金属膜（図示しない）を有することができる。これにより、発光素子１１からの光を効率よく反射することができる。このような金属膜の材料としては、高い反射率を有するものが好ましいが、これに限定されない。外部に露出している金属膜は、導電性部材１３と同様に、酸化もしくは硫化防止膜が形成されていることが好ましい。
また、発光装置の発光面側から見て、基板１５および反射部材１６からなる凹部（開口部）の形状は、特に限定されるものではなく、円形、楕円形、四角形、八角形等様々な形状とすることができる。さらに、凹部は複数設けることもできる。 (Reflection member 16)
The reflecting member 16 is provided on the surface side of the substrate 15 so as to reflect light from the light emitting element 11. For example, the reflecting member 16 is preferably provided on the outer peripheral portion of the substrate 15 so as to surround the mounting portion.
The reflecting member 16 has a first reflecting surface 16b below the upper surface 16a, and the upper surface 16a and the upper end of the first reflecting surface 16b are in contact with each other. Further, the reflecting member 16 has a second reflecting surface 16c so as to contact the lower end of the first reflecting surface 16b. Further, a new reflecting surface can be further provided below the second reflecting surface, and a plurality of reflecting surfaces can be provided (not shown).
The first reflecting surface 16b and the second reflecting surface 16c have different angles with respect to the mounting surface of the light emitting element 11. Thereby, even if the sealing member 12 and the reflecting member 16 are separated in order to suppress color unevenness, the light emitting device can be downsized. Furthermore, since a mounting portion on which the light emitting element 11 is provided can be sufficiently secured, a plurality of light emitting elements 11 can be provided. Normally, when the light emitting device is downsized or a plurality of light emitting elements 11 are provided, heat from the light emitting elements 11 is likely to be trapped, and therefore, the peeling of the sealing member 12 and the deterioration of the conductive member 13 are more likely to occur. Become. For this reason, the effect of this invention acts effectively.
In addition, it is preferable that one of the first reflecting surface 16 b and the second reflecting surface 16 c of the reflecting member 16 is substantially perpendicular to the mounting surface of the light emitting element 11. As a result, the light emitting device can be further reduced in size, and the effects of the present invention are more effective.
Moreover, it is preferable to provide the sealing member 12 so that it may become lower than the lower end of the 1st reflective surface 16b. As a result, the light emitting device can be reduced in size, and light emitted from the upper surface 12a of the sealing member 12 can be more efficiently irradiated onto the first reflecting surface 16b.
The reflective surface of the reflective member 16 can have a metal film (not shown). Thereby, the light from the light emitting element 11 can be reflected efficiently. As a material for such a metal film, a material having a high reflectance is preferable, but the material is not limited thereto. The metal film exposed to the outside is preferably provided with an oxidation or sulfidation prevention film as in the case of the conductive member 13.
In addition, the shape of the recess (opening) formed of the substrate 15 and the reflecting member 16 is not particularly limited when viewed from the light emitting surface side of the light emitting device, and various shapes such as a circle, an ellipse, a rectangle, an octagon, and the like It can be. Furthermore, a plurality of recesses can be provided.

ここで、「載置面に対する角度」とは、反射面と載置部の表面とがなす角度θ（０°＜θ≦９０°）のことである。例えば、図１に示すように、第１の反射面１６ｂと載置部の表面とがなす角度はθ11であり、第２の反射面１６ｃと載置部の表面とがなす角度はθ12である。 Here, the “angle with respect to the placement surface” is an angle θ (0 ° <θ ≦ 90 °) formed by the reflection surface and the surface of the placement portion. For example, as shown in FIG. 1, the angle formed between the first reflective surface 16b and the surface of the mounting portion is θ 11 , and the angle formed between the second reflective surface 16c and the surface of the mounting portion is θ 12. It is.

このような反射部材１６の材料としては、発光素子１１からの光を反射することができるものであれば、どのような材料を用いてもよい。例えば、ポリフタルアミド（ＰＰＡ）、ポリアミド（ＰＡ）、ポリカーボネート樹脂、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）、ＡＢＳ樹脂、エポキシ樹脂、フェノール樹脂、アクリル樹脂、ＰＢＴ樹脂等の樹脂、ガラスエポキシ樹脂、セラミック等が挙げられる。これらの材料には、着色剤として、種々の染料又は顔料等を混合して用いてもよい。例えば、Ｃｒ２Ｏ３、ＭｎＯ２、Ｆｅ２Ｏ３、ＴｉＯ２等が挙げられる。 As a material of the reflection member 16, any material may be used as long as it can reflect light from the light emitting element 11. For example, polyphthalamide (PPA), polyamide (PA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, epoxy resin, phenol resin, acrylic resin, PBT resin, etc., glass epoxy resin And ceramics. In these materials, various dyes or pigments may be mixed and used as a colorant. For example, Cr 2 O 3, MnO 2 , Fe 2 O 3, TiO 2 and the like.

本実施の形態において、図１に示すように、第２の反射面１６ｃは、発光素子１１の載置面に対して略垂直であることが好ましい。これにより、蛍光物質１９を含有する封止部材１２を透過した光（特に、封止部材１２の側面１２ｂから射出された光）が第２の反射面１６ｃに照射されることにより、点光源に近づけることができる。このため、色ムラの低減や配光の調整がし易い発光装置を提供することができる。このとき、第１の反射面１６ｂは、発光素子１１の載置面に対する角度θ１が、０°＜θ１１＜９０°であることが好ましく、更に好ましくは３０°＜θ１１＜６０°である。これにより、発光装置が小型化しても、反射部材１６の強度の低下を抑制すると共に、発光装置自体の反りも抑制することができる。さらに、封止部材１２の上面１２ａから射出される光が第１の反射面１６ｂに照射されることにより、光を効率よく集光することができる。また、封止部材１２は、第１の反射面１６ｂの下端より低くなるように設けることが好ましい。これにより、光源をさらに点光源に近づけることができる。 In the present embodiment, as shown in FIG. 1, the second reflecting surface 16 c is preferably substantially perpendicular to the mounting surface of the light emitting element 11. As a result, light that has passed through the sealing member 12 containing the fluorescent material 19 (particularly, light emitted from the side surface 12b of the sealing member 12) is irradiated onto the second reflecting surface 16c, whereby a point light source is obtained. You can get closer. Therefore, it is possible to provide a light emitting device that can easily reduce color unevenness and adjust light distribution. At this time, the angle θ 1 of the first reflecting surface 16b with respect to the mounting surface of the light emitting element 11 is preferably 0 ° <θ 11 <90 °, and more preferably 30 ° <θ 11 <60 °. is there. Thereby, even if the light emitting device is downsized, it is possible to suppress a decrease in strength of the reflecting member 16 and to suppress warpage of the light emitting device itself. Furthermore, the light emitted from the upper surface 12a of the sealing member 12 is irradiated onto the first reflecting surface 16b, whereby the light can be efficiently collected. Moreover, it is preferable to provide the sealing member 12 so that it may become lower than the lower end of the 1st reflective surface 16b. Thereby, a light source can be brought closer to a point light source.

（接着部材１７）
接着部材１７は、導電性部材１３および基板１５の少なくとも一部を被覆しており、かつ、反射部材１６を基板１５の表面側に固定（接着）している。これにより、基板１５と反射部材１６との間にできる隙間（基板１５および反射部材１６のそれぞれの接着面にある微細な凹凸や、導電性部材１３と基板１５とによる段差など）を埋めることができる。
基板１５と反射部材１６との間に設けられた接着部材１７は、反射部材１６の下端から発光素子１１側に突出しており、その突出部は少なくとも一部が封止部材１２により覆われている。このとき、接着部材１７の突出部は、導電性部材１３が外部に露出しないように封止部材１２に覆われるほうが好ましい。これにより、封止部材１２の密着性を向上できる他、導電性部材１３の劣化（酸化、硫化等）を防止することができる。
また、接着部材１７は、複数設けることができる。つまり、接着部材１７の機能を適宜分離することができるため、各部材に対して最適な材料を選択することができる。これにより、接着部材１７と接している部材の全ての部材に対して、密着力の高い材料を選択する必要もなくなるため、最も密着性に優れた材料を選択することができる。
また、反射部材１６に金属膜を設けた場合、接着部材１７の突出部は、金属膜と導電性部材１３とを電気的に隔離する（絶縁する）ことができる。つまり、製造工程上で金属膜と導電性部材１３とが接する他、マイグレーション等が発生することにより、ショートしてしまう問題を防止することができる。 (Adhesive member 17)
The adhesive member 17 covers at least a part of the conductive member 13 and the substrate 15, and fixes (adheres) the reflecting member 16 to the surface side of the substrate 15. As a result, gaps formed between the substrate 15 and the reflecting member 16 (such as fine irregularities on the bonding surfaces of the substrate 15 and the reflecting member 16 or steps formed by the conductive member 13 and the substrate 15) can be filled. it can.
The adhesive member 17 provided between the substrate 15 and the reflecting member 16 protrudes from the lower end of the reflecting member 16 toward the light emitting element 11, and the protruding portion is at least partially covered by the sealing member 12. . At this time, the protruding portion of the adhesive member 17 is preferably covered with the sealing member 12 so that the conductive member 13 is not exposed to the outside. Thereby, the adhesiveness of the sealing member 12 can be improved, and deterioration (oxidation, sulfurization, etc.) of the conductive member 13 can be prevented.
A plurality of adhesive members 17 can be provided. That is, since the function of the adhesive member 17 can be appropriately separated, an optimal material can be selected for each member. As a result, it is not necessary to select a material having a high adhesion force for all the members in contact with the adhesive member 17, so that a material having the highest adhesion can be selected.
When the reflective member 16 is provided with a metal film, the protruding portion of the adhesive member 17 can electrically isolate (insulate) the metal film and the conductive member 13. That is, it is possible to prevent the short circuit due to the occurrence of migration or the like in addition to the contact between the metal film and the conductive member 13 in the manufacturing process.

このような接着部材１７の材料としては、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、変性シリコーン樹脂、ポリイミド、ポリオレフィン、アクリル、ポリエステル、ＰＥＴ樹脂等が挙げられる。また、熱可塑性樹脂と熱硬化性樹脂とを組み合わせたものも用いることができる。さらに、接着部材１７には、無機部材、例えばガラス繊維などを含有させたものも好適に用いることができ、耐候性や発光装置の強度などを向上させることが可能となる。   Examples of the material of the adhesive member 17 include epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, polyimide, polyolefin, acrylic, polyester, and PET resin. A combination of a thermoplastic resin and a thermosetting resin can also be used. Furthermore, an inorganic member, for example, a material containing glass fiber or the like can be suitably used for the adhesive member 17, and weather resistance, strength of the light emitting device, and the like can be improved.

本実施の形態において、基板１５の表面側に設けられた第１の接着部材１７ａの上部には、さらに、反射部材１６と第１の接着部材１７ａとを接着するための第２の接着部材１７ｂが設けられている。第１の接着部材１７ａは、反射部材１６の下端よりも発光素子１１側に突出しており、その突出部は少なくとも一部が封止部材１２により覆われている。第２の接着部材１７ｂは、反射部材１６の下面（接着面）とほぼ同様の範囲に設けられている。
ただし、本実施の形態は、第１の接着部材１７ａのみを用いることにより、反射部材１６と基板１５とを接着することもできるが、複数の接着部材１７ａ、１７ｂを用いることにより、密着性を向上させるための材質を適宜選択することもできる。つまり、第１の接着部材１７ａを基板１５の上面側（表面側）に設けることにより、基板１５の表面にある微細な凹凸や、導電性部材１３および基板１５による段差を埋める。さらに、第２の接着部材１７ｂにより、反射部材１６の下面にある微細な凹凸を埋めると共に、第１の接着部材１７ａと反射部材１６と接着する。このように、一の部材の機能を複数の部材で分担して実現しているため、基板１５と反射部材１６とを接着するための最適な材料を選択することができる。 In the present embodiment, a second adhesive member 17b for adhering the reflecting member 16 and the first adhesive member 17a to the upper part of the first adhesive member 17a provided on the surface side of the substrate 15 is further provided. Is provided. The first adhesive member 17 a protrudes toward the light emitting element 11 from the lower end of the reflecting member 16, and at least a part of the protruding portion is covered with the sealing member 12. The second adhesive member 17b is provided in a range substantially similar to the lower surface (adhesive surface) of the reflecting member 16.
However, in the present embodiment, the reflective member 16 and the substrate 15 can be bonded by using only the first bonding member 17a, but the adhesion can be improved by using a plurality of bonding members 17a and 17b. The material for improving can also be selected suitably. That is, by providing the first adhesive member 17 a on the upper surface side (front surface side) of the substrate 15, the fine irregularities on the surface of the substrate 15 and the steps due to the conductive member 13 and the substrate 15 are filled. Furthermore, the fine unevenness on the lower surface of the reflecting member 16 is filled with the second adhesive member 17b, and the first adhesive member 17a and the reflecting member 16 are bonded. Thus, since the function of one member is shared by a plurality of members, an optimal material for bonding the substrate 15 and the reflecting member 16 can be selected.

（その他）
本実施の形態には、発光装置の一部として又は封止樹脂１２の表面に付属するように、例えば、発光素子１１の光の出射方向（発光素子１１の上方）に、エポキシ樹脂、ユリア樹脂、シリコーン樹脂、変性エポキシ樹脂、変性シリコーン樹脂、ポリアミド等からなるレンズを備えることができる。このとき、レンズの一部は、反射部材１６と封止部材１２との離間部にまで入り込み、かつ、封止部材１２を覆うように設けることが好ましい。これにより、発光素子１１からの光を目的に応じた配光にすることができると共に、封止部材１２の密着性を向上させることができる。 (Other)
In this embodiment, as part of the light emitting device or attached to the surface of the sealing resin 12, for example, in the light emitting direction of the light emitting element 11 (above the light emitting element 11), epoxy resin, urea resin A lens made of silicone resin, modified epoxy resin, modified silicone resin, polyamide, or the like can be provided. At this time, it is preferable that a part of the lens is provided so as to enter the space between the reflecting member 16 and the sealing member 12 and cover the sealing member 12. Thereby, while being able to make the light distribution from the light emitting element 11 according to the objective, the adhesiveness of the sealing member 12 can be improved.

また、本実施の形態には、発光素子１１の他、保護素子が搭載されていてもよい。保護素子は、１つでもよいし、２つ以上の複数個でもよい。ここで、保護素子は、特に限定されるものではなく、発光装置に搭載される公知のもののいずれでもよい。例えば、過熱、過電圧、過電流、保護回路、静電保護素子等が挙げられる。具体的には、ツェナーダイオード、トランジスタのダイオード等が利用できる。 In the present embodiment, a protective element may be mounted in addition to the light emitting element 11. The number of protective elements may be one, or two or more. Here, the protective element is not particularly limited, and may be any known element mounted on the light emitting device. For example, overheating, overvoltage, overcurrent, protection circuit, electrostatic protection element and the like can be mentioned. Specifically, a Zener diode, a transistor diode, or the like can be used.

＜第２の実施の形態＞
反射部材１６の形状以外は、第１の実施の形態と実質的に同様の構造を有している。なお、同じ構造については説明を省略する部分もある（以下の実施例でも同様とする）。 <Second Embodiment>
Except for the shape of the reflecting member 16, the structure is substantially the same as that of the first embodiment. In addition, there is a part which abbreviate | omits description about the same structure.

図４に示すように、第２の実施の形態に係る発明は、発光素子１１と封止部材１２と導電性部材１３とワイヤ１４と基板１５と反射部材１６と接着部材１７と蛍光物質１８とを備えて構成されている。本実施の形態は、第１の実施の形態と同様の効果を得ることができると共に、さらに、以下の効果も得ることができる。
反射部材１６において、第1の反射面１６ｂは、発光素子１１が配置される載置面に対して略垂直である。このとき、第２の反射面１６ｃは、載置面に対する角度θ１が、０°＜θ１＜９０°であることが好ましく、更に好ましくは３０°＜θ１＜６０°である。これにより、封止部材の側面１２ｂから放出される光を、少なくとも第２の反射面１６ｃで発光装置の上面方向へ射出することができるため、発光効率を向上することができる。
また、封止部材１２は、第１の反射面１６ｂの下端より低くなるように設けることが好ましい。これにより、反射部材１６の効果をさらに得ることができる。 As shown in FIG. 4, the invention according to the second embodiment includes a light emitting element 11, a sealing member 12, a conductive member 13, a wire 14, a substrate 15, a reflecting member 16, an adhesive member 17, and a fluorescent material 18. It is configured with. This embodiment can obtain the same effects as those of the first embodiment, and can also obtain the following effects.
In the reflecting member 16, the first reflecting surface 16b is substantially perpendicular to the mounting surface on which the light emitting element 11 is disposed. At this time, the angle θ 1 of the second reflecting surface 16c with respect to the placement surface is preferably 0 ° <θ 1 <90 °, and more preferably 30 ° <θ 1 <60 °. Thereby, since the light emitted from the side surface 12b of the sealing member can be emitted toward the top surface of the light emitting device at least by the second reflecting surface 16c, the light emission efficiency can be improved.
Moreover, it is preferable to provide the sealing member 12 so that it may become lower than the lower end of the 1st reflective surface 16b. Thereby, the effect of the reflecting member 16 can further be acquired.

＜製造方法＞
実施の形態に係る発光装置の製造方法について、その一例を第１の実施の形態を用いて説明する。 <Manufacturing method>
An example of a method for manufacturing a light emitting device according to an embodiment will be described with reference to the first embodiment.

（１）導電性部材１３の配線パターンが形成された基板１５において、発光素子１１が実装される載置部の周囲に、第１の接着部材１７ａを設ける。
（２）基板１５の載置部に発光素子１１を実装し、発光素子１１の電極と導電性部材１３とをワイヤ１４により電気的に接続する。
（３）封止部材１２により、発光素子１１、ワイヤ１４を被覆し、かつ、基板１５の上面側で導電性部材１３が外部に露出しないように第１の接着部材１７ａの少なくとも一部を被覆する。
（４）封止部材１２により被覆されていない第１の接着部材１７ａの上面に、第２の接着部材１７ｂを設ける。
（５）第１および２の反射面が形成された反射部材１６を、第２の接着部材１７ｂの上面に接着する。
（６）基板１５および反射部材１６からなる凹部内に、透光性部材（例えば、エポキシ樹脂など）を流し込み、金型により任意の形状にレンズを形成する。
以上の工程を経ることにより、本実施の形態に係る発光装置を製造することができる。
ただし、製造工程（１）、（２）において、第１の接着部材１７ａは、基板１５に実装した発光素子１１の電極と導電性部材１３とをワイヤ１４により電気的に接続した後に、設けることもできる。
また、製造工程（４）、（５）において、反射部材１６の下面（接着面）に第２の接着部材１７ｂを設けた後、第２の接着部材１７ｂにより反射部材１６を第１の接着部材１７ａの上面に接着することもできる。 (1) In the substrate 15 on which the wiring pattern of the conductive member 13 is formed, the first adhesive member 17a is provided around the mounting portion on which the light emitting element 11 is mounted.
(2) The light emitting element 11 is mounted on the mounting portion of the substrate 15, and the electrode of the light emitting element 11 and the conductive member 13 are electrically connected by the wire 14.
(3) The sealing member 12 covers the light emitting element 11 and the wire 14, and covers at least a part of the first adhesive member 17 a so that the conductive member 13 is not exposed to the outside on the upper surface side of the substrate 15. To do.
(4) The second adhesive member 17b is provided on the upper surface of the first adhesive member 17a that is not covered with the sealing member 12.
(5) The reflecting member 16 on which the first and second reflecting surfaces are formed is bonded to the upper surface of the second adhesive member 17b.
(6) A translucent member (for example, an epoxy resin) is poured into a recess made of the substrate 15 and the reflecting member 16, and a lens is formed into an arbitrary shape by a mold.
Through the above steps, the light-emitting device according to this embodiment can be manufactured.
However, in the manufacturing steps (1) and (2), the first adhesive member 17 a is provided after the electrode of the light emitting element 11 mounted on the substrate 15 and the conductive member 13 are electrically connected by the wire 14. You can also.
In the manufacturing steps (4) and (5), after the second adhesive member 17b is provided on the lower surface (adhesive surface) of the reflective member 16, the reflective member 16 is attached to the first adhesive member by the second adhesive member 17b. It can also be adhered to the upper surface of 17a.

また、上記の製造工程では、接着部材１７を複数（第１の接着部材１７ａおよび第２の接着部材１７ｂ）用いた場合を説明したが、接着部材１７を一つの部材により製造する場合についても以下に説明する。
（１）導電性部材１３の配線パターンが形成された基板１５において、発光素子１１を実装し、ワイヤ１４により導電性部材１３と発光素子１１の電極とを電気的に接続する。
（２）接着部材１７を発光素子１１が実装された載置部の周囲に配置すると供に、半硬化する。
（３）封止部材１２により、発光素子１１、ワイヤ１４を被覆し、かつ、基板１５の上面側で導電性部材１３が外部に露出しないように接着部材１７の少なくとも一部を被覆する。
（４）第１および２の反射面が形成された反射部材１６を接着部材１７の上面に配置し、接着部材１７を硬化することにより、反射部材１６と基板１５とを接着する。
（５）基板１５および反射部材１６からなる凹部内に、透光性部材（例えば、エポキシ樹脂など）を流し込み、金型により任意の形状にレンズを形成する。 Further, in the manufacturing process described above, the case where a plurality of the adhesive members 17 (the first adhesive member 17a and the second adhesive member 17b) are used has been described, but the case where the adhesive member 17 is manufactured using one member is described below. Explained.
(1) The light emitting element 11 is mounted on the substrate 15 on which the wiring pattern of the conductive member 13 is formed, and the conductive member 13 and the electrode of the light emitting element 11 are electrically connected by the wire 14.
(2) The adhesive member 17 is semi-cured while being disposed around the mounting portion on which the light emitting element 11 is mounted.
(3) The sealing member 12 covers the light emitting element 11 and the wire 14 and covers at least a part of the adhesive member 17 so that the conductive member 13 is not exposed to the outside on the upper surface side of the substrate 15.
(4) The reflective member 16 on which the first and second reflective surfaces are formed is disposed on the upper surface of the adhesive member 17, and the adhesive member 17 is cured to bond the reflective member 16 and the substrate 15.
(5) A translucent member (for example, an epoxy resin) is poured into a recess made of the substrate 15 and the reflecting member 16, and a lens is formed into an arbitrary shape by a mold.

以下に、本発明の発光装置の実施例を図面に基づいて詳細に説明する。   Embodiments of the light emitting device according to the present invention will be described below in detail with reference to the drawings.

＜実施例１＞
図１に示すように、実施例１は、発光素子１１と封止部材１２と導電性部材１３とワイヤ１４と基板１５と反射部材１６と接着部材１７と蛍光物質１８とを備えて構成されている。
なお、発光素子１１として窒化ガリウム系化合物半導体、封止部材１２としてシリコーン樹脂、導電性部材１３として銅、ワイヤ１４として金、基板１５としてガラスエポキシ樹脂、反射部材１６としてポリフタルアミド（ＰＰＡ）、接着部材１７としてエポキシ樹脂、蛍光物質１８としてイットリウム・アルミニウム酸化物系（ＹＡＧ系）蛍光体を用いる。 <Example 1>
As shown in FIG. 1, Example 1 includes a light emitting element 11, a sealing member 12, a conductive member 13, a wire 14, a substrate 15, a reflecting member 16, an adhesive member 17, and a fluorescent material 18. Yes.
The light emitting element 11 is a gallium nitride compound semiconductor, the sealing member 12 is a silicone resin, the conductive member 13 is copper, the wire 14 is gold, the substrate 15 is a glass epoxy resin, the reflecting member 16 is polyphthalamide (PPA), An epoxy resin is used as the adhesive member 17 and an yttrium / aluminum oxide (YAG) phosphor is used as the fluorescent material 18.

基板１５には、その表面側から裏面側まで連続的に導電性部材１３をパターン成形しており、導電性部材１３には発光素子１１を載置する。発光素子１１の電極と導電性部材１３とはワイヤ１４により接続（ボンディング）し、電気的導通をとる。このとき、導電性部材１３の最表面には、銀によるメッキを施している。
反射部材１６は、第１および第２の接着部材１７ａ、１７ｂにより、発光素子１１を囲むよう基板１５の表面側に固定（接着）する。図２に示すように、反射部材１６は、発光装置の発光面側からみて凹部の形状が略四角形状である。このとき、図３に示すように、第１の接着部材１７ａは、導電性部材１３および基板１５の一部を被覆しており、反射部材１６の下端よりも発光素子１１側に突出している。さらに、第１の接着部材１７ａの上部には、反射部材１６を接着するための第２の接着部材１７ｂを設けている。
また、反射部材１６は、その上面１６ａの下側に第１の反射面１６ｂを有しており、上面１６ａと第１の反射面１６ｂの上端とは接している。さらに、反射部材１６は、第１の反射面１６ｂの下端と接するように第２の反射面１６ｃを有している。このとき、発光素子１１の載置面に対する第１の反射面１６ｂの角度θ１１は約５５°、第２の反射面１６ｃの角度θ１２は約９０°である。
封止部材１２は、基板１５の表面側に設けられた導電性部材１３が外部に露出しないよう、発光素子１１、ワイヤ１４等の部材を被覆し、かつ、第１の接着部材１７ａの突出部をも被覆する。このとき、封止部材の側面１２ｂは、第２の反射面１６ｃから約１００μｍ離間させている。封止部材の上面１２ａは、第１の反射面１６ｂと第２の反射面１６ｃとが交差する部分（第１の反射面１６ｂの下端）よりも低く設けている。また、封止部材１２には、蛍光物質１８を含有させており、発光素子１１からの光を波長変換し放出する。
以上のようにして作製した発光装置は、高い信頼性を得ることができると共に、第１の実施の形態と同様の効果を得ることができる。 On the substrate 15, the conductive member 13 is continuously patterned from the front surface side to the back surface side, and the light emitting element 11 is placed on the conductive member 13. The electrode of the light emitting element 11 and the conductive member 13 are connected (bonded) by a wire 14 to establish electrical continuity. At this time, the outermost surface of the conductive member 13 is plated with silver.
The reflection member 16 is fixed (adhered) to the surface side of the substrate 15 so as to surround the light emitting element 11 by the first and second adhesive members 17a and 17b. As shown in FIG. 2, the reflecting member 16 has a substantially quadrangular concave portion when viewed from the light emitting surface side of the light emitting device. At this time, as shown in FIG. 3, the first adhesive member 17 a covers a part of the conductive member 13 and the substrate 15, and protrudes to the light emitting element 11 side from the lower end of the reflecting member 16. Further, a second adhesive member 17b for adhering the reflecting member 16 is provided on the upper portion of the first adhesive member 17a.
The reflecting member 16 has a first reflecting surface 16b below the upper surface 16a, and the upper surface 16a and the upper end of the first reflecting surface 16b are in contact with each other. Further, the reflecting member 16 has a second reflecting surface 16c so as to contact the lower end of the first reflecting surface 16b. At this time, the angle theta 11 of the first reflecting surface 16b with respect to the mounting surface of the light emitting element 11 is approximately 55 °, the angle theta 12 of the second reflecting surface 16c is about 90 °.
The sealing member 12 covers members such as the light emitting element 11 and the wire 14 so that the conductive member 13 provided on the surface side of the substrate 15 is not exposed to the outside, and the protruding portion of the first adhesive member 17a. Is also coated. At this time, the side surface 12b of the sealing member is separated from the second reflecting surface 16c by about 100 μm. The upper surface 12a of the sealing member is provided lower than a portion where the first reflecting surface 16b and the second reflecting surface 16c intersect (the lower end of the first reflecting surface 16b). Further, the sealing member 12 contains a fluorescent material 18, and the light from the light emitting element 11 is converted in wavelength and emitted.
The light-emitting device manufactured as described above can obtain high reliability and can obtain the same effects as those of the first embodiment.

＜実施例２＞
図４に示すように、反射部材１６の形状以外は、実施例１と同様にして発光装置を作製する。具体的には、反射部材１６において、発光素子１１の載置面に対する第１の反射面１６ｂの角度θ１１が約９０°であり、第２の反射面１６ｃの角度θ１２が約５０°である。
これにより、第２の実施の形態と同様の効果を得ることができる。 <Example 2>
As shown in FIG. 4, a light emitting device is fabricated in the same manner as in Example 1 except for the shape of the reflecting member 16. Specifically, the reflecting member 16, the angle theta 11 of the first reflecting surface 16b with respect to the mounting surface of the light emitting element 11 is about 90 °, an angle theta 12 of the second reflecting surface 16c is about 50 ° is there.
Thereby, the effect similar to 2nd Embodiment can be acquired.

＜実施例３＞
図５、図６、図７に示すように、レンズを設けている以外は、実施例１と同様にして発光装置を作製する。また、各図には光の行路も示している。
これにより、実施例１と同様の効果を得ることができる。さらに、発光素子１１からの光を調節し、発光装置の配光を適宜変更することができると共に、封止部材１２の密着性を向上することができる。 <Example 3>
As shown in FIGS. 5, 6, and 7, a light emitting device is manufactured in the same manner as in Example 1 except that a lens is provided. Each figure also shows the path of light.
Thereby, the same effect as Example 1 can be acquired. Furthermore, the light from the light emitting element 11 can be adjusted to change the light distribution of the light emitting device as appropriate, and the adhesion of the sealing member 12 can be improved.

＜実施例４＞
図８ａ、図８ｂは、発光素子１１、導電性部材１３、ワイヤ１４の具体的な配置を示したものである。これ以外は、実施例１と同様にして発光装置を作製する。
具体的には、実施例４に係る発光装置には、発光素子１１を複数（４つ）設けており、それらの発光素子１１が異なる導電性部材１３にそれぞれ載置している。また、それぞれの発光素子１１は、その各側面が反射部材１６の各反射面に対して略平行（発光装置の発光面側からみて）となるように、発光装置の凹部内に配置している。 <Example 4>
8a and 8b show a specific arrangement of the light emitting element 11, the conductive member 13, and the wire 14. FIG. Other than this, a light emitting device is fabricated in the same manner as in Example 1.
Specifically, the light emitting device according to Example 4 is provided with a plurality (four) of light emitting elements 11, and these light emitting elements 11 are respectively mounted on different conductive members 13. In addition, each light emitting element 11 is disposed in the recess of the light emitting device so that each side surface thereof is substantially parallel to each reflecting surface of the reflecting member 16 (as viewed from the light emitting surface side of the light emitting device). .

さらに、図８ａに示すように、実施例４に係る発光装置は、複数の発光素子１１を挟持するように正負一対の導電性部材１３を設けており、複数の発光素子１１の電極と正負一対の導電性部材１３とをそれぞれワイヤ１４にて接続し導通をとっている。これにより、実施例１と同様の効果を得ることができる。さらに、従来よりもワイヤ１４の長さを短くすることができるため、封止部材１２等からの熱応力によるワイヤ１４への負担を減らすことができる。   Further, as shown in FIG. 8a, the light emitting device according to Example 4 is provided with a pair of positive and negative conductive members 13 so as to sandwich the plurality of light emitting elements 11, and the electrodes of the plurality of light emitting elements 11 and the positive and negative pairs. The conductive members 13 are connected to each other by wires 14 to establish conduction. Thereby, the same effect as Example 1 can be acquired. Furthermore, since the length of the wire 14 can be made shorter than before, the burden on the wire 14 due to thermal stress from the sealing member 12 or the like can be reduced.

また、図８ｂに示すように、実施例４に係る発光装置は、発光素子１１間をワイヤ１４で直接的に接続することもできる。これにより、実施例１と同様の効果を得ることができる。さらに、基板１５の表面側に占める導電性部材１３の面積を減らすことができるため、封止部材１２の密着性を向上することができる。   Further, as shown in FIG. 8 b, the light emitting device according to Example 4 can also directly connect the light emitting elements 11 with wires 14. Thereby, the same effect as Example 1 can be acquired. Furthermore, since the area of the conductive member 13 occupying the surface side of the substrate 15 can be reduced, the adhesion of the sealing member 12 can be improved.

＜実施例５＞
図９ａ、図９ｂ、図９ｃに示すように、接着部材１７の形状以外は、実施例１と同様にして発光装置を作製する。図９ａ、図９ｃにおいて、接着部材１７は、基板１５との接触面と、それに対向する面と、のいずれか一方の面を突出させて張り出し部を形成し、その張り出し部の内部に封止部材１２の一部を食い込ませている。張り出し部分は、エッチングなどの従来の方法により形成することができる。また、図９ｂのように、複数の接着部材を用いて張り出し部を成形することもできる。これらにより、実施例１と同様の効果を得ることができる。さらに、封止部材１２の密着性が向上する。 <Example 5>
As shown in FIGS. 9 a, 9 b, and 9 c, a light emitting device is manufactured in the same manner as in Example 1 except for the shape of the adhesive member 17. 9a and 9c, the adhesive member 17 forms a protruding portion by projecting one of the contact surface with the substrate 15 and the surface facing the substrate 15, and seals the inside of the protruding portion. A part of the member 12 is bitten. The overhanging portion can be formed by a conventional method such as etching. Further, as shown in FIG. 9b, the overhanging portion can be formed using a plurality of adhesive members. By these, the same effect as Example 1 can be acquired. Furthermore, the adhesion of the sealing member 12 is improved.

本発明の発光装置は、発光素子を搭載することにより、ファクシミリ、コピー機、ハンドスキャナ等における画像読取装置に利用される照明装置のみならず、一般照明用光源、フラッシュ用光源、ＬＥＤディスプレイ、携帯電話機等のバックライト光源、信号機、照明式スイッチ、車載用ストップランプ、各種センサおよび各種インジケータ等の種々の照明装置に利用することができる。   The light-emitting device of the present invention is equipped with a light-emitting element, so that it can be used not only for illumination devices used for image reading devices in facsimiles, copiers, hand scanners, etc., but also for general illumination light sources, flash light sources, LED displays, mobile phones It can be used for various lighting devices such as a backlight light source such as a telephone, a traffic light, an illumination switch, an in-vehicle stop lamp, various sensors, and various indicators.

第１の実施の形態に係る発光装置の概略平面図（図２）におけるX−X′線にて切断した際に得られる概略断面図である。It is a schematic sectional drawing obtained when cut | disconnecting by the XX 'line in the schematic plan view (FIG. 2) of the light-emitting device which concerns on 1st Embodiment. 第１の実施の形態に係る発光装置の概略平面図である。1 is a schematic plan view of a light emitting device according to a first embodiment. 第１の実施の形態に係る発光装置における反射部材１６と封止部材１２とが離間した部分の拡大断面図である。3 is an enlarged cross-sectional view of a portion where a reflecting member 16 and a sealing member 12 are separated from each other in the light emitting device according to the first embodiment. FIG. 第２の実施の形態に係る発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which concerns on 2nd Embodiment. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略平面図である。It is a schematic plan view of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略平面図である。It is a schematic plan view of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 本発明に係る他の実施の形態の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of other embodiment which concerns on this invention. 従来の発光装置の概略断面図である。It is a schematic sectional drawing of the conventional light-emitting device. 従来の発光装置の概略断面図である。It is a schematic sectional drawing of the conventional light-emitting device.

符号の説明Explanation of symbols

１１、１０１、１１１ 発光素子
１２、１２ａ、１２ｂ、１０２、１０２ａ、１０２ｂ、１１２ 封止部材
１３、１０３、１１３ 導電性部材
１４、１０４、１１４ ワイヤ
１５、１０５、１１５ 基板
１６、１６ａ、１６ｂ、１６ｃ、１０６、１０６ａ、１０６ｂ、１１６、１１６ａ、１１６ｂ 反射部材
１７ａ、１７ｂ 接着部材
１８、１０８、１１８ 蛍光物質 11, 101, 111 Light emitting element 12, 12a, 12b, 102, 102a, 102b, 112 Sealing member 13, 103, 113 Conductive member 14, 104, 114 Wire 15, 105, 115 Substrate 16, 16a, 16b, 16c 106, 106a, 106b, 116, 116a, 116b Reflective member 17a, 17b Adhesive member 18, 108, 118 Fluorescent substance

Claims (5)

基板と、
前記基板に配置された発光素子と、
前記発光素子の光を反射させる反射部材と、
前記基板および前記反射部材を接着する接着部材と、
前記発光素子を被覆し、且つ、前記反射部材から離間して前記基板に配置された封止部材と、を有する発光装置であって、
前記接着部材は、前記反射部材の下端から前記発光素子側に突出された突出部を有し、その突出部が前記封止部材により覆われていることを特徴とする発光装置。 A substrate,
A light emitting device disposed on the substrate;
A reflective member for reflecting the light of the light emitting element;
An adhesive member for adhering the substrate and the reflective member;
A light-emitting device that covers the light-emitting element and has a sealing member disposed on the substrate apart from the reflective member,
The adhesive member has a protruding portion protruding from the lower end of the reflecting member toward the light emitting element, and the protruding portion is covered with the sealing member. 前記反射部材は、第１の反射面および第２の反射面を少なくとも有し、
前記第１の反射面の上端は前記反射部材の上面と接し、前記第１の反射面の下端は前記第２の反射面と接しており、
前記第１の反射面および前記第２の反射面は、前記発光素子の載置面に対して角度が互いに異なることを特徴とする請求項１に記載の発光装置。 The reflective member has at least a first reflective surface and a second reflective surface,
The upper end of the first reflecting surface is in contact with the upper surface of the reflecting member, and the lower end of the first reflecting surface is in contact with the second reflecting surface,
2. The light emitting device according to claim 1, wherein the first reflection surface and the second reflection surface have different angles with respect to a mounting surface of the light emitting element. 前記第１の反射面および前記第２の反射面のうち一方が、前記発光素子の載置面に対して略垂直であることを特徴とする請求項２に記載の発光装置。   3. The light emitting device according to claim 2, wherein one of the first reflecting surface and the second reflecting surface is substantially perpendicular to a mounting surface of the light emitting element. 前記封止部材は、前記第１の反射面の下端より低くなるように設けられていることを特徴とする請求項２又は３に記載の発光装置。   The light emitting device according to claim 2, wherein the sealing member is provided so as to be lower than a lower end of the first reflecting surface. 請求項１乃至４のいずれか一つに記載の発光装置において、さらに、レンズを有し、
前記レンズの一部は、前記反射部材と前記封止部材との離間部にまで入り込み、かつ、前記封止部材を覆うように設けられていることを特徴とする発光装置。 The light emitting device according to claim 1, further comprising a lens,
A part of the lens is provided so as to enter the space between the reflecting member and the sealing member and to cover the sealing member.
JP2006353727A 2006-12-28 2006-12-28 Light emitting device Active JP4826470B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006353727A JP4826470B2 (en) 2006-12-28 2006-12-28 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006353727A JP4826470B2 (en) 2006-12-28 2006-12-28 Light emitting device

Publications (2)

Publication Number Publication Date
JP2008166462A true JP2008166462A (en) 2008-07-17
JP4826470B2 JP4826470B2 (en) 2011-11-30

Family

ID=39695547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006353727A Active JP4826470B2 (en) 2006-12-28 2006-12-28 Light emitting device

Country Status (1)

Country Link
JP (1) JP4826470B2 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027974A (en) * 2008-07-23 2010-02-04 Sharp Corp Method of manufacturing light-emitting device
JP2010198952A (en) * 2009-02-26 2010-09-09 Eye Lighting Syst Corp Led lighting device
JP2011071354A (en) * 2009-09-25 2011-04-07 Toshiba Lighting & Technology Corp Light-emitting device, bulb-shaped lamp, and lighting apparatus
JP2011096793A (en) * 2009-10-29 2011-05-12 Nichia Corp Light-emitting device
JP2011114341A (en) * 2009-11-27 2011-06-09 Samsung Led Co Ltd Light emitting element package, and method of manufacturing the same
JP2011171345A (en) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd Light emitting device and method of manufacturing the same
CN102194976A (en) * 2010-02-12 2011-09-21 东芝照明技术株式会社 Light-emitting device and illumination device
WO2011122531A1 (en) * 2010-03-29 2011-10-06 三洋電機株式会社 Light-emitting device, light-emitting-device module, and process for producing light-emitting device
WO2011122529A1 (en) * 2010-03-29 2011-10-06 三洋電機株式会社 Light-emitting device and light-emitting-device module
JP2012009794A (en) * 2010-06-28 2012-01-12 Panasonic Corp Light emitting device, back light unit, liquid crystal display, and illumination device
JP2013172154A (en) * 2012-02-21 2013-09-02 Lg Innotek Co Ltd Light-emitting element, manufacturing method therefor, and illumination system including the same
JP2014036127A (en) * 2012-08-09 2014-02-24 Nichia Chem Ind Ltd Light emitting device
JP2014099455A (en) * 2012-11-13 2014-05-29 Nichia Chem Ind Ltd Light emitting device
EP2413023A3 (en) * 2010-07-30 2016-05-25 Ichikoh Industries, Ltd. Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device
US9484507B2 (en) 2013-06-28 2016-11-01 Nichia Corporation Light emitting device
JP2016195288A (en) * 2016-08-22 2016-11-17 日亜化学工業株式会社 Light emission device
JP2018182062A (en) * 2017-04-13 2018-11-15 ローム株式会社 Semiconductor light-emitting device
KR20200068257A (en) * 2018-11-13 2020-06-15 유니플렉스 테크놀로지 인코포레이티드 Production method for a photoelectric mechanism having a blocking wall

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4994585A (en) * 1973-01-15 1974-09-07
JP2006186297A (en) * 2004-12-03 2006-07-13 Toshiba Corp Semiconductor light emitting device and its manufacturing method
JP2006310505A (en) * 2005-04-28 2006-11-09 Citizen Electronics Co Ltd Light emitting diode

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4994585A (en) * 1973-01-15 1974-09-07
JP2006186297A (en) * 2004-12-03 2006-07-13 Toshiba Corp Semiconductor light emitting device and its manufacturing method
JP2006310505A (en) * 2005-04-28 2006-11-09 Citizen Electronics Co Ltd Light emitting diode

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027974A (en) * 2008-07-23 2010-02-04 Sharp Corp Method of manufacturing light-emitting device
JP2010198952A (en) * 2009-02-26 2010-09-09 Eye Lighting Syst Corp Led lighting device
JP2011071354A (en) * 2009-09-25 2011-04-07 Toshiba Lighting & Technology Corp Light-emitting device, bulb-shaped lamp, and lighting apparatus
JP2011096793A (en) * 2009-10-29 2011-05-12 Nichia Corp Light-emitting device
JP2011114341A (en) * 2009-11-27 2011-06-09 Samsung Led Co Ltd Light emitting element package, and method of manufacturing the same
CN102194976A (en) * 2010-02-12 2011-09-21 东芝照明技术株式会社 Light-emitting device and illumination device
US8616732B2 (en) 2010-02-12 2013-12-31 Toshiba Lighting & Technology Corporation Light-emitting device and illumination device
JP2011171345A (en) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd Light emitting device and method of manufacturing the same
WO2011122531A1 (en) * 2010-03-29 2011-10-06 三洋電機株式会社 Light-emitting device, light-emitting-device module, and process for producing light-emitting device
WO2011122529A1 (en) * 2010-03-29 2011-10-06 三洋電機株式会社 Light-emitting device and light-emitting-device module
JP2012009794A (en) * 2010-06-28 2012-01-12 Panasonic Corp Light emitting device, back light unit, liquid crystal display, and illumination device
EP2413023A3 (en) * 2010-07-30 2016-05-25 Ichikoh Industries, Ltd. Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device
US9512996B2 (en) 2010-07-30 2016-12-06 Ichikoh Industries, Ltd. Light source unit of semiconductor-type light source of vehicle lighting device and vehicle lighting device
JP2013172154A (en) * 2012-02-21 2013-09-02 Lg Innotek Co Ltd Light-emitting element, manufacturing method therefor, and illumination system including the same
JP2014036127A (en) * 2012-08-09 2014-02-24 Nichia Chem Ind Ltd Light emitting device
US9709223B2 (en) 2012-08-09 2017-07-18 Nichia Corporation Light emitting device
US10109777B2 (en) 2012-08-09 2018-10-23 Nichia Corporation Light emitting device
JP2014099455A (en) * 2012-11-13 2014-05-29 Nichia Chem Ind Ltd Light emitting device
US9587811B2 (en) 2012-11-13 2017-03-07 Nichia Corporation Light emitting device
US9484507B2 (en) 2013-06-28 2016-11-01 Nichia Corporation Light emitting device
US9608180B2 (en) 2013-06-28 2017-03-28 Nichia Corporation Light emitting device
JP2016195288A (en) * 2016-08-22 2016-11-17 日亜化学工業株式会社 Light emission device
JP2018182062A (en) * 2017-04-13 2018-11-15 ローム株式会社 Semiconductor light-emitting device
JP7089343B2 (en) 2017-04-13 2022-06-22 ローム株式会社 Semiconductor light emitting device
KR20200068257A (en) * 2018-11-13 2020-06-15 유니플렉스 테크놀로지 인코포레이티드 Production method for a photoelectric mechanism having a blocking wall
KR102236505B1 (en) 2018-11-13 2021-04-06 유니플렉스 테크놀로지 인코포레이티드 Production method for a photoelectric mechanism having a blocking wall

Also Published As

Publication number Publication date
JP4826470B2 (en) 2011-11-30

Similar Documents

Publication Publication Date Title
JP4826470B2 (en) Light emitting device
KR101114197B1 (en) Light emitting device and lighing system
US9947848B2 (en) Semiconductor light emitting device and method for producing the same
TWI608637B (en) Light emitting device and method of manufacturing the same
JP5842813B2 (en) Light emitting device and method for manufacturing light emitting device
JP4935514B2 (en) Light emitting device
JP4611937B2 (en) Surface mount type light emitting device and manufacturing method thereof
US20110175512A1 (en) Light emitting diode and light source module having same
JP2008098218A (en) Semiconductor light-emitting device and method formanufacturing the same
JP2008071955A (en) Light-emitting device
JP5256591B2 (en) Light emitting device
JP5125060B2 (en) Light emitting device
JP6107229B2 (en) Light emitting device
JP2007280983A (en) Light-emitting device
KR101163901B1 (en) Light emitting device and lighing system
JP5055837B2 (en) Light emitting device
JP5472031B2 (en) Light emitting device and manufacturing method thereof
KR101125437B1 (en) Light emitting device and lighing system
KR101114151B1 (en) Light emitting device and lighing system
KR101154671B1 (en) Light emitting device and lighing system
JP5628475B2 (en) Manufacturing method of surface mounted light emitting device
JP5849691B2 (en) Mounting method of light emitting element
KR101154656B1 (en) Light emitting device and lighing system
JP2017017162A (en) Light-emitting device
KR101172177B1 (en) Light emitting device and lighing system

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110816

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110829

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140922

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4826470

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140922

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250