JP2006080312A - Light emitting device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device and its manufacturing method in which the occurrence of damage due to thermal expansion and high temperature caused by a sealing material is prevented and sufficient light reflection can be obtained. <P>SOLUTION: A surface-mounted light emitting element 13 is mounted on a ceramic substrate 11 with through-holes 12a and 12b, upper surface pads 11a and 11b and lower surface pads 11c and 11d formed thereon. A glass sealing member 14 is sealed to cover the light emitting element 13. The glass sealing member 14 is externally formed in the shape of inverted pyramid by a tapered surface 14a spreading toward the outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light-emitting device and a method for manufacturing the same, and more particularly to a light-emitting device that prevents thermal expansion caused by a sealing material and damage due to a high temperature and that provides sufficient light reflection, and a method for manufacturing the same.

  As a conventional light emitting device, a sealing member in which an epoxy resin is filled is known (see, for example, Patent Document 1). This light emitting device will be described below with reference to the drawings.

  FIG. 15 is a cross-sectional view showing a conventional light emitting device. The light emitting device 100 includes a resin portion 101 having a recess 101A, leads 102 and 103 insert-molded in the resin portion 101, and a lead 102 exposed on the bottom surface of the recess 101A, such as an adhesive such as silver (Ag) paste. A light emitting element 105 mounted via an agent 104, bonding wires 106 and 107 made of gold (Au) or the like for connecting two electrodes (not shown) of the light emitting element 105 and the leads 102 and 103, and a phosphor. A sealing body 109 containing 108 and filled in the recess 101A, and a reflective film 110 formed on the inner surface of the recess 101A.

  The leads 102 and 103 are formed by cutting a predetermined portion from the lead frame, each one end is disposed so as to be close to each other, each other end extends in the opposite direction, and is pulled out from the resin portion 101 to the outside. It is.

  The recess 101A has a substantially elliptical shape or a circular shape having an inclined surface whose inner diameter decreases toward the lower side. The reflective film 110 is formed over the entire inclined surface of the recess 101A using aluminum or the like.

  The light emitting element 105 is formed from a nitride semiconductor on a substrate using a crystal growth method such as metal organic chemical vapor deposition (MOCVD) or molecular beam exit growth (MBE). A laminated structure having a light emitting layer is formed.

  The sealing body 109 uses a silicone resin as its material. Thereby, sufficient durability can be obtained even for short wavelength light having an emission peak wavelength of less than 400 nm.

  One type or several types of phosphors 108 can be used. For example, when a plurality of phosphors are used, there are three combinations of phosphors that emit red light, phosphors that emit green light, and phosphors that emit blue light. Wavelength conversion can be performed by the phosphor 110. For example, when the phosphor 110 includes a red phosphor, a green phosphor, and a blue phosphor, light such as ultraviolet light emitted from the light emitting element 105 is converted into the phosphor. The wavelength is converted by 108, and the secondary light from these is mixed with the primary light by the light emitting element 105 and extracted as the light emitted from the light emitting device 100.

  According to the light emitting device 100 described above, since the phosphor 110 is contained in the sealing body 109, the phosphor 110 absorbs primary light from the light emitting element 105 and emits visible light. A light emitting device 100 in which the color tone does not change even when the emission wavelength changes can be obtained.

There is also known a light-emitting device that uses an epoxy resin for a sealing body and a white resin for a resin portion to scatter and reflect light from a light-emitting element.
JP 2002-314142 A ([0026] to [0038], FIG. 1)

  However, according to the conventional light emitting device, when a silicone resin is used for the sealing body 109, it is excellent in weather resistance, light resistance, mechanical durability, etc., but because of thermal expansion, the bonding wire 106, 107 is easily deformed. There is glass as a material having a small thermal expansion. However, since glass has a high viscosity, the processing temperature must be increased, and the light emitting element may be damaged. In addition, when an epoxy resin is used for the sealing body 109, the light emitting element turns yellow due to light or heat from the light emitting element, absorbs light emitted from the light emitting element, and decreases the light emission output of the light emitting device.

  Further, when the reflective film 110 in the recess 101A is made of aluminum, high reflection efficiency cannot be obtained because the metal is absorbed by light, and when it is made of silver, the reflection film 110 is blackened at the time of deterioration to improve the reflection efficiency. Reduce.

  Moreover, when white resin is used for the resin part, light condensing performance cannot be obtained, and sufficient light extraction efficiency cannot be obtained.

  Accordingly, an object of the present invention is to provide a light emitting device that prevents thermal expansion and damage due to high temperature caused by a sealing material, and provides sufficient light reflection, and a method for manufacturing the same.

  In order to achieve the above object, the present invention includes a light emitting element, a power supply unit that mounts the light emitting element and supplies power, and an inorganic sealing material that seals the light emitting element. The sealing material has a tapered surface shape that spreads outward in the lateral direction with respect to the central axis of the light emitting element.

  In order to achieve the above object, the present invention provides a first step of mounting a plurality of surface-mounted light emitting elements on an insulating substrate at predetermined intervals, and covering the plurality of light emitting elements. A second step of forming the glass sealing member in such a thickness, and a third step of cutting the substrate and the glass sealing member so that a tapered surface is formed around each of the plurality of light emitting elements. The manufacturing method of the light-emitting device characterized by including this is provided.

  According to the light-emitting device of the present invention, the light-emitting element is sealed with an inorganic sealing member, and the outer surface thereof is provided with a tapered surface. The occurrence of damage due to is prevented, the light output can be prevented from being lowered, and good light collecting characteristics can be obtained.

  Further, according to the method for manufacturing a light emitting device of the present invention, after forming the glass sealing member, the substrate and the glass sealing member are cut so as to form a tapered surface around each of the light emitting elements. And productivity can be improved. In addition, a light reflecting surface with good light reflectivity can be easily formed without using a light reflecting material or the like.

[First Embodiment]
(Configuration of light emitting device)
1A and 1B show a configuration of a light-emitting device according to a first embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG. .

The light-emitting device 1 includes a ceramic (glass-containing Al ₂ O ₃ ) substrate 11 on which upper surface pads 11a and 11b and lower surface pads 11c and 11d are formed, and a via post formed on the ceramic substrate 11 and made of Cu. Through-holes 12a and 12b in which 15 is embedded, light-emitting element 13 mounted and connected via bumps 13a and 13b on upper surface pads 11a and 11b connected to through-holes 12a and 12b, light-emitting element 13 and ceramic And a glass sealing member 14 sealed in an inverted triangle so as to cover the exposed portion of the upper surface of the substrate 11.

The ceramic substrate 11 can be made of a material such as Al ₂ O ₃ or AlN in addition to glass-containing Al ₂ O ₃ .

  The through hole 12a is formed so as to connect the upper surface pad 11a and the lower surface pad 11c, and similarly, the through hole 12b is formed so as to connect the upper surface pad 11b and the lower surface pad 11d.

  The light emitting element 13 is of a flip chip type, and a pair of electrodes (not shown) connected to the upper surface pads 11a and 11b are provided on the mount surface.

The glass sealing member 14 is formed of phosphoric acid-based glass (thermal expansion coefficient 11.4 × 10 ^{−6 /} ° C., Tg 390 ° C., n = 1.59) as a low melting point glass, A tapered surface 14a is formed with a lateral cross-sectional area that increases upward. Thereby, the glass sealing member 14 has an outer shape of an inverted pyramid shape. This shape is produced by dicing as described in the manufacturing method.

  2-7 shows each process of the manufacturing method of the light-emitting device based on the 1st Embodiment of this invention. Here, a method for manufacturing the light emitting device 1 of the first embodiment will be described.

(Method for manufacturing light-emitting device 1)
FIG. 2 shows a cross-sectional view of the wafer-like ceramic substrate in the first stage of the manufacturing process. In this step, wiring patterns (not shown) are formed in advance on the upper and lower surfaces of the ceramic substrate 11. Through holes 12a and 12b are formed at regular intervals so as to be connected to the wiring pattern.

  FIG. 3 is a cross-sectional view showing a step following FIG. Via posts 15 are buried in the through holes 12a and 12b formed in FIG. Further, the upper surface pads 11a and 11b and the lower surface pads 11c and 11d are formed on the wiring pattern by being connected to the upper and lower surfaces of the through holes 12a and 12b.

  FIG. 4 is a cross-sectional view showing a step following FIG. In this step, the light emitting element 13 having the bumps 13a and 13b formed in advance is prepared. The light-emitting element 13 is mounted on the upper surface pads 11a and 11b with the formation surfaces of the bumps 13a and 13b facing down and the polarities being matched. Note that a filler having a small coefficient of thermal expansion may be filled between the ceramic substrate 11 and the light emitting element 13.

  FIG. 5 is a cross-sectional view showing a step that follows FIG. In this step, the glass sealing member 14 made of phosphate glass is thermocompression bonded by a pressure press. This thickness is determined according to the size of the upper surface of the glass sealing member 14.

  FIG. 6 is a cross-sectional view showing a step following FIG. In this step, the ceramic substrate 11 and the glass sealing member 14 are diced by the inverted V-shaped taper blade 20 at an intermediate position between the adjacent light emitting elements 13. While the taper blade 20 is rotated, the taper blade 20 is moved upward in FIG. 6 until the cutting edge reaches the upper surface of the glass sealing member 14 and the glass sealing member 14 is cut. And the taper surface 14a is formed in four sides of the glass sealing member 14 by rotating the blade edge | tip 90 degrees and dicing the ceramic substrate 11 and the glass sealing member 14 in the direction orthogonal to a previous cutting direction. . When dicing by the taper blade 20 is completed, the light emitting elements 13 are separated from each other, and a plurality of light emitting devices 1 having the same specifications are completed as shown in FIG.

(Effects of the first embodiment)
According to the first embodiment, the following effects are obtained.

(1) By using a low-melting glass and hot pressing in a high viscosity state, processing sufficiently lower than the crystal growth temperature is possible.

(2) A strong sealing strength can be obtained by bonding the ceramic substrate 11 and the glass sealing member 14 based on a chemical bond through an oxide. Therefore, even a small package with a small bonding area can be realized.

(3) Since the sealing glass and the ceramic substrate 11 have the same thermal expansion coefficient, poor adhesion such as peeling and cracking hardly occurs even after being bonded at a high temperature and at a normal temperature or a low temperature. Moreover, cracks do not occur in tensile stress in glass, but cracks do not easily occur in compressive stress, and sealing glass has a slightly smaller thermal expansion coefficient than ceramic substrate 11. According to the inventor's confirmation, peeling and cracking did not occur even in 1000 cycles of the liquid phase cooling / heating impulse test of −40 ° C. ← → 100 ° C. In addition, as a basic confirmation of joining a glass piece of 5 mm × 5 mm size to the ceramic substrate 11, an experiment was conducted with glass and the ceramic substrate 11 in various combinations of thermal expansion coefficients. When the ratio of the thermal expansion coefficients of the other member was 0.85 or more, it was confirmed that bonding could be performed without causing cracks. Although it depends on the rigidity and size of the member, the fact that the coefficient of thermal expansion is the same indicates this range.

(4) Since a wire can be dispensed with by flip-chip bonding, there is no problem with electrodes even when processing in a high viscosity state. Since the viscosity of the low melting point glass at the time of sealing is as hard as 10 ⁸ to 10 ⁹ poise and the physical properties are significantly different from that of the epoxy resin before the thermosetting treatment is about 5 poise, the electrode on the surface of the element When sealing a face-up type light emitting element that electrically connects a power supply member such as a lead with a wire, the wire may be crushed or deformed during the glass sealing process. Absent. Further, when the flip chip type light emitting element 13 in which the electrode on the surface of the element is flip chip bonded to a power supply member such as a lead via a bump such as gold (Au) is sealed, the light emitting element 13 is formed based on the viscosity of the glass. Pressure is applied in the direction of the power supply member, which causes collapse of the bumps and short circuit between the bumps, which can also be prevented.

(5) The low-melting glass and the ceramic substrate 11 are set in parallel and hot-pressed in a high-viscosity state, so that the low-melting glass is translated and adhered to the surface of the ceramic substrate 11, and the GaN-based light emitting device 13 In order to seal, no voids are generated.

(6) Since the circuit pattern 4 for wiring on the ceramic substrate 11 is pulled out to the back surface via the via hole 3A, no special measures are taken to prevent the glass from entering unnecessary portions or covering the electrical terminals. A plurality of light-emitting devices 1 can be easily mass-produced based on dicer cut only by batch-sealing a plate-like low melting point glass to a plurality of devices. Since low-melting glass is processed in a high-viscosity state, it is not necessary to take sufficient measures as in the case of a resin, and it is possible to sufficiently support mass production if the external terminals are pulled out to the back surface without using via holes. .

(7) The flip-mounting of the GaN-based light emitting element 13 overcomes the problems associated with realizing glass sealing and has the effect of realizing an ultra-small light emitting device 1 of 0.5 mm square. . This is because a wire bonding space is not required, and the glass sealing member 14 and the ceramic substrate 11 are selected to have the same coefficient of thermal expansion, and by a strong bonding based on a chemical bond, a small space can be obtained. This is due to the fact that no interfacial delamination occurs even with adhesion.

(8) By sealing the light emitting element 13 with the glass sealing member 14 made of low-melting glass as an inorganic material, durability against light deterioration and moisture resistance can be imparted, and heat generated with light emission of the light emitting element 13 Can be quickly dissipated to the outside. In particular, in the GaN-based light emitting element 13, the light emission output lowering factor is mainly due to the deterioration of the sealing portion. Therefore, the light emitting device 1 with extremely small output deterioration can be obtained by glass sealing. In addition, it is possible to select a glass sealing material having a higher refractive index than that of the resin sealing material, which is effective in improving external radiation efficiency.

(9) Since the light emitting element 13 on the ceramic substrate 11 is sealed with the glass sealing member 14 made of low-melting glass, it is possible to eliminate a problem that has occurred when the resin material is used for sealing, so that the light output is reduced. Can be prevented.

(10) Since the tapered surface 14a is provided on the side surface of the glass sealing member 14, light can be extracted from the glass sealing member 14 based on total reflection on the tapered surface 14a. Efficiency is improved and good light collecting characteristics can be obtained.

(11) Since the outer frame (FIG. 15, concave portion 101A) is not required, a device having a compact size can be obtained.

(12) Since the angle of the taper surface 14a of the glass sealing member 14 can be adjusted by the angle of the blade edge of the taper blade 20, troublesome work such as angle setting at the time of cutting becomes unnecessary, and the light emission angle can be easily changed. It is possible to respond easily to customer requests and increased product variations.

(13) After providing a plurality of light emitting elements 13 on a single wafer-like ceramic substrate 11, a glass sealing member 14 is formed so as to cover all the light emitting elements 13, and a tapered surface is provided by the taper blade 20. By separating into the individual light emitting devices 1, the light emitting device 1 having a light extraction structure based on the total reflection of the glass sealing member 14 can be easily formed, and mass productivity and productivity can be improved.

In addition, in 1st Embodiment, although the light-emitting device 1 which used phosphoric acid type glass for low melting glass was demonstrated, the glass sealing member 14 may be another glass material. As such a glass material, for example, there is silicate glass (thermal expansion coefficient: 6.5 × 10 ⁻⁶ / ° C., transition point Tg: 500 ° C.). When this silicate glass is used, it is preferable to use an Al ₂ O ₃ substrate (thermal expansion coefficient: 7.0 × 10 ⁻⁶ / ° C.).

  Moreover, when the unevenness | corrugation at the time of dicing becomes a problem, it can improve by giving the transparent resin coat which has a refractive index equivalent to the glass sealing member 14 to a dicing surface.

[Second Embodiment]
FIG. 8 shows a configuration of a light emitting device according to a second embodiment of the present invention, in which (a) is a plan view and (b) is a sectional view taken along line BB in (a). .

(Configuration of light-emitting device 1)
The light emitting device 1 of the present embodiment is obtained by cutting the periphery of the glass sealing member 14 vertically and reducing the outer shape of the glass sealing member 14 in the first embodiment. This is the same as the first embodiment.

  9 to 11 show a method for manufacturing a light-emitting device according to the second embodiment of the present invention. Here, the case where the light-emitting device 1 of 2nd Embodiment is manufactured is demonstrated.

(Method for manufacturing light-emitting device 1)
First, as shown in FIGS. 2 to 5 of the first embodiment, the steps until the glass sealing member 14 is formed are completed. Next, as shown in FIG. 9, a first taper blade 21 having a wide blade width and a cutting edge angle θ adjusted to a desired taper angle is used, and the first taper blade 21 is rotated while the glass sealing is performed. The stopper member 14 is raised to a predetermined height, and the glass sealing member 14 is diced halfway to form a tapered surface 14a.

  Next, as shown in FIG. 10, the taper blade is replaced with a second taper blade 22 having a narrower blade width than the first taper blade 21. The blade width Wb of the second taper blade 22 is set to Wb so as to be the width Wm of the glass sealing member 14 after the light emitting device 1 is completed. The cutting edge angle of the second taper blade 22 is not related to the taper surface 14a and can be arbitrarily set.

  The center of the second taper blade 22 is made coincident with the center of the first taper blade 21, and the second taper blade 22 is raised while rotating in this state, and the glass sealing member 14 is diced. When the body of the second taper blade 22 penetrates the glass sealing member 14, the light-emitting device 1 of FIG. 8 shown in the second embodiment is completed as shown in FIG.

(Effect of the second embodiment)
According to the second embodiment, a predetermined portion of the upper portion of the tapered surface 14a is cut, so that the light emitting device 1 can be downsized in addition to the effects obtained by the first embodiment. .

  In the second embodiment, a transparent film having a lower refractive index than the refractive index of the glass sealing member 14 can be coated on the outer surface of the glass sealing member 14. Thereby, even if dirt etc. adhere to taper surface 14a of glass sealing member 14, it can be assumed that a reflectance does not fall, and the extraction efficiency of light from light emitting element 13 can be stabilized.

  In addition, the light emitting element 13 is mounted on the ceramic substrate 11 as shown in FIG. And these are isolate | separated, It is good also as a state like FIG. That is, the optical surface may be formed by a glass mold upper mold for forming the upper flat surface and a glass mold lower mold for forming the lower tapered surface. Then, the same shape can be obtained by separating as shown in FIG.

[Third Embodiment]
12A and 12B show a light emitting device according to a third embodiment of the present invention, in which FIG. 12A is a plan view and FIG. 12B is a cross-sectional view taken along line CC in FIG.

(Configuration of light-emitting device 1)
In the light emitting device 1 of the present embodiment, in the second embodiment shown in FIG. 8, the white resin portion 30 made of a white resin material is provided so as to surround the side surface of the ceramic substrate 11 and the side surface of the glass sealing member 14. The other configurations are the same as those of the second embodiment.

  If the refractive index n of the glass sealing member 14 is 1.7, the white resin portion 30 uses a resin material having a refractive index of about 1.4. The white resin portion 30 only needs to be provided at least on the side surface of the glass sealing member 14, and the thickness only needs to obtain total reflection at the boundary surface with the glass sealing member 14, which is more than necessary. It is not necessary to have the thickness.

(Effect of the third embodiment)
According to the third embodiment, by providing the white resin portion 30, it is possible to obtain the same function as that provided with the reflective film on the side surface of the glass sealing member 14, and the aluminum reflective film. Since such metal reflection absorption and blackening unlike the silver reflection film do not occur, it is possible to prevent the light emission output of the light emitting device 1 from being lowered. Other effects are the same as those of the second embodiment.

  In the third embodiment, instead of the white resin portion 30, for example, a transparent resin coat having a refractive index n = 1.4 is applied to the side surface of the glass sealing member 14, and the surface of the transparent resin coat is refracted. A white resin coat having a rate n of 1.5 may be provided. As a result, it is possible to obtain a part of the total reflection effect by the coating of n = 1.4, and it is possible to make it difficult to change the characteristics even when used in an environment that is easily affected by surrounding dust. Further, it is possible to reduce the size of the white resin portion 30 so that the thickness of the white resin portion 30 can be ignored.

  In addition to the white resin coat, other colors may be used as long as the reflectance is high with respect to the emission wavelength, and a ceramic coat may be applied.

[Fourth Embodiment]
13A and 13B show a light emitting device according to a fourth embodiment of the present invention, in which FIG. 13A is a plan view and FIG. 13B is a sectional view taken along line DD in FIG.

(Configuration of light-emitting device 1)
In the light emitting device 1 of the present embodiment, in the third embodiment shown in FIG. 12, the glass sealing member 14 is provided with a plate material 32 containing phosphor 31 in transparent glass or resin on the upper surface thereof. Other configurations are the same as those of the third embodiment.

  As the phosphor 31, a YAG phosphor, a silicate phosphor, or a mixture of these at a predetermined ratio can be used.

(Effect of the fourth embodiment)
According to the fourth embodiment, since the plate material 32 containing the phosphor 31 is provided on the upper surface of the glass sealing member 14, wavelength conversion with respect to the light from the light emitting element 13 can be performed. High spectral characteristics can be obtained. Other effects are the same as those of the third embodiment.

  In the fourth embodiment, a filter that cuts ultraviolet rays may be used instead of the plate material 32 containing the phosphor 31 or on the plate material 32. Moreover, the structure which made the glass sealing member 14 contain fluorescent substance without providing the board | plate material 32 may be sufficient.

[Fifth Embodiment]
14A and 14B show a light emitting device according to a fifth embodiment of the present invention, in which FIG. 14A is a plan view and FIG. 14B is a sectional view taken along line EE of FIG.

(Configuration of light-emitting device 1)
The light emitting device 1 according to the present embodiment mounts a plurality of light emitting elements 13A to 13I in the third embodiment shown in FIG. 12, and adds pads and changes the arrangement in accordance with the connection status. This is a multi-emission type. The ceramic substrate 11 electrically connects the plurality of light emitting elements 13A to 13I by an intra-layer wiring pattern (not shown). Other configurations are the same as those of the fifth embodiment.

  The light emitting elements 13A to 13I may be the same color or a combination of R (red), G (green), and B (blue). Here, although nine light emitting elements are used, any number can be used. In addition, a configuration in which the light emitting elements 13A to 13I are individually driven may be a circuit configuration in which three light emitting elements in series are connected in parallel, or a circuit configuration in which nine light emitting elements are connected in series. It is also possible to do.

(Effect of 5th Embodiment)
According to the fifth embodiment, it is possible to mount an arbitrary number of light emitting elements simply by increasing the size of the glass sealing member 14, and to easily increase the light emission output. 1 output can be increased. Further, by combining a plurality of light emitting elements having different emission colors, a mixed emission color or white light can be easily obtained.

[Other embodiments]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in embodiments other than the fourth embodiment, a plate material 32 containing the phosphor 31 may be provided, or the glass sealing member 14 may contain the phosphor 31. The multi-light emission type configuration shown in the fifth embodiment is also applicable to the first, second, and fourth embodiments.

  Although the power supply unit has been described as the ceramic substrate 11 on which the circuit pattern is formed, a metal lead may be used. Although the compactness is inferior due to the protrusion of the lead, the strength necessary for holding the lead can be maintained even if it is compact because the hard glass is used as compared with the resin sealing.

  Moreover, although the sealing material of LED element 2 was demonstrated as glass, depending on a use, a part of glass may crystallize and become cloudy, and it is a chemically stable inorganic material. The material is not limited to a glassy material as long as good bonding can be achieved.

The structure of the light-emitting device which concerns on the 1st Embodiment of this invention is shown, In the same figure, (a) is a top view, (b) is sectional drawing of the AA line of (a). Sectional drawing of the wafer-shaped ceramic substrate in the 1st step of a manufacturing process is shown. FIG. 3 is a cross-sectional view showing a step that follows FIG. 2. FIG. 4 is a cross-sectional view showing a step that follows FIG. 3. FIG. 5 is a cross-sectional view showing a step that follows FIG. 4. FIG. 6 is a cross-sectional view showing a step that follows FIG. 5. FIG. 7 is a cross-sectional view showing a step that follows FIG. 6. The structure of the light-emitting device concerning the 2nd Embodiment of this invention is shown, In the same figure, (a) is a top view, (b) is sectional drawing of the BB line of (a). It is sectional drawing which shows the 1st process of the manufacturing method of the light-emitting device which concerns on the 2nd Embodiment of this invention. FIG. 10 is a cross-sectional view showing a step that follows FIG. 9. It is sectional drawing which shows the process following FIG. The light-emitting device which concerns on the 3rd Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing of CC line of (a). The light-emitting device which concerns on the 4th Embodiment of this invention is shown, In this figure, (a) is a top view, (b) is sectional drawing of the DD line of (a). The light-emitting device which concerns on the 5th Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing of the EE line | wire of (a). It is sectional drawing which shows the structure of the conventional light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 11 ... Ceramic substrate 11a ... Upper surface pad, 11b ... Upper surface pad 11c ... Lower surface pad 11d ... Lower surface pad, 12a ... Through hole 12b ... Through hole 13 ... Light emitting element, 13a ... Bump 13b ... Bump 13A-13I ... Light emission Element, 14 ... Glass sealing member 14a ... Tapered surface 15 ... Via post, 20 ... Taper blade 21 ... First taper blade, 22 ... Second taper blade 30 ... White resin part 31 ... Phosphor, 32 ... Plate material 100 ... Light emitting device 101A recess 101 ... resin part, 102 ... lead 103 ... lead 104 ... adhesive 105 ... light emitting element, 106 ... bonding wire 107 ... bonding wire, 108 ... phosphor 109 ... sealing body 110 ... reflective film 110 ... phosphor

Claims (14)

A light emitting element;
A power supply unit that mounts the light emitting element and supplies power;
An inorganic sealing material for sealing the light emitting element,
The light-emitting device, wherein the inorganic sealing material has a tapered surface shape that extends outward in a side surface direction with respect to a central axis of the light-emitting element.   The light emitting device according to claim 1, wherein the light emitting element is flip-mounted on the power supply unit.   The light emitting device according to claim 1, wherein the power supply unit is a ceramic substrate on which a conductive pattern for supplying power is formed.   The light emitting device according to any one of claims 1 to 3, wherein the inorganic sealing material is glass.   The light emitting device according to claim 1, wherein the inorganic sealing member has an inverted pyramid shape.   The light emitting device according to claim 1, wherein the inorganic sealing member has a vertical surface formed on an upper portion of the tapered surface.   7. The light emitting device according to claim 1, wherein the tapered surface of the inorganic sealing member is provided with a member having a high reflectance with respect to an emission spectrum of the light emitting element.   The light emitting device according to claim 5, wherein a member having a high reflectance with respect to an emission spectrum of the light emitting element has a refractive index smaller than a refractive index of the inorganic sealing member.   The light emitting device according to claim 1, wherein the inorganic sealing member is provided with a transparent member including a phosphor on a light emitting surface thereof.   The light emitting device according to claim 1, wherein the inorganic sealing member contains a phosphor.   The light emitting device according to claim 1, wherein the light emitting element includes a plurality of light emitting elements. A first step of mounting a plurality of surface-mounted light emitting elements on an insulating substrate at a predetermined interval;
A second step of forming a glass sealing member in a uniform thickness so as to cover the plurality of light emitting elements;
The manufacturing method of the light-emitting device characterized by including the 3rd process of cut | disconnecting the said board | substrate and the said glass sealing member so that a taper surface may be formed in each circumference | surroundings of these light emitting elements.   13. The method for manufacturing a light emitting device according to claim 12, wherein in the third step, the substrate and the glass sealing member are cut by a taper blade having a cutting edge angle that matches an angle of the taper surface.   In the third step, the substrate and the glass sealing member are cut halfway by the first taper blade having a blade edge angle that matches the angle of the taper surface, and then the blade width of the first taper blade is determined. 13. The method for manufacturing a light emitting device according to claim 12, wherein the glass sealing member is cut until the glass sealing member is divided by a second taper blade having a narrow blade width.

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